JP2005223216A - Light emitting light source, illuminator, and display unit - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light emitting light source which can make it difficult to separate a covered resin. <P>SOLUTION: An LED light source 1 comprises a substrate 10 mounting a plurality of LED bare chips on a surface, a reflector plate 60 which is attached to the surface of the substrate 10 for reflecting a light emitted from LED bare chips L66, L67, L68 to a predetermined direction, and a lens plate 70 condensing the reflected lens in a desired direction. For example, a metal plate made of aluminum, or the like is used as the reflector plate 60, and a reflection opening 60H is perforated corresponding to the LED bare chips L66, L67, L68, respectively. In the reflector plate 60, a recess 60A is formed all over peripheries on the side face, and a resin (70A) constituting the lens plate 70 is filled in this recess 60A to be arranged so as to engage with the recess 60A. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a light-emitting light source, an illumination device, and a display device that include a plurality of light-emitting bodies and a coating resin that covers these light-emitting bodies on the surface of a substrate.

It has been studied to mount a plurality of light emitters on the surface of a substrate and use them as a planar light source by emitting light. In particular, a light emitting diode using a bare chip of a light emitting diode (hereinafter simply referred to as “LED bare chip”) has been actively studied.
As such a light emitting light source, for example, a substrate, a plurality of LED bare chips mounted on the surface of the substrate, a resin body that individually encloses these LED bare chips, and a corresponding resin body were established. Some have a reflection plate having a reflection hole and a back surface adhered to the surface of the substrate, and a lens plate covering the entire reflection plate and having a lens in a portion corresponding to the LED bare chip.

As for the lens plate, a substrate having a reflecting plate attached thereto is set in advance in a molding die having a cavity corresponding to the shape of the lens plate, and a resin for lens plate (for example, 170 ° C.) in the molding die. Is injected and molded (so-called transfer molding) (Patent Document 1).
JP 2003-347327 A

However, in the above light-emitting light source, the coupling between the reflecting plate and the lens plate is performed at the curing temperature (molding temperature) of the resin of the lens plate, so when the temperature drops to a room temperature state where the LED bare chip is not lit, There is a problem that the distortion between the lens plate and the reflecting plate is increased.
In particular, in recent years, studies have been made so that the light-emitting light source can be used even in cold regions (for example, −20 ° C.), and the temperature difference between the temperature when the lens plate is molded and the temperature when it is not lit becomes larger. There is a tendency.

As described above, when the temperature difference from the molding becomes large, the difference in strain due to thermal contraction between the lens plate and the reflecting plate becomes large, and interface peeling may occur between the lens plate and the reflecting plate.
If peeling occurs at the interface between the lens plate and the reflecting plate, the refractive index at that portion changes, and light emitted from the LED bare chip cannot be condensed in a predetermined direction. Furthermore, when the interface peeling progresses, the lens plate may come off the reflecting plate.

The problem of peeling off the lens plate naturally occurs even in a light emitting light source that does not have a reflector as described above, that is, in a light emitting light source in which a lens resin is coated on the surface of a substrate on which an LED bare chip is mounted. It is a problem to get.
The present invention has been made in view of the above problems, and a light-emitting light source that can hardly cause interface peeling between a coating resin and a member coated with the coating resin, and an illumination device or a display using the light-emitting light source An object is to provide an apparatus.

  In order to achieve the above object, a light-emitting light source according to the present invention includes a plurality of light emitters mounted on a surface of a substrate, and reflection holes opened corresponding to the light emitters, and the back surface is the surface of the substrate. A reflective member attached to the surface, and a coating resin that covers the entirety of the reflective member and the light emitting body, and the reflective member is a portion that contacts the coating resin and excludes a wall surface of the reflective hole. And a convex portion and / or a concave portion, and a corresponding portion of the coating resin is engaged with the convex portion and / or the concave portion.

  A plurality of light emitters mounted on the surface of the substrate, a reflection member having a reflection hole opened corresponding to the light emitter, and a back surface adhered to the surface of the substrate, the entirety of the reflection member, and the A coating resin that covers the light emitting body, and the reflection member has a roughened portion whose surface is roughened in a portion that is in contact with the coating resin and excluding the wall surface of the reflection hole. It is characterized by having.

A plurality of light emitters mounted on the surface of the substrate, a reflection member having a reflection hole opened corresponding to the light emitter, and a back surface adhered to the surface of the substrate, the entirety of the reflection member, and the And a coating resin that covers the light emitter, and the edge of the surface of the reflecting member is chamfered.
A plurality of light emitters mounted on the surface of the substrate, a reflection member having a reflection hole opened corresponding to the light emitter, and a back surface adhered to the surface of the substrate, the entirety of the reflection member, and the A coating resin that covers the light-emitting body, and an adhesion layer is formed between the reflective member and the coating resin, the adhesion of which is stronger than the adhesion of the coating resin to the reflective member. It is characterized by having.

A plurality of light emitters mounted on the surface of the substrate, a reflection member having a reflection hole opened corresponding to the light emitter, and a back surface adhered to the surface of the substrate, the entirety of the reflection member, and the And a coating resin that covers the light-emitting body, wherein the reflection member is constituted by a plurality of reflection plates.
A portion comprising a substrate, a plurality of light emitters mounted on the surface of the substrate, and a coating resin that covers the whole of the plurality of light emitters and encloses the light emitter, and the portion of the substrate covered by the coating resin is: Except for the portion where the light emitter is mounted, an adhesion layer stronger than the adhesion between the substrate surface and the coating resin is formed.

A substrate, a plurality of light emitters mounted on the surface of the substrate, and a coating resin that covers and encloses the whole of the plurality of light emitters. A light-emitting light source that is subjected to a surface roughening process except for a portion to be mounted.
The illumination device according to the present invention is characterized by using the light emission source, and the display device according to the present invention is characterized by using the light emission source.

  The light-emitting light source according to the present invention can hardly cause interface peeling between the coating resin and the member coated with the coating resin.

Hereinafter, an LED light source using an LED bare chip as a light emitting element as a light emitting light source according to the present invention will be described with reference to the drawings.
1. Regarding LED Light Source (a) Configuration of LED Light Source FIG. 1 is a perspective view of an LED light source in the present embodiment, and FIG. 2 is an exploded perspective view before a reflector is attached to the substrate of the LED light source.

The LED light source 1 includes a substrate 10 on which a plurality of LED bare chips are mounted, and a reflector 60 (a reflecting member of the present invention) that is attached to the surface of the substrate 10 and reflects light emitted from the LED bare chips in a predetermined direction. And a lens plate 70 (corresponding to the coating resin of the present invention) for condensing the reflected light in a desired direction.
The LED light source 1 is a multi-point light source in which LED bare chips are regularly arranged in a direction orthogonal to the substrate 10 and is used as a planar light source by causing these LED bare chips to emit light.

The LED bare chip is encapsulated by a resin encapsulant. For this reason, what is mounted on the substrate 10 that appears in FIG. 2 is not an LED bare chip, but a resin enclosure that encapsulates it.
As shown in FIG. 2, 64 of the resin enclosures are regularly arranged in a matrix of 8 rows and 8 columns, and is indicated by a symbol “Rnm”. Here, n of the symbol “Rnm” indicates the number of rows, and m indicates the number of columns, both of which are integers of 1 to 8. Moreover, the code | symbol of the LED bare chip enclosed with the resin enclosure Rnm is shown by "Lnm" (n and m are the same as n and m used with the code | symbol of the resin encapsulation body).

FIG. 3 is a view when the vertical cross section (6th row) in the XX line of FIG. 1 is viewed from the direction of the arrow, and the range in which the LED bare chips of 6 to 8 rows are mounted is enlarged. Yes.
The substrate 10 is a so-called metal base substrate, and includes two insulating layers 30 and 40 and a metal base 20 attached to the back surface of the back insulating layer 30, as shown in FIG. In the insulating layers 30 and 40, wiring patterns 33 and 43 for supplying power to the LED bare chip Lnm are formed. Here, the metal base 20 has a function of reinforcing the insulating layers 30 and 40 and releasing heat generated when the LED bare chip emits light.

  As shown in FIG. 3, the LED bare chips L66, L67, and L68 have, for example, a substantially rectangular parallelepiped shape, and are flip-chip mounted on the surface of the front-side insulating layer 40 constituting the substrate 10. The LED bare chip Lnm is a so-called single-sided electrode type having both the P electrode and the N electrode (not shown) on the lower surface, and the P electrode and the N electrode are electrically connected to the wiring pattern 43 via bumps. ing.

The LED bare chip Lnm mounted on the substrate 10 is encapsulated by a cylindrical resin encapsulant Rnm as shown in FIGS. The resin enclosure Rnm protects the LED bare chip Lnm, and a phosphor is mixed in the resin constituting the resin enclosure Rnm.
Here, the cylindrical shape of the resin enclosure Rnm can limit the portion that emits the light emitted from the LED bare chip Lnm from the resin enclosure Rnm to the outside, and can be closer to a point light source. Because it can.

In addition, although silicone resin is used for resin for resin enclosure Rnm, other resin may be used, for example, transparent resin excellent in weather resistance, such as an epoxy resin and an acrylic resin, can be utilized.
In the present embodiment, the LED bare chip Lnm is an InGaN-based one whose emission color is blue, and the phosphor is a silicate-based one emitting broadband light. Thereby, the blue light emitted from the LED bare chip Lnm is converted into white light by the phosphor and emitted from the resin encapsulant Rnm.

A resin film 50 is formed on the surface of the substrate 10 except for the mounting portion of the LED bare chip Lnm in the wiring pattern 43. The resin film 50 protects the wiring pattern 43, further ensures insulation between the wiring pattern 43 and the reflection plate, and functions as a dam that stops the flow of the resin before curing when the resin sealing body Rnm is formed. It also has.
The resin film 50 uses, for example, a commonly used white epoxy resin. Here, the reason why the resin film 50 is white is to efficiently extract light emitted from the LED bare chip Lnm to the outside.

  As the reflecting plate 60, for example, a metal plate such as aluminum is used, and 64 reflecting holes 60H are opened corresponding to each LED bare chip Lnm mounted on the substrate 10, as shown in FIGS. ing. As shown in FIG. 3, the reflection hole 60 </ b> H is formed in a taper shape (so-called upward spreading shape) that widens toward the surface side (the side opposite to the substrate 10 and the upper side in FIG. 2). .

The lens plate 70 is formed of, for example, a translucent epoxy resin. As shown in FIGS. 1 to 3, the reflection hole 60 </ b> H of the reflection plate 60, that is, a portion corresponding to the mounting position of the LED bare chip Lnm is formed. The convex lens 70L protrudes in a hemispherical shape. Note that the resin constituting the lens plate 70 is also filled in the reflection hole 60 </ b> H of the reflection plate 60.
As shown in FIGS. 2 and 3, the reflecting plate 60 has a recess 60 </ b> A formed on the entire side surface thereof, and the recess 60 </ b> A is filled with resin constituting the lens plate 70 (this filling is performed). The portion is indicated by reference numeral “70A”) and is engaged with the recess 60A.

As for the side surface of the substrate 10, at least the interfaces between the insulating layers 30 and 40 and between the insulating layer 30 and the metal base 20 are covered with the resin of the lens plate. This is to prevent moisture in the air from entering the interface.
(B) Wiring pattern FIG. 4 is a plan view of the front-side insulating layer, and FIG. 5 is a plan view of the back-side insulating layer.

As shown in FIGS. 4 and 5, wiring patterns 31 and 41 for causing the LED bare chip Lnm to emit light are formed on the surfaces of the insulating layers 30 and 40.
As shown in FIG. 4, the wiring pattern 41 of the front-side insulating layer 40 includes a wiring pattern 43 to which the LED bare chip Lnm is actually connected and a connection terminal 42 that is connected to an external power supply and receives power. Become.

Further, as shown in FIG. 5, the wiring pattern 31 of the back insulating layer 30 includes a wiring pattern 33 for connecting the connection terminal 42 and the wiring pattern 43 of the front insulating layer 40 or connecting the wiring patterns 43 to each other. .
As shown in FIGS. 4 and 5, the wiring patterns 33 and 43 formed on the front and back insulating layers 30 and 40 are supplied with power from the connection terminals 42A, 42B, 42C and 42D of the front insulating layer 40, and 8 rows 8 LED bare chips Lnm mounted in a matrix of columns are connected in series, for example, between odd-numbered LED bare chips and even-numbered LED bare chips in each row, and are further connected in series in each row. The LED bare chips of the eyes and the LED bare chips of the even-numbered columns are connected in series.

That is, the LED bare chips Lnm are connected in series for each row. For example, in the first row, the LED bare chips Lnm are connected in the order of L11, L13, L15, L17, L12, L14, L16, and L18.
Further, the wiring patterns 33 and 43 further connect the first to fourth rows of the LED bare chips connected in series for each row in series in the order of row numbers, and the fifth to eighth rows. Connect the eyes in series in the same row number order.

That is, LED bare chips from the first row and the first column to the fourth row and the eighth column (hereinafter, these LED bare chips are referred to as “first group”) are connected in series, and the fifth row and the first column to the eighth row and the eighth column. LED bare chips (hereinafter referred to as “second group”) are connected in series.
In the first group, as shown in FIGS. 4 and 5, the connecting terminal 42A is connected to the wiring pattern 43A of the front insulating layer 40 via the wiring pattern 33A of the insulating layer 30 on the back side, and the connecting terminal 42B is insulated on the back side. The wiring pattern 33B of the layer 30 is connected to the wiring pattern 43B of the insulating layer 40 on the front side, and the connection terminal 42A side becomes the high potential side.

On the other hand, in the second group, the connection terminal 42C is connected to the wiring pattern 43C of the front insulating layer 40 via the wiring pattern 33C of the back insulating layer 30, and the connection terminal 42D is connected to the wiring pattern 33D of the back insulating layer 30. Are connected to the wiring pattern 43D of the insulating layer 40 on the front side, and the connection terminal 42D side becomes the high potential side.
In addition, each wiring pattern 31 and 41 formed in the insulating layers 30 and 40 on the front and back sides is connected through a via hole indicated by a circle in FIGS. Further, in the present embodiment, the substrate 10 has a multilayer structure using two insulating layers 30 and 40 in order to mount the LED bare chips at a higher density. However, the substrate 10 need not be a multilayer structure. For example, a single layer structure using one insulating layer may be used. Of course, a multilayer structure of three or more layers may be used.

2. Next, a method for manufacturing the LED light source 1 having the above-described configuration will be described.
FIG. 6 is a diagram for explaining a method of manufacturing an LED light source.
First, a wiring pattern as shown in FIG. 6A is formed (in FIG. 6, the wiring pattern 43 of the insulating layer 40 on the front side appears). The insulating layers 30 and 40 and the metal base 20 are formed. A laminated metal base substrate 10 is prepared. The thickness of the front and back insulating layers 30 and 40 is, for example, 0.1 [mm], and the thickness of the metal base 20 is, for example, 1.0 [mm]. Note that a resin film 50 is formed on the surface of the prepared substrate 10 except for a region where connection terminals are formed and portions where the resin enclosure Rnm is to be formed (see FIG. 2).

The wiring patterns 31 and 41 are formed by, for example, etching the copper foil adhered to the surfaces of the insulating layers 30 and 40 into a desired pattern. The resin film 50 is formed by, for example, applying an epoxy resin using a screen printing method. The curing conditions of the applied resin film are 150 ° C. and about 30 minutes.
For example, the thickness of the wiring pattern is approximately 10 [μm], while the thickness of the resin film 50 is approximately 20 [μm]. The dimensions of the LED bare chip mounted on the substrate 10 are, for example, approximately 300 [μm] square and a height of approximately 100 [μm]. In addition, the size and shape of the portion of the resin film 50 that is not applied as the portion where the resin enclosure is to be formed is, for example, a circular shape having a diameter of approximately 1.0 [mm].

  Next, the LED bare chip L is flip-chip mounted on the prepared substrate 10, and a molding die 55 for forming a resin enclosure R enclosing the mounted LED bare chip L is brought into contact with the surface of the substrate 10 (FIG. 6 (b)). The mold 55 is provided with holes 55H at portions corresponding to the respective positions of the LED bare chip L, and when the mold 55 is placed on the substrate 10, each of the LED bare chips L enters the holes 55H. It has become.

  Then, a resin containing a phosphor is supplied to the hole 55H by a printing method, and then the resin supplied into the hole 55H is cured. In the present embodiment, since a silicone resin is used as the resin for the resin enclosure, the curing conditions are about 150 [° C.] and about 30 [min]. In addition, the shape of the resin enclosure is a cylindrical shape, and the size thereof is, for example, about 0.9 [mm] in diameter and 0.30 [mm] in height.

The reflection plate 60 is attached to the substrate 10 on which the resin enclosure R enclosing the LED bare chip L is formed, and the lens plate 70 is formed on the front side of the reflection plate 60.
As shown in FIG. 2, the reflection plate 60 is provided with a reflection hole 60 </ b> H that expands upward corresponding to each LED bare chip L. The size of the reflection hole 60H is approximately 1.0 [mm] on the substrate 10 side and 2.44 [mm] on the lens plate 70 side. Moreover, as for the dimension of 70 A of side recessed parts, height H1 is 0.1 [mm]-0.5 [mm], and depth D1 is about 0.5 [mm], for example.

The reflective plate 60 is attached using an adhesive. Specifically, an adhesive (not shown) is applied to the back surface of the reflecting plate 60, and is adhered to the substrate 10 so that each LED bare chip L enters each reflecting hole 60H of the reflecting plate 60 (FIG. 6). (See (c)).
Next, as shown in FIG. 6 (d), the substrate 10 to which the reflection plate 60 is attached is placed in a molding die 75 for forming the lens plate 70.

FIG. 7 is a schematic view of a mold.
As shown in FIG. 7, the molding die 75 includes an upper die 75A and a lower die 75B. The substrate 10 to which the reflection plate 60 is attached is attached with the metal base 20 in contact with the upper mold. In this attached state, there is a gap between the reflecting plate 60 and the lower mold 75B, and this gap is a cavity 75C, and an epoxy resin for the lens plate is placed in the cavity 75C. The lens plate 70 is formed by injection and curing. The molding conditions for the epoxy resin are, for example, 160 [° C.] and 4 [min].

As shown in FIG. 7, the injection of the resin into the cavity 75C is performed from the end surface side of the substrate 10 on the metal base 20 side, and the injection of the air and the resin into the cavity 75C is performed at the injection port in the metal base. From the side of the end face different from (not shown).
At the time of resin injection, since the concave portion 60A is formed on the side surface of the reflecting plate 60 over the entire circumference, the concave portion 60A becomes a continuous groove, the flow of the injected resin is smooth, and the resin injection time is shortened. Furthermore, voids can be prevented from remaining in the cavity 75C.
3. Thermal Shock Test A thermal shock test was performed using the light emitting light source having the above configuration and the light emitting light source having the conventional configuration. In this thermal shock test, immersion was alternately carried out in a solution of −40 [° C.] and 100 [° C.] in a cycle of 5 minutes, and the presence or absence of interface peeling between the lens plate and the reflection plate was investigated. For the test, a heat shock tester manufactured by Espec was used, and a fluorine-based inert liquid Galden solution was used as the solution.

As a result of the test, there was a difference in size between the two with respect to the incidence of interfacial peeling. That is, it can be said that the light-emitting light source having the above-described configuration is less likely to cause interface peeling due to thermal change as compared with the conventional light-emitting light source.
4). 3. Others (1) Regarding resin for lens plate As described above, the lens plate 70 is formed by the transfer molding method. The lower mold 75B is formed with a deep recess 75D corresponding to the convex lens 70L and has a wide contact surface with the formed lens plate 70, so that the molded lens plate 70 and the lower mold 75C The releasability of the lens plate 70 was poor, and the production efficiency in the molding process of the lens plate 70 was poor.

Note that if a release agent is applied to the mold 75, the releasability of the lens plate is improved, but the applied release agent accumulates in the recess 75D formed in the lower mold, and the tip of the formed lens. Since the mold is flattened or the release agent is applied by a person, there is a problem that the coating amount is uneven and the shape of the lens cannot be kept constant.
Therefore, in order to easily remove the lens plate 70 from the lower mold 75B, there is a tendency to use a so-called self-release type transfer molding transparent resin that does not require application of a release agent. This transparent resin for self-release transfer molding improves the releasability from the lower mold 75B, but also weakens the adhesion between the reflector and the lens plate. For this reason, the reflection plate and the lens plate described in the above-mentioned section “Problems to be solved by the invention” tend to be easily separated from each other.

Accordingly, it can be said that it is very effective to form the concave portion 60A having the above-described configuration particularly in a light emitting light source formed using a transparent resin for transfer molding in that generation of interface peeling can be suppressed.
(2) About a recessed part In said example, although 60 A of recessed parts are provided in the side surface of the reflecting plate 60 over the perimeter, you may provide partially, for example. Even in such a case, since the resin for the lens plate enters into the concave portion and engages in that portion, the reflection plate and the lens plate are not as much as in the case of being provided all around. The stress acting on the interface is relaxed.

In the case where the concave portion is provided in a part, for example, if the concave portion is provided in a portion where peeling is likely to occur between the reflecting plate and the lens plate, the interface peeling can be effectively prevented.
Moreover, although the said recessed part 60A is formed in one place in the side surface of the reflecting plate 60 in FIG. 3, you may form in multiple numbers. Furthermore, instead of the concave portion 60A, a convex portion may be provided, or both the convex portion and the concave portion may be formed on the reflecting plate. In this case, it may be provided on the entire circumference of the reflector or may be provided on a part thereof.

Furthermore, you may form a recessed part in the upper surface of a reflecting plate. Moreover, you may make it a recessed part straddle a side surface and an upper surface or a side surface and a lower surface, for example. That is, the reflecting plate only needs to have a structure in which the lens resin can be engaged with the reflecting plate.
The shape of the concave and convex portions is not particularly limited. However, if the concave portion has a sharp corner, it is not preferable because a crack may occur from a location corresponding to the sharp corner in the lens plate 70. .
<Second Embodiment>
FIG. 8 is a cross-sectional view of the LED light source in the present embodiment, and is an enlarged view of the characteristic portion. In addition, the same code | symbol as 1st Embodiment is used about the same part as 1st Embodiment.

  As in the first embodiment, the LED light source according to the second embodiment includes a substrate 10, an LED bare chip L68 mounted on the surface of the substrate 10, and a resin enclosure that encapsulates the LED bare chip 68. A body R68, a reflecting plate 260 that reflects light emitted from the LED bare chip L68 in a desired direction, and a lens plate 70 that has a lens 70L that condenses the light reflected by the reflecting plate 260 in the desired direction.

The resin film 50 is formed on the surface of the substrate 10 except for the portion where the LED bare chip Lnm is mounted and the portion where the connection terminal is formed, and the reflection plate 260 is attached to this surface via an adhesive. .
As shown in FIG. 8, the reflection plate 260 has a reflection hole 260H corresponding to the LED bare chip L68, as in the first embodiment. And the edge of the upper surface and side surface in the reflecting plate 260, and further, the upper edge (edge on the surface side) of the reflection hole 260H is chamfered, more specifically, the R-processed R portion that rounds the edge. 260A and 260B. Note that the chamfering process may be C machining that drops corners. The radius of the R portions 260A and 260B is preferably about 100 [μm].

  As described above, since the R portions 260A and 260B are processed at the edge between the upper surface and the side surface of the reflection plate 260 and further at the upper edge of the reflection hole 260H, the lens plate is compared with the reflection plate not subjected to the R processing. 70, the stress concentration in the vicinity of the edge of the reflecting plate 260 is relaxed, and cracks that occur in the vicinity of the edge of the reflecting plate 260 in the lens plate 70 can be prevented. Can be prevented.

The resin for the lens plate 70 uses the above-described transparent resin for self-release transfer molding, but even if a resin having no releasability is used, the edge between the upper surface and the side surface of the reflector, If the upper edge of the reflection hole is R-processed, stress concentration generated in the vicinity of the edge of the reflection plate in the lens plate can be reduced.
Further, when stress is concentrated in the lens, the optical refractive index of the concentrated portion changes, and the color of light emitted from the lens may change. However, with the above configuration, it occurs near the edge of the reflecting plate in the lens plate. Since stress concentration can be relaxed, discoloration of light emitted from the lens 70 can be suppressed.
<Third Embodiment>
FIG. 9 is a cross-sectional view of the light emitting light source in the present embodiment, and is an enlarged view of the characteristic portion. In addition, the same code | symbol is used about the same part as 1st Embodiment.

The light-emitting light source in the third embodiment includes a substrate 10, an LED bare chip L68, a resin enclosure R68, a reflection plate 360, and a lens plate 70, as in the first and second embodiments.
As shown in FIG. 9, the reflection plate 360 has a reflection hole 360H, as in the first and second embodiments, and the surface and side surfaces excluding the reflection hole 360H, that is, the resin of the lens plate 70. The surface that is in contact with the surface excluding the reflection hole 360H is roughened. The portion subjected to the roughening process is referred to as a “roughened portion”, and reference numeral “360A” is used.

  Here, the roughening process in the present embodiment will be briefly described. First, the reflecting hole 360H of the reflecting plate 360 is formed by punching, and then pressed again by a mold having a convex portion having the shape of the reflecting hole 360H (tapered shape) (hole formed by punching) It is obtained by pressing the convex part on The surface other than the convex portion of the mold is roughened, and the roughened surface presses the surface of the reflector other than the hole formed by punching. Thereby, the rough surface of the mold is transferred to a surface other than the reflection hole 360H of the reflection plate 360, and the surface of the reflection plate 360 is roughened.

As described above, since the surface and side surfaces except for the reflection holes 360H of the reflection plate 360 are roughened, an anchor effect can be expected between the lens plate 70 and the reflection plate 360, and the surface is roughened. Compared with the reflection plate that is not, the adhesion between the reflection plate 360 and the lens plate 70 is improved, and as a result, the interface peeling between the reflection plate 360 and the lens plate 70 can be prevented.
<Fourth embodiment>
FIG. 10 is a cross-sectional view of the LED light source in the present embodiment, and is an enlarged view of the characteristic portion. In addition, the same code | symbol is used about the same part as 1st Embodiment.

The LED light source in the fourth embodiment includes a substrate 10, LED bare chips L66, L67, and L68, resin enclosures R66, R67, and R68, a reflection plate 460, and a lens plate 70, as in the above embodiments. Further, the reflection plate 460 also has a reflection hole 460H corresponding to the LED bare chips L66, L67, and L68.
The reflection plate 460 has a resin layer (corresponding to the adhesion layer in the present invention) on the entire surface, that is, on the upper and lower surfaces, the side surfaces, and the wall surfaces constituting the reflection holes, and made of a resin having high adhesion to the reflection plate 460 (aluminum plate) ) 470 is formed. In general, the adhesion between the resins is high, and conversely, the adhesion between the resin and the metal is lower than that.

In the fourth embodiment, a resin layer 470 having high adhesion to metal is formed on the entire surface of the reflection plate 460, and the lens plate 70 is formed so as to cover the formed resin layer 470.
Specifically, for example, epoxy resin (EPOXY RESIN: XNR5212, HARDER: XNH5212) manufactured by Nagase ChemteX Corporation is used as the resin having high adhesion to the reflector 460. An epoxy resin obtained by removing a substance having mold release properties from the resin of the lens plate can also be used for this resin.

  The thickness of the resin layer 470 is preferably 100 [μm] or less. This is because when the thickness of the resin layer 470 is larger than 100 [μm], the lower surface of the resin layer 470 and the upper surface of the LED bare chip are substantially the same height when the surface of the substrate 10 is used as a reference. This is because light output from the side surface of the bare chip is absorbed by the resin layer. That is, the light output from the LED bare chip cannot be efficiently reflected in the predetermined (upward) direction.

Therefore, the optimum value for the thickness of the resin layer is appropriately determined depending on the height of the LED bare chip, but at least the lower surface (surface on the substrate side) of the reflector plate is the upper surface (opposite side of the substrate) of the LED bare chip. It is preferable that it is on the substrate side than the surface.
With such a configuration, even if a self-release transfer molding transparent resin is used as the resin for the lens plate 70, the resin for the lens plate 70 and the reflection plate 460 are not in close contact with each other, and the reflection is not caused. Since the lens plate 70 and the reflection plate 460 are brought into close contact with each other via the resin layer 470 having high adhesive strength with the plate 460, interface peeling between the two becomes difficult to occur.

In the above example, the resin layer 470 is formed on the entire surface of the reflection plate 460, but the resin layer may not be provided on the entire surface. For example, only a portion of the reflecting plate that comes into contact with the lens plate may be used, or further, a portion where peeling between the reflecting plate and the lens plate is likely to occur may be provided.
<Fifth embodiment>
FIG. 11 is a perspective view of the LED light source in the present embodiment.

The LED light source 501 in the fifth embodiment has substantially the same structure as that of the above embodiments except that the configuration of the reflecting member is different. As shown in FIG. 11, the reflecting member 570 is composed of a plurality of, for example, four reflecting plates 570A, 570B, 570C, and 570D, and the lens plate is formed independently corresponding to each reflecting plate.
Here, the reflecting member 570 is composed of four reflecting plates 570A, 570B, 570C, and 570D. However, the number of reflecting plates is not limited to four. For example, two or five or more reflecting plates may be used. good. However, when the number of reflectors increases too much, there arises a new problem that it takes time to attach the substrate to the substrate.

  As described above, when the reflecting member 570 is constituted by a plurality of reflecting plates 570A, 570B, 570C, and 570D, each reflecting plate 570A, 570B, 570C, and 570D is different from the case where the reflecting member is constituted by one reflecting plate. Thermal strain acting on the interface with the lens plate can be reduced. Thereby, interface peeling between the reflecting plates 570A, 570B, 570C, and 570D and the lens plate can be suppressed.

The lens plate is formed independently corresponding to each of the reflection plates 570A, 570B, 570C, and 570D. This is because the expansion and contraction of the lens plate due to heat generated during light emission of the LED bare chip increases as the volume of the lens plate increases, so in order to reduce the influence on the coupling between the reflection plate and the substrate, the volume of the lens plate This is because smaller is better.
If the lens plate cannot be formed independently, the same effect as when the volume is reduced can be obtained even if the thickness of the portion connecting adjacent lenses is reduced.
<Others>
In each of the above embodiments, the configuration for improving the adhesion of the interface between the reflecting plate and the lens plate has been described. However, the present invention is a combination of any of the above embodiments. Alternatively, all of the above embodiments may be combined.

In addition, the specific numerical value demonstrated by each embodiment is an example, and is not limited to the numerical value.
Although the present invention has been described based on each embodiment, the content of the present invention is not limited to the specific examples shown in the above embodiments. For example, the following modifications are possible. Can be implemented.

(1) About light emitting light source In each said embodiment, although the light emission (LED) light source was provided with the reflecting plate, this invention is applicable also to the light emitting light source which is not provided with the reflecting plate. Hereinafter, a light-emitting light source that does not include a reflecting plate will be described (this example is referred to as a first modification).
FIG. 12 is a cross-sectional view of a light-emitting light source that does not include a reflecting plate. In addition, the same code | symbol is used about the same part as 1st Embodiment.

  As shown in FIG. 12, the LED light source 601 in the first modification includes a substrate 10, LED bare chips L66, L67, L68 mounted on the surface of the substrate 10, and LED bare chips L66, L67, L68. And a lens plate 670 having a lens 670L that condenses light emitted from the LED bare chips L66, L67, and L68 in a desired direction.

Also in the first modification, the resin film 50 is formed on the wiring pattern 43, and the resin enclosures R66, R67, and R68 are formed as in the first embodiment. In this example, the adhesion layer 680 used in the fourth embodiment is formed on the surface of the resin film 50, and a lens plate 670 is formed by transfer molding so as to cover them.
The lens 670L has a circular shape in plan view, and LED bare chips L66, L67, and L68 are arranged at the center thereof, and has an arc shape in side view.

Here, although the resin film 50 and the adhesion layer 680 are formed separately, for example, if a resin having a high adhesion force is used for the resin film 50, the adhesion layer 680 as in the above example is not necessary, and the resin film 50. Becomes an adhesion layer.
(2) Light Emitter In each of the above embodiments and modifications, a light emitting element, specifically an LED bare chip Lnm, is used as the light emitter mounted on the substrate 10, but a light emitting element other than the LED bare chip Lnm is used. May be. An example of such a light emitting element is a laser diode (LD). However, since the light emitted from the laser diode has strong directivity, for example, a diffusion lens for diffusing the light may be required.

Furthermore, the present invention may be a so-called submount in which a light emitting element is mounted on a substrate in advance as a light emitter.
FIG. 13 is a diagram showing an example in which a submount is used as a light emitter. In addition, the same code | symbol is used about the same part as 1st Embodiment.
FIG. 13 shows an example using a submount instead of the LED bare chip in the LED light source described in the first embodiment (this example is hereinafter referred to as “Modification 2”).

First, the substrate 10 includes two insulating layers 30 and 40 and a metal base 20 attached to the back surface of the back insulating layer 30. Similar to the first embodiment, wiring patterns 33 and 43 are formed in the two insulating layers 30 and 40.
The submounts SM67 and SM68 include, for example, a silicon substrate (hereinafter referred to as “Si substrate”) 710 and light emitting elements mounted on the upper surface of the Si substrate 710, for example, LED bare chips L67 and L68, and LED bare chips L67, And resin enclosures R67 and R68 enclosing L68.

A first terminal electrically connected to one electrode of the LED bare chips L67 and L68 is provided on the lower surface of the Si substrate 710, while the other terminal of the LED bare chips L67 and L68 is provided on the upper surface of the Si substrate 710. A second terminal electrically connected to the electrode is formed.
Submounts SM67 and SM68 are mounted on substrate 10 by, for example, die bonding using silver paste, and the first terminal on the lower surface of Si substrate 710 is connected to wiring pattern 43 on the surface of insulating layer 40 on the front side via silver paste. Further, the second terminal on the upper surface of the Si substrate 710 is wire-bonded to the wiring pattern of the insulating layer 40 on the front side through the wire 715.

In addition, as shown in FIG. 13, since the LED bare chip is mounted in advance on the Si substrate 710, the submount is inspected before mounting on the substrate 10 such as whether the mounted LED bare chip is normally lit. be able to.
For this reason, for example, the inspected submount can be mounted on the substrate, and the manufacturing yield as the LED light source can be improved. In addition, when there are variations in the light colors emitted from the submounts, there is an advantage that submounts with similar colors can be selected and used, or those that emit light of a color that meets the requirements can be collected and mounted.

(3) Illuminating device In each of the above embodiments, the light-emitting light source has been mainly described. However, naturally, the light-emitting light source can also be used as an illuminating device by supplying power via a power supply terminal.
FIG. 14 is a diagram illustrating an example of an illumination device using the LED light source according to the first embodiment.
The lighting device 100 includes a case 151 provided with a base 152 and a reflector 153, and the light emission source 110 is attached to the case 151. The base 152 is of the same standard as the base used in general light bulbs. The reflector 153 is for reflecting the light emitted from the light emitting light source 110 forward.

  The light emitting light source 110 is attached to an attachment portion 154 provided on the opposite side of the case 151 from the base 152. In the case 151, a circuit for supplying power to the LED bare chip via a power supply terminal, for example, a rectifier circuit for rectifying AC power supplied from a commercial power source into DC power, and DC power rectified by the rectifier circuit A power supply circuit including a voltage adjustment circuit for adjusting the voltage value of the power supply is accommodated.

(4) Display device It is also possible to mount an LED bare chip on the substrate in the embodiment and use it as an 8 × 8 display device. However, in this case, a known lighting control circuit or the like that changes the wiring pattern so that each LED bare chip is individually lit and individually lights the LED bare chip to display characters, symbols, and the like is required.

  Here, the display device with 8 rows and 8 columns has been described, but the LED bare chip mounting form is not limited to the form with 8 rows and 8 columns, and a plurality of (implementation) is performed on the substrate described in the embodiment. In this embodiment, 64 LED bare chips may be mounted as one light source of the display device.

  The light-emitting light source according to the present invention can be used for a light-emitting light source, an illumination device, and a display device that make it difficult for the coating resin to peel off.

It is a perspective view of the LED light source in this Embodiment. It is a disassembled perspective view before sticking a reflecting plate on the board | substrate of a LED light source. It is a figure when the vertical cross section (6th line) in the XX line | wire of FIG. 1 is seen from an arrow direction, The range in which the LED bare chip | tip of 6 rows to 8 rows is mounted is expanded. It is a top view of the insulating layer of a front side. It is a top view of the insulating layer of a back side. It is a figure explaining the manufacturing method of a LED light source. It is the schematic of a shaping | molding die. It is sectional drawing of the LED light source in 2nd Embodiment, and is the figure which expanded the characteristic part. It is sectional drawing of the LED light source in 3rd Embodiment, and is the figure which expanded the characteristic part. It is sectional drawing of the LED light source in 4th Embodiment, and is the figure which expanded the characteristic part. It is a perspective view of the LED light source in 5th Embodiment. It is sectional drawing in the light emission light source which is not provided with the reflecting plate. It is a figure which shows the example using a submount as a light-emitting body. It is a figure which shows an example of the illuminating device using the LED light source of 1st Embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 LED light source 10 Board | substrate 20 Metal base 30,40 Insulating layer 50 Resin film 60 Reflector 60A Recess 70 Lens plate 100 Illuminating device 260A, 260B R part 360A Roughening part 470 Resin layer 570A, 570B, 570C, 570D Small reflector Lnm LED bare chip Rnm Encapsulating resin body SM Submount

Claims (12)

A plurality of light emitters mounted on the surface of the substrate, a reflection member having a reflection hole opened corresponding to the light emitter, and a back surface adhered to the surface of the substrate; the entirety of the reflection member; and A coating resin covering the light emitter,
The reflective member has a convex portion and / or a concave portion in a portion that is in contact with the coating resin and excluding the wall surface of the reflective hole, and the corresponding portion of the coating resin is the convex portion and / or the concave portion. A light emitting light source characterized by being engaged. A plurality of light emitters mounted on the surface of the substrate, a reflection member having a reflection hole opened corresponding to the light emitter, and a back surface adhered to the surface of the substrate, the entirety of the reflection member, and the A coating resin covering the light emitter,
The light emitting light source according to claim 1, wherein the reflecting member has a roughened portion whose surface is roughened in a portion that is in contact with the coating resin and excluding the wall surface of the reflecting hole. A plurality of light emitters mounted on the surface of the substrate, a reflection member having a reflection hole opened corresponding to the light emitter, and a back surface adhered to the surface of the substrate, the entirety of the reflection member, and the A coating resin covering the light emitter,
A light emitting light source, wherein an edge on a surface of the reflecting member is chamfered. A plurality of light emitters mounted on the surface of the substrate, a reflection member having a reflection hole opened corresponding to the light emitter, and a back surface adhered to the surface of the substrate, the entirety of the reflection member, and the A coating resin covering the light emitter,
A light-emitting light source, wherein an adhesion layer is formed between the reflection member and the coating resin so that an adhesion force with the reflection member is stronger than an adhesion force with which the coating resin adheres to the reflection member. A plurality of light emitters mounted on the surface of the substrate, a reflection member having a reflection hole opened corresponding to the light emitter, and a back surface adhered to the surface of the substrate, the entirety of the reflection member, and the A coating resin covering the light emitter,
The light-emitting light source, wherein the reflection member includes a plurality of reflection plates.   The light emitting light source according to claim 5, wherein the plurality of reflecting plates are individually covered with the coating resin. A substrate, a plurality of light emitters mounted on the surface of the substrate, and a coating resin that covers the whole light emitters and encloses the light emitters,
The portion of the substrate covered with the coating resin is formed with an adhesion layer stronger than the adhesion between the substrate surface and the coating resin, except for a portion where the light emitter is mounted. light source. A substrate, a plurality of light emitters mounted on the surface of the substrate, and a coating resin that covers and encloses the whole of the plurality of light emitters,
A portion of the substrate covered with the coating resin is roughened except for a portion where the light emitter is mounted.   The light emitting source according to claim 1, wherein the light emitter is a light emitting diode.   The light emitting source according to any one of claims 1 to 8, wherein the light emitter is a submount including a substrate and a light emitting diode mounted on a surface of the substrate.   An illuminating device using the light-emitting light source according to claim 1.   A display device using the light-emitting light source according to claim 1.

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