KR101504171B1 - Light emitting device package, backlight unit and lighting device - Google Patents

Abstract

The present invention relates to a light emitting device package capable of emitting white color or daylight color, to a backlight unit, and to a lighting device. The light emitting device package comprises: a substrate; a first light emitting device mounted on the substrate; a second light emitting device mounted on the substrate, and emitting light of a different wavelength from that of the first light emitting device; a reflector installed on the substrate, and enclosing the periphery of the first light emitting device and the second light emitting device; and a first quantum-dot sheet installed on the first light emitting device.

Description

TECHNICAL FIELD [0001] The present invention relates to a light emitting device package, a backlight unit,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting device package, a backlight unit and a lighting apparatus, and more particularly, to a light emitting device package, a backlight unit and a lighting apparatus capable of emitting white or daylight.

BACKGROUND ART Light emitting diodes (LEDs) are semiconductor devices that can emit light of various colors by forming a light emitting source through PN formation of compound semiconductors. Such a light emitting device has a long lifetime, can be reduced in size and weight, has a strong directivity of light, and can be driven at a low voltage. In addition, these LEDs are resistant to impact and vibration, do not require preheating time and complicated driving, can be packaged after being mounted on various types of boards or lead frames, and can be modularized for various purposes, Device or the like.

In the case of a general light emitting device, a phosphor is used to enhance color reproducibility. However, when the conventional light emitting device is formed using only the conventional fluorescent material, there is a problem that the color reproduction rate does not exceed 65% to 72% of the OLED (Organic Light Emitting Diodes).

On the other hand, existing OLEDs also have a problem in that their yields are low and their prices are high and mass productivity is low, so that they are not widely available despite high color reproduction rate.

A conventional technology for a light emitting device that can improve the color reproduction rate to replace such an OLED has been to use a red chip, a green chip, and a blue chip to control the respective color recall ratios. However, Problems such as the problem and the quality and mass production were many problems. Therefore, it has been urgently required to develop a technique for a light emitting device package in which the color reproduction ratio is equal to that of the OLED and the price / mass productivity can be secured at the same time.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems and it is an object of the present invention to improve color reproducibility, fine color control, easy patterning, high light efficiency and easy reproduction of white or daylight A light emitting device package, a backlight unit, and a lighting device that allow the light emitting device package to emit light. However, these problems are exemplary and do not limit the scope of the present invention.

According to an aspect of the present invention, there is provided a light emitting device package including: a substrate; A first light emitting element that is seated on the substrate; A second light emitting device mounted on the substrate and emitting light of a wavelength different from that of the first light emitting device; A reflector disposed on the substrate and surrounding the first light emitting device and the second light emitting device; And a first quantum dot sheet provided on the first light emitting device.

The light emitting device package according to the present invention may further include a light transmitting encapsulant disposed between the reflector and the first quantum dot sheet.

According to an aspect of the present invention, the first light emitting device is a blue LED that emits light of a blue wavelength, and the second light emitting device is a red LED that emits light of a red wavelength, May be to emit light of a yellow wavelength or a green wavelength by absorbing light of a blue wavelength so that white or a light of a main light wavelength is emitted.

According to an aspect of the present invention, the first light emitting device is a blue LED that emits light of a blue wavelength, and the second light emitting device is a green LED that emits light of a green wavelength, May be to absorb light of blue and green wavelengths and emit light of a red wavelength so that light of a white or main light wavelength is emitted.

According to an aspect of the present invention, the first light emitting device and the second light emitting device are provided so as to be in contact with each other, and the first quantum dot sheet is disposed between the upper surface of the first light emitting device and the upper surface As shown in FIG.

According to an aspect of the present invention, the reflector may be a white resin-made reflector provided so as to be vertically contacted with one surface of the first light emitting device, one surface of the second light emitting device, and one surface of the first quantum dot sheet. have.

The light emitting device package according to the present invention may further include a second quantum dot sheet installed in the second light emitting device.

According to an aspect of the present invention, the first light emitting device is a blue LED that emits light of a blue wavelength, and the second light emitting device is a red LED that emits light of a red wavelength, Absorbs light of a blue wavelength so that white or a light of a daylight color is emitted, and emits light of a yellow wavelength, and the second quantum dot sheet absorbs light of a red wavelength so that white or a light of a daylight- The light of wavelength can be emitted.

According to another aspect of the present invention, there is provided a backlight unit comprising: a substrate; A first light emitting element that is seated on the substrate; A second light emitting device mounted on the substrate and emitting light of a wavelength different from that of the first light emitting device; A reflector disposed on the substrate and surrounding the first light emitting device and the second light emitting device; A first quantum dot sheet provided in the first light emitting device; And a light guide plate installed in an optical path of the first light emitting device.

According to an aspect of the present invention, there is provided a lighting apparatus comprising: a substrate; A first light emitting element that is seated on the substrate; A second light emitting device mounted on the substrate and emitting light of a wavelength different from that of the first light emitting device; A reflector disposed on the substrate and surrounding the first light emitting device and the second light emitting device; And a first quantum dot sheet provided on the first light emitting device.

According to some embodiments of the present invention as described above, the color reproducibility can be greatly improved by using optimized structures and combinations of various LEDs, phosphors and quantum dot sheets, fine color adjustment is possible, Has a long lifetime, can narrow a light emitting line width, is easy to pattern, can form pixels finely, has a high light efficiency, and can reproduce white or daylight light easily. Of course, the scope of the present invention is not limited by these effects.

1 is a cross-sectional view illustrating a light emitting device package according to some embodiments of the present invention.
2 is a cross-sectional view illustrating a light emitting device package according to some other embodiments of the present invention.
3 is a cross-sectional view illustrating a light emitting device package according to still another embodiment of the present invention.
4 is a cross-sectional view illustrating a light emitting device package according to still another embodiment of the present invention.
5 is a cross-sectional view illustrating a light emitting device package according to still another embodiment of the present invention.
6 is a cross-sectional view illustrating a light emitting device package according to still another embodiment of the present invention.
7 is a cross-sectional view illustrating a light emitting device package according to still another embodiment of the present invention.
8 is a cross-sectional view illustrating a backlight unit according to some embodiments of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

The embodiments of the present invention are described in order to more fully explain the present invention to those skilled in the art, and the following embodiments may be modified into various other forms, The present invention is not limited to the embodiment. Rather, these embodiments are provided so that this disclosure will be more thorough and complete, and will fully convey the concept of the invention to those skilled in the art. In the drawings, the thickness and size of each layer are exaggerated for convenience and clarity of explanation.

It is to be understood that throughout the specification, when an element such as a film, region or substrate is referred to as being "on", "connected to", "laminated" or "coupled to" another element, It will be appreciated that elements may be directly "on", "connected", "laminated" or "coupled" to another element, or there may be other elements intervening therebetween. On the other hand, when one element is referred to as being "directly on", "directly connected", or "directly coupled" to another element, it is interpreted that there are no other components intervening therebetween do. Like numbers refer to like elements. As used herein, the term "and / or" includes any and all combinations of one or more of the listed items.

Although the terms first, second, etc. are used herein to describe various elements, components, regions, layers and / or portions, these members, components, regions, layers and / It is obvious that no. These terms are only used to distinguish one member, component, region, layer or section from another region, layer or section. Thus, a first member, component, region, layer or section described below may refer to a second member, component, region, layer or section without departing from the teachings of the present invention.

Also, relative terms such as "top" or "above" and "under" or "below" can be used herein to describe the relationship of certain elements to other elements as illustrated in the Figures. Relative terms are intended to include different orientations of the device in addition to those depicted in the Figures. For example, if the element is inverted in the figures, the elements depicted as being on the upper surface of the other elements will have a direction on the lower surface of the other elements. Thus, the example "top" may include both "under" and "top" directions depending on the particular orientation of the figure. If the elements are oriented in different directions (rotated 90 degrees with respect to the other direction), the relative descriptions used herein can be interpreted accordingly.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms "a," "an," and "the" include singular forms unless the context clearly dictates otherwise. Also, " comprise "and / or" comprising "when used herein should be interpreted as specifying the presence of stated shapes, numbers, steps, operations, elements, elements, and / And does not preclude the presence or addition of one or more other features, integers, operations, elements, elements, and / or groups.

Hereinafter, embodiments of the present invention will be described with reference to the drawings schematically showing ideal embodiments of the present invention. In the figures, for example, variations in the shape shown may be expected, depending on manufacturing techniques and / or tolerances. Accordingly, the embodiments of the present invention should not be construed as limited to the particular shapes of the regions shown herein, but should include, for example, changes in shape resulting from manufacturing.

1 is a cross-sectional view illustrating a light emitting device package 100 according to some embodiments of the present invention.

1, a light emitting device package 100 according to some embodiments of the present invention includes a substrate 10, a first light emitting device 21, a second light emitting device 22, A reflector 30, and a first quantum dot sheet 41 (Quantum dot sheet).

Here, the substrate 10 can receive the first light emitting device 21 and the second light emitting device 22, and the first light emitting device 21 and the second light emitting device 22 It can be made of a material having a suitable mechanical strength and insulation or a conductive material so as to be able to support it.

1, the substrate 10 may have a total of two first light emitting devices 21 and second light emitting devices 22, and a plurality of different numbers of light emitting devices The devices can be seated.

For example, the substrate 10 may have various wiring layers to connect the first light emitting device 21 and the second light emitting device 22 to an external power source, Or a printed circuit board (PCB). The substrate 10 may be a Flexible Printed Circuit Board (FPCB) made of a flexible material.

In addition, the substrate 10 may be a synthetic resin substrate such as a resin or a glass epoxy or a ceramic substrate in consideration of a thermal conductivity. In addition, the substrate 10 may be formed of an insulating material such as aluminum, copper, zinc, tin, A metal substrate such as silver can be applied, and a plate or a lead frame substrate can be applied.

The substrate 10 may be made of at least one selected from EMC (Epoxy Mold Compound), PI (polyimide), ceramic, graphene, glass synthetic fiber and combinations thereof to improve workability have.

In addition, although not shown in the figure, the wiring layer may be provided in the form of a conductive layer pattern. The wiring layer may be made of at least one selected from copper, aluminum, and combinations thereof, which are excellent in thermal conductivity and relatively inexpensive materials.

At this time, such a pattern forming method may be thermocompression processing, plating processing, adhesive processing, sputtering processing, other etching processing, printing processing, spray processing and the like.

1, the first light emitting device 21 may be a blue LED that is mounted on the substrate 10 and emits light of a blue wavelength.

The blue LED (Blue) is excellent in color reproducibility, relatively excellent in workability and mass productivity, and has excellent color reproducibility in combination with the first quantum dot sheet 41 have.

The second light emitting device 22 may be a red LED mounted on the substrate 10 and emitting a red wavelength light, as shown in FIG.

More specifically, for example, the first light emitting device 21 and the second light emitting device 22 may emit light of different wavelengths, or may emit light of the same wavelength, Lt; / RTI > For example, the semiconductor may be a blue LED, a green LED, a red LED, a yellow LED, or an LED, which are made of a nitride semiconductor. The nitride semiconductor is represented by a general formula Al _x Ga _y In _z N (0? X? 1, 0? Y? 1, 0? Z? 1, x + y + z = 1).

The first light emitting device 21 and the second light emitting device 22 are formed on a sapphire substrate or a silicon carbide substrate for growth by a vapor phase growth method such as MOCVD or the like using InN, AlN, InGaN , AlGaN, InGaAlN, and the like can be epitaxially grown. The light emitting device 20 may be formed using semiconductors such as ZnO, ZnS, ZnSe, SiC, GaP, GaAlAs, and AlInGaP in addition to the nitride semiconductor. These semiconductors can be stacked in the order of an n-type semiconductor layer, a light emitting layer, and a p-type semiconductor layer. The light emitting layer (active layer) may be a laminated semiconductor having a multiple quantum well structure or a single quantum well structure or a laminated semiconductor having a double hetero structure. The first light emitting device 21 and the second light emitting device 22 can be selected to have arbitrary wavelengths depending on applications such as a display, a backlight unit, and an illumination application.

Here, as the growth substrate, an insulating, conductive or semiconductor substrate may be used if necessary. For example, the growth substrate may be sapphire, SiC, Si, MgAl 2 O 4, MgO, LiAlO 2, LiGaO 2, GaN. A GaN substrate, which is a homogeneous substrate, is preferable for epitaxial growth of a GaN material, but a GaN substrate has a problem of high production cost due to its difficulty in manufacturing.

Sapphire and silicon carbide (SiC) substrates are mainly used as the different substrates. Sapphire substrates are more utilized than expensive silicon carbide substrates. When using a heterogeneous substrate, defects such as dislocation are increased due to the difference in lattice constant between the substrate material and the thin film material. Also, due to the difference in the thermal expansion coefficient between the substrate material and the thin film material, warping occurs at a temperature change, and warping causes a crack in the thin film. This problem may be reduced by using a buffer layer between the substrate and the GaN-based light emitting laminate.

In addition, the substrate for growth may be completely or partially removed or patterned in order to improve the optical or electrical characteristics of the LED chip before or after the growth of the LED structure.

For example, in the case of a sapphire substrate, the substrate can be separated by irradiating the laser to the interface with the semiconductor layer through the substrate, and the silicon or silicon carbide substrate can be removed by a method such as polishing / etching.

Another supporting substrate may be used for removing the growth substrate. In order to improve the light efficiency of the LED chip on the opposite side of the growth substrate, the supporting substrate may be bonded using a reflective metal, As shown in FIG.

In addition, patterning of the growth substrate improves the light extraction efficiency by forming irregularities or slopes before or after the LED structure growth on the main surface (front surface or both sides) or side surfaces of the substrate. The size of the pattern can be selected from the range of 5 nm to 500 μm and it is possible to make a structure for improving the light extraction efficiency with a rule or an irregular pattern. Various shapes such as a shape, a column, a mountain, a hemisphere, and a polygon can be adopted.

In the case of the sapphire substrate, the crystals having a hexagonal-rhombo-cubic (Hexa-Rhombo R3c) symmetry have lattice constants of 13.001 and 4.758 in the c-axis direction and the a-axis direction, respectively, and have C plane, A plane and R plane. In this case, the C-plane is relatively easy to grow the nitride film, and is stable at high temperature, and thus is mainly used as a substrate for nitride growth.

Another material of the growth substrate is a Si substrate, which is more suitable for large-scale curing and relatively low in cost, so that mass productivity can be improved.

In addition, since the silicon (Si) substrate absorbs light generated from the GaN-based semiconductor and the external quantum efficiency of the light emitting device is lowered, the substrate may be removed as necessary, and Si, Ge, SiAl, A support substrate such as a metal substrate is further formed and used.

When a GaN thin film is grown on a different substrate such as the Si substrate, the dislocation density increases due to the lattice constant mismatch between the substrate material and the thin film material, and cracks and warpage Lt; / RTI > The buffer layer may be disposed between the growth substrate and the light emitting stack for the purpose of preventing dislocation and cracking of the light emitting stack. The buffer layer also functions to reduce the scattering of the wavelength of the wafer by adjusting the degree of warping of the substrate during the growth of the active layer.

Here, the buffer layer may be made of Al _x In _y Ga _1-xy N (0? X? 1, 0? _Y? 1, x + y? 1), in particular GaN, AlN, AlGaN, InGaN or InGaNAlN. Materials such as ZrB2, HfB2, ZrN, HfN and TiN can also be used as needed. Further, a plurality of layers may be combined, or the composition may be gradually changed.

The first light emitting device 21 and the second light emitting device 22 may be a flip chip type light emitting device having electrode pads formed on a lower surface thereof. In addition, the first light emitting device 21 and the second light emitting device 22 may be provided with signal transmission media such as various bumps and solders, or may be provided with various types of signal transmission media such as wires, Type light emitting devices can be applied.

1, the reflector 30 reflects light emitted from the first light emitting device 21 and the second light emitting device 22 upward, 10 and may surround the first light emitting device 21 and the second light emitting device 22 and may be various types of reflective structures.

More specifically, for example, as shown in Fig. 1, the reflector 30 includes a cup-shaped opening having an inclined surface around the first light emitting device 21 and the second light emitting device 22 as a whole, May be formed.

Although not shown, the reflector 30 may be installed in a wide variety of shapes such as a circle, a triangle, a rectangle, a polygon, an ellipse, a composite, and other geometric shapes as a whole. Accordingly, the shape of the reflector 30 of the light emitting device package 100 according to some embodiments of the present invention is not limited to the shape shown in FIG.

The reflector 30 may be molded on the substrate 10, or may be dispensed or screen-printed.

More specifically, the reflector 30 may be formed of an epoxy resin composition, a silicone resin composition, a modified epoxy resin composition such as a silicone modified epoxy resin, a modified silicone resin composition such as an epoxy modified silicone resin, a polyimide resin composition, a modified polyimide A resin composition, a resin such as polyphthalamide (PPA), polycarbonate resin, polyphenylene sulfide (PPS), liquid crystal polymer (LCP), ABS resin, phenol resin, acrylic resin and PBT resin can be applied.

It is also possible to add a light reflective reflecting material such as titanium oxide, silicon dioxide, titanium dioxide, zirconium dioxide, potassium titanate, alumina, aluminum nitride, boron nitride, mullite, chromium, .

In addition, the reflector 30 may be a reflector, a reflection layer, or a reflection unit made of metal such as aluminum, silver, gold, copper, or the like. In the case where the substrate 10 is made of metal, It is also possible to install it.

1, the first quantum dot sheet 41 is provided only on the first light emitting device 21, and the first light emitting device 21 emits blue light having a blue wavelength, And the second light emitting device 22 is a red LED that emits light of a red wavelength, the first quantum dot sheet 41 is a blue light emitting diode, It can absorb light of wavelength and emit light of yellow or green wavelength. In addition, the first quantum dot sheet 41 may emit light of at least yellow or red wavelength by absorbing light of a blue wavelength so that light of white or main light is emitted.

More specifically, for example, the first quantum dot sheet 41 may emit light of a second wavelength and light of a third wavelength by absorbing light of a first wavelength including green light, blue light, or near ultraviolet light . The first quantum dot sheet 41 may be formed by uniformly arranging quantum dot fluorescent powders corresponding to light of the second wavelength or light of the third wavelength on the base of silicon or the like.

Here, the quantum confinement effect occurs when the individual quantum dots QD of the quantum dot fluorescent powder are smaller than the Bohr radii of the excitons formed by electrons and holes excited by light, electricity or the like And the energy gap is changed in size. Further, the charge is confined within the quantum dots, so that it has a high luminous efficiency.

Unlike general fluorescent dyes, the quantum dots vary in fluorescence wavelength depending on the particle size. That is, as the size of the particle becomes smaller, it emits light having a shorter wavelength, and the particle size can be adjusted to produce fluorescence in a visible light region of a desired wavelength.

In addition, since it has a larger extinction coefficient and higher quantum yield than general dyes, it can generate very high fluorescence. These quantum dots can be synthesized by a chemical wet process. Here, the chemical wet method is a method of growing particles by adding a precursor material to an organic solvent, and a method of synthesizing a quantum dot by a chemical wet method is a well known technique.

The quantum dot may have a core-shell structure, and the core may include any one material selected from the group consisting of CdSe, CdTe, CdS, ZnSe, ZnTe, ZnS, HgTe and HgS, CdSe, CdTe, CdS, ZnSe, ZnTe, ZnS, HgTe, and HgS.

Here, the transmissive encapsulant 50 may be formed on the first quantum dot sheet 41, and an adhesive protective film may be formed on the lower surface.

This is because the first quantum dot sheet 41 is vulnerable to external oxygen or moisture and is supplemented by making a separate filling space in the transparent encapsulant 50, It is also possible to fill the opening 41 and seal it from the outside.

The first quantum dot sheet 41 includes a core (3 to 10 nm) such as CdSe and InP, a shell (0.5 to 2 nm) such as ZnS and ZnSe, and a ligand for stabilizing the core and the shell And various colors can be implemented according to the size.

The first quantum dot sheet 41 may be formed by a method in which the first light emitting device 21 is roughed or covered with a film, a method of attaching an already prepared sheet form such as a film or a ceramic fluorescent substance, May be used.

Here, dispensing, spray coating, and the like are generally used as a root method, and dispensing includes a mechanical method such as a pneumatic method, a screw, and a linear type. It is also possible to control the amount of dyeing through a small amount of jetting by means of a jetting method and control the color coordinates thereof. The method of collectively applying the phosphor on the wafer level or the light emitting device substrate by the spray method can easily control productivity and thickness.

The method of directly covering the first light emitting device 21 in the form of a film may be applied by electrophoresis, screen printing or molding, and there may be differences in the method depending on the type of the first light emitting device 21 .

The translucent encapsulant 50 may be a translucent structure filled between the reflector 30 and the first quantum dot sheet 41.

The transmissive encapsulant 50 protects the first light emitting device 21 and the second light emitting device 22 and protects the first quantum dot sheet 41.

More specifically, for example, the translucent encapsulant 50 may be a modified epoxy resin composition such as an epoxy resin composition, a silicone resin composition, or a silicone modified epoxy resin, a modified silicone resin composition such as an epoxy modified silicone resin, a polyimide resin composition , Modified polyimide resin composition, resin such as polyphthalamide (PPA), polycarbonate resin, polyphenylene sulfide (PPS), liquid crystal polymer (LCP), ABS resin, phenol resin, acrylic resin and PBT resin have.

Further, the shape of the translucent encapsulant 50 may vary widely. Therefore, the shape of the translucent encapsulant 50 of the light emitting device package 100 according to some embodiments of the present invention is not limited to the shape shown in FIG.

Accordingly, the operation of the light emitting device package 100 according to some embodiments of the present invention will be described in more detail. First, when the blue light is emitted from the first light emitting device 21, A part of the first quantum dot sheet 41 may be converted into yellow or green light by the first quantum dot sheet 41 and may be emitted to the outside through the transparent encapsulant 40.

Here, a part of the light of the blue wavelength can pass through the first quantum dot sheet 41 as it is or pass through the first quantum dot sheet 41, and the light emitted from the second light emitting element 22 The white light or the light of the main light wavelength can be implemented as a whole together with the light of the red wavelength.

At this time, the size of the quantum dots can be variously configured to easily realize light of a white color or a light of a daylight color.

Therefore, it is possible to simplify the process by attaching the first quantum dot sheet 41 to the first luminous means 21 using the quantum dots and the color reproducibility is high, and the translucent encapsulant 50 has a high color reproducibility, The sheet 41 can be thermally and mechanically protected to improve the durability of the product.

2 is a cross-sectional view illustrating a light emitting device package 200 according to some other embodiments of the present invention.

2, the first light emitting device 21 of the light emitting device package 200 according to some embodiments of the present invention is a blue LED that emits blue light, The first quantum dot sheet 41 absorbs light of blue and green wavelengths so that light of a white or main light wavelength is emitted from the second light emitting device 22. The second light emitting device 22 is a green LED that emits green light, And emit light of a red wavelength.

Therefore, the operation of the light emitting device package 200 according to some embodiments of the present invention will be described in more detail. First, when the blue light is emitted from the first light emitting device 21, A part of the first quantum dot sheet 41 may be converted into yellow or green light by the first quantum dot sheet 41 and may be emitted to the outside through the transparent encapsulant 40.

Here, a part of the light of the blue wavelength can pass through the first quantum dot sheet 41 as it is or pass through the first quantum dot sheet 41, and the light emitted from the second light emitting element 22 It is possible to realize white light or light of a daylight wavelength as a whole together with the light of green wavelength.

3 is a cross-sectional view illustrating a light emitting device package 300 according to still another embodiment of the present invention.

3, the light emitting device package 300 according to still another embodiment of the present invention is characterized in that the first light emitting device 21 and the second light emitting device 22 are installed in contact with each other And the first quantum dot sheet 41 may be installed over the upper surface of the first light emitting device 21 and the upper surface of the second light emitting device 22. [

Therefore, the separation distance between the first light emitting device 21 and the second light emitting device 22 can be reduced, and the efficiency of the process of the first quantum dot sheet 41 can be improved, .

4 is a cross-sectional view illustrating a light emitting device package 400 according to still another embodiment of the present invention.

4, the light emitting device package 400 according to still another embodiment of the present invention may further include a second quantum dot sheet 42 installed in the second light emitting device 22 have.

Therefore, the distance between the first light emitting device 21 and the second light emitting device 22 can be reduced, and the first quantum dot sheet 41 and the second quantum dot sheet 42 can be arranged side by side, Reproducibility, as well as ease of light combination and color reproduction rate can be greatly improved.

4, the first light emitting device 21 is a blue LED that emits light of a blue wavelength, and the second light emitting device 22 emits light of a red wavelength The first quantum dot sheet 41 absorbs light of a blue wavelength so as to emit white or a light of a primary color and emits light of a yellow wavelength, and the second quantum dot sheet 41 emits light of a blue wavelength, The sheet 42 can emit light of a green wavelength by absorbing light of a red wavelength so that light of a white or main light wavelength is emitted.

5 is a cross-sectional view illustrating a light emitting device package 500 according to still another embodiment of the present invention.

5, the light emitting device package 500 according to still another embodiment of the present invention is a blue LED (Blue) that emits light of a blue wavelength, The second light emitting device 22 may be a green LED that emits green light. In addition, the first light emitting device 21 and the second light emitting device 22 may be installed in various forms in various combinations.

6 is a cross-sectional view illustrating a light emitting device package 600 according to still another embodiment of the present invention.

6, the light emitting device package 600 according to still another embodiment of the present invention may be configured such that the reflector 30 is formed on one surface of the first light emitting device 21 and the second light emitting device 22 and the first quantum dot sheet 41 and a reflector of a white resin material provided in contact with one surface of the first quantum dot sheet 41 in a vertical direction.

Therefore, according to the light emitting device package 600 according to still another embodiment of the present invention, a very compact and high efficiency light emitting device can be manufactured, and the production process thereof is also very simple, and productivity can be greatly improved.

7 is a cross-sectional view illustrating a light emitting device package 700 according to still another embodiment of the present invention.

7, the light emitting device package 700 according to still another embodiment of the present invention may further include a second quantum dot sheet 42 installed in the second light emitting device 22 have.

Therefore, the distance between the first light emitting device 21 and the second light emitting device 22 can be reduced, and the first quantum dot sheet 41 and the second quantum dot sheet 42 can be arranged side by side, The reproducibility, as well as the ease of light combination and the color reproducibility can be greatly improved. At the same time, a very compact and high-efficiency product can be manufactured, and the production process is also very simple, and productivity can be greatly improved.

8 is a cross-sectional view illustrating a backlight unit 1000 according to some embodiments of the present invention.

8, a backlight unit 1000 according to some embodiments of the present invention includes a substrate 10, a first light emitting device 21 that is seated on the substrate 10, A second light emitting device 22 mounted on the substrate 10 and mounted on the first light emitting device 21 and the first light emitting device 21 to emit light of a different wavelength from the first light emitting device 21, A reflector 30 surrounding the periphery of the second light emitting element 22 and a first quantum dot sheet 41 provided in the first light emitting element 21 and a second quantum dot sheet 41 provided in the optical path of the first light emitting element 21 And the light guide plate 60 may be formed.

1, the substrate 10, the first light emitting device 21, the second light emitting device 22, the reflector 30, and the first quantum dot sheet 41 described above, The structure and role of the light emitting device package 100 of the present invention can be the same. Therefore, detailed description is omitted.

The backlight unit 1000 according to the present invention is installed on an LCD panel and projects light toward the LCD panel. The light guide plate 60 includes the first light emitting device 21 and the second light emitting device 22 The light emitted from the first light emitting device 21 and the light emitted from the second light emitting device 22 can be transmitted over a wider area.

The light guide plate 60 may be made of polycarbonate, polysulfone, polyacrylate, polystyrene, polyvinyl chloride, polyvinyl alcohol, polynorbornene, polyester, or the like , Besides, materials of various translucent resin series can be applied. The light guide plate 60 may be formed by various methods such as forming fine patterns, fine protrusions, diffusion films, or the like on the surface, or forming fine bubbles therein. Although not shown in the drawing, the backlight unit 1000 of the present invention may further include various lenses, diffusion sheets, prism sheets, filters, and the like.

The backlight unit 1000 according to some embodiments of the present invention may be a direct type backlight unit in which the first light emitting device 21 and the second light emitting device 22 are installed below the light guide plate 60 And the first light emitting device 21 and the second light emitting device 22 may be disposed on the side of the light guide plate 60. [

On the other hand, although not shown, the present invention can include a lighting device including the light emitting device packages described above. Here, the components of the lighting apparatus according to some embodiments of the present invention may have the same configuration and functions as those of the above-described light emitting device package of the present invention. Therefore, detailed description is omitted.

While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the invention. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.

10: substrate
21: first light emitting element
22: second light emitting element
30: reflector
41: first quantum dot sheet
42: second quantum dot sheet
50: Transparent encapsulant
Blue: Blue LED
Red: Red LED
Green: Green LED
60: light guide plate
100, 200, 300, 400, 500, 600, 700: Light emitting device package
1000: Backlight unit

Claims (10)

Board;
A first light emitting element that is seated on the substrate;
A second light emitting device mounted on the substrate and emitting light of a wavelength different from that of the first light emitting device; And
A first quantum dot sheet;
Lt; / RTI >
The first light emitting device and the second light emitting device are provided so as to be in contact with each other,
Wherein the first quantum dot sheet is provided so as to extend over an upper surface of the first light emitting element and an upper surface of the second light emitting element. The method according to claim 1,
A reflector disposed on the substrate and surrounding the first light emitting device and the second light emitting device; And
A light-transmitting encapsulant disposed between the reflector and the first quantum dot sheet;
Emitting device package. The method according to claim 1,
The first light emitting device is a blue LED that emits light of a blue wavelength,
Wherein the second light emitting device is a red LED that emits light of a red wavelength,
Wherein the first quantum dot sheet absorbs light of a blue wavelength so as to emit white or a light having a wavelength of the main light to emit yellow or green wavelength light. The method according to claim 1,
The first light emitting device is a blue LED that emits light of a blue wavelength,
The second light emitting device is a green LED that emits light of a green wavelength,
Wherein the first quantum dot sheet emits light of a red wavelength by absorbing light of blue and green wavelengths so that light of a white or main light wavelength is emitted. 3. The method of claim 2,
Wherein the reflector is a reflector of a white resin material provided so as to be vertically contacted with one surface of the first light emitting device, one surface of the second light emitting device, and one surface of the first quantum dot sheet. Board;
A first light emitting element that is seated on the substrate;
A second light emitting device mounted on the substrate and emitting light of a wavelength different from that of the first light emitting device; And
A first quantum dot sheet provided in the first light emitting device; And
A second quantum dot sheet provided in the second light emitting device;
Lt; / RTI >
The first light emitting device and the second light emitting device are provided so as to be in contact with each other,
And the first quantum dot sheet and the second quantum dot sheet are provided side by side. The method according to claim 6,
The first light emitting device is a blue LED that emits light of a blue wavelength,
Wherein the second light emitting device is a red LED that emits light of a red wavelength,
The first quantum dot sheet absorbs light of a blue wavelength so as to emit white or a light of a wavelength of a main light to emit light of a yellow wavelength,
And the second quantum dot sheet absorbs light of a red wavelength and emits light of a green wavelength. The method according to claim 6,
A reflector disposed on the substrate and surrounding the first light emitting device and the second light emitting device; And
A translucent encapsulant provided between the reflector and the first quantum dot sheet and the second quantum dot sheet;
Further comprising:
Wherein the reflector is a reflector of a white resin material provided in contact with one surface of the first light emitting device, one surface of the second light emitting device, and one surface of the first quantum dot sheet and the second quantum dot sheet, package. Board;
A first light emitting element that is seated on the substrate;
A second light emitting device mounted on the substrate and emitting light of a wavelength different from that of the first light emitting device;
A reflector disposed on the substrate and surrounding the first light emitting device and the second light emitting device; And
A first quantum dot sheet provided in the first light emitting device;
Lt; / RTI >
Wherein the first light emitting element and the second light emitting element are provided so as to be in contact with each other,
Wherein the first quantum dot sheet is provided over the upper surface of the first light emitting element and the upper surface of the second light emitting element. Board;
A first light emitting element that is seated on the substrate;
A second light emitting device mounted on the substrate and emitting light of a wavelength different from that of the first light emitting device;
A reflector disposed on the substrate and surrounding the first light emitting device and the second light emitting device; And
A first quantum dot sheet provided in the first light emitting device;
Lt; / RTI >
Wherein the first light emitting element and the second light emitting element are provided so as to be in contact with each other,
Wherein the first quantum dot sheet is provided so as to extend over the upper surface of the first light emitting element and the upper surface of the second light emitting element.

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