KR20090051863A - Light emitting diode package and method of fabricating the same - Google Patents

Light emitting diode package and method of fabricating the same Download PDF

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Publication number
KR20090051863A
KR20090051863A KR1020070118294A KR20070118294A KR20090051863A KR 20090051863 A KR20090051863 A KR 20090051863A KR 1020070118294 A KR1020070118294 A KR 1020070118294A KR 20070118294 A KR20070118294 A KR 20070118294A KR 20090051863 A KR20090051863 A KR 20090051863A
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KR
South Korea
Prior art keywords
emitting diode
light emitting
diode package
lens
package body
Prior art date
Application number
KR1020070118294A
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Korean (ko)
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KR100899554B1 (en
Inventor
김동수
최화경
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알티전자 주식회사
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Priority to KR1020070118294A priority Critical patent/KR100899554B1/en
Publication of KR20090051863A publication Critical patent/KR20090051863A/en
Application granted granted Critical
Publication of KR100899554B1 publication Critical patent/KR100899554B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

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  • Led Device Packages (AREA)

Abstract

The present invention relates to a light emitting diode package and a method of manufacturing the same.

As described above, the light emitting diode package body and the light emitting diode package body are mounted, and a printed circuit board having various types of circuit patterns formed on a surface thereof in a plate shape and the light emitting diode package body are sealed on the printed circuit board, Characterized in that it comprises a lens for converting the path of travel.

Description

LIGHT EMITTING DIODE PACKAGE AND METHOD OF FABRICATING THE SAME}

The present invention relates to a light emitting diode package and a method of manufacturing the same, and more particularly, to a light emitting diode lens integrated with the light emitting diode package.

A light emitting diode (LED) is a semiconductor device that converts electrical energy into light energy, and is composed of a compound semiconductor emitting light having a specific wavelength according to an energy band gap. In recent years, LEDs, which are increasing in use due to diversification of application fields, are provided in a package form depending on the purpose of use and required forms.

In general, a light emitting diode package is manufactured by mounting a light emitting diode chip on a substrate on which an electrode pattern is formed, and then electrically connecting a terminal of the chip and an electrode pad. A sidewall is formed around the light emitting diode chip, and the recessed cup portion formed by the sidewall is filled with a transparent resin to seal the light emitting diode chip. The finished LED package body is prepared separately from the LED package body and the lens in order to increase the efficiency of light emission when the light is emitted, and then attach the lens using a transparent adhesive on the transparent resin to complete the LED package. However, since the lens must be separately prepared and assembled using a mold required for manufacturing the lens, the complexity of the manufacturing process and the manufacturing cost increase. In addition, when the transparent adhesive is used to attach the lens and the light emitting diode body, the interface is increased, resulting in deterioration of reliability due to impurity penetration and alteration of the transparent adhesive between the transparent adhesive.

In order to solve the drawbacks of the prior art, an object of the present invention is to provide a method of manufacturing a light emitting diode package in which the light emitting diode package body and the light emitting diode lens are integrated to simplify assembly and reduce production cost.

In order to solve the above problems, a light emitting diode package and a method of manufacturing the same according to an embodiment of the present invention is a light emitting diode package body and the light emitting diode package body is mounted, the plate-like printed circuit pattern of various types formed on the surface And a lens for sealing a circuit board and the light emitting diode package body on the printed circuit board and converting a propagation path of light.

The method of manufacturing the LED package includes preparing a LED package body formed by forming a lead frame on a substrate, mounting a LED chip, and electrically connecting the LED package body, and attaching the LED package body to a printed circuit board having a plurality of holes. And attaching an injection mold defining a lens forming space therein so as to correspond to the light emitting diode package body attached to the printed circuit board, and forming a lens in the lens forming space through a hole opened in the printed circuit board facing the injection mold. Injecting a resin, and separating the printed circuit board and the lens injection mold.

The light emitting diode package and the method of manufacturing the same according to the present invention have an effect of simplifying the structure by integrating the light emitting diode package and the lens, thereby reducing the production cost and simplifying the manufacturing process, thereby improving the productivity of the product.

In addition, it is possible to prevent a decrease in reliability and light extraction efficiency due to the increase in the interface.

Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings.

1 is a cross-sectional view showing a cross section of a light emitting diode package according to an embodiment of the present invention.

Referring to FIG. 1, the light emitting diode package may include a light emitting diode package body 100, a lens 20, and a printed circuit board 23.

The light emitting diode package body 100 includes a light emitting diode chip 1, a lead frame 3, a wire 5, a housing 7, and a molding material 9.

The lead frame 3 may include a pad frame 15 and a heat sink frame 13 coupled to the pad frame 15 by an adhesive sheet 11.

The pad frame 15 may be formed with a plurality of conductive leads (not shown) that can be used as electrodes.

The light emitting diode chip 1 is mounted on the heat sink frame 13, and heat generated when the mounted light emitting diode chip 1 is driven may be emitted to the outside through the heat sink frame 13. At least the pad frame 15 of the pad frame 15 and the heat sink frame 13 may be exposed to the outside through the side wall of the housing 7.

The adhesive sheet 11 is an insulator, and may be patterned in the same form as the conductive lead formed in the pad frame 15. Short between the heat sink frame 13 and the pad frame 15 may be blocked using the adhesive sheet 11.

The wire 5 electrically connects the lead frame 3 and the light emitting diode chip 1.

The housing 7 surrounds the conductive lead and may have a groove 27 open to expose the light emitting diode chip 1 and a part of the lead frame 3 to the outside. An inner surface of the housing 7 forming the open groove 27 may be obliquely formed to form a predetermined angle with respect to the exposed lead frame 3 to function as a reflecting plate. The reflector may serve to reflect and disperse the light emitted from the light emitting diode chip 1. In addition, it may serve as a support for protecting and supporting the lead frame (3).

The open groove 27 may be filled with a transparent material, and may further include a molding material 9 for protecting the light emitting diode chip 1 mounted on the lead frame 3 from the outside.

The lens 20 is formed to surround the outside of the light emitting diode package body 100, and the lens surface positioned on the molding material 9 may change the path of incident light according to its shape.

Since the lens 20 surrounds the outside of the light emitting diode package body 100, damage to the light emitting diode package body 100 due to an external force may be prevented. In addition, it can function to disperse light emitted from the light emitting diode chip 1 to a wide range outside. The lens 20 may be directly fixed to the light emitting diode package body 100 to be fixed without an additional adhesive.

The lens 20 may be formed by injection molding using a thermosetting resin such as silicone and an epoxy resin and a transparent elastic resin. In addition, the lens 20 may be formed of the same material as the molding material 9. When the lens 20 and the molding material 9 are formed of the same material as described above, the light generated from the light emitting diode chip 1 is not changed or the total reflection of the refractive index at the boundary between the molding material 9 and the lens 20. To maintain straightness. The lens 20 may have an oval shape for wide-angle dispersion of light, and may have various shapes such as a cone shape or a concave top surface for improving light uniformity or color mixing. .

The printed circuit board (PCB) 23 may have a plate shape, and various types of printed circuit patterns 31 may be formed on a surface thereof. In addition to the function of electrically connecting the light emitting diode package body 100, the light emitting diode package body 100 serves to mechanically fix the light emitting diode package body 100.

Therefore, the light emitting diode package body 100 may be mounted, and electronic components may be electrically connected or frequency may be transmitted.

2 is a flowchart sequentially illustrating a method of manufacturing a light emitting diode body according to an embodiment of the present invention.

Referring to FIG. 2, the lead frame is formed by combining the pad frame and the heat sink frame through the adhesive sheet. (S10)

A housing is formed to surround a portion of the lead frame and form a groove so that a portion of the lead frame is exposed to the outside. (S20)

The light emitting diode chip is mounted on the lead frame. (S30)

The light emitting diode chip and the lead frame are electrically connected by conductive wires. (S40)

Through this process, the light emitting diode package body may be formed.

3A to 3D are views sequentially illustrating a method of manufacturing a light emitting diode package according to an embodiment of the present invention.

Referring to FIG. 3A, a plurality of printed circuit patterns 31 are formed on the printed circuit board 23, and at least two holes 33 are formed near the outer position of the printed circuit pattern on which the light emitting diode package body is to be mounted. do. Here, the hole 33 can be provided using laser processing, punching, or a drill.

Referring to FIG. 3B, the light emitting diode package body 100 is mounted on a printed circuit board 23 having a plurality of holes 33. Specifically, it may be mounted by a surface mount technology (SMT).

Referring to FIG. 3C, the light emitting diode package body 1 attached to the printed circuit board 23 is provided.

The injection mold 25 defining the lens forming space 37 is attached to the inside so as to correspond to 00).

Referring to FIG. 3D, the lens molding resin is injected into the lens forming space through the hole 33 opened in the printed circuit board 23 facing the injection mold 25. The lens-forming resin can be used a transparent elastic resin that is less deformed by heat because of deformation caused by heat generated in the light emitting diode chip. The elastic resin has excellent optical properties because the change of the short wavelength such as yellowing (Yellowing) is very small and the refractive index is also high.

The transparent resin is precisely discharged by a dotting method through the holes 33 formed in the printed circuit board 23. Air remaining in the lens forming space 37 is discharged through the remaining holes 33.

The lens molding resin is cured in a curing chamber (not shown). Since the transparent elastic resin maintains a state of gel or elastomer after curing, the light emitting diode package body 100 may be more stably protected from heat stress, vibration, and external impact.

The printed circuit board 23 and the lens injection mold 25 are separated.

Therefore, a light emitting diode package integrated with the light emitting diode lens 20 injection molded through the injection mold 25 may be obtained.

In the detailed description of the invention described above with reference to the preferred embodiment of the present invention, those skilled in the art or those skilled in the art having ordinary knowledge of the present invention described in the claims to be described later It will be understood that various modifications and variations can be made in the present invention without departing from the spirit and scope of the art.

1 is a cross-sectional view showing a cross section of a light emitting diode package according to an embodiment of the present invention;

 2 is a flowchart sequentially showing a method of manufacturing a light emitting diode body according to an embodiment of the present invention;

3A to 3D are schematic diagrams illustrating a manufacturing process of a light emitting diode package according to the present invention.

<Description of the symbols for the main parts of the drawings>

1: light emitting diode chip 3: lead frame

5: wire 7: housing

9: molding 11: adhesive sheet

13: heatsink frame 15: pad frame

20: lens 23: printed circuit board

27: open groove 25: injection mold

31: printed circuit pattern 33: hole

37: lens formation space

100: light emitting diode chip body

Claims (8)

A light emitting diode package body; A printed circuit board having the light emitting diode package body mounted thereon and having various types of circuit patterns formed on a surface thereof in a plate shape; A lens for sealing the light emitting diode package body on the printed circuit board and converting a traveling path of light; Light emitting diode package comprising a. The method of claim 1, And a printed circuit board interposed between the light emitting diode package body and the lens and having at least two holes formed therein. The method of claim 1, The light emitting diode package body, A lead frame including a heat sink frame and a pad frame bonded on the heat sink frame; And a light emitting diode chip mounted on the lead frame and electrically connected to the pad frame. The method of claim 3, wherein The LED package further comprises an adhesive sheet interposed between the heat sink frame and the pad frame. The method of claim 4, wherein The adhesive sheet insulates the conductive heat sink frame and the pad frame. The method of claim 4, wherein The adhesive sheet is a light emitting diode package, characterized in that the same pattern as the pad frame. Forming a lead frame on a substrate, mounting a light emitting diode chip, and preparing a light emitting diode package body electrically connected thereto; Attaching the light emitting diode package body to a printed circuit board having a plurality of holes; Attaching an injection mold defining a lens forming space therein to correspond to the light emitting diode package body attached to the printed circuit board; Injecting the lens molding resin into the lens forming space through a hole opened in the printed circuit board facing the injection mold; Light-emitting diode package manufacturing method comprising the step of separating the printed circuit board and the lens injection mold. The method of claim 7, wherein And injecting the lens molding resin and curing the lens molding resin.
KR1020070118294A 2007-11-20 2007-11-20 Light emitting diode package and method of fabricating the same KR100899554B1 (en)

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Application Number Priority Date Filing Date Title
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Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012023123A1 (en) * 2010-07-29 2012-02-23 제이더블유중외메디칼 주식회사 Shadowless led lamp having lens directly connected to heat sink
KR20120060990A (en) * 2010-10-08 2012-06-12 엘지이노텍 주식회사 Light Emitting Device Module
KR20130041571A (en) * 2011-10-17 2013-04-25 서울반도체 주식회사 Light emitting device and light emitting module comprising the same
KR20130065325A (en) * 2011-12-09 2013-06-19 엘지이노텍 주식회사 The light emitting device package and the light emitting system
CN103511877A (en) * 2012-06-29 2014-01-15 隆达电子股份有限公司 light emitting device
KR20140046734A (en) * 2012-10-11 2014-04-21 엘지이노텍 주식회사 Light emitting apparatus and lighting system having the same
US8878216B2 (en) 2011-07-26 2014-11-04 Samsung Electronics Co., Ltd. Light emitting diode module and method for manufacturing the same
KR20150001978A (en) * 2013-06-28 2015-01-07 엘지디스플레이 주식회사 Light emitting diode package
KR20170011869A (en) * 2015-07-24 2017-02-02 삼성전자주식회사 Light Emitting Diode module
KR20210115808A (en) * 2020-03-16 2021-09-27 (주) 헥사이노힐 Manufacture of all-in-one chip-on-board type light emitting device for low level laser therapy(LLLT) and medical light emitting device using it

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KR101291319B1 (en) 2009-09-18 2013-07-30 한국전자통신연구원 apparatus for generating/detecting THz wave and manufacturing method of the same

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KR20060053468A (en) * 2004-11-16 2006-05-22 엘지이노텍 주식회사 Led package having multitude led
KR100616684B1 (en) * 2005-06-03 2006-08-28 삼성전기주식회사 High power led package and fabrication method thereof
KR100765712B1 (en) * 2006-02-06 2007-10-11 엘지전자 주식회사 Light emitting device package and method of manufacturing the same
KR100729825B1 (en) 2005-12-27 2007-06-18 럭스피아(주) Light emitting unit

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012023123A1 (en) * 2010-07-29 2012-02-23 제이더블유중외메디칼 주식회사 Shadowless led lamp having lens directly connected to heat sink
KR20120060990A (en) * 2010-10-08 2012-06-12 엘지이노텍 주식회사 Light Emitting Device Module
US8878216B2 (en) 2011-07-26 2014-11-04 Samsung Electronics Co., Ltd. Light emitting diode module and method for manufacturing the same
KR20130041571A (en) * 2011-10-17 2013-04-25 서울반도체 주식회사 Light emitting device and light emitting module comprising the same
KR20130065325A (en) * 2011-12-09 2013-06-19 엘지이노텍 주식회사 The light emitting device package and the light emitting system
CN103511877A (en) * 2012-06-29 2014-01-15 隆达电子股份有限公司 light emitting device
KR20140046734A (en) * 2012-10-11 2014-04-21 엘지이노텍 주식회사 Light emitting apparatus and lighting system having the same
KR20150001978A (en) * 2013-06-28 2015-01-07 엘지디스플레이 주식회사 Light emitting diode package
KR20170011869A (en) * 2015-07-24 2017-02-02 삼성전자주식회사 Light Emitting Diode module
KR20210115808A (en) * 2020-03-16 2021-09-27 (주) 헥사이노힐 Manufacture of all-in-one chip-on-board type light emitting device for low level laser therapy(LLLT) and medical light emitting device using it

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