KR101504160B1 - Light emitting device package, backlight unit, lighting device and its manufacturing method - Google Patents

Abstract

The present invention relates to a light emitting device package used for a display or lighting, a backlight unit, a lighting device, and a method for manufacturing the light emitting device package. The light emitting device package includes a substrate, a cup groove part with a cup shape which is concavely formed on one side of the substrate by a punch press to receive at least one light emitting device inside, a wiring layer which is extended from one side of the substrate to the inner side of the cup groove part to be electrically connected to the light emitting device and includes copper or aluminum elements, and a deformation part which is formed to protrude by deforming the other side of the substrate when the cup groove part is pressed by the punch press.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting device package, a backlight unit, a lighting device,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting device package, a backlight unit, a lighting device, and a method of manufacturing a light emitting device package, and more particularly to a light emitting device package, a backlight unit, And a manufacturing method thereof.

A light emitting diode (LED) is a kind of semiconductor device that can emit light of various colors by forming a light emitting source through the formation of a PN diode of a compound semiconductor. Such a light emitting device has a long lifetime, can be reduced in size and weight, has a strong directivity of light, and can be driven at a low voltage. These LEDs are resistant to shocks and vibrations, do not require preheating time and complicated driving, can be packaged after being mounted on various types of boards or lead frames, so they are modularized for various purposes and applied to various lighting devices and display devices can do.

However, when the conventional substrate or the metal substrate is applied, the structure of the light emitting device package is complicated and the processing steps are complicated, so that the unit price is greatly increased and only a product with a low output thickness can be produced due to the heat dissipation problem. And the lifetime is shortened.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and it is an object of the present invention to provide a metal substrate having a cup portion by a punch press to greatly simplify a structure and a process, A light emitting device package, a backlight unit, a lighting device, and a method of manufacturing a light emitting device package, which are excellent in durability, can greatly improve heat dissipation characteristics and optical characteristics, can accommodate protrusions by punch presses, And to provide the above objects. However, these problems are exemplary and do not limit the scope of the present invention.

According to an aspect of the present invention, there is provided a light emitting device package including: a substrate; A cup-shaped cup-shaped groove formed on one surface of the substrate so as to be recessed by a punch press so that at least one light-emitting element can be seated therein; A wiring layer extending from one surface of the substrate to the inner surface of the cup-shaped portion so as to be electrically connected to the light-emitting element, the wiring layer including copper or an aluminum component; And a deformation part formed on the other surface of the substrate so as to protrude when the punch press presses the cup part.

In addition, the light emitting device package according to the present invention may further include a clearance groove portion formed on the other surface of the substrate corresponding to the deformable portion so as to accommodate the deformed portion, wherein the clearance groove portion includes: And an allowance volume introduced from the other surface of the substrate may be 50 to 80 percent of a depression volume of the cup space.

Further, according to the idea of the present invention, the clearance groove portion may have a shape in which the cross section of the groove surface is angular or concave.

According to an aspect of the present invention, a plurality of the clearance groove portions may be formed on the opposite surface of the cup-shaped portion of the substrate.

Further, the light emitting device package according to the present invention may further include a cup side wall portion formed by the punch press on an edge of the cup portion and having a contact height so as to be in contact with an edge of the lens.

According to an aspect of the present invention, the wiring layer is separated from the bottom surface of the cup portion, the substrate is a metal substrate containing aluminum or an iron component, an insulating layer is provided between the substrate and the wiring layer, A thermosetting adhesive layer for bonding the wiring layer and the substrate to each other by a hot press is provided between the wiring layer and the substrate, and the cup portion is formed with an inclined surface and is provided on the upper surface of the wiring layer provided on the inclined surface Wherein the reflective layer is a plating layer containing a component selected from at least one of silver, platinum, gold, mercury, chromium, and combinations thereof, and is disposed in a light path of the light emitting element, Wherein the filler comprises at least a phosphor, a light-transmitting encapsulant, a lens layer, and a combination thereof Will formed by selecting one or more of Ne, an insulating protective layer is provided on the surface of the substrate or the wiring layer other than the filler may further include a.

According to another aspect of the present invention, there is provided a backlight unit comprising: a substrate; A cup-shaped cup-shaped groove formed on one surface of the substrate so as to be recessed by a punch press so that at least one light-emitting element can be seated therein; A wiring layer extending from one surface of the substrate to the inner surface of the cup-shaped portion so as to be electrically connected to the light-emitting element, the wiring layer including copper or an aluminum component; A deformed portion formed on the other surface of the substrate so as to protrude when the punch press presses the cup portion; And a light guide plate installed in an optical path of the light emitting device.

According to an aspect of the present invention, there is provided a lighting apparatus comprising: a substrate; A cup-shaped cup-shaped groove formed on one surface of the substrate so as to be recessed by a punch press so that at least one light-emitting element can be seated therein; A wiring layer extending from one surface of the substrate to the inner surface of the cup-shaped portion so as to be electrically connected to the light-emitting element, the wiring layer including copper or an aluminum component; And a deformation part formed on the other surface of the substrate so as to protrude when the punch press presses the cup part.

According to another aspect of the present invention, there is provided a method of fabricating a light emitting device package, including: providing a wiring layer of a conductive material on a surface of a substrate; Forming a clearance groove on the other surface of the substrate so as to accommodate the deformed portion of the substrate; Forming a cup-shaped cup portion concave on one surface of the substrate by using a punch press so that the clearance groove can accommodate the deformed portion of the substrate; Providing a reflective layer on a portion of the wiring layer inside the cup groove portion; And placing the light emitting element on the wiring layer inside the cup groove portion to electrically connect the wiring layer and the light emitting element.

According to an aspect of the present invention, the step of forming the clearance groove to accommodate the deformed portion of the substrate on the other surface of the substrate may include cutting the substrate or etching the substrate.

According to some embodiments of the present invention as described above, it is possible to reduce the unit cost of the product, reduce the thickness, enable high output, provide excellent durability, greatly improve the heat dissipation characteristics and optical characteristics, So that the lower surface can be flattened. Of course, the scope of the present invention is not limited by these effects.

1 is a cross-sectional view illustrating a light emitting device package according to some embodiments of the present invention.
FIGS. 2 to 8 are cross-sectional views illustrating steps of fabricating a light emitting device package according to some embodiments of the present invention.
9 is a cross-sectional view illustrating a light emitting device package according to some other embodiments of the present invention.
10 is a cross-sectional view illustrating a light emitting device package according to still another embodiment of the present invention.
FIGS. 11 to 13 are cross-sectional views illustrating steps of fabricating a light emitting device package according to still another embodiment of the present invention.
14 is a cross-sectional view illustrating a light emitting device package according to still another embodiment of the present invention.
15 is a flowchart showing a method of manufacturing a light emitting device package according to some embodiments of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

The embodiments of the present invention are described in order to more fully explain the present invention to those skilled in the art, and the following embodiments may be modified into various other forms, The present invention is not limited to the embodiment. Rather, these embodiments are provided so that this disclosure will be more thorough and complete, and will fully convey the concept of the invention to those skilled in the art. In the drawings, the thickness and size of each layer are exaggerated for convenience and clarity of explanation.

It is to be understood that throughout the specification, when an element such as a film, region or substrate is referred to as being "on", "connected to", "laminated" or "coupled to" another element, It will be appreciated that elements may be directly "on", "connected", "laminated" or "coupled" to another element, or there may be other elements intervening therebetween. On the other hand, when one element is referred to as being "directly on", "directly connected", or "directly coupled" to another element, it is interpreted that there are no other components intervening therebetween do. Like numbers refer to like elements. As used herein, the term "and / or" includes any and all combinations of one or more of the listed items.

Although the terms first, second, etc. are used herein to describe various elements, components, regions, layers and / or portions, these members, components, regions, layers and / It is obvious that no. These terms are only used to distinguish one member, component, region, layer or section from another region, layer or section. Thus, a first member, component, region, layer or section described below may refer to a second member, component, region, layer or section without departing from the teachings of the present invention.

Also, relative terms such as "top" or "above" and "under" or "below" can be used herein to describe the relationship of certain elements to other elements as illustrated in the Figures. Relative terms are intended to include different orientations of the device in addition to those depicted in the Figures. For example, if the element is inverted in the figures, the elements depicted as being on the upper surface of the other elements will have a direction on the lower surface of the other elements. Thus, the example "top" may include both "under" and "top" directions depending on the particular orientation of the figure. If the elements are oriented in different directions (rotated 90 degrees with respect to the other direction), the relative descriptions used herein can be interpreted accordingly.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms "a," "an," and "the" include singular forms unless the context clearly dictates otherwise. Also, " comprise "and / or" comprising "when used herein should be interpreted as specifying the presence of stated shapes, numbers, steps, operations, elements, elements, and / And does not preclude the presence or addition of one or more other features, integers, operations, elements, elements, and / or groups.

Hereinafter, embodiments of the present invention will be described with reference to the drawings schematically showing ideal embodiments of the present invention. In the figures, for example, variations in the shape shown may be expected, depending on manufacturing techniques and / or tolerances. Accordingly, the embodiments of the present invention should not be construed as limited to the particular shapes of the regions shown herein, but should include, for example, changes in shape resulting from manufacturing.

1 is a cross-sectional view illustrating a light emitting device package 100 according to some embodiments of the present invention.

FIGS. 2 to 8 are cross-sectional views illustrating steps of fabricating the light emitting device package 100 according to some embodiments of the present invention.

1, a substrate 100 for a light emitting device according to some embodiments of the present invention includes a substrate 10, a cup trench 11, a wiring layer 20, a filler 50 ), A deforming portion (13), and a clearance groove portion (70).

Here, as shown in FIG. 1, the substrate 10 may be made of a material having a suitable mechanical strength and insulation and a conductive material so as to support the light emitting device 30.

For example, the substrate 10 may be a metal substrate such as an insulated aluminum, copper, zinc, tin, lead, gold, silver, etc., and metal substrates in the form of a plate or a lead frame may be applied .

In addition, the substrate 10 may be a printed circuit board (PCB) having a plurality of epoxy resin sheets formed thereon. The substrate 10 may be a Flexible Printed Circuit Board (FPCB) made of a flexible material.

The substrate 10 may be a synthetic resin substrate such as resin or glass epoxy, or a ceramic substrate in consideration of thermal conductivity.

More specifically, the substrate 10 may be a bar-type metal substrate containing a relatively inexpensive material such as aluminum, iron, or copper, and the surface of the substrate 10 may be subjected to various oxidation processes Various insulating layers 12 can be formed.

In addition, the substrate 10 may be made of at least one selected from EMC (Epoxy Mold Compound), PI (polyimide), ceramic, graphene, glass synthetic fiber and combinations thereof in order to improve workability have.

1, the cup trench 11 is formed on one surface 10-1 of the substrate 10 so that at least one of the light emitting devices 30 can be seated therein, And may be a portion formed concavely by a punch press (PP).

In addition, the cup portion 11 may have an inclined surface 11a formed therein. For this, a protruding portion corresponding to the shape of the cup groove portion 11 may be formed in the punch press PP shown in FIG. 4, and the protruded portion may be provided with a slope surface 11a corresponding to the slope surface 11a of the cup groove portion 11, Can be formed.

1, the wiring layer 20 is formed on one surface 10-1 of the substrate 10 so as to be electrically connected to the light emitting device 30, And may include a copper or aluminum component.

1, the wiring layer 20 may be a conductive sheet extending from one side of the substrate 10 to the inner surface of the cup groove 11 and containing copper or an aluminum component.

The wiring layer 20 may be separated from the bottom of the cup groove 11 by an electrode separation line and an insulating layer 12 may be provided between the substrate 10 and the wiring layer 20.

1, a thermosetting adhesive layer 21 for bonding the wiring layer 20 and the substrate 10 to each other by hot pressing is provided between the wiring layer 20 and the substrate 10 .

The thermosetting adhesive layer 21 is provided on the rear surface of the sheet-shaped wiring layer 20 and can be thermally adhered to the substrate 10 by the pressing force of the hot press.

Here, the thermosetting adhesive layer 21 may be a prepreg adhesive layer. In addition, the thermosetting adhesive layer 21 may be formed of a composite material such as a polyester amide copolymer, glass, carbon, carbon fiber, paper or the like, polyvinyl acetate, polyamide, polycarbonate, polyacetal, polyphenylene oxide, Polyether sulfone, polyether ether ketone, polyether ketone ketone, polyaramid, polybenzimidazole, polyethylene polypropylene, polyamide, polyamide, polyamide, , Cellulose acetate, cellulose butyrate, and the like.

In addition, a plurality of the light emitting devices 30 may be electrically connected to the wiring layer 20 by being seated in the cup trench 11.

The light emitting device 30 may be seated in the cup groove 11 of the substrate 10. A plurality of light emitting devices 30 may be mounted on the substrate 10, Only the light emitting devices 30 may be mounted.

The light emitting device 30 may be formed of a semiconductor. For example, LEDs of blue, green, red, and yellow light emission, and LEDs of ultraviolet light emission, which are made of a nitride semiconductor, can be applied. The nitride semiconductor is represented by a general formula Al _x Ga _y In _z N (0? X? 1, 0? Y? 1, 0? Z? 1, x + y + z = 1).

The nitride semiconductor such as InN, AlN, InGaN, AlGaN, or InGaAlN is epitaxially grown on a sapphire substrate for growth or a silicon carbide substrate by a vapor phase growth method such as MOCVD To grow. In addition to the nitride semiconductor, the light emitting element 30 can be formed using semiconductors such as ZnO, ZnS, ZnSe, SiC, GaP, GaAlAs, and AlInGaP. These semiconductors can be stacked in the order of an n-type semiconductor layer, a light emitting layer, and a p-type semiconductor layer. The light emitting layer (active layer) may be a laminated semiconductor having a multiple quantum well structure or a single quantum well structure or a laminated semiconductor having a double hetero structure. Further, the light emitting device 30 can be selected to have an arbitrary wavelength depending on applications such as display use and illumination use.

Here, as the growth substrate, an insulating, conductive or semiconductor substrate may be used if necessary. For example, the growth substrate may be sapphire, SiC, Si, MgAl ₂ O ₄ , MgO, LiAlO ₂ , LiGaO ₂ , GaN. A GaN substrate, which is a homogeneous substrate, is preferable for epitaxial growth of a GaN material, but a GaN substrate has a problem of high production cost due to its difficulty in manufacturing.

Sapphire and silicon carbide (SiC) substrates are mainly used as the different substrates. Sapphire substrates are more utilized than expensive silicon carbide substrates. When using a heterogeneous substrate, defects such as dislocation are increased due to the difference in lattice constant between the substrate material and the thin film material. Also, due to the difference in the thermal expansion coefficient between the substrate material and the thin film material, warping occurs at a temperature change, and warping causes a crack in the thin film. This problem may be reduced by using a buffer layer between the substrate and the GaN-based light emitting laminate.

In addition, the substrate for growth may be completely or partially removed or patterned in order to improve the optical or electrical characteristics of the LED chip before or after the growth of the LED structure.

For example, in the case of a sapphire substrate, the substrate can be separated by irradiating the laser to the interface with the semiconductor layer through the substrate, and the silicon or silicon carbide substrate can be removed by a method such as polishing / etching.

Another supporting substrate may be used for removing the growth substrate. In order to improve the light efficiency of the LED chip on the opposite side of the growth substrate, the supporting substrate may be bonded using a reflective metal, As shown in FIG.

In addition, patterning of the growth substrate improves the light extraction efficiency by forming irregularities or slopes before or after the LED structure growth on the main surface (front surface or both sides) or side surfaces of the substrate. The size of the pattern can be selected from the range of 5 nm to 500 μm and it is possible to make a structure for improving the light extraction efficiency with a rule or an irregular pattern. Various shapes such as a shape, a column, a mountain, a hemisphere, and a polygon can be adopted.

In the case of the sapphire substrate, the crystals having a hexagonal-rhombo-cubic (Hexa-Rhombo R3c) symmetry have lattice constants of 13.001 and 4.758 in the c-axis direction and the a-axis direction, respectively, and have C plane, A plane and R plane. In this case, the C-plane is relatively easy to grow the nitride film, and is stable at high temperature, and thus is mainly used as a substrate for nitride growth.

Another material of the growth substrate is a Si substrate, which is more suitable for large-scale curing and relatively low in cost, so that mass productivity can be improved.

In addition, since the silicon (Si) substrate absorbs light generated from the GaN-based semiconductor and the external quantum efficiency of the light emitting device is lowered, the substrate may be removed as necessary, and Si, Ge, SiAl, A support substrate such as a metal substrate is further formed and used.

When a GaN thin film is grown on a different substrate such as the Si substrate, the dislocation density increases due to the lattice constant mismatch between the substrate material and the thin film material, and cracks and warpage Lt; / RTI > The buffer layer may be disposed between the growth substrate and the light emitting stack for the purpose of preventing dislocation and cracking of the light emitting stack. The buffer layer also functions to reduce the scattering of the wavelength of the wafer by adjusting the degree of warping of the substrate during the growth of the active layer.

Here, the buffer layer may be made of Al _x In _y Ga _1-xy N (0? X? 1, 0? _Y? 1, x + y? 1), in particular GaN, AlN, AlGaN, InGaN or InGaNAlN. Materials such as ZrB ₂ , HfB ₂ , ZrN, HfN and TiN may be used as needed. Further, a plurality of layers may be combined, or the composition may be gradually changed.

Although not shown, the light emitting device 30 may be a flip chip type light emitting device having a signal transmitting medium such as a bump, a pad, or a solder. In addition, the light emitting device 30 may be a vertical type or a horizontal type And the like can be applied.

The filling material 50 may be a fluorescent material, a translucent sealing material, or a mixture thereof, which is disposed in the light path of the light emitting device 30 and is filled in the cup groove part 11. [

Here, the phosphor may have the following composition formula and color.

Oxide system: yellow and green Y ₃ Al ₅ O ₁₂ : Ce, Tb ₃ Al ₅ O ₁₂ : Ce, Lu ₃ Al ₅ O ₁₂ : Ce

(Ba, Sr) ₂ SiO ₄ : Eu, yellow and orange (Ba, Sr) ₃ SiO ₅ : Ce

The nitride-based: the green β-SiAlON: Eu, yellow _{L 3 Si 6 O 11: Ce} , orange-colored α-SiAlON: Eu, red _{CaAlSiN 3: Eu, Sr 2 Si} 5 N 8: Eu, SrSiAl 4 N 7: Eu

The composition of the phosphor should basically correspond to stoichiometry, and each element may be substituted with another element in each group on the periodic table. For example, Sr can be substituted with Ba, Ca, Mg, etc. of the alkaline earth (II) group, and Y can be replaced with lanthanum series of Tb, Lu, Sc, Gd and the like. Ce, Tb, Pr, Er, Yb and the like, and the active agent may be used alone or as a negative active agent for the characteristic modification.

As a substitute for the phosphor, materials such as a quantum dot may be used. Alternatively, a fluorescent material and QD may be mixed with the LED or used alone.

QD can be composed of a core (3 to 10 nm) such as CdSe and InP, a shell (0.5 to 2 nm) such as ZnS and ZnSe, and a ligand for stabilizing the core and the shell. Can be implemented.

In addition, the coating method of the fluorescent material or the quantum dot may include at least one of a method of being applied to an LED chip or a light emitting device, a method of covering the material in a film form, a method of attaching a sheet form such as a film or a ceramic fluorescent material .

Dispensing and spray coating are common methods of spraying, and dispensing includes mechanical methods such as pneumatic method and screw, linear type. It is also possible to control the amount of dyeing through a small amount of jetting by means of a jetting method and control the color coordinates thereof. The method of collectively applying the phosphor on the wafer level or the light emitting device substrate by the spray method can easily control productivity and thickness.

The method of directly covering the light emitting device or the LED chip in a film form can be applied by a method of electrophoresis, screen printing or phosphor molding, and the method can be different according to necessity of application of the side of the LED chip.

In order to control the efficiency of the long-wavelength light-emitting phosphor that reabsers light emitted from a short wavelength among two or more kinds of phosphors having different emission wavelengths, two or more kinds of phosphor layers having different emission wavelengths can be distinguished. A DBR (ODR) layer may be included between each layer to minimize absorption and interference.

In order to form a uniform coating film, the phosphor may be formed into a film or ceramic form and then attached onto the LED chip or the light emitting device.

In order to make a difference in light efficiency and light distribution characteristics, a photoelectric conversion material may be located in a remote format. In this case, the photoelectric conversion material is located together with a transparent polymer, glass, or the like depending on its durability and heat resistance.

Since the phosphor coating technique plays a major role in determining the optical characteristics in the light emitting device, control techniques such as the thickness of the phosphor coating layer and the uniform dispersion of the phosphor have been studied variously. QD can also be placed in the LED chip or the light emitting element in the same manner as the phosphor, and can be positioned between the glass or translucent polymer material for light conversion.

The translucent encapsulant may be at least one selected from the group consisting of EMC, an epoxy resin composition, a silicone resin composition, a modified epoxy resin composition, a modified silicone resin composition, a polyimide resin composition, a modified polyimide resin composition, a polyphthalamide (PPA), a polycarbonate resin, At least one of phenylene sulfide (PPS), liquid crystal polymer (LCP), ABS resin, phenol resin, acrylic resin, PBT resin, bragg reflection layer, air gap, total reflection layer, metal layer, As shown in FIG.

The transparent encapsulant may be applied to the cup trench 11 in the form of a paste or may be laminated using a separate lamination process or by pressing the sheet material.

1, a light emitting device package 100 according to some embodiments of the present invention includes a reflective layer 40 provided on an upper surface of the wiring layer 20 provided on the inclined surface 11a, And an insulating protective layer 60 provided on the surface of the substrate 10 or the wiring layer 20 except for the filler 50. [

Here, the reflective layer 40 may be formed of at least one selected from the group consisting of at least silver, platinum, gold, mercury, chromium, and combinations thereof having high reflectance so as to reflect light emitted from the light emitting device 30 upward And the like.

The reflective layer 40 may be at least one selected from the group consisting of EMC, an epoxy resin composition, a silicone resin composition, a modified epoxy resin composition, a modified silicone resin composition, a polyimide resin composition, a modified polyimide resin composition, a polyphthalamide (PPA) Resin, polyphenylene sulfide (PPS), liquid crystal polymer (LCP), ABS resin, phenol resin, acrylic resin, PBT resin, bragg reflection layer, air gap, total reflection layer, metal layer and combinations thereof It can be done by selecting one or more.

Therefore, the reflective layer 40 can be made as thin as possible in order to reflect light upward, and can protect the oxidation or deformation of the wiring layer 20 in addition to the function of reflecting light.

The insulating protective layer 60 may be provided on the surface of the wiring layer 20 to protect oxidation and deformation of the wiring layer 20 and protect the wiring layer 20 from external impacts.

The insulating protective layer 60 may be made of at least one of EMC, EMC including at least a reflective material, white silicon containing a reflective material, a photoimageable solder resist (PSR), and combinations thereof.

More specifically, for example, the insulating protective layer 60 may be formed of a modified silicone resin composition such as an epoxy resin composition, a silicone resin composition, a modified epoxy resin composition such as a silicone modified epoxy resin, an epoxy modified silicone resin, A resin such as polyimide resin composition, modified polyimide resin composition, polyphthalamide (PPA), polycarbonate resin, polyphenylene sulfide (PPS), liquid crystal polymer (LCP), ABS resin, phenol resin, acrylic resin, PBT resin Etc. may be applied.

Further, a light reflecting material such as titanium oxide, silicon dioxide, titanium dioxide, zirconium dioxide, potassium titanate, alumina, aluminum nitride, boron nitride, mullite, chromium, have.

Therefore, as described above, according to the present invention, the cup trench 11 is formed of the punch press PP on the substrate 10 made of a metal to greatly simplify the structure and the process, thereby lowering the product cost and reducing the thickness High power is possible, durability is excellent, and heat radiation characteristic and optical characteristic can be greatly improved

1, when the punch press presses the cup groove portion 11, a part of the other surface 10-2 of the substrate 10 is deformed and protruded, .

The punch press PP presses the cup groove 11 in the cup groove 11 so as to accommodate the deformed portion 13 of the substrate 10 when the punch press PP presses the cup groove 11. [ (10-2) of the substrate (10).

4, the clearance groove portion 70 is formed on the opposite side of the cup groove portion 11 of the substrate 10 on the pressing axis PL of the punch press PP .

The allowance groove portion 70 may vary depending on the size and material of the substrate 10, the processing environment, the shape of the cup groove portion 11, the pressing force and shape of the punch press PP, The allowance volume entered from the other side of the substrate 10 may be 50 to 80 percent of the recessed volume of the cup groove 11 in order to sufficiently accommodate the deformed portion 13 of the substrate 10. [

The thicker the thickness of the substrate 10, the deeper the depth of the clearance groove 70 or the width of the clearance groove 70 can be.

2 to 8, a manufacturing process of the light emitting device package 100 according to some embodiments of the present invention will be described. First, as shown in FIG. 2, A wiring layer 20 of a conductive material may be provided on one surface 10-1 of the substrate 10-1.

At this time, a thermosetting adhesive layer 21 provided between the wiring layer 20 and the substrate 10 contacts the wiring layer 20 and the substrate 10 so as to bond the wiring layer 20 and the substrate 10 to each other, Can be pressed by a hot press.

3, the margin portion 70 may be formed on the other surface 10-2 of the substrate 10 so as to accommodate the deformed portion 13 of the substrate 10. As shown in FIG.

At this time, in order to form the clearance groove portion 70 so as to accommodate the deformed portion 13 of the substrate 10 on the other surface 10-2 of the substrate 10, The substrate 10 can be etched.

4 and 5, the punch press (PP) is used to hold the deformation portion 13 of the substrate 10, The cup-shaped cup-shaped groove 11 is concavely formed on one surface and the substrate 10 and the wiring layer 20 are punched simultaneously at the same time so that the wiring layer 20 can extend into the cup- It can be processed by press (PP).

6, a reflective layer 40 may be formed on a part of the wiring layer 20 in the cup trench 11 by a plating method.

7, the light emitting element 30 is placed on the wiring layer 20 inside the cup groove portion 11, and the wiring layer 20 and the light emitting element 30 are connected to each other using a bump, solder, (30) can be electrically connected.

Next, as shown in FIG. 8, the cup 50 may be filled with the filler 50 so as to cover the light emitting device 30.

Meanwhile, as shown in FIG. 3, the margin portion 71 may have an angled cross section of a groove surface.

9 is a cross-sectional view illustrating a light emitting device package 200 according to some other embodiments of the present invention.

As shown in Fig. 9, the margin portion 72 may have a concave rounded cross-section of the groove surface.

In addition, the cross-sectional shape of the clearance groove portion 72 may be formed in various shapes for accommodating the deformed portion 13 of the substrate 10 such as a triangular shape, a polygonal shape, or a convexly rounded shape. It is not limited to the drawings.

10 is a cross-sectional view illustrating a light emitting device package 300 according to still another embodiment of the present invention.

As shown in FIG. 10, a plurality of the clearance groove portions 73 may be formed on the opposite side of the cup groove portion 11 of the substrate 10. The plurality of spare trenches 73 may serve to relieve the impact of the substrate 10 by accommodating the deformed portions 13 of the substrate 10 in stages.

FIGS. 11 to 13 are cross-sectional views illustrating steps of fabricating a light emitting device package 400 according to still another embodiment of the present invention.

11 to 13, the light emitting device package 400 according to still another embodiment of the present invention is formed by the punch press PP at the edge of the cup groove part 11, (90) having a contact height (H1) so as to be in contact with an edge of the cup side wall portion (80).

11 to 13, a manufacturing process of the light emitting device package 400 according to still another embodiment of the present invention will be described. First, as shown in FIG. 11, A wiring layer 20 of a conductive material is provided on one surface 10-1 of the substrate 10 and a deformation portion 13 of the substrate 10 is received on the other surface 10-2 of the substrate 10. [ The extra trench portion 70 can be formed.

12, the clearance groove 70 is recessed on one surface of the substrate 10 by using a punch press PP so as to accommodate the deformed portion 13 of the substrate 10, The cup-shaped cup-shaped groove portion 11 can be formed.

11, the punch press PP has a projection PPa corresponding to the cup sidewall portion 90. The protrusion PPa corresponds to the edge of the lens 80 in the rim of the cup groove portion 11, A cup side wall portion 90 having a contact height H1 may be formed.

13, when the lens material is coated so as to cover the light emitting device 30, the lens material is guided upward due to the height H1 of the cup side wall portion 90, The thickness of the lens 80 can be thickened, the flow of the lens material can be smoothly induced, and the lens 80 can be more firmly fixed.

14 is a cross-sectional view illustrating a light emitting device package 500 according to still another embodiment of the present invention.

14, a light emitting device package 500 according to still another embodiment of the present invention connects LEDs in the form of a lateral chip instead of flip chip LEDs with each other with a wire WR , The LED can be sealed with an encapsulating material. In addition, various types of LEDs such as a vertical type can be applied.

15 is a flow chart showing a method of manufacturing a light emitting device package 100 according to some embodiments of the present invention.

1 to 15, a method of manufacturing a light emitting device package 100 according to some embodiments of the present invention includes the steps of: (1) forming a wiring layer of a conductive material on a surface 10-1 of a substrate 10 A margin trench 70 is formed on the other surface 10-2 of the substrate 10 so as to accommodate the deformed portion 13 of the substrate 10 And then the concave portion 70 is recessed on one surface of the substrate 10 by using a punch press PP so as to accommodate the deformation portion 13 of the substrate 10, (S4) of forming a cup-shaped groove portion (11) of the cup-shaped groove portion (11) and then providing a reflective layer (40) on a part of the wiring layer (20) (S5) placing the light emitting element (30) on the wiring layer (20) inside the wiring layer (20) and electrically connecting the wiring layer (20) to the light emitting element (30).

The step S2 of forming the margin portion 70 to accommodate the deformed portion 13 of the substrate 10 on the other surface of the substrate 10 may be performed by cutting the substrate 10, (10).

On the other hand, although not shown, the present invention can include a backlight unit including the above-described light emitting device packages and a lighting device. Here, the backlight unit according to some embodiments of the present invention may further include a light guide plate installed in the optical path of the light emitting device 30, and the components of the backlight unit and the illumination device may be the same as those of the above- The structure and the role of the light emitting device package can be the same as those of the light emitting device package. Therefore, detailed description is omitted.

The backlight unit of the present invention is installed in a display panel such as an LCD panel and projects light in the direction of the display panel. The light guide plate is installed in a path of light generated from the light emitting device 30, It is possible to transmit light generated by the light source 30 to a wider area.

The light guide plate may be made of polycarbonate, polysulfone, polyacrylate, polystyrene, polyvinyl chloride, polyvinyl alcohol, polynorbornene, polyester, or the like. A translucent resin-based material can be applied. Further, the light guide plate may be formed by various methods such as forming fine patterns, fine protrusions, diffusion films, or the like on the surface, or forming fine bubbles therein. Although not shown in the drawings, the backlight unit of the present invention may further include various lenses, diffusion sheets, prism sheets, filters, and the like.

The backlight unit according to some embodiments of the present invention may be a direct-type backlight unit in which the light-emitting device 30 is installed below the light guide plate, or the edge-type backlight unit in which the light- .

While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the invention. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.

10: substrate
11: cup groove
11a:
12: Insulation layer
13:
20: wiring layer
21: thermosetting adhesive layer
30: Light emitting element
40: reflective layer
50: packing
60: Insulating protective layer
70, 71, 72, 73:
PP: Punch press
PPa: protrusion
90: cup side wall portion
H1; Height
100, 200, 300, 400, 500: Light emitting device package

Claims (10)

Board;
A cup-shaped cup-shaped groove formed on one surface of the substrate so as to be recessed by a punch press so that at least one light-emitting element can be seated therein;
A wiring layer extending from one surface of the substrate to the inner surface of the cup-shaped portion so as to be electrically connected to the light-emitting element, the wiring layer including copper or an aluminum component;
A deformed portion formed on the other surface of the substrate so as to protrude when the punch press presses the cup portion;
A filler disposed in a light path of the light emitting device and filled in the cup groove; And
A cup side wall portion formed at the rim of the cup portion by the punch press and having a contact height to be in contact with an edge of the filling material;
Lt; / RTI >
Wherein the cup groove portion and the cup side wall portion are formed at the same time when the punch press is pressed,
The height of the filling material from the bottom of the cup space to the top of the filling material is increased by guiding the filling material upward due to the contact height of the cup side wall part,
And the contact area of the filler is increased by the contact of the edge of the filler to the cup side wall portion, so that the filler is further fixed to the substrate. The method according to claim 1,
Wherein the deforming portion is accommodated by an allowance groove portion formed on the other surface of the substrate corresponding to the deformed portion,
Wherein the clearance groove portion is formed on a pressing axis line of the punch press on a side opposite to the cup portion of the substrate. 3. The method of claim 2,
Wherein the allowance groove portion has an allowance volume of 50 to 80 percent of the recessed volume of the cup portion, and the cross-section of the groove surface has an angular shape or a concave round shape. 3. The method of claim 2,
Wherein a plurality of the clearance groove portions are formed on the opposite surface of the cup portion of the substrate. delete The method according to claim 1,
The wiring layer is separated from the bottom surface of the cup portion,
Wherein the substrate is a metal substrate comprising aluminum or an iron component,
An insulating layer is provided between the substrate and the wiring layer,
A thermosetting adhesive layer for bonding the wiring layer and the substrate to each other is provided between the wiring layer and the substrate by hot pressing,
Wherein the cup portion has an inclined surface formed therein,
And a reflective layer provided on an upper surface of the wiring layer provided on the inclined surface,
Wherein the reflective layer is a plating layer containing a component selected from at least one of silver, platinum, gold, mercury, chromium, and combinations thereof,
The filler is selected from at least one of a phosphor, a light-transmitting encapsulant, a lens layer, and a combination thereof.
And an insulating protective layer provided on a surface of the substrate or wiring layer excluding the filling material. Board;
A cup-shaped cup-shaped groove formed on one surface of the substrate so as to be recessed by a punch press so that at least one light-emitting element can be seated therein;
A wiring layer extending from one surface of the substrate to the inner surface of the cup-shaped portion so as to be electrically connected to the light-emitting element, the wiring layer including copper or an aluminum component;
A deformed portion formed on the other surface of the substrate so as to protrude when the punch press presses the cup portion;
A filler disposed in a light path of the light emitting device and filled in the cup groove;
A cup side wall portion formed at the rim of the cup portion by the punch press and having a contact height to be in contact with an edge of the filling material; And
A light guide plate installed in an optical path of the light emitting element;
/ RTI >
Wherein the cup groove portion and the cup side wall portion are formed at the same time when the punch press is pressed,
The height of the filling material from the bottom of the cup space to the top of the filling material is increased by guiding the filling material upward due to the contact height of the cup side wall part,
The contact area of the filler is increased by the contact of the edge of the filler to the cup side wall portion, so that the filler is further fixed to the substrate. Board;
A cup-shaped cup-shaped groove formed on one surface of the substrate so as to be recessed by a punch press so that at least one light-emitting element can be seated therein;
A wiring layer extending from one surface of the substrate to the inner surface of the cup-shaped portion so as to be electrically connected to the light-emitting element, the wiring layer including copper or an aluminum component;
A deformed portion formed on the other surface of the substrate so as to protrude when the punch press presses the cup portion;
A filler disposed in a light path of the light emitting device and filled in the cup groove; And
A cup side wall portion formed at the rim of the cup portion by the punch press and having a contact height to be in contact with an edge of the filling material;
Lt; / RTI >
Wherein the cup groove portion and the cup side wall portion are formed at the same time when the punch press is pressed,
The height of the filling material from the bottom of the cup space to the top of the filling material is increased by guiding the filling material upward due to the contact height of the cup side wall part,
The contact area of the filler is increased by the contact of the edge of the filler to the cup side wall portion, so that the filler is further fixed to the substrate. Providing a wiring layer of a conductive material on one surface of a substrate;
Forming a clearance groove on the other surface of the substrate so as to accommodate the deformed portion of the substrate;
Forming a cup-shaped cup portion concave on one surface of the substrate by using a punch press so that the clearance groove can accommodate the deformed portion of the substrate;
Providing a reflective layer on a portion of the wiring layer inside the cup groove portion;
Placing a light emitting element on the wiring layer inside the cup groove portion to electrically connect the wiring layer and the light emitting element; And
Forming a filler filling the cup space;
Lt; / RTI >
The step of forming the cup portion includes forming a cup side wall portion formed by the punch press at an edge of the cup portion and having a contact height so as to be in contact with an edge of the filler,
Wherein the cup groove portion and the cup side wall portion are formed at the same time when the punch press is pressed,
The height of the filling material from the bottom of the cup space to the top of the filling material is increased by guiding the filling material upward due to the contact height of the cup side wall part,
Wherein a contact area of the filler is increased by contacting the edge of the filler to the cup sidewall portion, thereby fixing the filler to the substrate. 10. The method of claim 9,
Wherein the step of forming the clearance groove portion to accommodate the deformed portion of the substrate on the other surface of the substrate comprises cutting the substrate or etching the substrate.

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