KR20080082112A - Method for fabricating light emitting diode and structure of package substrate - Google Patents

Method for fabricating light emitting diode and structure of package substrate Download PDF

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Publication number
KR20080082112A
KR20080082112A KR1020070022495A KR20070022495A KR20080082112A KR 20080082112 A KR20080082112 A KR 20080082112A KR 1020070022495 A KR1020070022495 A KR 1020070022495A KR 20070022495 A KR20070022495 A KR 20070022495A KR 20080082112 A KR20080082112 A KR 20080082112A
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KR
South Korea
Prior art keywords
lead frame
lens
mold
diode chip
hole
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Application number
KR1020070022495A
Other languages
Korean (ko)
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KR100887598B1 (en
Inventor
박성배
이주석
Original Assignee
우리이티아이 주식회사
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Priority to KR1020070022495A priority Critical patent/KR100887598B1/en
Publication of KR20080082112A publication Critical patent/KR20080082112A/en
Application granted granted Critical
Publication of KR100887598B1 publication Critical patent/KR100887598B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

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Abstract

The present invention relates to a light emitting diode manufacturing method for forming a lens using a mold and a structure of a lead frame, and preparing a mold to have a lens-shaped lens forming portion, the mold to inject a transparent mold material into the lens forming portion Alternatively, grooves or holes are formed in the lead frame to align the mold and the lead frame on which the diode chip is mounted to inject a transparent mold material through the grooves or holes to simultaneously form the molding part and the lens.

Description

Method for fabricating light emitting diode and structure of package substrate

1 is a cross-sectional view illustrating a method of manufacturing a light emitting device according to the prior art.

Figure 2 is for explaining the structure of the mold according to the first embodiment of the present invention, Figure 2a is a plan view of the mold, Figure 2b is a side view

3 is a structural cross-sectional view of a lead frame on which a chip according to a first embodiment of the present invention is mounted;

4 is a cross-sectional view for describing a method of forming a molding part and a lens according to a first exemplary embodiment of the present invention.

5 is a perspective view of a lead frame according to a second embodiment of the present invention;

6 is a cross-sectional view of a state in which a lead frame and a mold are coupled according to a second embodiment of the present invention;

7 is a cross-sectional view of a state in which a lead frame and a mold are coupled according to a third embodiment of the present invention.

8 is a rear view of a lead frame according to a fourth embodiment of the present invention.

9 is a cross-sectional view of a state in which a lead frame and a mold are coupled according to a fourth embodiment of the present invention;

10A to 10C are structural cross-sectional views of through holes according to third and fourth embodiments of the present invention.

*** Explanation of symbols on main parts of drawing ***

10, 35: mold 11: lens forming portion

12, 13, 29a, 29b: injection groove or vent groove

21, 31: lead electrodes 22, 32: lead frame

23, 33: light emitting diode chip 24, 34: wire

25, 42: molding part 26, 43: lens

27, 40: heat metal 28, 41: body

14a, 14b, 37a, 37b: through hole 39: nozzle

The present invention relates to a method of manufacturing a light emitting device, and to a light emitting diode manufacturing method for forming a lens using a mold and a structure of a lead frame therefor.

In general, light emitting diodes (LEDs) have excellent monochromatic peak wavelength, have excellent light efficiency, and can be miniaturized, and thus are widely used as various display devices, mobile phones, and landscape lighting. Recently, white light emitting diodes have been actively developed as high-output, high-efficiency light sources capable of coping with backlights of lighting devices or liquid crystal display devices.

Such a light emitting diode should have excellent light extraction characteristics, and attach a lens to the light emitting surface in order to have excellent light extraction characteristics.

Referring to the accompanying drawings, a conventional method for manufacturing a light emitting diode is as follows.

1 is a cross-sectional view for explaining a method of manufacturing a conventional light emitting device.

The conventional method of manufacturing a light emitting diode has a heat metal (7) on a lead frame (2) with a lead metal (1) and a lead electrode (1) for dissipating heat generated from a diode chip with a protrusion on its top surface. The diode chip 3 is mounted on the protruding portion thereof.

The electrode of the diode chip 3 and the lead electrode 1 are connected using a gold wire 4.

A molding part 5 is formed on the lead frame 2 on which the diode chip 3 is mounted to cover both the diode chip 3 and the wire 4.

Then, in order to improve the light extraction characteristic, the lens 6 made by the injection mold is attached onto the molding part 5 of the lead frame 2 using an adhesive sheet.

However, such a conventional method of manufacturing a light emitting diode has the following problems.

That is, in order to improve the light extraction characteristics, the lens made by the injection mold is attached onto the molding part of the lead frame using an adhesive sheet, so that the process is large and the productivity is lowered, and the lens forming cost is high.

In addition, since the lens made by the injection mold is attached to the molding part using an adhesive sheet, during the attaching process, foreign matter is inserted or scratches are generated on the surface of the lens, thereby deteriorating light extraction characteristics.

The present invention has been made to solve the problems of the prior art as described above, to prepare a mold having a lens-shaped lens forming portion, and to be injected into the mold or lead frame to inject a transparent mold material into the lens forming portion / A light emitting device capable of simultaneously forming a molding part and a lens by forming a vent groove or an injection / vent hole to align the lead frame in which the mold and the diode chip are mounted to inject a transparent mold material through the injection groove or the injection hole. It is an object of the present invention to provide a method of manufacturing a and a structure of a lead frame for manufacturing the light emitting device.

Method of manufacturing a light emitting device according to the present invention for achieving the above object comprises the steps of preparing a mold having a lens-shaped lens forming portion and the injection groove formed in the lens forming portion; Mounting a diode chip on a lead frame; Aligning and coupling the mold and the lead frame such that the diode chip and the lens forming unit face each other and the diode chip is positioned at the center of the lens forming unit; And forming a molding part and a lens for molding the diode chip by injecting silicon or epoxy through the injection groove at the same time.

In addition, the manufacturing method of the light emitting device according to the present invention for achieving the above object comprises the steps of preparing a mold having a lens-shaped lens forming portion; Preparing a lead frame having at least one injection groove formed therein; Mounting a diode chip on the lead frame; Aligning and coupling the mold and the lead frame such that the diode chip and the lens forming unit face each other and the remaining portions except the injection groove are sealed to each other; And forming a molding part and a lens for molding the diode chip by injecting silicon or epoxy through the injection groove at the same time.

In addition, the manufacturing method of the light emitting device according to the present invention for achieving the above object comprises the steps of preparing a lead frame formed with at least one injection groove; Preparing a mold having at least one through hole in a lens-shaped lens forming portion and a portion corresponding to the injection groove; Mounting a diode chip on the lead frame; Aligning and coupling the mold and the lead frame such that the diode chip and the lens forming unit face each other, the through hole and the injection groove correspond to each other, and the remaining portions except the injection groove are sealed to each other; And forming a molding part and a lens for molding the diode chip by injecting silicon or epoxy through the through hole and the injection groove at the same time.

In addition, the manufacturing method of the light emitting device according to the present invention for achieving the above object comprises the steps of preparing a mold having a lens-shaped lens forming portion; Forming at least one through hole on the lead frame; Mounting a diode chip on the lead frame; Aligning and coupling the mold and the lead frame such that the diode chip and the lens forming unit face each other and the through hole is positioned in the lens forming unit; In addition, there is another feature, including the step of forming a molding unit and a lens for molding the diode chip by injecting silicon or epoxy through the through-hole at the same time.

On the other hand, the lead frame according to the present invention for achieving the above object, has a protrusion to the top surface for dissipating heat generated from the diode chip; Lead electrodes; A body fixing the heat metal and the lead electrode; And it is characterized by having at least one through-hole.

In addition, the lead frame according to the present invention for achieving the above object, has a protrusion to the upper surface for dissipating heat generated from the diode chip; a lead electrode; A body fixing the heat metal and the lead electrode; And it is another feature that is configured with at least one injection groove formed in the body.

The method of manufacturing the light emitting device according to the present invention having the above characteristics and the structure of a lead frame for manufacturing the light emitting device will be described in more detail with reference to the accompanying drawings.

First embodiment

Figure 2 is for explaining the structure of the mold according to the first embodiment of the present invention, Figure 2a is a plan view of the mold, Figure 2b is a side view. 3 is a structural cross-sectional view of a lead frame on which a chip according to a first embodiment of the present invention is mounted. 4 is a cross-sectional view for describing a method of forming a molding part and a lens according to a first exemplary embodiment of the present invention.

As shown in Figs. 2A to 2B, a mold 10 for manufacturing a light emitting device according to the first embodiment of the present invention is prepared.

That is, in the mold 10 for manufacturing the light emitting device according to the first embodiment of the present invention, the lens forming portion 11 formed in the shape of a lens and the epoxy or silicon for forming the lens and the molding portion are injected. In order to provide the injection groove 12 formed in the lens forming portion (11).

Here, the mold 10 may form the molding part and the lens at the same time in the light emitting device even if the injection groove 12 is provided only, the vent groove 13 separately from the injection groove 12 for a more smooth process It may be provided. In the figure it is shown that the vent groove 13 is provided. In addition, the lens forming unit may be formed in an oval, circular or polygonal shape, and may form irregularities of various shapes (circular, square, triangular, etc.) on the inner surface of the lens forming unit, that is, the lens surface.

Then, the lead frame 22 according to the first embodiment of the present invention is prepared.

That is, as shown in Figure 3, the lead frame 22 according to the first embodiment of the present invention, the heat metal 27 for dissipating heat generated from the diode chip having a protrusion on the upper surface and the lead, The electrode 21 and the body 28 which fixes the said heat metal 27 and the lead electrode 21 are comprised.

The diode chip 23 is mounted on the protruding portion of the heat metal 27 of the lead frame 22 configured as described above. In addition, the electrode of the diode chip 23 and the lead electrode 21 are connected by using a conductive wire 24.

The mold 10 is aligned and coupled to the lead frame 22 prepared as described above, and a molding part and a lens are simultaneously formed by injecting a material such as epoxy or silicon through the injection groove 12 of the mold 10. .

More specifically, as shown in FIG. 4, the mold 10 as shown in FIGS. 2A and 2B is aligned and coupled to the lead frame 22 in which the diode chip 23 as shown in FIG. 3 is mounted. The alignment method aligns the center portion of the lens-shaped lens forming portion 11 of the mold 10 and the diode chips 23 mounted on the lead frame 22 to be aligned with each other, and the mold 10 Except for the injection groove 12 or the vent groove 13, the mold 10 and the lead frame 22 are coupled to seal the remaining portions to each other.

At this time, the mold 10 may be located below and the lead frame 22 may be located above, the mold 10 may be located above, and the lead frame 22 may be located below. .

By combining as described above, the lens 26 is formed simultaneously with the molding part 25 by injecting epoxy or silicon through the injection groove 12.

At this time, the epoxy or silicon may be mixed with at least one of a phosphor or a light dispersant.

Second embodiment

In the method of manufacturing the light emitting device according to the second embodiment of the present invention, in the first embodiment of the present invention, the injection groove or the vent hole is formed in the lead frame without forming the injection groove in the mold. After preparing a mold having an injection groove for injecting epoxy or silicon into the lead frame, the lead frame and the mold are aligned and joined so that the end of the injection groove is exposed to the outside, and then epoxy or through the injection groove. Injecting silicon to form a lens at the same time as the molding portion. This will be described in detail as follows.

5 is a perspective view of a lead frame according to a second embodiment of the present invention, and FIG. 6 is a cross-sectional view of a lead frame and a mold according to a second embodiment of the present invention.

As shown in FIGS. 5 and 6, a heat metal 27, a lead electrode 21, a lead electrode 21, a heat electrode 27, and a lead electrode for dissipating heat generated in a diode chip having a protrusion on an upper surface thereof are shown. Lead frame 22 according to the second embodiment of the present invention having a body 28 for fixing the 21 and at least one injection groove or vent groove 29a, 29b on the upper surface of the body 28 Prepare. Here, even if only one injection groove 29a is provided, the molding part and the lens may be simultaneously formed in the light emitting device, and a vent groove 29b may be provided separately from the injection groove 29a for a smoother process. . In the figure, the vent groove 29b is provided.

In addition, a mold 10 having a lens forming portion 11 formed in a lens shape is prepared. Here, the lens forming unit 11 may be formed in an oval, circular or polygonal shape, and the irregularities of various shapes (circular, square, triangular, etc.) are formed on the inner surface of the lens forming unit 11, that is, the lens surface. can do.

The diode chip 23 is mounted on the protruding portion of the heat metal 27 of the lead frame 22 configured as described above. In addition, the electrode of the diode chip 23 and the lead electrode 21 are connected by using a conductive wire 24.

The mold 10 is aligned and coupled to the lead frame 22 prepared as described above, and a molding part and a lens are simultaneously formed by injecting a material such as epoxy or silicon through the injection groove 29a of the lead frame 22. do.

More specifically, as shown in FIG. 6, the mold 10 is aligned and coupled to the lead frame 22 on which the diode chip 23 is mounted. In the alignment method, the center portion of the lens-shaped lens forming portion 11 of the mold 10 and the diode chip 23 mounted on the lead frame 22 are positioned in line with each other, and the injection groove or the vent groove ( The mold 10 and the lead frame 22 are aligned so that the ends of the ends 29a and 29b are exposed to the outside. In addition, the mold 10 and the lead frame 22 are coupled to each other to seal the remaining portions except the injection groove 29a or the vent groove 29b of the lead frame 22.

At this time, the mold 10 may be located below and the lead frame 22 may be located above, the mold 10 may be located above, and the lead frame 22 may be located below. .

In this way, the nozzle is inserted into the injection groove 29a to inject epoxy or silicon through the injection groove 29a to simultaneously form the lens 26 with the molding part 25.

At this time, the epoxy or silicon may be mixed with at least one of a phosphor or a light dispersant.

Third embodiment

In the method of manufacturing a light emitting device according to the third embodiment of the present invention, in the second embodiment of the present invention, a through hole is further formed in the mold to be aligned with the injection groove, such that the through hole and the injection groove are aligned. After aligning and combining the lead frame and the metal mold, the nozzle is inserted into the injection groove through the through hole to inject epoxy or silicon to form a lens simultaneously with the molding part. This will be described in detail as follows.

7 is a cross-sectional view of a state in which a lead frame and a mold are coupled according to a third embodiment of the present invention.

The structure of the lead frame according to the third embodiment of the present invention is the same as that of FIGS. 5 and 6 described in the second embodiment of the present invention. Therefore, the description of the structure of the lead frame according to the third embodiment of the present invention will be omitted.

As shown in FIG. 7, through-holes 14a and 14b are provided in portions corresponding to the lens forming part 11 formed in the shape of a lens and the injection grooves or the vent holes 29a and 29b of the lead frame 22. The mold 10 is prepared. Here, the lens forming unit 11 may be formed in an oval, circular or polygonal shape, and the irregularities of various shapes (circular, square, triangular, etc.) are formed on the inner surface of the lens forming unit 11, that is, the lens surface. can do.

The mold 10 is aligned and coupled to the lead frame 22 prepared as described above, and the nozzle is inserted into the injection groove 29a of the lead frame 22 through the through hole 14a of the mold 10. The molding part 25 and the lens 26 are simultaneously formed by injecting a material such as epoxy or silicon.

More specifically, as shown in FIG. 7, the mold 10 is aligned and coupled to the lead frame 22 on which the diode chip 23 is mounted. The alignment method includes the mold 10 and the lead frame 22 such that the through holes 14a and 14b of the mold 10 and the injection or vent grooves 29a and 29b formed in the lead frame 22 correspond to each other. Sort it. In addition, the mold 10 and the lead frame 22 are coupled to each other to seal the remaining portions except the injection groove 29a or the vent groove 29b of the lead frame 22.

At this time, the mold 10 may be located below and the lead frame 22 may be located above, the mold 10 may be located above, and the lead frame 22 may be located below. .

In this way, the nozzle is inserted into the injection groove 29a through the inside of the through hole 14a of the mold 10, and epoxy or silicon is injected through the injection groove 29a to mold the molding part 25. And the lens 26 at the same time.

At this time, the epoxy or silicon may be mixed with at least one of a phosphor or a light dispersant.

In the third embodiment of the present invention as described above, the nozzle is not inserted into the injection hole 29a through the through hole 14a, and the nozzle is inserted only at the entrance of the through hole 14a of the mold 10. The lens 26 may be simultaneously formed with the molding part 25 by injecting epoxy or silicon through the through hole 14a and the injection groove 29a.

Fourth embodiment

In the method of manufacturing a light emitting device according to a fourth embodiment of the present invention, a mold having a lens-shaped lens forming portion is prepared, a through hole for injecting epoxy or silicon into a lead frame is formed to align and combine the lead frame and the mold. Thereafter, a lens is formed at the same time as the molding part by injecting epoxy or silicon through the through hole from the rear side of the lead frame. This will be described in detail as follows.

FIG. 8 is a rear view of a lead frame according to a fourth embodiment of the present invention, and FIG. 9 is a cross-sectional view of a lead frame and a mold according to a fourth embodiment of the present invention.

As shown in FIGS. 8 and 9, a heat metal 40, a lead electrode 31, a lead electrode 31, a heat electrode 40 for dissipating heat generated from a diode chip having a protrusion on an upper surface thereof, and the heat metal 40 and a lead electrode. A lead frame 32 according to a fourth embodiment of the present invention having a body 41 for fixing 31 is prepared.

At least one through hole 37a or 37b is formed at both sides of the diode chip to be mounted on the lead frame 32. In more detail, at least one through hole 37a or 37b is formed in the periphery of the heat metal 40. 8 and 9 illustrate that the at least one through hole 37a and 37b is formed in the body 41 on both sides of the heat metal 40. Here, the at least one through hole 37a is an injection hole for injecting epoxy or silicon, and the at least one through hole 37b is a vent hole for discharging air or the like during the injection of epoxy or silicon. Of course, only one injection hole may be formed without a vent hole.

In addition, the position at which the through-hole is formed is not specified to any particular portion, and any portion can be used as long as it is not difficult to work.

Then, the diode chip 33 is mounted on the protruding and floating of the heat metal 40 of the lead frame 32 configured as described above, and the electrode of the diode chip 33 and the lead electrode 31 are connected to a conductive wire ( conductivity wire (34).

On the other hand, the metal mold | die 35 which has a lens-shaped lens formation part is prepared. In addition, the mold 35 and the lead frame 32 are aligned to couple the mold 35 and the lead frame 32 to seal the space between the mold 35 and the lead frame 32. At this time, the lead frame 32 and the mold 35 are aligned such that the at least one through hole 37a and 37b is positioned inside the lens forming portion of the mold 35.

At this time, there is no significant effect on the position of the mold 35 and the lead frame 32, it is shown in Figure 9 that the mold 35 is located on the lower side, the lead frame 32 is located on the upper side The mold 35 is located above and the lead frame 32 may be located below.

As described above, the molding part 42 and the lens 43 are simultaneously formed by injecting epoxy or silicon through the injection through hole 37a while the mold 35 and the lead frame 32 are coupled to each other. At this time, the epoxy or silicon may be mixed with at least one of a phosphor or a light dispersant.

Then, the mold 35 and the lead frame 32 are separated.

In the above, according to the product characteristics of the light emitting device, the lens-shaped lens forming portion may be formed in an oval, circular or polygonal shape, various shapes (round, square, triangle, etc.) on the inner surface of the lens forming portion, that is, the lens surface Irregularities can be formed.

In the third and fourth embodiments of the present invention, the cross-sectional structure of the through hole will be described in more detail as follows.

10A through 10C are structural cross-sectional views of through holes according to third and fourth embodiments of the present invention.

As shown in Figs. 10A to 10C, the structure of the through hole of the present invention is smaller than the radius of the through holes 37a and 37b in the surface portion of the rear surface of the lead frame 32 in which the through holes 37a and 37b are formed. It is provided with a guide portion 38 formed more wide. That is, in order to inject the injection nozzle 39 for injecting epoxy or silicon into the through-holes 37a and 37b deeper from the surface portion of the rear surface of the lead frame 32, sliding (tilting) as shown in Fig. 10A. Load guide) 38, or as shown in Figure 10b, to configure the guide portion 38 to have a step, or as shown in Figure 10c to configure the guide portion 38 so that one side is sliding and the other side has a step. Can be.

The reason is to prevent the epoxy or silicon from protruding from the back of the lead frame 32 when the epoxy or silicon is injected.

This structure is also applied to the through holes 14a and 14b formed in the mold 10 according to the third embodiment of the present invention.

That is, the surface portion of the back surface of the mold 10 in which the through holes 14a and 14b are formed is provided with a guide portion formed wider than the radius of the through holes 14a and 14b. To 10c.

In the first to fourth embodiments of the present invention, only the injection type lead frame is illustrated and described. However, the present invention is not limited thereto and may be applied to both a lead frame of a PCB type including a metal or a lead frame of a COB type. Since the structure of the lead frame of the PCB type or the lead frame of the COB type is a well known structure, its configuration is not shown.

As described above, the method of manufacturing the light emitting device and the structure of the lead frame according to the present invention have the following effects.

First, since the molding part and the lens are formed at the same time using a mold, process time can be shortened and productivity can be improved.

Secondly, since the molding part and the lens are formed at the same time by using a mold, it is possible to prevent foreign matter from being inserted into the lens or a scratch on the lens surface during the process, thereby increasing the light extraction efficiency of the light emitting device.

Claims (19)

Preparing a mold having a lens-shaped lens forming portion and an injection groove formed in the lens forming portion; Mounting a diode chip on a lead frame; Aligning and coupling the mold and the lead frame such that the diode chip and the lens forming unit face each other and the diode chip is positioned at the center of the lens forming unit; And And forming a molding part and a lens for molding the diode chip by injecting silicon or epoxy through the injection groove at the same time. Preparing a mold having a lens-shaped lens forming portion; Preparing a lead frame having at least one injection groove formed therein; Mounting a diode chip on the lead frame; Aligning and coupling the mold and the lead frame such that the diode chip and the lens forming unit face each other and the remaining portions except the injection groove are sealed to each other; And And forming a molding part and a lens for molding the diode chip by injecting silicon or epoxy through the injection groove at the same time. Preparing a lead frame having at least one injection groove formed therein; Preparing a mold having at least one through hole in a lens-shaped lens forming portion and a portion corresponding to the injection groove; Mounting a diode chip on the lead frame; Aligning and coupling the mold and the lead frame such that the diode chip and the lens forming unit face each other, the through hole and the injection groove correspond to each other, and the remaining portions except the injection groove are sealed to each other; And And forming a molding part and a lens for molding the diode chip by injecting silicon or epoxy through the through hole and the injection groove at the same time. Preparing a mold having a lens-shaped lens forming portion; Forming at least one through hole on the lead frame; Mounting a diode chip on the lead frame; Aligning and coupling the mold and the lead frame such that the diode chip and the lens forming unit face each other and the through hole is positioned in the lens forming unit; And And forming a molding part and a lens for molding the diode chip by injecting silicon or epoxy through the through-hole at the same time. The method according to any one of claims 1 to 4, The method of manufacturing a light emitting device, characterized in that the lens forming portion of the mold is formed in an oval, circular or polygonal shape. The method according to any one of claims 1 to 4, And a concave-convex portion of various shapes on the inner surface of the lens forming portion of the mold, that is, the lens surface portion. The method according to any one of claims 1 to 4, The epoxy or silicon is a method of manufacturing a light emitting device, characterized in that at least one of a phosphor or a light dispersant is mixed. The method according to any one of claims 1 to 4, The lead frame is a manufacturing method of a light emitting device, characterized in that one of the injection type lead frame, PCB type lead frame or COB type lead frame. The method of claim 1, The mold further comprises a vent groove formed in the lens forming portion. The method according to claim 2 or 3, The lead frame further comprises a vent groove. The method of claim 3, wherein In the forming of the molding part and the lens simultaneously, the method of manufacturing a light emitting device, characterized in that the injection of silicon or epoxy by inserting a nozzle to the injection groove through the through hole. A heat metal having a protrusion on the top surface for dissipating heat generated in the diode chip; Lead electrodes; A body fixing the heat metal and the lead electrode; And A lead frame comprising at least one through hole. The method of claim 12, And the at least one through hole is formed around the heat metal. The method of claim 12, The at least one through hole is formed in the body lead frame. The method of claim 12, And each of the at least one through holes has a guide portion formed wider than the radius of the through holes at a predetermined depth from the rear surface of the lead frame. The method of claim 15, The guide frame is characterized in that the sliding sliding. The method of claim 15, The guide part is configured to have a step. The method of claim 15, One side of the guide portion is sliding and the other side surface is configured to have a stepped lead frame. A heat metal having a protrusion on the top surface for dissipating heat generated from the diode chip; Lead electrodes; A body fixing the heat metal and the lead electrode; And Lead frame characterized in that it is provided with at least one injection groove formed in the body.
KR1020070022495A 2007-03-07 2007-03-07 Method for fabricating light emitting diode and structure of package substrate KR100887598B1 (en)

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Cited By (1)

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Publication number Priority date Publication date Assignee Title
KR20130075309A (en) * 2011-12-27 2013-07-05 엘지이노텍 주식회사 Light emitting device array

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KR101547548B1 (en) * 2013-12-26 2015-08-26 주식회사 루멘스 Phosphor encapsulation type light emitting device package, backlight unit, illumination device and its manufacturing method

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JP2005223216A (en) * 2004-02-06 2005-08-18 Matsushita Electric Ind Co Ltd Light emitting light source, illuminator, and display unit
KR100784057B1 (en) * 2005-06-24 2007-12-10 엘지이노텍 주식회사 Light emitting device package and mauufacture method of light emitting device package
KR100757196B1 (en) * 2005-08-01 2007-09-07 서울반도체 주식회사 Light emitting device with a lens of silicone

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20130075309A (en) * 2011-12-27 2013-07-05 엘지이노텍 주식회사 Light emitting device array

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