KR101544126B1 - Light emitting device package module, multi-backlight unit and display apparatus - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting device package module, a multi-backlight unit and a display device which can be used for display or illumination, A first light emitting device provided on the substrate and having a light emitting surface oriented in a first direction with respect to the substrate, the plurality of light emitting devices arranged in a longitudinal direction of the substrate; And a second light emitting device provided on the substrate and having a light emitting surface oriented in a second direction with respect to the substrate, and a plurality of heat emitting elements arranged in a longitudinal direction of the substrate.

Description

[0001] The present invention relates to a light emitting device package module, a multi-backlight unit, and a display device,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting device package module, a multi-backlight unit and a display device, and more particularly, to a light emitting device package module, a multi-backlight unit and a display device.

A light emitting diode (LED) is a kind of semiconductor device that can emit light of various colors by forming a light emitting source through the formation of a PN diode of a compound semiconductor. Such a light emitting device has a long lifetime, can be reduced in size and weight, and can be driven at a low voltage. In addition, these LEDs are resistant to shock and vibration, do not require preheating time and complicated driving, can be packaged after being mounted on a substrate or lead frame in various forms, so that they can be modularized for various purposes and used as a backlight unit A lighting device, and the like.

However, when a conventional display apparatus and a lighting apparatus are installed together on a conventional street billboard or a display board, a backlight unit is used in a conventional display apparatus. In the conventional lighting apparatus, diffusion sheets are installed separately, There was a problem.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems and it is an object of the present invention to provide a backlight unit and a diffusion sheet simultaneously by mounting light emitting devices having different directivity angles on a single substrate, A light emitting device package module, and a multi-backlight unit and a display device. However, these problems are exemplary and do not limit the scope of the present invention.

According to an aspect of the present invention, there is provided a light emitting device package module including: a substrate; A first light emitting device provided on the substrate and having a light emitting surface oriented in a first direction with respect to the substrate, the plurality of light emitting devices arranged in a longitudinal direction of the substrate; And a second light emitting device provided on the substrate and having a light emitting surface oriented in a second direction with respect to the substrate, and a plurality of heat emitting elements arranged in a longitudinal direction of the substrate.

According to an aspect of the present invention, the first light emitting device is an LED having a light emitting surface toward one side of the substrate, and the second light emitting device includes an LED having a light emitting surface facing upward from the substrate, Lt; / RTI >

According to an aspect of the present invention, the first light emitting device may include a side-view type LED having a light output surface facing a light guide plate (LGP) provided at one side of the substrate, .

According to an aspect of the present invention, the second light emitting device may include a top-view type LED in which a light emitting surface is formed toward a diffuser sheet provided on the other side of the substrate. have.

According to an aspect of the present invention, there is provided a multi-backlight unit comprising: a substrate having a long length in a longitudinal direction; A first light emitting device provided on the substrate and having a light emitting surface oriented in a first direction with respect to the substrate, the plurality of light emitting devices arranged in a longitudinal direction of the substrate; A second light emitting device provided on the substrate and having a light emitting surface oriented in a second direction with respect to the substrate, the plurality of light emitting devices arranged in a longitudinal direction of the substrate; A light guide plate installed in an optical path of the first light emitting device; And a diffusion sheet installed in an optical path of the second light emitting device.

According to an aspect of the present invention, the light guide plate is an edge light-guiding plate in which the first light emitting element is provided at an edge portion, and the diffusion sheet is a direct diffusion sheet have.

According to an aspect of the present invention, there is provided a display device comprising: a substrate formed to be long in a longitudinal direction; A first light emitting device provided on the substrate and having a light emitting surface oriented in a first direction with respect to the substrate, the plurality of light emitting devices arranged in a longitudinal direction of the substrate; A second light emitting device provided on the substrate and having a light emitting surface oriented in a second direction with respect to the substrate, the plurality of light emitting devices arranged in a longitudinal direction of the substrate; A light guide plate installed in an optical path of the first light emitting device; A display panel installed in an optical path of the light guide plate; A diffusion sheet provided in an optical path of the second light emitting device; And a display panel installed in an optical path of the diffusion sheet.

According to some embodiments of the present invention as described above, light emitting devices having different directivity angles may be mounted on a single substrate to provide a simultaneous light source to the backlight unit and the diffusion sheet, thereby saving parts and space And it has the effect of increasing the productivity, lowering the unit price of the product, and giving the consumer aesthetic curiosity and esthetics. Of course, the scope of the present invention is not limited by these effects.

1 is a perspective view of a light emitting device package module according to some embodiments of the present invention.
FIG. 2 is an enlarged perspective view of the light emitting device package module of FIG. 1. FIG.
3 is an enlarged cross-sectional view of the light emitting device package module of FIG.
4 is a plan view showing a light emitting device package module according to some other embodiments of the present invention.
5 is a plan view illustrating a light emitting device package module according to still another embodiment of the present invention.
6 is a plan view illustrating a light emitting device package module according to still another embodiment of the present invention.
7 is a perspective view showing a display device according to some embodiments of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

The embodiments of the present invention are described in order to more fully explain the present invention to those skilled in the art, and the following embodiments may be modified in various other forms, The present invention is not limited to the embodiment. Rather, these embodiments are provided so that this disclosure will be more thorough and complete, and will fully convey the concept of the invention to those skilled in the art. In the drawings, the thickness and size of each layer are exaggerated for convenience and clarity of explanation.

It is to be understood that throughout the specification, when an element such as a film, region or substrate is referred to as being "on", "connected to", "laminated" or "coupled to" another element, It will be appreciated that elements may be directly "on", "connected", "laminated" or "coupled" to another element, or there may be other elements intervening therebetween. On the other hand, when one element is referred to as being "directly on", "directly connected", or "directly coupled" to another element, it is interpreted that there are no other components intervening therebetween do. Like numbers refer to like elements. As used herein, the term "and / or" includes any and all combinations of one or more of the listed items.

Although the terms first, second, etc. are used herein to describe various elements, components, regions, layers and / or portions, these members, components, regions, layers and / It is obvious that no. These terms are only used to distinguish one member, component, region, layer or section from another region, layer or section. Thus, a first member, component, region, layer or section described below may refer to a second member, component, region, layer or section without departing from the teachings of the present invention.

Also, relative terms such as "top" or "above" and "under" or "below" can be used herein to describe the relationship of certain elements to other elements as illustrated in the Figures. Relative terms are intended to include different orientations of the device in addition to those depicted in the Figures. For example, if the element is inverted in the figures, the elements depicted as being on the upper surface of the other elements will have a direction on the lower surface of the other elements. Thus, the example "top" may include both "under" and "top" directions depending on the particular orientation of the figure. If the elements are oriented in different directions (rotated 90 degrees with respect to the other direction), the relative descriptions used herein can be interpreted accordingly.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms "a," "an," and "the" include singular forms unless the context clearly dictates otherwise. Also, " comprise "and / or" comprising "when used herein should be interpreted as specifying the presence of stated shapes, numbers, steps, operations, elements, elements, and / And does not preclude the presence or addition of one or more other features, integers, operations, elements, elements, and / or groups.

Hereinafter, embodiments of the present invention will be described with reference to the drawings schematically showing ideal embodiments of the present invention. In the figures, for example, variations in the shape shown may be expected, depending on manufacturing techniques and / or tolerances. Accordingly, the embodiments of the present invention should not be construed as limited to the particular shapes of the regions shown herein, but should include, for example, changes in shape resulting from manufacturing.

1 is a perspective view of a light emitting device package module 100 according to some embodiments of the present invention. FIG. 2 is an enlarged perspective view of the light emitting device package module 100 of FIG. 1. FIG. 3 is an enlarged cross-sectional view of the light emitting device package module 100 of FIG.

1 to 3, a light emitting device package module 100 according to some embodiments of the present invention includes a substrate 10, first and second light emitting devices 11 and 11, (12).

Here, the substrate 10 may be a structure having a long and thin bar shape in the longitudinal direction.

1 to 3, the substrate 10 may have appropriate mechanical strength and insulation properties to support a plurality of the first light emitting devices 11 and the second light emitting devices 12 Or may be made of a conductive material.

More specifically, for example, the substrate 10 may be a printed circuit board (PCB) having a plurality of epoxy resin sheets formed thereon. The substrate 10 may be a Flexible Printed Circuit Board (FPCB) made of a flexible material.

In addition, the substrate 10 may be a synthetic resin substrate such as resin or glass epoxy, or a ceramic substrate in consideration of thermal conductivity.

In order to improve workability, the substrate 10 may be formed by partially or wholly selecting at least one of EMC (Epoxy Mold Compound), PI (polyimide), ceramic, graphene, glass synthetic fiber, Lt; / RTI >

In addition, the substrate 10 may include a lead frame having a first electrode on one side and a second electrode on the other side based on the electrode separation space.

For example, the substrate 10 may be an insulated metal substrate such as aluminum, copper, zinc, tin, lead, gold, or silver, and may be a plate or lead frame substrate.

1 to 3, the first light emitting device 11 is mounted on the substrate 10 and is disposed in a first direction (left direction in FIG. 3) with respect to the substrate 10, Emitting type LED (Light Emitting Diode) in which a plurality of heat-emitting LEDs (Light Emitting Diodes) are arranged in the longitudinal direction of the substrate 10.

The second light emitting device 12 is mounted on the substrate 10 in parallel with the first light emitting devices 11 and is arranged in the second direction 3), and a plurality of LEDs are arranged in the longitudinal direction of the substrate 10 to form a top emission type LED.

That is, the first light emitting device 11 may be an LED having a light emitting surface 11a formed on one side of the substrate 10, and the second light emitting device 12 may be an LED, The light emitting surface 12a may be formed to face upward.

The first light emitting device 11 includes a light emitting device package 11 including a light emitting device package 11 made of a reflective encapsulant having a light emitting surface 11a directed toward one side of the substrate 10, The LED may have a flip chip type directivity angle A1 of about 120 degrees.

The second light emitting device 12 includes a light emitting device package 12 made of a reflective encapsulant in which the light emitting surface 12a is directed upwardly of the substrate 10 and the terminals of the chip are formed downward, The LED may have a flip chip type directivity angle A1 of about 120 degrees.

The first light emitting device 11 and the second light emitting device 12 may be made of a semiconductor, as shown in FIGS. 1 to 3. For example, LEDs emitting blue, green, red, and yellow light, and LEDs emitting ultraviolet light or infrared light, which are made of a nitride semiconductor, can be applied. The nitride semiconductor is represented by a general formula Al _x Ga _y In _z N (0? X? 1, 0? Y? 1, 0? Z? 1, x + y + z = 1).

The first light emitting device 11 and the second light emitting device 12 may be formed on a sapphire substrate for growth or a silicon carbide substrate by vapor phase growth such as MOCVD using InN, AlN, InGaN , AlGaN, InGaAlN, and the like can be epitaxially grown. The first light emitting device 11 and the second light emitting device 12 may be formed using semiconductors such as ZnO, ZnS, ZnSe, SiC, GaP, GaAlAs, and AlInGaP in addition to the nitride semiconductor. These semiconductors can be stacked in the order of an n-type semiconductor layer, a light emitting layer, and a p-type semiconductor layer. The light emitting layer (active layer) may be a laminated semiconductor having a multiple quantum well structure or a single quantum well structure or a laminated semiconductor having a double hetero structure. In addition, the first light emitting device 11 and the second light emitting device 12 can be selected at arbitrary wavelengths depending on applications such as display use and illumination use.

Here, as the growth substrate, an insulating, conductive or semiconductor substrate may be used if necessary. For example, the growth substrate may be sapphire, SiC, Si, MgAl 2 O 4, MgO, LiAlO 2, LiGaO 2, GaN. A GaN substrate, which is a homogeneous substrate, is preferable for epitaxial growth of a GaN material, but a GaN substrate has a problem of high production cost due to its difficulty in manufacturing.

Sapphire and silicon carbide (SiC) substrates are mainly used as the different substrates. Sapphire substrates are more utilized than expensive silicon carbide substrates. When using a heterogeneous substrate, defects such as dislocation are increased due to the difference in lattice constant between the substrate material and the thin film material. Also, due to the difference in the thermal expansion coefficient between the substrate material and the thin film material, warping occurs at a temperature change, and warping causes a crack in the thin film. This problem may be reduced by using a buffer layer between the substrate and the GaN-based light emitting laminate.

In addition, the substrate for growth may be completely or partially removed or patterned in order to improve the optical or electrical characteristics of the LED chip before or after the growth of the LED structure.

For example, in the case of a sapphire substrate, the substrate can be separated by irradiating the laser to the interface with the semiconductor layer through the substrate, and the silicon or silicon carbide substrate can be removed by a method such as polishing / etching.

Another supporting substrate may be used for removing the growth substrate. In order to improve the light efficiency of the LED chip on the opposite side of the growth substrate, the supporting substrate may be bonded using a reflective metal, As shown in FIG.

In addition, patterning of the growth substrate improves the light extraction efficiency by forming irregularities or slopes before or after the LED structure growth on the main surface (front surface or both sides) or side surfaces of the substrate. The size of the pattern can be selected from the range of 5 nm to 500 μm and it is possible to make a structure for improving the light extraction efficiency with a rule or an irregular pattern. Various shapes such as a shape, a column, a mountain, a hemisphere, and a polygon can be adopted.

In the case of the sapphire substrate, the crystals having a hexagonal-rhombo-cubic (Hexa-Rhombo R3c) symmetry have lattice constants of 13.001 and 4.758 in the c-axis direction and the a-axis direction, respectively, and have C plane, A plane and R plane. In this case, the C-plane is relatively easy to grow the nitride film, and is stable at high temperature, and thus is mainly used as a substrate for nitride growth.

Another material of the growth substrate is a Si substrate, which is more suitable for large-scale curing and relatively low in cost, so that mass productivity can be improved.

In addition, since the silicon (Si) substrate absorbs light generated from the GaN-based semiconductor and the external quantum efficiency of the light emitting device is lowered, the substrate may be removed as necessary, and Si, Ge, SiAl, A support substrate such as a metal substrate is further formed and used.

When a GaN thin film is grown on a different substrate such as the Si substrate, the dislocation density increases due to the lattice constant mismatch between the substrate material and the thin film material, and cracks and warpage Lt; / RTI > The buffer layer may be disposed between the growth substrate and the light emitting stack for the purpose of preventing dislocation and cracking of the light emitting stack. The buffer layer also functions to reduce the scattering of the wavelength of the wafer by adjusting the degree of warping of the substrate during the growth of the active layer.

Here, the buffer layer may be made of Al _x In _y Ga _1-xy N (0? X? 1, 0? _Y? 1, x + y? 1), in particular GaN, AlN, AlGaN, InGaN or InGaNAlN. Materials such as ZrB2, HfB2, ZrN, HfN and TiN can also be used as needed. Further, a plurality of layers may be combined, or the composition may be gradually changed.

Although not shown, the first light emitting element 11 and the second light emitting element 12 may be in the form of a flip chip having a signal transmitting medium such as a bump, a pad, or a solder. In addition, A light emitting device in which a bonding wire is applied to both the first terminal and the second terminal such as a mold or a bonding wire is applied to only the first terminal or the second terminal may be all applied.

One or more of the first light emitting device 11 and the second light emitting device 12 may be provided on the substrate 10 or a plurality of the light emitting devices 11 may be provided on the substrate 10.

The light emitting surface 11a of the first light emitting device 11 and the light emitting surface 12a of the second light emitting device 12 may be provided with phosphors.

Here, the phosphor may have the following composition formula and color.

Oxide system: yellow and green Y3Al5O12: Ce, Tb3Al5O12: Ce, Lu3Al5O12: Ce

(Ba, Sr) 2SiO4: Eu, yellow and orange (Ba, Sr) 3SiO5: Ce

Eu, Sr2Si5N8: Eu, SrSiAl4N7: Eu, Eu3O3: Eu, Eu3O3: Eu,

The composition of the phosphor should basically correspond to stoichiometry, and each element may be substituted with another element in each group on the periodic table. For example, Sr can be substituted with Ba, Ca, Mg, etc. of the alkaline earth (II) group, and Y can be replaced with lanthanum series of Tb, Lu, Sc, Gd and the like. Ce, Tb, Pr, Er, Yb and the like, and the active agent may be used alone or as a negative active agent for the characteristic modification.

As a substitute for the phosphor, materials such as a quantum dot may be used. Alternatively, a fluorescent material and QD may be mixed with the LED or used alone.

QD can be composed of a core (3 to 10 nm) such as CdSe and InP, a shell (0.5 to 2 nm) such as ZnS and ZnSe, and a ligand for stabilizing the core and the shell. Can be implemented.

In addition, the coating method of the fluorescent material or the quantum dot may include at least one of a method of being applied to an LED chip or a light emitting device, a method of covering the material in a film form, a method of attaching a sheet form such as a film or a ceramic fluorescent material .

Dispensing and spray coating are common methods of spraying, and dispensing includes mechanical methods such as pneumatic method and screw, linear type. It is also possible to control the amount of dyeing through a small amount of jetting by means of a jetting method and control the color coordinates thereof. The method of collectively applying the phosphor on the wafer level or the light emitting device substrate by the spray method can easily control productivity and thickness.

The method of directly covering the light emitting device or the LED chip in a film form can be applied by a method of electrophoresis, screen printing or phosphor molding, and the method can be different according to necessity of application of the side of the LED chip.

In order to control the efficiency of the long-wavelength light-emitting phosphor that reabsers light emitted from a short wavelength among two or more kinds of phosphors having different emission wavelengths, two or more kinds of phosphor layers having different emission wavelengths can be distinguished. A DBR (ODR) layer may be included between each layer to minimize absorption and interference.

In order to form a uniform coating film, the phosphor may be formed into a film or ceramic form and then attached onto the LED chip or the light emitting device.

In order to make a difference in light efficiency and light distribution characteristics, a photoelectric conversion material may be located in a remote format. In this case, the photoelectric conversion material is located together with a transparent polymer, glass, or the like depending on its durability and heat resistance.

Since the phosphor coating technique plays a major role in determining the optical characteristics in the light emitting device, control techniques such as the thickness of the phosphor coating layer and the uniform dispersion of the phosphor have been studied variously. QD can also be placed in the LED chip or the light emitting element in the same manner as the phosphor, and can be positioned between the glass or translucent polymer material for light conversion.

Although not shown, a reflective encapsulant may be provided around the phosphor.

Here, the reflective encapsulant may be a reflective encapsulant that reflects light generated in the first and second light emitting devices 11 and 12, And may be a molding formed around the light emitting device 12. [

The reflective encapsulant may be, for example, a white EMC (Epoxy Molding Compound).

In addition, the reflective encapsulant may be an epoxy resin composition, a silicone resin composition, a modified epoxy resin composition, a modified silicone resin composition, a polyimide resin composition, a modified polyimide resin composition, a polyphthalamide (PPA), a polycarbonate resin, At least one of sulfide (PPS), liquid crystal polymer (LCP), ABS resin, phenol resin, acrylic resin, PBT resin, Bragg reflection layer, air gap, total reflection layer, metal layer and combinations thereof .

In addition, the reflective encapsulant may be selected from at least one of EMC including a reflective material, white silicon containing a reflective material, a photoimageable solder resist (PSR), and combinations thereof.

More specifically, for example, the reflective encapsulant may be a silicone resin composition, a modified epoxy resin composition such as a silicone modified epoxy resin, a modified silicone resin composition such as an epoxy modified silicone resin, a polyimide resin composition, a modified polyimide A resin composition, a resin such as polyphthalamide (PPA), polycarbonate resin, polyphenylene sulfide (PPS), liquid crystal polymer (LCP), ABS resin, phenol resin, acrylic resin and PBT resin can be applied.

Further, a light reflecting material such as titanium oxide, silicon dioxide, titanium dioxide, zirconium dioxide, potassium titanate, alumina, aluminum nitride, boron nitride, mullite, chromium, have.

1 and 3, the first light emitting device 11 includes a light guide plate 20 (Light Guide Plate) disposed on one side of the substrate 10, And may be a sideview type LED in which a light emitting surface 11a having a range A1 is formed.

More specifically, for example, as shown in FIGS. 1 and 3, various kinds of display panels 40 such as an LCD panel may be installed above the light guide plate 20. [

Here, the light guide plate 20 may be an optical member that can be made of a light-transmitting material so as to guide light generated from the first light emitting device 11.

The light guide plate 20 may be installed in a path of light generated by the first light emitting device 11 to transmit the light generated from the first light emitting device 11 to a larger area.

The light guide plate 20 may be made of polycarbonate, polysulfone, polyacrylate, polystyrene, polyvinyl chloride, polyvinyl alcohol, polynorbornene, polyester, or the like , And various light transmitting resin materials may be applied. The light guide plate 20 may be formed by various methods such as forming fine patterns, fine protrusions, diffusion films, or the like on the surface, or forming fine bubbles therein.

Although not shown, various diffusion sheets, prism sheets, filters, and the like may be additionally provided above the light guide plate 20. In addition, various display panels 40 such as an LCD panel may be installed above the light guide plate 20.

1 and 3, the second light emitting device 12 is disposed on the diffusion sheet 30 (diffuser sheet) provided on the other side of the substrate 10, And a top view type LED in which a light emitting surface 12a having a light emitting surface A2 is formed.

1 and 3, various kinds of display panels 50 such as a printing panel, a photo panel, and a coloring sheet panel can be installed above the diffusion sheet 30. [ have.

Here, the diffusion sheet 30 (diffusion sheet) is a kind of optical member for forming a diffusion pattern or a diffusion layer on a base film or a base panel including a binder or the like, and may be made of a light-transmitting material as a whole.

The diffusion sheet 30 may be made of a polycarbonate series, a polysulfone series, a polyacrylate series, a polystyrene series, a polyvinyl chloride series, a polyvinyl alcohol series, a polynorbornene series, a polyester or the like. Various types of translucent resin-based materials can be applied. The diffusion sheet 30 may be formed by various methods such as forming fine patterns, fine protrusions, diffusion films, or the like on the surface or forming fine bubbles therein.

Although not shown, various prism sheets, filters, and the like may be additionally provided above the diffusion sheet 30. A variety of display panels 50 such as various types of printing panels, a photo panel, and a color paper panel may be provided above the diffusion sheet 30.

1, the light emitting device package module 100 according to some embodiments of the present invention may be mounted on the light guide plate 20 and the diffusion sheet 30 simultaneously using a single substrate 10, Light can be transmitted, thereby reducing the number of parts and lowering the unit cost of the product, thereby greatly improving the productivity.

4 is a plan view illustrating a light emitting device package module 100 according to some other embodiments of the present invention.

As shown in FIG. 4, the light emitting device package module 100 according to some embodiments of the present invention includes a light guide plate 20, a light guide plate 20, Four can be installed. Of course, the light emitting device package module 100 of the present invention may be provided with two light emitting device packages 100, one in the upward direction and one in the left direction of the light guide plate 20, respectively.

5 is a plan view illustrating a light emitting device package module 200 according to still another embodiment of the present invention.

As shown in FIG. 5, the light emitting device package module 200 according to some embodiments of the present invention includes an L-shaped substrate 10-B bent in L-shape along the upper surface and the left surface of the light guide plate 20 of FIG. 1). This is a combination of two light emitting device package modules 100 of FIG. 4, so that the number of assembling steps can be reduced and electrical connection can be facilitated.

6 is a plan view illustrating a light emitting device package module 300 according to still another embodiment of the present invention.

As shown in FIG. 6, the light emitting device package module 300 according to some embodiments of the present invention includes a top surface and a bottom surface of the light guide plate 20 of FIG. 4, a quadrangular ring shape bent along the left surface and the right surface, And may include a substrate 10-2. This is a combination of the four light emitting device package modules 100 of FIG. 4, thereby reducing the number of assembling steps and making electrical connection easier.

1, a multi-backlight unit 1000 according to some embodiments of the present invention includes a substrate 10 formed to be long in the longitudinal direction, A first light emitting device 11 in which a plurality of light emitting devices 11 are arranged in a longitudinal direction of the substrate 10 and a light emitting surface 11a is formed toward the first direction with respect to the substrate 10, , A second light emitting device (12) provided on the substrate (10) with a light emitting surface (12a) formed in a second direction with respect to the substrate (10) A light guide plate 20 provided in the optical path of the first light emitting device 11 and a diffusion sheet 30 installed in the optical path of the second light emitting device 12. [

Here, the substrate 10, the first light emitting device 11, the second light emitting device 12, the light guide plate 20, and the diffusion sheet 30 are shown in Figs. 1 to 6 The light emitting device package module 100, 200, 300 of the present invention may have the same configuration and function as those of the light emitting device package module 100, 200, 300 of the present invention. Therefore, the detailed description is omitted here.

1, the light guide plate 20 is an edge light guide plate in which the first light emitting device 11 is provided at an edge portion, and the diffusion sheet 30 is a light guiding plate, 12 may be a direct-type diffusion sheet provided on the bottom surface.

7 is a perspective view showing a display device 2000 according to some embodiments of the present invention.

1 and 7, a display device 2000 according to some embodiments of the present invention includes a substrate 10 formed to be long in the longitudinal direction, A first light emitting device 11 in which a plurality of light emitting devices 11 are arranged in a longitudinal direction of the substrate 10 and a light emitting surface 11a is formed toward the first direction with respect to the substrate 10, , A second light emitting device (12) provided on the substrate (10) with a light emitting surface (12a) formed in a second direction with respect to the substrate (10) A light diffusing sheet 30 installed in the light path of the display panel 40 and the second light emitting device 12 and a display panel 50 disposed in the light path of the first light emitting device 11, ).

Here, the substrate 10, the first light emitting device 11, the second light emitting device 12, the light guide plate 20, and the diffusion sheet 30 are shown in Figs. 1 to 6 The light emitting device package module 100, 200, 300 of the present invention may have the same configuration and function as those of the light emitting device package module 100, 200, 300 of the present invention. Therefore, the detailed description is omitted here.

7, the display apparatus 2000 according to some embodiments of the present invention can display the display panel 50 together with information having excellent visibility to the viewer using the display panel 50 It is possible to give aesthetic curiosity and esthetics to consumers at the same time.

While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the invention. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.

10: substrate
11: First light emitting element
12: second light emitting element
20: light guide plate
30: diffusion sheet
40: Display panel
50: Display panel
100: Light emitting device package module
1000: Multi backlight unit
2000: Display device

Claims (8)

A substrate formed to be long in the longitudinal direction;
A first light emitting device provided on the substrate and having a light emitting surface oriented in a first direction with respect to the substrate, the plurality of light emitting devices arranged in a longitudinal direction of the substrate;
A second light emitting device provided on the substrate and having a light emitting surface oriented in a second direction with respect to the substrate, the plurality of light emitting devices arranged in a longitudinal direction of the substrate;
A light guide plate installed in an optical path of the first light emitting device; And
A diffusion sheet provided in an optical path of the second light emitting device;
Lt; / RTI >
The light guide plate is an edge light guide plate in which the first light emitting element is provided at an edge portion,
Wherein the diffusion sheet is a direct diffusion sheet in which the second light emitting element is provided on a lower surface. The method according to claim 1,
Wherein the first light emitting device is an LED having a light emitting surface facing one side of the substrate,
Wherein the second light emitting device is an LED having a light emitting surface formed upwardly of the substrate. The method according to claim 1,
The first light emitting device includes:
And a side-view type LED having a light output surface facing the light guide plate (LGP). The method according to claim 1,
Wherein the second light emitting element comprises:
And a top-view type LED in which a light output surface is formed toward the diffuser sheet. The method according to claim 1,
Wherein the substrate is at least one selected from a linear substrate, an L-shaped substrate, a quadrangular ring substrate and a combination thereof. delete delete A substrate formed to be long in the longitudinal direction;
A first light emitting device provided on the substrate and having a light emitting surface oriented in a first direction with respect to the substrate, the plurality of light emitting devices arranged in a longitudinal direction of the substrate;
A second light emitting device provided on the substrate and having a light emitting surface oriented in a second direction with respect to the substrate, the plurality of light emitting devices arranged in a longitudinal direction of the substrate;
A light guide plate installed in an optical path of the first light emitting device;
A display panel installed in an optical path of the light guide plate;
A diffusion sheet provided in an optical path of the second light emitting device; And
A display panel installed in an optical path of the diffusion sheet;
And a display device.

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