JP4606302B2 - Light emitting device - Google Patents

Light emitting device Download PDF

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JP4606302B2
JP4606302B2 JP2005312711A JP2005312711A JP4606302B2 JP 4606302 B2 JP4606302 B2 JP 4606302B2 JP 2005312711 A JP2005312711 A JP 2005312711A JP 2005312711 A JP2005312711 A JP 2005312711A JP 4606302 B2 JP4606302 B2 JP 4606302B2
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light emitting
substrate
light
emitting element
reflecting member
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JP2006237557A (en
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大輔 作本
真吾 松浦
裕樹 森
民男 草野
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京セラ株式会社
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  The present invention relates to a light emitting device that houses a light emitting element.

  Light-emitting devices using light-emitting elements such as light-emitting diodes (LEDs) and semiconductor lasers (LDs) have been attracting attention because they are expected to further reduce power consumption and extend their life. It has begun to be used in various fields such as indicators, optical sensors, displays, photocouplers, backlights, and optical printer heads. FIG. 15 is a cross-sectional view of a light-emitting element storage package (hereinafter also simply referred to as a package) for mounting a conventional light-emitting element.

  As shown in FIG. 15, the conventional package has a substrate 11, and power is supplied from the outside to the light emitting element 13 mounted on the mounting portion 11a in the package via a wiring conductor (not shown). The light emitting element 13 becomes operable.

  On the outer peripheral portion of the upper surface of the substrate 11, a reflecting member 12 joined so as to surround the mounting portion 11a is provided.

  The light emitting element 13 is die-bonded on the mounting portion 11a of the substrate 11, and the electrode of the light emitting element 13 and the wiring conductor arranged around the mounting portion 11a are electrically connected. Thereafter, the inside of the reflecting member 12 is filled with the transparent resin 17 so as to cover the light emitting element 13, and is thermally cured, thereby protecting the light emitting element 13 and firmly adhering the light emitting element 13 to the package to form a light emitting device. be able to. Alternatively, after applying a phosphor or a transparent resin mixed with a phosphor on the side surface or top surface of the light emitting element 13, the transparent resin 17 is filled inside the reflecting member 12 and thermally cured, so that the light from the light emitting element 13 is emitted. It is possible to form a light emitting device that can convert the wavelength with a phosphor and extract light having a desired wavelength spectrum. A translucent lid (not shown) can be bonded to the upper surface of the reflecting member 12 as necessary.

  This light-emitting device can emit visible light by causing the light-emitting element 13 to emit light by a drive current supplied from an external electric circuit. In recent years, this light-emitting device has been used for illumination, and a device having higher characteristics in terms of high luminance and heat dissipation is required. In addition, when used for illumination, the lifetime is an important issue, and thus a long-life light emitting device is required.

Therefore, recently, in order to improve the light emission luminance of the light emitting device, it has been studied to configure the reflecting member 12 and the substrate 11 with a material having higher reflectance.
JP 2002-344029 A

  However, the conventional package does not efficiently dissipate heat generated when the light-emitting element 13 is operated, so that heat is trapped in the package and the temperature of the light-emitting element 13 is remarkably increased. There was a problem that decreased.

  In addition, the heat generated when the light emitting element 13 is activated, the temperature change of the external environment, and the like are repeatedly applied, and the pattern of the light emitting element 13 and the wiring conductor is changed due to the difference in the thermal expansion coefficient between the substrate 11 and the reflecting member 12. There is a problem that stress is generated in the mounting portion and the package, and a bending moment is generated in the entire light emitting element storage package. As a result, a crack is generated in the substrate 11 or a joint between the substrate 11 and the reflecting member 12, a piezo effect is generated in the light emitting element 13, or the substrate 11 and the reflecting member 12, and the light emitting element 13 and the substrate 11 are peeled off. There was a problem. For this reason, an electrical connection failure such as disconnection occurs in the wiring conductor, etc., the intensity distribution of light emitted from the light emitting element storage package and the illuminance distribution on the irradiation surface are uneven, or the output light is unstable. Or the light emitting device cannot be operated with high reliability over a long period of time. In particular, when the light-emitting device is used for local illumination or the like, instability of light intensity distribution and illuminance distribution is an important problem.

  Therefore, the present invention has been completed in view of such conventional problems, and the object thereof is high heat dissipation, and the light emitted from the light emitting element is uniformly and efficiently radiated to the outside. An object of the present invention is to provide a high-quality light-emitting device in which optical characteristics with a stable illuminance distribution are obtained and defects such as cracks are reduced.

According to one aspect of the present invention, a light emitting device includes a substrate having a wiring conductor, a light emitting element mounted on the upper surface of the substrate and electrically connected to the wiring conductor, and a reflection surrounding the light emitting element. And a member. In planar perspective, the side surface of the reflecting member is located outside the side surface of the substrate. Reflecting member, so that the gap is provided between the external circuit board and the reflecting member to which the substrate is placed, it is provided on the substrate.

  The light-emitting device of the present invention includes a light-emitting element, a substrate on which the light-emitting element is mounted, and a reflective member that has a reflective surface formed above the substrate and partially covers the side surface of the substrate. Then, since the site | part of the lower surface outer side of the reflecting member joined to the board | substrate is exposed to external air, heat | fever can be discharge | released effectively from the surface of the exposed reflecting member. In particular, a gap is formed between the substrate, the reflecting member, and the external circuit board by positioning the lower surface of the reflecting member located outside the substrate above the height position of the lower surface of the substrate in a side view. Then, the heat transferred to the outside air that has entered there moves from the gap toward the upper outside of the light emitting device by natural convection. As a result, heat dissipation can be increased.

  In addition, since the heat generated from the light emitting element can be efficiently dissipated to the outside of the light emitting device, the temperature of the light emitting element can be prevented from significantly increasing. For this reason, a decrease in luminous efficiency caused by phonon scattering or the like is also suppressed.

  In addition to increasing heat dissipation as described above, the contact area between the substrate and the reflecting member is reduced, so that heat generated during operation of the light emitting element and temperature change of the external environment are repeatedly applied. However, the stress caused by the difference in thermal expansion coefficient between the substrate and the reflecting member can be reduced. Furthermore, since the contact area between the substrate and the reflecting member is small, even when an external stress is applied to the reflecting member in a manufacturing process or the like, it is possible to effectively suppress the stress from being transmitted from the reflecting member to the substrate. As a result, the bending moment generated in the entire light emitting element storage package can be suppressed, the occurrence of cracks in the substrate, the joint between the substrate and the reflecting member, or the piezo effect generated in the light emitting element, or the substrate and the reflecting member, the substrate and the light emitting element. Can be effectively suppressed. Therefore, there is no electrical connection failure such as disconnection in the wiring conductor, etc., the uneven distribution of the intensity distribution of light emitted from the light emitting element storage package and the illuminance distribution on the irradiated surface is suppressed, and the output light is stabilized. The light emitting device can be operated with high reliability over a long period of time.

  The light emitting device of the present invention will be described in detail below. FIG. 1 is a cross-sectional view showing an example of an embodiment of a light emitting device of the present invention. In FIG. 1, a light emitting element 3 is mounted on the upper surface of a substrate 1, and a reflecting member 2 surrounding the light emitting element 3 is formed on the upper surface of the substrate 1. Note that the expressions “upper, lower, left and right” used in the description of the present specification merely describe the positional relationship between the respective parts on the drawings, and do not define the positional relationship in actual use.

  The light emitting element storage package used in the light emitting device of the present invention includes a substrate 1 made of ceramics or the like having a mounting portion 1a for the light emitting element 3 on the upper surface and a conductive path (not shown) formed from the upper surface to the lower surface of the substrate. And a reflection member 2 attached to the upper surface of the substrate 1 with a reflection surface 2a surrounding the mounting portion 1a. The side surface (outer surface) of the substrate 1 is a side surface of the reflection member 2 in plan view. The lower surface of the reflecting member 2 positioned outside the substrate 1 is positioned higher than the height position AA ′ of the lower surface of the substrate 1 when viewed from the side. Yes.

  The substrate 1 of the present invention functions as a support member for supporting and mounting the light emitting element 3. The substrate 1 is provided with a mounting portion 1a for the light emitting element 3, and the light emitting element 3 is removed via a resin adhesive, a tin (Sn) -lead (Pb) solder, a low melting point brazing material such as Au-Sn, or the like. Worn. And the heat | fever of the light emitting element 3 maintains the operativity of the light emitting element 3 favorably by being transmitted to the board | substrate 1 via a resin adhesive and a low melting-point brazing material, and being efficiently dissipated outside. The light emitted from the light emitting element 3 is reflected by the reflecting surface 2a and emitted to the outside.

  The substrate 1 is made of ceramics such as an aluminum oxide sintered body (alumina ceramics), an aluminum nitride sintered body, glass ceramics, and the like, and a mounting portion 1 a is formed at the center of the substrate 1. Further, a wiring conductor (not shown) is formed from the vicinity of the mounting portion 1a so as to lead out to the outside of the light emitting element storage package.

  The wiring conductor formed on the substrate 1 is formed of a metallized layer such as W, Mo, Mn, or Cu. For example, a metal paste obtained by adding an organic solvent or a solvent to a powder such as W is mixed with a predetermined paste. The substrate 1 is formed by printing and applying to a pattern and baking. In order to prevent oxidation and to firmly connect a bonding wire (not shown) on the surface of the wiring conductor, a Ni layer having a thickness of 0.5 to 9 μm, an Au layer having a thickness of 0.5 to 5 μm, etc. The metal layer is preferably deposited by a plating method.

  The reflecting member 2 is made of metal such as Al, stainless steel (SUS), Ag, iron (Fe) -Ni-cobalt (Co) alloy, Fe-Ni alloy, resin, ceramics, or the like. When the reflecting member 2 is made of metal, the inner peripheral surface is made to be a mirror surface by a method such as polishing, so that the inner peripheral surface is a reflecting surface 2a that can favorably reflect visible light emitted from the light emitting element 3. Can do. In the case of being made of resin, ceramics, or the like, a reflective surface 2a that can favorably reflect visible light emitted from the light emitting element 3 on the inner peripheral surface by forming a metal layer on the inner peripheral surface by plating or vapor deposition. It can be. From the viewpoint that the reflecting surface 2a having high reflection efficiency of visible light from the light emitting element 3 can be more easily manufactured and that corrosion due to oxidation or the like can be prevented, the reflecting member 2 is made of Al or SUS. Preferably it consists of. Further, when such a reflecting member 2 is made of metal, the reflecting member 2 is formed into a predetermined shape by subjecting an ingot of the material to conventionally known metal processing such as cutting, rolling, and punching.

  The substrate 1 and the reflecting member 2 are more preferably made of ceramics. That is, the difference in thermal expansion between the substrate 1 and the light emitting element 3 is reduced, and the stress between the substrate 1 and the light emitting element 3 generated by heat generated from the light emitting element 3 or heat of the external environment is suppressed. Further, the stress at the joint between the base 1 and the reflecting member 2 and the deformation of the reflecting surface 2a, which are caused by the difference in thermal expansion coefficient between the substrate 1 and the reflecting member 2, are suppressed. Furthermore, since the water permeability of ceramics is small, it is possible to improve the water resistance due to moisture entering from the substrate 1 and the reflecting member 2. In addition, compared with resin materials and metal materials, ceramics are, for example, Pb (lead) -Sn (tin) solder, Au (gold) -Sn solder, Au-Si (silicon) solder, Au-Ge (germanium). Thermal degradation is unlikely to occur during soldering with solder such as solder, Sn-Ag (silver) solder, Sn-Ag-Cu (copper) solder, and oxidation and corrosion of the ceramic surface due to air, moisture, oxygen, etc. Therefore, deterioration of the reflectance of the substrate and the reflecting member can be suppressed. As a result, the light emitting device can stably operate the light emitting element 3 while suppressing a decrease in light output over a long period of time.

  When the light emitting element 3 is a gallium nitride compound semiconductor, a sapphire substrate having a thermal expansion coefficient of about 5 × 10 −6 / ° C. is used as the substrate on which the light emitting layer is formed. When the light emitting element 3 is a gallium arsenide compound semiconductor, the thermal expansion coefficient of the gallium arsenide compound semiconductor is about 6 × 10 −6 / ° C. When an aluminum oxide sintered body is used as the substrate 1 and the reflecting member 2, the aluminum oxide sintered body has a thermal expansion coefficient of about 6 × 10 −6 / ° C., and the thermal expansion with the light emitting element 3 described above. The coefficient difference can be reduced. On the other hand, when the substrate 1 is made of an epoxy resin or a liquid crystal polymer (LCP) resin, the thermal expansion coefficient is about 20 × 10 −6 / ° C., and the difference in thermal expansion coefficient from the light emitting element 3 is increased. In some cases, stress concentrates on the joint with the light emitting element 3, and in the light emitting device in which the light emitting element 3 is flip-chip mounted, an electrical connection failure occurs, and the light emitting element 3 cannot be operated normally. In addition, since the stress generated at the junction between the substrate 1 and the light emitting element 3 is concentrated on the light emitting layer of the light emitting element 3, the light emitting element 3 generates a wavelength shift due to the piezo effect and light emitted from the light emitting device. It is difficult to obtain good illumination light as a light source used in the illumination device because the color of the light source changes, the intensity varies, or the light unevenness occurs.

  The substrate 1 and the reflecting member 2 are made of white ceramics such as an aluminum oxide sintered body, a zirconium oxide sintered body (zirconia ceramics), an yttrium oxide sintered body (yttria ceramics), or a titanium oxide sintered body. More preferably, it is made of a knot (titania ceramics). Note that the white system has a reflection characteristic in which the difference between the maximum value and the minimum value of the reflectance from at least the ultraviolet region to the visible light region is within 10%. By using white ceramics for the substrate 1 and the reflecting member 2, the reflecting member 2 can be made efficient and less wavelength dependent from the ultraviolet region to the visible light region.

  The reflecting member 2 is formed on the upper surface of the substrate 1 so as to surround the mounting portion 1a, and the outer surface of the reflecting member 2 is positioned outside the substrate 1 and outside the substrate 1. The lower surface of the reflecting member 2 is positioned above the height position AA ′ of the lower surface of the substrate 1 when viewed from the side. For this reason, the contact area between the substrate 1 and the reflection member 2 is reduced, and the portion of the reflection member 12 that is conventionally bonded to the substrate 11 is exposed to the outside air, so heat is applied from the exposed surface of the reflection member 2. It can be effectively released.

  Further, the lower surface of the reflecting member 2 positioned outside the substrate 1 is positioned above the height position AA ′ of the lower surface of the substrate 1 in a side view, whereby the substrate 1 and the reflecting member 2 A gap is formed between the external circuit board 4 and the external circuit board 4. When the outside air enters the gap and the outside air causes natural convection, the heat transferred from the reflecting member 2 to the outside air existing in the gap moves to the outside of the light emitting device, and the heat dissipation can be further enhanced. .

  Moreover, since the heat dissipation of the light emitting element 3 is increased in this manner, the light emitting element 3 can be prevented from being deteriorated at a high temperature and the emission intensity being lowered.

  Further, since the surface area of the reflecting member 2 in contact with the substrate 1 can be reduced, the thermal expansion between the substrate 1 and the reflecting member 2 can be achieved even when heat generated during the operation of the light emitting element 3 or temperature changes in the external environment are repeatedly applied. It is possible to mitigate the occurrence of stress due to the coefficient difference. Further, since the contact area between the substrate 1 and the reflecting member 2 is small, it is effective that the stress is transmitted from the reflecting member 2 to the substrate 1 even when an external stress is applied to the reflecting member 2 in a manufacturing process or the like. Can be suppressed. As a result, the bending moment generated in the entire light emitting element storage package can be suppressed, the generation of cracks in the substrate 1 or the joint between the substrate 1 and the reflecting member 2, the piezo effect generated in the light emitting element 3, or the substrate 1 and the reflecting member. 2 can be effectively suppressed. Therefore, electrical connection defects such as disconnection do not occur in the wiring conductor, etc., suppressing unevenness in the intensity distribution of light emitted from the light emitting element storage package and the illuminance distribution on the irradiated surface, and stabilizing the output light, The light emitting device can be operated while maintaining high reliability over a long period of time.

  Furthermore, since the path through which heat moves from the substrate 1 to the reflecting member 2 is narrowed, it is possible to effectively prevent heat from being transferred from the substrate 1 to the reflecting member 2, and distortion of the reflecting member 2 due to heat is less likely to occur. Therefore, the light generated in the light emitting element 3 can be stably emitted to the outside.

  Further, preferably, as shown in FIG. 3, the outer surface of the substrate 1 is positioned on the inner side of the outer surface of the reflecting member 2 in a plan view, and the lower surface of the reflecting member 2 positioned on the outer side of the substrate 1 is As viewed, it may be positioned above the height position BB ′ of the upper surface of the substrate 1 or above the height position BB ′ of the upper surface of the substrate 1. By positioning the reflecting member 2 above the height position BB ′ on the upper surface of the substrate 1, the gap between the substrate 1, the reflecting member 2, and the external circuit substrate 4 becomes larger and all of the substrate 1 is Since the outer surface is exposed to the outside air, the heat dissipation can be further improved.

  Further, as shown in FIG. 5, when the outer surface of the reflecting member 2 bonded to the upper surface of the substrate 1 is formed to warp upward, the gap between the substrate 1 and the reflecting member 2 becomes larger, so that the gap is heated. It is preferable because it is possible to effectively suppress the accumulation, and natural convection of the outside air from the side surface of the substrate 1 tends to occur upward, and the heat dissipation is further improved. Even if the heat of the light emitting element 3 is transferred to the substrate 1 and the heat is transferred from the substrate 1 to the reflecting member 2, the gap between the substrate 1, the reflecting member 2 and the external circuit board 4 is increased, so that the heat is further increased. It becomes easier to convection, and it becomes easier to dissipate heat to the outside. As a result, it is possible to more effectively suppress the deterioration of the light emitting element 3 due to the high temperature and the decrease in light emission intensity. In addition, there is no unevenness in the intensity distribution of light emitted from the light-emitting element storage package and the illuminance distribution on the irradiation surface, and more stable light is output, and the light-emitting device operates with high reliability and stability over a long period of time. be able to.

  Further, the side surface of the substrate 1 is preferably inclined. This is because the side surface of the substrate 1 is inclined to increase the surface area of the substrate 1 that is exposed to the outside air, whereby heat generated from the light emitting element 3 can be efficiently radiated from the substrate 1 to the outside of the light emitting device.

  In particular, as shown in FIG. 6, when the substrate 1 is formed so that the cross-sectional area of the substrate 1 increases in the depth direction of the substrate 1, the external circuit substrate 4 can be connected with a larger area. Therefore, heat generated in the light emitting element 3 is more easily diffused to the outside of the light emitting device, and heat can be more efficiently dissipated, which is preferable.

  Further, if the area of the substrate 1 in contact with the reflecting member 2 exceeds two thirds of the area of the lower surface of the reflecting member 2, the contact area between the reflecting member 2 and the substrate 1 becomes too large. The lower surface of the reflecting member 2 is not sufficiently exposed to the outside air, and natural convection of the outside air is less likely to occur, heat dissipation is deteriorated, and stress due to the difference in thermal expansion coefficient between the reflecting member 2 and the substrate 1 is suppressed. It becomes difficult. On the other hand, if the ratio is less than 1/20, the substrate 1 cannot sufficiently hold the reflecting member 2, and the stability of the reflecting member 2 is lost. Therefore, from the viewpoint of heat dissipation and stability, the area of the substrate 1 in contact with the reflecting member 2 should be set to 1/20 or less to 2/3 or less of the area of the lower surface of the reflecting member 2. preferable.

FIG. 7 shows a reference example of the embodiment mounted on an external circuit board. A metal or conductive resin having good heat dissipation may be formed in the gap between the reflecting member 2, the substrate 1, and the external circuit substrate 4. As a result, heat is radiated to the outside through the metal 6 formed in the gap, and the metal 6 etc. holds the light emitting element storage package, suppresses the deviation from the external circuit board, and operates normally and stably over a long period of time. Can be made.

  The light reflecting surface 2a may be flat (straight) as shown in FIG. 1, or may be arcuate (curved) as shown in FIG. In the case of the circular arc shape, the light from the light emitting element 3 can be evenly reflected so that highly directional light can be radiated uniformly from the outside.

  More preferably, the outer surface of the substrate 1 is preferably located on the inner side over the entire circumference of the outer surface of the reflecting member 2 in plan view. As a result, an outside air layer having a larger capacity exists than before the outside surface of the substrate 1 is located on the inner side over the entire circumference of the outside surface of the reflecting member 2 in plan view, and is generated when the light emitting element 3 is operated. Heat can be radiated more effectively from the reflecting member 2 to the outside, and stress generated in the light emitting element storage package due to the difference in thermal expansion coefficient between the substrate 1 and the reflecting member 2 or stress generated in the light emitting element storage package in the manufacturing process However, transmission from the reflecting member 2 to the substrate 1 can be more effectively mitigated. As a result, the bending moment transmitted from the reflecting member 2 to the substrate 1 can be further suppressed, and cracks and cracks in the substrate 1 and separation of the light emitting element 3 from the substrate 1 can be further suppressed.

  The reflecting surface 2a is preferably inclined at an angle of 35 to 70 degrees with respect to the upper surface of the substrate 1. As a result, the light of the light emitting element 3 mounted on the mounting portion 1a can be favorably reflected by the inclined reflecting surface 2a, and the light can be radiated to the outside within a range of a radiation angle of 45 degrees or less. The light emission efficiency, luminance, and luminous intensity of the light emitting device using the light emitting element storage package can be made extremely high. The light emission angle is an angle of light spread on a plane orthogonal to the substrate 1 passing through the center of the light emitting element 3, and if the opening shape in the cross section of the reflecting member 2 is circular. The radiation angle is constant over the entire circumference of the reflecting surface 2a. In addition, when the opening shape in the cross section of the reflecting member 2 is biased such as an elliptical shape, the radiation angle is the maximum value.

  In addition, when the angle between the reflection surface 2a and the upper surface of the substrate 1 is less than 35 degrees, the radiation angle spreads beyond 45 degrees, the amount of dispersed light increases, and the brightness and brightness of light tend to decrease. On the other hand, when the angle exceeds 70 degrees, the light from the light emitting element 3 is not emitted well outside the light emitting element accommodation package, and is easily diffusely reflected in the light emitting element accommodation package.

  In addition, when the shape of the reflective surface 2a is an inverted conical shape, the angle formed by the reflective surface 2a and the upper surface of the substrate 1 is preferably 35 to 70 degrees over the entire circumference. Moreover, when the shape of the reflective surface 2a is a quadrangular pyramid shape, it is preferable that at least a pair of opposed inner surfaces be inclined at 35 to 70 degrees with respect to the upper surface of the substrate. Preferably, the entire inner surface is inclined at 35 to 70 degrees with respect to the upper surface of the substrate 1. Thereby, the luminous efficiency can be made extremely high.

  Moreover, it is preferable that arithmetic mean roughness Ra of the reflective surface 2a shall be 0.004-4 micrometers. That is, when the arithmetic average roughness Ra of the reflecting surface 2a exceeds 4 μm, it becomes difficult to regularly reflect the light of the light emitting element 3 accommodated in the light emitting element accommodation package and emit it above the light emitting element accommodation package. The light intensity is easily attenuated or biased. Further, when the arithmetic average roughness Ra of the reflecting surface 2a is less than 0.004 μm, it is difficult to form such a surface stably and efficiently, and the product cost tends to increase. In addition, in order to make Ra of the reflective surface 2a into said range, it can form by a conventionally well-known electrolytic polishing process, a chemical polishing process, or a cutting process. Further, a method of forming by transfer processing using the surface accuracy of the mold may be used.

  In addition, as shown in the sectional views of FIGS. 8A and 8B and a perspective view in which a part of the reflecting member 2 is cut, the reflecting frame 8 is provided so as to surround the outer surface 2b of the reflecting member 2. It is more preferable to have. The reflective frame 8 is made of metal such as Al, SUS, Ag, Fe—Ni—Co alloy, Fe—Ni alloy, Cu—W alloy, ceramics such as alumina ceramics, zirconia ceramics, yttria ceramics, titania ceramics, or Teflon. (Registered trademark) Resin, fluorine resin, liquid crystal polymer, epoxy resin, silicone resin, acrylic resin, polycarbonate, etc., and the like. Joined to the outer periphery.

  Thereby, in the manufacturing process of the light emitting element storage package, heat is repeatedly applied to the light emitting element storage package, or heat from the light emitting element 3 generated when the light emitting device is operated or heat from the external environment is transmitted to the reflecting member 2. Even if it is done, deformation due to heat of the reflecting member 2, that is, thermal expansion or contraction, is restrained by the reflecting frame 8 and suppressed. As a result, it is possible to suppress the occurrence of stress and cracks concentrated on the joint between the substrate 1 and the reflecting member 2, or the separation between the substrate 1 and the reflecting member 2, and the fluctuation of the light distribution of light emitted from the light emitting device. Can be suppressed. Furthermore, the reflective frame 8 can be configured to efficiently dissipate heat conducted from the light emitting element 3 to the reflective member 2 into the atmosphere when the light emitting device is operated.

  For example, the outer surface 2b of the reflecting member 2 made of Al having a thermal expansion coefficient of about 25 × 10 −6 / ° C. and a Young's modulus of about 70 GPa has a thermal expansion coefficient of about 6 × 10 −6 / ° C. and a Young's modulus. When attaching the reflective frame body 8 made of an aluminum oxide sintered body of about 280 GPa, the reflective frame body 8 having a smaller thermal expansion and thermal shrinkage and higher rigidity than the reflective member 2 expands in the horizontal direction of the reflective member 2. Such deformation can be restrained and restrained. As a result, in the light emitting element storage package and the light emitting device, stress or cracks concentrated at the joint between the substrate 1 and the reflecting member 2 generated due to the deformation of the reflecting member 2, or peeling between the substrate 1 and the reflecting member 2 occur. In addition, fluctuations in the light distribution of light emitted from the light emitting device can be suppressed. Furthermore, since the reflecting frame 8 can suppress bending moment to the substrate 1 caused by deformation or thermal contraction of the reflecting member 2 due to thermal expansion in the horizontal direction, the light emitting element storage package and the light emitting device can be connected to a wiring conductor or the like. It is manufactured with good yield without causing electrical connection failure such as disconnection. Accordingly, the light-emitting element storage package and the light-emitting device can be normally operated while maintaining airtightness for a long period of time.

  Further, for example, on the outer surface 2b of the reflecting member 2 made of an aluminum oxide sintered body having a thermal conductivity of about 20 W / m · K, a reflecting frame made of Al having a thermal conductivity of about 200 W / m · K. 8, the heat conducted from the light emitting element 3 to the reflecting member 2 when the light emitting device is operated is not conducted inside the reflecting member 2 but is conducted to the reflecting frame 8 through the adhesive 10. The Thus, the light emitting device can increase the heat dissipation area of the light emitting device by disposing the reflective frame 8 having a large thermal conductivity on the outer surface and in the vertical direction of the light emitting device, and thus the reflecting member. 2 is suppressed, and the light emitting device can stably emit light having a desired light distribution, and can suppress the wavelength variation of the light emitting element 3 and the deterioration of optical characteristics.

  Moreover, it is more preferable that the reflection frame 8 is made of aluminum. As a result, the reflection frame 8 is formed with a passivated film due to oxidation, and the change in reflectance is reduced. Therefore, the light-emitting element storage package that efficiently emits light from the light-emitting element 3 and has little change in reflectance due to the operating environment. Can be produced. In addition, since aluminum has less wavelength dependency of reflectance from the ultraviolet region to the visible light region, even if the light wavelength from the ultraviolet region to the visible light region emitted from the light emitting element 3 is changed, the light output fluctuation is small and stable. Thus, a light emitting device capable of maintaining the light output can be manufactured.

  Further, by using the reflecting frame 8 made of aluminum, it is possible to block the light emitted from the side surface of the reflecting member 2 through the translucent reflecting member 2 made of an aluminum oxide sintered body or the like. Accordingly, when the light-emitting device is used as a light source for display, the contrast between the light-emitting surface and the non-light-emitting surface of the light-emitting device becomes clearer, and a light-emitting device with excellent visibility can be manufactured as a light source for display. Further, when the light emitting element 3 emits light in the blue region to the ultraviolet region, the high energy light transmitted through the reflecting member 2 can be shielded.

  Further, the reflective member 2 and the substrate 1 are joined by a resin adhesive such as silicone or epoxy, a metal brazing material such as Ag-Cu brazing, Pb-Au-Sn-Au-Sn-silicon (Si), Sn. -It is performed with solder such as Ag-Cu. Such a bonding material such as an adhesive and solder may be appropriately selected in consideration of the material of the substrate 1 and the reflecting member 2, the thermal expansion coefficient, and the like, and is not particularly limited. In addition, when high reliability of bonding between the substrate 1 and the reflecting member 2 is required, it is preferable to bond with a metal brazing material or solder.

  Thus, in the light emitting element storage package used in the light emitting device of the present invention, the light emitting element 3 is mounted on the mounting portion 1a of the substrate 1, and the light emitting element 3 is connected to the light emitting element 3 via bonding wires and wiring conductors such as Au and Al. It can be electrically connected to an external electric circuit outside the storage package. Then, a translucent member 5 such as a transparent resin is filled inside the reflecting member 2 and thermally cured to form a coating layer that covers the light emitting element 3, and a translucent lid is formed on the upper surface of the reflecting member 2 as necessary. A light emitting device of the present invention is obtained by bonding a body (not shown) with solder, a resin adhesive, or the like. Alternatively, a phosphor or a transparent resin mixed with a phosphor is applied to the side surface and the upper surface of the light emitting element 3, and then the light transmissive member 5 covering the light emitting element 3 is filled and thermally cured. By joining the optical lid with solder, resin adhesive, or the like, the light emitting device 3 is capable of taking out light having a desired wavelength spectrum by converting the wavelength of the light from the light emitting element 3 using a phosphor.

  In addition, as shown in the cross-sectional views and partial cross-sectional perspective views of FIGS. 9A and 9B, the light-emitting device of the present invention includes the light-emitting element storage package and the light-emitting element 3 mounted on the mounting portion 1a. And a wavelength conversion member 9 that converts the wavelength of a part or all of the light from the light emitting element 3 disposed so as to close the opening of the reflection frame 8. Thereby, the light-emitting device can suppress the characteristic deterioration of the wavelength conversion member 9 due to the heat generated from the light-emitting element 3. That is, when the wavelength conversion member 9 is disposed on the upper end surface 8b of the reflection frame 8, the heat radiation path from the light emitting element 3 to the wavelength conversion member 9 becomes longer and the thermal resistance increases. When a resin adhesive such as acrylic resin or epoxy resin is used, the thermal resistance from the light emitting element 3 to the wavelength converting member 9 is further increased by these resin adhesives, and the heat from the light emitting element 3 is converted to the wavelength converting member. Heat transfer to 9 is difficult. As a result, when an epoxy resin or an acrylic resin is used as the base material of the wavelength conversion member 9, yellowing of the base material due to heating and deterioration of the transmittance can be suppressed. Furthermore, it is possible to suppress degradation of light output due to acceleration of chemical reactions such as oxidation and reduction reactions of the phosphor filled in the wavelength conversion member 9. Furthermore, the light emitted downward from the outer peripheral portion of the lower surface of the wavelength conversion member 9 is reflected upward by the reflection member 2 or the upper end surface 8b of the reflection frame 8, thereby emitting upward from the wavelength conversion member 9. As a result, the light output and luminance of the light emitting device are improved.

  10 (a), (b), FIG. 11 (a), (b), FIG. 12 (a), (b), FIG. 13 (a), (b), FIG. 14 (a), (b). ) And the partial cross-sectional perspective view, the outer surface 2b of the reflecting member 2 is surrounded, and the upper end surface 8b of the reflecting frame 8 is provided above the upper end surface of the reflecting member 2. It is more preferable that the reflection frame body 8 is provided and the wavelength conversion member 9 is disposed inside the reflection frame body 8. Thereby, the light emitted from the upper surface of the wavelength conversion member 9 is increased, and the light output of the light emitting device is improved. That is, the light emitted downward from the outer peripheral portion of the lower surface of the wavelength conversion member 9 is reflected upward at the upper end surface of the reflection member 2, and further, without exciting the phosphor contained in the wavelength conversion member 9, The light of the light emitting element 3 emitted to the side of the wavelength conversion member 9 is reflected to the inside of the wavelength conversion member 9 by the inner peripheral surface 8a of the reflection frame 8, and the phosphor can be excited again. As a result, in the light emitting device, the light whose wavelength is converted by the wavelength conversion member 9 increases, and the light output, light emission efficiency, and luminance of the light emitting device can be improved.

  When the reflection frame 8 is made of a conductive member, as shown in FIGS. 14 (a) and 14 (b), the light emitting device drive circuit board and lead terminals installed so as to be taken out to the side of the board 1 (see FIG. (Not shown) may be attached so that the lower surface of the reflecting frame 8 is disposed above the lower surface of the reflecting member 2.

  Furthermore, as shown in the cross-sectional view and the partial cross-sectional perspective view shown in FIGS. 11 (a), 11 (b), 13 (a), 13 (b), 14 (a), 14 (b), the translucent member. 7 is filled below the upper surface of the first reflecting member 2, and the wavelength converting member 9 is disposed on the upper surface of the first reflecting member 2, whereby the upper surface of the translucent member 7 and the lower surface of the wavelength converting member 9. A part of visible light output downward from the inside of the wavelength conversion member 9 is totally reflected upward at the interface between the lower surface of the wavelength conversion member 9 and the gap 20. Is done. As a result, in the light emitting device, visible light emitted upward from the wavelength conversion member 9 is increased, and the light output of the light emitting device is improved.

  The light emitting element 3 is more preferably a light emitting element 3 that emits light in at least the ultraviolet region to the blue region. That is, when the wavelength conversion member 9 that converts the wavelength of light from the light emitting element 3 contains a phosphor that is excited by the light of the light emitting element 3 to generate fluorescence, the energy of the energy is reduced at a short wavelength from at least the ultraviolet region to the blue region. The high light-emitting element 3 light improves the wavelength conversion efficiency of the phosphor that converts the fluorescent light having a longer wavelength and lower energy than the light of the light-emitting element 3, and increases the light output of the light-emitting device.

  In addition, the ultraviolet region of the light generated from the light emitting element 3 is the upper limit of the short wavelength end of visible light of 360 to 400 nm, and the lower limit is an electromagnetic wave having a wavelength range of up to about 1 nm (Rikagaku Encyclopedia 5th edition / Iwanami Shoten) . Further, the blue region has a short wavelength end of 360 to 400 nm of visible light as a lower limit, and an upper limit as a wavelength range up to about 495 nm (chromaticity coordinates of JIS Z8701 XYZ color system).

  In addition, the light emitting device of the present invention is provided by arranging one light source as a predetermined light source, or a plurality of light emitting devices, for example, a lattice shape, a staggered shape, a radial shape, or a plurality of light emitting devices. A lighting device can be obtained by installing the light emitting device groups in a circular shape or a polygonal shape so as to have a predetermined arrangement such as a plurality of concentric groups. Thereby, intensity unevenness can be suppressed as compared with the conventional lighting device.

  In addition, the light emitting device of the present invention is installed in a predetermined arrangement as a light source, and by installing a reflection jig, an optical lens, a light diffusing plate, etc. optically designed in an arbitrary shape around these light emitting devices, It can be set as the illuminating device which can radiate | emit the light of this light distribution.

  For example, a plurality of light emitting devices 101 are arranged in a plurality of rows on the light emitting device driving circuit board 102 as shown in the plan view and the cross-sectional view shown in FIGS. 16 and 17, and are optically designed in an arbitrary shape around the light emitting device 101. In the case of an illuminating device in which the reflecting jig 103 is installed, in a plurality of light emitting devices 101 arranged on adjacent rows, an arrangement in which the interval between adjacent light emitting devices 101 is not shortest, a so-called staggered pattern It is preferable that By increasing the distance between the adjacent light emitting devices 101, the thermal interference between the adjacent light emitting devices 101 is effectively suppressed, and the heat buildup in the light emitting device driving circuit board 102 on which the light emitting devices 101 are mounted. It is suppressed and heat is efficiently dissipated outside the light emitting device 101.

  Further, the lighting device is a concentric arrangement of a circular or polygonal light emitting device 101 group composed of a plurality of light emitting devices 101 on the light emitting device driving circuit board 102 as shown in the plan view and the cross-sectional view shown in FIGS. In the case of a plurality of lighting devices formed in a group, it is preferable to increase the number of light emitting devices 101 arranged in one circular or polygonal light emitting device 101 group toward the outer peripheral side from the center side of the lighting device. As a result, more light emitting devices 101 can be arranged while maintaining an appropriate interval between the light emitting devices 101, and the illuminance of the lighting device can be further improved. In addition, the density of the light emitting device 101 in the central portion of the lighting device can be reduced to suppress heat accumulation in the central portion of the light emitting device driving circuit board 102. Therefore, the temperature distribution in the light emitting device driving circuit board 102 is uniform, heat is efficiently transmitted to the external electric circuit board and the heat sink on which the lighting device is installed, and the temperature rise of the light emitting device 101 can be suppressed. As a result, the light-emitting device 101 can operate stably over a long period of time and a long-life lighting device can be manufactured.

  Examples of such lighting devices include general lighting fixtures, chandelier lighting fixtures, residential lighting fixtures, office lighting fixtures, store lighting, display lighting fixtures, street lighting fixtures, used indoors and outdoors. Guide light fixtures and signal devices, stage and studio lighting fixtures, advertising lights, lighting poles, underwater lighting lights, strobe lights, spotlights, security lights embedded in power poles, emergency lighting fixtures, flashlights, Examples include electronic bulletin boards, backlights such as dimmers, automatic flashers, displays, moving image devices, ornaments, illuminated switches, optical sensors, medical lights, and in-vehicle lights.

  It should be noted that the present invention is not limited to the above-described embodiment, and various modifications are not hindered without departing from the gist of the present invention. For example, light is extracted at a desired radiation angle by joining an optical lens that arbitrarily collects and diffuses light emitted from the light emitting device or a flat light-transmitting lid with solder or a resin bonding agent. In addition, the water resistance into the light emitting device is improved and the long-term reliability is improved. Further, in order to suppress light loss due to the bonding wire, a light emitting device in which metallized wiring is formed on the substrate 1 and the light emitting element 3 is electrically connected to the metallized wiring via solder may be used.

It is sectional drawing which shows an example of embodiment which mounted the light emitting element storage package of this invention in the external circuit board. It is a top view of the light emitting element storage package of FIG. It is sectional drawing which shows the other example of embodiment which mounted the light emitting element storage package of this invention in the external circuit board. It is sectional drawing which shows the other example of embodiment which mounted the light emitting element storage package of this invention in the external circuit board. It is sectional drawing which shows the other example of embodiment which mounted the light emitting element storage package of this invention in the external circuit board. It is sectional drawing which shows the other example of embodiment which mounted the light emitting element storage package of this invention in the external circuit board. It is sectional drawing which shows the reference example of embodiment which mounted the light emitting element storage package in the external circuit board. It is sectional drawing and the partial cross section perspective view which show the other example of embodiment of the light-emitting device of this invention. It is sectional drawing and the partial cross section perspective view which show the other example of embodiment of the light-emitting device of this invention. It is sectional drawing and the partial cross section perspective view which show the other example of embodiment of the light-emitting device of this invention. It is sectional drawing and the partial cross section perspective view which show the other example of embodiment of the light-emitting device of this invention. It is sectional drawing and the partial cross section perspective view which show the other example of embodiment of the light-emitting device of this invention. It is sectional drawing and the partial cross section perspective view which show the other example of embodiment of the light-emitting device of this invention. It is sectional drawing and the partial cross section perspective view which show the other example of embodiment of the light-emitting device of this invention. It is sectional drawing which mounted the conventional light emitting element accommodation package on the external circuit board. It is a top view which shows an example of embodiment of the illuminating device of this invention. It is sectional drawing of the illuminating device of FIG. It is a top view which shows the other example of embodiment of the illuminating device of this invention. It is sectional drawing of the illuminating device of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1: Board | substrate 1a: Mounting part 2: Reflection member 2a: Reflection surface 3: Light emitting element 7: Translucent member 8: Reflection frame AA ': Side view of the light emitting element accommodation package of this invention of the board | substrate 1 Bottom height position

Claims (2)

  1. A substrate having a wiring conductor;
    A light emitting device mounted on the upper surface of the substrate and electrically connected to the wiring conductor;
    A reflective member surrounding the light emitting element,
    In planar perspective, the side surface of the reflecting member is located outside the side surface of the substrate,
    As the air gap is provided between the reflecting member and an external circuit board on which the substrate is placed, the light emitting device wherein the reflecting member, characterized in that provided on the substrate.
  2. It further comprises a reflective frame that contains aluminum, is fixed to the side surface of the reflective member so as to surround the reflective member, and dissipates heat conducted from the light emitting element to the reflective member. The light-emitting device according to claim 1.
JP2005312711A 2005-01-27 2005-10-27 Light emitting device Active JP4606302B2 (en)

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JP5491691B2 (en) * 2007-09-28 2014-05-14 パナソニック株式会社 Light emitting device and lighting apparatus
CN201758139U (en) * 2010-07-16 2011-03-09 福建中科万邦光电股份有限公司 Novel LED light source module packaging structure
CN101958387A (en) * 2010-07-16 2011-01-26 福建中科万邦光电股份有限公司 Novel LED light resource module packaging structure
JP2012134407A (en) * 2010-12-24 2012-07-12 Okaya Electric Ind Co Ltd Light-emitting diode
JP2013030599A (en) * 2011-07-28 2013-02-07 Sumitomo Bakelite Co Ltd Light emitting device and lighting device
EP2819185B1 (en) 2012-05-31 2018-01-03 Panasonic Intellectual Property Management Co., Ltd. Led module and method of preparing the led module, lighting device
CN108878625A (en) 2017-05-12 2018-11-23 日亚化学工业株式会社 Light emitting device and its manufacturing method

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JP2002094122A (en) * 2000-07-13 2002-03-29 Matsushita Electric Works Ltd Light source and its manufacturing method
JP2003031850A (en) * 2001-04-25 2003-01-31 Agilent Technol Inc Light source
JP2004214436A (en) * 2003-01-06 2004-07-29 Sharp Corp Semiconductor light emitting device and its manufacturing method
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