CN201758139U - Novel LED light source module packaging structure - Google Patents

Novel LED light source module packaging structure Download PDF

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Publication number
CN201758139U
CN201758139U CN2010202614753U CN201020261475U CN201758139U CN 201758139 U CN201758139 U CN 201758139U CN 2010202614753 U CN2010202614753 U CN 2010202614753U CN 201020261475 U CN201020261475 U CN 201020261475U CN 201758139 U CN201758139 U CN 201758139U
Authority
CN
China
Prior art keywords
metal substrate
light source
source module
reflector
led chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2010202614753U
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Chinese (zh)
Inventor
何文铭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujian Wanban optoelectronic Technology Co., Ltd.
Original Assignee
FUJIAN ZHONGKEWANBANG PHOTOELECTRIC SHARES Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FUJIAN ZHONGKEWANBANG PHOTOELECTRIC SHARES Co Ltd filed Critical FUJIAN ZHONGKEWANBANG PHOTOELECTRIC SHARES Co Ltd
Priority to CN2010202614753U priority Critical patent/CN201758139U/en
Priority to PCT/CN2010/077509 priority patent/WO2012006818A1/en
Application granted granted Critical
Publication of CN201758139U publication Critical patent/CN201758139U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)

Abstract

The utility model provides a novel LED light source module packaging structure, which belongs to the field of processing lighting equipment, and comprises a metal substrate, a circuit board, reflection cups and LED chips. The novel LED light source module packaging structure is characterized in that the circuit board is embedded into the metal substrate and exposed on the outer surface of the metal substrate, reflection cups are fixed to the circuit board and the metal substrate, at least one LED chip is mounted in each reflection cup and adhered onto the metal substrate at the bottom of the corresponding reflection cup, a glue and fluorescent powder mixed layer is coated on the upper surface of each LED chip, and the LED chips are connected onto the circuit board by leads.

Description

The Novel LED light source module package structure
[technical field]
The utility model relates to a kind of lighting apparatus, relates in particular to a kind of led light source module.
[background technology]
LED is a kind of low voltage light sources, because its power saving, life-span is long, various low-voltage lighting devices now have been widely used in, the encapsulating structure of the multi-chip LED light source module that traditional high-power LED chip or degree of integration are higher generally adopts metal substrate to realize, concrete structure generally adopts at the high-thermal conductive metal with reflector (as copper, aluminium etc.) as basic unit, again insulating barrier and circuit articulamentum are compounded in the basic unit, form whole metal substrate, led chip is installed by central authorities at reflector, led chip is connected to the circuit articulamentum, again the upper surface of led chip is applied a glue and the fluorescent material mixed layer is finished encapsulation.In above-mentioned traditional led light source module encapsulation construction, because needing lead-in wire between led chip and the circuit articulamentum is connected, but led chip is arranged on reflector inside, and wiring board is arranged on outside the reflector, therefore in the process of producing, be easy to make the lead-in wire between led chip and the wiring board to damage for bumping to break because of the people, greatly reduce production efficiency, and it is more complicated that production process also becomes, increase production cost, and because traditional metal substrate need adopt large-area insulating barrier, cause the heat dispersion of whole encapsulating structure relatively poor, be unfavorable for the life-span of product.
[utility model content]
The technical problems to be solved in the utility model is to provide a kind of heat dispersion better, and can save the Novel LED light source module package structure of production cost.
The utility model is achieved in that a kind of Novel LED light source module package structure, comprise metal substrate, wiring board, reflector and led chip, it is characterized in that: described wiring board be embedded metal substrate and outside be exposed at the upper surface of metal substrate, wiring board and metal substrate upper fixed have reflector, at least one led chip is installed in the reflector, this led chip is bonded at by insulating cement on the metal substrate of bottom of reflector, the upper surface of described led chip is coated with glue and fluorescent material mixed layer, and led chip is connected on the wiring board by lead.
The upper surface of described metal substrate is provided with a reflector layer of electroplating.
Described reflector is a ring-type, makes by injection moulding or the some mode of moulding.
One end of described metal substrate is provided with a buckle, and the opposite position of the other end is provided with adaptive with it draw-in groove.
The utlity model has following advantage: adopt above-mentioned packaged type, can make led chip and wiring board and the lead between them, all be encapsulated in below glue and the fluorescent material mixed layer, can in the operation of led chip encapsulation, just can finish in a direct step, improved production efficiency greatly, reduce the damage of lead in the production process, saved production cost; Wherein reflector can also be fixedly mounted in wiring board metal substrate inside except as the reflection of light effect; Because led chip can directly be fixed on the metal substrate, can improve heat dispersion widely simultaneously, improve the life-span of product.
[description of drawings]
In conjunction with the embodiments the utility model is further described with reference to the accompanying drawings.
Fig. 1 is the overall structure schematic diagram of Novel LED light source module package structure of the present utility model.
Fig. 2 is the A-A cutaway view of Fig. 1.
Fig. 3 is the side schematic view of Novel LED light source module package structure of the present utility model.
Fig. 4 is the syndeton schematic diagram between metal substrate, wiring board and the reflector of Novel LED light source module package structure of the present utility model.
[embodiment]
Come the utility model is described in detail below in conjunction with specific embodiment.
See also Fig. 1 to shown in Figure 4, it is Novel LED light source module package structure described in the utility model, comprise metal substrate 1, wiring board 2, reflector 3 and led chip 4, the described groove 11 that is provided with a strip in the centre of metal substrate 1 that is embedded, be embedded with wiring board 2 in the groove 11, and these wiring board 2 outer upper surfaces that are exposed at metal substrate 1, wiring board 2 is provided with ready made connecting circuit, the two ends that the two ends of wiring board 2 lead to metal substrate 1 respectively form both positive and negative polarity, the upper fixed of wiring board 2 and metal substrate 1 has some reflectors 3, some led chips 4 are installed in the reflector 3, this led chip 4 is bonded at all the other positions outside the wiring board 2 on the metal substrate 1 of bottom of reflector 3 by insulating cement, the upper surface of described led chip 4 is coated with glue and fluorescent material mixed layer 5, and led chip 4 is connected on the wiring board 2 by lead 6.The upper surface of described metal substrate 1 is provided with a reflector layer 7 of electroplating, and this reflector layer adopts silver coating in the present embodiment, and described reflector 3 is a ring-type, and what adopt in the present embodiment is circular reflector, makes by injection moulding or the some mode of moulding.Also can adopt square ring-type reflector to realize in the utility model simultaneously.One end of described metal substrate 1 is provided with a buckle wide outside and narrow inside 8, and the opposite position of the other end is provided with the draw-in groove 9 that shape is identical with it, so just can easily a plurality of same modules be snapped together, as using on the purposes of long strip type lamp bar.

Claims (4)

1. Novel LED light source module package structure, comprise metal substrate, wiring board, reflector and led chip, it is characterized in that: described wiring board be embedded metal substrate and outside be exposed at the upper surface of metal substrate, wiring board and metal substrate upper fixed have reflector, at least one led chip is installed in the reflector, this led chip is bonded at by insulating cement on the metal substrate of bottom of reflector, the upper surface of described led chip is coated with glue and fluorescent material mixed layer, and led chip is connected on the wiring board by lead.
2. Novel LED light source module package structure according to claim 1 is characterized in that: the upper surface of described metal substrate is provided with a reflector layer of electroplating.
3. Novel LED light source module package structure according to claim 1 is characterized in that: described reflector is a ring-type, makes by injection moulding or the some mode of moulding.
4. Novel LED light source module package structure according to claim 1 is characterized in that: an end of described metal substrate is provided with a buckle, and the opposite position of the other end is provided with adaptive with it draw-in groove.
CN2010202614753U 2010-07-16 2010-07-16 Novel LED light source module packaging structure Expired - Fee Related CN201758139U (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2010202614753U CN201758139U (en) 2010-07-16 2010-07-16 Novel LED light source module packaging structure
PCT/CN2010/077509 WO2012006818A1 (en) 2010-07-16 2010-09-30 Package structure for led light source module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010202614753U CN201758139U (en) 2010-07-16 2010-07-16 Novel LED light source module packaging structure

Publications (1)

Publication Number Publication Date
CN201758139U true CN201758139U (en) 2011-03-09

Family

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Application Number Title Priority Date Filing Date
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Country Status (2)

Country Link
CN (1) CN201758139U (en)
WO (1) WO2012006818A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101958387A (en) * 2010-07-16 2011-01-26 福建中科万邦光电股份有限公司 Novel LED light resource module packaging structure
CN102856311A (en) * 2012-03-22 2013-01-02 创维液晶器件(深圳)有限公司 LED (Light-Emitting Diode) packaging module and packaging method

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4606302B2 (en) * 2005-01-27 2011-01-05 京セラ株式会社 Light emitting device
CN200983368Y (en) * 2006-01-25 2007-11-28 廖本瑜 High heat radiation package base plate of high brightness LED
CN100487310C (en) * 2007-07-06 2009-05-13 深圳市泓亚光电子有限公司 Tabulate highpower light source with multiple chips
US20090059583A1 (en) * 2007-08-28 2009-03-05 Chi-Yuan Hsu Package Structure for a High-Luminance Light Source
CN100555691C (en) * 2007-09-11 2009-10-28 东南大学 Improve the encapsulating structure of luminous efficiency of power LED
TW200941659A (en) * 2008-03-25 2009-10-01 Bridge Semiconductor Corp Thermally enhanced package with embedded metal slug and patterned circuitry
US20100006886A1 (en) * 2008-07-10 2010-01-14 Brilliant Technology Co., Ltd. High power light emitting diode chip package carrier structure
CN101752354A (en) * 2009-12-18 2010-06-23 中山大学 Packaging substrate structure for LED and production method thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101958387A (en) * 2010-07-16 2011-01-26 福建中科万邦光电股份有限公司 Novel LED light resource module packaging structure
CN102856311A (en) * 2012-03-22 2013-01-02 创维液晶器件(深圳)有限公司 LED (Light-Emitting Diode) packaging module and packaging method
CN102856311B (en) * 2012-03-22 2015-09-30 创维液晶器件(深圳)有限公司 LED module and method for packing

Also Published As

Publication number Publication date
WO2012006818A1 (en) 2012-01-19

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: FUJIAN WANBAN OPTOELECTRONICS TECHNOLOGY CO., LTD.

Free format text: FORMER OWNER: FUJIAN ZHONGKE WANBAN OPTRONICS CO., LTD.

Effective date: 20110321

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20110321

Address after: Gao Village of Huating town of Putian city in 351100 in Fujian Province, Chengxiang District

Patentee after: Fujian Wanban optoelectronic Technology Co., Ltd.

Address before: Gao Village of Huating town of Putian city in 351100 in Fujian Province, Chengxiang District

Patentee before: Fujian Zhongkewanbang Photoelectric Shares Co., Ltd.

CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110309

Termination date: 20140716

EXPY Termination of patent right or utility model