KR20100003334A - Light-emitting device - Google Patents

Light-emitting device Download PDF

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Publication number
KR20100003334A
KR20100003334A KR1020080061074A KR20080061074A KR20100003334A KR 20100003334 A KR20100003334 A KR 20100003334A KR 1020080061074 A KR1020080061074 A KR 1020080061074A KR 20080061074 A KR20080061074 A KR 20080061074A KR 20100003334 A KR20100003334 A KR 20100003334A
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KR
South Korea
Prior art keywords
light emitting
emitting device
package body
reflector
contact surface
Prior art date
Application number
KR1020080061074A
Other languages
Korean (ko)
Other versions
KR101537797B1 (en
Inventor
박병열
김방현
이상철
조재호
Original Assignee
서울반도체 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 서울반도체 주식회사 filed Critical 서울반도체 주식회사
Priority to KR1020080061074A priority Critical patent/KR101537797B1/en
Publication of KR20100003334A publication Critical patent/KR20100003334A/en
Application granted granted Critical
Publication of KR101537797B1 publication Critical patent/KR101537797B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Abstract

The present invention relates to a light emitting device having a lead frame which is easy to form a contact surface and has improved adhesion without a trimming and forming process, the light emitting device comprising: a light emitting chip; A package body having an opening through which light emitted from the light emitting chip is emitted; It is provided spaced apart from each other, the mounting surface is electrically connected to the light emitting chip inside the opening is formed, a contact surface for the electrical contact is formed to the outside of the package body, the groove portion is formed in at least part of the contact surface It characterized in that it comprises a block-shaped first and second leadframe.

Light Emitting Diode, Light Emitting Diode, Lead Frame, Trimming, Forming

Description

Light-emitting device {LIGHT-EMITTING DEVICE}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting device, and more particularly, to a light emitting device having a lead frame that is easy to form a contact surface without improved trimming and forming process and has improved adhesion.

In general, various light emitting chips are used in a light emitting device. For example, a light emitting diode using a phenomenon in which a small number of carriers (electrons or holes) are injected by using a pn junction structure of a semiconductor and emits light by recombination thereof is used. Emitting Diode, LED) is used. Light emitting diodes include red light emitting diodes using GaAsP and the like, green light emitting diodes using GaP and the like, and blue light emitting diodes using an InGaN / AlGaN double hetero structure.

The light emitting device is manufactured in various forms according to the type of chip, the shape of the package, or the light emitting direction. For example, chip type, lamp type, top view type and side view type are manufactured and used, and recently, slim and low power of LCD (Liquid Crystal Display) products Accordingly, the demand for side view type light emitting devices used as LCD backlight unit light sources is increasing.

A general side view type light emitting device includes a package body including a housing and a reflector, first and second lead frames spaced apart from each other on the housing, and wires mounted on the first lead frame and connected to the second lead frame. And a molding part formed inside the reflector to encapsulate the light emitting chip.

At this time, the first and the second lead frame is formed with a contact surface which is an electrical contact portion for mounting the light emitting device on a separate printed circuit board. The first and second leadframes are prepared in a plate shape and prefabricated through a trimming process, and then coupled to the package body, and the lead frames exposed to the outside of the package body are bent upward or downward. A forming process is performed to form the contact surface. However, when the trimming and forming process is performed to form the contact surface, cracks are generated in the lead frame and the package main body, or a bonding defect occurs at the interface between the lead frame and the package main body.

And, the contact surface of the lead frame is made of a plane, the area is very narrow, there is a problem inferior solderability. Thus, when the light emitting device is mounted on a separate printed circuit board, there are many problems such as the light emitting device is misaligned or short-circuited on the printed circuit board.

In addition, since the package body manufactured by injection molding uses a thermoplastic PPA resin having relatively low thermal characteristics, when the solder reflow process is performed to mount the light emitting device on a separate printed circuit board, There was a problem that the package body and the molding part are deformed due to thermal damage.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems. The present invention provides a substrate for widening the area of the contact surface formed in the lead frame of the light emitting device and forming grooves for improving solderability, and when mounted on a printed circuit board. An object of the present invention is to provide a light emitting device capable of improving the adhesive stone.

In addition, as the package body constituting the light emitting device is manufactured by a transfer molding method, a material having excellent thermal characteristics can be used, thereby preventing damage to the lead frame and the package body during a reflow process in which the light emitting device is mounted on a printed circuit board. Another object is to provide a light emitting device capable of doing so.

The light emitting device according to the present invention for achieving the above object is a light emitting chip; A package body having an opening through which light emitted from the light emitting chip is emitted; It is provided spaced apart from each other, the mounting surface is electrically connected to the light emitting chip inside the opening is formed, a contact surface for the electrical contact is formed to the outside of the package body, the groove portion is formed in at least part of the contact surface It characterized in that it comprises a block-shaped first and second leadframe.

The contact surface is formed on one or both of an upper surface and a lower surface of the portions in which the first and second lead frames protrude outwardly of the package body, and the groove portion is recessed in a vertical direction from the contact surface. It is characterized by.

At this time, the groove portion is formed at the edge of the contact surface, the cross-sectional shape of the groove portion is preferably an arc having a right angle or a predetermined radius of curvature.

The package body includes a housing in which the first and second lead frames are installed on one side and the length of the package body is extended to a thickness of the first and second lead frames on the other side; It is formed on one side of the housing, characterized in that it comprises a reflector for forming an opening for emitting light emitted from the light emitting chip.

The reflectors may be disposed to face each other at an upper side and a lower side of the front face of the housing, and a pair of reflective surfaces protruding in the forward direction may be formed.

The reflector may further include a pair of auxiliary reflection surfaces protruding forward from both sides of the housing front surface.

The apparatus may further include a molding part molded into the reflector to seal the light emitting chip.

The package body is formed by a transfer molding method using a thermosetting resin.

According to the present invention, the area of the lead frame is enlarged, and in particular, grooves for improving solderability are formed on the contact surfaces, thereby improving adhesion between the printed circuit board and the light emitting device, thereby preventing dropping and twisting of the light emitting device. There is an effect that can be prevented.

In addition, by using a block-shaped lead frame, a process such as trimming and forming, which has been conventionally performed, can be omitted, thereby simplifying the manufacturing process.

As the housing of the package body is extended, the balance of the reflector can be maintained to ensure stable mounting of the light emitting device.

In addition, since the package body is molded by a transfer molding method using a thermosetting resin having excellent thermal characteristics, the reflow process of mounting the light emitting device on a printed circuit board is performed at a temperature relatively lower than the melting point of the package body and the molding part. There is an effect that can prevent thermal damage to the body and the molding portion.

Hereinafter, a light emitting device package and a method of manufacturing the same according to the present invention will be described in detail with reference to the accompanying drawings.

1 is a perspective view showing a light emitting device according to the present invention, Figure 2 is a perspective view showing a light emitting device according to another embodiment of the present invention, Figure 3 is a perspective view showing a lead frame according to the present invention, Figure 4 is a present A perspective view showing a modification of the lead frame according to the invention.

As shown in FIG. 1, the light emitting device according to the present invention includes a light emitting chip 110; A package body 120 having an opening through which light emitted from the light emitting chip 110 is emitted; Mounting surfaces 131 and 141 spaced apart from each other and electrically connected to the light emitting chip 110 are formed inside the opening, and contact surfaces 133 and 143 for electrical contact are formed outside the package body 120. And first and second lead frames 130 and 140 having grooves 135 and 145 formed in at least some of the contact surfaces 133 and 143.

The light emitting chip 110 is a means for generating light by application of an external power source, and may be selectively selected from chips emitting light in the infrared region from the infrared region. For example, a vertical light emitting diode can be used.

The package body 120 has the first and second lead frames 130 and 140 installed at one side thereof, and the housing 121 having a length longer than the thickness t of the first and second lead frames 130 and 140 at the other side thereof. and; The reflector 123 is formed at one side of the housing 121 and forms an opening through which light emitted from the light emitting chip 110 is emitted. The package body 120 is manufactured by a transfer molding method using an epoxy mold compound (EMC) molding agent in which a white pigment is added to a thermosetting resin, for example, an epoxy resin. Thus, the housing 121 and the reflector 123 are integrally formed.

The shapes of the housing 121 and the reflector 123 may be variously changed according to the use of the light emitting device. In particular, in the present embodiment, the opening direction of the opening formed in the reflector 123 is formed in front of the package body 120. The term “front” refers to a light emitting direction of the side view type light emitting device, and refers to a Z direction shown in the drawing. In the following description, in order to clarify the description of components to be described later, the X-direction shown in the drawings is upper, -X-axis direction is lower, Y-axis direction and -Y-axis direction is side, Z-axis is forward, -Z-axis is rear It is defined as.

The housing 121 extends rearward to be longer than the thickness t of the first and second lead frames 130 and 140. Preferably, as the light emitting device is extended to have a weight corresponding to the weight of the reflector 123, the light emitting device may be mounted in a stable posture without being inclined in the direction of the reflector 123 when mounted on the printed circuit board.

The reflector 123 includes a pair of reflective surfaces 123a and 123b which are disposed on the upper side and the lower side of the front surface of the housing 121 and protrude in the front (Z-axis) direction. Thus, the angle at which the light emitted from the light emitting chip 110 is irradiated can be made up to 180 degrees in the horizontal direction of the front side. Of course, the shape of the reflector 123 is not limited thereto and may be variously changed to adjust the emission range of the light emitted from the light emitting chip 110 according to the use of the light emitting device. For example, as shown in FIG. 2, the reflector 123 is disposed on the upper side and the lower side of the front surface of the housing 121 so as to face each other and protrudes in a forward direction, and the housing front surface. A pair of auxiliary reflection surfaces 123c and 123d may protrude from both sides of the front surface in the forward direction. By adjusting the protruding lengths of the auxiliary reflection surfaces 123c and 123d, a range in which the emitted light is emitted may be adjusted.

In addition, the package body 120 includes a molding part 160 formed in an opening formed in the reflector 123 to encapsulate a portion of the light emitting chip 110 and the first and second lead frames 130 and 140. .

The molding part 160 is to encapsulate and protect a part of the light emitting chip 110 and the first and second lead frames 130 and 140. The forming method and shape may be variously implemented. In general, the molding part 160 is formed of a transparent silicone resin or an epoxy resin which is a thermosetting resin. In this case, when the molding part 160 is formed in the reflector 123 in which both sides shown in FIG. 1 are opened, the molding part 160 is preferably formed by a transfer molding method, and as shown in FIG. 2, the molding part 160 is in the closed reflector 123 . When formed, it can be formed by a transfer molding method or a dotting molding method. The molding unit 160 as described above In the thermal distortion to the package body 120 and the molding member 160 to prevent damage of the package body 120 during the molding of the molding portion 160 in the case of forming by the transfer molding method It would be desirable to form it with a thermoset resin. However, the present invention is not limited thereto, and any material may be used as long as the resin is transparent enough to transmit light according to the use of the light emitting device, and various molding techniques may be used to mold each material. In addition, phosphors may be mixed in the molding part to realize white light.

The first and second lead frames 130 and 140 are for applying external power to the light emitting chip 110 as the light emitting chip 110 is mounted or electrically connected through a wire 150. It is provided on the boundary surface of the reflector 123 spaced apart from each other. In this case, each of the first and second lead frames 130 and 140 is formed in a block shape instead of a plate shape, and mounting surfaces 131 and 141 electrically connected to the light emitting chip 110 are formed at one side thereof, and for the electrical contact on the other side. Contact surfaces 133 and 143 are formed, and grooves 135 and 145 are formed in at least some of the contact surfaces 133 and 143. At this time, as shown in Figure 3 and the contact surface (133,143) By the mounting (131 141) only teokbu (137 147) to form a single teokbu (137 147) between the by increasing the first and second lead frames (130 140) and the package area that the body 120 is joined the first And improve the coupling force between the second lead frames 130 and 140 and the package body 120. Then, the thickness of the package body 120 of the first and second lead frames (130,140) Since the contact surfaces 133 and 143 are formed to have a thickness corresponding to the width w of the points where the contact surfaces 133 and 143 are formed, the widths of the first and second lead frames 130 and 140 , in particular the widths of the points where the contact surfaces 133 and 143 are formed ( w) forming a thin layer and may be formed in the light-emitting device as a whole slim (slim).

In the present embodiment, the light emitting chip 110 is mounted on the mounting surface 131 of the first lead frame 130, and the wire 150 connected to the light emitting chip 110 is mounted on the second lead frame 140. 141 is connected.

In particular, each of the first and second leadframes 130 and 140 has a length L of a portion protruding to the outside of the package body 120 sufficiently to omit a trimming or forming process, and the thickness t is increased. It is provided in a block shape that is sufficiently thick and can be sufficiently bonded by soldering to the substrate on which the light emitting device is mounted on the contact surfaces 133 and 143 corresponding to the upper and lower surfaces of the portion protruding to the outside of the package body 120. It is preferable to have an area (L x t).

In addition, in order to improve adhesion of the contact surfaces 133 and 143, grooves 135 and 145 are formed in the contact surfaces 133 and 143 to be recessed in the vertical direction to extend the contact area. In this case, the grooves 135 and 145 are formed at edges of the contact surfaces 133 and 143, and the cross-sectional shapes of the grooves 135 and 145 are formed at right angles. However, the number, location, and cross-sectional shape of the grooves 135 and 145 are not limited thereto, and may be variously changed as long as the area of the contact surfaces 133 and 143 can be expanded. For example, as shown in FIG. 4, the cross sections of the grooves 135 and 145 may be arcs having a predetermined radius of curvature.

The grooves 135 and 145 may be formed by various forming methods that match the shape, number, and the like, and are formed by etching a portion of the contact surfaces 133 and 143 of the first and second lead frames 130 and 140, for example.

A state in which a light emitting device having the above configuration is mounted on a printed circuit board will be described with reference to the drawings.

5A and 5B are views illustrating a mounting state of a light emitting device according to the present invention. FIG. 5A is a cross-sectional view taken along the line A-A of FIG. 1, and FIG. 5B is a side view of FIG. 1.

As shown in FIG. 5A, in the light emitting device according to the present invention, a solder pattern 2 in which portions of the first and second lead frames 130 and 140 protruding out of the package body 120 are patterned on the printed circuit board 1. It is mounted on). Precisely, as shown in FIG. 5B, contact surfaces 133 and 143 of the first and second lead frames 130 and 140 are mounted against the solder pattern 2 of the printed circuit board 1. At this time, the solder patterns 2 of the first and second lead frames 130 and 140 and the printed circuit board 1 are electrically connected by soldering 3. The first and second leadframes 130 and 140 are at least sufficient for mounting the light emitting device by forming at least a length L protruding out of the package body 120 and a contact surface 133 and 143 corresponding to the thickness t thereof. The contact area L × t is provided. Accordingly, it is possible to omit a trimming or forming process that has been performed separately for forming the contact surfaces 133 and 143.

The grooves 135 and 145 may be formed in the contact surfaces 133 and 143 to expand the contact area with the solder 3, thereby further improving the adhesion of the light emitting device.

In addition, since the solder 3 has a shape into which the grooves 135 and 145 are inserted, the light emitting device serves as a stopper to prevent the light emitting device from being twisted or biased on the printed circuit board 1.

As the length of the housing 121 is increased to correspond to the weight of the reflector 123, the package main body 120 may take a stable posture without being inclined in the direction of the reflector 123.

Although described above with reference to the drawings and embodiments, those skilled in the art can be variously modified and changed within the scope of the invention without departing from the spirit of the invention described in the claims below. I can understand.

1 is a perspective view showing a light emitting device according to the present invention;

2 is a perspective view showing a light emitting device according to another embodiment of the present invention;

3 is a perspective view showing a lead frame according to the present invention;

Figure 4 is a perspective view showing a modification of the lead frame according to the present invention,

5A and 5B are views illustrating a mounting state of a light emitting device according to the present invention.

<Explanation of symbols for the main parts of the drawings>

110: light emitting chip 120: package body

130: first lead frame 140: second lead frame

135,145 groove 150: wire

160: molding part

Claims (8)

Light emitting chip; A package body having an opening through which light emitted from the light emitting chip is emitted; It is provided spaced apart from each other, the mounting surface is electrically connected to the light emitting chip inside the opening is formed, a contact surface for the electrical contact is formed to the outside of the package body, the groove portion is formed in at least part of the contact surface Light emitting device comprising a block-shaped first and second lead frame. The method according to claim 1, The contact surface is formed on one or both of an upper surface and a lower surface of the portions in which the first and second lead frames protrude outwardly of the package body, and the groove is formed by recessing in the vertical direction from the contact surface. Light emitting device characterized in that. The method according to claim 2, And the groove portion is formed at an edge of the contact surface, and the cross-sectional shape of the groove portion is an arc having a right angle or a predetermined radius of curvature. The method according to claim 1, The package body A housing in which the first and second lead frames are installed at one side and the length of the housing is extended than the thickness of the first and second lead frames at the other side; And a reflector formed at one side of the housing and forming an opening through which the light emitted from the light emitting chip is emitted. The method according to claim 4, The reflector is disposed on the upper side and the lower side of the front face of the housing, the light emitting device, characterized in that a pair of reflective surfaces protruding in the forward direction is formed. The method according to claim 5, The reflector may further include a pair of auxiliary reflection surfaces protruding forward from both sides of the front surface of the housing. The method according to any one of claims 4 to 6, And a molding part molded into the reflector to encapsulate the light emitting chip. The method according to claim 1, The package body is formed by a transfer molding method using a thermosetting resin.
KR1020080061074A 2008-06-26 2008-06-26 Light-emitting device KR101537797B1 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104425701A (en) * 2013-08-29 2015-03-18 日亚化学工业株式会社 Light emitting device
KR20160103583A (en) * 2015-02-24 2016-09-02 주식회사 세미콘라이트 Semiconductor light emitting device, method of manufacturing the same, and light source module having the same

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102426861B1 (en) * 2015-12-02 2022-07-29 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 Light emitting device package

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3621203B2 (en) * 1996-08-07 2005-02-16 ローム株式会社 Transfer resin sealing method and resin sealing mold apparatus used therefor
JP3864263B2 (en) * 1999-08-24 2006-12-27 ローム株式会社 Light emitting semiconductor device
KR100772433B1 (en) * 2006-08-23 2007-11-01 서울반도체 주식회사 Light emitting diode package employing lead terminal with reflecting surface

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104425701A (en) * 2013-08-29 2015-03-18 日亚化学工业株式会社 Light emitting device
KR20160103583A (en) * 2015-02-24 2016-09-02 주식회사 세미콘라이트 Semiconductor light emitting device, method of manufacturing the same, and light source module having the same

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