KR20050101737A - Light emitting diode package - Google Patents

Abstract

The present invention discloses a light emitting diode package comprising heat dissipation means and a plurality of electrode leads in an LED package to facilitate heat dissipation and circuit configuration. The disclosed invention includes a sub-mount in which a light emitting diode is mounted; A plurality of leads electrically connected to electrodes of the light emitting diode; Heat dissipation means formed in said sub-mount; And a molding part disposed on the sub mount.

Here, further comprising a lens formed on the molding portion of the upper portion of the mounted light emitting diode, wherein the plurality of leads are composed of two or more pairs of leads, at least one pair of the plurality of leads is an integral structure electrically connected, The heat dissipation means is formed integrally with the sub-mount.

Description

Light Emitting Diode Package {LIGHT EMITTING DIODE PACKAGE}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting diode package, and more particularly, to a light emitting diode package having improved heat conduction and heat dissipation performance and improved circuit configuration of a mounted light emitting diode.

Generally, a light emitting diode (LED) is also called a light emitting diode, which is a device used to send and receive signals by converting an electric signal into an infrared, visible or light form using the characteristics of a compound semiconductor.

Usually, the use range of LED is used in home appliances, remote controllers, electronic signs, indicators, and various automation devices, and the types are largely divided into Infrared Emitting Diode (IRD) and Visible Light Emitting Diode (VLED).

The structure of the LED is generally as follows.

In general, unlike a red LED, a blue LED has an N-type GaN layer formed on a sapphire substrate, an N-metal on one side of the surface of the N-type GaN layer, and an active layer in addition to the region where the N-metal is formed. .

A P-type GaN layer is formed on the active layer, and a P-metal is formed on the P-type GaN layer.

The active layer is a layer that generates light by combining holes transmitted through the P metal and electrons transmitted through the N metal.

The LED is used in home appliances, electronic signs, and the like, according to the intensity of light output. The following shows a structure in which LEDs are packaged on a backlight lead frame.

In particular, LEDs are becoming smaller and slimmer in information and communication devices, and peripheral devices, such as resistors, capacitors, and noise filters, are becoming smaller.

Therefore, it is made of a surface mount device (hereinafter referred to as SMD) type for mounting directly on a PCB (Printed Circuit Board) substrate.

Accordingly, LED lamps, which are used as display elements, are also being developed in SMD type.

Such SMD can replace the existing simple lighting lamp, which is used for lighting indicators of various colors, character display and image display.

As the use area of LEDs becomes wider as described above, the amount of luminance required such as electric lamps for living, electric power for rescue signals, etc. also increases, and high power light emitting diodes are widely used in recent years.

1 is an exploded perspective view of a structure of a light emitting diode package according to the prior art.

As shown in FIG. 1, in the LED package structure according to the related art, an electrode lead frame 102 for applying power to the light emitting diode from an external PCB is formed on the light emitting diode package body 100, respectively.

A mold lens 111 is attached to the light emitting diode package body 100 to improve light efficiency of light generated from the light emitting diode 10.

An assembly in which the light emitting diode 10 is mounted is coupled to the lower side of the light emitting diode package body 100. First, a reflective cup 21 having a high light reflectance is coupled to the electrical conductor 20.

The light emitting diode 10 is mounted by flip chip bonding or wire bonding on a sub-mount (SMD) 15 formed of silicon. Although not shown in the drawing, the light-emitting diode 10 is formed by etching the sub-mount 15 to form a reflection hole inside the sub-mount. The light emitting diode 10 is mounted, and then a reflective layer is formed on the reflective hole.

When the light emitting diode 10 is mounted on the sub mount 15, the sub mount 15 is mounted on the reflection cup 21 formed on the conductor 20, and then power may be applied. An electrical connection process is performed with the electrode lead frame 102 of the LED body 100.

The assembled LED package reflects the light generated from the light emitting diode 10 in the reflective cup 21 and then diverges to the outside through the mold lens 111.

However, the light emitting diode package having the structure as described above has a problem of high heat generation due to poor heat dissipation performance when the current is increased in order to obtain high output light.

As such, high heat is not radiated inside the package, and when present as it is, the resistance is very high and the light efficiency is reduced.

In addition, the conventional LED package has a disadvantage that the conductor, the reflecting cup, the package body, etc. are separated from each other, so that many heat resistors exist so that heat generated from the LED is not easily transferred to the outside.

The present invention, by arranging the electrode leads connected to the electrode of the LED mounted in the LED package in various ways, by arranging a heat dissipation film that serves as a heat sink in the area where the LED is mounted, thereby improving the thermal conductivity of the package while improving the thermal design performance It is an object of the present invention to provide an improved LED package.

In order to achieve the above object, a light emitting diode package according to the present invention,

A sub-mount in which a light emitting diode is mounted;

A plurality of leads electrically connected to electrodes of the light emitting diode;

Heat dissipation means formed in said sub-mount; And

And a molding part disposed on the sub mount.

Here, further comprising a lens formed on the molding portion of the upper portion of the mounted light emitting diode, wherein the plurality of leads are composed of two or more pairs of leads, at least one pair of the plurality of leads is an integral structure electrically connected, The heat dissipation means is formed integrally with the sub-mount.

In addition, the heat dissipation means is one side is drawn out to the outside of the package to radiate heat generated from the LED to the outside, the heat dissipation means is any one of Cu, Al alloy or ceramic material, the structure of the sub-mount square, polygon , Characterized in that it is in the shape of any one of a circular or oval.

In addition, the heat dissipation means includes a heat dissipation plate and a heat dissipation film, characterized in that the heat dissipation plate and the heat dissipation film is formed integrally.

According to the present invention, by arranging the electrode leads connected to the electrode of the LED mounted in the LED package in various ways, by disposing a heat dissipation film acting as a heat sink in the area where the LED is mounted, while improving the circuit design performance of the package, the thermal conductivity To improve.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

2 is a view showing the structure of a light emitting diode package according to the present invention.

As shown in FIG. 2, a reflective hole is formed by etching in a central region of a sub mount 201 formed of silicon, and an LED 250 is mounted in the reflective hole region.

Although not clearly shown in the drawing, the heat dissipation means, which serves as a heat sink, is integrally formed on the sub-mount 201 to dissipate heat generated by the mounted LED 250, or the sub-mount ( 201) is configured to attach a heat dissipation means that can serve as a heat sink.

The integrally formed includes simultaneously performing the role of the heat dissipation means 210 of the sub-mount 201.

The heat dissipation means 210 uses a metal having excellent thermal conductivity, or uses Cu, Al alloy or ceramic material.

When the heat dissipation means 210 is integrally formed with the sub mount 201, the heat dissipation means 210 may be pulled out of the package in a film form on one side of the sub mount 201 to be generated from the mounted LED 250. Heat dissipation to the outside.

However, when the heat dissipation means 210 is attached to the sub-mount 201, the heat dissipation means 210 is configured in the form of a heat dissipation plate and a heat dissipation film, and the LED 250 is in contact with the heat dissipation plate, and is led out of the heat dissipation plate and the package. The heat radiation film is connected to heat the heat to the outside.

Here, the heat sink and the heat radiation film are integrally formed.

The LED 250 is mounted on the reflection hole formed in the sub-mount 201, and is connected to a plurality of electrode leads disposed on the sub-mount 201 by bonding the wire 215.

The electrode lead is spaced apart from the lower submount 201 and the molding part 203. This is because the submount 201 is made of a metal material to prevent electrical short.

The electrode lead is formed on the submount 201 by placing a support for supporting the electrode lead, and then epoxy between the electrode lead and the submount 201 when molding with epoxy or ceramic. Alternatively, the molding part 203 is formed to fill the ceramic.

The molding part 203 is molded along the circumference of the sub-mount 201, and covers a molding case during the molding operation so that the molding material is not filled in the area where the LED 250 is mounted.

The electrode leads are formed by forming an anode electrode as a first anode lead 205 and a second anode lead 205a so as to facilitate a circuit design, unlike in the prior art. The first cathode lead 206 and the second cathode lead 206a were formed and disposed.

The first anode lead 205 and the second anode lead 205a are integrally formed, and the surface drawn out to the outside of the LED package 200 is changed to facilitate circuit design. Although drawings are drawn in the direction perpendicular to each other, the electrode leads can be drawn out in various ways.

Similarly, the second cathode lead 206 and the second cathode lead 206a are integrally formed, and the surface drawn out to the outside of the LED package 200 is changed to facilitate the circuit design. Although drawings are drawn in the direction perpendicular to each other, the electrode leads can be drawn out in various directions.

The electrodes of the LED 250 mounted on the sub-mount 201 are connected to the first and second anode electrodes 205 and 205a and the first and second cathode electrodes 206 and 206a by wires 215. Is connected to.

In addition, a heat dissipation means 210 serving as a heat sink is disposed on a surface of the sub-mount 201 on which the LED 250 is mounted, and an LED 250 is mounted on the heat dissipation means 210 to improve thermal conduction efficiency. I was.

Here, the heat dissipation means 210 is integrally formed with the sub mount 201, and extended outwardly in the form of a heat dissipation film on one side of the sub mount 201 to increase the heat dissipation performance.

Accordingly, one side of the heat dissipation means 210 is drawn out to the outside of the LED package 200 so that the heat generated from the LED 250 is conducted along the heat dissipation means 210 to quickly dissipate to the outside.

 In addition, a lens 211 formed of an epoxy resin is formed on the sub-mount 201 on which the LED 250 is mounted, thereby improving light efficiency generated from the LED 250.

However, when the sub-mount 201 and the heat dissipation means 210 are separated, a heat dissipation plate is disposed on the sub-mount 201 on which the LED 250 is mounted, and a heat dissipation film connected to the heat dissipation package is packaged. It is formed to be drawn out.

The effect is the same as that of the heat dissipation means 250 and the sub-mount 201.

3 is a plan view of a light emitting diode package according to the present invention.

As shown in FIG. 3, the first and second anode leads 205 and 205a and the first and second cathode leads 206 in which the LEDs 250 are disposed at both sides by wire bonding in the center area of the sub-mount 201. , 206a).

The first anode lead 205 is drawn out to the upper side of the LED package, and the second anode lead 205a is drawn out to the right side of the LED package 200.

Similarly, the first cathode electrode 206 and the second cathode electrode 206a are drawn out in directions perpendicular to each other.

The heat dissipation means 210 is drawn out between the second anode lead 205a and the second cathode lead 206a.

Since the heat dissipation means 210 is formed integrally with the sub mount 201, the LED is mounted on the sub mount 201, and the sub mount 201 is formed from a portion in contact with the LED 250. ) And the metal was stretched out to the outside.

In addition, the portion drawn out to the outside of the LED package 200 is in the form of a film, and serves to radiate heat to the outside.

Therefore, heat generated from the LED 250 is transferred to the heat dissipation means 210 which is in contact with the integrated, and heat conducted to the heat dissipation means 210 is radiated along the heat dissipation film drawn out of the package.

Therefore, the LED package according to the present invention has an advantage in that the circuit design is easy when designing the LED package 250 with other elements by drawing electrode leads at various angles.

In addition, heat can be continuously dissipated to the outside through the heat dissipation means 210 which is in direct contact with the LED 250, so that the light efficiency is not degraded despite the use of the high power LED.

In addition, although the structure of the sub-mount 201 has been described in terms of a rectangular structure in this drawing, packages of various shapes of light emitting diodes may be manufactured by implementing the circular, elliptical, and polygonal shapes.

4 is a side view of the LED package according to the present invention.

As shown in FIG. 4, a first cathode lead 206 is disposed in a rear direction along a side circumference of the sub mount 201 toward one side of the sub mount 201 where the LED 250 is mounted. The second cathode lead 206a integrally connected with the first cathode lead 206 is led out of the submount 201 in a direction perpendicular thereto.

Although not shown in the drawing, the structures of the first and second anode leads 205 and 205a corresponding to the first and second cathode leads 206 and 206a also have a corresponding structure.

An LED 250 is mounted on the sub-mount 201, and a molding part 203 made of epoxy resin or ceramic is formed on a region where the LED 250 is mounted.

The molding part 203 is molded in a shape surrounding the entire sub-mount 201 and cannot penetrate into the LED 250 in which the foreign matter is mounted from the outside.

A lens 211 made of an epoxy resin is formed on the molding unit 203 on which the LED 250 is mounted to improve the efficiency of light generated from the LED 250.

Between the molding unit 203 and the sub-mount 201, a heat dissipation means 210 for dissipating heat generated from the LED 250 to the outside is formed integrally with the sub-mount 201, the one side The second cathode lead 205a is drawn out in the extraction direction.

However, when the heat dissipation means 210 is formed of a metal different from the sub-mount 201, a metal film having excellent thermal conductivity is attached to an area of the sub-mount 201 where the LED 250 is mounted. Can be withdrawn.

Accordingly, the electrode lead is drawn out from the LED 250 in various directions to facilitate design with an external circuit, while continuously dissipating heat generated from the LED 250 by the heat dissipation means 210.

Since the heat dissipation means 210 is formed integrally with the sub mount 201 or attached to the sub mount 201, the heat dissipation means 210 is in direct contact with the mounted LED 250 and thus has excellent heat dissipation performance.

As described in detail above, the present invention has an effect of facilitating circuit design by arranging a plurality of electrode leads drawn out from the LED package.

In addition, there is an effect of improving the thermal conductivity and heat dissipation performance from the mounted LED.

The present invention is not limited to the above-described embodiments, and various changes can be made by those skilled in the art without departing from the gist of the present invention as claimed in the following claims.

1 is an exploded perspective view of a structure of a light emitting diode package according to the prior art.

2 is a view showing the structure of a light emitting diode package according to the present invention.

3 is a plan view of a light emitting diode package according to the present invention;

4 is a side view of a light emitting diode package according to the present invention;

* Description of the symbols for the main parts of the drawings *

200: LED package 201: submount

203: molding part 205: first anode lead

205a: second anode lead 206: first cathode lead

206a: second cathode lead 210: heat dissipation means

215: wire 250: LED

Claims (10)

A sub-mount in which a light emitting diode is mounted; A plurality of leads electrically connected to electrodes of the light emitting diode; Heat dissipation means formed in said sub-mount; And And a molding part disposed on the sub-mount. The method of claim 1, The lens formed on the molded part of the upper portion of the mounted light emitting diode further Light emitting diode package comprising a. The method of claim 1, The plurality of leads is a light emitting diode package, characterized in that composed of two or more pairs of leads. The method of claim 3, wherein At least one pair of the plurality of leads is a light emitting diode package, characterized in that the integral structure. The method of claim 1, The heat dissipation means is a light emitting diode package, characterized in that formed integrally with the sub-mount. The method of claim 1, The heat dissipation means is a light emitting diode package, characterized in that one side is drawn to the outside of the package to radiate heat generated from the LED to the outside. The method of claim 1, The heat dissipation means is a light emitting diode package, characterized in that any one of Cu, Al alloy or ceramic material. The method of claim 1, The structure of the sub-mount is a light emitting diode package, characterized in that the shape of any one of a rectangle, polygon, circle or oval. The method of claim 1, The heat dissipation means is a light emitting diode package comprising a heat sink and a heat dissipation film. The method of claim 9, The heat sink and the heat dissipation film is a light emitting diode package, characterized in that the structure formed integrally.