KR20200127063A - Light source module having reflector and manufacturing method of the same - Google Patents

Light source module having reflector and manufacturing method of the same Download PDF

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Publication number
KR20200127063A
KR20200127063A KR1020190050214A KR20190050214A KR20200127063A KR 20200127063 A KR20200127063 A KR 20200127063A KR 1020190050214 A KR1020190050214 A KR 1020190050214A KR 20190050214 A KR20190050214 A KR 20190050214A KR 20200127063 A KR20200127063 A KR 20200127063A
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South Korea
Prior art keywords
light source
sealing layer
reflective
light
backlight device
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KR1020190050214A
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Korean (ko)
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조우진
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희성전자 주식회사
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Priority to KR1020190050214A priority Critical patent/KR20200127063A/en
Priority to PCT/KR2019/009183 priority patent/WO2020222357A1/en
Priority to TW108132258A priority patent/TWI733185B/en
Priority to CN201910934934.5A priority patent/CN111856812A/en
Publication of KR20200127063A publication Critical patent/KR20200127063A/en

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0033—Means for improving the coupling-out of light from the light guide
    • G02B6/005—Means for improving the coupling-out of light from the light guide provided by one optical element, or plurality thereof, placed on the light output side of the light guide
    • G02B6/0055—Reflecting element, sheet or layer
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133605—Direct backlight including specially adapted reflectors
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0033—Means for improving the coupling-out of light from the light guide
    • G02B6/005—Means for improving the coupling-out of light from the light guide provided by one optical element, or plurality thereof, placed on the light output side of the light guide
    • G02B6/0051—Diffusing sheet or layer
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0065—Manufacturing aspects; Material aspects
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133606—Direct backlight including a specially adapted diffusing, scattering or light controlling members
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133608—Direct backlight including particular frames or supporting means
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133611—Direct backlight including means for improving the brightness uniformity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements
    • F21V31/005—Sealing arrangements therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/04—Optical design
    • F21V7/05—Optical design plane
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2202/00—Materials and properties
    • G02F2202/28—Adhesive materials or arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
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  • Crystallography & Structural Chemistry (AREA)
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Abstract

The present invention relates to an LED module for a backlight of a display device integrated with a reflection member and a manufacturing method thereof. A surface light source module of the present invention includes: a reflection member in which a plurality of light source holes making a predetermined interval are formed on a plate having high reflexibility; a sealing layer molded on an upper surface of the reflection member while sealing the light source holes to be integrated with the reflection member; a light shading member laminated on an upper surface of the sealing layer as reflection patterns are formed on positions corresponding to the light source holes; and a light source part combined with a lower surface of the reflection member such that a plurality of light sources are embedded on a substrate at predetermined intervals and the light sources are sealed by the sealing layer in the light source holes. The sealing layer is formed as molded transparent resin seals the inserted light sources after primary hardening, and is secondarily hardened.

Description

백라이트 장치용 면광원 모듈 및 그 제조방법{Light source module having reflector and manufacturing method of the same}A surface light source module for a backlight device and a manufacturing method thereof {Light source module having reflector and manufacturing method of the same}

본 발명은 디스플레이 장치에 관한 것으로, 더욱 상세하게는 반사부재가 일체로 형성되는 디스플레이 장치의 백라이트용 LED 모듈과 그 제조방법에 관한 것이다.The present invention relates to a display device, and more particularly, to an LED module for backlight of a display device in which a reflective member is integrally formed, and a method of manufacturing the same.

일반적으로 디스플레이 장치는 영상 신호를 전달받아 표시하는 장치로, TV나 모니터 등이 이에 속하며, 영상을 표시하기 위한 수단으로 액정표시장치(LCD : Liquid Crystal Display Device), 유기발광장치(OLED : Organic Light Emitting Display), 플라즈마표시장치(PDP : Plasma Display Panel) 등 다양한 장치가 이용되고 있다.In general, a display device is a device that receives and displays an image signal, and includes a TV or a monitor, and is a liquid crystal display device (LCD) and an organic light emitting device (OLED) as a means for displaying an image. Emitting Display), plasma display device (PDP: Plasma Display Panel), etc. are used.

LCD는 다른 표시장치와는 달리 그 자체에서 빛을 발하지 못하여, 고품질의 화상을 실현하기 위해서는 반드시 별도의 외부 광원을 필요로 한다. 따라서 LCD는 액정패널 외에 면광원의 백라이트 장치를 더 포함하고, 백라이트 장치가 액정패널로 고휘도의 광원을 균일하게 공급함으로써 양질의 화상을 구현하게 된다. 이와 같이 백라이트 장치는 LCD와 같은 디스플레이 장치의 화상을 실현하기 위한 면조명 장치를 말하며, 광원이 배치되는 위치에 따라 직하형(Direct Lighting type) 또는 측면형(Edge Lighting type) 백라이트 장치로 구분된다. 백라이트 장치의 광원으로는 소형, 저소비 전력, 고신뢰성 등의 장점을 갖는 발광다이오드(Light Emitting Diode, 이하 'LED'라 함)가 주로 이용되고 있다.Unlike other display devices, LCDs do not emit light on their own, and therefore require a separate external light source in order to realize high-quality images. Accordingly, the LCD further includes a backlight device of a surface light source in addition to the liquid crystal panel, and the backlight device uniformly supplies a high-intensity light source to the liquid crystal panel, thereby realizing a quality image. As described above, the backlight device refers to a surface lighting device for realizing an image of a display device such as an LCD, and is classified into a direct lighting type or an edge lighting type according to a position at which a light source is disposed. As a light source of a backlight device, a light emitting diode (hereinafter referred to as'LED') having advantages such as small size, low power consumption, and high reliability is mainly used.

도 1은 종래의 기술에 따라 제조된 LED 모듈을 나타낸 단면도이다.1 is a cross-sectional view showing an LED module manufactured according to the prior art.

직하형 백라이트 장치의 LED 모듈은, 기판(11) 상에 캐비티(cavity, 14)가 형성되도록 몰딩부(13)를 형성한 후, 캐비티(14) 내의 기판(11) 상에 LED 소자(12)를 다이 본딩(Die bonding) 및 와이어 본딩(Wire bonding)으로 실장하고, 캐비티(14) 내에 형광체가 분산된 실리콘 등의 수지를 충진하여 밀봉층(15)을 형성하는 방법으로 제조된다. 밀봉층(15)은 LED 소자(12)를 보호하고 파장을 변환시키는 기능을 하며, 수지의 충진은 디스펜싱 몰딩(Dispensing Molding)이나 스크린 프린팅(Screen Printing)이 적용되고 있다.In the LED module of the direct-type backlight device, after forming the molding part 13 so that a cavity 14 is formed on the substrate 11, the LED element 12 on the substrate 11 in the cavity 14 Is mounted by die bonding and wire bonding, and the sealing layer 15 is formed by filling the cavity 14 with a resin such as silicon in which the phosphor is dispersed. The sealing layer 15 functions to protect the LED element 12 and convert the wavelength, and the resin is filled by dispensing molding or screen printing.

이러한 제조 방법은 다수의 LED 소자(12)에 대하여 동시에 수지를 몰딩할 수 있어 대면적의 면광원 모듈을 제조하는데 유리한 장점이 있다.This manufacturing method has an advantage in manufacturing a large-area surface light source module since it is possible to simultaneously mold a resin for a plurality of LED elements 12.

그러나 종래의 LED 모듈 제조방법은, 겔 상태의 수지를 충진한 후 이를 경화시키는 과정으로 이루어지는데, 수지가 경화되는 과정에서 몰딩부(13)의 접촉면에 나타나는 표면 장력에 의하여 밀봉층(15) 표면에는 리플로우(reflow, 15a)가 발생된다. 밀봉층(15) 상면에 발생된 리플로우(15a)는 외부로 출사되는 광 특성을 왜곡시켜 결국 디스플레이 장치의 화질 저하를 초래한다.However, the conventional LED module manufacturing method consists of filling a gel-like resin and then curing it. In the process of curing the resin, the surface of the sealing layer 15 is caused by the surface tension that appears on the contact surface of the molding part 13. Reflow (15a) occurs. The reflow 15a generated on the upper surface of the sealing layer 15 distorts the characteristics of light emitted to the outside, resulting in deterioration of image quality of the display device.

또한, LED 모듈은 기판(11)에 인쇄되는 회로(11a)에 의하여 기판(11)과 몰딩부(13) 사이에 단차가 필연적으로 형성된다. 종래의 LED 모듈 제조방법은, 겔 상태의 수지를 고체 상태로 직접 경화시키는 과정에서 에어가 유입되어 단차 부분에서 기포(15b)가 쉽게 발생된다. 밀봉층(15) 내부에 발생된 기포(15b)는 LED 모듈의 내구성을 약화시키고, 밀봉층(15) 내부에서 광 손실을 초래하며, 밀봉층(15)에서 출사되는 광특성을 왜곡시킨다. 따라서 기포(15b)를 제거하기 위한 탈포 공정이 더 진행되어야 하는 문제점이 있다. Further, in the LED module, a step is inevitably formed between the substrate 11 and the molding portion 13 by the circuit 11a printed on the substrate 11. In the conventional LED module manufacturing method, air is introduced in the process of directly curing the gel-like resin into a solid state, so that bubbles 15b are easily generated in the stepped portion. Bubbles 15b generated inside the sealing layer 15 weaken the durability of the LED module, cause light loss inside the sealing layer 15, and distort the optical characteristics emitted from the sealing layer 15. Therefore, there is a problem in that the degassing process for removing the air bubbles 15b must be further performed.

또한, 종래의 LED 모듈은, LED 소자(12)가 몰딩부(13) 사이의 캐비티(15) 내에 실장되는데, LED 소자(12)에서 출사되는 빛은 측면으로 쉽게 확산되지 못하고 상측으로 집중되어, LED 소자가 실장된 위치와 그 사이의 공간에서 큰 휘도 편차를 나타내는 문제점이 있다.In addition, in the conventional LED module, the LED element 12 is mounted in the cavity 15 between the molding portions 13, and the light emitted from the LED element 12 is not easily diffused to the side but is concentrated upward, There is a problem in that a large luminance deviation is shown in a location where an LED element is mounted and a space therebetween.

한국공개특허 10-2012-0086142호(2012.08.02.출원공개, LED 패키지 제조방법)Korean Patent Laid-Open Patent No. 10-2012-0086142 (2012.08.02.Public application, LED package manufacturing method)

본 발명의 과제는 기판 상에 LED 소자와 함께 반사부재를 구비하여 높은 휘도를 나타내면서, 휘도 편차를 최소로 하여 균일한 휘도를 나타낼 수 있는 면광원 모듈과 그 제조방법을 제공하는 것이다.An object of the present invention is to provide a surface light source module and a method of manufacturing the same, which can exhibit high luminance by providing a reflective member together with an LED element on a substrate, and exhibiting uniform luminance by minimizing luminance deviation.

또한, 본 발명의 과제는 LED 소자를 밀봉하는 밀봉층이 균일한 출광면을 갖고, 내부에 기포가 형성되지 않도록 함으로써, 우수한 광 특성을 나타낼 수 있는 면광원 모듈과 그 제조방법을 제공하는 것이다.In addition, an object of the present invention is to provide a surface light source module capable of exhibiting excellent light characteristics and a method of manufacturing the same by preventing the sealing layer sealing the LED element from having a uniform light exit surface and forming bubbles therein.

상기와 같은 과제를 달성하기 위한 본 실시예의 면광원 모듈은, 고반사율을 갖는 플레이트에 소정 간격을 이루는 다수의 광원 홀이 형성되는 반사부재, 상기 광원 홀을 밀봉하면서 반사부재 상면에 몰딩되어 상기 반사부재와 일체를 이루는 밀봉층, 상기 광원 홀에 대응하는 위치에 반사패턴이 형성되어, 상기 밀봉층 상면에 라미네이팅되는 차광부재, 및, 기판 상에 광원이 소정 간격으로 다수 개 실장되고, 상기 광원이 상기 광원 홀 내의 상기 밀봉층에 밀봉되도록 상기 반사부재 하면에 결합되는 광원부를 포함하되, 상기 밀봉층은, 몰딩된 투명 수지가 1차 경화된 후 삽입되는 상기 광원을 밀봉하고, 다시 2차 경화되어 형성된다.The surface light source module of this embodiment for achieving the above-described problem includes a reflective member having a plurality of light source holes formed at predetermined intervals on a plate having a high reflectivity, and is molded on the upper surface of the reflective member while sealing the light source hole to reflect the reflection. A sealing layer integral with a member, a light blocking member having a reflective pattern formed at a position corresponding to the light source hole, and laminated on an upper surface of the sealing layer, and a plurality of light sources mounted on the substrate at predetermined intervals, and the light source is Includes a light source unit coupled to a lower surface of the reflective member so as to be sealed to the sealing layer in the light source hole, wherein the sealing layer seals the light source inserted after the molded transparent resin is first cured, and is then secondary cured again. Is formed.

여기서, 상기 반사부재는, 상기 광원 홀의 측면에 형성되면서 볼록한 곡면 형상을 이루는 제 1 반사면과, 상기 제 1 반사면과 연결되는 상면에서 평면 형상을 이루는 제 2 반사면을 포함할 수 있다.Here, the reflective member may include a first reflecting surface formed on a side surface of the light source hole and forming a convex curved surface, and a second reflecting surface forming a planar shape on an upper surface connected to the first reflecting surface.

또한, 상기 제 1 반사면은, 최하단부에서 곡면의 접선 기울기가 수직 방향에 대하여 45˚ 내지 60˚를 이룰 수 있다.In addition, the first reflective surface may have a tangential slope of the curved surface at the lowermost end of 45° to 60° with respect to the vertical direction.

또한, 상기 광원과 상기 반사패턴은 1:1 대응하면서 수직 중심축이 일치하도록 배치될 수 있다.In addition, the light source and the reflective pattern may correspond to each other and are arranged so that the vertical central axis coincides with each other.

또한, 본 실시예의 면광원 모듈은, 상기 밀봉층과 상기 차광부재 사이에 결합되는 확산부재를 더 포함할 수 있다.In addition, the surface light source module of the present embodiment may further include a diffusion member coupled between the sealing layer and the light blocking member.

또한, 상기 밀봉층은, 상기 광원 홀에 형성되어 상기 제 2 반사면과 동일한 높이를 이룰 수 있다.In addition, the sealing layer may be formed in the light source hole to achieve the same height as the second reflective surface.

그리고 상기와 같은 목적을 달성하기 위한 본 실시예의 면광원 모듈 제조방법은, 고반사율을 갖는 플레이트에 소정 간격을 이루는 다수의 광원 홀을 형성하여 반사부재를 제조하고, (a) 상기 광원 홀을 포함하는 상기 반사부재 상면에 투명 수지를 몰딩하여 밀봉층을 형성하는 단계, (b) 상기 밀봉층을 1차 경화하는 단계, 기판 상에 상기 광원 홀과 대응하는 위치에 다수의 광원을 실장하여 광원부를 제조하고, (c) 상기 광원이 1차 몰딩된 상기 광원 홀 내부의 상기 밀봉층에 밀봉되도록 상기 광원부를 상기 반사부재 하면에 결합하는 단계, (d) 상기 밀봉층을 2차 경화하는 단계를 포함한다.And the method of manufacturing a surface light source module of this embodiment for achieving the above object, a reflective member is formed by forming a plurality of light source holes at predetermined intervals in a plate having a high reflectivity, and (a) including the light source hole Forming a sealing layer by molding a transparent resin on the upper surface of the reflective member, (b) first curing the sealing layer, and mounting a plurality of light sources on a substrate at a position corresponding to the light source hole And (c) coupling the light source to a lower surface of the reflective member so that the light source is sealed to the sealing layer inside the light source hole in which the light source is first molded, (d) secondary curing the sealing layer. do.

또한, 상기 면광원 모듈 제조방법은, (e) 반사패턴이 형성된 차광부재를 상기 밀봉층 상면에 라미네이팅하는 단계;를 더 포함할 수 있다.In addition, the method of manufacturing the surface light source module may further include (e) laminating a light blocking member having a reflective pattern formed thereon on an upper surface of the sealing layer.

또한, 면광원 모듈 제조방법은, (f) 상기 밀봉층 상면에 확산부재를 결합하는 단계를 더 포함할 수 있고, 상기 차광부재는 상기 확산부재 상면에 라미네이팅할 수 있다.In addition, the method of manufacturing a surface light source module may further include (f) coupling a diffusion member to an upper surface of the sealing layer, and the light blocking member may be laminated to an upper surface of the diffusion member.

또한, 상기 광원 홀은, 측면이 볼록한 곡면 형상을 이루면서 상기 플레이트의 상면과 연결되도록 형성할 수 있다.In addition, the light source hole may be formed to be connected to the upper surface of the plate while forming a convex curved surface shape.

또한, 상기 (b) 단계의 1차 경화는, 겔 상의 상기 투명 수지가 유동성을 갖지 않도록 경화한다.In addition, the primary curing of step (b) is cured so that the transparent resin in the gel phase does not have fluidity.

본 발명은 기판 상에 반사부재가 구비되어 높은 휘도를 나타내고, 반사부재는 곡면의 반사면을 구비하여 광 균일도가 향상되는 효과가 있다.In the present invention, a reflective member is provided on a substrate to exhibit high luminance, and the reflective member has a curved reflective surface to improve light uniformity.

또한, 본 발명은 밀봉층을 경화화는 과정에서 리플로우와 기포가 생성되지 않아 균일하고 우수한 광 특성을 나타낼 수 있다. In addition, in the present invention, reflow and air bubbles are not generated in the process of curing the sealing layer, so that uniform and excellent optical properties may be exhibited.

도 1은 종래의 기술에 따라 제조된 LED 모듈을 나타낸 단면도,
도 2는 본 과제의 실시예에 따른 LED 모듈을 나타낸 분해 사시도,
도 3은 도 2의 주요부를 나타낸 I-I 방향의 단면도,
도 4는 도 3의 주요부인 반사부재의 측면 반사부를 나타낸 확대도,
도 5는 도 2의 주요부인 반사부재에 따른 광 출사 특성을 나타낸 단면도,
도 6은 본 과제의 실시예에 따른 LED 모듈을 제조하는 과정을 나타낸 공정도,
도 7은 본 과제의 다른 실시예에 따른 LED 모듈을 나타낸 단면도.1 is a cross-sectional view showing an LED module manufactured according to the prior art,
2 is an exploded perspective view showing an LED module according to an embodiment of the present subject,
3 is a cross-sectional view in the II direction showing the main part of FIG. 2;
4 is an enlarged view showing a side reflecting part of the reflective member, which is a main part of FIG. 3;
5 is a cross-sectional view showing a light emission characteristic according to a reflective member that is a main part of FIG. 2;
6 is a process chart showing a process of manufacturing an LED module according to an embodiment of the present subject,
7 is a cross-sectional view showing an LED module according to another embodiment of the present subject.

본 발명과 본 발명의 실시에 의해 달성되는 기술적 과제는 다음에서 설명하는 바람직한 실시예들에 의해 명확해질 것이다. 이하 첨부된 도면을 참조하여 본 발명의 바람직한 실시예를 상세히 살펴보기로 한다.The present invention and the technical problem achieved by the implementation of the present invention will be clarified by the preferred embodiments described below. Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

후술되는, 본 실시예의 차이는 상호 배타적이지 않은 사항으로 이해되어야 한다. 즉 본 발명의 기술 사상 및 범위를 벗어나지 않으면서, 기재되어 있는 특정 형상, 구조 및 특성은, 일 실시예에 관련하여 다른 실시예로 구현될 수 있으며, 각각의 개시된 실시예 내의 개별 구성요소의 위치 또는 배치는 변경될 수 있음이 이해되어야 하며, 도면에서 유사한 참조부호는 여러 측면에 걸쳐서 동일하거나 유사한 기능을 지칭하며, 길이, 면적 및 두께 등과 그 형태는 편의를 위하여 과장되어 표현될 수도 있다. It should be understood that the differences between the present embodiments described below are not mutually exclusive. That is, without departing from the spirit and scope of the present invention, specific shapes, structures, and characteristics described may be implemented in other embodiments in relation to one embodiment, and the location of individual components within each disclosed embodiment. Alternatively, it should be understood that the arrangement may be changed, and similar reference numerals in the drawings refer to the same or similar functions over various aspects, and the length, area, thickness, and the like may be exaggerated for convenience.

도 2는 본 과제의 실시예에 따른 LED 모듈을 나타낸 분해 사시도이고, 도 3은 도 2의 주요부를 나타낸 I-I 방향의 단면도이며, 도 4는 도 3의 주요부인 반사부재의 측면 반사부를 나타낸 'A' 부분의 확대도이고, 도 5는 도 2의 주요부인 반사부재에 따른 광 출사 특성을 나타낸 단면도이다.FIG. 2 is an exploded perspective view showing an LED module according to an embodiment of the present subject, FIG. 3 is a cross-sectional view in the direction II showing the main part of FIG. 2, and FIG. 4 is'A' 'Is an enlarged view of a portion, and FIG. 5 is a cross-sectional view showing light emission characteristics according to a reflective member that is a main part of FIG. 2.

이들 도면에 도시된 바와 같이, 본 실시예의 LED 모듈은, 기판(110) 상에 다수의 LED 소자(120)가 실장되는 광원부(100)와, LED 소자(120)를 노출시키는 광원 홀(210)을 가지면서 기판(110)에 결합되는 반사부재(200)와, 반사부재(200)의 광원 홀(210)에 충진되는 밀봉층(300)과, 밀봉층(300) 상면에 결합되는 차광부재(400)를 포함한다.As shown in these figures, the LED module of this embodiment, a light source unit 100 on which a plurality of LED elements 120 are mounted on a substrate 110, and a light source hole 210 exposing the LED element 120 A reflective member 200 coupled to the substrate 110 while having a, a sealing layer 300 filled in the light source hole 210 of the reflective member 200, and a light blocking member coupled to the upper surface of the sealing layer 300 ( 400).

구체적으로 살펴보면, 광원부(100)를 구성하는 기판(110)은 LED 소자(120)를 실장시켜 LED 소자(120)에 전원 및 제어 신호를 인가하는 구성으로, 인쇄회로기판(PCB) 또는 플렉시블 인쇄회로기판(FPCB) 등으로 구성될 수 있다. 또한, LED 소자(120)는 LED 모듈의 광원으로, 다이 본딩 및 와이어 본딩으로 기판(110)에 실장되어 전기적으로 연결된다. LED 소자(120)는 소정의 간격을 이루면서 가로, 세로 및 임의의 방향으로 다수 개 실장된다. LED 소자(120)는 상측으로 빛을 발하는 탑 뷰(top view) 방식의 소자 또는 상측 출광면을 포함하는 다면 발광 소자로 구성될 수 있다. Specifically, the substrate 110 constituting the light source unit 100 is a configuration for applying power and control signals to the LED element 120 by mounting the LED element 120, a printed circuit board (PCB) or a flexible printed circuit. It may be composed of a substrate (FPCB) or the like. In addition, the LED element 120 is a light source of the LED module, mounted on the substrate 110 by die bonding and wire bonding, and electrically connected. A plurality of LED elements 120 are mounted horizontally, vertically, and in arbitrary directions while forming a predetermined interval. The LED device 120 may be configured as a top view type device emitting light upward or a multi-faceted light emitting device including an upper light emitting surface.

반사부재(200)는 LED 소자(120)를 노출시키며 기판(110)의 상면에 결합되고, LED 소자(120)에서 출사되는 빛을 확산 및 반사시킨다. 이를 위한 반사부재(200)는 고반사율을 갖는 시트 또는 플레이트로 구성되고, 각 LED 소자(120)에 대응하는 위치에 다수의 광원 홀(210)이 형성된다. 여기서 고반사율이란 일반적으로 면광원 장치에서 반사소재로 사용될 수 있을 정도의 우수한 반사율을 갖는 정도를 말한다. 반사부재(200)는 광원 홀(210)에 형성되는 제 1 반사면(220)과, 상면에 형성되는 제 2 반사면(230)을 구비한다. The reflective member 200 exposes the LED element 120 and is coupled to the upper surface of the substrate 110, and diffuses and reflects the light emitted from the LED element 120. The reflective member 200 for this purpose is composed of a sheet or plate having a high reflectance, and a plurality of light source holes 210 are formed at positions corresponding to each LED element 120. Here, the high reflectance generally refers to a degree of having an excellent reflectivity that can be used as a reflective material in a surface light source device. The reflective member 200 includes a first reflective surface 220 formed in the light source hole 210 and a second reflective surface 230 formed on an upper surface.

제 1 반사면(220)은 광원 홀(210)의 측면으로서 본 실시예에서는 볼록한 곡면 형상을 이룬다. 즉, 광원 홀(210)은 반사부재(200)의 두께 방향에 대하여 하단부 직경이 상대적으로 좁고 상측으로 갈수록 직경이 증가한다. The first reflective surface 220 is a side surface of the light source hole 210 and has a convex curved shape in this embodiment. That is, the diameter of the lower end of the light source hole 210 is relatively narrow with respect to the thickness direction of the reflective member 200, and the diameter increases toward the upper side.

제 1 반사면(220)은 볼록한 곡면 형상을 이룸으로써, 밀봉층(300)을 형성하는 수지가 경화될 때 표면 장력을 완화시킨다. 따라서, 제 1 반사면(220)에서는 수지 경화 과정에서 리플로우(도 1의 15a 참고)가 발생되지 않아, 밀봉층(300)에 대한 두께의 균일도와 상면의 편평도를 향상시킬 수 있다.The first reflective surface 220 has a convex curved shape, thereby reducing surface tension when the resin forming the sealing layer 300 is cured. Accordingly, reflow (refer to 15a of FIG. 1) does not occur in the resin curing process on the first reflective surface 220, and thus uniformity of the thickness of the sealing layer 300 and flatness of the upper surface may be improved.

또한, 제 1 반사면(220)은 LED 소자(120)에서 출사되는 빛을 제 2 반사면(230) 상부로 확산시킨다. 즉, 제 1 반사면(220)은 LED 소자(120) 상부로 집중될 수 있는 빛을 제 2 반사면(230) 상부로 분산시켜 광 균일도를 향상시킨다.In addition, the first reflective surface 220 diffuses light emitted from the LED element 120 to the second reflective surface 230. That is, the first reflective surface 220 distributes light that may be concentrated on the LED element 120 to the second reflective surface 230 to improve light uniformity.

도 5를 참조하여 광 진행 경로를 구체적으로 살펴보면, (a)와 같이 제 1 반사면(220)이 수직을 이루는 경우 LED 소자(120)에서 사선 방향으로 출사되는 빛(L1)은 제 1 반사면(220)에 반사되면서 다시 LED 소자(120) 상부로 집광된다. 그러나, (b)와 같이 제 1 반사면(220)이 볼록한 곡면의 경사를 이루는 경우 LED 소자(120)에서 사선 방향으로 출사되는 빛(L2)은 제 1 반사면(220)에 반사되면서 제 2 반사면(230) 상부로 분산된다. 따라서 곡면 형상의 제 1 반사면(220)에 의하여 빛이 분사되는 효과가 나타난다.Referring to FIG. 5 in detail, when the first reflective surface 220 is vertical as shown in (a), the light L1 emitted in the diagonal direction from the LED element 120 is the first reflective surface. As reflected by 220, the light is again condensed to the top of the LED element 120. However, as shown in (b), when the first reflective surface 220 forms an inclination of a convex curved surface, the light L2 emitted in the diagonal direction from the LED element 120 is reflected to the first reflective surface 220 and the second It is distributed over the reflective surface 230. Accordingly, an effect of light is emitted by the first reflective surface 220 having a curved shape.

이때, 제 1 반사면(220)은 접선이 소정의 기울기를 갖는 곡면 형상을 이루어야 하는 것으로, 본 실시예에서는 하단부에서 상측으로 갈수록 접선 방향의 경사가 감소하도록 구성된다. 도 4를 참조하면, 제 1 반사면(220)은 최하단부에서 접선 방향의 경사(θ)는 수직 방향을 기준으로 45˚ 내지 60˚를 이루도록 형성된다. 제 1 반사면(220)의 접선 경사(θ)가 45˚미만일 경우 수지 경화 과정에서 표면 장력을 완화시키는 효과가 현저히 감소되고, 60˚를 초과하는 경우 LED 소자(120)에서 사선 방향으로 출사되는 빛을 제어하지 못해 광 균일도를 개선하는 효과가 50% 미만으로 감소한다.At this time, the first reflective surface 220 should have a curved shape in which the tangent line has a predetermined inclination, and in this embodiment, the inclination in the tangent direction decreases from the lower end to the upper side. Referring to FIG. 4, the first reflective surface 220 is formed so that the inclination θ in the tangential direction at the lowest end is 45° to 60° based on the vertical direction. When the tangential inclination (θ) of the first reflective surface 220 is less than 45°, the effect of reducing the surface tension in the resin curing process is significantly reduced, and when it exceeds 60°, the light emitted from the LED element 120 in the diagonal direction Due to the inability to control light, the effect of improving light uniformity is reduced to less than 50%.

제 2 반사면(230)은 반사부재(200)의 상면에 형성되어, 반사부재(200)와 차광부재(400) 사이에 분포되는 빛을 상측으로 반사시켜 LED 모듈의 휘도를 향상시킨다. 제 2 반사면(230)은 제 1 반사면(220)에서 연장되면서 평면 형상의 반사면을 구성한다. The second reflective surface 230 is formed on the upper surface of the reflective member 200 and reflects light distributed between the reflective member 200 and the light blocking member 400 upward to improve the brightness of the LED module. The second reflective surface 230 forms a planar reflective surface while extending from the first reflective surface 220.

밀봉층(300)은 광원 홀(210)을 포함하는 반사부재(200) 상면에 몰딩되어 LED 소자(120)를 보호하고, LED 소자(120)에서 출사되는 빛을 확산시키는 기능을 한다. 이를 위한 밀봉층(300)은 고투명도를 갖는 수지 재질로 구성될 수 있으며, 일 예로, PS, PC, PMMA, PE, PET, PP, MMA-styrene 중 어느 하나 이상을 포함하는 투명 소재로 구성될 수 있고, 고투명도를 갖는 소재라면 그 종류에 한정되지 않는다.The sealing layer 300 is molded on the upper surface of the reflective member 200 including the light source hole 210 to protect the LED element 120 and diffuse light emitted from the LED element 120. For this purpose, the sealing layer 300 may be made of a resin material having high transparency, and as an example, it may be made of a transparent material including any one or more of PS, PC, PMMA, PE, PET, PP, and MMA-styrene. It can be, and if it is a material having high transparency, it is not limited to the type.

밀봉층(300)은 광원 홀(210) 내부를 포함하여 제 2 반사면(230)으로부터 소정의 간격을 이루는 높이까지 형성될 수 있다. 따라서 LED 소자(120)에서 출사되는 빛은 제 2 반사면(230) 상부의 밀봉층(300) 영역에서 충분히 확산되어 광 균일도를 향상시킬 수 있다. 밀봉층(300)에는 광 확산을 위하여 광 산란재가 분산될 수 있고, LED 소자(120)의 종류에 따라 LED 소자(120)에서 출사되는 빛의 파장을 변환시키기 위한 형광체가 더 분산될 수 있다. The sealing layer 300 may be formed to a height at a predetermined interval from the second reflective surface 230 including the inside of the light source hole 210. Accordingly, light emitted from the LED device 120 is sufficiently diffused in the area of the sealing layer 300 on the second reflective surface 230 to improve light uniformity. A light scattering material may be dispersed in the sealing layer 300 to diffuse light, and a phosphor for converting a wavelength of light emitted from the LED element 120 may be further dispersed according to the type of the LED element 120.

밀봉층(300)은 겔 상의 투명 수지가 디스펜싱 몰딩(Dispensing Molding) 등의 공정으로 몰딩된 후 경화되어 형성될 수 있다. 특히, 본 실시예의 밀봉층(300)은 반사부재(200)에 투명 수지가 몰딩되고, 1차 경화 과정(가 경화)으로 수지의 유동성이 제거된 상태에서 광원부(100)와 결합된 후, 다시 2차 경화(본 경화)되어 형성된다. 따라서, 본 실시예의 밀봉층(300)은 수지의 유동성이 제거된 상태에서 기판(110)과 결합되므로, 단차가 형성되는 기판(110)의 전극 부분에서도 기포(도 1의 15b 참고)가 발생되지 않는다.The sealing layer 300 may be formed by molding a gel-like transparent resin by a process such as dispensing molding and then curing. In particular, in the sealing layer 300 of the present embodiment, a transparent resin is molded on the reflective member 200, and after being combined with the light source unit 100 in a state in which the fluidity of the resin is removed by the first curing process (temporal curing), It is formed by secondary curing (main curing). Therefore, since the sealing layer 300 of the present embodiment is combined with the substrate 110 in a state in which the fluidity of the resin is removed, bubbles (refer to 15b of FIG. 1) are not generated even at the electrode portion of the substrate 110 where the step difference is formed. Does not.

차광부재(400)는 LED 소자(120)의 수직 상부로 출사되는 빛의 진행 방향을 제어하여 핫 스팟을 방지하고 광 균일도를 향상시킨다. 이러한 차광부재(400)는 고투명도를 갖는 시트 또는 필름으로 구성될 수 있으며, LED 소자(120)의 빛을 반사시키기 위한 반사패턴(410)을 구비한다. 차광부재(400)는 밀봉층(300) 상면에 라미네이팅되어 결합된다. 이때, 반사패턴(410)은 각 LED 소자(120)와 1:1로 대응하면서 수직 중심축이 일치하는 위치에서 차광부재(400)의 어느 일면에 형성된다.The light blocking member 400 prevents hot spots and improves light uniformity by controlling a traveling direction of light emitted vertically from the LED device 120. The light blocking member 400 may be formed of a sheet or film having high transparency, and includes a reflective pattern 410 for reflecting light of the LED element 120. The light blocking member 400 is laminated and coupled to the upper surface of the sealing layer 300. At this time, the reflective pattern 410 is formed on any one surface of the light blocking member 400 at a position where the vertical central axis coincides with each LED element 120 and corresponds to 1:1.

상기와 같은 본 실시예의 LED 모듈은 LED 소자(120)를 수용하는 광원 홀(210)에 곡면 형상의 제 1 반사면(220)이 형성되어 LED 소자(120) 상부로 집중되는 빛을 LED 소자(120) 사이의 제 2 반사면(230) 상부로 분산시킴으로써, 광 균일도를 향상시킬 수 있다. 또한, 본 실시예의 LED 모듈은 제 1 반사면(220)과 제 2 반사면(230)의 연결부에서 표면 장력이 완화되므로 밀봉층(300) 형성시 리플로우가 발생되지 않아 우수한 광 특성을 나타낼 수 있다. 또한, 본 실시예의 LED 모듈은 반사부재(200)에 몰딩된 밀봉층(300)이 1차 경화된 후 기판(110)과 결합되어 2차 경화됨으로써, 기판(110)과 밀봉층(300) 사이에 기포가 발생되지 않아 내구성과 광 특성을 향상시킬 수 있다.In the LED module of this embodiment as described above, a curved first reflective surface 220 is formed in the light source hole 210 accommodating the LED element 120 so that the light focused on the LED element 120 is transferred to the LED element ( By dispersing it over the second reflective surface 230 between 120), light uniformity may be improved. In addition, since the surface tension at the connection portion between the first reflective surface 220 and the second reflective surface 230 is relieved, the LED module of the present embodiment does not cause reflow when forming the sealing layer 300 and thus exhibits excellent optical characteristics. have. In addition, in the LED module of this embodiment, the sealing layer 300 molded on the reflective member 200 is first cured and then combined with the substrate 110 to be secondary cured, so that between the substrate 110 and the sealing layer 300 Since no air bubbles are generated, durability and optical properties can be improved.

도 6은 본 과제의 실시예에 따른 LED 모듈을 제조하는 과정을 나타낸 공정도이다.6 is a process chart showing a process of manufacturing an LED module according to an embodiment of the present subject.

도 6을 참조하면, 광원 홀(210)이 형성된 반사부재(200)에 투명 수지를 소정의 높이로 몰딩하여 밀봉층(300)을 형성하고, 투명 수지를 1차 경화한다. 이때, 투명 수지의 몰딩은 디스펜싱 몰딩 또는 스크린 프린팅 공정 등으로 진행될 수 있다. 또한, 1차 경화 과정에서는 경화기를 이용하여 겔 상의 투명 수지가 유동성이 제거될 정도로만 경화한다. Referring to FIG. 6, a transparent resin is molded to a predetermined height in a reflective member 200 in which a light source hole 210 is formed to form a sealing layer 300, and the transparent resin is first cured. In this case, the molding of the transparent resin may be performed through a dispensing molding or a screen printing process. In addition, in the first curing process, the gel-like transparent resin is cured only to the extent that fluidity is removed using a curing machine.

반사부재(200)는 몰딩 공정 이전에 별도의 공정에서 제조되며, 광원 홀(210)을 형성하는 측면이 곡면 형상의 제 1 반사면(220)을 갖도록 제조된다. 따라서 투명 수지를 경화하는 과정에서 리플로우가 발생되지 않는다.The reflective member 200 is manufactured in a separate process prior to the molding process, and the side surface forming the light source hole 210 is manufactured to have a curved first reflective surface 220. Therefore, no reflow occurs in the process of curing the transparent resin.

그리고, 1차 경화되어 형성된 밀봉층(300) 상에 별도의 공정에서 제조된 차광부재(400)를 라미네이팅하여 부착한다. 차광부재(400)는 각 반사패턴(410)이 광원 홀(210)과 수직 중심축이 일치하도록 라미네이팅되어야 한다.Then, the light blocking member 400 manufactured in a separate process is laminated and attached on the sealing layer 300 formed by primary curing. The light blocking member 400 must be laminated so that the reflective patterns 410 coincide with the light source hole 210 and the vertical central axis.

차광부재(400)가 라미네이팅 된 후 기판(110)에 LED 소자(120)가 실장된 광원부(100)와 밀봉층(300)이 형성된 반사부재(200)를 결합한다. 이때, LED 소자(120)는 광원 홀(210)의 중심에 위치시켜 반사패턴(410)과 수직 중심축이 일치하도록 한다. 밀봉층(300)이 1 차 경화된 상태에서 광원부(100)가 결합되므로, 경화 과정에서 기판(110)과 밀봉층(300) 사이에 기포가 발생되지 않는다. 광원부(100)와 반사부재(200)가 합지된 후 1차 경화된 밀봉층(300)을 2차 경화하여 완전히 경화한다.After the light blocking member 400 is laminated, the light source unit 100 on which the LED element 120 is mounted on the substrate 110 and the reflective member 200 on which the sealing layer 300 is formed are coupled. In this case, the LED element 120 is positioned at the center of the light source hole 210 so that the reflection pattern 410 and the vertical central axis coincide. Since the light source unit 100 is coupled in a state in which the sealing layer 300 is first cured, bubbles are not generated between the substrate 110 and the sealing layer 300 during the curing process. After the light source unit 100 and the reflective member 200 are laminated, the primary cured sealing layer 300 is secondary cured to completely cure.

본 실시예의 LED 모듈 제조 과정에서 차광부재(400)를 라미네이팅하는 단계는 광원부(100)가 합지되기 전에 이루어지는 구성을 예시하였으나, 광원부(100)가 반사부재(200) 하면에서 먼저 결합되고, 그 후에 차광부재(400)가 밀봉층(300) 상면에 라미네이팅되는 구성도 가능하다.The step of laminating the light blocking member 400 in the manufacturing process of the LED module according to the present embodiment illustrates a configuration made before the light source unit 100 is laminated, but the light source unit 100 is first combined on the lower surface of the reflective member 200, and then A configuration in which the light blocking member 400 is laminated on the upper surface of the sealing layer 300 is also possible.

도 7은 본 과제의 다른 실시예에 따른 LED 모듈을 나타낸 단면도이다.7 is a cross-sectional view showing an LED module according to another embodiment of the present subject.

도면을 참조하면, 본 실시예의 LED 모듈은 밀봉층(300)이 광원 홀(210) 내부에만 형성된다. 즉, 밀봉층(300)은 제 2 반사면(230)과 동일한 높이를 이룬다. 따라서 LED 소자(120)에서 출사되는 빛이 충분히 확산되는 공간을 확보하기 위하여 밀봉층(300) 상면, 즉, 반사부재(200) 상면에는 확산부재(500)가 더 결합된다. 확산부재(500)는 소정의 두께를 갖는 투명 수지 소재로 구성되며, 일 예로, PC, PS, PMMA 등의 투명 플레이트가 이용될 수 있다. Referring to the drawings, in the LED module of this embodiment, the sealing layer 300 is formed only inside the light source hole 210. That is, the sealing layer 300 has the same height as the second reflective surface 230. Therefore, the diffusion member 500 is further coupled to the upper surface of the sealing layer 300, that is, the upper surface of the reflective member 200 in order to secure a space in which light emitted from the LED element 120 is sufficiently diffused. The diffusion member 500 is composed of a transparent resin material having a predetermined thickness, for example, a transparent plate such as PC, PS, PMMA may be used.

또한, 확산부재(500) 상면에는 반사패턴(410)을 갖는 차광부재(400)가 라미네이팅될 수 있다. 반사패턴(410)은 확산부재(500) 상면에 직접 형성될 수 있으며, 이 경우 별도의 차광부재(400)는 라미네이팅 되지 않을 수 있다. In addition, a light blocking member 400 having a reflective pattern 410 may be laminated on an upper surface of the diffusion member 500. The reflective pattern 410 may be directly formed on the upper surface of the diffusion member 500, and in this case, the separate light blocking member 400 may not be laminated.

이상 설명한 바와 같이 본 발명의 예시적인 실시예가 도시되어 설명되었지만, 다양한 변형과 다른 실시예가 본 분야의 숙련된 기술자들에 의해 행해질 수 있을 것이다. 이러한 변형과 다른 실시예들은 첨부된 청구범위에 모두 고려되고 포함되어 본 발명의 진정한 취지 및 범위를 벗어나지 않는다 할 것이다.Although the exemplary embodiments of the present invention have been shown and described as described above, various modifications and other embodiments may be made by those skilled in the art. These modifications and other embodiments are all considered and included in the appended claims and will not depart from the true spirit and scope of the present invention.

100 : 광원부
110 : 기판 120 : LED 소자
200 : 반사부재 210 : 광원 홀
220 : 제 1 반사면 230 : 제 2 반사면
300 : 밀봉층
400 : 차광부재 410 : 반사패턴
500 : 확산부재100: light source
110: substrate 120: LED element
200: reflective member 210: light source hole
220: first reflective surface 230: second reflective surface
300: sealing layer
400: light blocking member 410: reflection pattern
500: diffusion member

Claims (11)

고반사율을 갖는 플레이트에 소정 간격을 이루는 다수의 광원 홀이 형성되는 반사부재;
상기 광원 홀을 밀봉하면서 반사부재 상면에 몰딩되어 상기 반사부재와 일체를 이루는 밀봉층;
상기 광원 홀에 대응하는 위치에 반사패턴이 형성되어, 상기 밀봉층 상면에 라미네이팅되는 차광부재; 및,
기판 상에 광원이 소정 간격으로 다수 개 실장되고, 상기 광원이 상기 광원 홀 내의 상기 밀봉층에 밀봉되도록 상기 반사부재 하면에 결합되는 광원부;를 포함하되,
상기 밀봉층은, 몰딩된 투명 수지가 1차 경화된 후 삽입되는 상기 광원을 밀봉하고, 다시 2차 경화되어 형성된, 백라이트 장치용 면광원 모듈.A reflective member having a plurality of light source holes formed at predetermined intervals in a plate having a high reflectance;
A sealing layer that is molded on an upper surface of the reflective member while sealing the light source hole to form an integral body with the reflective member;
A light blocking member having a reflective pattern formed at a position corresponding to the light source hole and laminated on an upper surface of the sealing layer; And,
A light source unit coupled to a lower surface of the reflective member such that a plurality of light sources are mounted on a substrate at predetermined intervals, and the light source is sealed to the sealing layer in the light source hole;
The sealing layer is formed by sealing the light source inserted after the molded transparent resin is first cured and then secondary curing again, thereby forming a surface light source module for a backlight device. 제 1 항에 있어서, 상기 반사부재는,
상기 광원 홀의 측면에 형성되면서 볼록한 곡면 형상을 이루는 제 1 반사면과, 상기 제 1 반사면과 연결되는 상면에서 평면 형상을 이루는 제 2 반사면을 포함하는, 백라이트 장치용 면광원 모듈.The method of claim 1, wherein the reflective member,
A surface light source module for a backlight device, comprising: a first reflective surface formed on a side surface of the light source hole and forming a convex curved surface, and a second reflective surface forming a planar shape on an upper surface connected to the first reflective surface. 제 2 항에 있어서, 상기 제 1 반사면은,
최하단부에서 곡면의 접선 기울기가 수직 방향에 대하여 45˚ 내지 60˚를 이루는, 백라이트 장치용 면광원 모듈.The method of claim 2, wherein the first reflective surface,
A surface light source module for a backlight device, in which the tangential slope of the curved surface at the lowest end is 45° to 60° with respect to the vertical direction. 제 1 항에 있어서,
상기 광원과 상기 반사패턴은 1:1 대응하면서 수직 중심축이 일치하도록 배치되는, 백라이트 장치용 면광원 모듈.The method of claim 1,
A surface light source module for a backlight device, wherein the light source and the reflection pattern correspond to each other and are arranged such that a vertical central axis coincides with each other. 제 1 항에 있어서,
상기 밀봉층과 상기 차광부재 사이에 결합되는 확산부재;를 더 포함하는, 백라이트 장치용 면광원 모듈.The method of claim 1,
A surface light source module for a backlight device further comprising; a diffusion member coupled between the sealing layer and the light blocking member. 제 5 항에 있어서, 상기 밀봉층은,
상기 광원 홀에 형성되어 상기 제 2 반사면과 동일한 높이를 이루는, 백라이트 장치용 면광원 모듈.The method of claim 5, wherein the sealing layer,
A surface light source module for a backlight device, which is formed in the light source hole and has the same height as the second reflective surface. 고반사율을 갖는 플레이트에 소정 간격을 이루는 다수의 광원 홀을 형성하여 반사부재를 제조하고,
(a) 상기 광원 홀을 포함하는 상기 반사부재 상면에 투명 수지를 몰딩하여 밀봉층을 형성하는 단계;
(b) 상기 밀봉층을 1차 경화하는 단계;
기판 상에 상기 광원 홀과 대응하는 위치에 다수의 광원을 실장하여 광원부를 제조하고,
(c) 상기 광원이 1차 몰딩된 상기 광원 홀 내부의 상기 밀봉층에 밀봉되도록 상기 광원부를 상기 반사부재 하면에 결합하는 단계;
(d) 상기 밀봉층을 2차 경화하는 단계;를 포함하는, 백라이트 장치용 면광원 모듈 제조방법.A reflective member is manufactured by forming a plurality of light source holes at predetermined intervals in a plate having a high reflectance,
(a) forming a sealing layer by molding a transparent resin on an upper surface of the reflective member including the light source hole;
(b) first curing the sealing layer;
A light source unit is manufactured by mounting a plurality of light sources on a substrate at a position corresponding to the light source hole,
(c) coupling the light source unit to a lower surface of the reflective member so that the light source is sealed to the sealing layer inside the light source hole in which the light source is first molded;
(d) secondary curing the sealing layer; including, a method for manufacturing a surface light source module for a backlight device. 제 7 항에 있어서,
(e) 반사패턴이 형성된 차광부재를 상기 밀봉층 상면에 라미네이팅하는 단계;를 더 포함하는, 백라이트 장치용 면광원 모듈 제조방법.The method of claim 7,
(e) laminating the light blocking member on which the reflective pattern is formed on the upper surface of the sealing layer; further comprising, a method for manufacturing a surface light source module for a backlight device. 제 8 항에 있어서,
(f) 상기 밀봉층 상면에 확산부재를 결합하는 단계;를 더 포함하고,
상기 차광부재는 상기 확산부재 상면에 라미네이팅하는, 백라이트 장치용 면광원 모듈 제조방법.The method of claim 8,
(f) coupling a diffusion member to the upper surface of the sealing layer; further comprising,
The light blocking member is laminated to the upper surface of the diffusion member, a method of manufacturing a surface light source module for a backlight device. 제 7 항에 있어서, 상기 광원 홀은,
측면이 볼록한 곡면 형상을 이루면서 상기 플레이트의 상면과 연결되도록 형성하는, 백라이트 장치용 면광원 모듈 제조방법.The method of claim 7, wherein the light source hole,
A method of manufacturing a surface light source module for a backlight device, wherein a side surface is formed to be connected to an upper surface of the plate while forming a convex curved surface shape. 제 7 항에 있어서, 상기 (b) 단계의 1차 경화는,
겔 상의 상기 투명 수지가 유동성을 갖지 않도록 경화하는, 백라이트 장치용 면광원 모듈 제조방법.
The method of claim 7, wherein the first curing of step (b),
A method of manufacturing a surface light source module for a backlight device, curing the gel-like transparent resin so as not to have fluidity.
KR1020190050214A 2019-04-30 2019-04-30 Light source module having reflector and manufacturing method of the same KR20200127063A (en)

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