KR100550750B1 - Luminescent diode package and method for manufacturing led package - Google Patents

Abstract

The present invention discloses a light emitting diode package excellent in heat dissipation while maintaining a high brightness by mounting a plurality of high output light emitting diodes in a package form, and a method of manufacturing the same. The present invention discloses a plurality of light emitting diodes; A plurality of light emitting diodes mounted thereon, the wiring unit controlling power and signal input / output to the plurality of light emitting diodes and transferring heat generated from the plurality of light emitting diodes to the outside ; A reflection cup part coupled to the wiring part to reflect light of the light emitting diodes; And a lens unit disposed on the reflective cup unit to irradiate light generated from the light emitting diode to the outside.

Here, a heat sink for dissipating heat generated from the light emitting diode to the outside through the wiring portion is attached to the rear surface of the wiring portion on which the light emitting diode is mounted, and the lens portion is a Fresnel lens having various shapes. The wiring portion is characterized in that the metal heat dissipation PCB.

Light-emitting diode, package, red, green, blue

Description

Light emitting diode package and manufacturing method thereof {LUMINESCENT DIODE PACKAGE AND METHOD FOR MANUFACTURING LED PACKAGE}

1 is a view showing a light emitting diode package according to the prior art.

2 illustrates a light emitting diode package in which several light emitting diodes are mounted in a single mold lens according to the prior art;

3 illustrates a high power light emitting diode package according to the present invention;

4 is a view showing the shape of the LED package manufactured by the present invention.

* Description of the symbols for the main parts of the drawings *

300: LED package 301a: red LED chip

301b: green LED chip 301c: blue LED chip

311; Reflective cup portion 320: wiring portion

322: silicone resin 330: lens unit

350: heat sink

The present invention relates to a light emitting diode package and a method for manufacturing the same, and more particularly, to a light emitting diode package having excellent high brightness and heat dissipation in which a plurality of high output light emitting diodes are packaged, and a method of manufacturing the same.

In general, a light emitting diode is a diode that emits excess energy as light when the injected electrons and holes recombine, a red light emitting diode using GaAsP, a green light emitting diode using GaP, and an InGaN / AlGaN double hetero. And blue light emitting diodes using the structure.

Such light emitting diodes are widely used in various fields such as numeric character display devices, traffic light sensors, light coupling devices, and the like due to their low voltage and low power.

In order to manufacture high quality light emitting diodes, the following four points must be satisfied.

The first is good brightness, the second is long life, the third is thermal stability, and the fourth is to operate at low voltage.

Among them, the luminance is closely related to the power consumption of the device, which is currently being developed in various directions to increase the luminance of the light emitting diode.

The basic structure of such a light emitting diode is a GaN buffer layer, an under GaN layer, an n-type dopant GaN layer, an active layer, and a P-type gallium nitride layer on the sapphire substrate in order to complete the light emitting diode.

A transparent metal (TM) layer is grown on the P-type gallium nitride layer to transmit light generated from the active layer to the outside.

The operating principle of the LED having the structure described above is that when a forward voltage is applied to a semiconductor of a specific element, electrons and holes move and recombine with each other through the junction of the positive and negative electrodes. The combination causes the energy level to fall and emit light.

In addition, the LED is generally 0.25 mm 2, which is very small and manufactured in size, and is mounted on an epoxy mold, a lead frame, and a PCB.

Currently, the most commonly used LEDs are 5mm (T 1 3/4) plastic packages or new types of packages depending on the specific application. The color of the light emitted by the LED creates a wavelength depending on the composition of the semiconductor chip components, and the wavelength determines the color of the light.

In particular, LEDs are becoming smaller and smaller, such as resistors, capacitors, and noise filters, due to the trend toward miniaturization and slimming of information and communication devices, and directly mounting them on a PCB (Printed Circuit Board) board. In order to make the surface mount device (Surface Mount Device) type.

Accordingly, LED lamps, which are used as display elements, are also being developed in SMD type. Such SMD can replace the existing simple lighting lamp, which is used for lighting indicators of various colors, character display and image display.

As the wider area using the LED as described above, the high and increasing the amount of the luminance is also required, such as light, signal light structure that is used for living, in recent years, a high-power light-emitting diode widely used.

1 is a view showing a light emitting diode package according to the prior art.

As shown in FIG. 1, the red LED chip 101a, the green LED chip 101b, and the blue LED chip 101c are independently molded to form the LED package 100.

That is, the red LED chip 101a, the green LED chip 101b, and the blue LED chip 101c are respectively mounted on the wiring part 120 used for the LED package 100, and each LED chip 101a is mounted. The red mold 110a, the green mold 110b, and the blue mold 110c are performed on the, 101b and 101c.

In addition, signal input / output terminals drawn from the individually mounted red LED chip 101a, green LED chip 101b, and blue LED chip 101c are bonded on the wiring unit 120, and the bonded input / output The terminal is electrically connected to the connection pin 121 disposed under the wiring part 120 to be exposed to the outside of the wiring part 120.

The red LED chip (101a), a green LED chip (101b), blue LED chips (101c) are electrically connected to the wiring 120 by wire bonding (wire bonding), by an epoxy resin (epoxy), respectively Molded.

Since the conventional LED package 100 having the above structure is driven at low power, and each LED chip is driven independently, the characteristic of the monochromatic light corresponding to each LED chip is excellent.

FIG. 2 is a view illustrating a light emitting diode package (LED package) in which a plurality of light emitting diodes are mounted in a single mold lens according to the prior art, and as shown, a red LED chip 201a and a green LED in one single mold. The chip 201b and the blue LED chip 201c are mounted together.

That is, the red LED chip 201a, the green LED chip 201b, and the blue LED chip 201c are wire bonded on the wiring unit 220, and the wire bonded LED chips 201a, 201b, and 201c are on the wire. The light emitting diode package (LED Package) 200 is completed by forming the package mold 210 with an epoxy resin.

At this time, since the LED chips 201a, 201b, and 201c are disposed in one mold, the electrical connection relationship between the wiring unit 220 and the LED chips 201a, 201b, and 201c is molded for each LED chip. Since it is simpler than that, the number of the connecting pins 221 exposed under the wiring unit 220 is smaller.

In addition, since all three LED chips are molded by one epoxy, it is advantageous to implement a high power light emitting diode package.

However, in the LED package according to the related art, as shown in FIG. 1, a method of independently molding the red LED chip, the green LED chip, and the blue LED chip, respectively, is intended to form a high output light emitting diode package. Since each must be mounted, the manufacturing process of the package is very complicated and bulky.

In addition, since each LED chip has a resistance component, there are many thermal resistors, and thus, power loss and heat dissipation are difficult.

The structure of mounting three LED chips in a single mold described in FIG. 2 requires wire bonding to electrically connect the LED chips on the wiring part, which causes a complicated process and a large volume for high brightness output.

In particular, since a plurality of LED chips are mounted in one single mold, heat generation is higher than that of an LED package independently molded, but heat dissipation is more difficult.

SUMMARY OF THE INVENTION An object of the present invention is to provide a light emitting diode package and a method of manufacturing the same, in which a plurality of high power light emitting diodes are mounted in a package form and a heat sink is attached to the back surface of the package to provide excellent heat emission while providing high brightness.

In order to achieve the above object, a light emitting diode package according to the present invention,
A plurality of light emitting diodes;

A plurality of light emitting diodes mounted thereon, the wiring unit controlling power and signal input / output to the plurality of light emitting diodes and transferring heat generated from the plurality of light emitting diodes to the outside ;

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A reflection cup part coupled to the wiring part to reflect light of the light emitting diodes; And

And a lens part disposed on the reflective cup part to irradiate light generated from the light emitting diode to the outside.

Here, a heat sink for dissipating heat generated from the light emitting diode to the outside through the wiring portion is attached to the rear surface of the wiring portion on which the light emitting diode is mounted, and the lens portion is a Fresnel lens having various shapes. The wiring portion is characterized in that the metal heat dissipation PCB.

And the shape of the Fresnel lens is a convex lens shape of the center, the concave-convex shape of the left and right symmetry around the convex lens, the heat sink is formed in the concave-convex shape to expand the surface area, the material of the reflective cup portion , Al or polycarbonate, and the surface of the region in which the light emitting diode is mounted inside the reflective cup is subjected to a reflective coating by Ag.

In addition, the LED package manufacturing method of the present invention,

Mounting a plurality of light emitting diodes on a wiring portion formed of metal to transfer heat to the outside ;

Mounting a reflective cup part for light reflection on the wiring part on which the light emitting diodes are mounted;

Performing a molding operation on an inner side of an open reflection cup unit in which the light emitting diode is mounted; And

Attaching a lens on the reflective cup portion on which the molding operation is performed; Characterized in that it comprises a.

Here, a heat sink is further included on a rear surface of the wiring unit to which the lens is attached, and the LED chips to be mounted on the wiring unit are selected by one of wire bonding and flip chip bonding.

According to the present invention, there is an advantage in that the heat dissipation is attached to the rear surface of the package while maximizing luminance by mounting a plurality of high output light emitting diodes in the form of a package, so that heat emission is excellent.

In addition, the manufacturing process is simplified because a plurality of LED chips are packaged in one package.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

3 is a view showing a high power light emitting diode package according to the present invention.

As shown in FIG. 3, the high output light emitting diode package is divided into light emitting diode parts 301a, 301b, and 301c, a lens part 330, and a wiring part 320.

The light emitting diodes 301a, 301b, and 301c include red LED chips 301a, green LED chips 301b, and blue LED chips 301c that emit red, blue, and green colors. ) Is a combination of multiple. In FIG. 3, three LED chips 301a, 301b, and 301c will be described. However, as shown in FIG. 4, a plurality of LED chips may be used to correspond to various types of Fresnel lenses.

The lens unit 330 is composed of a Fresnel lens, and the structure of the Fresnel lens has a convex lens structure having a low center height, and the left and right shapes of the convex lens have symmetrical concave-convex shapes. The height is similar to the convex lens.

The Fresnel lens having the structure as described above has the advantage that the height is reduced compared to the LED lens structure by the conventional molding, and can maintain the same brightness.

The wiring part 320 is formed of a metal heat-dissipating metal core printed circuit board (PCB), and the LED chips 301a, 301b, and 301c are mounted and electrically connected thereto.

The metal heat dissipation PCB of the wiring unit 320 is used for a large area capable of mounting a plurality of chips, and electrically connects the terminals of the mounted chips, and applies a current to operate the chips. Can be.

In addition, since the wiring unit 320 is made of a metal, high heat generated from the mounted LED chips 301a, 301b, and 301c can be discharged to the outside through the wiring unit 320, thereby providing excellent heat dissipation. Do.

In order to increase the heat dissipation effect of the wiring unit 320, the heat dissipation plate 350 having an uneven shape having a wider heat dissipation surface area may be attached or formed integrally with the wiring unit 320.

In order to improve the light efficiency of the LED chips 301a, 301b, and 301c mounted on the wiring part 320, a reflecting cup part 311 is disposed, and the reflecting cup part 311 supports the lens part 330. At the same time, the optical efficiency of the LED chips 301a, 301b, and 301c mounted on the wiring unit 320 is improved.

In addition, the reflective cup 311 is made of copper (Cu), aluminum (Al), polycarbonate (PC) material, and the inner surface of the reflective cup 311, that is, LED chips 301a, 301b, and 301c. The reflective coating film made of Ag metal is formed on the area where the light generated by the direct contact.

When the reflective cup part 311 is attached to the wiring part 320 on which the LED chips 301a, 301b, and 301c are mounted, the external chip is filled with a material having the same refractive index while protecting the flip chip or wire bonding to maximize external quantum efficiency. The possible silicone resin 322 was filled.

A plurality of light emitting diodes described above, a lens unit 330 composed of a Fresnel lens having various shapes, and a wiring for mounting the plurality of light emitting diodes to quickly dissipate heat generated while generating high light output to the outside. The unit 320 is assembled into one module structure.

The light emitting diode package manufacturing process of the present invention as described above is as follows.

A plurality of light emitting diodes 301a, 301b, and 301c, that is, a red LED chip 301a, a green LED chip 301b, and a blue LED chip 301c are mounted on the wiring part 320.

In this case, since the red LED chip 301a is suitably wire bonded rather than flip chip bonding due to red light emission, the red LED chip 301a electrically contacts the electrodes of the red LED chips 301a and the circuit terminals on the wiring part 320. .

The green LED chip 301b and the blue LED chip 301c are directly contacted with circuit terminals on the wiring part 320 by flip chip bonding.

When the LED chips 301a, 301b, and 301c are mounted on the wiring unit 320 as described above, the reflective cup unit 311 may be provided to support the Fresnel lens to be attached while improving the light reflectance of the LED. Bind to phase.

The reflective cup 311 has a structure in which regions in which the LED chips 301a, 301b, and 301c are mounted are open, and the opened regions are LED chips mounted on the wiring 320. 301a, 301b, and 301c are positioned.

When the reflective cup part 311 is coupled to the wiring part 320, the silicone resin 322 is injected to mold the LED chips 301a, 301b, and 301c surrounded by the reflective cup part 311. .

Since the high power LED chips 301a, 301b, and 301c are mounted, molding is performed using the silicone resin 322 to prevent the molding by the general epoxy resin from being deformed due to deterioration or generating yellowing. do.

When the LED chips 301a, 301b, and 301c are molded by the silicone resin 322, the lens part 330 of the Fresnel lens having a planar convex lens structure is connected to the reflective cup part 311. The lens unit 330 is bonded to the LED chips 301a, 301b, and 301c by a constant force with the silicone resin 322 and the reflective cup unit 311 molded on the LED chips 301a, 301b, and 301c.

When the lens unit 330 is coupled to the reflective cup unit 311, the lens unit 330 may be coupled to the reflective cup unit 311 using a heat resistant adhesive.

In addition, the lens unit 330 is coupled with the reflective cup unit 311, and then a pin is disposed along an edge of the lens unit 330 to fix the entire LED package 300. 330 may be combined.

When the lens unit 330 is coupled to the reflective cup unit 311 as described above, the wiring unit of the LED package 300 to emit high heat generated from the high power LED chip to the outside of the LED package 300 ( 320) by attaching a heat sink 350 having a concave-convex shape on the back surface to complete the LED package 300.

Therefore, in the present invention, a plurality of high output light emitting diodes are directly disposed on the wiring part 320 and then molded directly, without combining the reflective cup part 311 with the Fresnel lens 330 and the heat sink 350. It has a module structure of.

That is, while implementing the high brightness LED package 300 by a plurality of light emitting diodes, the heat sink 350 is attached to quickly discharge the high heat generated by the high output to the outside of the LED package 300.

Figure 4 is a view showing the shape of the LED package manufactured by the present invention.

As shown in FIG. 4, a plan view illustrating a model of a lens unit attached to the LED package of FIG. 3.

The lens unit has a low height and uses a Fresnel lens having a variety of shapes, the shape of the lens is a straight, circular, hexagonal, square, etc., so that it can be manufactured in a package of various types mounted with LED chips.

The high power light emitting diodes may be mounted in a variety of forms in a single package form, and may be manufactured to be assembled into a single module form.

The LED package in which the Fresnel lens is linearly packaged may be used for a backlight, and the LED package packaged in a circular shape may be used as a signal lamp, an automobile headlight, or an indoor lamp.

In addition, even in the case of the Fresnel lens having a rectangular or hexagonal shape, it can be used as various lighting components used in everyday life such as lighting, marine traffic light, emergency light, stadium lighting, searchlight, and the like.

Therefore, in the present invention, a plurality of high output light emitting diodes can be packaged as described above, and the high heat generated here can be quickly emitted to the outside, and thus can be used as a high brightness LED package module.

In addition, since a plurality of light emitting diodes are packaged and configured as described above, the manufacturing process may be simplified and the cost may be reduced.

As described in detail above, the present invention mounts a plurality of high output light emitting diodes in the form of a package, maximizing luminance, and attaches a heat sink on the back surface of the package to achieve excellent heat emission and high brightness.

In addition, since a plurality of LED chips are packaged in one package, there is an advantage of simplifying the manufacturing process.

The present invention is not limited to the above-described embodiments, and various changes can be made by those skilled in the art without departing from the gist of the present invention as claimed in the following claims.

Claims (11)

A plurality of light emitting diodes; A plurality of light emitting diodes mounted thereon, the wiring unit controlling power and signal input / output to the plurality of light emitting diodes and transferring heat generated from the plurality of light emitting diodes to the outside ; A reflection cup part coupled to the wiring part to reflect light of the light emitting diodes; And And a lens unit disposed on the reflecting cup unit to irradiate light generated from the light emitting diode to the outside. The method of claim 1, And a heat dissipation plate attached to a rear surface of the wiring unit on which the light emitting diode is mounted, for dissipating heat generated from the light emitting diode to the outside through the wiring unit. The method of claim 1, The lens unit is a light emitting diode package, characterized in that the Fresnel lens having a variety of shapes. The method of claim 1, The wiring unit is a light emitting diode package, characterized in that the metal heat dissipation PCB. The method of claim 3, wherein The shape of the Fresnel lens is a convex lens shape of the center, the light emitting diode package, characterized in that the concave-convex shape that is symmetrical around the convex lens. The method of claim 2, The heat sink is a light emitting diode package, characterized in that formed in the concave-convex shape to extend the surface area. The method of claim 1, The reflective cup portion is made of a light emitting diode package, characterized in that any one of Cu, Al or polycarbonate. The method of claim 1, The surface of the region in which the light emitting diode is mounted inside the reflective cup portion is subjected to a reflective coating by Ag. Mounting a plurality of light emitting diodes on a wiring portion formed of metal to transfer heat to the outside ; Wherein said light emitting diodes are mounted a reflection cup portion for light reflected on the wiring portion is mounted; Performing a molding operation on an inner side of an open reflection cup unit in which the light emitting diode is mounted; And Attaching a lens on the reflective cup portion on which the molding operation is performed; Method for manufacturing a light emitting diode package comprising a. The method of claim 9, The method of manufacturing a light emitting diode package further comprising the step of coupling the heat sink on the back of the wiring portion to which the lens is attached. The method of claim 9, The LED chip mounted on the wiring portion is selected by any one of wire bonding or flip chip bonding to mount the LED package manufacturing method.

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