JP4511238B2 - Light emitting element storage package, light emitting device, and lighting device - Google Patents

Description

  The present invention relates to a light-emitting element housing package, a light-emitting device, and a lighting device that radiate light emitted from a light-emitting element to the outside.

  A light emitting device that emits white light by converting long wavelengths of light such as near-ultraviolet light and blue light emitted from a light emitting element 15 such as a conventional light emitting diode (LED) with a plurality of phosphors such as red, green, blue, and yellow. Is shown in FIG. In FIG. 3, the light-emitting device has a mounting portion 11a for mounting the light-emitting element 15 at the center of the upper main surface, and leads terminals that electrically connect the inside and outside of the light-emitting device from the mounting portion 11a and its periphery. And a base 11 made of an insulator on which a wiring conductor (not shown) made of metallized wiring or the like is formed, and an upper main surface of the base 11 are bonded and fixed, and a through hole 12a having an upper opening larger than the lower opening is formed. In addition, a frame-like reflecting member 12 whose inner peripheral surface is a reflecting surface 12b that reflects light emitted from the light emitting element 15, and excitation of light emitted from the light emitting element 15 filled inside the reflecting member 12 However, it is mainly composed of a translucent member 13 containing a phosphor 14 for wavelength conversion on the long wavelength side, and a light emitting element 15 mounted and fixed on the mounting portion 11a.

  The substrate 11 is made of an aluminum oxide sintered body (alumina ceramic), an aluminum nitride sintered body, a mullite sintered body, ceramics such as glass ceramics, or a resin such as epoxy resin. When the substrate 11 is made of ceramic, the wiring conductor is formed on the upper main surface thereof by firing a metal paste made of tungsten (W), molybdenum (Mo) -manganese (Mn), or the like at a high temperature. When the base 11 is made of a resin, lead terminals made of copper (Cu), iron (Fe) -nickel (Ni) alloy, etc. are molded and fixed inside the base 11.

  The reflecting member 12 has a frame shape in which a through hole 12a having an upper opening larger than the lower opening is formed and a reflecting surface 12b for reflecting light is provided on the inner peripheral surface. Specifically, it consists of metals such as aluminum (Al) and Fe-Ni-cobalt (Co) alloys, ceramics such as alumina ceramics or resins such as epoxy resins, and molding technologies such as cutting, die molding or extrusion molding. It is formed by.

  Further, the reflecting surface 12b of the reflecting member 12 is formed by smoothing the inner peripheral surface of the through hole 12a or by depositing a metal such as Al on the inner peripheral surface of the through hole 12a by vapor deposition or plating. It is formed by. The reflecting member 12 is formed on the upper main surface of the base 11 so that the mounting portion 11a is surrounded by the inner peripheral surface of the reflecting member 12 by a soldering material such as solder, silver (Ag) brazing, or a bonding material such as a resin adhesive. Be joined.

Then, the wiring conductor arranged around the mounting portion 11a and the light emitting element 15 are electrically connected through the electrical connection means 16 such as a bonding wire or a metal ball, and then an epoxy resin or silicone containing a phosphor is used. Filling the inside of the reflective member 12 with a translucent member 13 such as a resin so as to cover the light emitting device 15 with an injection machine such as a dispenser, and thermosetting in an oven, the light from the light emitting device 15 is emitted by a phosphor with a long wavelength A light emitting device capable of extracting light having a desired wavelength spectrum by wavelength conversion to the side can be obtained (see Patent Document 1 below).
Japanese Patent Laid-Open No. 2003-37298

  In recent years, there has been an increase in the use of the above-described light emitting device for illumination, and a light emitting device with higher characteristics in radiation intensity and heat dissipation characteristics is required.

  However, in the above conventional light emitting device, the reflective member 12 is likely to be displaced when bonded to the base 11, and the light emitted from the light emitting element 15 is not reflected at the predetermined position of the reflective member 12, In this case, there is a problem that the light is not emitted to the upper surface of the light emitting device at an angle of. For this reason, there has been a problem that the radiation intensity, the on-axis luminous intensity, the luminance, the color rendering properties, and the like vary.

  Further, light emitted from the side surface of the light emitting element 15 in the lateral direction or obliquely downward is absorbed or diffusely reflected at the junction between the reflecting member 12 and the base 11 or the surface of the base 11, and thus desired. It was difficult to efficiently radiate the outside efficiently at a radiation angle. For this reason, there has been a problem that the radiation intensity of the light emitted from the light emitting device cannot be kept high and stable.

Therefore, the present invention has been completed in view of the above-described conventional problems, and its purpose is as follows.
It is an object to provide a light emitting element storage package, a light emitting device, and a lighting device that reduce variations in radiation intensity, on-axis luminous intensity, luminance, color rendering, and the like and improve the radiation intensity of the light emitting device.

  The light emitting element storage package of the present invention is formed on a top surface of a light emitting element formed on a top surface, which is formed in parallel with a short side between a base made of ceramics having a rectangular shape in plan view and an opposing long side of the upper main surface of the base. A convex part having a mounting part, a concave part is formed on the lower surface, and the inner peripheral surface is joined to the upper main surface of the base so as to fit the convex part and surround the mounting part. A frame-shaped reflecting member that is a reflecting surface that reflects light emitted from the element, and a conductor layer that is formed on an upper surface of the convex portion and electrically connected to the light-emitting element. It is characterized by.

  In the light emitting element storage package of the present invention, it is preferable that the convex portion has concave and convex portions on a side surface.

  The light emitting device of the present invention includes the light emitting element storage package of the present invention, the light emitting element mounted on the mounting portion and electrically connected to the conductor layer, and a translucent member that covers the light emitting element. It is characterized by comprising.

  The illuminating device of the present invention is characterized in that the light emitting device of the present invention is installed in a predetermined arrangement.

  The light emitting element storage package of the present invention is formed on a top surface of a light emitting element formed on a top surface, which is formed in parallel with a short side between a base made of ceramics having a rectangular shape in plan view and an opposing long side of the upper main surface of the base. Light that the light emitting element emits light on the inner peripheral surface, in which a convex portion having a mounting portion, a concave portion is formed on the lower surface, and the concave portion is fitted to the upper main surface of the base body and joined so as to surround the mounting portion. Since a frame-shaped reflecting member that is a reflecting surface that reflects light and a conductor layer that is formed on the top surface of the convex portion and is electrically connected to the light emitting element, the convex portion of the base body is provided. By fitting the concave portion of the reflecting member, the reflecting member can be easily and accurately joined to the predetermined position of the base, and the light emitted from the light emitting element is reflected at the predetermined position of the reflecting member at a predetermined angle. Radiated to the upper surface of the light emitting device. Therefore, it is possible to prevent variations in radiation intensity, on-axis luminous intensity, luminance, color rendering, and the like.

  In addition, in a direction parallel to the long side, light emitted from the side surface of the light emitting element in the lateral direction or obliquely downward can be reliably reflected by the reflecting surface of the reflecting member, It can be effectively prevented from being absorbed or irregularly reflected on the surface of the substrate, and can be efficiently radiated to the outside efficiently at a desired radiation angle. Therefore, the radiation intensity of the light emitted from the light emitting device can be kept high and stable.

  In addition to dissipating the heat generated during the operation of the light emitting element from the bottom surface of the substrate, the heat is also moved along the convex portion, and from the side surface of the convex portion exposed to the outside on the long side of the substrate. It can be dissipated to the outside, the heat generated during the operation of the light emitting element can be efficiently dissipated to the outside, the temperature of the light emitting element is kept constant even when the light emitting element is activated, and the operability of the light emitting element is improved. The radiation intensity of the light emitting device can be improved while maintaining good.

  As described above, variations in radiation intensity, on-axis brightness, luminance, color rendering, and the like can be reduced, and the radiation intensity of the light-emitting device can be improved. Thus, a light-emitting element storage package with excellent mass productivity can be obtained.

  In the light emitting element storage package of the present invention, preferably, since the convex part has irregularities formed on the side surface, the light emitted from the light emitting element, reflected by the surface of the translucent member or the reflecting member, and the convex part Effectively attenuates light at the corner between the side surface of the convex portion and the top surface of the base body by irregularly reflecting the light irradiated to the side surface of the base portion by the irregularities on the side surface of the convex portion located on the short side of the base body. Can be prevented.

  Further, the exposed area can be increased by the irregularities on the side surfaces of the convex portions exposed to the outside located on the long side of the substrate, and the heat generated during the operation of the light emitting element can be radiated more efficiently.

  Further, when a light-transmitting member including a phosphor is provided so as to cover the light emitting element and the side surface of the convex part located on the long side of the substrate, the light emitted from the light emitting element is uneven by the side surface of the convex part. By irregularly reflecting, it is possible to irradiate the phosphor uniformly, and it is possible to effectively prevent the occurrence of color unevenness by uniformly converting the wavelength of the light.

  A light emitting device of the present invention includes the light emitting element storage package of the present invention, a light emitting element mounted on the mounting portion and electrically connected to the conductor layer, and a translucent member covering the light emitting element. Therefore, the light emitting characteristics of the light emitting element can be maximized, and a light emitting device having excellent light characteristics such as on-axis luminous intensity, luminance, and color rendering can be obtained.

  Since the light emitting device of the present invention is installed in a predetermined arrangement, the lighting device of the present invention uses light emission by recombination of electrons of a light emitting element made of a semiconductor. Thus, a small illuminating device that can have lower power consumption and longer life than the existing illuminating device can be obtained. As a result, fluctuations in the center wavelength of light generated from the light emitting element can be suppressed, light can be emitted with a stable radiant light intensity and radiant light angle (light distribution distribution) over a long period of time, and an irradiation surface It is possible to provide a lighting device in which uneven color and uneven illuminance distribution are suppressed.

  In addition, the light emitting device of the present invention is installed in a predetermined arrangement as a light source, and by installing a reflection jig, an optical lens, a light diffusing plate, etc. optically designed in an arbitrary shape around these light emitting devices, It can be set as the illuminating device which radiates | emits the light of this light distribution.

  The light emitting device of the present invention will be described in detail below. FIG. 1 shows an example of an embodiment of a light emitting device of the present invention. FIG. 1A is a cross-sectional view showing an example of an embodiment of a light emitting device of the present invention, and FIG. 1B is a perspective view of the light emitting device of FIG. In these figures, 1 is a base, 1a is a convex portion, 2 is a reflecting member, 4 is a translucent member, 5 is a light emitting element, and mainly emits light emitted from the light emitting element 5 with directionality to the outside. A light emitting device that can be made is configured.

  The light emitting element storage package of the present invention emits light on the upper surface formed in parallel with the short side between the opposing long sides of the base 1 made of ceramics having a rectangular shape in plan view and the upper main surface of the base 1. A convex portion 1a having a mounting portion for the element 5, and a concave portion 2c formed on the lower surface, and an inner peripheral surface in which the concave portion 2c is fitted to the convex portion 1a and joined so as to surround the mounting portion on the upper main surface of the base 1 A frame-like reflecting member 2 whose surface is a reflecting surface 2b that reflects light emitted from the light emitting element 5, and a conductor layer formed on the upper surface of the convex portion 1a to which the light emitting element 5 is electrically connected; It has.

  The light-emitting device of the present invention includes the light-emitting element storage package of the present invention, a light-emitting element 5 mounted on the mounting portion and electrically connected to the conductor layer, and a translucent member that covers the light-emitting element 5. 4.

  The substrate 1 in the present invention is made of alumina ceramic, aluminum nitride sintered body, mullite sintered body, ceramic such as glass ceramic, or resin such as epoxy resin. The base body 1 has a convex portion 1a on which the light emitting element 5 protruding from the upper main surface is mounted.

  On the convex portion 1a, an electrical connection pattern for electrically connecting the light emitting element 5 is formed. The electrical connection pattern is led out to the outer surface of the light emitting device through a wiring layer (not shown) formed inside the base 1 and connected to the external electrical circuit board, whereby the light emitting element 5 and the external electrical circuit are connected. Are electrically connected to each other.

  By mounting the light emitting element 5 on the convex portion 1a protruding from the upper main surface of the base body 1, the light emitted downward from the light emitting element 5 by the protruding convex portion 1a is applied to the reflecting surface 2b of the reflecting member 2. It is possible to irradiate well, prevent light from being absorbed at a portion other than the reflecting member 2, and reflect most of the light emitted from the light emitting element 5 with high reflectance. Further, the light emitting element 5 can be accurately and easily mounted at a desired position of the base body 1 by the convex portion 1a. As a result, the light emitting characteristics of the light emitting element 5 can be maximized, and a light emitting device having excellent light characteristics such as on-axis luminous intensity, luminance, and color rendering can be obtained.

  Moreover, since the convex part 1a is formed in parallel with the short side between the long sides which the base | substrate 1 opposes, not only the heat | fever generated at the time of the action | operation of the light emitting element 5 is dissipated from the bottom face of the base | substrate 1, but a convex part. Heat can be moved along 1a, and can be dissipated to the outside also from the side surface of the convex portion 1a exposed to the outside located on the long side of the substrate 1, and the heat generated when the light emitting element 5 is operated efficiently Can be dissipated outside. And even if the light emitting element 5 operates, the temperature of the light emitting element 5 can be kept constant, the operability of the light emitting element 5 can be maintained well, and the radiation intensity of the light emitting device can be improved.

  In particular, since the convex portion 1 a is formed in parallel with the short side between the opposing long sides of the base body 1, from the light emitting element 5 to the side surface of the convex portion 1 a exposed to the outside located on the long side side of the base body 1. It is possible to dissipate heat by making the distance between the light emitting element 5 easy to move and to dissipate heat generated from the light emitting element 5 very efficiently from the side surface exposed to the outside of the convex portion 1a. Always good.

  In addition, the light emitting element 5 has a rectangular parallelepiped shape, but has a feature that a large amount of light is emitted from two opposite sides in a plan view and a small amount of light is emitted from the remaining two sides. It is preferable to mount the light emitting element 5 on the convex portion 1 a of the base body 1 so as to be parallel to the long side of the base body 1. With this configuration, a large amount of light emitted from the light emitting element 5 is emitted toward the short side of the substrate 1, and the light emitted from the light emitting element 5 is reflected without waste by the reflecting member 2 bonded to the upper surface of the substrate 1. it can.

  As described above, the operability of the light-emitting element 5 can be always improved, and the light emitted from the light-emitting element 5 can be reflected by the reflecting member 2 without waste, so that a light-emitting device having excellent radiation intensity can be obtained. .

  As a method of connecting the light emitting element 5 to the electrical connection pattern, a method of connecting through wire bonding or a flip chip bonding method in which the lower surface of the light emitting element 5 is connected by electrical connection means 6 such as a solder bump is used. A method or the like is used. Preferably, the connection is made by a flip chip bonding method. Thereby, since the electrical connection pattern can be provided immediately below the light emitting element 5, it is not necessary to provide a space for providing the electrical connection pattern on the upper surface of the base 1 around the light emitting element 5. Therefore, it is possible to effectively suppress the light emitted from the light emitting element 5 from being absorbed in the space for the electrical connection pattern of the substrate 1 and the on-axis luminous intensity being lowered.

  The electrical connection pattern is formed, for example, by forming a metallized layer of a metal powder such as W, Mo, Cu, or Ag on the surface or inside of the base 1 so that lead terminals such as Fe-Ni-Co alloy are formed on the base 1. It is provided by embedding or by fitting and joining an input / output terminal made of an insulator on which a wiring conductor is formed in a through hole provided in the base 1.

  The exposed surface of the electrical connection pattern should be coated with a metal having excellent corrosion resistance, such as Ni or gold (Au), with a thickness of about 1 to 20 μm. Can be effectively prevented, and the connection between the light emitting element 5 and the electrical connection pattern can be strengthened. Therefore, for example, a Ni plating layer having a thickness of about 1 to 10 μm and an Au plating layer having a thickness of about 0.1 to 3 μm are sequentially deposited on the exposed surface of the electrical connection pattern by an electrolytic plating method or an electroless plating method. More preferably.

  Preferably, the convex portion 1a has irregularities on the side surfaces. Thereby, the light emitted from the light emitting element 5 or the light reflected by the surface of the translucent member 4 or the reflecting member 2 and irradiated on the side surface of the convex portion 1 a is projected on the short side of the base 1. By irregularly reflecting the unevenness on the side surface of 1a, it is possible to effectively prevent attenuation at the corner between the side surface of the convex portion 1a and the upper surface of the substrate 1.

  Further, the exposed area can be increased by the unevenness of the side surface of the convex portion 1a exposed to the outside, which is located on the long side of the substrate 1, so that the heat generated during the operation of the light emitting element 5 can be radiated more efficiently. it can.

  Further, when the light-transmitting member 4 including a phosphor is provided so as to cover the side surfaces of the light emitting element 5 and the convex portion 1a located on the long side of the base body 1, the light emitted from the light emitting element 5 is projected to the convex portion. By irregularly reflecting the irregularities on the side surface of 1a, it is possible to uniformly irradiate the phosphor, and it is possible to effectively prevent the occurrence of color unevenness due to uniform wavelength conversion of light.

  Such unevenness on the side surface of the convex portion 1 a may be formed on only one of the side surface on the long side and the side surface on the short side of the substrate 1.

  The unevenness on the side surface of the convex portion 1a is preferably 30 μm to 300 μm. Accordingly, light can be diffusely reflected by the unevenness of the convex portion 1a or can be radiated well, and damage such as lack of unevenness can be effectively prevented. Further, when the translucent member 4 is formed so as to adhere to the side surface of the convex portion 1a, the adhesion strength between the translucent member 4 and the convex portion 1a can be increased, and the translucent member 4 and It is possible to effectively prevent air from entering the interface with the convex portion 1a.

  The base body 1 on which the convex portions 1a having irregularities on such side surfaces are formed, for example, by using a ceramic green sheet laminating method, and by laminating the ceramic green sheets to be the convex portions 1a in a desired size on the side surfaces. It can produce as what has the unevenness | corrugation. In addition, when such a ceramic green sheet laminating method is used, it becomes easy to form a plurality of convex portions 1a on the substrate 1, so that it is possible to obtain a light emitting element storage package with extremely excellent mass productivity. .

  Further, the reflecting member 2 is attached to the upper surface of the substrate 1 by a bonding material such as solder, a brazing material such as Ag brazing, or an adhesive such as an epoxy resin. The reflection member 2 has a through hole 2a formed at the center and an inner peripheral surface that is a reflection surface 2b that reflects light emitted from the light emitting element 5.

  The reflecting member 2 is made of metal, ceramics, resin, or the like, and is formed by performing cutting processing, mold forming, or the like. Further, the reflecting surface 2b of the reflecting member 2 is smoothed by polishing the inner peripheral surface of the through hole 2a, pressing a mold, or the like, or on the inner peripheral surface of the through hole 2a. The reflective surface 2b may be formed by forming a highly reflective metal thin film such as Al, Ag, Au, platinum (Pt), titanium (Ti), chromium (Cr), or Cu by vapor deposition or the like. When the reflecting surface 2b is made of a metal that is easily discolored by oxidation such as Ag or Cu, an Ni plating layer having a thickness of about 1 to 10 μm and an Au plating layer having a thickness of about 0.1 to 3 μm are formed on the surface. Is preferably deposited sequentially by electrolytic plating or electroless plating. Thereby, the corrosion resistance of the reflective surface 2b improves.

  In addition, the arithmetic average roughness Ra of the surface of the reflecting surface 2b is preferably 0.004 to 4 μm, so that the reflecting surface 2b can reflect light from the light emitting element 5 and the phosphor 4 well. When Ra exceeds 4 μm, it becomes difficult to uniformly reflect the light of the light emitting element 5 and it becomes easy to diffusely reflect inside the light emitting device. On the other hand, if it is less than 0.004 μm, it tends to be difficult to form such a surface stably and efficiently.

  The reflecting surface 2b has, for example, a linear inclined surface as shown in FIG. 1 whose longitudinal cross-sectional shape spreads outward as it goes upward, a curved inclined surface that spreads outward as it goes upward, Or shapes, such as a rectangular surface, are mentioned.

  The reflecting member 2 is joined so that the concave portion 2 c is fitted to the convex portion 1 a on the upper main surface of the base 1. Thereby, the reflecting member 2 can be easily and accurately bonded to a predetermined position of the substrate 1, and light emitted from the light emitting element 5 is emitted to the upper surface of the light emitting device at a predetermined angle, and the radiant intensity, the axial luminous intensity, Variations in brightness, color rendering, etc. can be prevented. Further, not only the light from the light emitting element 5 is directly emitted to the outside, but also light emitted from the light emitting element 5 in a lateral direction or the like in the direction parallel to the long side of the substrate 1 or emitted downward from the phosphor 4. The reflected light can be reflected uniformly and uniformly on the reflecting surface 2b, and the axial luminous intensity, luminance, color rendering, etc. can be improved effectively.

  In particular, the closer the reflection member 2 is to the convex portion 1a, the more prominent the above effect is. Thereby, by enclosing the circumference | surroundings of the convex part 1a with the reflection member 2, more light can be reflected and it becomes possible to obtain a higher on-axis luminous intensity.

  The translucent member 4 is made of a transparent resin such as an epoxy resin or a silicone resin, and may contain a phosphor that converts the wavelength of light emitted from the light emitting element 5. Thereby, the light emitted from the light emitting element 5 can be wavelength-converted into a desired wavelength spectrum.

  The translucent member 4 is poured on the upper surface of the light emitting element 5 by an injection machine such as a dispenser, and drops along the side surface of the convex portion 1a by gravity, thereby covering the light emitting element 5 in a hemispherical shape and transmitting light. The lower part of the light-sensitive member 4 covers the side surface of the convex portion 1a with a certain thickness, and is thermally cured in an oven or the like.

  In addition, as shown in FIG. 1, the surface of the translucent member 4 may be covered with gas, such as air, or the atmosphere of the surface of the translucent member 4 may be vacuum. Moreover, transparent members, such as transparent resin and sol-gel glass which do not contain fluorescent substance, may be filled so that the surface of the translucent member 4 containing fluorescent substance may be covered.

  Moreover, the translucent member 4 may be attached so that a plate-like thing may cover the through-hole 2a on the upper surface or inner peripheral surface of the reflecting member 2.

  In addition, the light emitting device of the present invention is a circular shape in which one device is installed in a predetermined arrangement, or a plurality of light emitting devices, for example, a lattice shape, a staggered shape, a radial shape, or a plurality of light emitting devices. In addition, a lighting device can be obtained by installing the light emitting device groups in a plurality of concentric shapes so as to have a predetermined arrangement. Thereby, since light emission by recombination of electrons of the light emitting element 5 made of a semiconductor is used, it is possible to achieve lower power consumption and longer life than a lighting device using a conventional discharge, and generate less heat. It can be set as a small illuminating device. As a result, fluctuations in the center wavelength of the light generated from the light emitting element 5 can be suppressed, and light can be irradiated with a stable radiant light intensity and radiant light angle (light distribution) over a long period of time. It can be set as the illuminating device by which the color nonuniformity in the surface and the bias of illuminance distribution were suppressed.

  In addition, the light emitting device of the present invention is installed in a predetermined arrangement as a light source, and by installing a reflection jig, an optical lens, a light diffusing plate, etc. optically designed in an arbitrary shape around these light emitting devices, It can be set as the illuminating device which can radiate | emit the light of this light distribution.

  Such an illuminating device may be configured such that a plurality of light emitting elements 5 are mounted on the substrate 1, as shown in FIG. With this configuration, the light emitting elements 5 can be mounted in a plurality of mounting portions provided on the base 1 so that the light emitting elements 5 can be arranged in a predetermined manner, making the lighting device easy to manufacture and mass production. A suitable lighting device can be obtained.

  Examples of such lighting devices include general lighting fixtures, chandelier lighting fixtures, residential lighting fixtures, office lighting fixtures, store lighting, display lighting fixtures, street lighting used indoors and outdoors. Appliances, guide light fixtures and signal devices, stage and studio lighting fixtures, advertising lights, lighting poles, underwater lighting lights, strobe lights, spotlights, spotlights, security lighting embedded in power poles, emergency lighting fixtures, pocket lights Examples include electric lights, electric bulletin boards, backlights such as dimmers, automatic blinkers, displays, moving image devices, ornaments, illuminated switches, optical sensors, medical lights, vehicle lights, and the like.

  In addition, this invention is not limited to the example of the above embodiment, If it is in the range which does not deviate from the summary of this invention, it will not interfere at all. For example, a plurality of light emitting elements 5 may be provided on the substrate 1 in order to improve the radiation intensity. In addition, the lighting device of the present invention may be one in which a plurality of light emitting devices are installed in a predetermined arrangement, and one light emitting device is installed in a predetermined arrangement.

(A) is sectional drawing which shows an example of embodiment of the light-emitting device of this invention, (b) is a perspective view of the light-emitting device of (a). It is a perspective view which shows an example of embodiment of the illuminating device of this invention. It is sectional drawing of the conventional light-emitting device.

Explanation of symbols

1: Base 1a: Convex part 2: Reflective member 2b: Reflective surface 2c: Concave part 4: Translucent member 5: Light emitting element

Claims (4)

A base made of ceramic having a rectangular shape in plan view, a convex portion having a light emitting element mounting portion on the upper surface, formed in parallel with the short side between the opposing long sides of the upper main surface of the base, and a lower surface A concave surface is formed, and the inner peripheral surface is a reflective surface that reflects light emitted from the light emitting element, the concave portion being fitted to the convex portion and joined so as to surround the mounting portion. A light-emitting element storage package comprising: a frame-shaped reflecting member, and a conductor layer formed on an upper surface of the convex portion and electrically connected to the light-emitting element. The light-emitting element storage package according to claim 1, wherein the convex part has an uneven surface formed on a side surface. The light emitting element storage package according to claim 2, the light emitting element mounted on the mounting portion and electrically connected to the conductor layer, and a translucent member covering the light emitting element. A light emitting device characterized by that. 4. A lighting device comprising the light emitting device according to claim 3 installed in a predetermined arrangement.

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