JP2004103775A - Chip led light emitting body and method for manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a chip LED light emitting body by which there is no inconvenience in fitting of a reflection housing to a printed wiring board, there is no fear of damaging a packaging component in the case of fitting in addition, and charging work of an optical diffusion lens to the reflection housing is carried out properly and simply. <P>SOLUTION: The reflection housing 4 is injection-molded in the state of a continuous single body directly on the upper surface of the printed wiring board 1 with a setting drag block 2 for inserting the printed wiring board 1 and a cope block 3 for housing formation. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method for manufacturing a chip LED light emitter and a chip LED light emitter, wherein a reflection housing is formed directly and integrally on a surface of a printed wiring board by injection molding.
[0002]
[Prior art]
FIG. 6 is an explanatory view showing a manufacturing stage of a conventional chip LED light emitter A used as a thin LED display.
A conventional chip LED illuminant A generally includes a printed wiring board 1 having a chip LED 12 mounted on a pattern section 11 and a cylindrical reflecting housing 4 having an upper and lower opening attached and fixed on the printed wiring board 1. Consisting of
[0003]
The specific manufacture of the chip LED luminous body A is as follows. The mounting leg portion 48 of the reflection housing (plastic molded product) 4 formed in advance is fitted into the mounting fitting hole 18 of the printed wiring board 1 and the thermal camera It is formed by being fixed by, for example.
[0004]
[Problems to be solved by the invention]
In the conventional chip LED light emitter A, various problems occur when the reflection housing is fixed to the printed wiring board. For example, a complicated operation of inserting the mounting leg portion of the reflection housing into the mounting hole of the substrate and a heat caulking operation of the fitted portion are required.
Then, at the stage of the steps of the insertion work and the heat caulking work, there is a possibility that the mounted chip LED, connection wire and the like may be damaged.
[0005]
Further, as shown in FIG. 7, the chip LED luminous body A is usually formed by filling a light diffusion lens portion (sealing resin mold portion) 5 in a reflection housing 4.
On the other hand, the thickness of the printed wiring board 1 has a relatively large variation. Therefore, a slight gap is generated between the junction between the reflection housing 4 and the printed wiring board 1.
[0006]
Therefore, conventionally, as shown in FIG. 7, a temporary sealing portion B is provided to prevent the filling resin in the reflection housing 4 from leaking out of the gap between the joints. The operation of the temporary sealing portion B is not very troublesome, and there are disadvantages such as poor appearance of the product.
[0007]
The present invention solves the above problems, and does not permit any inconvenience of mounting the reflection housing to the printed wiring board, does not damage the mounted components at the time of mounting, and furthermore, the reflection housing is mounted inside the reflection housing. It is an object of the present invention to provide a method of manufacturing a chip LED illuminator and a chip LED illuminator capable of appropriately and simply performing a filling operation of the light diffusion lens unit.
[0008]
[Means for Solving the Problems]
In order to achieve this object, the method for manufacturing a chip LED light emitter of the present invention has the following configuration.
The method of manufacturing the chip LED luminous body is such that the lower die block for setting in which the printed wiring board on which the chip LED is mounted is inserted and the upper die block for forming the housing are used to directly and integrally reflect on the upper surface of the printed wiring board. The housing is injection-molded.
[0009]
In the method of manufacturing a chip LED light emitter having such a configuration, the printed wiring board is set on the insert portion of the lower die block. When the lower block and the upper block are clamped, only the pattern contact surface of the upper block contacts the surface of the printed wiring board.
[0010]
That is, an inward concave relief portion is provided on the outer periphery of the pattern corresponding portion of the upper block, and the portion other than the pattern corresponding portion does not come into contact with the substrate surface. The upper block faces the substrate surface via the concave relief portion. Accordingly, since the substrate is not subjected to unnecessary mold clamping pressure as a whole, damage to the substrate and cutting of the substrate pattern portion are prevented.
[0011]
In this state, white (for example, polyphthalamide) resin is injected and filled into the housing forming space of the upper mold block (pattern corresponding portion) for housing formation, so that the surface is directly and integrally reflected on the surface of the printed wiring board. A housing is formed.
[0012]
Thus, there is no gap between the surface of the printed wiring board and the housing for reflection, and it is not possible to obtain a chip LED luminous body having a good appearance, and damage to the board and the board pattern portion caused by insert injection molding. A production method in which no generation occurs is obtained.
[0013]
In a chip LED luminous body comprising a printed wiring board on which chip LEDs are mounted and mounted, and a reflection housing directly and integrally injection-molded on the printed wiring board, the reflection housing is attached to the printed wiring board. Not only is it unnecessary to eliminate the trouble of mounting, but also the disadvantage of damaging electronic components during mounting is eliminated.
[0014]
Further, since there is no bonding gap between the printed wiring board and the housing for reflection, temporary sealing work for preventing leakage when forming the light diffusion lens portion (resin molding portion for sealing) becomes unnecessary. Demonstrate the effect.
[0015]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, specific embodiments of a method of manufacturing a chip LED light emitter and a chip LED light emitter according to the present invention will be described with reference to the drawings.
[0016]
The feature of the method of manufacturing the chip LED light emitter is that the printed wiring board 1 is inserted and the reflection housing 4 is formed on the surface of the printed wiring board 1 by injection molding.
As shown in FIG. 3, the manufacturing mold includes a lower mold block 2 for setting a substrate and an upper mold block 3 for forming a housing.
[0017]
The printed wiring board 1 has the same structure as that of the conventional example. The thickness of the printed circuit board is about 0.8 mm. A printed pattern section 11 is provided on the surface of the board 1, and the pattern section 11 has a reflective pattern as described later. After the housing 4 is integrally formed, the LED 12 is mounted.
[0018]
The board setting lower die block 2 is provided with a recessed board insert portion 21 corresponding to the thickness of the printed wiring board 1 on the upper surface.
In the present embodiment, the depth of the board insert 21 is slightly smaller than the average thickness of the board 1 in consideration of variations in the thickness accuracy of the printed wiring board 1 (manufacturer's guaranteed value ± 0.2 mm) ( (For example, 0.2 mm shallower). This is intended to prevent breakage of the substrate 1, excessive compression of the substrate 1 and prevention of resin burrs.
[0019]
When the printed wiring board 1 is set in the insert portion 21, a recessed relief portion 22 is formed in the lower block 2 for substrate setting at a position corresponding to the pattern portion 11 of the printed wiring board 1. I have. As a result, the extra mold clamping pressure acting on the pattern portion 11 of the substrate 1 is absorbed.
[0020]
The upper die block 3 for housing formation has a pattern corresponding part 31 at a position corresponding to the pattern part 11 of the printed wiring board 1 on the bottom surface, that is, the surface facing the lower die block 2.
[0021]
When the lower block 2 and the upper block 3 are clamped, the outer peripheral portion of the pattern corresponding portion 31 is depressed inward so that only the pattern contact surface portion 31 contacts the substrate 1. This is set in the relief section 32.
[0022]
As shown in FIG. 4, in the embodiment, the pressure relief portion 32 is formed such that a gap of about 0.2 mm is provided between the pattern corresponding portion 31 and the surface of the substrate 1 when the pattern corresponding portion 31 is in contact with the surface of the substrate 1. Is set.
[0023]
Thereby, the extra clamping force due to the clamping of the mold is set so as not to act on the printed wiring board 1, so that the printed wiring board 1 is prevented from being damaged and the substrate pattern portion 11 from being cut properly.
[0024]
The upper housing block 3 is provided with a reflecting housing space (vacant space) 33 corresponding to the pattern portion 11 of the printed wiring board 1. An opening 34 is provided.
[0025]
FIG. 4 shows a state in which the printed wiring board 1 is clamped by the board setting lower block 2 in which the printed wiring board 1 is inserted and the housing forming upper block 3.
[0026]
In this clamped state, only the pattern corresponding portion 31 of the upper die block 3 is in contact with the upper surface of the printed wiring board 1, and the outer periphery of the pattern corresponding portion 31 is subjected to a pressure relief portion 32 to apply a pressing force to the printed wiring board 1. Does not work.
[0027]
Further, in this state, white resin is injected from the port 34 of the upper block 3 for forming a housing. In the embodiment, the housing resin is injected into the housing forming space 33 by using PPA (polyphthalamide resin) which has good adhesiveness, is hard to peel off, and has high light reflectivity.
[0028]
In the embodiment, the injection pressure is set so that the substantial pressure (pressure after deducting the pressure loss) is about 660 kg / cm ² or less. In combination with the shallow setting of the insert depth of the substrate 1, the occurrence of burrs due to resin flowing into the surface of the substrate 1 is prevented.
[0029]
Thus, as shown in FIG. 1, the cylindrical reflection housing 4 having an upper opening having the surface of the substrate 1 as a bottom face is formed integrally and continuously at a position corresponding to the pattern portion 11 of the printed wiring board 1. In the embodiment, the reflecting housing 4 protrudes from the surface of the substrate 1 by a height of about 3 mm, and the inner circumferential surface of the cylinder is set in a tapered shape 41 expanding upward, and guides the reflected light to the center of the optical axis.
[0030]
Then, as shown in FIG. 1, the LED 12 is mounted on the bottom surface (the pattern portion 11 of the printed wiring board 1) surrounded by the reflection housing 4. In the embodiment, three (red, blue, and green) chip LEDs 12 constituting a full color are mounted.
[0031]
FIG. 2 is a perspective view showing the chip LED illuminant A produced by the steps of FIGS. 3, 4 and 1 described above.
The chip LED illuminant A is composed of a printed wiring board 1 on which the chip LED 12 is mounted and arranged, and a reflecting housing 4 directly and integrally formed on the printed wiring board 1 by injection molding.
[0032]
Further, the chip LED illuminant A is configured by filling and disposing a light diffusion lens portion (sealing resin mold portion) 5 in a reflection housing 4. In the embodiment, the light diffusion lens portion 5 is filled with a resin in which a scattering agent of titanium powder and a powdery white fluorescent agent are mixed in a transparent epoxy resin (or a transparent polycarbonate resin).
[0033]
As shown in FIG. 5, the chip LED luminous body A includes a conductive part (gold-plated part) 13 which is usually formed in a row of 12 pieces and is arranged in the adjacent column direction in a rectangular surface surrounded by a rectangular substrate frame 6. It is formed as a four-row arrangement. Then, as shown in FIG. 2, each single chip LED light emitter A is cut out from the substrate frame 6.
[0034]
In such a chip LED light-emitting body A, since the reflection housing 4 is formed integrally and continuously with the printed wiring board 1, the work of inserting the reflector 4 into the board 1 and the work of caulking as in the related art are unnecessary. Thus, disadvantages such as damage to mounted components during each operation are eliminated.
[0035]
【The invention's effect】
According to the present invention, as described above, the lower housing block for the set in which the printed wiring board is inserted and the upper housing block are formed directly on the surface of the printed wiring board by injection molding the reflection housing integrally and continuously. Therefore, not only is it possible to eliminate troublesome various operations when retrofitting the reflective housing to the printed wiring board, but also it is possible to eliminate disadvantages such as damage to mounted components during the mounting operation. Further, since there is no gap between the junction between the printed wiring board and the reflecting housing, a temporary sealing operation for preventing leakage of the resin when filling the resin for the light diffusion lens portion is unnecessary.
[0036]
Further, in the upper block for forming the housing, only the pattern corresponding portion is in contact with the substrate surface, and the outer periphery of the pattern corresponding portion is made not to be in contact with the substrate by the relief portion. Do not apply mold clamping force. Therefore, damage to the substrate, cutting of the pattern, and occurrence of burrs due to insert injection molding (variation in substrate thickness and mold clamping pressure) can be completely prevented.
[0037]
The chip LED illuminator constituted by providing the reflection housing directly and integrally on the printed wiring board is easy to form the light diffusion lens portion, and is used for preventing resin leakage on the outer peripheral surface of the reflection housing. Since there is no temporary sealing portion, an excellent effect of achieving the object of the invention is obtained, such as obtaining a thin luminous body for an LED display having a good appearance and appearance.
[Brief description of the drawings]
FIG. 1 is an explanatory view showing a manufacturing stage in which the manufacture of a chip LED light emitter is completed.
FIG. 2 is a perspective view showing a chip LED light emitter.
FIG. 3 is a separation explanatory view showing a state in which a substrate, an upper die, and a lower die are separated.
FIG. 4 is an explanatory view showing a state where the inserted substrate is pressed by an upper die and a lower die.
FIG. 5 is an explanatory perspective view showing a state in which a chip LED light emitter is cut out from a substrate frame.
FIG. 6 is an explanatory view showing a manufacturing state of a conventional chip LED light emitter.
FIG. 7 is a cross-sectional view showing a conventional chip LED light emitter.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Printed wiring board 2 Lower block for board setting 3 Upper block for housing formation 4 Housing for reflection 5 Resin molded part (light diffusion lens part)
11 Pattern part 12 Chip LED
21 Board insert part 22 Relief part 31 Pattern corresponding part 32 Pressure relief part 33 Housing formation space

Claims (4)

Manufacture of a chip LED luminous body, wherein a reflection housing is injection-molded directly and integrally directly on an upper surface of a printed wiring board by a lower mold for setting in which a printed wiring board is inserted and an upper mold for forming a housing. Method. 2. The chip LED according to claim 1, wherein the housing molding upper mold is provided with a pattern corresponding portion which comes into contact only with a pattern portion on the surface of the printed wiring board, and the pattern corresponding portion has a housing forming space. Method for manufacturing luminous body A chip LED luminous body comprising a printed wiring board on which a chip LED is mounted and arranged, and a reflection housing directly and integrally injection-molded on the printed wiring board. 4. The chip LED illuminator according to claim 3, wherein a light diffusion lens portion is filled and provided in the reflection housing.

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