KR100694889B1 - Power led package - Google Patents

Abstract

A power LED package is provided to reduce generation of heat and increase the output of a power LED by distributing input power and supplying the distributed input power to each power LED and by unifying output power. A heat sink(200) is made of copper of a disc type, and bolt holes are formed in the upper and the lower portions of the heat sink while the bolt holes correspond to each other. A pattern(210) is formed on the upper surface of the heat sink, and an input terminal(220), an output terminal and a connection terminal(240) corresponding to the input and the output terminals are respectively formed by the pattern. A plurality of power LED's(310) are mounted on a leadframe(300) installed in the upper center of the heat sink. The leadframe is electrically connected to the connection terminal, applying DC power supplied from the input terminal and the output terminal to the power LED. AT least 2~6 input and output terminals can be formed in the heat sink. At least 2~6 power LED's corresponding to the input and output terminals can be formed.

Description

Power LED Package {POWER LED PACKAGE}

1 is a perspective view showing the configuration of a power LED package according to the present invention,

2 and 3 are a plan view showing the configuration of the lead frame of the power LED package according to the present invention,

Figure 4 is a side cross-sectional view showing the configuration of the lead frame of the power LED package according to the present invention,

Figure 5 is a bottom view showing the configuration of the lead frame of the power LED package according to the present invention.

<Explanation of symbols on main parts of the drawings>

100: power LED package 200: heat sink

210: pattern 220: input terminal

230: output terminal 240: connection terminal

300: lead frame 310: power LED

320: lead 330: mounting member

340: epoxy 350: chin

360: exposed surface 370: inclined surface

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a power LED package, and more particularly, to a power LED package capable of increasing the output of a power LED by manufacturing a lead frame by applying micro array technology.

In general, a light emitting diode (LED) generates a small number of carriers (electrons or holes) injected using a pn junction structure of a semiconductor, and emits light by recombination thereof. It is divided into LED, Light Emitting Diode (LD) and Laser Diode (LD). Since the light emitting diode (LED) or the laser diode (LD) generates light only in a desired wavelength band in a narrow area from the beginning, black body radiation ( Blackbody Radiation generates a broad spectrum of light and is much more efficient than current incandescent lamps that use filters of the desired color.

These LEDs are used not only for medical use using a certain wavelength, but also for promoting plant growth. In particular, LEDs have a relatively low power consumption and very high brightness, so in recent years, traffic lights, vehicle rear lamps, The situation is widely applied to outdoor advertising, the scope of application is not limited.

However, since the luminous rate is low to use the LED for lighting, there is a limit to use for incandescent lamps or fluorescent lamps, and the LED has a small size, so that the luminous efficiency is low.

Thus, a power LED package has been developed in which LEDs having larger capacities than LEDs are applied to PCBs.

Power LED package is complementary to the light efficiency aspect. Since 2004, it is mainly used for lighting, and more and more companies are using power LED package.

Currently used power LED package is used in PCB and horizontal type (type) and there are various types. However, the common point was the problem of bulky using the power LED in the PCB state, the size is 20, 28, 40mil, etc., and the power consumption is 0.5 ~ 1W (W) There is a problem that there is a limit to increase the output as much heat generated as this high. Here, mil is a thousandth of an inch as a standard unit of an LED chip.

In addition, the conventional power LED package has a problem that the expression is not free because the output angle does not exceed 120 ~ 140 degrees.

The present invention is to solve the above problems, by using a pattern to distribute the input power supply to each power LED, by reducing the heat generated by combining the output power into a power that can increase the output of the power LED The purpose is to provide an LED package.

In addition, the present invention has another object to provide a power LED package that can be used to vary the value of use and use by allowing the output angle to be adjusted freely to 120 ~ 180 degrees.

Features of the present invention for achieving the above object,

A power LED package; It is formed of a copper (Cu) material in the form of a disc, and a pattern is formed on the upper surface to form a plurality of input terminals, output terminals, and connecting terminals to correspond to the input terminals and output terminals, respectively, and correspond to each other on the upper and lower ends. A heat sink provided with a bolt hole; A plurality of power LEDs are mounted and installed in the center of the upper surface of the heat sink, and lead frames electrically connected to the connection terminals to apply DC power to each of the power LEDs by DC power supplied from the input terminal and the output terminal. Characterized in that it comprises a.

Here, two to six input terminals and output terminals of the heat sink are formed.

Herein, two to six power LEDs may be mounted to correspond to the input terminal and the output terminal.

Here, the lead frame is made of an aluminum material, and is formed in a rectangular shape, each corner is rounded, a plurality of leads of the same material connected to the connection terminal on both sides protrudes, a plurality of An injection molding is integrally formed with the lead and the mounting member such that a mounting member having a plate shape that is wider at the top of the copper material and narrowed toward the bottom thereof is exposed to the inside of the upper surface to mount the power LED.

Here, the lead frame has a rectangular shape in which the jaw protrudes from the upper edge so that the epoxy is filled, and the lead is exposed radially around the mounting member so as to wire-bond each of the power LED and the lead. Four exposed surfaces are formed.

Here, the side surface of the said mounting member has the inclination of the angle of 55-65 degree.

Here, the exposed surface is formed in a quadrangle, each corner is rounded, one side corresponding to each other is formed to have a predetermined inclination, the horizontal axis of the lead frame and the central axis angle of the center is 26 ~ 30 The angle of inclination of the lead frame is 53 to 57 degrees.

Here, the lead frame is formed so as to have an inclined surface on the inner side with respect to the center portion on the side thereof, and the inclination forms 4 to 6 degrees.

Here, the mounting member has a bottom surface exposed to a predetermined height from the bottom surface of the lead frame so that the heat dissipation is spaced apart between the lead frame and the heat sink and make a surface contact with the heat sink.

Here, the said fixed height is 0.1-0.2 mm.

Here, the lead frame is formed such that the inner circular frame has the same inclination as the mounting member so as to widen the light emission angle of the power LED when the power LED is mounted on the mounting member.

Here, the power LED is mounted with a mixture of monochrome or RGB.

Here, the DC power supply is used 5 ~ 110V.

Here, the power LED package is equally distributed through the lead pre arbitrary input terminal and the output terminal to supply the power supply to each power LED, the sum of the DC power output through the output terminal sum the power Increase the brightness of the LED.

Hereinafter, the configuration of the power LED package according to the present invention in detail with reference to the accompanying drawings as follows.

In the following description of the present invention, if it is determined that a detailed description of a related known function or configuration may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted. Terms to be described later are terms defined in consideration of functions in the present invention, and may be changed according to intentions or customs of users or operators. Therefore, the definition should be made based on the contents throughout the specification.

Hereinafter, the present invention will be described based on the form in which three power LEDs are mounted.

1 is a perspective view showing the configuration of a power LED package according to the present invention, Figures 2 and 3 is a plan view showing the configuration of a lead frame of the power LED package according to the present invention, Figure 4 is a power LED package according to the present invention Is a side sectional view showing the configuration of the lead frame, and FIG. 5 is a bottom view showing the configuration of the lead frame of the power LED package according to the present invention.

1 to 5, the power LED package 100 according to the present invention includes a heat sink 200 and a lead frame 300.

First, the heat sink 200 is formed of a copper (Cu) material in the form of a disc, the pattern 210 is formed on the upper surface by a plurality of input terminals 220, the output terminal 230 and the input by the pattern 210 Connection terminals 240 are formed to correspond to the terminal 220 and the output terminal 230, respectively, and bolt holes 250 are provided to correspond to each other at the upper and lower ends thereof.

The bolt hole 250 of the heat sink 200 is formed to fix the heat sink 200 to a desired position by using a bolt (not shown).

In addition, two to six input terminals 220 and output terminals 230 of the heat sink 200 are formed, and the connection terminals 240 are formed to correspond to the number of input terminals 220 and output terminals 230, respectively. That is, when three input terminals 220 and output terminals 230 are formed, six are formed, respectively.

Meanwhile, the lead frame 300 has a plurality of power LEDs 310 mounted on the top surface center of the heat sink 200, and is electrically connected to the connection terminal 240 so that the input terminal 220 and the output terminal 230 are provided. DC power is applied to each of the power LEDs 310 by the DC power supplied from the power supply. Here, two to six power LEDs 310 are mounted so as to correspond to the input terminal 220 and the output terminal 230. When the three input terminal 220 and the output terminal 230 are formed, three are It is mounted in a triangle. Here, the power LED 310 is mounted by mixing a single color or RGB, and the DC power supply is 5 to 110V (5 to 300V in the case of an AC power supply).

In addition, the lead frame 300 is made of aluminum, and is formed in a rectangular shape, and each edge is rounded, and a plurality of leads 320 of the same material that is connected to the connection terminal 240 on both sides protrude. The lead 320 and the mounting member 330 are formed to expose the mounting member 330 formed in a plate shape, the upper end of which is wider and the narrower toward the bottom of the upper surface of the upper surface of the upper surface of the power LED 310. It is injection molded integrally with. Here, the lead 320 is bent to be connected to the connection terminal 240 of the heat sink.

In addition, the lead frame 300 has a jaw 350 protruding from the upper edge so that the epoxy 340 is filled, and the mounting member 330 may be wire-bonded to each of the power LEDs 310 and the lead 320. Four exposed surfaces 360 of a rectangular shape in which the lead 320 is radially exposed to the center are formed. At this time, according to the color of the power LED 310 mounted when the epoxy 340 is filled in order to emit a desired light through a combination of light (for example, blue power LED is mounted to implement white, yellow epoxy (Fill) can be formed, and the epoxy 340 may form a constant curved surface to adjust the light emission angle of the light to a desired angle. Since the curved structure of the epoxy 340 is a known technique, the description thereof is omitted.

On the other hand, the side surface of the mounting member 330 of the lead frame 300 has an inclination of an angle of 55 to 65 degrees, preferably has an inclination of 60 degrees, the bottom surface of the lead frame 300 so that heat radiation is achieved The height is exposed to 0.1 ~ 0.2mm, preferably exposed to 0.1mm height is spaced apart between the lead frame 300 and the heat sink 200 and makes a surface contact with the heat sink 200.

The exposed surface 360 of the lead frame 300 forms a pair of two up and down about the horizontal center axis of the lead frame 300, and the pair is formed to be symmetrical with each other. Are each rounded, one side is formed to have a predetermined inclination and are symmetrical with each other, and the horizontal central axis of the lead frame 300 and the central axis angle of the center form 26 to 30 degrees, preferably 28 degrees. Here, the predetermined inclination is an angle between the horizontal center axis of the lead frame 300 and the inclination is 53 to 57 degrees, preferably 54.471 degrees.

In addition, the lead frame 300 is formed so as to have an inclined surface 370 inward with respect to the center portion on the side thereof, the inclination of which is 4 to 6 degrees, preferably 5 degrees.

On the other hand, the lead frame 300 is formed such that the inner circular frame has the same inclination, that is, 60 degrees to the mounting member 330 so as to widen the light emission angle of the light when the power LED 310 is mounted on the mounting member 330.

In addition, the power LED package 100 distributes the DC power input by using the micro array technology through the input terminal 220 and the output terminal 230 of the lead frame 300 equally to each of the power LED 310. It supplies to the, and adds the DC power output through the output terminal 230 to increase the brightness of the power LED (310).

Hereinafter, the operation of the power LED package according to the present invention will be described in detail with reference to the accompanying drawings.

First, the DC power inputted through the input terminal 220 and the output terminal 230 of the heat sink 200 is equally distributed. For example, when 12V power is input, the input power is distributed by 4V to each input terminal. Supply to the power LED 310 through, and sums the DC power output through the output terminal 230. Using the micro-array technology, DC power is distributed and summed up to about 1.3 watts of power from a 40-watt, one-watt power LED, which is about 3.8 when three 1-watt power LEDs are used. More than watts of power can be achieved, resulting in high brightness.

In addition, the power LED package 100 may be protected from heat because the DC power is distributed, and the heat sink 200 and the lead frame 300 are made of a material having excellent heat generation.

In addition, the mounting member 330 of the lead frame 300 is formed in a dish shape in which the upper end is wider and narrower toward the lower end. For example, the bottom diameter is 4.6 mm and the upper diameter is 6.6 mm, and the side surface is formed. After forming the inclination of 60 degrees and filling the epoxy 340 to the top surface of the power LED 310 to the curved surface it is possible to implement the output angle up to 120 ~ 180 degrees.

On the other hand, the mounting method of the power LED and the connection method through the wire between the connection terminal can be changed depending on the number and color combination.

According to the power LED package of the present invention configured as described above, by distributing the input power by using a pattern to supply to each power LED, by combining the output power to reduce heat generation, it is possible to increase the output of the power LED, By allowing the output angle to be adjusted freely from 120 to 180 degrees, it is possible to diversify its value and use.

As those skilled in the art would realize, the described embodiments may be modified in various ways, all without departing from the spirit or scope of the present invention. It is to be understood, however, that the present invention is not limited to the specific forms referred to in the description, but rather includes all modifications, equivalents, and substitutions within the spirit and scope of the invention as defined by the appended claims. Should be.

Claims (14)

A power LED package; It is formed of a copper (Cu) material in the form of a disc, and a pattern is formed on the upper surface to form a plurality of input terminals, output terminals, and connecting terminals to correspond to the input terminals and output terminals, respectively, and correspond to each other on the upper and lower ends. A heat sink provided with a bolt hole; A plurality of power LEDs are mounted and installed in the center of the upper surface of the heat sink, and lead frames electrically connected to the connection terminals to apply DC power to each of the power LEDs by DC power supplied from the input terminal and the output terminal. Power LED package comprising a. The method of claim 1, The input terminal and the output terminal of the heat sink, Power LED package, characterized in that two to six are formed. The method of claim 1, The power LED, Power LED package, characterized in that 2 to 6 are mounted so as to correspond to the input terminal and the output terminal. The method of claim 1, The lead frame, It is made of aluminum material and is formed in a rectangular shape, each corner is rounded, and a plurality of leads of the same material connected to the connection terminal are formed to protrude on both sides, and the inside of the upper surface to mount the plurality of power LEDs. The power LED package, characterized in that the injection member is integrally formed with the lead and the mounting member so that the mounting member made of a plate shape is made of copper material wider and narrower toward the bottom. The method of claim 4, wherein The lead frame, The jaw protrudes from the upper edge so that the epoxy is filled, and four exposed surfaces of the rectangular shape in which the lead is exposed radially around the mounting member are formed to wire-bond each of the power LED and the lead. Featured Power LED Package. The method of claim 4, wherein The side of the mounting member, Power LED package, characterized in that the inclination of the angle of 55 ~ 65 degrees. The method of claim 5, The exposed surface, It is formed in a square, each corner is rounded, one side corresponding to each other is formed to have a predetermined inclination, the horizontal axis of the lead frame and the central axis of the center forms an angle of 26 to 30 degrees, the constant inclination is Power LED package, characterized in that the angle of the horizontal center axis and the inclination of the lead frame is 53 ~ 57 degrees. The method of claim 4, wherein The lead frame, Power LED package, characterized in that the side is formed to have an inclined surface inward with respect to the central portion, the inclination is 4 to 6 degrees. The method of claim 4, wherein The mounting member, A power LED package, characterized in that the bottom surface is exposed to a certain height from the bottom surface of the lead frame so that the heat dissipation is spaced apart from the lead frame and the heat sink and make a surface contact with the heat sink. The method of claim 9, The constant height is, Power LED package, characterized in that 0.1 ~ 0.2mm. The method of claim 4, wherein The lead frame, The power LED package, characterized in that the inner circular edge is formed to have the same slope as the mounting member so as to widen the light emission angle of the light when the power LED is mounted on the mounting member. The method of claim 1, The power LED, Power LED package, characterized in that a single color or RGB mixed. The method of claim 1, The DC power supply, Power LED package, characterized in that 5 ~ 110V is used. The method of claim 1, The power LED package, The DC power input is equally distributed through the input terminal and the output terminal of the lead frame to be supplied to each power LED, and the DC power output through the output terminal is added to increase the brightness of the power LED. Power LED package.

Images