KR101547548B1 - Phosphor encapsulation type light emitting device package, backlight unit, illumination device and its manufacturing method - Google Patents

Abstract

The present invention relates to a phosphor encapsulation type light emitting device package, a backlight unit, a lighting device, and a method of manufacturing a phosphor encapsulation type light emitting device package that can be applied to an illumination or display device. A lead electrically connected to the light emitting element; And a phosphor surrounding the lead and the periphery of the light emitting element, wherein the lead includes: a first lead; And a second lead provided so as to be spaced apart from the first lead, wherein the first lead and the second lead have a shape that is first bent to form a space for accommodating the light emitting element therein, The phosphor may be configured to integrally surround the periphery of the light emitting element and the lead, which are accommodated in the light emitting element accommodating space and are electrically connected to the lead.

Description

FIELD OF THE INVENTION [0001] The present invention relates to a phosphor encapsulation type light emitting device package, a backlight unit, an illuminating device, and a method of manufacturing a phosphor encapsulation type light emitting device package,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a phosphor encapsulation type light emitting device package, a backlight unit, an illuminating device, and a method of manufacturing a phosphor encapsulation type light emitting device package, and more particularly to a phosphor encapsulation type light emitting device package A backlight unit, an illumination device, and a method of manufacturing a phosphor encapsulation type light emitting device package.

Light emitting diodes (LEDs) are semiconductor devices that can emit light of various wavelengths by forming a light emitting source through the formation of PN diodes of compound semiconductors. Such a light emitting device has a long lifetime, can be reduced in size and weight, has a strong directivity of light, and can be driven at a low voltage. Further, such an LED is resistant to impact and vibration, does not require preheating time and complicated driving, can be packaged in various forms, can be modularized for various purposes, and can be applied to various lighting devices and display devices.

However, in the conventional light emitting device package, white mold or gold wire, which reflects light in one direction and forms an external structure, is used in addition to the phosphor, the overall thickness of the product is increased and the cost is wasted , There is a problem that light is emitted only in one direction of the package, and the luminous efficiency is lowered.

SUMMARY OF THE INVENTION [0008] The present invention has been made to solve the above-mentioned problems, and it is an object of the present invention to provide an integrated phosphor which surrounds a lid and a light emitting element instead of a white mold to reduce the thickness of the product, The present invention also provides a phosphor encapsulation type light emitting device package, a backlight unit, an illuminating device, and a method of manufacturing a phosphor encapsulation type light emitting device package that can emit light to increase the luminous efficiency. However, these problems are exemplary and do not limit the scope of the present invention.

According to an aspect of the present invention, there is provided a phosphor encapsulation type light emitting device package including: a light emitting element; A lead electrically connected to the light emitting element; And a phosphor surrounding the lead and the periphery of the light emitting element, wherein the lead includes: a first lead; And a second lead provided so as to be spaced apart from the first lead, wherein the first lead and the second lead have a shape that is first bent to form a space for accommodating the light emitting element therein, The phosphor may be configured to integrally surround the periphery of the light emitting element and the lead, which are accommodated in the light emitting element accommodating space and are electrically connected to the lead.

According to an aspect of the present invention, the light emitting device includes a first light emitting surface facing the spaced space so as to emit light through the spacing space, and a first electrode and a second electrode on both ends of the first light emitting surface, A flip chip in which electrodes are formed, or a horizontal type LED.

According to an aspect of the present invention, the light emitting device may be a bidirectional light emitting device in which a second light emitting surface is formed on a surface opposite to the first light emitting surface.

According to an aspect of the present invention, the first lead may include: a first elongated lead electrically connected to the first electrode of the light emitting element and extending in the longitudinal direction of the light emitting element; And a first bent lead connected to the first extended lead and having a first bent shape with respect to the first extended lead, wherein the second lead is electrically connected to the second electrode of the light emitting element A second extension lead extending in the longitudinal direction of the light emitting element; And a second bent lead connected to the second extended lead and having a first bent shape with respect to the second extended lead.

According to an aspect of the present invention, the first lead is connected to the first bending lead, is exposed to the outside of the phosphor, and the first exposed lead, which is secondarily bent on the basis of the first bending lead, And a second exposed lead connected to the second bent lead and exposed to the outside of the phosphor and having a second bent shape with respect to the second bent lead, .

According to an aspect of the present invention, the first exposed lead and the second exposed lead may be bent in the lower direction of the phosphor or in an outward direction of the phosphor.

According to an aspect of the present invention, there is provided a backlight unit including: a light emitting element; A lead electrically connected to the light emitting element; A phosphor surrounding the lead and the periphery of the light emitting element; And a light guide plate installed in an optical path of the light emitting element, wherein the lead includes: a first lead; And a second lead provided so as to be spaced apart from the first lead, wherein the first lead and the second lead have a shape that is first bent to form a space for accommodating the light emitting element therein, The phosphor may be configured to integrally surround the periphery of the light emitting element and the lead, which are accommodated in the light emitting element accommodating space and are electrically connected to the lead.

According to an aspect of the present invention, there is provided an illumination device including: a light emitting element; A lead electrically connected to the light emitting element; And a phosphor surrounding the lead and the periphery of the light emitting element, wherein the lead includes: a first lead; And a second lead provided so as to be spaced apart from the first lead, wherein the first lead and the second lead have a shape that is first bent to form a space for accommodating the light emitting element therein, The phosphor may be configured to integrally surround the periphery of the light emitting element and the lead, which are accommodated in the light emitting element accommodating space and are electrically connected to the lead.

According to another aspect of the present invention, there is provided a method of manufacturing a phosphor-encapsulated light emitting device package, the method comprising: bending a first lead and a second lead to form a space for accommodating a light emitting element therein; And arranging the first lead and the second lead to prepare a lead; Placing the light emitting element in the light emitting element accommodating space, and electrically connecting the light emitting element and the lead; And providing a phosphor around the lead and the light emitting device.

According to an aspect of the present invention, the step of placing the light emitting element in the light emitting element accommodating space and electrically connecting the light emitting element and the lead may include applying a conductive paste to the light emitting element, The step of providing the phosphor around the lead and the light emitting element may include inserting the lead and the light emitting element into a cavity inside the mold and molding a phosphor material into the cavity of the mold.

According to some embodiments of the present invention as described above, it is possible to provide a light emitting device that is structurally very rigid using first and second bent leads to form a space for accommodating a light emitting element, The thickness of the product can be remarkably reduced by using the phosphor, the cost can be saved by using the flip chip coated with the conductive paste, and the light can be emitted in both directions of the package. Of course, the scope of the present invention is not limited by these effects.

1 is a perspective view showing a phosphor encapsulation type light emitting device package according to some embodiments of the present invention.
FIG. 2 is a cross-sectional view showing a II-II cross section of the phosphor-encapsulated light emitting device package of FIG. 1; FIG.
3 is a cross-sectional view showing a III-III cross section of the phosphor encapsulation type light emitting device package of FIG.
4 is a cross-sectional view illustrating a phosphor encapsulation type light emitting device package according to some other embodiments of the present invention.
5 is a cross-sectional view illustrating a phosphor encapsulation type light emitting device package according to still another embodiment of the present invention.
6 is a cross-sectional view illustrating a phosphor encapsulation type light emitting device package according to still another embodiment of the present invention.
FIGS. 7 and 8 are cross-sectional views illustrating steps of fabricating a phosphor-encapsulated light emitting device package according to some embodiments of the present invention.
9 is a cross-sectional view illustrating a backlight unit according to some embodiments of the present invention.
10 is a flowchart showing a method of manufacturing a phosphor encapsulation type light emitting device package according to some embodiments of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

The embodiments of the present invention are described in order to more fully explain the present invention to those skilled in the art, and the following embodiments may be modified into various other forms, The present invention is not limited to the embodiment. Rather, these embodiments are provided so that this disclosure will be more thorough and complete, and will fully convey the concept of the invention to those skilled in the art. In the drawings, the thickness and size of each layer are exaggerated for convenience and clarity of explanation.

It is to be understood that throughout the specification, when an element such as a film, region or substrate is referred to as being "on", "connected to", "laminated" or "coupled to" another element, It will be appreciated that elements may be directly "on", "connected", "laminated" or "coupled" to another element, or there may be other elements intervening therebetween. On the other hand, when one element is referred to as being "directly on", "directly connected", or "directly coupled" to another element, it is interpreted that there are no other components intervening therebetween do. Like numbers refer to like elements. As used herein, the term "and / or" includes any and all combinations of one or more of the listed items.

Although the terms first, second, etc. are used herein to describe various elements, components, regions, layers and / or portions, these members, components, regions, layers and / It is obvious that no. These terms are only used to distinguish one member, component, region, layer or section from another region, layer or section. Thus, a first member, component, region, layer or section described below may refer to a second member, component, region, layer or section without departing from the teachings of the present invention.

Also, relative terms such as "top" or "above" and "under" or "below" can be used herein to describe the relationship of certain elements to other elements as illustrated in the Figures. Relative terms are intended to include different orientations of the device in addition to those depicted in the Figures. For example, in the figures the elements are turned over so that the elements depicted as being on the top surface of the other elements are oriented on the bottom surface of the other elements. Thus, the example "top" may include both "under" and "top" directions depending on the particular orientation of the figure. If the elements are oriented in different directions (rotated 90 degrees with respect to the other direction), the relative descriptions used herein can be interpreted accordingly.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms "a," "an," and "the" include singular forms unless the context clearly dictates otherwise. Also, " comprise "and / or" comprising "when used herein should be interpreted as specifying the presence of stated shapes, numbers, steps, operations, elements, elements, and / And does not preclude the presence or addition of one or more other features, integers, operations, elements, elements, and / or groups.

Hereinafter, embodiments of the present invention will be described with reference to the drawings schematically showing ideal embodiments of the present invention. In the figures, for example, variations in the shape shown may be expected, depending on manufacturing techniques and / or tolerances. Accordingly, the embodiments of the present invention should not be construed as limited to the particular shapes of the regions shown herein, but should include, for example, changes in shape resulting from manufacturing.

FIG. 1 is a perspective view showing a phosphor encapsulation type light emitting device package 100 according to some embodiments of the present invention, FIG. 2 is a cross-sectional view showing a II-II cross section of a phosphor encapsulation type light emitting device package 100 of FIG. 1 And Fig. 3 is a cross-sectional view showing a III-III cross section of the phosphor-encapsulated light emitting device package 100 of Fig.

1 to 3, a phosphor encapsulation type light emitting device package 100 according to some embodiments of the present invention includes a light emitting device 10, a lead 20, (30).

1 to 3, the light emitting device 10 is a flip chip type LED (Light Emitting Diode) having a first electrode 11 and a second electrode 12 on an upper surface thereof .

Here, the first electrode 11 and the second electrode 12 may be coated or dispensed with a conductive paste on the chip of the light emitting device 10. The first electrode 11 and the second electrode 12 may be formed by a method of applying a conductive paste to the light emitting element 10 and a method of applying a conductive paste may be, Various printing methods such as a stamping method, an inkjet printing method, a stencil printing method, and a squeeze printing method can be applied.

In addition, the first electrode 11 and the second electrode 12 may form various types of fingers F to improve current diffusion.

The light emitting device 10 may be made of a semiconductor, as shown in FIGS. For example, LEDs of blue, green, red, and yellow light emission, LEDs of ultraviolet light emission, and LEDs of infrared light emission, which are made of a nitride semiconductor, can be applied. The nitride semiconductor is represented by a general formula Al _x Ga _y In _z N (0? X? 1, 0? Y? 1, 0? Z? 1, x + y + z = 1).

The light emitting device 10 can be formed by epitaxially growing nitride semiconductors such as InN, AlN, InGaN, AlGaN, and InGaAlN on a sapphire substrate for growth or a silicon carbide substrate by a vapor phase growth method such as MOCVD To grow. The light emitting element 10 may be formed using a semiconductor such as ZnO, ZnS, ZnSe, SiC, GaP, GaAlAs, or AlInGaP in addition to the nitride semiconductor. These semiconductors can be stacked in the order of an n-type semiconductor layer, a light emitting layer, and a p-type semiconductor layer. The light emitting layer (active layer) may be a laminated semiconductor having a multiple quantum well structure or a single quantum well structure or a laminated semiconductor having a double hetero structure. Further, the light emitting element 10 can be selected to have an arbitrary wavelength depending on applications such as display use and illumination use.

Here, as the growth substrate, an insulating, conductive or semiconductor substrate may be used if necessary. For example, the growth substrate may be sapphire, SiC, Si, MgAl 2 O 4, MgO, LiAlO 2, LiGaO 2, GaN. A GaN substrate, which is a homogeneous substrate, is preferable for epitaxial growth of a GaN material, but a GaN substrate has a problem of high production cost due to its difficulty in manufacturing.

Sapphire and silicon carbide (SiC) substrates are mainly used as the different substrates. Sapphire substrates are more utilized than expensive silicon carbide substrates. When using a heterogeneous substrate, defects such as dislocation are increased due to the difference in lattice constant between the substrate material and the thin film material. Also, due to the difference in the thermal expansion coefficient between the substrate material and the thin film material, warping occurs at a temperature change, and warping causes a crack in the thin film. This problem may be reduced by using a buffer layer between the substrate and the GaN-based light emitting laminate.

In addition, the substrate for growth may be completely or partially removed or patterned in order to improve the optical or electrical characteristics of the LED chip before or after the growth of the LED structure.

For example, in the case of a sapphire substrate, the substrate can be separated by irradiating the laser to the interface with the semiconductor layer through the substrate, and the silicon or silicon carbide substrate can be removed by a method such as polishing / etching.

Another supporting substrate may be used for removing the growth substrate. In order to improve the light efficiency of the LED chip on the opposite side of the growth substrate, the supporting substrate may be bonded using a reflective metal, As shown in FIG.

In addition, patterning of the growth substrate improves the light extraction efficiency by forming irregularities or slopes before or after the LED structure growth on the main surface (front surface or both sides) or side surfaces of the substrate. The size of the pattern can be selected from the range of 5 nm to 500 μm and it is possible to make a structure for improving the light extraction efficiency with a rule or an irregular pattern. Various shapes such as a shape, a column, a mountain, a hemisphere, and a polygon can be adopted.

In the case of the sapphire substrate, the crystals having a hexagonal-rhombo-cubic (Hexa-Rhombo R3c) symmetry have lattice constants of 13.001 and 4.758 in the c-axis direction and the a-axis direction, respectively, and have C plane, A plane and R plane. In this case, the C-plane is relatively easy to grow the nitride film, and is stable at high temperature, and thus is mainly used as a substrate for nitride growth.

Another material of the growth substrate is a Si substrate, which is more suitable for large-scale curing and relatively low in cost, so that mass productivity can be improved.

In addition, since the silicon (Si) substrate absorbs light generated from the GaN-based semiconductor and the external quantum efficiency of the light emitting device is lowered, the substrate may be removed as necessary, and Si, Ge, SiAl, A support substrate such as a metal substrate is further formed and used.

When a GaN thin film is grown on a different substrate such as the Si substrate, the dislocation density increases due to the lattice constant mismatch between the substrate material and the thin film material, and cracks and warpage Lt; / RTI > The buffer layer may be disposed between the growth substrate and the light emitting stack for the purpose of preventing dislocation and cracking of the light emitting stack. The buffer layer also functions to reduce the scattering of the wavelength of the wafer by adjusting the degree of warping of the substrate during the growth of the active layer.

Here, the buffer layer may be made of Al _x In _y Ga _1-xy N (0? X? 1, 0? _Y? 1, x + y? 1), in particular GaN, AlN, AlGaN, InGaN or InGaNAlN. Materials such as ZrB2, HfB2, ZrN, HfN and TiN can also be used as needed. Further, a plurality of layers may be combined, or the composition may be gradually changed.

The light emitting device 10 may be a horizontal or vertical chip having a signal transmitting medium such as a wire, a bump, a pad, or a solder in addition to a flip chip.

1, the light emitting device 10 may be provided on the lower surface of the lead 20, or a plurality of the light emitting devices 10 may be provided on the lead 20.

The lead 20 is electrically connected to the light emitting element 10 and the lead 20 may be formed of an insulating material such as aluminum, copper, zinc, tin, lead, gold, A metal lead frame type or a metal or plate type substrate can be applied.

1, the lead 20 includes a first lead 21 and a second lead 22 provided with a spacing A1 from the first lead 21, . The spacing space A1 may be referred to as an electrode separation line.

The first lead 21 and the second lead 22 may have a first bent shape so that the light emitting element accommodating space A2 may be formed therein.

Here, the spacing space A1 may be an outgoing path of light directed upward, and the light emitting element accommodation space A2 may include at least the light emitting element 10, 10, a width wider than the width of the light emitting device 10, and a height greater than a thickness of the light emitting device 10. [

The bending process of the lead 20 can be realized by bending the flat lead partly by using a press or a punch, or by bending it by various methods such as molding by die casting or a die.

Accordingly, the lead 20 can guide the light emitted from the light emitting element 10 upward by using the spacing space A1, and the first lead 21 and the second lead 21, The light emitting element 10 can be securely and safely protected from external impacts and various stresses by forming the light emitting element accommodation space A2 inside the lid 22 by using the leads 22. [

For this, the lead 20 may be made of a material having a suitable mechanical strength and an insulating property or a conductive material so as to support the light emitting element 10.

In addition, the lead 20 may be a printed circuit board (PCB) having a plurality of epoxy resin sheets formed thereon. The lead 20 may be a flexible printed circuit board (FPCB) made of a soft material.

The lead 20 may be a synthetic resin substrate such as resin or glass epoxy or a ceramic substrate in consideration of thermal conductivity.

The lead 20 may be formed by partially or wholly selecting at least one of EMC (Epoxy Mold Compound), PI (polyimide), ceramic, graphene, glass synthetic fiber and combinations thereof to improve workability .

The phosphor 30 surrounds the periphery of the lead 20 and the light emitting device 10. The phosphor 30 is accommodated in the light emitting device accommodation space A2 and electrically connected to the lead 20, It may be a shape that integrally surrounds the periphery of the element 10 and the lead 20.

The phosphor 30 may be formed of a molding resin material having appropriate mechanical strength and insulation so as to firmly support and protect the light emitting element 10 together with the lead 20.

More specifically, the phosphor 30 may be composed of a binder that is a resin material such as fluorescent particles and epoxy.

Here, the fluorescent particles of the fluorescent material 30 may have the following composition formula and color.

Oxide system: yellow and green Y3Al5O12: Ce, Tb3Al5O12: Ce, Lu3Al5O12: Ce

(Ba, Sr) 2SiO4: Eu, yellow and orange (Ba, Sr) 3SiO5: Ce

Eu, Sr2Si5N8: Eu, SrSiAl4N7: Eu, Eu3O3: Eu, Eu3O3: Eu,

The composition of the fluorescent particles should basically correspond to stoichiometry, and each element may be substituted with another element in each group on the periodic table. For example, Sr can be substituted with Ba, Ca, Mg, etc. of the alkaline earth (II) group, and Y can be replaced with lanthanum series of Tb, Lu, Sc, Gd and the like. Ce, Tb, Pr, Er, Yb and the like, and the active agent may be used alone or as a negative active agent for the characteristic modification.

In addition, as a substitute for the fluorescent particles, materials such as a quantum dot can be applied, and a fluorescent material and QD can be mixed with LEDs or used alone.

QD can be composed of a core (3 to 10 nm) such as CdSe and InP, a shell (0.5 to 2 nm) such as ZnS and ZnSe, and a ligand for stabilizing the core and the shell. Can be implemented.

In addition, the phosphor 30 may be molded in the mold in combination with the binder. In addition, a coating method of the phosphor 30 or the quantum dot may be used.

Such a coating method may use at least one of a method of being applied to an LED chip or a light emitting element, a method of covering a film form, a method of attaching a sheet form such as a film or a ceramic fluorescent substance, or the like.

Dispensing and spray coating are common methods of spraying, and dispensing includes mechanical methods such as pneumatic method and screw, linear type. It is also possible to control the amount of dyeing through a small amount of jetting by means of a jetting method and control the color coordinates thereof. The method of collectively applying the phosphor on the wafer level or the light emitting device substrate by the spray method can easily control productivity and thickness.

The method of directly covering the light emitting device 10 or the LED chip in a film form can be applied by a method of electrophoresis, screen printing, or phosphor molding, and the method may have a difference depending on necessity of application of the side of the LED chip.

In order to control the efficiency of the long-wavelength light-emitting phosphor that reabsers light emitted from a short wavelength among two or more kinds of phosphors having different emission wavelengths, two or more kinds of phosphor layers having different emission wavelengths can be distinguished. A DBR (ODR) layer may be included between each layer to minimize absorption and interference.

In order to form a uniform coating film, the phosphor may be formed into a film or ceramic form and then attached onto the LED chip or the light emitting device.

In order to make a difference in light efficiency and light distribution characteristics, a photoelectric conversion material may be located in a remote format. In this case, the photoelectric conversion material is located together with a transparent polymer, glass, or the like depending on its durability and heat resistance.

Since the phosphor coating technique plays a major role in determining the optical characteristics in the light emitting device, control techniques such as the thickness of the phosphor coating layer and the uniform dispersion of the phosphor have been studied variously. QD can also be placed in the LED chip or the light emitting element in the same manner as the phosphor, and can be positioned between the glass or translucent polymer material for light conversion.

Further, for example, the binder of the phosphor 30 may be an epoxy resin composition, a silicone resin composition, a modified epoxy resin composition, a modified silicone resin composition, a polyimide resin composition, a modified polyimide resin composition, a polyphthalamide (PPA ), Polycarbonate resin, polyphenylene sulfide (PPS), liquid crystal polymer (LCP), ABS resin, phenol resin, acrylic resin, and combinations thereof.

2, the light emitting device 10 has a first light emitting surface 10-1 directed toward the spacing A1 so as to emit light through the spacing A1, And a flip chip or a horizontal type LED in which a first electrode 11 and a second electrode 12 are formed at both ends of the first light emitting surface 10-1.

Here, the light emitting device 10 may be a bidirectional light emitting device having a second light emitting surface 10-2 formed on the opposite side of the first light emitting surface 10-1.

In addition, the light emitting device 10 may be an omnidirectional light emitting device that emits light from four side surfaces together with the first light emitting surface 10-1 and the second light emitting surface 10-2.

More specifically, for example, the bi-directional light emitting device may be a flip-chip LED in which a sapphire substrate as a growth substrate is cut or cut.

Therefore, a part of the light generated in the light emitting element 10 is emitted upward through the first light emitting surface 10-1 and converted into white light by the phosphor 30 provided in the spacing space A1. And can be diverted to the outside.

At the same time, another part of the light emitted from the light emitting element 10 is emitted downward through the second light emitting surface 10-2. The phosphor 30 provided in the light emitting element accommodating space A2 emits white light And can be diverted to the outside.

In this case, for example, when the light emitting element 10 is a blue LED and the fluorescent particles included in the fluorescent substance 30 are yellow fluorescent particles capable of converting light having a blue wavelength into yellow, A part of the light of the blue wavelength generated in the light emitting element 10 is emitted as blue light through the phosphor 20 as it is and another part of the light of the blue wavelength generated in the light emitting element 10 is emitted to the phosphor 20, and is converted into light having a yellow wavelength and is emitted. Therefore, the blue light and the yellow light can be mixed to form white light. Of course, the light emitting element 10 is not limited to the blue LED, but may be a red LED or a green LED, and the fluorescent particles included in the fluorescent material 30 may also include red fluorescent particles, , Blue fluorescent particles, and the like.

2, the first lead 21 includes a first extension lead 21-1, a first bending lead 21-2, and a first exposure lead 21-3. .

More specifically, for example, the first extension lead 21-1 is electrically connected to the first electrode 11 of the light emitting element 10 and extends in the longitudinal direction of the light emitting element 10 .

The first bent lead 21-2 is connected to the first extended lead 21-1 and the first extended lead 21-1 and the first extended lead 21-1 is connected to the reference As shown in Fig.

The first exposed leads 21-3 are connected to the first bending leads 21-2 and are exposed to the outside of the fluorescent material 30 and the first bending leads 21-2 It may be a member of a shape that is secondarily bent on the basis of a reference.

2, the second lead 22 includes a second extension lead 22-1, a second bending lead 22-2, and a second exposure lead 22-3. .

The second extension lead 22-1 may be a member electrically connected to the second electrode 12 of the light emitting element 10 and extending in the longitudinal direction of the light emitting element 10. [

The second bent lead 22-2 is connected to the second extended lead 22-1 and the second extended lead 22-1 and the second extended lead 22-1 is connected to the reference As shown in Fig.

The second exposed lead 22-3 is connected to the second bent lead 22-2 and is exposed to the outside of the phosphor 30 and the second bent lead 22-2 It may be a member of a shape that is secondarily bent on the basis of a reference.

Therefore, the first extension lead 21-1, the first bending lead 21-2, the second extension lead 22-1, and the second bending lead 22-2 are electrically connected to the light emission The phosphor 30 has a shape that surrounds the periphery of the light emitting element 10 so as to protect the element 10 and the phosphor 30 has the first extended lead 21-1 and the first bent lead 21 2) and the second extension lead 22-1, the second bending lead 22-2, and the light emitting element 10, it is possible to prevent the light emitting element 10 from being damaged even when there is no separate white molding material. Since the phosphor 30 is formed in all directions of the light emitting element 10, the light generated from the light emitting element 10 can be efficiently converted to provide high quality, high brightness, A light quantity of white light can be realized in all directions.

2, the first exposed lead 21-3 and the second exposed lead 22-3 are connected to external terminals in a direction of the bottom surface of the phosphor 30 It can be bent.

4 is a cross-sectional view illustrating a phosphor encapsulation type light emitting device package 200 according to some other embodiments of the present invention.

4, the phosphor encapsulation type light emitting device package 200 according to some other embodiments of the present invention includes the first exposed lead 21-3 and the second exposed lead 22-3, May be bent outwardly of the phosphor 30 so as to be connected to external terminals. The bending directions of the first exposed lead 21-3 and the second exposed lead 22-3 may be different depending on the type, the type and the position of the external terminals.

5 is a cross-sectional view illustrating a phosphor encapsulation type light emitting device package 300 according to still another embodiment of the present invention.

5, a phosphor encapsulation type light emitting device package 300 according to still another embodiment of the present invention includes a plurality of light emitting elements (LEDs) The elements 40, 50 and 60 may be electrically connected. Here, the light emitting devices 40, 50, and 60 may generate light of different wavelengths, and the light emitting devices 40, 50, and 60 may include a plurality of the first leads 21 and a plurality of the second leads 22, respectively.

Accordingly, the phosphor encapsulation type light emitting device package 300 according to still another embodiment of the present invention can implement a multi-chip type package. Therefore, it is possible to reproduce light of various wavelengths and various amounts of light in various combinations.

6 is a cross-sectional view illustrating a phosphor encapsulation type light emitting device package 400 according to still another embodiment of the present invention.

6, the phosphor encapsulation type light emitting device package 400 according to still another embodiment of the present invention may further include a translucent body 70 surrounding the phosphor 30. Referring to FIG. Here, the light transmitting member 70 may be molded or may be applied in various ways, and glass such as transparent glass, acrylic, silicone, epoxy resin, silicone resin, polyimide resin, or polypropylene resin is applied .

Therefore, the phosphor 30 can be protected by using the translucent member 70, and degeneration and deformation of the phosphor 30 can be prevented.

FIGS. 7 and 8 are cross-sectional views illustrating steps of manufacturing a phosphor-encapsulated light emitting device package 100 according to some embodiments of the present invention.

7 and 8, a manufacturing process of the phosphor encapsulation type light emitting device package 100 according to some embodiments of the present invention will be described. First, as shown in FIG. 7, And the light emitting element 10 can be inserted into the cavity C in the mold 1 (2). Here, the molds 1 and 2 include a first mold 1 provided at a lower portion of an object to be molded, and a second mold 1 capable of being mold-closed with the first mold 1, (2).

Next, as shown in Fig. 8, the molds 1 and 2 can be mold-closed to mold the phosphor material M in the cavity C of the molds 1 and 2. Next, as shown in Fig.

Therefore, the entire appearance of the package can be formed by molding the phosphor 30 on the entire surface of the light emitting element 10 by a single molding operation, thereby reducing the number of operations and time, thereby greatly improving the productivity.

The phosphor encapsulation type light emitting device package 100 may be manufactured by various methods such as a phosphor coating method, a dispensing method, a dotting method, and a printing method in addition to the insert injection molding method described above.

9 is a cross-sectional view illustrating a backlight unit according to some embodiments of the present invention.

9, the backlight unit according to some embodiments of the present invention includes a light emitting element 10, a lead 20 electrically connected to the light emitting element 10, A phosphor 30 surrounding the light emitting element 10 and a light guide plate 80 provided in an optical path of the light emitting element 10 and the lid 20 includes a first lead 21, And a second lead 22 provided with a space A1 between the first lead 21 and the first lead 21 and the second lead 22. The first lead 21 and the second lead 22, The phosphor 30 is formed in a shape that is firstly bent so that a receiving space A2 can be formed. The phosphor 30 is accommodated in the light emitting element accommodating space A2 and is electrically connected to the light emitting element 10 And the periphery of the lead 20 integrally.

1, the light emitting device 10, the lead 20, and the fluorescent material 30 may be formed in the same manner as the fluorescent encapsulant type light emitting device package 100 according to some embodiments of the present invention, ) May have the same role and configuration as the components of FIG. Therefore, detailed description is omitted.

In addition, the light guide plate 80 may be an optical member that can be made of a light-transmitting material to guide light generated from the light emitting device 10.

The light guide plate 80 may be installed in a path of light generated by the light emitting device 10 to transmit light generated by the light emitting device 10 over a wider area.

The light guide plate 80 may be made of polycarbonate, polysulfone, polyacrylate, polystyrene, polyvinyl chloride, polyvinyl alcohol, polynorbornene, polyester, or the like , And various light transmitting resin materials may be applied. In addition, the light guide plate 80 may be formed by various methods such as forming fine patterns, fine protrusions, diffusion films, or the like on the surface, or forming fine bubbles therein.

Although not shown, various diffusion sheets, prism sheets, filters, and the like may be additionally provided above the light guide plate 80. In addition, various display panels such as an LCD panel may be provided above the light guide plate 80. [

Although not shown, the present invention may include a lighting device including the above-mentioned phosphor-sealed light emitting device package 100. Here, the components of the lighting device according to some embodiments of the present invention may have the same configuration and functions as those of the above-described phosphor-sealed light emitting device package 100 of the present invention. Therefore, detailed description is omitted.

10 is a flowchart showing a method of manufacturing a phosphor-encapsulated light emitting device package 100 according to some embodiments of the present invention.

1 to 10, a method of manufacturing a phosphor-encapsulated light emitting device package 100 according to some embodiments of the present invention includes forming a light emitting element accommodating space A2 inside a first Bending the lead 21 and the second lead 22 and arranging the first lead 21 and the second lead 22 in a spaced space A1 to prepare the lead 10 (S2) of placing the light emitting element (10) in the light emitting element accommodation space (A2) and electrically connecting the light emitting element (10) and the lead (20) And a step S3 of providing a phosphor 30 around the light emitting device 10. [

More specifically, for example, the step S2 of mounting the light emitting element 10 may electrically connect the lead 20 to the light emitting element 10 by applying a conductive paste thereto.

7, the lead 20 and the light emitting element 10 are placed in the cavity C in the mold 1 (2), as shown in FIG. 7, , And the phosphor material (M) may be molded in the cavity (C) of the mold (1) (2) as shown in FIG.

While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the invention. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.

1, 2: Mold
C: cavity
M: phosphor material
10, 40, 50, 60: light emitting element
20: Lead
21: first lead
22: second lead
30: Phosphor
A1: Spacing space
A2: Space for accommodating the light emitting element
70: Transparent body
80: light guide plate
100: Phosphor encapsulant type light emitting device package

Claims (10)

A light emitting element;
A lead electrically connected to the light emitting element; And
A phosphor surrounding the lead and the periphery of the light emitting element;
Lt; / RTI >
The lead includes:
A first lead; And a second lead installed with a space between the first lead and the first lead,
The first lead and the second lead are each in a shape that is first bent to form a light emitting element accommodating space therein,
Wherein the phosphor has a shape that integrally surrounds the periphery of the light emitting element and the lead which are housed in the light emitting element accommodating space and are electrically connected to the lead,
The first lead may be formed,
A first elongated lead electrically connected to the first electrode of the light emitting element and extending in the longitudinal direction of the light emitting element, the first elongated lead being embedded in the phosphor; And
And a first bent lead connected to the first extended lead and having a first bent shape with respect to the first extended lead,
And the second lead has,
A second elongated lead electrically connected to the second electrode of the light emitting element and extending in the longitudinal direction of the light emitting element, the second elongated lead being embedded in the phosphor; And
And a second bending lead connected to the second extension lead and having a first bent shape with respect to the second extension lead. The method according to claim 1,
The light emitting device may include a flip chip having a first light emitting surface facing the spacing space to emit light through the spacing space and a first electrode and a second electrode formed on both ends of the first light emitting surface, Wherein the light emitting device package comprises a light emitting diode package. 3. The method of claim 2,
Wherein the light emitting device is a bidirectional light emitting device in which a second light emitting surface is formed on a surface opposite to the first light emitting surface. delete The method according to claim 1,
The first lead may be formed,
And a first exposed lead connected to the first bent lead and exposed to the outside of the phosphor and having a second bent shape with respect to the first bent lead,
And the second lead has,
And a second exposed lead connected to the second bent lead and exposed to the outside of the phosphor and having a second bent shape with respect to the second bent lead. 6. The method of claim 5,
Wherein the first exposed lead and the second exposed lead are bent in the lower direction of the phosphor or in an outward direction of the phosphor. A light emitting element;
A lead electrically connected to the light emitting element;
A phosphor surrounding the lead and the periphery of the light emitting element; And
A light guide plate installed in an optical path of the light emitting element;
/ RTI >
The lead includes:
A first lead; And a second lead installed with a space between the first lead and the first lead,
The first lead and the second lead are each in a shape that is first bent to form a light emitting element accommodating space therein,
Wherein the phosphor has a shape that integrally surrounds the periphery of the light emitting element and the lead which are housed in the light emitting element accommodating space and are electrically connected to the lead,
The first lead may be formed,
A first elongated lead electrically connected to the first electrode of the light emitting element and extending in the longitudinal direction of the light emitting element, the first elongated lead being embedded in the phosphor; And
And a first bent lead connected to the first extended lead and having a first bent shape with respect to the first extended lead,
And the second lead has,
A second elongated lead electrically connected to the second electrode of the light emitting element and extending in the longitudinal direction of the light emitting element, the second elongated lead being embedded in the phosphor; And
And a second bent lead connected to the second extended lead and having a first bent shape with respect to the second extended lead. A light emitting element;
A lead electrically connected to the light emitting element; And
A phosphor surrounding the lead and the periphery of the light emitting element;
Lt; / RTI >
The lead includes:
A first lead; And a second lead installed with a space between the first lead and the first lead,
The first lead and the second lead are each in a shape that is first bent to form a light emitting element accommodating space therein,
Wherein the phosphor has a shape that integrally surrounds the periphery of the light emitting element and the lead which are housed in the light emitting element accommodating space and are electrically connected to the lead,
The first lead may be formed,
A first elongated lead electrically connected to the first electrode of the light emitting element and extending in the longitudinal direction of the light emitting element, the first elongated lead being embedded in the phosphor; And
And a first bent lead connected to the first extended lead and having a first bent shape with respect to the first extended lead,
And the second lead has,
A second elongated lead electrically connected to the second electrode of the light emitting element and extending in the longitudinal direction of the light emitting element, the second elongated lead being embedded in the phosphor; And
And a second bent lead connected to the second extended lead and having a first bent shape with respect to the second extended lead. Bending the first lead and the second lead so that the light emitting element accommodating space can be formed therein, and arranging the first lead and the second lead with a spacing space to prepare a lead;
Placing the light emitting element in the light emitting element accommodating space, and electrically connecting the light emitting element and the lead; And
Providing a phosphor around the lead and the light emitting element;
Lt; / RTI >
The first lead may be formed,
A first elongated lead electrically connected to the first electrode of the light emitting element and extending in the longitudinal direction of the light emitting element, the first elongated lead being embedded in the phosphor; And
And a first bent lead connected to the first extended lead and having a first bent shape with respect to the first extended lead,
And the second lead has,
A second elongated lead electrically connected to the second electrode of the light emitting element and extending in the longitudinal direction of the light emitting element, the second elongated lead being embedded in the phosphor; And
And a second bending lead connected to the second extension lead and having a first bent shape with respect to the second extension lead. 10. The method of claim 9,
Wherein the step of placing the light emitting element in the light emitting element accommodating space and electrically connecting the light emitting element and the lead includes:
A conductive paste is applied to the light emitting element and electrically connected to the lead,
The step of providing the phosphor around the lead and the light emitting element may include:
Wherein the lead and the light emitting element are inserted into a cavity inside a mold, and a phosphor material is molded in a cavity of the mold.

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