KR101553343B1 - Light emitting device package and backlight unit - Google Patents

Abstract

The present invention relates to a light emitting device package which can be used for a display or lighting. The light emitting device package includes: a substrate; a light emitting device mounted on the substrate; a reflective encapsulation material formed on the substrate for forming a reflective cup to reflect a light generated by the light emitting device; a charging member charged in the reflective cup; a first light conversion sheet formed on the top or inside of the charging member spaced from the light emitting device for conversing a light generated by the light emitting device; and a second light conversion sheet formed on the top of the first light conversion sheet for conversing a light generated by the light emitting device. The first light conversion sheet and second light conversion sheet can be shaped as a plurality of lenticular lenses or micro lenses.

Description

[0001] DESCRIPTION [0002] LIGHT EMITTING DEVICE PACKAGE AND BACKLIGHT UNIT [0003]

The present invention relates to a light emitting device package and a backlight unit, and more particularly, to a light emitting device package and a backlight unit which can be used for display or illumination.

A light emitting diode (LED) is a kind of semiconductor device that can emit light of various colors by forming a light emitting source through the formation of a PN diode of a compound semiconductor. Such a light emitting device has a long lifetime, can be reduced in size and weight, and can be driven at a low voltage. In addition, these LEDs are resistant to shock and vibration, do not require preheating time and complicated driving, can be packaged after being mounted on a substrate or lead frame in various forms, so that they can be modularized for various purposes and used as a backlight unit A lighting device, and the like.

QD (Quantum Dot) is a nano-sized semiconductor material that exhibits a quantum confinement effect and generates stronger light in a narrow wavelength band than conventional phosphors. The emission of quantum dots (QD, Quantum Dot) occurs when electrons excited from a conduction band to a valence band are transferred. Even in the case of the same material, the wavelength varies depending on the particle size. Quantum dots (QDs) emit light of a shorter wavelength as the size decreases, so that light of a desired wavelength range can be obtained by adjusting the size.

QD (Quantum Dot) produced by a chemical wet process does not use the undiluted solution, but coordinates a given ligand around the QD (Quantum Dot) for convenience in storage or use. Materials used as ligands of quantum dots (QDs) include, for example, trioctylphosphine oxide (TOPO). In order to use the quantum dot (QD) in the light emitting device package, a purification process for eliminating the ligand must be performed before adding it to a sealing material such as a resin.

When quantum dots (QDs) are purified, side effects such as decrease in luminescence, precipitation in solution due to removal of surface ligands, or change in wavelength of emitted light due to surface oxidation occur. In order to solve this problem, there is a method of capping a quantum dot (QD) with an organic material or wrapping a surface of a quantum dot (QD) with a material having a band gap larger than that of a quantum dot (QD) .

Such quantum dots (QDs) are used in place of the phosphors in the light emitting device package or mixed with the phosphors to realize white light or various colors of light.

However, the conventional light emitting device package including a quantum dot (QD) has a problem in that a quantum dot (QD) itself is capped with an organic material or a quantum dot (QD) is quantized by a bandgap of a quantum dot (QD) (QD, Quantum Dot) is coated using a method of covering a surface with a larger material and then used in a light emitting device package. Therefore, it takes a lot of time and cost in a packaging process, resulting in an increase in the price of the product, .

In addition, when a large quantum dot (QD) is used in a light emitting device package, a sulfur component in a quantum dot (QD) reacts with a silver component plated on the electrode mold of the light emitting device package to cause discoloration, There was a problem that it was deteriorated.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and it is an object of the present invention to provide a light emitting device package which can be manufactured by a simple process by mounting a quantum dot (QD) And to provide the above-mentioned objects. However, these problems are exemplary and do not limit the scope of the present invention.

According to an aspect of the present invention, there is provided a light emitting device package including: a substrate; A light emitting element mounted on the substrate; A reflective encapsulant formed on the substrate and having reflective cups to reflect light emitted from the encapsulant; A filling member filled in the reflection cup portion; A first light conversion sheet formed on an upper surface or inside of the filling member so as to be spaced apart from the light emitting device and photo-converting light generated from the light emitting device; And a second light conversion sheet formed above the first light conversion sheet and photo-converting the light converted in the first light conversion sheet or the light generated in the light emitting element, The conversion sheet and the second light conversion sheet may be in the form of a plurality of lenticular lenses or microlenses.

According to an aspect of the present invention, the first light conversion sheet or the second light conversion sheet may include a quantum dot or a fluorescent material.

According to an aspect of the present invention, the lenticular lens or the microlens shape includes one of a semicircular shape, a parabolic shape, a triangular shape, a rectangular shape, and a polygonal shape in cross section and includes quantum dots or phosphors elongated in the longitudinal direction A lenticular lens or a microlens shape of a resin material.

According to an aspect of the present invention, the longitudinal direction of the lenticular lens or the microlens of the first light conversion sheet and the longitudinal direction of the lenticular lens or the microlens of the second light conversion sheet are vertically overlapped with each other Can be installed.

The light emitting device package according to the present invention may further include a diffusion member formed above the second light conversion sheet and diffusing the point light source into the surface light source.

According to an aspect of the present invention, the diffusing member may be a light-diffusing member that diffuses light emitted from at least one of the light-emitting device, the first light-converting sheet, and the second light- A light diffusion pattern can be formed on the light surface.

Further, according to an aspect of the present invention, the light diffusion pattern may be formed by at least one of a super-precision cutting process, lithography, thermal press transfer, or laser processing.

Further, the light emitting device package according to the present invention is formed below the first light conversion sheet or the second light conversion sheet, and the light emitting element package is provided with the first light conversion sheet or the second light conversion sheet A heat insulating layer intercepting the transmitted heat; And a second light conversion sheet formed on the first light conversion sheet or the second light conversion sheet and having at least one of air, moisture, foreign matter, heat, And a protective layer for protecting the conversion sheet.

According to another aspect of the present invention, there is provided a backlight unit comprising: a substrate; A light emitting element mounted on the substrate; A reflective encapsulant formed on the substrate and having reflective cups to reflect light emitted from the encapsulant; A filling member filled in the reflection cup portion; A first light conversion sheet formed on an upper surface or inside of the filling member so as to be spaced apart from the light emitting device and photo-converting light generated from the light emitting device; A second light conversion sheet formed above the first light conversion sheet and photo-converting the light converted in the first light conversion sheet or the light generated in the light emitting element; And a light guide plate for guiding light that has passed through the first light conversion sheet and / or the second light conversion sheet, wherein the first light conversion sheet and the second light conversion sheet include a plurality of lenticular lenses or micro lenses Lt; / RTI >

According to some embodiments of the present invention as described above, the light emitting device package can be manufactured by a simple process because the quantum dots are separated from the light emitting device and installed in a package in a sheet form. . Of course, the scope of the present invention is not limited by these effects.

1 is a cross-sectional view illustrating a light emitting device package and a backlight unit according to some embodiments of the present invention.
Figs. 2 to 3 are perspective views showing the first light conversion sheet and the second light conversion sheet of Fig. 1. Fig.
4 to 5 are cross-sectional views showing a first light conversion sheet and a second light conversion sheet of a light emitting device package according to some other embodiments of the present invention.
6 to 7 are sectional views showing a first light conversion sheet and a second light conversion sheet of a light emitting device package according to still another embodiment of the present invention.
8 is a cross-sectional view illustrating a light emitting device package according to some other embodiments of the present invention.
9 is a cross-sectional view illustrating a light emitting device package according to still another embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

The embodiments of the present invention are described in order to more fully explain the present invention to those skilled in the art, and the following embodiments may be modified in various other forms, The present invention is not limited to the embodiment. Rather, these embodiments are provided so that this disclosure will be more thorough and complete, and will fully convey the concept of the invention to those skilled in the art. In the drawings, the thickness and size of each layer are exaggerated for convenience and clarity of explanation.

It is to be understood that throughout the specification, when an element such as a film, region or substrate is referred to as being "on", "connected to", "laminated" or "coupled to" another element, It will be appreciated that elements may be directly "on", "connected", "laminated" or "coupled" to another element, or there may be other elements intervening therebetween. On the other hand, when one element is referred to as being "directly on", "directly connected", or "directly coupled" to another element, it is interpreted that there are no other components intervening therebetween do. Like numbers refer to like elements. As used herein, the term "and / or" includes any and all combinations of one or more of the listed items.

Although the terms first, second, etc. are used herein to describe various elements, components, regions, layers and / or portions, these members, components, regions, layers and / It is obvious that no. These terms are only used to distinguish one member, component, region, layer or section from another region, layer or section. Thus, a first member, component, region, layer or section described below may refer to a second member, component, region, layer or section without departing from the teachings of the present invention.

Also, relative terms such as "top" or "above" and "under" or "below" can be used herein to describe the relationship of certain elements to other elements as illustrated in the Figures. Relative terms are intended to include different orientations of the device in addition to those depicted in the Figures. For example, in the figures, when the element is turned over, the elements depicted as being on the upper surface of the other elements are oriented on the lower surface of the other elements. Thus, the example "top" may include both "under" and "top" directions depending on the particular orientation of the figure. If the elements are oriented in different directions (rotated 90 degrees with respect to the other direction), the relative descriptions used herein can be interpreted accordingly.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms "a," "an," and "the" include singular forms unless the context clearly dictates otherwise. Also, " comprise "and / or" comprising "when used herein should be interpreted as specifying the presence of stated shapes, numbers, steps, operations, elements, elements, and / And does not exclude the presence or addition of one or more other features, integers, operations, elements, elements, and / or groups.

Hereinafter, embodiments of the present invention will be described with reference to the drawings schematically showing ideal embodiments of the present invention. In the figures, for example, variations in the shape shown may be expected, depending on manufacturing techniques and / or tolerances. Accordingly, the embodiments of the present invention should not be construed as limited to the particular shapes of the regions shown herein, but should include, for example, changes in shape resulting from manufacturing.

The lenticular lens referred to in the present invention collectively refers to a configuration in which one or more semicylindrical lenses are arranged in the form of an array, and can act to scatter light.

The micro lens referred to in the present invention refers to a minute lens having a diameter of about 0.1 to several millimeters, and may have various cross-sectional shapes for scattering light.

1 is a cross-sectional view showing a light emitting device package 100 and a backlight unit 1000 according to some embodiments of the present invention. Figs. 2 to 3 are sectional views of a first light conversion sheet 50 and a second light Fig. 6 is a perspective view showing the conversion sheet 60; Fig.

1, a light emitting device package 100 according to some embodiments of the present invention includes a substrate 10, a light emitting device 20, a reflective encapsulant 30, a filling member 40 ), A first light conversion sheet (50), and a second light conversion sheet (60).

Specifically, for example, the light emitting device 20 may include a flip chip type LED having a first pad and a second pad and electrically connected to the substrate 10 using a bonding medium, Light Emitting Diode).

Although not shown, the light emitting device 20 may be a flip chip type having a signal transmission medium such as a pump or a solder in addition to the pad. In addition, a bonding wire may be applied to the terminal, A light emitting element to which a bonding wire is applied to only two terminals, or a horizontal type or vertical type light emitting element can be applied.

The light emitting device 20 may be made of a semiconductor, as shown in FIG. For example, LEDs of blue, green, red, and yellow light emission, LEDs of ultraviolet light emission, and LEDs of infrared light emission, which are made of a nitride semiconductor, can be applied.

The light emitting device 20 can be formed by epitaxially growing nitride semiconductors such as InN, AlN, InGaN, AlGaN, and InGaAlN on a sapphire substrate for growth or a silicon carbide substrate by a vapor phase growth method such as MOCVD To grow. The light emitting device 20 may be formed using semiconductors such as ZnO, ZnS, ZnSe, SiC, GaP, GaAlAs, and AlInGaP in addition to the nitride semiconductor. These semiconductors can be stacked in the order of an n-type semiconductor layer, a light emitting layer, and a p-type semiconductor layer. The light emitting layer (active layer) may be a laminated semiconductor having a multiple quantum well structure or a single quantum well structure or a laminated semiconductor having a double hetero structure. In addition, the light emitting device 20 can be selected to have an arbitrary wavelength depending on the application such as display use and illumination use.

Here, as the growth substrate, an insulating, conductive or semiconductor substrate may be used if necessary. For example, the growth substrate may be sapphire, SiC, Si, MgAl ₂ O ₄ , MgO, LiAlO ₂ , LiGaO ₂ , GaN. A GaN substrate, which is a homogeneous substrate, is preferable for epitaxial growth of a GaN material, but a GaN substrate has a problem of high production cost due to its difficulty in manufacturing.

Sapphire and silicon carbide (SiC) substrates are mainly used as the different substrates. Sapphire substrates are more utilized than expensive silicon carbide substrates. When using a heterogeneous substrate, defects such as dislocation are increased due to the difference in lattice constant between the substrate material and the thin film material. Also, due to the difference in the thermal expansion coefficient between the substrate material and the thin film material, warping occurs at a temperature change, and warping causes a crack in the thin film. This problem may be reduced by using a buffer layer between the substrate and the GaN-based light emitting laminate.

In addition, the substrate for growth may be completely or partially removed or patterned in order to improve the optical or electrical characteristics of the LED chip before or after the growth of the LED structure.

For example, in the case of a sapphire substrate, the substrate can be separated by irradiating the laser to the interface with the semiconductor layer through the substrate, and the silicon or silicon carbide substrate can be removed by a method such as polishing / etching.

Another supporting substrate may be used for removing the growth substrate. In order to improve the light efficiency of the LED chip on the opposite side of the growth substrate, the supporting substrate may be bonded using a reflective metal, As shown in FIG.

In addition, patterning of the growth substrate improves the light extraction efficiency by forming irregularities or slopes before or after the LED structure growth on the main surface (front surface or both sides) or side surfaces of the substrate. The size of the pattern can be selected from the range of 5 nm to 500 μm and it is possible to make a structure for improving the light extraction efficiency with a rule or an irregular pattern. Various shapes such as a shape, a column, a mountain, a hemisphere, and a polygon can be adopted.

In the case of the sapphire substrate, the crystals having a hexagonal-rhombo-cubic (Hexa-Rhombo R3c) symmetry have lattice constants of 13.001 and 4.758 in the c-axis direction and the a-axis direction, respectively, and have C plane, A plane and R plane. In this case, the C-plane is relatively easy to grow the nitride film, and is stable at high temperature, and thus is mainly used as a substrate for nitride growth.

Another material of the growth substrate is a Si substrate, which is more suitable for large-scale curing and relatively low in cost, so that mass productivity can be improved.

Since the external quantum efficiency of the light emitting device is lowered by absorbing light generated from the GaN-based semiconductor, the Si (silicon) substrate may be removed, if necessary, and Si, Ge, SiAl, Or a support substrate such as a metal substrate is further formed and used.

When a GaN thin film is grown on a different substrate such as the Si substrate, the dislocation density increases due to the lattice constant mismatch between the substrate material and the thin film material, and cracks and warpage Lt; / RTI > The buffer layer may be disposed between the growth substrate and the light emitting stack for the purpose of preventing dislocation and cracking of the light emitting stack. The buffer layer also functions to reduce the scattering of the wavelength of the wafer by adjusting the degree of warping of the substrate during the growth of the active layer.

The buffer layer may be made of GaN, AlN, AlGaN, InGaN, or InGaNAlN. If necessary, a material such as ZrB ₂ , HfB ₂ , ZrN, HfN, or TiN may be used. Further, a plurality of layers may be combined, or the composition may be gradually changed.

1, the substrate 10 includes a first electrode 11 disposed on one side of the electrode separation space, a second electrode 12 disposed on the other side of the substrate 10, And may be a metal lead frame in which a seating surface is formed so that the light emitting device 20 can be seated.

More specifically, for example, as shown in FIG. 1, the substrate 10 may be made of a material or a conductive material having appropriate mechanical strength and insulation that can support or accommodate the light emitting device 20 have.

For example, the substrate 10 may be formed of metal such as aluminum, copper, zinc, tin, lead, gold, or silver, and may be in the form of a perforated or bent plate.

In order to maximize the reflectance, at least a silver (Ag) plating layer, a silver (Ag) alloy, a silver (Ag) alloy layer, an aluminum (Al) (Al) alloy layer, a copper (Cu) alloy, a copper (Cu) alloy layer, a copper (Cu) alloy layer, a platinum (Pt) alloy, a platinum (Au), gold (Au) plated layer, gold (Au) alloy layer, palladium (Pd), ruthenium (Ru), rhodium (Rh) and combinations thereof.

In addition, the substrate 10 may be a printed circuit board (PCB) in which an epoxy resin sheet is formed in multiple layers instead of the lead frame shown in FIG. The substrate 10 may be a Flexible Printed Circuit Board (FPCB) made of a flexible material.

In addition, instead of the substrate 10, a synthetic resin substrate such as resin or glass epoxy or a ceramic substrate may be used in consideration of thermal conductivity.

In order to improve workability, the substrate 10 may be formed by partially or wholly selecting at least one of EMC (Epoxy Mold Compound), PI (polyimide), ceramic, graphene, glass synthetic fiber, Lt; / RTI >

1, a reflective encapsulant 30 according to some embodiments of the present invention may be formed on the substrate 10 and may reflect light emitted from the light emitting device 20 The reflection cup portion 30a may be formed.

The reflective encapsulant 30 may be at least one selected from the group consisting of an epoxy resin composition, a silicone resin composition, a modified epoxy resin composition, a modified silicone resin composition, a polyimide resin composition, a modified polyimide resin composition, a polyphthalamide (PPA), a polycarbonate resin , Polyphenylene sulfide (PPS), liquid crystal polymer (LCP), ABS resin, phenol resin, acrylic resin, PBT resin, and combinations thereof. These resins may also contain light reflecting materials such as titanium oxide, silicon dioxide, titanium dioxide, zirconium dioxide, potassium titanate, alumina, aluminum nitride, boron nitride, mullite, chromium, have

The reflective encapsulant 30 may be made of at least one selected from the group consisting of EMC including a reflective material, white silicon containing a reflective material, a photoimageable solder resist (PSR), and combinations thereof.

In addition, at least one of the air gap, the resin layer, the light-transmitting resin layer, the fluorescent material, and the combination thereof may be selected and filled in the reflection cup portion 30a.

Also, as shown in FIG. 1, the reflection cup portion 30a may be filled with the filling member 40. FIG.

More specifically, for example, the filling member 40 may be formed of a light transmitting member such as a silicone resin composition, a modified epoxy resin composition such as a silicone modified epoxy resin, a modified silicone resin composition such as an epoxy modified silicone resin, a polyimide resin composition, A resin such as polyimide resin composition, polyphthalamide (PPA), polycarbonate resin, polyphenylene sulfide (PPS), liquid crystal polymer (LCP), ABS resin, phenol resin, acrylic resin and PBT resin can be applied.

1, a light emitting device package 100 according to some embodiments of the present invention is formed on an upper surface or inside of the filling member 40 so as to be spaced apart from the light emitting device 20, A first light conversion sheet 50 for converting light generated in the light emitting device 20 and a second light conversion sheet 50 formed above the first light conversion sheet 50, And a second light conversion sheet 60 for converting light emitted from the light emitting device 20 or light generated from the light emitting device 20.

In addition, the first light conversion sheet 50 or the second light conversion sheet 60 may include a quantum dot (QD) or a fluorescent material.

More specifically, for example, the first light conversion sheet 50 or the second light conversion sheet 60 may be formed by mixing a fluorescent material with a quantum dot (QD).

In addition, the first light conversion sheet 50 and the second light conversion sheet 60 may include different quantum dots (QDs) or phosphors.

The quantum dot (QD) is composed of a core (3 to 10 nm) such as CdSe and InP, a shell (0.5 to 2 nm) such as ZnS and ZnSe, and a ligand for stabilizing the core and shell And may have optical characteristics that realize various colors depending on the size.

2 to 3, the first light conversion sheet 50 and the second light conversion sheet 60 may be formed of a plurality of or a single lenticular lens 50a, 60a or micro lens 51a, (61a).

Here, the shape of the lenticular lens 50a (60a) or the shape of the micro lenses 51a (61a) is one of a semicircular shape, a parabolic shape, a triangular shape, a pentagonal shape, and a polygonal shape, Or a resin material including a quantum dot (QD, Quantum Dot) or a phosphor.

2, the longitudinal direction of the lenticular lens 50a of the first light conversion sheet 50 and the longitudinal direction of the lenticular lens 60a of the second light conversion sheet 60 are They can be installed vertically overlapping each other.

The longitudinal direction of the lenticular lens 50a of the first light conversion sheet 50 and the longitudinal direction of the lenticular lens 60a of the second light conversion sheet 60 are overlapped with each other It may be installed.

In addition, the lenticular lens 50a may be formed such that a plurality of the light converters 50-2 are dispersed in the resin member 50-1.

For example, the lenticular lens 50a may be formed by injecting a plurality of light converters 50-2 into the resin member 50-1.

3, the longitudinal direction of the microlens 51a of the first light conversion sheet 50 and the longitudinal direction of the microlens 61a of the second light conversion sheet 60 are They can be installed vertically overlapping each other.

The longitudinal direction of the microlens 51a of the first light conversion sheet 50 and the longitudinal direction of the microlens 61a of the second light conversion sheet 60 are set so as to overlap with each other .

In addition, the microlenses 51a may be formed by dispersing a plurality of the light converters 51-2 in the resin member 51-1.

For example, the microlenses 51a may be formed by injecting a plurality of the light converters 51-2 of the resin member 51-1.

Figs. 4 to 5 are cross-sectional views showing a first light conversion sheet 52, 53 and a second light conversion sheet 62, 63 of the light emitting device package according to some other embodiments of the present invention.

4, the first light conversion sheet 52 and the second light conversion sheet 62 are arranged in the same direction as the longitudinal direction of the lenticular lens 52a of the first light conversion sheet 52, The longitudinal directions of the lenticular lenses 62a of the second light conversion sheet 62 may be the same direction.

Here, the first light conversion sheet (52) and the second light conversion sheet (62) may be provided by laminating a resin sheet having a convex shape in the same direction.

In addition, the lenticular lens 52a may be formed by dispersing a plurality of the light converters 52-2 in the resin member 52-1.

For example, the lenticular lens 52a may be formed by injecting a plurality of light converters 52-2 into the resin member 52-1.

5, the first light-converting sheet 53 and the second light-converting sheet 63 are arranged in parallel with the longitudinal direction of the microlens 53a of the first light- The longitudinal directions of the lenticular lenses 63a of the second light conversion sheet 63 may be the same direction.

Here, the first light conversion sheet 53 and the second light conversion sheet 63 may be provided by laminating a resin sheet in a direction in which the upper surface and the lower surface are parallel to each other.

In addition, the micro lenses 53a may be formed by dispersing a plurality of the light converters 53-2 in the resin member 53-1.

For example, the microlenses 53a may be formed by injecting a plurality of light converters 53-2 into the resin member 53-1.

6 to 7 are cross-sectional views showing a first light conversion sheet 54 (55) and a second light conversion sheet 64 (65) of a light emitting device package according to still another embodiment of the present invention.

6, the first light conversion sheet 54 and the second light conversion sheet 64 are disposed in the same direction as the longitudinal direction of the lenticular lens 64a of the first light conversion sheet 54, The lenticular lenses 64a of the second light conversion sheet 64 may have a convex shape in the direction in which the longitudinal directions of the lenticular lenses 64a are opposite to each other.

In addition, the lenticular lens 54a may be formed by dispersing a plurality of the light converters 54-2 in the resin member 54-1.

For example, the lenticular lens 54a may be formed by injecting a plurality of light converters 54-2 into the resin member 54-1.

7, the first light-converting sheet 55 and the second light-converting sheet 65 are arranged in parallel with the longitudinal direction of the microlens 55a of the first light- The resin sheets may be stacked in the direction in which the longitudinal directions of the microlenses 65a of the second light conversion sheet 65 are the same direction and the lower surfaces thereof face each other.

In addition, the microlens 55a may be formed by dispersing a plurality of the light converters 55-2 in the resin member 55-1.

For example, the microlenses 55a may be formed by injecting a plurality of light converters 55-2 into the resin member 55-1.

Accordingly, since the light emitting device package 100 according to some embodiments of the present invention can have a shape in which a small amount of the light converters are efficiently dispersed, when a quantum dot (QD) is used as a light converter, QD, and Quantum Dot) and an efficient light dispersion effect.

Therefore, the first light conversion sheet 50 and the second light conversion sheet 60 according to some embodiments of the present invention can be installed in a package by separating quantum dots (QDs) from the light emitting elements, The reliability of the light emitting device package can be improved because no discoloration phenomenon occurs in which the sulfur component in the quantum dot (QD, Quantum Dot) reacts with the silver component plated on the electrode mold of the light emitting device package.

8 is a cross-sectional view illustrating a light emitting device package 200 according to some other embodiments of the present invention.

8, the light emitting device package 200 includes a substrate 10, a light emitting device 20, a reflective encapsulant 30, a filling member 40, a first light conversion sheet 50, 2 light conversion sheet 60, and a diffusion member 70. [

Here, the substrate 10, the light emitting device 20, the reflective encapsulant 30, the filling member 40, the first light conversion sheet 50, The light emitting device package 60 may have the same configuration and function as those of the light emitting device packages 100 according to the embodiments of the present invention shown in FIG. Therefore, detailed description is omitted.

Further, the diffusion member 70 is formed above the second light conversion sheet 60, and the point light source can be diffused into the surface light source.

The diffusing member 70 may diffuse and diffuse the light emitted from at least one of the light emitting device 20, the first light conversion sheet 50, and the second light conversion sheet 60 , A light diffusion pattern may be formed on the light incidence surface 70a or the light exiting surface 70b.

More specifically, for example, the light diffusion pattern may be formed by at least one of a super-precision cutting process, lithography, thermal press transfer, or laser processing.

Therefore, the diffusion member 70 may be formed of at least one of a point light source type light emitted from at least one of the light emitting device 20, the first light conversion sheet 50, and the second light conversion sheet 60, It can be provided in the form of a light source.

Therefore, the light emitting device package 200 having a high light conversion efficiency with a small amount of the light conversion member can be provided.

9 is a cross-sectional view illustrating a light emitting device package 300 according to still another embodiment of the present invention.

9, the light emitting device package 300 may further include a heat insulating layer 80 and a protective layer 90. [

Specifically, for example, the heat insulating layer 80 is formed below the first light conversion sheet 50 or the second light conversion sheet 60, and the first light conversion sheet 60, The heat transmitted to the sheet 50 or the second light conversion sheet 60 may be blocked.

Therefore, the heat insulating layer 80 is formed of a material having a low thermal conductivity and is positioned below the quantum dot (QD) and can be transmitted from the light emitting element 20 to the quantum dot (QD) (QD, Quantum Dot) in the heat can be protected by intercepting the heat.

Specifically, for example, the protective layer 90 may be formed above the heat insulating layer 80 and the first light conversion sheet 50 or the second light conversion sheet 60. [

Therefore, the protective layer 90 protects the first light conversion sheet 50 or the second light conversion sheet 60 from at least one of at least air, moisture, foreign matter, heat, and combinations thereof. .

1, a backlight unit 1000 according to some embodiments of the present invention includes a substrate 10, a light emitting device 20, a reflective encapsulant 30, a charging member 40, A first light conversion sheet 50, a second light conversion sheet 60, and a light guide plate 110. [

More specifically, for example, the backlight unit 1000 includes a substrate 10, a light emitting element 20 mounted on the substrate 10, and a light emitting element 20 formed on the substrate 10, A reflective encapsulant 30 on which the reflective cup portion 30a is formed so as to reflect light emitted from the reflective cup portion 30a, a filling member 40 to be filled in the reflective cup portion 30a, A first light conversion sheet 50 formed on or in the upper surface of the filling member 40 for converting light generated in the light emitting device 20 into light, A second light conversion sheet 60 for converting light converted from the first light conversion sheet 50 or light generated from the light emitting element 20 and a second light conversion sheet 60 formed on the first light conversion sheet and / Or a light guide plate (110) for guiding light passing through the second light conversion sheet, and the first light conversion sheet (50) and the second light conversion sheet Conversion sheet 60 may be a plurality of lenticular lens or a microlens shape.

Here, the substrate 10, the light emitting device 20, the reflective encapsulant 30, the filling member 40, the first light conversion sheet 50, The light emitting device package 60 may have the same configuration and function as those of the light emitting device packages 100, 200, and 300 according to various embodiments of the present invention shown in FIGS. Therefore, detailed description is omitted.

In addition, the light guide plate 110 may be an optical member that can be made of a light-transmitting material to guide light converted from the light emitting device 20.

The light guide plate 110 may be installed in an optical path of light generated by the light emitting device 20 to transmit light generated by the light emitting device 20 over a wider area.

The light guide plate 110 may be made of polycarbonate, polysulfone, polyacrylate, polystyrene, polyvinyl chloride, polyvinyl alcohol, polynorbornene, polyester, or the like , And various light transmitting resin materials may be applied. In addition, the light guide plate 110 may be formed by various methods such as forming fine patterns, fine protrusions, diffusion films, or the like on the surface, or forming fine bubbles therein.

Although not shown, various diffusion sheets, prism sheets, filters, and the like may be additionally provided above the light guide plate 110. In addition, various display panels such as an LCD panel may be installed above the light guide plate 110. [

Meanwhile, although not shown, the present invention may include a lighting device or a display device including the light emitting device package 100 (200) 300 described above. Here, the components of the illumination device or the display device according to some embodiments of the present invention may have the same configuration and function as those of the above-described light emitting device package of the present invention. Therefore, detailed description is omitted.

While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the invention. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.

10: substrate
20: Light emitting element
30: Reflective bag material
40: Charging member
50: first light conversion sheet
50a: Lenticular lens
51a: Micro lens
60: second light conversion sheet
60a: Lenticular lens
61a: Micro lens
70: diffusion member
80: insulating layer
90: Protective layer
100: Light emitting device package
110: light guide plate
1000: Backlight unit

Claims (9)

Board;
A light emitting element mounted on the substrate;
A reflective encapsulant formed on the substrate and having reflective cups to reflect light emitted from the encapsulant;
A filling member filled in the reflection cup portion;
A first light conversion sheet formed on an upper surface or inside of the filling member so as to be spaced apart from the light emitting device and photo-converting light generated from the light emitting device; And
And a second light conversion sheet formed above the first light conversion sheet and photo-converting the light converted in the first light conversion sheet or the light generated in the light emitting element,
Wherein the first light conversion sheet and the second light conversion sheet are in the form of a plurality of lenticular lenses or microlenses,
Wherein the longitudinal direction of the lenticular lens or the microlens of the first light conversion sheet and the longitudinal direction of the lenticular lens or the microlens of the second light conversion sheet are vertically overlapped with each other. The method according to claim 1,
Wherein the first light conversion sheet or the second light conversion sheet comprises a quantum dot or a fluorescent material. The method according to claim 1,
The lenticular lens or the microlens shape may be a lenticular lens or a micro lens made of a resin material having a semi-circular shape, a parabolic shape, a triangular shape, a rectangular shape, or a polygonal shape in cross section, Gt; a < / RTI > shape. delete The method according to claim 1,
A diffusion member formed above the second light conversion sheet and diffusing the point light source into a surface light source;
Emitting device package. 6. The method of claim 5,
Wherein the diffusion member
Wherein a light diffusion pattern is formed on an incoming or outgoing surface so as to diffuse and diffuse the light emitted from at least one of the light emitting element, the first light conversion sheet and the second light conversion sheet. The method according to claim 6,
Wherein the light diffusion pattern is formed by at least one of super precision cutting, lithography, thermal press transfer, and laser processing. The method according to claim 1,
A heat insulating layer formed below the first light conversion sheet or the second light conversion sheet to block heat transmitted from the light emitting element to the first light conversion sheet or the second light conversion sheet; And
And a protection member which is formed above the first light conversion sheet or the second light conversion sheet and protects the first light conversion sheet or the second light conversion sheet from at least one of external air, moisture, foreign matter, layer;
Emitting device package. Board;
A light emitting element mounted on the substrate;
A reflective encapsulant formed on the substrate and having reflective cups to reflect light emitted from the encapsulant;
A filling member filled in the reflection cup portion;
A first light conversion sheet formed on an upper surface or inside of the filling member so as to be spaced apart from the light emitting device and photo-converting light generated from the light emitting device;
A second light conversion sheet formed above the first light conversion sheet and photo-converting the light converted in the first light conversion sheet or the light generated in the light emitting element; And
And a light guide plate for guiding light passing through the first light conversion sheet and / or the second light conversion sheet,
Wherein the first light conversion sheet and the second light conversion sheet are in the form of a plurality of lenticular lenses or microlenses,
Wherein the longitudinal direction of the lenticular lens or the microlens of the first light conversion sheet and the longitudinal direction of the lenticular lens or the microlens of the second light conversion sheet are vertically overlapped with each other.

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