CN204243078U - Without bowl cup LED support structure - Google Patents
Without bowl cup LED support structure Download PDFInfo
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- CN204243078U CN204243078U CN201420604911.0U CN201420604911U CN204243078U CN 204243078 U CN204243078 U CN 204243078U CN 201420604911 U CN201420604911 U CN 201420604911U CN 204243078 U CN204243078 U CN 204243078U
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- silver coating
- lead frame
- clubfoot
- groove
- support structure
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Abstract
The utility model discloses a kind of without bowl cup LED support structure, it relates to LED light source component encapsulation technology field.It comprises epoxy resin, lead frame, groove and clubfoot, lead frame is provided with silver coating positive electrode and the silver coating negative electrode of insulation isolation, the groove of depression is provided with between silver coating positive electrode and silver coating negative electrode, the surrounding of lead frame is provided with multiple clubfoot, is all filled with epoxy resin in the back side of silver coating positive electrode, silver coating negative electrode and surrounding and groove.The utility model increases the space of lead frame die bond chip indirectly, improves product power, and add the flexibility that chip is placed, cost is low simultaneously.
Description
Technical field
The utility model relates to LED light source component encapsulation technology field, be specifically related to without bowl cup LED support structure.
Background technology
LED light source component is high owing to having luminous efficiency, high energy-conservation, changeable, the feature such as pollution-free, just be widely used in interior decoration illumination, automobile, graphic display screen, the fields such as TV backlight, required LED light source component quantity and LED light source component cost during in order to reduce lamp assembled, make lamp assembled more simple and convenient, often adopt at present and plurality of LEDs chip is positioned over the form of carrying out integration packaging in single led support, obtain more high-power LED light source device, and in order to meet the high temperature resistant demand of integration packaging form, the resistant to elevated temperatures materials such as LED support many employings epoxy resin and silicones encapsulate.
A kind of LED support of prior art as shown in Figure 1, it comprises the first pedestal 5, second pedestal 6, positive electrode lead 7 and negative electrode lead 8, and positive electrode lead 7 and negative electrode lead 8 are arranged on substrate, but the shortcoming that above-mentioned LED support structure exists is, comparatively multi-chip cannot be placed, power is low, and the discharge of chip is more single simultaneously, lacks flexibility.
In order to solve the problem, design a kind of without bowl cup LED support structure or necessary.
Summary of the invention
For the deficiency that prior art exists, the utility model object is to provide a kind of without bowl cup LED support structure, and structure is simple, reasonable in design, indirectly increase the space of lead frame die bond chip, improve product power, add the flexibility that chip is placed, cost is low simultaneously.
To achieve these goals, the utility model realizes by the following technical solutions: without bowl cup LED support structure, comprise epoxy resin, lead frame, groove and clubfoot, lead frame is provided with silver coating positive electrode and the silver coating negative electrode of insulation isolation, the groove of depression is provided with between silver coating positive electrode and silver coating negative electrode, the surrounding of lead frame is provided with multiple clubfoot, clubfoot connects the clubfoot of other lead frame, thus formation supporting structure, silver coating positive electrode, all epoxy resin is filled with in the back side of silver coating negative electrode and surrounding and groove, epoxy resin is the material of high-temperature heat-resistance.
As preferably, described lead frame and formed planar structure by the groove of epoxy resin filling.
The beneficial effects of the utility model: without encapsulation base, cost is low, indirectly increases the space of lead frame die bond chip, improves product power, simultaneously die bond chip put without limitation, add the flexibility of chip placement.
Accompanying drawing explanation
The utility model is described in detail below in conjunction with the drawings and specific embodiments;
Fig. 1 is the structural representation of background technology;
Fig. 2 is structural representation of the present utility model;
Fig. 3 is vertical view of the present utility model;
Fig. 4 is end view of the present utility model;
Fig. 5 is the structural representation before the utility model encapsulation.
Embodiment
The technological means realized for making the utility model, creation characteristic, reaching object and effect is easy to understand, below in conjunction with embodiment, setting forth the utility model further.
With reference to Fig. 2-5, this embodiment is by the following technical solutions: without bowl cup LED support structure, comprise epoxy resin 1, lead frame 2, groove 3 and clubfoot 4, lead frame 2 is provided with silver coating positive electrode and the silver coating negative electrode of mutually insulated isolation, between silver coating positive electrode and silver coating negative electrode, there is gap, just, negative electrode framework has the recessed trench 3 communicated with gap, the groove bottom of groove 3 has and to extend along flute length direction and through the coarse part of chemical corrosion process, epoxy resin 1 is all filled with in gap and groove 3, lead frame 2 is filled front surrounding at epoxy resin 1 and is provided with connected clubfoot 4, clubfoot 4 connects the clubfoot of other lead frame, thus formation supporting structure, silver coating positive electrode, the back side of silver coating negative electrode and surrounding are filled with epoxy resin 1, epoxy resin 1 is high temperature resistant material.
It should be noted that described lead frame 2 and be in same plane by the groove 3 that epoxy resin 1 is filled.
In addition, described lead frame 2 and clubfoot 4 adopt copper or copper alloy.
This embodiment increases the space of lead frame die bond chip indirectly, improves product power, simultaneously die bond chip put without limitation, add the flexibility of chip placement, without encapsulation base, reduce cost, there is market application foreground widely.
More than show and describe general principle of the present utility model and principal character and advantage of the present utility model.The technical staff of the industry should understand; the utility model is not restricted to the described embodiments; what describe in above-described embodiment and specification just illustrates principle of the present utility model; under the prerequisite not departing from the utility model spirit and scope; the utility model also has various changes and modifications, and these changes and improvements all fall within the scope of claimed the utility model.The claimed scope of the utility model is defined by appending claims and equivalent thereof.
Claims (4)
1. without bowl cup LED support structure, it is characterized in that, comprise epoxy resin (1), lead frame (2), groove (3) and clubfoot (4), lead frame (2) is provided with silver coating positive electrode and the silver coating negative electrode of insulation isolation, the groove (3) of depression is provided with between silver coating positive electrode and silver coating negative electrode, the surrounding of lead frame (2) is provided with multiple clubfoot (4), is all filled with epoxy resin (1) in the back side of silver coating positive electrode, silver coating negative electrode and surrounding and groove (3).
2. according to claim 1ly to it is characterized in that without bowl cup LED support structure, described lead frame (2) be in same plane by the groove (3) that epoxy resin (1) is filled.
3. according to claim 1ly it is characterized in that without bowl cup LED support structure, described lead frame (2) and clubfoot (4) are respectively copper framework and copper clubfoot.
4. according to claim 1ly it is characterized in that without bowl cup LED support structure, described lead frame (2) and clubfoot (4) are respectively copper alloy framework and copper alloy clubfoot.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420604911.0U CN204243078U (en) | 2014-10-20 | 2014-10-20 | Without bowl cup LED support structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420604911.0U CN204243078U (en) | 2014-10-20 | 2014-10-20 | Without bowl cup LED support structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204243078U true CN204243078U (en) | 2015-04-01 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420604911.0U Active CN204243078U (en) | 2014-10-20 | 2014-10-20 | Without bowl cup LED support structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204243078U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105591005A (en) * | 2014-10-20 | 2016-05-18 | 深圳市斯迈得光电子有限公司 | Bowl-free LED support structure |
-
2014
- 2014-10-20 CN CN201420604911.0U patent/CN204243078U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105591005A (en) * | 2014-10-20 | 2016-05-18 | 深圳市斯迈得光电子有限公司 | Bowl-free LED support structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Baoan District Shiyan street Shenzhen city Guangdong province 518000 White Pine Road in Yuntai technology industrial plant building 6, 8, 9 floor Patentee after: SHENZHEN SMALITE OPTO-ELECTRONIC CO., LTD. Address before: Baoan District Shiyan street Shenzhen city Guangdong province 518000 White Pine Road in Yuntai technology industrial plant building 6, 8, 9 floor Patentee before: Shenzhen Smalite Optoelectronics Co., Ltd. |