KR101567927B1 - Surface light source displayer, illumination device and backlight unit having it - Google Patents

Abstract

The present invention relates to a surface light source display device capable of realizing an LED as a point light source as a planar light source and thinning the product thickness and preventing an unevenness phenomenon, a luminance deviation, a color deviation, Device and a backlight unit having the same, the device comprising: a substrate; A first light emitting element that is seated on the substrate; A second light emitting device mounted on the substrate, the second light emitting device being spaced apart from the first light emitting device so as to form a space therebetween; And a light guide member for guiding light emitted from the first light emitting device and the second light emitting device toward the spaced space so as to emit light to the outside through the spacing space.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface light source display device, a lighting device, and a backlight unit having the same,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a planar light source display device, an illumination device, and a backlight unit having the planar light source display device, and more particularly, A backlight unit having the same, a lighting device, and a backlight unit having the same.

A light emitting diode (LED) is a kind of semiconductor device that can emit light of various colors by forming a light emitting source through the formation of a PN diode of a compound semiconductor. Such a light emitting device has a long lifetime, can be reduced in size and weight, has a strong directivity of light, and can be driven at a low voltage. These LEDs are resistant to shocks and vibrations, do not require preheating time and complicated driving, can be packaged after being mounted on various types of boards or lead frames, so they are modularized for various purposes and applied to various lighting devices and display devices can do.

1. Published Patent Application No. 10-2011-0080514 (July 13, 2011) 2. Open Patent Publication No. 10-2007-0068175 (June 29, 2007) 3. Registration Patent Publication No. 10-0906010 (July 6, 2009)

The direct-type light emitting device package widely used in the backlight unit can widely disperse light generated from the light emitting device package through the secondary lens so as to reduce the thickness of the unit and uniformly irradiate the light to the light guide plate.

However, in the conventional light emitting device package, the overall thickness of the product is increased by inserting a specific device such as the secondary lens, and there is a limitation in making the product slimmer and lighter and making a flexible product, The brightness and the color deviation of the lens are deteriorated and the optical characteristics are lowered to cause the unevenness or the uniformity of the light irradiated to the light guide plate or the display panel to be remarkably decreased, And the like.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and it is an object of the present invention to provide a point light source in which a second light source is guided to a surface light source, The thickness of the product can be reduced, the product can be made slimmer, lighter, and more flexible, and the moldability is excellent. Also, the optical characteristics can be improved by preventing the mura phenomenon, luminance deviation and color deviation of the display device, A backlight unit having the same, and a planar light source display device, a lighting device, and a backlight unit having the same. However, these problems are exemplary and do not limit the scope of the present invention.

According to an aspect of the present invention, there is provided a surface light source display device including: a substrate; A first light emitting element that is seated on the substrate; A second light emitting device mounted on the substrate, the second light emitting device being spaced apart from the first light emitting device so as to form a space therebetween; And a light guide member for guiding light emitted from the first light emitting device and the second light emitting device toward the spaced space so as to emit light to the outside through the spacing space.

According to an aspect of the present invention, the surface light guiding member may include: a first reflective layer disposed above the first light emitting device and the second light emitting device; And a second reflective layer provided on an upper surface of the substrate.

According to an aspect of the present invention, the first reflective layer may completely cover the upper surface of the first light emitting element and the upper surface of the second light emitting element, respectively.

According to an aspect of the present invention, the light emitting device may further include a side fluorescent member disposed on a side surface of each of the first and second light emitting devices.

According to an aspect of the present invention, the first reflective layer may include: a 1-1 reflective layer disposed vertically above the first light emitting device; And a 1-1 second reflective layer disposed vertically above the second light emitting device, wherein the 1-1 reflective layer has an area equal to or larger than the size of the first light emitting device, And the 1-2 reflection layer may have the same size as the size of the second light emitting device or an area larger than the size of the second light emitting device.

According to an aspect of the present invention, the light emitting device may further include a top phosphor disposed on the top surface of the first light emitting device and the top surface of the second light emitting device, respectively.

Further, according to an aspect of the present invention, the first reflective layer may be one in which the total reflection paste is applied.

According to an aspect of the present invention, a reflective wall may be formed on a rim of the substrate.

According to an aspect of the present invention, the substrate is a flexible printed circuit board, and a translucent encapsulant or a filter is provided above the surface light guide member.

According to another aspect of the present invention, there is provided a backlight unit comprising: a substrate; A first light emitting element that is seated on the substrate; A second light emitting device mounted on the substrate, the second light emitting device being spaced apart from the first light emitting device so as to form a space therebetween; A light guide member for guiding light emitted from the first light emitting device and the second light emitting device toward the spacing space so as to emit light to the outside through the spacing space; And a light guide plate provided above the light guide member.

According to an aspect of the present invention, there is provided a lighting apparatus comprising: a substrate; A first light emitting element that is seated on the substrate; A second light emitting device mounted on the substrate, the second light emitting device being spaced apart from the first light emitting device so as to form a space therebetween; And a light guide member for guiding light emitted from the first light emitting device and the second light emitting device toward the spaced space so as to emit light to the outside through the spacing space.

According to some embodiments of the present invention as described above, the thickness of the product can be reduced, the point light source can be changed to the surface light source, and the optical characteristics of the product can be improved, thereby preventing product defects. Of course, the scope of the present invention is not limited by these effects.

1 is a cross-sectional view illustrating a planar light source display device according to some embodiments of the present invention.
2 is an enlarged cross-sectional view showing an enlarged side view phosphor of the planar light source display device of FIG.
3 is a plan view of the planar light source display device of FIG.
4 is an enlarged cross-sectional view showing a top surface phosphor of the planar light source display device according to another example of FIG.
5 is an enlarged sectional view showing a first reflective layer of a planar light source display device according to another example of FIG.
FIG. 6 is an enlarged cross-sectional view illustrating a side surface phosphor and a top surface phosphor of the planar light source display device according to another example of FIG. 2;
7 is a cross-sectional view showing a backlight unit having a surface light source display device according to some embodiments of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

The embodiments of the present invention are described in order to more fully explain the present invention to those skilled in the art, and the following embodiments may be modified in various other forms, The present invention is not limited to the embodiment. Rather, these embodiments are provided so that this disclosure will be more thorough and complete, and will fully convey the concept of the invention to those skilled in the art. In the drawings, the thickness and size of each layer are exaggerated for convenience and clarity of explanation.

It is to be understood that throughout the specification, when an element such as a film, region or substrate is referred to as being "on", "connected to", "laminated" or "coupled to" another element, It will be appreciated that elements may be directly "on", "connected", "laminated" or "coupled" to another element, or there may be other elements intervening therebetween. On the other hand, when one element is referred to as being "directly on", "directly connected", or "directly coupled" to another element, it is interpreted that there are no other components intervening therebetween do. Like numbers refer to like elements. As used herein, the term "and / or" includes any and all combinations of one or more of the listed items.

Although the terms first, second, etc. are used herein to describe various elements, components, regions, layers and / or portions, these members, components, regions, layers and / It is obvious that no. These terms are only used to distinguish one member, component, region, layer or section from another region, layer or section. Thus, a first member, component, region, layer or section described below may refer to a second member, component, region, layer or section without departing from the teachings of the present invention.

Also, relative terms such as "top" or "above" and "under" or "below" can be used herein to describe the relationship of certain elements to other elements as illustrated in the Figures. Relative terms are intended to include different orientations of the device in addition to those depicted in the Figures. For example, if the element is inverted in the figures, the elements depicted as being on the upper surface of the other elements will have a direction on the lower surface of the other elements. Thus, the example "top" may include both "under" and "top" directions depending on the particular orientation of the figure. If the elements are oriented in different directions (rotated 90 degrees with respect to the other direction), the relative descriptions used herein can be interpreted accordingly.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms "a," "an," and "the" include singular forms unless the context clearly dictates otherwise. Also, " comprise "and / or" comprising "when used herein should be interpreted as specifying the presence of stated shapes, numbers, steps, operations, elements, elements, and / And does not preclude the presence or addition of one or more other features, integers, operations, elements, elements, and / or groups.

Hereinafter, embodiments of the present invention will be described with reference to the drawings schematically showing ideal embodiments of the present invention. In the figures, for example, variations in the shape shown may be expected, depending on manufacturing techniques and / or tolerances. Accordingly, the embodiments of the present invention should not be construed as limited to the particular shapes of the regions shown herein, but should include, for example, changes in shape resulting from manufacturing.

1 is a sectional view showing a planar light source display device 100 according to some embodiments of the present invention. 2 is an enlarged sectional view showing an enlarged view of the side fluorescent lamp 40 of the planar light source display device 100 of FIG. 1, and FIG. 3 is a plan view of the planar light source display device 100 of FIG.

1, a planar light source display apparatus 100 according to some embodiments of the present invention includes a substrate 10, a first light emitting element 21, a second light emitting element 22 And a light guide member 30.

Here, the substrate 10 may be made of a material having a suitable mechanical strength and insulation and a conductive material so as to support the first light emitting device 21 and the second light emitting device 22.

A reflection wall 11 may be formed on the rim of the substrate 10 to reflect light of the first light emitting device 21 and the second light emitting device 22. Here, the reflective wall 11 may be made of the same material as the first reflective layer 31 and the second reflective layer 32, or may be made of different materials.

For example, the substrate 10 may be a printed circuit board (PCB) having a plurality of epoxy resin sheets formed thereon. The substrate 10 may be a Flexible Printed Circuit Board (FPCB) made of a flexible material.

In addition, the substrate 10 may be a synthetic resin substrate such as a resin or a glass epoxy or a ceramic substrate in consideration of a thermal conductivity. In addition, the substrate 10 may be formed of an insulating material such as aluminum, copper, zinc, tin, A metal substrate such as silver can be applied, and a plate or a lead frame substrate can be applied.

More specifically, the substrate 10 may be a flat plate type metal substrate including a relatively inexpensive material such as aluminum, iron, or copper, and the surface of the substrate 10 may be subjected to various oxidation processes Various insulating layers 12 and a reflective layer to be described later can be formed.

In addition, the substrate 10 may be made of at least one selected from EMC (Epoxy Mold Compound), PI (polyimide), ceramic, graphene, glass synthetic fiber and combinations thereof in order to improve workability have.

The first light emitting device 21 may be a flip chip type LED mounted on a part of the substrate 10.

The second light emitting device 22 is mounted on another portion of the substrate 10 and is spaced apart from the first light emitting device 21 so that a space A is formed therebetween. Type LED.

Here, the first light emitting device 21 and the second light emitting device 22 may be respectively mounted on the substrate 10 so as to be spaced apart from each other. The first light emitting device 21 and the second light emitting device 22 may be at least one or more, It is also possible to emit light of a wavelength.

The first light emitting device 21 and the second light emitting device 22 may be formed of a semiconductor. For example, LEDs of blue, green, red, and yellow light emission, and LEDs of ultraviolet light emission, which are made of a nitride semiconductor, can be applied. The nitride semiconductor is represented by a general formula Al _x Ga _y In _z N (0? X? 1, 0? Y? 1, 0? Z? 1, x + y + z = 1).

The first light emitting device 21 and the second light emitting device 22 are formed on a sapphire substrate or a silicon carbide substrate for growth by a vapor phase growth method such as MOCVD or the like using InN, AlN, InGaN , AlGaN, InGaAlN, and the like can be epitaxially grown. The first light emitting device 21 and the second light emitting device 22 may be formed using semiconductors such as ZnO, ZnS, ZnSe, SiC, GaP, GaAlAs, and AlInGaP in addition to the nitride semiconductor. These semiconductors can be stacked in the order of an n-type semiconductor layer, a light emitting layer, and a p-type semiconductor layer. The light emitting layer (active layer) may be a laminated semiconductor having a multiple quantum well structure or a single quantum well structure or a laminated semiconductor having a double hetero structure. Further, the light emitting device 30 can be selected to have an arbitrary wavelength depending on applications such as display use and illumination use.

Here, as the growth substrate, an insulating, conductive or semiconductor substrate may be used if necessary. For example, the growth substrate may be sapphire, SiC, Si, MgAl 2 O 4, MgO, LiAlO 2, LiGaO 2, GaN. A GaN substrate, which is a homogeneous substrate, is preferable for epitaxial growth of a GaN material, but a GaN substrate has a problem of high production cost due to its difficulty in manufacturing.

Sapphire and silicon carbide (SiC) substrates are mainly used as the different substrates. Sapphire substrates are more utilized than expensive silicon carbide substrates. When using a heterogeneous substrate, defects such as dislocation are increased due to the difference in lattice constant between the substrate material and the thin film material. Also, due to the difference in the thermal expansion coefficient between the substrate material and the thin film material, warping occurs at a temperature change, and warping causes a crack in the thin film. This problem may be reduced by using a buffer layer between the substrate and the GaN-based light emitting laminate.

In addition, the substrate for growth may be completely or partially removed or patterned in order to improve the optical or electrical characteristics of the LED chip before or after the growth of the LED structure.

For example, in the case of a sapphire substrate, the substrate can be separated by irradiating the laser to the interface with the semiconductor layer through the substrate, and the silicon or silicon carbide substrate can be removed by a method such as polishing / etching.

Another supporting substrate may be used for removing the growth substrate. In order to improve the light efficiency of the LED chip on the opposite side of the growth substrate, the supporting substrate may be bonded using a reflective metal, As shown in FIG.

In addition, patterning of the growth substrate improves the light extraction efficiency by forming irregularities or slopes before or after the LED structure growth on the main surface (front surface or both sides) or side surfaces of the substrate. The size of the pattern can be selected from the range of 5 nm to 500 μm and it is possible to make a structure for improving the light extraction efficiency with a rule or an irregular pattern. Various shapes such as a shape, a column, a mountain, a hemisphere, and a polygon can be adopted.

In the case of the sapphire substrate, the crystals having a hexagonal-rhombo-cubic (Hexa-Rhombo R3c) symmetry have lattice constants of 13.001 and 4.758 in the c-axis direction and the a-axis direction, respectively, and have C plane, A plane and R plane. In this case, the C-plane is relatively easy to grow the nitride film, and is stable at high temperature, and thus is mainly used as a substrate for nitride growth.

Another material of the growth substrate is a Si substrate, which is more suitable for large-scale curing and relatively low in cost, so that mass productivity can be improved.

In addition, since the silicon (Si) substrate absorbs light generated from the GaN-based semiconductor and the external quantum efficiency of the light emitting device is lowered, the substrate may be removed as necessary, and Si, Ge, SiAl, A support substrate such as a metal substrate is further formed and used.

When a GaN thin film is grown on a different substrate such as the Si substrate, the dislocation density increases due to the lattice constant mismatch between the substrate material and the thin film material, and cracks and warpage Lt; / RTI > The buffer layer may be disposed between the growth substrate and the light emitting stack for the purpose of preventing dislocation and cracking of the light emitting stack. The buffer layer also functions to reduce the scattering of the wavelength of the wafer by adjusting the degree of warping of the substrate during the growth of the active layer.

Herein, the buffer layer may be made of Al _x In _y Ga _1-xy N (0? X? 1, 0? _Y? 1, x + y? 1), in particular GaN, AlN, AlGaN, InGaN or InGaNAlN. Materials such as ZrB2, HfB2, ZrN, HfN and TiN can also be used as needed. Further, a plurality of layers may be combined, or the composition may be gradually changed.

Although not shown, the first light emitting device 21 and the second light emitting device 22 may be flip chip type light emitting devices having signal transmission media such as bumps, pads, and solders, Various types of light emitting devices such as a vertical type and a horizontal type having a signal transmission medium can be applied.

The light guide member 30 may be configured to guide the light emitted from the first light emitting device 21 and the second light emitting device 22 to the outside through the spacing space A, May be a member for guiding in the direction of the spacing space (A).

1 to 3, the surface light guiding member 30 may include a first reflective layer 31 and a second reflective layer 32. In addition,

That is, the first reflective layer 31 may be a reflective layer disposed above each of the first and second light emitting devices 21 and 22. Further, the first reflective layer 31 may be coated with a total reflection paste.

The second reflective layer 32 may be a reflective layer disposed on the upper surface of the substrate 10.

For example, as shown in FIGS. 1 and 2, the first reflective layer 31 completely covers the upper surface of the first light emitting device 21 and the upper surface of the second light emitting device 22, respectively The first light emitting device 21 may reflect the light generated upward from the first light emitting device 21 to the lower side or the side of the first light emitting device 21, And may reflect the light generated above the second light emitting element 22 in the element 22 to the lower side or the side of the second light emitting element 21.

1 and 2, the second reflective layer 32 is in contact with a lower surface of the first light emitting device 21 and a lower surface of the second light emitting device 22, The first light emitting device 21 may function to reflect light generated below the first light emitting device 21 to the upper side or the side of the first light emitting device 21, The second light emitting device 22 may reflect the light generated below the second light emitting device 21 to the upper side or the side of the second light emitting device 22.

The first reflective layer 31 and the second reflective layer 32 may include at least one selected from the group consisting of platinum, gold, mercury, chromium, and combinations thereof having high reflectance .

The first reflective layer 31 and the second reflective layer 32 may be formed of at least one of EMC, epoxy resin composition, silicone resin composition, modified epoxy resin composition, modified silicone resin composition, polyimide resin composition, modified polyimide resin composition (PPA), a polycarbonate resin, a polyphenylene sulfide (PPS), a liquid crystal polymer (LCP), an ABS resin, a phenol resin, an acrylic resin, a PBT resin, a Bragg reflection layer, , A total reflection layer, a metal layer, and a combination thereof.

2, the light emitted from the first light emitting device 21 and the second light emitting device 22 is reflected by the first and second reflective layers 31 and 32, The first reflective layer 31 and the second reflective layer 32 can be guided laterally.

1 and 2, the surface light source display device 100 according to some embodiments of the present invention may be configured to convert the sidewise-directed light into a white color or an intended color, The light emitting device 21 and the second light emitting device 22 may further include a side fluorescent member 40 disposed on a side surface of the second light emitting device 22, respectively.

Here, the side fluorescent material 40 may have the following composition formula and color.

Oxide system: yellow and green Y3Al5O12: Ce, Tb3Al5O12: Ce, Lu3Al5O12: Ce

(Ba, Sr) 2SiO4: Eu, yellow and orange (Ba, Sr) 3SiO5: Ce

Eu, Sr2Si5N8: Eu, SrSiAl4N7: Eu, Eu3O3: Eu, Eu3O3: Eu,

The composition of the side surface fluorescent material 40 should basically correspond to stoichiometry and each element may be substituted with other elements in each group on the periodic table. For example, Sr can be substituted with Ba, Ca, Mg, etc. of the alkaline earth (II) group, and Y can be replaced with lanthanum series of Tb, Lu, Sc, Gd and the like. Ce, Tb, Pr, Er, Yb and the like, and the active agent may be used alone or as a negative active agent for the characteristic modification.

As a substitute material for the side fluorescent material 40, materials such as a quantum dot may be used, and a fluorescent material and QD may be mixed with the LED or may be used alone.

QD can be composed of a core (3 to 10 nm) such as CdSe and InP, a shell (0.5 to 2 nm) such as ZnS and ZnSe, and a ligand for stabilizing the core and the shell. Can be implemented.

The coating method of the side fluorescent material 40 or the quantum dot may be roughly divided into a method of being applied to an LED chip or a light emitting element, a method of covering a film form, a method of attaching a sheet form such as a film or a ceramic fluorescent material, You can use one.

Dispensing and spray coating are common methods of spraying, and dispensing includes mechanical methods such as pneumatic method and screw, linear type. It is also possible to control the amount of dyeing through a small amount of jetting by means of a jetting method and control the color coordinates thereof. The method of collectively applying the phosphor on the wafer level or the light emitting device substrate by the spray method can easily control productivity and thickness.

The method of directly covering the light emitting device or the LED chip in a film form can be applied by a method of electrophoresis, screen printing or phosphor molding, and the method can be different according to necessity of application of the side of the LED chip.

In order to control the efficiency of the long-wavelength light-emitting phosphor that reabsers light emitted from a short wavelength among two or more kinds of phosphors having different emission wavelengths, two or more kinds of phosphor layers having different emission wavelengths can be distinguished. A DBR (ODR) layer may be included between each layer to minimize absorption and interference.

In order to form a uniform coating film, the phosphor may be formed into a film or ceramic form and then attached onto the LED chip or the light emitting device.

In order to make a difference in light efficiency and light distribution characteristics, a photoelectric conversion material may be located in a remote format. In this case, the photoelectric conversion material is located together with a transparent polymer, glass, or the like depending on its durability and heat resistance.

Since the phosphor coating technique plays a major role in determining the optical characteristics in the light emitting device, control techniques such as the thickness of the phosphor coating layer and the uniform dispersion of the phosphor have been studied variously. QD can also be placed in the LED chip or the light emitting element in the same manner as the phosphor, and can be positioned between the glass or translucent polymer material for light conversion.

2, the first light emitting device 21 and the second light emitting device 22 (hereinafter, referred to as " second light emitting device " Is repeatedly reflected between the first reflective layer 31 and the second reflective layer 32 so that the light emitted from the first reflective layer 31 and the second reflective layer 32 ). ≪ / RTI >

Subsequently, the light emitted from the side fluorescent material 40 is converted into wavelength and color by the side fluorescent material 40, and is emitted as a planar light source through the spacing space A.

Therefore, by using the first reflection layer 31 and the second reflection layer 32, a point light source can be changed to change the surface light source, thereby eliminating the need for a separate secondary lens, reducing the thickness of the product, The conventional mura phenomenon, luminance deviation and color deviation which are concentrated on the first light emitting device 21 and the second light emitting device 22 can be prevented to improve the optical characteristics, Can be produced.

4 is an enlarged sectional view showing the top surface phosphor 50 of the planar light source display device according to another example of FIG.

4, the first reflective layer 31 includes a 1-1 reflective layer 31-1 disposed vertically above the first light emitting element 21, And a first-second reflective layer 31-2 provided vertically above the first reflective layer 31-2.

4, the 1-1 reflective layer 31-1 has the same size as that of the first light emitting device 21, and the 1-2 reflective layer 31-2 has the same size as the first light emitting device 21, May be the same as the size of the second light emitting device 22.

The first reflective layer 31-1 and the second reflective layer 31-2 may have a length L1 equal to the length L1 of the first light emitting device 21, have.

The upper fluorescent material 50 may be provided on the upper surface of the first light emitting device 21 and the upper surface of the second light emitting device 22, respectively.

Therefore, the light from the first light emitting device 21 and the second light emitting device 22, which are directed upward of the first light emitting device 21 and the second light emitting device 22, are reflected several times, Can be released.

At this time, the light emitted from the first light emitting device 21 and the second light emitting device 22 may be changed to white or a desired color by the upper surface fluorescent material 50 or may be emitted to the outside by increasing the light efficiency.

5 is an enlarged sectional view showing a first reflective layer 31 of the planar light source display device according to still another example of FIG.

5, the 1-1 reflective layer 31-1 has an area larger than the size of the first light emitting device 21, and the 1-2 reflective layer 31-2 also has an area larger than that of the first light emitting device 21, May have an area larger than that of the second light emitting device 22.

The first reflective layer 31-1 and the first reflective layer 31-2 may have a length L2 greater than the length L1 of the first light emitting device 21, have.

FIG. 6 is an enlarged sectional view showing a side surface and an upper surface phosphor 60 of the planar light source display device according to another example of FIG.

As shown in FIG. 6, a side surface and an upper surface phosphor of the first light emitting device 21 and a side surface and an upper surface phosphor 60 may be provided on a side surface and an upper surface of the second light emitting device 22, respectively.

Therefore, the light from the first light emitting device 21 and the second light emitting device 22, which are directed upward of the first light emitting device 21 and the second light emitting device 22, are reflected several times, The light emitted from the first light emitting device 21 and the second light emitting device 22 is changed to white or a desired color by the side and top phosphor 60 or light efficiency is increased And can be discharged to the outside.

1 and 3, a translucent encapsulant 70 and a filter 80 may be provided above the surface light guiding member 30. As shown in FIG.

Here, the translucent encapsulant 70 may be formed of a modified epoxy resin composition such as an epoxy resin composition, a silicone resin composition, or a silicone modified epoxy resin, a modified silicone resin composition such as an epoxy modified silicone resin, a polyimide resin composition, a modified polyimide resin A resin such as a polyphthalamide (PPA), a polycarbonate resin, a polyphenylene sulfide (PPS), a liquid crystal polymer (LCP), an ABS resin, a phenol resin, an acrylic resin and a PBT resin.

The filter 80 may be a protective sheet, a prism sheet, a polarizing filter, a diffusion filter, or the like.

7 is a cross-sectional view showing a backlight unit 200 having a surface light source display device according to some embodiments of the present invention.

7, a backlight unit 200 having a surface light source display device according to some embodiments of the present invention includes a substrate 10, a first light emitting device 21 A second light emitting device 22 mounted on the substrate 10 and spaced apart from the first light emitting device 21 so as to form a space A therebetween, A light guide member 30 for guiding light emitted from the first light emitting device 21 and the second light emitting device 22 in the direction of the spacing A so that light can be emitted to the outside through the first light emitting device 21 and the second light emitting device 22, And a light guide plate 90 provided above the light guide member 30.

Here, the substrate 10, the first light emitting device 21, the second light emitting device 22, and the surface light guiding member 30 are formed on the surface of the substrate 10 of the surface light source display device 100 The first light emitting device 21, the second light emitting device 22 and the surface light guiding member 30 may be the same as the first light emitting device 10, the first light emitting device 21, therefore. A detailed description thereof will be omitted.

The backlight unit 200 is installed on the LCD panel and projects light in the direction of the LCD panel. The backlight unit 200 is installed in a path of light generated from the light emitting device, have.

7, the light guide plate 90 is made of a material such as polycarbonate, polysulfone, polyacrylate, polystyrene, polyvinyl chloride, polyvinyl alcohol, polynorbornene , Polyester, and the like. In addition, materials of various translucent resin series may be applied. In addition, the light guide plate 90 may be formed by various methods such as forming fine patterns, fine protrusions, diffusion films, or the like on the surface, or forming fine bubbles therein.

The backlight unit 200 according to some embodiments of the present invention is a direct-type backlight unit in which the first light emitting device 21 and the second light emitting device 22 are installed below the light guide plate 50 .

On the other hand, although not shown, the present invention can include a lighting device including the above-described surface light source display device. Here, the components of the lighting device according to some embodiments of the present invention may have the same configuration and function as those of the above-described surface light source display device of the present invention. Therefore, detailed description is omitted.

While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the invention. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.

10: substrate
11: reflective wall
21: first light emitting element
22: second light emitting element
A: Spacing space
30:
31: First reflective layer
31-1: 1-1 reflective layer
31-2: 1-2 reflective layer
32: Second reflective layer
40: side phosphor
50: upper surface phosphor
60: side and top phosphor
70: Transparent encapsulant
80: Filter
90: light guide plate
100: plane light source display device
L1, L2: Length
200: Backlight unit

Claims (11)

Board;
A first light emitting element that is seated on the substrate;
A second light emitting device mounted on the substrate, the second light emitting device being spaced apart from the first light emitting device so as to form a space therebetween; And
And a surface light guiding member for guiding light emitted from the first light emitting device and the second light emitting device toward the spacing space so as to emit light to the outside through the spacing space,
The surface-
A first reflective layer disposed above each of the first light emitting device and the second light emitting device; And
And a second reflective layer provided on an upper surface of the substrate,
Wherein the first reflective layer is attached to the upper surface of the first light emitting device and the second light emitting device and reflects light emitted upward of the first light emitting device and the second light emitting device,
A surface light source display device. delete The method according to claim 1,
Wherein the first reflective layer completely covers the upper surface of the first light emitting element and the upper surface of the second light emitting element, respectively. The method according to claim 1,
A side surface fluorescent material disposed on a side surface of the first light emitting device and the side surface of the second light emitting device, respectively;
Further comprising: The method according to claim 1,
Wherein the first reflective layer comprises:
A 1-1 reflective layer attached vertically above the first light emitting device; And
A first-second reflective layer attached vertically above the second light emitting device;
/ RTI >
The first reflective layer has an area equal to or larger than a size of the first light emitting device,
Wherein the first and second reflective layers have an area equal to or larger than a size of the second light emitting device. 6. The method according to any one of claims 1 to 5,
An upper phosphor disposed on the upper surface of the first light emitting device and the upper surface of the second light emitting device, respectively;
Further comprising: The method according to claim 1,
Wherein the first reflective layer is coated with a total reflection paste. The method according to claim 1,
And a reflective wall is formed at an edge of the substrate. The method according to claim 1,
Wherein the substrate is a flexible printed circuit board,
Wherein a translucent encapsulant or a filter is provided above the surface light guide member. Board;
A first light emitting element that is seated on the substrate;
A second light emitting device mounted on the substrate, the second light emitting device being spaced apart from the first light emitting device so as to form a space therebetween;
A light guide member for guiding light emitted from the first light emitting device and the second light emitting device toward the spacing space so as to emit light to the outside through the spacing space; And
And a light guide plate provided above the light guide member,
The surface-
A first reflective layer disposed above each of the first light emitting device and the second light emitting device; And
And a second reflective layer provided on an upper surface of the substrate,
Wherein the first reflective layer is attached to the upper surface of the first light emitting device and the second light emitting device and reflects light emitted upward of the first light emitting device and the second light emitting device,
Backlight unit. Board;
A first light emitting element that is seated on the substrate;
A second light emitting device mounted on the substrate, the second light emitting device being spaced apart from the first light emitting device so as to form a space therebetween; And
And a surface light guiding member for guiding light emitted from the first light emitting device and the second light emitting device toward the spacing space so as to emit light to the outside through the spacing space,
The surface-
A first reflective layer disposed above each of the first light emitting device and the second light emitting device; And
And a second reflective layer provided on an upper surface of the substrate,
Wherein the first reflective layer is attached to the upper surface of the first light emitting device and the second light emitting device and reflects light emitted upward of the first light emitting device and the second light emitting device,
Lighting device.

Images