JP2007036199A - Light-emitting apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light-emitting apparatus having high intensity of radiation light, on-axis luminous intensity and luminance by improving light extracting efficiency. <P>SOLUTION: The light-emitting apparatus is provided with a base 2; light-emitting element 4 mounted on the base; reflecting surface disposed on the base and surrounding the light-emitting element; first light transmissive section 5 provided on the inside of the reflecting surface so as to cover the light-emitting element and having a top surface formed in a concave shape; second light transmissive section 7 provided on the first light transmissive section and performing wavelength conversion for a light radiated from the light-emitting element; and third light transmissive section G provided between the first and second light transmissive sections. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a light emitting device that converts the wavelength of light emitted from a light emitting element with a phosphor and emits the light to the outside.

  A light-emitting device 211 for accommodating a light-emitting element 214 such as a conventional light-emitting diode (LED) is shown in FIG. As shown in FIG. 18, the light emitting device has a mounting portion 212a for mounting the light emitting element 214 at the center of the upper surface, and electrically connects the inside and outside of the light emitting device from the mounting portion 212a and its periphery. A base 212 made of an insulator on which a wiring conductor (not shown) made of a lead terminal, metallized wiring or the like is formed, and a through hole for adhering and fixing to the upper surface of the base 212 and accommodating the light emitting element 214 in the center portion. It is mainly comprised from the formed frame 213 which consists of a metal, resin, or ceramics.

  The substrate 212 is made of an aluminum oxide sintered body (alumina ceramic), an aluminum nitride sintered body, a mullite sintered body, ceramics such as glass ceramics, or a resin such as an epoxy resin. When the substrate 212 is made of ceramics, the metallized wiring layer is formed on the upper surface by baking a metal paste made of tungsten (W), molybdenum (Mo) -manganese (Mn), or the like at a high temperature. When the base 212 is made of resin, when the base 212 is molded, a lead terminal made of copper (Cu), iron (Fe) -nickel (Ni) alloy or the like protrudes at one end into the base 212. To be fixed.

  The frame body 213 is made of a metal such as aluminum (Al) or Fe-Ni-cobalt (Co) alloy, a ceramic such as an alumina sintered body, or a resin such as an epoxy resin. It is formed by molding or the like. Furthermore, a through hole is formed in the central portion of the frame body 213 so as to spread outward as it goes upward. To improve the light reflectance of the inner peripheral surface of the through hole, Al or the like is formed on the inner peripheral surface. The metal is deposited by vapor deposition or plating. The frame body 213 is bonded to the upper surface of the base body 212 with a solder material such as solder or silver solder or a resin adhesive.

  Then, a wiring conductor (not shown) formed on the surface of the base 212 and the electrode of the light emitting element 214 are electrically connected via a bonding wire (not shown), and then the phosphor is applied to the surface of the light emitting element 214. After forming the layer 217, the inside of the frame body 213 is filled with a transparent resin 215 and thermally cured, so that the light emitted from the light emitting element 214 is converted by the phosphor layer 217 to extract light having a desired wavelength spectrum. Can be made with equipment. Further, the light emitting element 214 is selected to include an ultraviolet region having an emission wavelength of 300 to 400 nm, and the color tone is adjusted by adjusting the mixing ratio of phosphor particles of the three primary colors red, blue, and green contained in the phosphor layer 217. Can be designed freely.

  In general, the phosphor particles are powder, and it is difficult to form the phosphor layer 217 with the phosphor alone. Therefore, the phosphor particles are mixed in a transparent member such as a resin or glass to form the surface of the light emitting element 214. Generally, the phosphor layer 217 is applied.

Japanese Patent No. 30565263 JP 2003-110146 A

  However, in the case of the conventional light emitting device 211, the light emitted to the lower side of the phosphor layer 217 after wavelength conversion by the phosphor layer 217 or the lower side on the upper surface of the phosphor layer 217 after being emitted from the light emitting element. The light reflected by the light is repeatedly reflected inside the frame body 213 and attenuated, or is absorbed by the base body 212 and the light emitting element 214, resulting in a significant increase in light loss.

  In addition, light emitted obliquely upward from the light emitting element 214 is radiated to the outside of the light emitting device 211 without being reflected by the frame body 213, so that the radiation angle is increased and the axial luminous intensity is increased. It had the problem of being low.

  Therefore, the present invention has been completed in view of the above-described conventional problems, and an object thereof is to provide a light emitting device and an illuminating device that improve light extraction efficiency and have high radiated light intensity, high on-axis luminous intensity, and luminance. That is.

A light emitting device according to the present invention includes a base,
A light emitting device mounted on the substrate;
A reflective surface disposed on the substrate and surrounding the light emitting element;
A first translucent portion provided on the inner side of the reflective surface so as to cover the light emitting element and having a concave upper surface;
A second translucent part that is provided on the first translucent part and converts the wavelength of the light emitted from the light emitting element;
A third translucent part provided between the first translucent part and the second translucent part.

  In the present invention, when the refractive index of the first translucent part is n1, the refractive index of the second translucent part is n2, and the refractive index of the third translucent part is n3, n3 <n1 And satisfying the relationship of n3 <n2.

  Moreover, in this invention, it is preferable that a said 3rd translucent part is a gas layer.

  In the present invention, it is preferable that the third translucent portion is composed of a silicone resin and a phosphor that is contained in the silicone resin and converts the wavelength of light emitted from the light emitting element.

  Moreover, in this invention, it is preferable that the said light emitting element is a light emitting diode which has a light emission peak wavelength in a near ultraviolet region or an ultraviolet region, and the said fluorescent substance consists of a red fluorescent substance, a green fluorescent substance, and a blue fluorescent substance.

  According to the present invention, for example, the second translucent part containing the phosphor is in contact with the third translucent part having a refractive index lower than that of the second translucent part. After being wavelength-converted by the phosphor contained in the translucent part, the light emitted downward from the phosphor and the light reflected downward on the upper surface of the second translucent part are It is totally reflected by the lower surface of the second translucent part, and light can be advanced upward. Therefore, the emitted light intensity increases.

  In addition, since light incident on the inside of the light emitting device from the outside is totally reflected at the interface between the second light transmitting part and the third light transmitting part, deterioration of the member due to external light, for example, Deterioration of the strength, transmittance, and adhesive strength of the first translucent portion can be suppressed.

  In addition, since the phosphor-containing second light-transmitting part is provided so as to cover the entire first light-transmitting part, light emitted from the light-emitting element does not leak into the second light-transmitting part without leakage. Since the incident light is converted in wavelength, the light emission efficiency is increased. Furthermore, since the wavelength of the light is not converted by only a part of the second light-transmitting portion, but the wavelength-converted light is emitted from the entire surface of the second light-transmitting portion, the color of the light on the light emitting surface. Unevenness can be suppressed.

  Furthermore, it is preferable that the third light-transmitting part is composed of a gas layer having a refractive index of about 1.0, and the second light-transmitting part has a second refractive index as compared with the case where a resin having a refractive index of about 1.5 is filled. After wavelength conversion with the phosphor contained in the translucent part, the light emitted downward from the phosphor and the light reflected downward on the upper surface of the second translucent part are secondly converted. More light can be totally reflected on the lower surface of the translucent part of the light, and light can be advanced upward.

  Moreover, the heat insulation effect is acquired by providing a gas layer between an external environment and a light emitting element. Therefore, heat from the external environment can be suppressed from being transmitted to the light emitting element. As a result, wavelength variation due to temperature variation of the light emitting element is suppressed, and color variation of light emitted from the light emitting device is suppressed.

  Further, the fourth translucent part having a refractive index n4 is formed so as to be in contact with the lower surface of the second translucent part containing the phosphor, so that the lower surface of the second translucent part is fluorescent. Even if the body particles are exposed, the exposed phosphor particles are covered with the fourth translucent portion. Therefore, the light emitted from the phosphor is favorably reflected at the interface between the fourth translucent part and the third translucent part, and the loss of light can be prevented.

  In addition, since the refractive index n2 of the second translucent part is larger than the refractive index n4 of the fourth translucent part, the upper part is at the interface between the second translucent part and the fourth translucent part. Since the reflection loss of the light traveling to the surface decreases, the light extraction efficiency increases.

  In addition, a fourth light-transmitting portion having a refractive index smaller than that of the second light-transmitting portion and larger than that of the third light-transmitting portion is provided on the lower surface of the second light-transmitting portion. After the wavelength conversion by the second translucent part, part of the light traveling downward is at the interface between the second translucent part and the fourth translucent part containing the phosphor. It progresses to the 4th translucent part, without being reflected. Therefore, irregular reflection of light confined in the second light-transmitting portion can be reduced.

  For this reason, the irregularly reflected light does not concentrate on the second translucent part, and light deterioration (deterioration of moisture resistance, transmittance, adhesive strength, etc.) of the second translucent part is suppressed. Furthermore, since the wavelength-converted light that has entered the fourth translucent part from the second translucent part is efficiently reflected at the interface with the gas layer, for example, the second translucent part and the fourth translucent part By arranging the reflecting member around the translucent part, the wavelength-converted light can be efficiently extracted outside the light emitting device.

  Furthermore, it is preferable that the first translucent part is formed of a silicone resin. Since the silicone resin does not easily deteriorate with respect to ultraviolet light or the like, the sealing reliability is improved, and aged deterioration of the light emission efficiency is suppressed.

  Furthermore, it is preferable that the second translucent part is formed of a silicone resin containing a phosphor. Since the silicone resin does not easily deteriorate with respect to ultraviolet light or the like, the sealing reliability is improved, and aged deterioration of the light emission efficiency is suppressed.

  Furthermore, it is preferable that a reflective member joined so as to surround the light emitting element is provided on the outer peripheral portion of the upper surface of the base, and the reflective member has a light reflective inner peripheral surface. As a result, the light emitted from the light emitting element is reflected by the light reflecting surface and travels upward of the light emitting device, thereby improving the directivity of light emission.

  In addition, the reflecting member is preferably formed of a heat conductive material, which increases the heat dissipation area of the base, thereby improving the heat dissipation of the light emitting device.

  Furthermore, it is preferable that the upper surface shape of the 1st translucent part is concave shape. As a result, the interface between the first translucent part and the third translucent part functions as a concave lens that diffuses light. For this reason, the light from the light emitting element uniformly illuminates the entire second translucent portion, and the light emission distribution of the light emitting device is made uniform.

  Furthermore, it is preferable that the upper surface shape of the first translucent portion is a convex surface shape. Thereby, the interface between the first light transmitting part and the third light transmitting part functions as a convex lens that collects light. Therefore, light from the light emitting element is efficiently incident on the second light transmissive portion, and the light emission intensity of the light emitting device is improved.

  Furthermore, it is preferable that the first translucent portion is provided only on the upper surface and side surfaces of the light emitting element. Since most of the light from the light emitting element is emitted from the upper surface and the side surface of the light emitting element, the light extraction efficiency is increased by suppressing reflection on the upper surface and the side surface.

  Furthermore, the light emitting element preferably has a main light emission peak in the near ultraviolet region or the ultraviolet region. As a result, all visible light emitted to the outside comes from light that has been wavelength-converted by the phosphor contained in the second light-transmitting portion. As a result, when designing the color mixture ratio of light, the influence of light from the light emitting element is reduced, and only the phosphor component adjustment is required.

  Moreover, when the light-emitting device according to the present invention is used as a light source of a lighting device, it is possible to improve the light extraction efficiency and provide a lighting device with high radiated light intensity, high on-axis luminous intensity, and luminance.

(First embodiment)
1A and 1B are cross-sectional views showing a first embodiment of the present invention. First, as illustrated in FIG. 1A, the light emitting device 1 includes a base 2, a light emitting element 4, a first light transmissive portion 5, a second light transmissive portion 7, and a third light transmissive portion G. Etc.

  In the base 2, a wiring conductor for supplying a current to the light emitting element 4 is formed from the upper surface to the lower surface or the side surface.

  The light emitting element 4 is mounted on the upper surface of the base 2 so as to be electrically connected to the wiring conductor of the base 2.

  The first light transmissive portion 5 is made of a light transmissive material and covers the light emitting element 4.

  The second translucent portion 7 is formed of a translucent material containing a phosphor that converts the wavelength of light emitted from the light emitting element 4, and the first translucent portion 5 is disposed above the first translucent portion 5. It is provided so as to cover the translucent part 5.

  The third translucent part G is provided between the first translucent part 5 and the second translucent part 7.

  The first light transmissive part 5, the second light transmissive part 7, and the third light transmissive part G are formed in a curved shape centering on the light emitting element 4.

  In the present embodiment, when the refractive index of the first light transmitting portion 5 is n1, the refractive index of the second light transmitting portion 7 is n2, and the refractive index of the third light transmitting portion G is n3, The material of the 1st translucent part 5, the 2nd translucent part 7, and the 3rd translucent part G is selected so that the relationship of n3 <n1 and n3 <n2 may be satisfy | filled.

  Specifically, as the 1st translucent part 5, silicone resin (refractive index: 1.41-1.52), epoxy resin (refractive index: 1.55-1.61), acrylic resin (refractive index) : About 1.48), fluororesin (refractive index: about 1.31), polycarbonate resin (refractive index: about 1.59), polyimide resin (refractive index: about 1.68), etc. can be used.

Moreover, as the 2nd translucent part 7, a silicone resin (refractive index: 1.41-1.52), an epoxy resin (refractive index: 1.55-1.61), an acrylic resin (refractive index: about 1). .48), fluororesin (refractive index: about 1.31), polycarbonate resin (refractive index: about 1.59), etc. can be used, and the phosphor contained in the second translucent portion 7 is La. ₂ O ₂ S: Eu, LiEuW ₂ O ₈ , ZnS: Ag, SrAl ₂ O ₄ : Eu, ZnS: Cu, Al, ZnCdS: Ag, ZnS: Cu, (BaMgAl) ₁₀ O ₁₂ : Eu, SrCaS: Eu, (Sr, Ca, Ba, Mg) ₁₀ (PO ₄ ) ₆ Cl ₂ : Eu or the like can be used.

  Moreover, as the 3rd translucent part G, a silicone resin, an epoxy resin, a fluororesin etc. can be used, or it can also be comprised by the gas layer which consists of air etc. In either case, the material is selected so as to satisfy the relationship of n3 <n1 and n3 <n2. For example, when the light emitted from the light emitting element has a main emission peak from the ultraviolet region to the near ultraviolet region, it is preferable to use a silicone resin that has a high transmittance in the ultraviolet region to the near ultraviolet region and hardly causes yellowing or strength deterioration. In this case, a silicone resin having a refractive index of 1.52 is used as the first and second light-transmitting portions 5 and 7, and a silicone having a refractive index of 1.41 is used as the third light-transmitting portion. Resin is used. Thereby, the light-emitting device of this invention can be comprised.

  With such a configuration, the second translucent part 7 containing the phosphor is in contact with the third translucent part G having a refractive index lower than that of the second translucent part 7. After wavelength conversion by the phosphor contained in the translucent part 7, light emitted downward from the phosphor and light reflected downward by the upper surface of the second translucent part 7 Most of the light is reflected by the lower surface of the second translucent portion 7 due to total reflection or the like, and light can travel upward.

  In addition, most of the light incident from the outside to the inside of the light emitting device is reflected at the interface between the second translucent portion 7 and the third translucent portion G due to total reflection or the like, so that it is reflected in the external light. The deterioration of the member resulting from it, for example, the intensity | strength of the 1st translucent part 5, the transmittance | permeability, and deterioration of adhesive strength can be suppressed.

  In addition, since the phosphor-containing second light-transmitting portion 7 is provided so as to cover the entire first light-transmitting portion 5, the light emitted from the light-emitting element 4 can be leaked without leaking. Since the light is incident on the active portion 7 and wavelength conversion is performed, the light emission efficiency is increased.

  Furthermore, it is preferable that the third translucent portion G is composed of a gas layer having a refractive index of about 1.0, which is higher than that in the case where a resin having a refractive index of about 1.5 is filled. After being wavelength-converted by the phosphor contained in the translucent portion 7, the light emitted from the phosphor in the lower direction and reflected from the upper surface of the second translucent portion 7 in the lower direction Most of the light can be reflected more on the lower surface of the second translucent portion 7, and the light can travel upward.

  Further, by providing a gas layer as the third translucent portion G between the external environment and the light emitting element 4, a heat insulating effect can be obtained. Therefore, heat from the external environment can be suppressed from being transmitted to the light emitting element 4. As a result, wavelength variation due to temperature variation of the light emitting element 4 is suppressed, and color variation of light emitted from the light emitting device is suppressed.

  Furthermore, in this embodiment, it is preferable that the thickness of the 3rd translucent part G is substantially constant. The thickness of the third translucent portion G corresponds to the distance between the upper surface of the first translucent portion 5 and the lower surface of the second translucent portion 7, and has an error of ± 5% as a whole. A range is preferable.

  If the upper surface or the lower surface of the third translucent portion G has irregularities and the thickness is not substantially constant, refraction occurs at the upper and lower surfaces, and the light intensity distribution may fluctuate. Therefore, by making the thickness of the third light transmitting portion G substantially constant, the intensity distribution of light incident on the second light transmitting portion 7 from the first light transmitting portion 5 does not fluctuate. The light quantity distribution converted in wavelength by the translucent portion 2 is almost uniform, and color variation and color unevenness on the light emitting surface can be suppressed.

  Next, in FIG. 1B, the shape of the substrate 2 is devised, the upper surface of the substrate 2 on which the light emitting element 4 is mounted is flat, and is inclined upward from the upper surface of the substrate 1 on which the light emitting element 4 is mounted toward the periphery. A conical surface is formed. By providing such an inclined surface, the light emitted from the light emitting element 4 is directed upward, so that the light utilization efficiency is improved.

(Second Embodiment)
FIG. 2 is a cross-sectional view showing a second embodiment of the present invention. The light emitting device 1 includes a base 2, a frame 3, a light emitting element 4, a first light transmitting part 5, a second light transmitting part 7, a third light transmitting part G, and the like. Is done.

  In the base 2, a wiring conductor for supplying a current to the light emitting element 4 is formed from the upper surface to the lower surface or the side surface.

  The light emitting element 4 is mounted on the upper surface of the base 2 so as to be electrically connected to the wiring conductor of the base 2.

  The frame 3 is fixed on the base 2 and has an inner surface that is inclined upward so as to surround the light emitting element 4. The inner surface of the frame 3 is preferably light reflective in terms of light utilization efficiency.

  The first light transmissive portion 5 is made of a light transmissive material and covers the light emitting element 4.

  The second translucent portion 7 is formed of a translucent material containing a phosphor that converts the wavelength of light emitted from the light emitting element 4, and the first translucent portion 5 is disposed above the first translucent portion 5. It is provided so as to cover the translucent part 5.

  The third translucent part G is provided between the first translucent part 5 and the second translucent part 7.

  The first translucent part 5, the second translucent part 7, and the third translucent part G have a horizontal interface so that a multilayer configuration substantially parallel to the upper surface of the substrate 2 can be obtained.

  In the present embodiment, when the refractive index of the first light transmitting portion 5 is n1, the refractive index of the second light transmitting portion 7 is n2, and the refractive index of the third light transmitting portion G is n3, The material of the 1st translucent part 5, the 2nd translucent part 7, and the 3rd translucent part G is selected so that the relationship of n3 <n1 and n3 <n2 may be satisfy | filled. Specific materials listed in the above embodiment can be used, and by appropriately combining these materials, the relationship of n3 <n1 and n3 <n2 can be satisfied.

  With such a configuration, the second translucent part 7 containing the phosphor is in contact with the third translucent part G having a refractive index lower than that of the second translucent part 7. After wavelength conversion by the phosphor contained in the translucent part 7, light emitted downward from the phosphor and light reflected downward by the upper surface of the second translucent part 7 Most of the light is reflected by the lower surface of the second translucent portion 7 due to total reflection or the like, and light can travel upward.

  In addition, most of the light incident from the outside to the inside of the light emitting device is reflected at the interface between the second translucent portion 7 and the third translucent portion G due to total reflection or the like, so that it is reflected in the external light. The deterioration of the member resulting from it, for example, the intensity | strength of the 1st translucent part 5, the transmittance | permeability, and deterioration of adhesive strength can be suppressed.

  In addition, since the phosphor-containing second light-transmitting portion 7 is provided so as to cover the entire first light-transmitting portion 5, the light emitted from the light-emitting element 4 can be leaked without leaking. Since the light is incident on the active portion 7 and wavelength conversion is performed, the light emission efficiency is increased.

  Furthermore, it is preferable that the third translucent portion G is composed of a gas layer having a refractive index of about 1.0, which is higher than that in the case where a resin having a refractive index of about 1.5 is filled. After being wavelength-converted by the phosphor contained in the translucent portion 7, the light emitted from the phosphor in the lower direction and reflected from the upper surface of the second translucent portion 7 in the lower direction Most of the light can be reflected more on the lower surface of the second translucent portion 7, and the light can travel upward.

  Further, by providing a gas layer as the third translucent portion G between the external environment and the light emitting element 4, a heat insulating effect can be obtained. Therefore, heat from the external environment can be suppressed from being transmitted to the light emitting element 4. As a result, wavelength variation due to temperature variation of the light emitting element 4 is suppressed, and color variation of light emitted from the light emitting device is suppressed.

  Furthermore, in this embodiment, it is preferable that the thickness of the 3rd translucent part G is substantially constant. The thickness of the third translucent portion G corresponds to the distance between the upper surface of the first translucent portion 5 and the lower surface of the second translucent portion 7, and has an error of ± 5% as a whole. A range is preferable.

  If the upper surface or the lower surface of the third translucent portion G has irregularities and the thickness is not substantially constant, refraction occurs at the upper and lower surfaces, and the light intensity distribution may fluctuate. Therefore, by making the thickness of the third light transmitting portion G substantially constant, the intensity distribution of light incident on the second light transmitting portion 7 from the first light transmitting portion 5 does not fluctuate. The light quantity distribution converted in wavelength by the translucent portion 2 is almost uniform, and color variation and color unevenness on the light emitting surface can be suppressed.

(Third embodiment)
3A and 3B are cross-sectional views showing a third embodiment of the present invention. First, as illustrated in FIG. 3A, the light emitting device 1 includes a base body 2, a frame body 3, a light emitting element 4, a first light transmitting portion 5, a second light transmitting portion 7, and a third light emitting device 4. It is composed of a translucent part G and the like.

  In the base 2, a wiring conductor for supplying a current to the light emitting element 4 is formed from the upper surface to the lower surface or the side surface.

  The light emitting element 4 is mounted on the upper surface of the base 2 so as to be electrically connected to the wiring conductor of the base 2.

  The frame 3 is fixed on the base 2 and has an inner surface that is inclined upward so as to surround the light emitting element 4. The inner surface of the frame 3 is preferably light reflective in terms of light utilization efficiency.

  The first light transmissive portion 5 is made of a light transmissive material and covers the light emitting element 4.

  The second translucent portion 7 is formed of a translucent material containing a phosphor that converts the wavelength of light emitted from the light emitting element 4, and the first translucent portion 5 is disposed above the first translucent portion 5. It is provided so as to cover the translucent part 5.

  The third translucent part G is provided between the first translucent part 5 and the second translucent part 7.

  In the present embodiment, when the refractive index of the first light transmitting portion 5 is n1, the refractive index of the second light transmitting portion 7 is n2, and the refractive index of the third light transmitting portion G is n3, The material of the 1st translucent part 5, the 2nd translucent part 7, and the 3rd translucent part G is selected so that the relationship of n3 <n1 and n3 <n2 may be satisfy | filled. Specific materials listed in the above embodiment can be used, and by appropriately combining these materials, the relationship of n3 <n1 and n3 <n2 can be satisfied. Satisfying such a relationship improves the light utilization efficiency as described above.

  Further, as shown in FIG. 3A, the lower surface of the first light transmitting portion 5, the upper surface of the second light transmitting portion 7, and the interface between the second light transmitting portion 7 and the third light transmitting portion G. Has an interface substantially parallel to the upper surface of the substrate 2, and the upper surface shape of the first translucent portion 5 is preferably concave. As a result, the interface between the first translucent part 5 and the third translucent part G functions as a concave lens that diffuses light. For this reason, the light from the light emitting element 4 uniformly illuminates the entire second translucent portion 7, and the light emission distribution of the light emitting device 1 is made uniform.

  As an alternative to this, as shown in FIG. 3B, the upper surface shape of the first light-transmissive portion 5 is preferably a convex surface shape. As a result, the interface between the first translucent portion 5 and the third translucent portion G functions as a convex lens that collects light. Therefore, the light from the light emitting element 4 efficiently enters the second light transmissive portion 7, and the light emission intensity of the light emitting device 1 is improved.

  Specific examples will be described below.

(Example 11)
A plate-like alumina ceramic substrate having a width of 15 mm, a depth of 15 mm, and a thickness of 1 mm, in which a wiring conductor was formed from the upper surface of the substrate on which the light emitting element is mounted to the outer surface of the substrate, was prepared.

  The substrate on which the light emitting element is mounted has a pair of circular pads connected to the electrodes of the light emitting element on the upper surface, and is formed by a metallized layer obtained by firing Mo-Mn powder.

  Furthermore, a Ni plating layer having a thickness of 3 μm and an Au plating layer having a thickness of 3 μm are sequentially deposited on the surfaces of the pair of circular pads by an electrolytic plating method.

Then, a frame-like reflecting member made of Al (aluminum) obtained by chemically polishing the surface of 15 mm × 15 mm × thickness 5 mm through an adhesive made of acrylic resin so as to surround the light emitting element on the upper surface of the above-mentioned substrate. Attached. Incidentally, the reflecting member has a through inner circumference phi ₁ of the lower end 5 mm, the inner circumferential diameter phi ₂ is 10mm at the upper end, straight inclined surface extending in accordance with the inner peripheral surface toward the upper end portion is formed It has a hole.

  Next, a light emitting device composed of a nitride compound semiconductor of 0.35 mm × 0.35 mm × thickness 0.1 mm, which emits near ultraviolet light having a peak at a wavelength of 405 nm through Ag paste on the circular pad described above. A pair of electrodes were bonded and fixed.

  Thereafter, the first translucent portion 5 made of silicone resin and having a refractive index n1 = 1.41 is dropped inside the reflecting member so as to have a thickness of 2.5 mm so as to cover the light emitting element using a dispenser. Heat cured.

On the other hand, a refractive index n2 in which La ₂ O ₂ S: Eu (red phosphor), ZnS: Cu, Al (green phosphor), (BaMgAl) ₁₀ O ₁₂ : Eu (blue phosphor) is contained in an epoxy resin. = 1.55, and a plate-like second light-transmitting portion 7 having a thickness of 0.5 mm was formed. A light emitting device is formed by disposing the second light-transmitting portion above the first light-transmitting portion 5 so as to cover the entire first light-transmitting portion 5 and bonding the second light-transmitting portion to the reflecting member. did. At this time, the first translucent portion 5 and the second translucent portion 7 are provided so as to leave a gap of 2 mm, and this gap is a third translucent light with a refractive index n3 = 1. It functions as the sex part G. The same applies to the following embodiments.

(Example 12)
Except that the fourth light-transmitting part 6 having a thickness of 0.5 mm and made of a silicone resin and having a refractive index n4 = 1.41 is adhered to the lower surface of the second light-transmitting part 7. Were the same as in Example 11 to form a light emitting device. Here, the difference from Example 11 is that the refractive index n4 of the fourth translucent portion 6 is smaller than the refractive index n2 of the second translucent portion 7.

(Comparative Example 11)
The first light transmissive part 5 is filled in the light emitting device surrounded by the inner peripheral surface of the reflecting member and the second light transmissive part 7, and the third light transmissive part G and the fourth light transmissive part are filled. A light emitting device was formed in the same manner as in Example 12 except that the portion 6 was not provided.

  When the total luminous fluxes of Examples 11 and 12 and Comparative Example 11 were measured, the total luminous flux of Example 11 was about 3% larger than that of Comparative Example 11, and the total luminous flux of Example 12 was compared. About 7% more than Example 11. Therefore, Example 11 and Example 12 were confirmed to have better luminous efficiency than Comparative Example 11.

(Fourth embodiment)
FIG. 4 is a cross-sectional view showing a fourth embodiment of the present invention. The light emitting device 1 includes a base 2, a frame 3, a light emitting element 4, a first light transmissive part 5, a second light transmissive part 7, a third light transmissive part G, 4 translucent portions 6 and the like.

  The substrate 2 is made of alumina ceramic, aluminum nitride sintered body, mullite sintered body, ceramic such as glass ceramic, resin such as epoxy resin, or metal, and functions as a support member that supports the light emitting element 4.

  When the substrate 2 is ceramic, a wiring conductor (not shown) for electrically connecting the light emitting element 4 is formed on the upper surface of the substrate 2 and its periphery. The wiring conductor is led out to the outer surface of the base 2 and connected to the external electric circuit board, whereby the light emitting element 4 and the external electric circuit board are electrically connected.

  As a method of connecting the light emitting element 4 to the wiring conductor, a method of connecting via wire bonding (not shown) or a flip chip bonding method in which the lower surface of the light emitting element 4 is connected by solder bumps (not shown). The method used is used. Preferably, the connection is made by a flip chip bonding method. Thereby, since the wiring conductor can be provided directly under the light emitting element 4, it is not necessary to provide a space for providing the wiring conductor on the upper surface of the base 2 around the light emitting element 4. Therefore, it is possible to effectively suppress the light emitted from the light emitting element 4 from being absorbed in the space for the wiring conductor of the base body 2 to reduce the intensity of the emitted light, and to reduce the size of the light emitting device 1. .

  When the base 2 is made of ceramic, the wiring conductor is formed of a metallized layer of metal powder such as W, Mo, Cu, silver (Ag), for example. Alternatively, an input / output terminal made of an insulator on which a wiring conductor is formed is provided by being fitted into a through hole provided in the base 2. Moreover, when the base | substrate 2 consists of resin, it forms, for example by embedding lead terminals, such as a Fe-Ni-Co alloy.

  It should be noted that a metal with excellent corrosion resistance, such as Ni or gold (Au), should be deposited on the exposed surface of the wiring conductor in a thickness of about 1 to 20 μm, effectively preventing oxidative corrosion of the wiring conductor. In addition, the connection between the light emitting element 4 and the wiring conductor can be strengthened. Therefore, for example, a Ni plating layer having a thickness of about 1 to 10 μm and an Au plating layer having a thickness of about 0.1 to 3 μm are sequentially deposited on the exposed surface of the wiring conductor by an electrolytic plating method or an electroless plating method. More preferably.

  The frame 3 is made of metal such as Al or Fe-Ni-Co alloy, ceramics such as alumina ceramics, or resin such as epoxy resin, and is formed by cutting, die molding, extrusion molding, or the like.

  Further, the surface of the inner peripheral surface of the frame body 3 preferably has an arithmetic average roughness Ra of the surface of 0.1 μm or less, whereby the light of the light emitting element 4 is favorably reflected to the upper side of the light emitting device 1. can do. When Ra exceeds 0.1 μm, it becomes difficult to reflect light upward on the inner peripheral surface of the frame 3 of the light emitting element 4 and to diffusely reflect inside the light emitting device 1. As a result, the propagation loss of light inside the light emitting device 1 tends to increase, and it becomes difficult to emit light outside the light emitting device 1 at a desired radiation angle.

In addition, the second translucent portion 7 includes, for example, phosphors of three primary colors of red, blue, and green in a translucent portion such as epoxy resin, silicone resin, acrylic resin, or glass. It is formed by applying or placing on the upper surface of the second translucent part. Various materials are used as the phosphor. For example, red is a phosphor of La ₂ O ₂ S: Eu (Eu-doped La ₂ O ₂ S), green is a phosphor of ZnS: Cu, Al, and blue is a phosphor. A particulate material such as a phosphor of (BaMgAl) ₁₀ O ₁₂ : Eu is used. Furthermore, such a phosphor is not limited to one type, and a light having a desired emission spectrum and color can be output by blending a plurality of phosphors at an arbitrary ratio.

  Moreover, it is preferable that the thickness of the 2nd translucent part 7 is 0.1-1 mm. Thereby, the wavelength of the light emitted from the light emitting element 4 can be efficiently converted. When the thickness of the phosphor layer 7 is less than 0.1 mm, the ratio of the light emitted from the light emitting element 4 that is transmitted through the phosphor layer 7 without being wavelength-converted by the phosphor layer 7 is increased. Efficiency tends to decrease. On the other hand, if the thickness exceeds 1 mm, the light whose wavelength has been converted by the phosphor layer 7 is easily absorbed by the phosphor layer 7 and the intensity of radiated light tends to decrease.

  Further, the first light transmissive part 5 is formed so as to cover the light emitting element 4. The first light transmitting portion 5 is preferably made of a material having a small refractive index difference from the light emitting element 4 and having a high transmittance with respect to light in the ultraviolet region to the visible light region. The property part 5 consists of transparent resin, such as a silicone resin and an epoxy resin, low melting glass, sol-gel glass, etc. Thereby, it is possible to effectively suppress the occurrence of light reflection loss due to the difference in refractive index between the light emitting element 4 and the first light transmitting portion 5.

  Preferably, the first translucent part 5 is made of a silicone resin. Since the silicone resin does not easily deteriorate with respect to light such as ultraviolet light emitted from the light-emitting element 4, a light-emitting device with high sealing reliability can be provided.

  Moreover, as shown in FIG. 5, it is preferable that the 1st translucent part 5 is hemispherical. Thereby, since the traveling direction of the light emitted from the light emitting element 4 can be orthogonal to the upper surface of the first translucent portion 5, the upper surface of the first translucent portion 5 Light can be efficiently extracted without being totally reflected, and the light emitting device 1 having high radiation light intensity can be obtained.

  Moreover, as the 3rd translucent part G, a silicone resin, an epoxy resin, a fluororesin etc. can be used, or it can also be comprised by the gas layer which consists of air etc. In either case, the material is selected so as to satisfy the relationship of n3 <n1 and n3 <n2. For example, when the light emitted from the light emitting element has a main emission peak from the ultraviolet region to the near ultraviolet region, it is preferable to use a silicone resin that has a high transmittance in the ultraviolet region to the near ultraviolet region and hardly causes yellowing or strength deterioration. In this case, a silicone resin having a refractive index of 1.52 is used as the first and second light-transmitting portions 5 and 7, and a silicone having a refractive index of 1.41 is used as the third light-transmitting portion. Resin is used. Thereby, the light-emitting device of this invention can be comprised.

  It is preferable that the fourth translucent portion 6 is formed on the lower surface of the second translucent portion 7. Thereby, even if the phosphor is exposed on the lower surface of the second light-transmitting portion 7, the light emitted from the phosphor is covered by covering the exposed phosphor with the fourth light-transmitting portion 6. Can be totally reflected well on the lower surface of the fourth light-transmissive portion 6 to allow light to travel upward. Therefore, it is possible to effectively prevent the light from being directly emitted from the phosphor into the gap and absorbed by the substrate 2 and the light emitting element 4, and to obtain the light emitting device 1 that can further improve the light extraction efficiency. it can.

  The fourth translucent part 6 is provided so as to cover the first translucent part 5 with a gap between the first translucent part 5 and the ultraviolet light region to the visible light region. It is good to consist of a thing with the high transmittance | permeability with respect to the light. Thus, since the 4th translucent part 6 is provided so that a clearance gap may be provided between the 1st translucent part and the 1st translucent part may be covered, the 1st translucent part is provided. The light emitted in a wide range from the upper surface of the conductive portion 5 can be advanced in the upper direction perpendicular to the base 2 when entering the lower surface of the fourth light transmissive portion 6. Therefore, it is possible to effectively prevent the occurrence of color unevenness due to the difference in wavelength conversion efficiency by approximating the optical path length transmitted through the second translucent portion 7 in the entire second translucent portion 7. The light can be emitted with good directivity onto the axis of the light emitting device 1 to increase the intensity of emitted light, the intensity of the axis, and the luminance.

  Furthermore, since the lower surface of the fourth translucent part 6 is in contact with the third translucent part G made of an air layer or the like having a lower refractive index, the phosphor in the second translucent part 7 Most of the light emitted in the lower direction and the light reflected in the lower direction on the upper surface of the second translucent portion 7 can be totally reflected on the lower surface of the fourth translucent portion 6, It is possible to effectively prevent light from being repeatedly reflected and attenuated inside the frame body 3 and absorbed by the base 2 and the light emitting element 4, and to effectively suppress a decrease in light extraction efficiency.

  Note that the third translucent portion G, that is, the gap between the first translucent portion 5 and the second translucent portion 7, or the first translucent portion 5 and the fourth translucent portion. The gap between the light transmitting portion 6 is smaller than the refractive index of the first light transmitting portion 5, the fourth light transmitting portion 6, and the second light transmitting portion 7 constituting the phosphor layer. It does not have to be an air layer. For example, it may be a layer of another gas or a layer of a light-transmitting portion with a low refractive index.

  The fourth translucent part 6 is preferably made of a material having a small difference in refractive index from the second translucent part 7 and having a high transmissivity with respect to light from the ultraviolet region to the visible light region. The fourth translucent portion 6 is made of a transparent resin such as a silicone resin or an epoxy resin, a low-melting glass, a sol-gel glass, or the like. It is preferable that the 4th translucent part 6 is the same material as the 2nd translucent part 7 which comprises a fluorescent substance layer. Thereby, while being able to permeate | transmit light favorably at the interface of the 2nd translucent part 7 and the 4th translucent part 6, light loss can be made small, and the 2nd translucent part 7 and These can be effectively prevented from being peeled off by stress due to a difference in thermal expansion coefficient from the fourth light-transmissive portion 6.

  Moreover, it is preferable to make the 1st translucent part 5 into a silicone resin. Since the silicone resin does not easily deteriorate with respect to light such as ultraviolet light emitted from the light-emitting element 4, a light-emitting device with high sealing reliability can be provided.

  Further, the thickness of the first translucent part 5, the distance (gap width) between the first translucent part 5 and the second translucent part 7, the first translucent part 5 and the first translucent part 5. 4 (the width of the gap) and the thickness of the fourth translucent part 6 are the same as the interface between the first translucent part 5 and the second translucent part 7 or the first translucent part 6. The light-transmitting part 5 and the fourth light-transmitting part 6 may be appropriately selected in consideration of the reflection efficiency at the interface.

  Further, when it is assumed that the thickness of the light emitting device is the same, preferably, as shown in FIG. 7, the thickness of the third translucent part G, that is, the upper surface of the first translucent part 5 and the second upper part. The distance (gap width) between the first translucent part 7 and the upper surface of the first translucent part 5 and the fourth translucent part 6 (gap width) It is better to make it smaller than the thickness of the sex part 5. As a result, the thermal expansion of the light-emitting element 4 is changed by reducing the thermal expansion of the gap and sufficiently absorbing the stress due to the thermal expansion of the gap by the first light-transmitting portion 5 to generate stress in the light-emitting element 4. It can prevent well.

  On the other hand, from the viewpoint of reducing light loss, when the thickness of the light emitting device is assumed to be the same, the total thickness of the first light transmissive part 5 and the second light transmissive part 6 (second light transmissive part). When there is no transmissive part 6, the thickness of the first translucent part 5) is the width of the gap (the distance between the first translucent part 5 and the second translucent part 6 or the first translucent part 6). It is preferable that the distance is smaller than the distance between the translucent part 5 and the second translucent part 7. Thereby, in the path through which the light emitted from the light emitting element 4 passes until it is emitted to the outside, the ratio of the air layer having a high transmittance can be increased, and it is confined in the light emitting device or repeatedly diffused. Light propagation loss caused by the

  Also, as shown in FIG. 6, a lid made of a transparent member such as glass, sapphire, quartz, or a resin (plastic) such as epoxy resin, silicone resin, acrylic resin, polycarbonate resin, polyimide resin, or the like on the upper surface of the frame 3 The body 8 may be placed and fixed. In this case, the light emitting element 4, the wiring conductor, the bonding wire, the first light transmitting part 5, and the fourth light transmitting part 6 installed inside the frame 3 are protected, and the inside of the light emitting device 1 is protected. The light emitting element 4 can be hermetically sealed, and the light emitting element 4 can be operated stably for a long time. Further, by forming the lid 8 in the shape of a lens and adding the function of an optical lens, it is possible to collect or disperse the light and extract the light outside the light emitting device 1 with a desired radiation angle and intensity distribution. .

  In addition, the light emitting device 1 of the present invention is a single light source set in a predetermined arrangement and used as a light source, or a plurality of light emitting devices, for example, a lattice shape, a staggered shape, a radial shape, or a plurality of light emission types. A lighting device according to the present invention can be obtained by installing a light emitting device group of a circular shape or a polygonal shape, which is composed of a plurality of devices, so as to have a predetermined arrangement, such as a concentric group of light emitting device groups. . Thereby, the light extraction efficiency can be improved, and an illuminating device with high radiated light intensity, high on-axis luminous intensity, and luminance can be provided.

  In addition, since light emission by electron recombination of the light emitting element 4 made of a semiconductor is used, it is possible to achieve lower power consumption and longer life than a conventional lighting device using discharge, and a small size that generates less heat. It can be set as the illuminating device. As a result, fluctuations in the center wavelength of the light generated from the light emitting element 4 can be suppressed, and light can be emitted with a stable radiant light intensity and radiant light angle (light distribution distribution) over a long period of time. It can be set as the illuminating device by which the color nonuniformity in the surface and the bias of illuminance distribution were suppressed.

  Further, the lighting device of the present invention is not limited to one in which a plurality of light emitting devices 1 are installed in a predetermined arrangement, but may be one in which one light emitting device 1 is installed in a predetermined arrangement.

  Specific examples will be described below.

(Example 21)
First, an alumina ceramic substrate to be the base 2 was prepared. The substrate 2 was a rectangular parallelepiped having a width of 8 mm, a depth of 8 mm, and a thickness of 0.5 mm.

  Further, a wiring conductor was formed from the upper surface of the substrate 2 on which the light emitting element 4 is mounted to the outer surface of the substrate 2. The wiring conductor on the upper surface of the substrate 2 on which the light emitting element 4 is mounted is formed into a circular pad having a diameter of 0.1 mm by a metallized layer made of Mo—Mn powder, and a Ni plating layer having a thickness of 3 μm is deposited on the surface. It was done. Moreover, the wiring conductor inside the base body 2 was formed by an electrical connection portion made of a through conductor, a so-called through hole. This through hole was also formed with a metallized conductor made of Mo-Mn powder.

Further, the base body 2 and the frame body 3 are bonded with an adhesive, and then the first light-transmissive portion 5 made of an epoxy resin having a refractive index of 1.61 is covered with the frame body 3 so as to cover the light emitting element 4. Is placed in a hemispherical shape with a radius of 0.4 mm, and a gap of 1.1 mm is provided in the height direction from the hemispherical zenith, and the refractive index is 1.41 above the silicone. A plate-like fourth translucent part 6 made of resin and having a thickness of 0.1 mm was adhered to the inside of the frame 3 so as to cover the first translucent part 5. Then, the upper surface of the fourth light transmitting portion 6, red _La 2 _O 2 S: Eu, green ZnS: Cu, Al, blue _{(BaMgAl) 10 O} 12: phosphor silicone resin consisting of Eu The light-emitting device 1 of the present invention was configured by covering the second light-transmitting portion 7 contained in the light-transmitting member.

(Comparative Example 21)
On the other hand, as Comparative Example 21, the same conditions as in Example 21 were configured except that the frame 3 was filled with the first translucent portion 5 with a thickness of 1.5 mm.

  When the total luminous flux was measured for Example 21 and Comparative Example 21 produced in this manner, the total luminous flux of Example 21 was increased by about 10% compared to Comparative Example 21. Was found to be excellent.

(Fifth embodiment)
8-10 is sectional drawing which shows 5th Embodiment of this invention. The light emitting device 1 includes a base 2, a light emitting element 4, a first light transmissive part 5, a second light transmissive part 7, a third light transmissive part G, and the like.

  The substrate 2 is made of alumina ceramic, aluminum nitride sintered body, mullite sintered body, ceramic such as glass ceramic, resin such as epoxy resin, or metal, and functions as a support member that supports the light emitting element 4.

  When the substrate 2 is ceramic, a wiring conductor (not shown) for electrically connecting the light emitting element 4 is formed on the upper surface of the substrate 2 and its periphery. The wiring conductor is led out to the outer surface of the base 2 and connected to the external electric circuit board, whereby the light emitting element 4 and the external electric circuit board are electrically connected.

  The first light transmissive portion 5 is made of a light transmissive material and covers the upper surface of the light emitting element 4.

  The second translucent portion 7 is formed of a translucent material containing a phosphor that converts the wavelength of light emitted from the light emitting element 4, and the first translucent portion 5 is disposed above the first translucent portion 5. It is provided so as to cover the translucent part 5.

  The third translucent part G is provided between the first translucent part 5 and the second translucent part 7.

  In the present embodiment, when the refractive index of the first light transmitting portion 5 is n1, the refractive index of the second light transmitting portion 7 is n2, and the refractive index of the third light transmitting portion G is n3, The material of the 1st translucent part 5, the 2nd translucent part 7, and the 3rd translucent part G is selected so that the relationship of n3 <n1 and n3 <n2 may be satisfy | filled. Specific materials listed in the above embodiment can be used, and by appropriately combining these materials, the relationship of n3 <n1 and n3 <n2 can be satisfied. Satisfying such a relationship improves the light utilization efficiency as described above.

  8 to 10, a conductive path 18 such as metallization using a metal powder such as W, Mo, or Mn for electrically connecting the inside and outside of the light emitting device 1 to the surface or inside of the substrate 2. The electrode of the light emitting element 4 is electrically connected to a portion of the conductive path 18 exposed on the upper surface of the base 2. Further, the conductive path 18 is connected to an external electric circuit at a portion exposed to the outside such as the lower surface of the base 2 via a lead terminal made of a metal such as Cu or Fe—Ni alloy. Thereby, the light emitting element 4 is electrically connected to the external electric circuit via the conductive path 18.

  The conductive path 18 is preferably coated with a metal having excellent corrosion resistance, such as Ni or gold (Au), with a thickness of about 1 to 20 μm on the exposed surface, and the conductive path 18 is subject to oxidative corrosion. While being able to prevent effectively, the electrical connection between the conductive path 18 and the light emitting element 4 and the connection between the conductive path 18 and the conductive adhesive member 17 can be strengthened. Accordingly, a Ni plating layer having a thickness of about 1 to 10 μm and an Au plating layer having a thickness of about 0.1 to 3 μm are sequentially deposited on the exposed surface of the conductive path 18 by an electrolytic plating method or an electroless plating method. More preferably.

  The frame 3 is made of a metal such as aluminum (Al) or Fe-Ni-cobalt (Co) alloy, a ceramic such as an alumina-based sintered body, or a resin such as an epoxy resin, and includes cutting, die molding, extrusion molding, and the like. It is formed into a frame shape by the molding technique. Moreover, the through-hole which spreads outside is formed in the center part of the frame 3 as it goes upwards, and let the internal peripheral surface of a through-hole be a light reflection surface.

  Such a light reflecting surface is smoothed on the inner peripheral surface by molding techniques such as cutting, mold forming, and extrusion molding, or a metal such as Al is deposited on the inner peripheral surface by vapor deposition or plating. Is formed. Then, the frame 3 is joined to the upper main surface of the base 2 by a brazing material such as solder, silver brazing, or a resin adhesive.

  As shown in FIGS. 8 to 10, the light-emitting element 4 of the present invention has a conductive path 18 formed on the upper surface of the substrate 2 by flip chip bonding via a conductive adhesive member 17 such as Au—Sn eutectic solder. It is mounted on the base 2 by being connected. Alternatively, it is attached to the upper surface of the substrate 2 with an inorganic adhesive such as solder, sol-gel glass or low-melting glass, or an organic adhesive such as epoxy resin, and the electrode of the light emitting element 4 is electrically connected to the conductive path 18 via a bonding wire. Connected.

  As shown in FIGS. 8 to 10, when the light emitting element 4 is flip-chip mounted on the conductive path 18, the first translucent portion 5 does not exist on the lower surface side of the light emitting element 4, and the first It is preferable that a third translucent part G made of silicone resin or the like has a refractive index smaller than that of the translucent part 5. Thereby, the light emitted from the light emitting element 4 is transmitted from the upper surface or the side surface of the light emitting element 4 having a small refractive index difference, rather than traveling from the lower surface of the light emitting element 4 having a large refractive index difference to the third translucent portion G. It progresses to the 1st translucent part 5, and it becomes easy to advance to the 3rd translucent part G. As a result, the light emitted from the light-emitting element 4 connects the electrode below the light-emitting element and the conductive path 18, and the conductive adhesive member 17 such as a brazing material containing Au such as an Au—Sn alloy. It is possible to effectively prevent the light emission efficiency from being absorbed by the light.

  Further, in FIG. 8, the first light transmissive portion 5 is provided on the upper surface of the light emitting element 4, and the second light transmissive portion is entirely covered above the first light transmissive portion. A translucent part is provided. Accordingly, the light emitted from the light emitting element 4 is allowed to travel well above the light emitting element 4 and is prevented from being absorbed by the conductive adhesive member 17, and the relationship of n3 <n1 and n3 <n2 is satisfied. Thus, light from the light emitting element 4 can be emitted more efficiently.

  9 and 10, the upper surface and the side surface of the light emitting element 4 are covered with the first translucent portion 5. Thereby, since the light emitted from the light emitting element 4 can be favorably advanced upward and to the side of the light emitting element 4, it is suppressed from being absorbed by the conductive adhesive member 17, and n3 <n1 and n3 < By considering the relationship of n2, the light from the light emitting element 4 can be emitted more efficiently.

  In addition, in FIGS. 8 to 10 described above, it is preferable that the third translucent portion G is a gas layer. That is, as compared with the case where a transparent material made of resin or the like is disposed as the third light-transmitting portion G below the light-emitting element 4, the first light-emitting element 4 formed below the light-emitting element 4 by heat generated from the light-emitting element 4. The light-transmitting portion G of the third light-transmitting portion G is not thermally expanded, so that the light-emitting element 4 can be prevented from being peeled off from the conductive path 18 due to the stress generated by the thermal expansion of the third light-transmitting portion G. Therefore, the light-emitting device can be operated normally.

  The second translucent part 7 is formed so as to cover the entire first translucent part 5, and the second translucent part 7 is formed by containing a phosphor in a transparent material. Is molded into a desired shape in advance, and then mounted on the first light-transmitting part 5 with a gap, or the third light-transmitting part G on the first light-transmitting part 5. A silicone resin or the like to be applied is applied to a desired thickness and thermally cured sequentially, and after the phosphor and the transparent material are kneaded, the second transparent material is used in a liquid wavelength conversion member precursor state using a dispenser. This is performed by a method of forming the optical part 7 and curing it in an oven.

  In addition, it is more preferable that the first light-transmitting portion 5 is formed by simply attaching the light-emitting element 4 to the light-emitting element 4 before bonding the light-emitting element 4 to the base 2. For example, a semiconductor for forming a light emitting layer such as n-type gallium nitride and p-type gallium nitride is epitaxially grown on a transparent substrate wafer such as sapphire, and then an electrode is formed to obtain a wafer of the light-emitting element 4. it can. Then, a liquid translucent member precursor to be the first translucent portion 5 is applied by a spin coater method or a spray method in a state where a sapphire wafer is attached to a support member such as an ultraviolet curable film. In addition, the first translucent portion 5 can be deposited on a large number of light emitting elements 4. Thereafter, the sapphire wafer is cut into individual pieces with a dicer and placed on the substrate 2, whereby the light emitting element 4 having the first translucent portion 5 formed on the upper surface can be obtained easily and at low cost with good reproducibility.

  Alternatively, the first light-transmitting portion 5 can be easily provided in each light-emitting element 4 in a state where the wafer of the light-emitting element 4 is cut and separated into individual light-emitting elements 4 at intervals. The upper surface or the upper surface and the side surface of the light emitting element 4 can be surrounded by the first light-transmitting portion 5 with good reproducibility at low cost.

  As described above, the first light-transmitting portion 5 is attached to the light-emitting element 4 before the light-emitting element 4 is bonded to the base 2, so that each light-emitting element 4 is mounted on the light-emitting element storage package. As in the case where the first light-transmitting portion 5 is formed later, the thickness of the first light-transmitting portion 5 does not become a desired one but becomes a defective product. It is possible to prevent the package from being wasted and to improve the manufacturing yield.

  Further, in the present embodiment, it is preferable that at least a part of the surface including the region on the light emitting element 4 has a curved surface, as shown in FIG. More preferably, the overall shape of the first translucent part 5 is hemispherical with the center of gravity of the light emitting part of the light emitting element 4 as the center. As a result, the angle formed between the traveling direction of the light emitted from the light emitting element 4 to the first translucent part 5 and the interface between the first translucent part 5 and the third translucent part G is 90 degrees. And the probability that light is reflected at this interface can be significantly reduced.

  Such a hemispherical first light-transmitting part 5 applies a liquid light-transmitting material precursor from the upper surface to the side surface of the light-emitting element 4 and uses surface tension acting on the corners of the light-emitting element 4. Thus, a hemispherical shape with the light emitting element 4 as the center can be easily obtained, and this can be cured to form the first translucent portion 5. The shape of the first translucent portion 5 is only required to make the rectangular parallelepiped shape of the light-emitting element 4 as close to a hemisphere as possible. The hemisphere referred to here is a distorted hemisphere as shown in FIG. Curved shapes are also included.

  Moreover, the light-emitting device 1 of this invention is installed so that one thing may become predetermined arrangement | positioning, and the light-emitting device 1 of this invention is used as a light source, or a plurality, for example, a grid | lattice form or zigzag The light emitting device 1 of the present invention is used as a light source. The light emitting device 1 is used as a light source. Therefore, the lighting device can be obtained. Thereby, since light emission by electron recombination of the light emitting element 4 made of a semiconductor is used, it is possible to achieve lower power consumption and longer life than a conventional lighting device using discharge, and generate less heat. It can be set as a small illuminating device. As a result, fluctuations in the center wavelength of the light generated from the light emitting element 4 can be suppressed, and light can be emitted with a stable radiant light intensity and radiant light angle (light distribution distribution) over a long period of time. It can be set as the illuminating device by which the color nonuniformity in the surface and the bias of illuminance distribution were suppressed.

(Sixth embodiment)
FIG. 11 is a cross-sectional view showing a sixth embodiment of the present invention. The light emitting device 1 includes a base 2, a frame 3, a light emitting element 4, a first light transmissive part 5, a second light transmissive part 7, a third light transmissive part G, and an elasticity. It consists of the member 14 etc., and comprises the light emitting element accommodation package as a whole.

  The frame body 3 is attached to the upper surface of the base 2 and has a reflection surface 3 a surrounding the light emitting element 4. A notch 3 b is formed between the outer peripheral surface and the lower surface of the frame 3.

  The elastic member 14 is a ring-shaped member having an inverted L-shaped cross section. The upper portion of the elastic member 14 is embedded in the cutout portion 3 b, and the lower portion of the elastic member 14 is disposed on the side of the base 2. The

  The first light transmissive portion 5 is made of a light transmissive material and covers the light emitting element 4.

  The second translucent portion 7 is formed of a translucent material containing a phosphor that converts the wavelength of light emitted from the light emitting element 4, and the first translucent portion 5 is disposed above the first translucent portion 5. It is provided so as to cover the translucent part 5.

  The third translucent part G is provided between the first translucent part 5 and the second translucent part 7.

  In the present embodiment, when the refractive index of the first light transmitting portion 5 is n1, the refractive index of the second light transmitting portion 7 is n2, and the refractive index of the third light transmitting portion G is n3, The material of the 1st translucent part 5, the 2nd translucent part 7, and the 3rd translucent part G is selected so that the relationship of n3 <n1 and n3 <n2 may be satisfy | filled. Specific materials listed in the above embodiment can be used, and by appropriately combining these materials, the relationship of n3 <n1 and n3 <n2 can be satisfied. Satisfying such a relationship improves the light utilization efficiency as described above.

  The base 2 functions as a support member for supporting and mounting the light emitting element 4 and a heat dissipation member for dissipating the heat of the light emitting element 4. The light emitting element 4 is attached to the upper surface of the base 2 via a resin adhesive, tin (Sn) -lead (Pb) solder, a low melting point brazing material such as Au-Sn, or the like. And the heat | fever of the light emitting element 4 is maintained to the favorable operation | movement of the light emitting element 4 by being transmitted to the base | substrate 2 via a resin adhesive and a low melting-point brazing material, and being efficiently dissipated outside. Further, the light emitted from the light emitting element 4 is reflected by the reflecting surface 3a and emitted to the outside.

  The substrate 2 is made of ceramics such as an aluminum oxide sintered body (alumina ceramics), an aluminum nitride sintered body, and glass ceramics. Further, a wiring conductor led out from the vicinity of the upper surface of the base 2 on which the light emitting element 4 is mounted to the outside of the light emitting element storage package is formed.

  The wiring conductor formed on the substrate 2 is formed of, for example, a metallized layer such as W, Mo, Mn, or Cu. For example, a metal paste obtained by adding and mixing an organic solvent or solvent to a powder such as W. Is formed on the substrate 2 by printing, coating and baking in a predetermined pattern. In order to prevent oxidation and to firmly connect a bonding wire (not shown) on the surface of the wiring conductor, a Ni layer having a thickness of 0.5 to 9 μm, an Au layer having a thickness of 0.5 to 5 μm, etc. It is preferable to deposit the metal layer by plating.

  The frame 3 is formed on the upper surface of the base 2 so as to surround the light emitting element 4, and a notch 3 b is formed between the lower surface of the frame 3 and the outer peripheral surface. The frame 3 is made of metal such as Al, stainless steel (SUS), Ag, iron (Fe) -Ni-cobalt (Co) alloy, Fe-Ni alloy, resin, ceramics, etc., and the frame 3 is made of metal. In this case, the inner peripheral surface can be made a mirror surface by a method such as polishing, so that the inner peripheral surface can be a reflecting surface 3a that can favorably reflect visible light emitted from the light emitting element 4.

  Further, when the frame 3 is made of resin or ceramics, visible light emitted from the light emitting element 4 can be favorably reflected on the inner peripheral surface by forming a metal layer on the inner peripheral surface by plating or vapor deposition. It can be set as the reflective surface 3a. From the viewpoint that the reflecting surface 3a having high reflection efficiency of visible light from the light emitting element 4 can be more easily manufactured and that corrosion due to oxidation or the like can be prevented, the frame 3 is made of Al or SUS. Preferably it consists of.

  In addition, when such a frame 3 is made of metal, the frame 3 is formed in the above-described predetermined shape by applying conventionally known metal processing such as cutting, rolling, and punching to the ingot of the material.

  The elastic member 14 of the present invention is made of a material whose longitudinal elastic modulus is smaller than that of the frame 3. Preferably, the longitudinal elastic modulus of the elastic member 14 is not more than 1/5 times the longitudinal elastic modulus of the frame 3. By having a longitudinal elastic modulus smaller than that of the frame 3, heat generated during operation of the light emitting element 4, temperature change of the external environment, and the like are repeatedly applied to the base 2 and the frame 3. Even if it expands or contracts, the stress caused by the strain can be effectively relaxed by the elastic member 14, and the influence on the frame 3 can be greatly reduced.

  The elastic member 14 has an upper portion embedded in the cutout portion 3b of the frame 3, and a lower portion disposed on the side of the base 2 to be attached to the frame 3. For example, an epoxy resin or a liquid crystal It is made of a highly heat-resistant thermosetting resin such as a polymer (LCP) or a thermoplastic resin, and the elastic modulus of the elastic member 14 is preferably 10 [MPa] to 20 [MPa]. This is because the elastic member 14 becomes a buffer material by having the value of the longitudinal elastic modulus as described above, and heat generated when the light emitting element 4 is operated, temperature change of the external environment, and the like are repeatedly applied to the base 2. However, since generation of a large thermal stress is suppressed, it is possible to effectively prevent cracks in the base 2 and separation of the base 2 and the frame 3.

  As a result, it is possible to suppress an electrical connection failure such as disconnection in the wiring conductor and the like, and the pattern of the light beam (light beam) emitted from the light emitting element 4 and reflected by the frame 3 becomes constant, and light emission The light intensity distribution represented by a single light beam or an aggregate thereof having a stable angle can be set to a desired value and pattern.

  When the longitudinal elastic modulus of the elastic member 14 is greater than 70 [MPa], it is difficult to relieve stress generated in the base 2 and the frame 3 when the light emitting element 4 generates heat. Moreover, when the longitudinal elastic modulus of the elastic member 14 is a value smaller than 5 [MPa], the effect of the elastic member 14 supporting the frame 3 is reduced, and the frame 3 cannot be stably fixed on the base 2. Tend. Therefore, the longitudinal elastic modulus of the elastic member 14 is preferably 5 [MPa] to 70 [MPa], and more preferably 10 [MPa] to 20 [MPa].

  Further, as shown in FIG. 11, when the elastic member 14 is bonded to the upper surface of the base 2 and the elastic member 14 having a thermal conductivity lower than that of the frame 3 is used, the heat conduction from the base 2 to the frame 3 is It can be suppressed by an elastic member having a low thermal conductivity, and the frame 3 is particularly preferably prevented from being distorted by heat. Even if the base 2 is distorted by the heat of the light emitting element 4, the stress caused by the strain is relaxed by the elastic member 14 bonded to the base 2 and the frame 3, and the influence on the frame 3 is greatly reduced. can do. Therefore, there is no unevenness in the intensity distribution of light emitted from the light emitting element storage package and the illuminance distribution on the irradiated surface, and stable light is output, and the light emitting device can be operated with high reliability and stability over a long period of time. Can do.

  When the light emitting element storage package is connected to the external connection substrate, an external connection terminal is provided on the lower surface of the base 2 so that one end portion protrudes outward from the base 2 in plan view, or the base is connected. In many cases, a conductive bonding material is provided directly on the connection pad formed on the lower surface of the connector 2. Among these, for example, as shown in FIG. 13, when an L-shaped lead terminal 21 is provided as an external connection terminal on the lower surface of the base 2 and the elastic member 14, the stress generated when the light emitting element 4 generates heat. Even if the L-shaped lead terminal 21 tries to collide with the base 2, the L-shaped lead terminal 21 comes into contact with the elastic member 14 formed on the side of the base 2 to prevent contact with the base 2. Even if it collides, the stress is buffered by the elastic member 14, so that the occurrence of chipping, cracking, cracking, etc. of the base 2 due to contact between the L-shaped lead terminal 21 and the base 2 can be effectively prevented. It is. As a result, the light emitting element 4 can be accommodated in an airtight manner, and the light emitting element 4 can be operated normally and stably over a long period of time.

  Further, when the L-shaped lead terminal 21 is provided on the lower surface of the base 2 in this way, the joint portion of the lead terminal 21 is positioned above the center of the base 2 as shown in FIG. It is preferable to provide a step portion on the L-shaped lead terminal 21 and connect the L-shaped lead terminal 21 to the step portion. By providing the L-shaped lead terminal 21 at the stepped portion, a short circuit between the external connection substrate and the L-shaped lead terminal 21 can be suppressed.

  Further, when the conductive bonding material is provided directly on the connection pad formed on the lower surface of the base 2 to attach the light emitting element storage package and the external connection substrate, even when the conductive bonding material is melted, the external connection substrate Even if the conductive bonding material protrudes from between the light emitting element storage package and travels up through the base 2, the elastic member 14 is present in the portion of the frame body 3 in the present invention. 3 and the conductive bonding material are difficult to contact. Therefore, even if the frame 3 is made of metal or the like, the frame 3 and the conductive bonding material are not easily in contact with each other, so that an electrical short circuit can be effectively prevented.

  When the base 2 is made of ceramics, the lower portion of the elastic member 14 is disposed on the side of the base 2 and attached to the frame 3, so that the lower portion of the elastic member 14 on the side causes the ceramic base to be attached. The light leaking to the outside from the side surface of 2 is prevented from traveling and can be prevented from leaking to the outside. As a result, even when the light-emitting device of the present invention is used as a display device, light is not blurred and good visibility can be obtained.

  In addition, a gap is preferably provided between the lower portion of the elastic member 14 and the side of the base 2, and heat generated from the light emitting element 4 is transmitted to the base 2, and from the gap between the base 2 and the elastic member 14, It is good because the heat can be dissipated. Moreover, it can be said that it is more preferable because the heat dissipation increases, so that the deterioration of the light emitting element 4 can be prevented and the deformation of the light emitting element storage package due to heat can be effectively prevented.

  More preferably, the cutout portion 3 b of the frame body 3 is annularly provided along the outer peripheral surface of the frame body 3. As a result, an outside air layer having a larger capacity than that before the notch 3b is annularly formed exists between the base 2 and the frame 3, and heat generated during the operation of the light emitting element 4 is generated by the base 2 Can be effectively prevented from being transmitted to the frame 3. As a result, the bending moment transmitted from the frame 3 to the base 2 can be suppressed, and cracks and cracks can be effectively prevented from occurring in the base 2.

  Furthermore, the volume of the frame body 3 can be reduced, the area where the base body 2 and the frame body 3 are in contact with each other can be reduced, and the base body 2 and the frame body can be formed by heat generated from the light emitting element 4 when the light emitting device is operated. 3 is restrained from being concentrated at the joint portion. As a result, it is possible to further suppress cracks and peeling at the base 2 and the joint between the base 2 and the frame 3.

  Further, when the elastic member 14 is annularly provided along the outer peripheral surface of the frame 3, an external connection terminal is provided on the lower surface of the base body 2 so that one end portion protrudes outward from the base body 2 in a plan view. When the storage package is bonded to the external connection substrate, the stress caused by the elastic member 14 hitting the base 2 is no matter what position the external connection terminal is displaced due to the stress generated when the light emitting element 4 generates heat. Since it is buffered by the elastic member 14 formed in an annular shape, it is more preferable. As a result, it is possible to more effectively prevent the occurrence of chips, cracks, cracks, and the like generated on the base 2 and the outer peripheral portion of the base 2, and the light-emitting element 4 is accommodated in an airtight manner so that the light-emitting element 4 is normal and stable over a long period. Can be operated.

  Moreover, it is preferable that the frame 3 has only the upper surface of the notch 3b joined to the elastic member 14. Thereby, the frame 3 is easily deformed moderately, and the restraint by the elastic member 14 can be released moderately. As a result, even if the elastic member 14 and the base body 2 are distorted, the distortion of the frame 3 due to the distortion can be effectively suppressed. Further, it is preferable to form a gap between a portion located on the inner side of the elastic member 14 on the lower surface of the frame 3 and the upper surface of the base 2. This is preferable because heat can be hardly transmitted from the base 2 to the reflecting surface 3a.

  The reflecting surface 3 a is preferably inclined at an angle of 35 to 70 degrees with respect to the upper surface of the base 2. Thereby, the light of the light emitting element 4 mounted on the upper surface of the substrate 2 can be favorably reflected by the inclined reflecting surface 3a, and the light can be radiated to the outside within the range of the radiation angle within 45 degrees. The light emission efficiency, brightness, and luminous intensity of the light emitting device using the light emitting element storage package can be made extremely high. The light emission angle is an angle of light spread on a plane orthogonal to the base 2 passing through the center of the light emitting element 4, and if the opening shape in the cross section of the frame 3 is circular. The radiation angle is constant over the entire circumference of the reflecting surface 3a. Moreover, when the opening shape in the cross section of the frame 3 is biased such as an elliptical shape, the radiation angle is the maximum value.

  In addition, when the angle between the reflecting surface 3a and the upper surface of the base 2 is less than 35 degrees, the radiation angle spreads beyond 45 degrees, the amount of dispersed light increases, and the luminance and luminous intensity of the light tend to decrease. . On the other hand, when the angle exceeds 70 degrees, the light from the light-emitting element 4 is not emitted well outside the light-emitting element storage package and is easily diffusely reflected in the light-emitting element storage package.

  In addition, when the shape of the reflective surface 3a is an inverted conical shape, it is preferable that the angle formed by the reflective surface 3a and the upper surface of the substrate 2 is 35 to 70 degrees over the entire circumference. Moreover, when the shape of the reflective surface 3a is a quadrangular pyramid, it is preferable that at least a pair of opposed inner surfaces be inclined with respect to the upper surface of the substrate 2 by 35 to 70 degrees. Since the entire inner surface is inclined at 35 to 70 degrees with respect to the upper surface of the substrate 2, the luminous efficiency can be made extremely high.

  Moreover, it is preferable that arithmetic mean roughness Ra of the reflective surface 3a shall be 0.004-4 micrometers. That is, when the arithmetic average roughness Ra of the reflecting surface 3a exceeds 4 μm, it becomes difficult to regularly reflect the light of the light emitting element 4 accommodated in the light emitting element accommodation package and to emit it above the light emitting element accommodation package. Light intensity is easily attenuated or biased. In addition, when the arithmetic average roughness Ra of the reflecting surface 3a is less than 0.004 μm, it is difficult to form such a surface stably and efficiently, and the product cost tends to increase. In addition, in order to make Ra of the reflective surface 3a into said range, it can form by a conventionally well-known electrolytic polishing process, a chemical polishing process, or a cutting process. Further, a method of forming by transfer processing using the surface accuracy of the mold may be used.

  Further, the bonding between the frame 3 and the elastic member 14 and the bonding between the frame 3 and the base 2 are performed by using a resin adhesive such as silicone or epoxy, a metal brazing material such as Ag-Cu brazing, or Pb-Au-. This is performed by using solder such as Sn-Au-Sn-silicon (Si) and Sn-Ag-Cu. Such a bonding material such as an adhesive or solder may be appropriately selected in consideration of the material, thermal expansion coefficient, and the like of the base 2, the elastic member 14, and the frame 3, and is not particularly limited. In addition, when high reliability of bonding between the base body 2 and the elastic member 14 and between the elastic member 14 and the frame body 3 is required, it is preferable to bond them with a metal brazing material or solder.

  Further, when importance is attached to the characteristics of the light emitting device, it is preferable to join by a caulking method in order to prevent the frame 3 and the elastic member 14 from being displaced by the joining material. In the caulking method, the positioning of the frame 3 is uniquely performed, the positional deviation and inclination of the frame 3 in the manufacturing process of the light emitting element storage package can be suppressed, and the central axis of the elastic member 14 and the frame 3 is set. Can be joined with high accuracy. As a result, the optical axis of the light emitting element 4 and the central axis of the frame 3 that reflects light can be matched with high accuracy in the manufacturing process of the light emitting element storage package. Accordingly, it is possible to manufacture a light emitting device that can obtain a desired light intensity distribution, illuminance distribution, and emission color.

  Further, the relational expression of the thermal expansion coefficient between the elastic member 14 and the frame 3 may be α1 <α2 when the thermal expansion coefficient of the elastic member 14 is α1 and the thermal expansion coefficient of the frame 3 is α2. Good. Thereby, the thermal expansion coefficient difference between the frame 3 and the base 2 is relaxed by the elastic member 14, and it is possible to effectively suppress the stress due to the thermal expansion difference from being generated in the base 2, the frame 3, and the elastic member 14. it can. Therefore, it is possible to relieve stress caused by thermal expansion and heat absorption when the light emitting element storage package is manufactured and the light emitting device is operated, and it is possible to suppress inclination and deformation of the frame 3.

  Thus, in the light emitting element storage package of the present invention, the light emitting element 4 is mounted on the upper surface of the substrate 2, and the light emitting element 4 is connected to the external electric power outside the light emitting element storage package via the bonding wires and wiring conductors such as Au and Al. The circuit can be electrically conducted. Then, a transparent material such as a transparent resin is filled inside the frame body 3 and cured to cover the side surface or the upper surface of the light emitting element 4 or the entire light emitting element 4. Form. And the 2nd translucent part 7 is formed in the 1st translucent part 5 with a clearance gap, and a translucent cover body (not shown) is soldered to the upper surface of the frame 3 as needed. The light emitting device of the present invention is obtained by bonding with a resin adhesive or the like. Or after forming the 1st translucent part 5, the 3rd translucent part G which consists of silicone resin etc. is formed, and it covers the 1st translucent part 5 whole on it The second light-transmitting portion 7 is formed, and if necessary, a light-transmitting lid is joined to the upper surface of the frame 3 with solder, resin adhesive, or the like, so that the light of the light-emitting element 4 is emitted from the phosphor. Thus, the light emitting device can convert the wavelength and extract light having a desired wavelength spectrum.

  In addition, the light emitting device of the present invention is provided by arranging one light source as a predetermined light source, or a plurality of light emitting devices, for example, a lattice shape, a staggered shape, a radial shape, or a plurality of light emitting devices. A lighting device can be obtained by installing the light emitting device groups in a circular shape or a polygonal shape so as to have a predetermined arrangement such as a plurality of concentric groups. Thereby, intensity unevenness can be suppressed as compared with the conventional lighting device.

  In addition, the light emitting device of the present invention is installed in a predetermined arrangement as a light source, and by installing a reflection jig, an optical lens, a light diffusing plate, etc. optically designed in an arbitrary shape around these light emitting devices, It can be set as the illuminating device which can radiate | emit the light of this light distribution.

  It should be noted that the present invention is not limited to the above-described embodiment, and various modifications are possible without departing from the scope of the present invention. For example, light is extracted at a desired radiation angle by joining an optical lens that arbitrarily collects and diffuses light emitted from the light emitting device or a flat light-transmitting lid with solder or a resin bonding agent. Long term reliability can be improved. Further, in order to suppress light loss due to the bonding wire, a light emitting device in which metallized wiring is formed on the substrate 1 and the light emitting element 3 is electrically connected to the metallized wiring via solder may be used.

  The light emitting device 1 according to each embodiment described above is installed in a predetermined arrangement as a light source, and a reflecting jig, an optical lens, a light diffusing plate, and the like optically designed in an arbitrary shape are installed around the light emitting device 1. By doing so, it can be set as the illuminating device which can radiate | emit light of arbitrary light distribution.

  For example, as shown in the plan view shown in FIG. 14 and the cross-sectional view shown in FIG. 15, a plurality of light emitting devices 1 are arranged in a plurality of rows on the light emitting device driving circuit board 10, and are optically formed in an arbitrary shape around the light emitting device 1. In the case of an illuminating device in which the designed reflecting jig 9 is installed, in a plurality of light emitting devices 1 arranged on one adjacent row, an arrangement in which the interval between adjacent light emitting devices 1 is not shortest, so-called. A staggered pattern is preferred.

  That is, when the light-emitting devices 1 are arranged in a grid, the light-emitting devices 1 serving as light sources are arranged on a straight line, so that glare is strong, and such a lighting device enters human vision. Thus, discomfort is likely to occur, but the staggered pattern suppresses glare and can also reduce discomfort for human eyes.

  Furthermore, since the distance between the adjacent light emitting devices 1 is increased, thermal interference between the adjacent light emitting devices 1 is effectively suppressed, and heat in the light emitting device driving circuit board 10 on which the light emitting device 1 is mounted is reduced. Clouding is suppressed and heat is efficiently dissipated outside the light emitting device 1. As a result, it is possible to manufacture a long-life lighting device with stable optical characteristics over a long period of time without causing discomfort to human eyes.

  In addition, as shown in the plan view of FIG. 16 and the cross-sectional view of FIG. 17, the lighting device includes a group of circular or polygonal light emitting devices 1 including a plurality of light emitting devices 1 on the light emitting device driving circuit board 10. In the case of a lighting device in which a plurality of groups are concentrically formed, it is preferable that the number of light emitting devices 1 in one circular or polygonal light emitting device group 1 is increased from the center side of the lighting device to the outer peripheral side. Thereby, more light-emitting devices 1 can be arranged while keeping the interval between the light-emitting devices 1 moderately, and the illuminance of the illumination device can be further improved.

  Moreover, the density of the light-emitting device 1 in the central part of the lighting device can be lowered to suppress heat accumulation in the central part of the light-emitting device driving circuit board 10. Therefore, the temperature distribution in the light emitting device driving circuit board 10 becomes uniform, heat is efficiently transmitted to the external electric circuit board and the heat sink on which the lighting device is installed, and the temperature rise of the light emitting device 1 can be suppressed. As a result, the light emitting device 1 can operate stably over a long period of time, and a long-life lighting device can be manufactured.

  Examples of such lighting devices include general lighting fixtures, chandelier lighting fixtures, residential lighting fixtures, office lighting fixtures, store lighting, display lighting fixtures, street lighting fixtures, used indoors and outdoors. Guide light fixtures and signaling devices, stage and studio lighting fixtures, advertising lights, lighting poles, underwater lighting lights, strobe lights, spotlights, security lights embedded in power poles, emergency lighting fixtures, flashlights, Examples include electronic bulletin boards and the like, backlights for dimmers, automatic flashers, displays and the like, moving image devices, ornaments, illuminated switches, optical sensors, medical lights, in-vehicle lights, and the like.

  It should be noted that the present invention is not limited to the above-described embodiments and examples, and various modifications can be made without departing from the scope of the present invention.

  ADVANTAGE OF THE INVENTION According to this invention, the light-emitting device which has high light extraction efficiency, radiated light intensity, on-axis luminous intensity, and a brightness | luminance can be provided, and it is very useful industrially.

It is sectional drawing which shows 1st Embodiment of this invention. It is sectional drawing which shows 1st Embodiment of this invention. It is sectional drawing which shows 2nd Embodiment of this invention. It is sectional drawing which shows 3rd Embodiment of this invention. It is sectional drawing which shows 3rd Embodiment of this invention. It is sectional drawing which shows 4th Embodiment of this invention. It is sectional drawing which shows the example whose 1st translucent part is hemispherical. It is sectional drawing which shows the example which mounted the lens-shaped cover body. It is sectional drawing which shows the example whose 3rd translucent part is thin. It is sectional drawing which shows 5th Embodiment of this invention. It is sectional drawing which shows the example whose translucent member is hemispherical. It is sectional drawing which shows the example whose translucent member is a curved surface shape. It is sectional drawing which shows 6th Embodiment of this invention. It is the fracture | rupture perspective view which abbreviate | omitted each translucent part of the light-emitting device shown in FIG. It is sectional drawing which shows the example which provided the L-shaped lead terminal in the base | substrate lower surface. It is a top view which shows an example of the illuminating device which arranged the light-emitting device based on this invention in the array form. It is sectional drawing of the illuminating device shown in FIG. It is a top view which shows the other example of the illuminating device which arranged the light-emitting device based on this invention in circular shape. It is sectional drawing of the illuminating device shown in FIG. It is sectional drawing which shows an example of the conventional light-emitting device.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Light-emitting device 2 Base | substrate 3 Frame 3a Reflecting surface 3b Notch part 4 Light emitting element 5 1st translucent part 6 4th translucent part 7 2nd translucent part G 3rd translucent part DESCRIPTION OF SYMBOLS 9 Reflecting jig 10 Light-emitting device drive circuit board 14 Elastic member 17 Conductive adhesive member 18 Conductive path 21 Lead terminal

Claims (5)

A substrate;
A light emitting device mounted on the substrate;
A reflective surface disposed on the substrate and surrounding the light emitting element;
A first translucent portion provided on the inner side of the reflective surface so as to cover the light emitting element and having a concave upper surface;
A second translucent part that is provided on the first translucent part and converts the wavelength of the light emitted from the light emitting element;
A light emitting device comprising: a third light transmissive portion provided between the first light transmissive portion and the second light transmissive portion.   When the refractive index of the first light transmitting part is n1, the refractive index of the second light transmitting part is n2, and the refractive index of the third light transmitting part is n3, n3 <n1 and n3 <n2 The light emitting device according to claim 1, satisfying the relationship:   The light emitting device according to claim 1, wherein the third light transmissive portion is a gas layer.   The said 3rd translucent part consists of a silicone resin and the fluorescent substance which is contained in this silicone resin and converts the wavelength of the light radiated | emitted from the said light emitting element. The light emitting device described. The light emitting device according to claim 4, wherein the light emitting element is a light emitting diode having a light emission peak wavelength in a near ultraviolet region or an ultraviolet region, and the phosphor is composed of a red phosphor, a green phosphor and a blue phosphor.

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