KR20060053468A - Led package having multitude led - Google Patents

Abstract

The present invention relates to an LED package having a plurality of LEDs in one package and improving heat dissipation structure. The LED package according to the present invention includes: a lead frame unit forming at least three electrodes and leads; A light emitting unit having two or more LEDs corresponding to the electrodes; A heat dissipation unit for dissipating heat of the light emitting unit; A mold unit coupled to the heat dissipation unit at a bottom surface thereof; And a lens unit coupled to the upper surface side of the mold unit.

According to the present invention, it is possible to configure a multi-LED package, apart from the conventional single-package configuration, free color expression in the minimum space, regardless of the high temperature of the LED through an efficient thermal design that separates the heat path and the electric path LED package products can be used stably. In addition, according to the present invention, it is possible to maximize the LED mounting by designing the radiator in two stages using MCPCB and adding a circuit to provide a terminal function in one radiator.

Description

LED package having multiple LEDs {LED package having multitude LED}

1 is an exploded perspective view of the structure of the LED package according to the prior art.

Figure 2 is a vertical cross-sectional view of the LED package according to the present invention from the side.

Figure 3 is a vertical cross-sectional view showing the internal configuration when the LED package according to the present invention is equipped with a Fresnel condenser lens.

Figure 4 is a top view showing a lead frame portion provided by the LED package according to the present invention.

Figure 5 is a cross-sectional view showing a form in which the LED package according to the present invention coupled to the upper surface side.

6 is a bottom view of the LED package according to the present invention.

7 is a top view showing a circuit heat dissipation unit according to the present invention.

Figure 8 is a side view showing a circuit radiator according to the present invention.

9 is a top view showing the LED package when the circuit heat shield according to the present invention is coupled.

<Explanation of symbols for main parts of drawing>

10: mold portion 20: lens portion

20a: Fresnel lens 30: lead frame portion

32: electrode 34: lead

40: light emitting part 42: LED

44: submount 46: wire

50: heat dissipation unit 60: circuit heat dissipation unit

62: MCPCB 68: Electrical connection socket

The present invention relates to an LED package.

The present invention relates to a light emitting diode package, and more particularly, to a light emitting diode package that is excellent in heat dissipation performance and can increase freedom of circuit design.

In general, an LED is also called a light emitting diode, which is a device used to send and receive signals by converting an electrical signal into a form of infrared, visible or ultraviolet light using the characteristics of a compound semiconductor.

Usually, the use range of LED is used in home appliances, remote controllers, electronic signs, indicators, and various automation devices, and the types are largely divided into Infrared Emitting Diode (IRD) and Visible Light Emitting Diode (VLED). As follows.

In general, a blue LED has an N-type GaN layer formed on a sapphire substrate, an N-metal on one side of the surface of the N-type GaN layer, and an active layer other than the region where the N-metal is formed.

A P-type GaN layer is formed on the active layer, and a P-metal is formed on the P-type GaN layer.

The active layer is a layer that generates light by combining holes transmitted through the P metal and electrons transmitted through the N metal.

Such LEDs are used in home appliances, electronic displays, and the like according to the intensity of light output. In particular, LEDs are becoming smaller and slimmer in information and communication devices, and peripheral devices such as resistors, capacitors, and noise filters are also used. It is becoming smaller.

Therefore, in order to mount directly on a PCB (Printed Circuit Board) substrate, it is made of Surface Mount Device (SMD) type. As a result, LED lamps used as display elements are also SMD. It is being developed into a mold.

Such SMD can replace the existing simple lighting lamp, which is used for lighting indicators of various colors, character display and image display.

As the use area of LED is widened as described above, the required brightness such as electric light used for living, electric light for rescue signal is getting higher and higher, and high power light emitting diode is widely used in recent years.

Figure 1 is an exploded perspective view of the structure of the LED package according to the prior art. As shown in Figure 1, the LED package structure according to the prior art has an electrode lead frame 130 for applying power to the LED from an external PCB Each LED package body 120 is formed and disposed.

The mold lens 110 is attached to the upper portion of the LED package body 120 to improve the light efficiency of the light generated from the LED 140.

An assembly in which the LED 140 is mounted is coupled to the lower side of the LED package body 120. First, the reflective cup 160 having a high light reflectance is coupled onto the electrical conductor 170. The LED 140 is formed of silicon. Mounted by flip chip bonding or wire bonding on the sub-mount 150 formed as a shape, although not shown in the drawing, the sub-mount 150 is etched to form a reflective hole inside the sub-mount, and a reflective layer is formed on the reflective hole. After forming, the LED 140 is mounted.

When the LED 140 is mounted on the sub-mount 150, the sub-mount 150 is mounted on the reflective cup 160 formed on the conductor 170, and then power can be applied. An electrical connection process is performed with the electrode lead frame 130 of the LED body 120.

The assembled LED package reflects the light generated by the LED 140 in the reflective cup 160 and then diverges to the outside through the mold lens 110.

However, the LED package having the structure as described above has a problem that high heat is generated due to poor heat dissipation performance in the package when the current is increased in order to obtain high output light, and thus high heat is radiated inside the package. If it is not present, the resistance is very high and the light efficiency is reduced. In addition, since the conductor, the reflecting cup, and the package body are separated from each other, there are many thermal resistors, so that the heat generated from the LED is easily removed. There is a disadvantage that is not delivered to.

In addition, since only one LED is mounted inside the body, in order to implement a high output white, three LED packages have to operate in sets. In this case, there are disadvantages in that the control circuit becomes complicated and bulky.

Accordingly, there is a demand for a method capable of mounting a plurality of high-power LEDs in one LED package and dissipating a large amount of heat generated thereby.

An object of the present invention is to provide an LED package which can be provided with a plurality of electrodes and LEDs and which can efficiently assemble these components and connection circuits.

It is also an object of the present invention to provide an LED package which effectively dissipates a considerable amount of heat generated by an LED and selectively uses electrodes using a heat dissipation part as a common terminal.

In addition, an object of the present invention is to provide an LED housing which can increase reflection efficiency and mount various types of lenses.

In order to achieve the above object, the LED package according to the present invention comprises a lead frame unit for forming three or more electrodes and leads; A light emitting unit having two or more LEDs corresponding to the electrodes; A heat dissipation unit for dissipating heat of the light emitting unit; A mold unit coupled to the heat dissipation unit at a bottom surface thereof; And a lens unit coupled to the upper surface side of the mold unit.

In addition, the present invention is a metal plate coated with an insulating layer to provide a heat dissipation function to the bottom surface of the insulating layer, the upper surface of the insulating layer to form an electrical connection socket, an electrode electrically connected to the lead and a metal core printed circuit, the top surface Further characterized in that it further comprises a circuit radiator coupled to the radiator.

In addition, the circuit heat dissipation unit according to the present invention further includes an electrode on a surface in contact with the heat dissipation unit to connect the electrode to the printed circuit so that the heat dissipation unit is used as a common terminal, the circuit heat dissipation unit any one of the lead Alternatively, the heat dissipation unit may be configured to configure the electrical connection socket and the printed circuit to be used as a common terminal.

Hereinafter, an LED package according to the present invention will be described in detail with reference to the accompanying drawings.

Figure 2 is a vertical cross-sectional view of the LED package according to the present invention from the side, Figure 3 is a vertical cross-sectional view showing the internal configuration when the LED package according to the present invention is equipped with a Fresnel condensing lens. 4 is a top view illustrating the lead frame unit 30 included in the LED package according to the present invention.

2, the LED package according to the present invention includes a mold part 10, a lens part 20, a lead frame part 30, a light emitting part 40, and a heat dissipation part 50.

First, the mold part 10 provides a housing space for the lead frame part 30 and the light emitting part 40 to be located. The heat dissipation part 50 is coupled to the bottom side and the lens part 20 to the image side. ).

In the mold 10 according to the present invention, the inner surface of the mold 10 is plated with a reflecting material to expand the reflecting space, and since the mold part 10 is not provided with a separate reflecting cup, the reflecting space may be simultaneously provided to the housing space.

Therefore, a plurality of different components may be installed in the expanded reflective space, and the lens unit 20 may be coupled to the entire upper surface, thereby allowing various lens units to be attached. The inner surface of the mold portion 10 is preferably plated with silver (Ag).

The lens unit 20 collects and transmits the light transmitted from the mold unit 10 to the outside, and a hemispherical convex lens or a Fresnel condenser lens (FIG. 3: 20a) may be used as the lens.

The lead frame unit 30 may form a plurality of electrodes 32 and leads 34. In describing the embodiment of the present invention, the lead frame unit 30 according to the present invention is illustrated in FIG. 4. ) Forms four electrodes 32 and leads 34. However, the conventional lead frame unit 30 forms a pair of electrodes and leads for one LED. The lead frame unit 30 is positioned and fixed on the heat dissipation unit 50. In this case, the lead frame unit 30 is insulated from the heat dissipation unit 50 through an insulating material 5.

The three electrodes 32 are electrically connected to the three LEDs 42 on the top surface of the heat dissipation unit 50, and the other one electrode 32 is used as a common terminal. The terminal of the LED 42 is wire-bonded with the electrode 32, in the present invention is connected through the gold wire 46. A portion of the four leads 34 protrudes out of the space in which the heat dissipation part 50 and the mold part 10 are combined to be connected to an external control circuit or a circuit heat dissipation part to be described below.

The three LEDs 42 have a positive wire terminal bonded to each of the three electrodes 32 with gold wires, and the negative terminals of the LEDs 42 are gold wire bonded to the heat dissipation unit 50, and the remaining portions are used as common terminals. One electrode 32 is gold-bonded with the heat dissipation unit 50. LED package according to the present invention is characterized in that it comprises a plurality of light emitting portion 40, as described above, if the electrode 32 of the lead frame portion 30 is provided with four light emitting portion 40 is Three LEDs 42 may be provided.

According to the present invention, the light emitting unit 40 may be provided with a large area LED flip chip (in this case, the shape of the electrode of the lead frame unit 30 should be different), respectively, red LED, green LED and blue LED It can be provided with a variety of colors. For example, when all three LEDs 42 emit light, white light is displayed through the lens unit 20.

As described above, the three LEDs 42 are electrically connected to the leads 34 through the electrodes 32 and to place the three submounts 44 on the bottom of the LEDs 42, respectively. The submount 44 may be removed and mounted directly to the heat dissipation unit 50.

If in the conventional LED package configuration, a plurality of LEDs 42 are required to have a plurality of reflecting cups and complicated electrode / lead connection, and the lens unit must also be equipped with lenses corresponding to each LED.

The heat dissipation unit 50 fixes the lead frame unit 30 and the light emitting unit 40 to an upper surface, and is coupled to the side wall of the mold unit 10 to form a closed space. The heat dissipation unit 50 is electrically insulated by coating an insulating material 5 when combined with the lead frame unit 30 and the mold unit 10.

Since the light emitting part 40 according to the present invention includes three LEDs 42, the heat of the light emitting part 40 will be considerably higher than that of the conventional one, and thus the heat dissipating part 50 can efficiently absorb this heat. Must be released. The heat dissipation unit 50 is made of a heat conductive metal heat dissipation pad, and is preferably provided as an oxygen free copper (OFHC) heat dissipation pad.

Oxygen-free copper is copper which prevents the formation of oxide particles by removing impurities such as iron, sulfur, antimony, aluminum, and arsenic. Unlike general copper having 250 ppm of oxide, oxygen-free copper has only 50 ppm of oxide component. Therefore, the heat dissipation pad made of oxygen-free copper has a low physical interference, high electrical conductivity, and thermal conductivity.

The closed space formed by combining the heat dissipation unit 50, the lens unit 20, the lead frame unit 30, and the mold unit 10 may be filled with the high refractive index transparent filler 7.

5 is a parallel cross-sectional view showing a form in which the LED package according to the present invention is coupled to the upper surface side.

5 is a cross-sectional view of the middle portion of the mold portion 10 in parallel, and the lens portion is not shown. As shown in FIG. 5, the mold part 10 forms a side wall of the housing space and covers and insulates a portion where the heat dissipation part 50 is exposed by covering the bottom.

The heat dissipation unit 50 is in a state where only the surface where the light emitting unit 40 is located is exposed, and the light emitting unit 40 is fixed to the sub mount 44 by placing it on the bottom surface thereof.

The lead frame part 30 positioned on the heat dissipation part 50 may include leads 34 exposed to the outside of the mold part 10 and electrodes 32 assembled next to a space in which the light emitting part 40 is located. As shown, the electrodes 32 are electrically connected to the light emitting part 40.

6 is a bottom view of the LED package according to the present invention.

Referring to FIG. 6, only the lead 34 of the heat dissipation part 50 and the lead frame part 30 is shown, and the portion A is a part where the electrode 32 and the light emitting part 40 are located. have.

The heat dissipation unit 50 has four quadrangular partial cut surfaces to expose the leads 34 to the outside, and fixes the leads 34 in a state where the insulating material 5 is applied.

Hereinafter, with reference to the accompanying drawings, the LED package according to the present invention further comprises a circuit radiator, the configuration and coupling structure will be described.

7 is a top view of the circuit heat dissipation unit 60 according to the present invention, and FIG. 8 is a side view of the circuit heat dissipation unit 60 according to the present invention.

The circuit heat dissipation unit 60 is made of a metal plate 62 coated with an insulation layer, preferably made of an aluminum plate coated with an insulation layer. The circuit heat dissipation unit 60 receives heat emitted from the heat dissipation unit 50 and finally releases it to the outside.

The circuit heat dissipation unit 60 is preferably manufactured in the form of MCPCB (Metal Core Printed Circuit Board), and in combination with the heat dissipation unit 50, a tape, an adhesive, or a mechanical fastener may be used. The use of adhesives is advantageous in terms of thermal conductivity and stability.

The circuit heat dissipation unit 60 provides a heat dissipation function as described above to the bottom of the insulating layer, and provides an electrical connection function to the top of the insulating layer. That is, the circuit heat dissipating part 60 forms an electrical connection socket 68, an electrode 64 electrically connected to the lead 34, and a metal core printed circuit 66 on the insulating layer. The LED package facilitates its electrical connection when used in conjunction with an external device. The electrode 64 of the circuit radiator 60 is formed at a position where the lead 34 exposed to the outside of the heat radiator 50 may contact.

Here, there is a way to use the LED package more efficiently by adding another function to the circuit radiator 60.

First, the circuit heat dissipation unit 60 further includes an electrode 64a at a bonding surface with the heat dissipation unit 50, and connects the electrode 64a to the printed circuit 66. The heat dissipation unit 50 is connected to the light emitting unit 40 by a wire. In this case, the heat dissipation unit 50 may provide another terminal function, which is preferably used as a common terminal of the LED 42.

When the heat dissipation unit 50 provides a function as a terminal, the electrical connection socket 68 may be provided as a 5-pin socket.

FIG. 9 is a top view illustrating the LED package when the circuit heat dissipation unit 60 according to the present invention is coupled. The LED package, which is finally coupled, is connected to a connection line of another external device to the electrical connection socket 68. It is very convenient to use.

According to FIG. 9, the LED package according to the present invention is equipped with four LEDs 42 and electrically connects four electrodes of the lead frame unit 30 to the respective LEDs 42.

The user can physically control the LED 42 by selectively connecting the pins of the electrical connection socket 68.

The present invention has been described above with reference to the preferred embodiments, which are merely examples and are not intended to limit the present invention, and those skilled in the art to which the present invention pertains do not depart from the essential characteristics of the present invention. It will be appreciated that various modifications and applications are not possible that are not illustrated above. For example, each component specifically shown in the embodiment of the present invention can be modified. And differences relating to such modifications and applications will have to be construed as being included in the scope of the invention defined in the appended claims.

As described above, according to the LED package according to the present invention, it is possible to configure a multi-LED package capable of expressing a variety of colors out of the conventional single-piece package configuration, there is an effect that can freely color expression in the minimum space.

In addition, through efficient thermal design that separates the heat path and the electric path, the LED package product can be stably used regardless of the high temperature of the LED, and the life of the product can be extended.

In addition, according to the present invention, it is possible to maximize the mounting of the LED by designing the radiator in two stages using the MCPCB and adding a circuit to provide a terminal function in one radiator.

Claims (11)

A lead frame unit forming at least three electrodes and leads; A light emitting unit having two or more LEDs corresponding to the electrodes; A heat dissipation unit for dissipating heat of the light emitting unit; A mold unit coupled to the heat dissipation unit at a bottom surface thereof; And LED package comprising a lens portion coupled to the upper surface side of the mold portion. The method of claim 1, wherein the mold portion The inner surface is plated with a reflective material to expand the reflective space, and provide the reflective space to the housing space so that the lead frame portion and the light emitting portion can be located. The method of claim 1, Insulating layer coated metal plate to provide a heat dissipation function to the bottom of the insulating layer, The upper surface of the insulating layer is formed of an electrical connection socket, an electrode electrically connected to the lead and a metal core printed circuit, the LED package, characterized in that further comprising a circuit radiator coupled to the heat dissipation portion on the upper surface. The method of claim 3, wherein the circuit radiator The LED package, characterized in that further comprising an electrode on the surface in contact with the heat dissipation portion, by connecting the electrode to the printed circuit so that the heat dissipation portion is used as a common terminal. The method of claim 4, wherein the circuit radiator The LED package, characterized in that for configuring any one of the leads or the heat dissipation unit and the electrical connection socket and the printed circuit to be used as a common terminal. The method of claim 1, wherein the mold portion LED package, characterized in that the insulation by coating an insulating material on the bonding surface and the heat radiating portion and the lead frame portion. The method of claim 1, The light emitting unit is a LED package, characterized in that it comprises a red LED, a green LED and a blue LED. The method of claim 1, wherein the lens unit LED package, characterized in that provided as a hemispherical convex lens or Fresnel condensing lens. The method of claim 1, wherein the heat dissipation unit LED package, characterized in that provided with an oxygen-free copper heat radiation pad. The method of claim 1, wherein the mold portion LED package, characterized in that the high refractive index transparent filler is provided in the housing space. The method of claim 1, wherein the mold portion LED package, characterized in that the locking step is provided at the upper end, the lens unit is coupled to the locking step.

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