JP2003110146A - Light-emitting device - Google Patents

Light-emitting device

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Publication number
JP2003110146A
JP2003110146A JP2002218989A JP2002218989A JP2003110146A JP 2003110146 A JP2003110146 A JP 2003110146A JP 2002218989 A JP2002218989 A JP 2002218989A JP 2002218989 A JP2002218989 A JP 2002218989A JP 2003110146 A JP2003110146 A JP 2003110146A
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JP
Japan
Prior art keywords
light
light emitting
emitting element
member
emitting device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002218989A
Other languages
Japanese (ja)
Inventor
Takuma Hashimoto
Hideyoshi Kimura
Tadashi Murakami
Koji Nishioka
Eiji Shiohama
Masaru Sugimoto
Masao Yamaguchi
Ryoji Yokoya
英二 塩濱
昌男 山口
秀吉 木村
勝 杉本
忠史 村上
良二 横谷
拓磨 橋本
浩二 西岡
Original Assignee
Matsushita Electric Works Ltd
松下電工株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2001226699 priority Critical
Priority to JP2001-226699 priority
Application filed by Matsushita Electric Works Ltd, 松下電工株式会社 filed Critical Matsushita Electric Works Ltd
Priority to JP2002218989A priority patent/JP2003110146A/en
Publication of JP2003110146A publication Critical patent/JP2003110146A/en
Priority claimed from TW92114454A external-priority patent/TWI291769B/en
Application status is Pending legal-status Critical

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Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/507Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161Disposition
    • H01L2224/16151Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52Encapsulations
    • H01L33/54Encapsulations having a particular shape
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58Optical field-shaping elements

Abstract

PROBLEM TO BE SOLVED: To provide a light-emitting device whose life as a commercial product can be extended by forming fluorescent materials which rapidly deteriorate and a resin containing the fluorescent materials into an exchangeable structure.
SOLUTION: The light-emitting device is provided with light-emitting elements 2 placed on a mount board 1 and fluorescent members 3 which are excited by the light emitted by the light-emitting elements 2 and emit light with a wavelength different from the excitation wavelength. The fluorescent members 3 are exchangeable.
COPYRIGHT: (C)2003,JPO

Description

【発明の詳細な説明】 【0001】 【発明の属する技術分野】本発明は、発光素子を利用した発光装置に関するものである。 BACKGROUND OF THE INVENTION [0001] [Technical Field of the Invention The present invention relates to a light emitting device using a light-emitting element. 【0002】 【従来の技術】近年、窒化ガリウム系化合物半導体によって、青色光あるいは紫外線を放射するLEDチップが開発された。 [0002] In recent years, the gallium nitride-based compound semiconductor, LED chips emitting blue light or ultraviolet rays has been developed. そして、このLEDチップを種々の蛍光体と組み合わせることにより、白色を含め、LEDチップの発光色とは異なる色合いの光を出すことができるLE By combining this LED chips with various phosphors, including white, it is possible to emit light of a different hue than the emission color of the LED chip LE
D発光装置の開発が試みられている。 Development of D-emitting devices has been attempted. このLED発光装置には、小型、軽量、省電力といった長所があり、現在、表示用光源、小型電球の代替光源、あるいは液晶パネル用光源等として広く用いられている。 The LED light emitting device, small size, light weight, has advantages such as power saving, currently, display light source, a small light bulb alternative light source or widely used as a liquid crystal panel for a light source or the like. 【0003】この種の公知例としては、特開2000− [0003] As known examples of this type, JP 2000-
208815号公報、特開2002−158378号公報、特開平5−152609号公報、特開2001−1 208815, JP 2002-158378, JP-A No. 5-152609, JP-2001-1
48512号公報、特開2001−57445号公報、 48512, JP-2001-57445, JP-
特開平11−261114号公報、特開2001−14 JP-11-261114, JP-2001-14
8509号公報等に記載されているものを挙げることができる。 It may be mentioned those described in 8509 JP like. これらの公知例におけるLED発光装置では、 In LED light-emitting device in these known examples,
蛍光体あるいは蛍光体を含有した樹脂がLEDチップの周囲に設置され、少なくともその一部分はLEDチップに接触する構成となっている。 Resin containing phosphors or phosphor is disposed around the LED chip, at least a portion thereof has a structure in contact with the LED chip. 【0004】 【発明が解決しようとする課題】しかしながら、上記のLED発光装置においては、蛍光体あるいは蛍光体を含有した樹脂の劣化が最も早く、LED発光装置の寿命は、LEDチップそのものではなく、蛍光体や蛍光体を含む樹脂の寿命で決まってしまうという問題点があった。 [0004] The present invention is, however, in the above LED light-emitting device, degradation of the resin containing a phosphor or phosphor earliest life of LED light emitting device, rather than the LED chip itself, there is a problem in that determined by the life of the resin containing a phosphor or phosphor. 【0005】さらに、上記公報に記載のLED発光装置のようなフェースアップ実装においては、導電性ワイヤー(ボンディングワイヤー)が影になり、発光素子からの光を効率よく利用することができないという問題があった。 [0005] Further, in the face-up mounting, such as an LED light emitting device according to the above publication, will be a conductive wire (bonding wire) shadow, making it impossible to efficiently utilize the light from the light emitting element there were. 【0006】また、例えば特開2000−101148 [0006] Also, for example, JP 2000-101148
号公報等に開示されているように、図43に示すような蛍光体あるいは蛍光体を含有した樹脂を自由に着脱できるようにした構造のものが従来例としてある。 No. or the like as disclosed in Japanese, there Examples conventional ones having a structure to freely attach and detach the resin containing the phosphor or phosphor, as shown in FIG. 43. すなわち、上記公報に記載の発光ダイオードは、発光素子2 That is, the light-emitting diode according to the publication, the light emitting element 2
と、取付け部材38と、透明又は半透明合成樹脂製のモールド部39と、蛍光物質を含有させたキャップ40等を備えたものであり、キャップ40を図43(a) When a mounting member 38, the mold portion 39 made of transparent or semi-transparent synthetic resin, which includes a cap 40 or the like which contains a fluorescent substance, 43 a cap 40 (a)
(b)のように自由に着脱できるようにしている。 It is free to detachably as shown in (b). しかし、この場合にはモールド部39での配光制御ができないため効率よく照射することができないという問題点があった。 However, in this case, there is a problem that can not be efficiently irradiated because it can not light distribution control at the mold portion 39. 【0007】本発明は上記の点に鑑みてなされたものであり、劣化の早い蛍光体や蛍光体を含む樹脂を交換可能な構造とすることによって、商品としての寿命を延ばすことができる発光装置を提供することを目的とするものである。 [0007] The present invention has been made in view of the above, by making the resin replaceable structure including fast phosphor or phosphor deterioration, a light emitting device can extend the life of the product it is an object to provide a. 【0008】さらに、蛍光体や蛍光体を含む樹脂の寿命を延ばしつつ、配光制御が可能である発光装置を提供することをも目的とするものである。 Furthermore, while extending the life of the resin containing a phosphor or phosphor, it is an object of the invention is to provide a light emitting device capable of light distribution control. 【0009】 【課題を解決するための手段】本発明の請求項1に係る発光装置は、実装基板1に発光素子2を載置し、この発光素子2の発光によって励起されると共に励起波長と異なる波長の光を放射する蛍光部材3を備えて形成される発光装置において、蛍光部材3を交換可能にして成ることを特徴とするものである。 [0009] The light emitting device according to claim 1 of the present invention According to an aspect of the mounted light emitting element 2 to the mounting substrate 1, and the excitation wavelength while being excited by light emission of the light emitting element 2 in the light-emitting device is formed with a fluorescent member 3 which emit light of different wavelengths, and is characterized in that formed by the replaceable fluorescent member 3. 【0010】また請求項2の発明は、請求項1において、発光素子2を載置した実装基板1に、表面又は内部に蛍光部材3を含んで形成される光学部材4を着脱自在に装着して成ることを特徴とするものである。 [0010] A second aspect of the present invention, in claim 1, the light emitting element 2 mounted board 1 mounted with the, mounting the optical member 4 which is formed to include a fluorescent member 3 surface or inside removably be comprised Te is characterized in. 【0011】また請求項3の発明は、請求項1又は2において、フェースダウン実装によって実装基板1に発光素子2を載置すると共に、発光素子2に光学部材4を対向配置させて成ることを特徴とするものである。 [0011] A third aspect of the present invention, in claim 1 or 2, with mounting the light emitting element 2 to the mounting substrate 1 by face-down mounting, that formed by the optical member 4 is disposed to face the light emitting element 2 it is an feature. 【0012】また請求項4の発明は、請求項2又は3において、光学部材4内において蛍光部材3を発光素子2 [0012] The invention according to claim 4, in claim 2 or 3, emitting a fluorescent member 3 in the optical member 4 element 2
に最も近い位置に配置して成ることを特徴とするものである。 It is characterized in that formed by position nearest to. 【0013】また請求項5の発明は、請求項2乃至4のいずれかにおいて、光学部材4の形状が凸レンズ形状であることを特徴とするものである。 [0013] A fifth aspect of the present invention, in any one of claims 2 to 4, is characterized in that the shape of the optical member 4 is a convex lens shape. 【0014】また請求項6の発明は、請求項2乃至5のいずれかにおいて、蛍光部材3によって波長が変換されて放射された光のうち、光学部材4の光取出し面19に向かう方向と異なる方向に放射された光を、光取出し面19に向かう方向に全反射させる形状となるように光学部材4を形成して成ることを特徴とするものである。 [0014] According to a sixth aspect of the invention, in any one of claims 2 to 5, of the light wavelength emitted are converted by the fluorescent member 3, different from the direction toward the light extraction surface 19 of the optical member 4 the light emitted in the direction, and is characterized in that obtained by forming an optical member 4 so that the shape to be totally reflected toward the light extraction surface 19. 【0015】また請求項7の発明は、請求項2乃至6のいずれかにおいて、光学部材4の発光素子2側の面に反射部23を設けると共に、発光素子2からの光を取り入れるための開口部24を反射部23に設けて成ることを特徴とするものである。 [0015] According to a seventh aspect of the invention, in any one of claims 2 to 6, the reflecting portion 23 is provided on the surface of the light emitting element 2 side of the optical member 4, an opening for taking light from the light emitting element 2 the part 24 is characterized in that comprising providing the reflective portion 23. 【0016】また請求項8の発明は、請求項2乃至7のいずれかにおいて、光学部材4が光学部材4よりも低い屈折率を有する低屈折部材25を備えると共に、蛍光部材3を通過した光又は蛍光部材3により波長が変換された光が低屈折部材25を介して光学部材4へ入射されるように低屈折部材25を配置して成ることを特徴とするものである。 [0016] eighth aspect, in any one of claims 2 to 7, the light optical member 4 is provided with a low refractive member 25 having a lower refractive index than the optical member 4, it passes through the fluorescent member 3 or in which the light wavelength by the fluorescent member 3 is converted is equal to or formed by disposing the low refractive member 25 as incident on the optical member 4 via a low refractive member 25. 【0017】また請求項9の発明は、請求項1乃至8のいずれかにおいて、発光素子2からの光が蛍光部材3中を略等しい光路長にて通過するように蛍光部材3を形成して成ることを特徴とするものである。 [0017] According to a ninth aspect of the invention, in any one of claims 1 to 8, light from the light emitting element 2 to form a fluorescent member 3 so as to pass in a substantially equal optical path lengths fluorescent member 3 Medium it is characterized in that the made. 【0018】また請求項10の発明は、請求項9において、蛍光部材3の光取出し面19側の面と蛍光部材3の発光素子2側の面のうち少なくとも一方を曲面に形成して成ることを特徴とするものである。 [0018] According to a tenth aspect of the invention, in claim 9, it comprising at least one of a surface of the light emitting element 2 side of the light extraction surface 19 side surface and the fluorescent member 3 of the fluorescent member 3 is formed in a curved surface the one in which the features. 【0019】また請求項11の発明は、請求項1乃至1 [0019] According to another embodiment of the present invention 11, claims 1 to 1
0のいずれかにおいて、発光素子2を略包囲するように蛍光部材3を配置して成ることを特徴とするものである。 In either 0 and is characterized by comprising a light emitting element 2 is disposed a fluorescent member 3 so as to be substantially surrounded. 【0020】また請求項12の発明は、請求項1乃至1 [0020] According to another embodiment of the present invention 12, claims 1 to 1
1のいずれかにおいて、実装基板1に凹設された凹部6 In any one of the recesses 6 that are recessed in the mounting board 1
の底面に発光素子2を載置すると共に、蛍光部材3の発光素子2側の面を凹部6の開口面と略等しい大きさに形成して成ることを特徴とするものである。 With placing the bottom surface to the light emitting element 2 and is characterized by comprising the surface of the light emitting element 2 side of the fluorescent member 3 is formed in substantially the same size as the opening of the recess 6. 【0021】また請求項13の発明は、請求項12において、凹部6の内周面を略放物面形状に形成すると共に、発光素子2から放射された光を上記内周面で反射させることによって蛍光部材3へ入射可能にして成ることを特徴とするものである。 [0021] According to another embodiment of the present invention 13, in claim 12, to form the inner peripheral surface of the concave portion 6 to Ryakuho Surface Generation, the light emitted from the light emitting element 2 can be reflected by the inner peripheral surface the is characterized in that formed by allowing incident on the fluorescent member 3. 【0022】また請求項14の発明は、請求項12において、凹部6の内周面を略楕円面形状に形成すると共に、発光素子2から放射された光を上記内周面で反射させることによって蛍光部材3へ入射可能にして成ることを特徴とするものである。 [0022] According to another embodiment of the present invention 14, in claim 12, to form the inner peripheral surface of the concave portion 6 in a substantially ellipsoid shape, a light emitted from the light emitting element 2 by reflecting at the inner peripheral surface it is characterized in that formed by allowing incident on the fluorescent member 3. 【0023】また請求項15の発明は、請求項2乃至1 [0023] According to another embodiment of the present invention 15, claim 2 or 1
4のいずれかにおいて、光学部材4と実装基板1との間に放熱のための間隙部26を設けて成ることを特徴とするものである。 In any of the 4, it is characterized in that comprising providing a gap 26 for heat dissipation between the optical member 4 and the mounting substrate 1. 【0024】また請求項16の発明は、請求項1乃至1 [0024] According to another embodiment of the present invention 16, claims 1 to 1
5のいずれかにおいて、透光性樹脂27によって発光素子2を封止すると共に、封止した透光性樹脂27の光取出し面19側の面を曲面形状に形成して成ることを特徴とするものである。 In 5 either, along with sealing the light emitting element 2 by the translucent resin 27, characterized in that it comprises a surface of the light extraction surface 19 side of the translucent resin 27 sealed to form a curved shape it is intended. 【0025】また請求項17の発明は、請求項1乃至1 [0025] According to another embodiment of the present invention 17, claims 1 to 1
6のいずれかにおいて、発光素子2の発光に対する蛍光部材3表面の光反射率を低下させ、かつ蛍光部材3中への入射量を増加させる反射防止膜28を、蛍光部材3と発光素子2との間に介在させて成ることを特徴とするものである。 In 6 either, the fluorescent member 3 surface reduces the light reflectance, and the antireflection film 28 to increase the incident amount to the fluorescent member 3 in respect to light emission of the light emitting element 2, the fluorescent member 3 and the light emitting element 2 it is characterized in that comprising interposed between. 【0026】また請求項18の発明は、請求項2乃至1 [0026] According to another embodiment of the present invention 18, claim 2 or 1
7のいずれかにおいて、発光素子2又は蛍光部材3からの光を散乱させる光拡散材29を、蛍光部材3と光学部材4との間に介在させて成ることを特徴とするものである。 In 7 either, a light diffusing material 29 that scatters light from the light emitting element 2 or the fluorescent member 3 and is characterized by comprising interposed between the fluorescent member 3 and the optical member 4. 【0027】また請求項19の発明は、請求項2乃至1 [0027] According to another embodiment of the present invention 19, claim 2 or 1
8のいずれかにおいて、無機透明材料を用いて光学部材4を形成して成ることを特徴とするものである。 In 8 either, it is characterized in that obtained by forming an optical member 4 using an inorganic transparent material. 【0028】また請求項20の発明は、請求項1において、実装基板1に載置された発光素子2を覆うように、 [0028] According to another embodiment of the present invention 20, as in claim 1, covering the light emitting element 2 mounted on the mounting substrate 1,
蛍光部材3を含む透明物質を用いて形成された半球状のドーム5を実装基板1に着脱自在に装着して成ることを特徴とするものである。 It is characterized in that a hemispherical dome 5 which is formed of a transparent material containing a fluorescent member 3 on the mounting board 1 formed by removably mounted. 【0029】また請求項21の発明は、請求項1において、実装基板1に形成した凹部6に発光素子2を載置すると共に、この凹部6に蛍光部材3を充填し、透明材料を用いて形成された着脱自在な蓋7でこの凹部6を密閉して成ることを特徴とするものである。 [0029] According to another embodiment of the present invention 21, in claim 1, together with placing the light emitting element 2 in the recess 6 formed in the mounting substrate 1, a fluorescent member 3 was filled in the concave portion 6, a transparent material it is characterized in that in formed removable lid 7 formed by sealing the recess 6. 【0030】 【発明の実施の形態】以下、本発明の実施の形態を説明する。 [0030] PREFERRED EMBODIMENTS Hereinafter, an embodiment of the present invention. 【0031】(実施形態1)図1は本発明に係る発光装置の実施の形態の一例を示すものであり、この発光装置は以下のように形成されている。 [0031] (Embodiment 1) FIG. 1 shows an example of an embodiment of a light emitting device according to the present invention, the light emitting device is formed as follows. 【0032】実装基板1はプリント配線板等で形成されるものであり、この実装基板1には凹部6が凹設されると共に、この凹部6にLEDチップ等の発光素子2が搭載され、実装基板1と発光素子2とが電気的に接続されている。 The mounting substrate 1 is intended to be formed with the printed wiring board or the like, the recess 6 is recessed in the mounting substrate 1, the light emitting element 2 such as an LED chip is mounted in the recess 6, mounting the substrate 1 and the light emitting element 2 are electrically connected. このとき図1に示すものでは、発光素子2に半田等でバンプ8を設け、実装基板1の凹部6の底面に発光素子2を載置すると共に、実装基板1の電極(図示省略)にバンプ8を接合することによって、電気的な接続が行われているが、発光素子2の電極と実装基板1の電極とを導電性ワイヤーで接続することもできる。 As shown in figure 1 this time, the bump 8 provided with solder or the like to the light-emitting element 2, while placing the bottom surface to the light-emitting element 2 of the concave portion 6 of the mounting substrate 1, bumps of the mounting board 1 electrode (not shown) by joining 8, the electrical connections have been made, it is also possible to connect the the electrode light-emitting element 2 of the mounting board 1 electrode with a conductive wire. 【0033】そして実装基板1には、凹部6を設けた側にレンズ等の光学部材(透光性部品)4が着脱自在に装着されている。 [0033] Then the mounting board 1, an optical member such as a lens on the side provided with the recess 6 (translucent part) 4 is mounted detachably. この光学部材4は、表面又は内部に蛍光部材(波長変換物質)3を含んで形成されるものであり、図1に示すものでは、凹部6側に向いた表面に蛍光部材3を固定しているが、これとは反対側の表面に蛍光部材3を固定することもできる。 The optical member 4, which is formed to include a fluorescent member (wavelength converting material) 3 in or on, as shown in figure 1, to fix the fluorescent member 3 on the surface facing the recess 6 side It is, but it is also possible to fix the fluorescent member 3 on the surface opposite thereto. なお、蛍光部材3とは、発光素子2の発光によって励起されると共に励起波長と異なる波長の光を放射するものをいい、例えば、蛍光体を挙げることができる。 Note that the fluorescent member 3, refers to one which emits light of wavelength different from the excitation wavelength while being excited by light emission of the light emitting element 2, for example, a phosphor. 【0034】蛍光部材3を光学部材4の表面に固定するにあたっては、蛍光体を含む樹脂を光学部材4の表面に塗布したり、図1のように凹部6側に向いた光学部材4 [0034] When fixing the fluorescent member 3 on the surface of the optical member 4, the optical member 4 facing the resin containing a phosphor or applied to the surface of the optical member 4, the concave portion 6 side as shown in FIG. 1
の表面に、実装基板1の凹部6に対応して凹所9を設け、この凹所9に蛍光体を含む樹脂を充填したりして行うことができる。 On the surface of the recess 9 provided corresponding to the concave portion 6 of the mounting substrate 1, a resin containing a fluorescent material can be carried out or filled into the recess 9. 【0035】また例えば、蛍光体を透明樹脂に分散させ、これを用いてトランスファー成形法等を行って光学部材4を形成することもできる。 [0035] Further, for example, a phosphor is dispersed in a transparent resin, it is also possible to form the optical member 4 performs a transfer molding method or the like using the same. このようにして形成した光学部材4は、その内部に蛍光部材3である蛍光体を分散して含んだ構造となっており、蛍光部材3を改めて光学部材4に固定する必要がなく、光学部材4の形成と蛍光部材3の固定とを同時に行うことができるものである。 Such optical member 4 formed in the is a structure containing dispersed phosphor is a fluorescent member 3 therein, it is not necessary to fix the fluorescent member 3 again to the optical member 4, the optical member 4 of forming a fluorescent member 3 of the fixed and those that can be carried out simultaneously. 【0036】そして、上記の光学部材4を実装基板1に装着することによって、発光装置を形成することができるものであるが、この光学部材4を実装基板1に対して着脱自在にするにあたっては、以下のようにして行うことができる。 [0036] Then, by mounting the optical member 4 of the above mounting board 1, but is capable of forming a light-emitting device, in order to detachably the optical member 4 to the mounting board 1 , it can be carried out in the following manner. 例えば、図1に示すように、光学部材4の外周縁に沿って実装基板1の表面から突片10を突設しておくものである。 For example, as shown in FIG. 1, it is intended to be projected to the projecting piece 10 from along the outer peripheral edge surface of the mounting substrate 1 of the optical member 4. このようにしておくと、実装部品の表面に光学部材4を載置すると同時に、実装基板1の突片10の内側面11と光学部材4の外周端部の外側面1 If you leave this way, at the same time placing the optical member 4 to the surface of the mounting component, the inner surface 11 and the outer surface 1 of the outer peripheral edge of the optical member 4 of the projecting piece 10 of the mounting board 1
2とが当接することとなり、光学部材4と実装基板1とを嵌合によって装着することができるものである。 Will be 2 and abuts, in which can be mounted by fitting the optical member 4 and the mounting substrate 1. しかも、このような嵌合構造であると、光学部材4を実装基板1から取り外すにあたっては、両者を離間する方向に引っ張ることによって行うことができるものであり、実装基板1に対する光学部材4の着脱が自在となるものである。 Moreover, if it is such a fitting structure, when remove the optical member 4 from the mounting substrate 1, which can be done by pulling in a direction away both, attachment and detachment of the optical member 4 with respect to the mounting board 1 one in which is freely. ここで、実装基板1の突片10を若干内側に傾斜させて形成しておくと、この突片10の内側面11と光学部材4の外側面12とが弾接することによって、実装基板1から光学部材4が不用意に外れるのを防止することができるものである。 Here, the projecting piece 10 of the mounting substrate 1 when previously formed to be inclined slightly inwardly by contact with the outer surface 12 transgression bullet inner surface 11 and the optical member 4 of the projecting piece 10, the mounting board 1 is capable of the optical member 4 is prevented from unexpectedly detached. 【0037】なお、光学部材4としては、図1のように凹部6に対応して突曲面17が設けられたレンズを使用することができるが、これに限定されるものではなく、 [0037] As the optical member 4, it is possible to use a lens projecting curved surface 17 is provided corresponding to the recesses 6 as shown in FIG. 1, the invention is not limited thereto,
その他にカバー等も使用することができる。 Others on the cover, or the like can also be used. また、光学部材4を実装基板1に装着するための構造としては、光学部材4の着脱が自在な構造であればよく、上記のような嵌合構造の他にねじ止め構造等も採用することができる。 As the structure for mounting the optical member 4 to the mounting substrate 1 may be a can freely structure detachable in the optical member 4, be adopted screwing structure or the like in addition to the fitting structure described above can. 【0038】上記のようにして形成した発光装置にあって、最も劣化の早い蛍光体や蛍光体を含む樹脂等の蛍光部材3は光学部材4にのみ含まれており、しかもこの光学部材4は実装基板1に対して着脱自在であるため、蛍光部材3の劣化によって発光装置の性能が低下した場合には、実装基板1はそのままにして、光学部材4を新しいものに取り替えるだけでよく、これによって蛍光部材3が未劣化の新しいものに交換され、発光装置の性能が回復し商品としての寿命を延ばすことができるものである。 [0038] In the light emitting device formed as described above, most fluorescent member 3 such as a resin containing a fast phosphor or phosphor degradation are only included in the optical member 4, moreover the optical member 4 since the mounting board 1 is detachable, if the performance of the light emitting device due to deterioration of the fluorescent member 3 is lowered, the mounting substrate 1 intact, it is only replaced with a new optical member 4, which the fluorescent member 3 is replaced with new non-deteriorated, but the performance of the light emitting device can extend the life of the product recovered. 【0039】(実施形態1−2)図2は本発明の請求項3に係る発光装置の実施の形態の一例を示すものであり、この発光装置は以下のように形成されている。 [0039] (Embodiment 1-2) FIG. 2 shows an example of an embodiment of a light emitting device according to claim 3 of the present invention, the light emitting device is formed as follows. 【0040】実装基板1はプリント配線板等で形成されるものであり、この実装基板1には凹部6が凹設されると共に、この凹部6にLEDチップ等の発光素子2がフェースダウン実装によって搭載され、実装基板1と発光素子2とが電気的に接続されている。 The mounting substrate 1 is intended to be formed with the printed wiring board or the like, the recess 6 is recessed in the mounting substrate 1, the light emitting element 2 is mounted face down in the LED chip or the like in the recess 6 is mounted, the mounting substrate 1 and the light emitting element 2 are electrically connected. すなわち、図2に示すものでは、発光素子2に半田等でバンプ8を設け、 That is, as shown in figure 2, the bump 8 provided with solder or the like to the light-emitting element 2,
実装基板1の凹部6の底面に発光素子2を載置すると共に、実装基板1の配線部18と導通する電極に上記バンプ8を接合することによって、電気的な接続が行われている。 With mounting the light emitting element 2 to the bottom surface of the concave portion 6 of the mounting board 1, by joining the bump 8 on the electrode conducting with the wiring portion 18 of the mounting substrate 1, electrical connection is made. 【0041】そして実装基板1には、凹部6を設けた側にレンズ等の光学部材4が着脱自在に装着されている。 [0041] Then the mounting substrate 1, the optical member 4 such as a lens on the side provided with the recess 6 is detachably attached.
つまり、光学部材4は発光素子2に対向して配置している。 In other words, the optical member 4 is disposed to face the light emitting element 2. この光学部材4は、配光を制御するためのものであって、表面又は内部に蛍光部材3を含んで形成されるものであり、図2に示すものでは、凹部6側に向いた表面に蛍光部材3を固定している。 The optical member 4 is for controlling the light distribution, which is formed to include a fluorescent member 3 in or on, as shown in figure 2, the surface facing the recess 6 side fixing the fluorescent member 3. また光学部材4において、実装基板1と対向する側と反対側の表面(以下、光取出し面19という)には所望の光学形状を形成することができる。 In the optical member 4, the mounting substrate 1 and the side facing the opposite surface (hereinafter, referred to as light extraction surface 19) in the can to form the desired optical shape. 【0042】蛍光部材3を光学部材4の表面に固定するにあたっては、蛍光体を含む樹脂を光学部材4の表面に塗布したり、図2のように発光素子2に対向する光学部材4の表面に、実装基板1の凹部6に対応して凹所9を設け、この凹所9に蛍光体を含む樹脂を充填したりして行うことができる。 [0042] When fixing the fluorescent member 3 on the surface of the optical member 4, or by applying a resin containing a fluorescent material on the surface of the optical member 4, the surface of the optical member 4 facing the light emitting element 2 as shown in FIG. 2 in, a recess 9 provided corresponding to the concave portion 6 of the mounting substrate 1, a resin containing a fluorescent material can be carried out or filled into the recess 9. このようにして、特に光学部材4内において蛍光部材3を発光素子2に最も近い位置に配置すれば、発光素子2から発せられた光を有効に蛍光部材3へ入射させることができるものである。 In this way, in particular those when located closest fluorescent member 3 to the light emitting element 2 in the optical member 4, it can be effectively incident on the fluorescent member 3 the light emitted from the light emitting element 2 . 【0043】そして、上記の光学部材4を実装基板1に装着することによって、発光装置を形成することができるものであるが、この光学部材4を実装基板1に対して着脱自在にするにあたっては、(実施形態1)と同様に行うことができる。 [0043] Then, by mounting the optical member 4 of the above mounting board 1, but is capable of forming a light-emitting device, in order to detachably the optical member 4 to the mounting board 1 it can be performed in the same manner as (embodiment 1). 【0044】上記のようにして形成した発光装置にあって、発光素子2から発せられた光は、蛍光部材3へ入射してこれを励起すると共に、蛍光部材3が励起波長と異なる波長の光を発する。 [0044] In the light emitting device formed as described above, light emitted from the light emitting element 2 serves to excite this by entering the fluorescent member 3, light having a wavelength fluorescent member 3 is different from the excitation wavelength the issues. 励起波長の光と蛍光部材3より発せられた波長の光は、光学部材4の光取出し面19に形成してある所定の光学形状によって配光制御されることとなり、所望の配光を実現することができるものである。 Light wavelength emitted from the light and the fluorescent member 3 of the excitation wavelength, will be controlled light distribution by a predetermined optical shape which is formed on the light extraction surface 19 of the optical member 4, to achieve a desired light distribution it is what it is. また、発光素子2とは別部材である光学部材4に所定の光学形状を形成すると共に、この光学部材4に蛍光部材3を含ませているので、発光素子2への応力、熱、 Further, with the light emitting element 2 to form a predetermined optical shape on the optical member 4 is another member, since the contained fluorescent member 3 in the optical member 4, the stress to the light emitting element 2, the heat,
化学的負荷を低減することができるものである。 It is capable of reducing the chemical load. 【0045】ここで、蛍光部材3と発光素子2とを接しないようにしておくと、蛍光部材3が発光素子2の熱に直接晒されることがなくなり、蛍光体や蛍光体を含む樹脂等の劣化が低減されて、蛍光部材3の寿命を延ばすことができ、これによって光束減退が抑えられ、発光装置が長寿命となる。 [0045] Here, when the left so as not to contact the fluorescent member 3 and the light emitting element 2, prevents the fluorescent member 3 is directly exposed to the heat emitting elements 2, such as a resin containing a phosphor or phosphor degradation is reduced, it is possible to extend the life of the fluorescent member 3, whereby the light flux decline is suppressed, the light emitting device becomes longer life. しかも、蛍光部材3と発光素子2とは接していないので、発光素子2の放熱性も良好になるものである。 Moreover, since not in contact with the fluorescent member 3 and the light emitting element 2, in which heat dissipation properties of the light-emitting element 2 is also improved. 【0046】また、発光素子2をフェースダウン実装したことにより、導電性ワイヤーが不必要となり、フェースアップ実装に比べて、蛍光体や蛍光体を含む樹脂等の蛍光部材3を、発光素子2に接しない範囲において、より発光素子2に近付けることが可能となる。 [0046] Further, by the light-emitting element 2 were mounted face down, conductive wires becomes unnecessary, as compared to a face-up mounting, the fluorescent member 3 such as a resin containing a phosphor or phosphor, the light emitting element 2 to the extent not in contact, it is possible to close more to the light emitting element 2. 従って、より正確で効果的な配光制御が可能となるものである。 Therefore, it is made possible to more accurate and efficient light distribution control. しかも、導電性ワイヤーによって発光の一部が遮られることがないので、光量ロスも起こらなくなり、蛍光部材3 Moreover, since there is not blocked part of light by a conductive wire, also no longer occur loss of light, fluorescent member 3
への光の入射量が増加し、発光効率が良好になるものである。 The amount of incident light is increased to one in which the luminous efficiency is improved. 【0047】さらに、最も劣化の早い蛍光体や蛍光体を含む樹脂等の蛍光部材3は光学部材4にのみ含まれており、しかもこの光学部材4は実装基板1に対して着脱自在であるため、蛍光部材3の劣化によって発光装置の性能が低下した場合には、実装基板1はそのままにして、 [0047] Further, most fluorescent member 3 such as a resin containing a fast phosphor or phosphor degradation are only included in the optical member 4, and since the optical member 4 is detachably attached to the mounting board 1 , if the performance of the light emitting device due to deterioration of the fluorescent member 3 is lowered, the mounting board 1 is intact,
光学部材4を新しいものに取り替えるだけでよく、これによって蛍光部材3が未劣化の新しいものに交換され、 Need only replace the optical member 4 with a new one, whereby the fluorescent member 3 is replaced with a new un degradation,
発光装置の性能が回復し商品としての寿命を延ばすことができるものである。 In which the performance of the light emitting device can extend the life of the product recovered. 【0048】(実施形態1−3)図3は本発明の請求項5に係る発光装置の実施の形態の一例を示すものであり、この発光装置は基本的には上記の(実施形態1)等と同様に形成されているが、特に光学部材4の形状を凸レンズ形状にしたところに特徴がある。 [0048] (Embodiment 1-3) FIG. 3 shows an example of an embodiment of a light emitting device according to claim 5 of the present invention, the light emitting device is basically of the above (Embodiment 1) etc. are formed in the same manner as it is characterized in particular was the shape of the optical member 4 in a convex lens shape. このように光学部材4を形成しておくと、例えば図3の矢印で示すように、蛍光部材3から出てきた光を、光学部材4の凸レンズ形状によって所定の方向へ容易に配光制御することができるものである。 With such advance to form an optical member 4, for example, as shown by the arrows in FIG. 3, the light emerging from the fluorescent member 3, readily light distribution control by the convex lens shape of the optical member 4 in a predetermined direction it is what it is. 【0049】(実施形態1−4)図4は本発明の請求項6に係る発光装置の実施の形態の一例を示すものであり、この発光装置は基本的には上記の(実施形態1)等と同様に形成されているが、特に光学部材4の形状を以下のような形状にしたところに特徴がある。 [0049] (Embodiment 1-4) FIG. 4 shows an example of an embodiment of a light emitting device according to claim 6 of the present invention, the light emitting device is basically of the above (Embodiment 1) etc. and are formed as well, is characterized in particular was the shape of the optical member 4 in the shape as described below. 【0050】すなわち、光学部材4を形成するにあたって、蛍光部材3によって波長が変換されて放射された光のうち、光学部材4の光取出し面19に向かう方向と異なる方向に放射された光を、光取出し面19に向かう方向に全反射させる形状である。 [0050] That is, in forming the optical member 4, of the light wavelength by the fluorescent member 3 is radiated is converted, the light emitted in a direction different from a direction toward the light extraction surface 19 of the optical member 4, a shape that totally reflected toward the light extraction surface 19. このような形状は、例えば、光学部材4の光取出し面19と反対側の面に、外側面20が滑らかな傾斜面であって先端部21が平坦な山状の凸部22を設けることによって、形成することができる。 Such a shape, for example, on the surface opposite to the light extraction surface 19 of the optical member 4, by the tip 21 outer surface 20 a smooth inclined plane provided a flat mountain-shaped protrusions 22 , it can be formed. 凸部22の先端部21には蛍光部材3を充填するための凹所9が設けてある。 The distal end portion 21 of the projection 22 is provided with a recess 9 for filling the fluorescent member 3. 【0051】通常、蛍光部材3から出てきた光は、光取出し面19へ向かうもの(図4において矢印イ)と、光取出し面19へ向かわずにほぼ横方向へ向かうもの(図4において矢印ロ)とに分かれる。 [0051] Normally, the light emerging from the fluorescent member 3, an arrow which directed to the light extracting surface 19 (the arrow b in FIG. 4), which substantially toward the lateral direction without directed to the light extraction surface 19 (in FIG. 4 b) and to split. しかし、光学部材4 However, the optical member 4
を上記のような形状となるように形成してあると、当初から光取出し面19へ向かう光はそのまま光取出し面1 When a certain form such a shape as described above, light traveling from the beginning to the light extraction surface 19 as the light extraction surface 1
9から外部に取り出すことができるのはもちろん、当初から光取出し面19へ向かわない光であっても、このような光を凸部22の外側面20で全反射させることによって、光取出し面19へ向かう光にすることができ、所定の方向へ配光制御することができるものである。 Course can be removed from the 9 to the outside, even light that is not directed to the light extraction surface 19 from the beginning, by total reflection of such light outside surface 20 of the projection 22, the light extraction surface 19 can be light directed to and is able to light distribution control in a predetermined direction. 【0052】(実施形態1−5)図5は本発明の請求項7に係る発光装置の実施の形態の一例を示すものであり、この発光装置は基本的には上記の(実施形態1− [0052] (Embodiment 1-5) FIG. 5 shows an example of an embodiment of a light emitting device according to claim 7 of the present invention, the light emitting device is basically of the above (Embodiment 1
4)と同様に形成されているが、下記の点で(実施形態1−4)とは異なっている。 4) and it is formed in the same manner but are different from the (Embodiment 1-4) in the following points. 【0053】すなわち、本実施形態においては、光学部材4の発光素子2側の面に反射部23を設けると共に、 [0053] That is, in this embodiment, the reflective portion 23 is provided on the surface of the light emitting element 2 side of the optical member 4,
発光素子2からの光を取り入れるための開口部24を反射部23に設けている。 An opening 24 for taking light from the light emitting element 2 is provided in the reflection portion 23. 具体的には、光学部材4の発光素子2側の面にアルミ蒸着等を行って反射部23を設けてあり、この際、凸部22の先端部21の全部又は一部にはアルミ蒸着等を行わないことによって開口部24を設けてある。 Specifically, is provided with a reflecting portion 23 performs an aluminum vapor deposition or the like on the surface of the light emitting element 2 side of the optical member 4, this time, to all or a portion of the distal end portion 21 of the protrusion 22 of aluminum evaporation or the like It is provided with an opening 24 by not performing. つまり、この開口部24を通して、発光素子2から発せられた光を蛍光部材3へ取り入れることができるようにしてある。 In other words, through the opening 24, it is to be able to incorporate the light emitted from the light emitting element 2 to the fluorescent member 3. 【0054】既述のように通常、蛍光部材3から出てきた光は、光取出し面19へ向かうもの(図5において矢印イ)と、光取出し面19へ向かわずにほぼ横方向へ向かうもの(図5において矢印ロ)とに分かれる。 [0054] Of the normal As described above, the light coming out of the fluorescent member 3, which toward the light extraction surface 19 (the arrow b in FIG. 5), toward the substantially horizontal direction without directed to the light extraction surface 19 divided in (5 arrow b) and. しかし、上記のように光学部材4に反射部23を設けると共に反射部23に開口部24を設けるようにしてあると、 However, if there be provided an opening 24 in the reflective portion 23 provided with a reflecting portion 23 to the optical member 4, as described above,
当初から光取出し面19へ向かう光はそのまま光取出し面19から外部に取り出されるのはもちろん、当初から光取出し面19へ向かわない光であっても、このような光を全て凸部22の外側面20等で全反射させることができ、それによって光取出し面19へ向かう光にすることができ、所定の方向へ配光制御することができるものである。 Light directed toward the light extraction surface 19 from the beginning as well as from being extracted from the light extracting surface 19 to the outside, even light that is not directed to the light extraction surface 19 from the beginning, out of all such light projecting portion 22 it can be totally reflected by the side surface 20 or the like, thereby it is possible to light toward the light extraction surface 19 and is able to light distribution control in a predetermined direction. 【0055】また、光学部材4の発光素子2側の面には、開口部24を除いて反射部23を設けてあるので、 [0055] Further, since the surface of the light emitting element 2 side of the optical member 4 is provided with a reflecting portion 23 except the opening 24,
一旦開口部24を通して光学部材4内へ取り入れられた光は、反射部23で全反射されることにより、実装基板1側へ抜け出ることがなくなり、発光効率がさらに向上するものである。 Once the light taken in through the opening 24 into the optical member 4, by being totally reflected by the reflection section 23, it is not being withdrawn into the mounting substrate 1 side, in which the luminous efficiency is further improved. 【0056】また反射部23は、光学部材4の発光素子2側の面、つまり光学部材4と実装基板1との間に設けてあるので、容易に触れられず、劣化や汚れを少なくすることができるものである。 [0056] The reflection portion 23, the surface of the light emitting element 2 side of the optical member 4, i.e. so is provided between the optical member 4 and the mounting substrate 1, not be easily touched, reducing degradation and dirt it is those that can. 【0057】さらに、アルミ蒸着等によって実装基板1 [0057] In addition, the mounting board 1 by aluminum deposition or the like
に反射部23を設けるのは困難であるが、光学部材4に対しては容易に反射部23を設けることができるものである。 Although it is difficult to provide a reflecting portion 23 to one in which it is possible to provide easily the reflecting portion 23 with respect to the optical member 4. 【0058】(実施形態1−6)図6は本発明の請求項8に係る発光装置の実施の形態の一例を示すものであり、この発光装置は基本的には上記の(実施形態1)等と同様に形成されているが、本実施形態は、光学部材4 [0058] (Embodiment 1-6) FIG. 6 shows an example of an embodiment of a light emitting device according to claim 8 of the present invention, the light emitting device is basically of the above (Embodiment 1) Although etc. are formed in the same manner as the present embodiment, the optical member 4
よりも低い屈折率を有する低屈折部材25を用いるところに特徴がある。 It is characterized in that using a low refractive member 25 having a lower refractive index than. 【0059】すなわち、光学部材4は低屈折部材25を備えており、蛍光部材3を通過した光又は蛍光部材3により波長が変換された光が低屈折部材25を介して光学部材4へ入射されるように、光学部材4において低屈折部材25を配置している。 [0059] That is, the optical member 4 is provided with a low refractive member 25, the light wavelength is converted by light or fluorescent member 3 passes through the fluorescent member 3 is incident to the optical member 4 via a low refractive member 25 in so that it is arranged a low refractive member 25 in the optical member 4. 具体的には、光学部材4に設けた凹所9の内面にシリカエアロゲル等の低屈折部材2 Specifically, the low refractive member of silica airgel such as the inner surface of the recess 9 provided on the optical member 4 2
5を塗布するなどして配置した後に、蛍光部材3を充填してある。 After placing by such a 5 coating, it is filled with a fluorescent member 3. 【0060】そうすると、蛍光部材3を通過した光又は蛍光部材3により波長が変換された光、つまり蛍光部材3から出てきた光を、低屈折部材25へ入射させた後に光学部材4へ入射させることができる。 [0060] Then, the light wavelength by light or fluorescent member 3 passes through the fluorescent member 3 is converted, that is, the light emerging from the fluorescent member 3, so that it is incident on the optical member 4 After entering the low refractive member 25 be able to. 低屈折部材25 Low refractive member 25
から光学部材4へ入射する際、光は屈折作用により絞られる方向に曲げられるので、より多くの光を配光制御することができるものである。 When entering from the optical member 4, the light is bent in the direction narrowed by refraction action, it is capable of light distribution control more light. また、上記のように蛍光部材3と光学部材4との間に低屈折部材25によって界面を作ることで、屈折作用を利用することができ、図3で示される(実施形態1−3)の場合よりも、光学部材4 Further, by making the surface by the low refractive member 25 to between the fluorescent member 3 and the optical member 4, as described above, it can be utilized to refraction, as shown in FIG. 3 (Embodiment 1-3) than, the optical member 4
の光取出し面19の凸レンズ形状をより緩やかにすることができる。 It can be a convex lens shape of the light extraction surface 19 more gentle. 【0061】(実施形態1−7)図7は本発明の請求項9に係る発光装置の実施の形態の一例を示すものであり、この発光装置は基本的には上記の(実施形態1)等と同様に形成されているが、本実施形態においては、発光素子2から発せられた光が蛍光部材3中を略等しい光路長にて通過するように、蛍光部材3を形成している。 [0061] (Embodiment 1-7) FIG. 7 shows an example of an embodiment of a light emitting device according to claim 9 of the present invention, the light emitting device is basically of the above (Embodiment 1) Although etc. are similarly formed, in this embodiment, as the light emitted from the light emitting element 2 passes at substantially equal optical path lengths fluorescent member 3 medium, to form a fluorescent member 3.
具体的には、光学部材4の実装基板1側の面において、 Specifically, in the plane of the mounting substrate 1 side of the optical member 4,
凹所9を半球状に形成し、この半球状の凹所9に蛍光部材3を充填して、蛍光部材3を半球状に形成するようにしている。 Forming a recess 9 in a semi-spherical shape, the hemispherical recess 9 is filled with a fluorescent member 3, so as to form a fluorescent member 3 in a hemispherical shape. 光学部材4に半球状の凹所9を設けるのは容易であるため、この凹所9に蛍光部材3を充填するだけで、容易に半球状の蛍光部材3を形成することができるのである。 Because of providing the hemispherical recess 9 in the optical member 4 is easy, simply filling the fluorescent member 3 in the recess 9, it is possible to easily form the fluorescent member 3 hemispherical. 凹所9の開口縁は円形となり、この略中心に発光素子2を配置することによって、発光素子2から凹所9の内面までの距離がいずれの方角についても略等しくなって、発光素子2から発せられた光が蛍光部材3中を略等しい光路長にて通過することができるものである。 Opening edge of the recess 9 becomes circular, by placing the light emitting element 2 in the substantially central, substantially equal also direction distance either from the light emitting element 2 to the inner surface of the recess 9, the light emitting element 2 emitted light is one that can pass in a substantially equal optical path lengths fluorescent member 3 medium. 【0062】つまり、発光素子2から発せられた光は蛍光部材3内を通過する際、どの方向でも等距離となり、 [0062] That is, light emitted from the light emitting element 2 when passing through the fluorescent member 3, also becomes equal distance in any direction,
蛍光部材3を励起させる距離も同じとなる。 Distance to excite the fluorescent member 3 is also the same. そのため角度ごとでの色特性が緩和されることによって、光取出し面19での色むらを抑えることができるものである。 Therefore by the color characteristics at each angle it is relaxed, in which it is possible to suppress color unevenness in the light extraction surface 19. 【0063】(実施形態1−8)図8は本発明の請求項11に係る発光装置の実施の形態の一例を示すものであり、この発光装置は基本的には上記の(実施形態1)等と同様に形成されているが、本実施形態においては、蛍光部材3の光取出し面19側の面と蛍光部材3の発光素子2側の面のうち、少なくとも一方を曲面に形成するところに特徴がある。 [0063] (Embodiment 1-8) FIG. 8 shows an example of an embodiment of a light emitting device according to claim 11 of the present invention, the light emitting device is basically of the above (Embodiment 1) Although etc. are formed in the same manner as, in the present embodiment, among the surfaces of the light emitting element 2 side surface and the fluorescent member 3 of the light extraction surface 19 side of the fluorescent member 3, where the forming at least one curved surface there is a feature. なお、本実施形態においては、実装基板1に凹部6を凹設することなく発光素子2を搭載しているが、実装基板1に凹部6を凹設し、この凹部6の底面に発光素子2を搭載してもよい。 In the present embodiment, is equipped with a light-emitting element 2 without recessed recesses 6 on the mounting board 1, a concave portion 6 is recessed in the mounting substrate 1, the light emitting element 2 to the bottom surface of the recess 6 it may be mounted. 【0064】本実施形態においても、(実施形態1− [0064] In the present embodiment, (the embodiment 1
7)と同様に、発光素子2から発せられた光が蛍光部材3中を略等しい光路長にて通過するように、蛍光部材3 Similar to 7), such that light emitted from the light emitting element 2 passes at substantially equal optical path lengths fluorescent member 3 medium, the fluorescent member 3
を形成している。 To form a. 具体的には、光学部材4の実装基板1 Specifically, the mounting substrate 1 of the optical member 4
側の面において、凹所9を半球状に形成し、この半球状の凹所9に蛍光部材3を充填している。 In the surface on the side, to form a recess 9 hemispherical, filling the fluorescent member 3 in this hemispherical recess 9. このとき、光学部材4の発光素子2側の面(凹所9を除く)と蛍光部材3の発光素子2側の面とが面一となるように、凹所9に蛍光部材3を充填すれば、(実施形態1−7)と同様になるが(図7参照)、本実施形態においては、図8に示すように凹所9に充填する蛍光部材3の量を(実施形態1−7)の場合よりも若干減らして、蛍光部材3の発光素子2側の面を、凹所9の内面側に凹んだ曲面となるように形成してある。 In this case, (except for recess 9) the light emitting element 2 side surface of the optical member 4 and the like and the surface of the light emitting element 2 side of the fluorescent member 3 is flush, by filling the fluorescent member 3 in the recess 9 if, (embodiment 1-7) becomes the same (see FIG. 7), in the present embodiment, the amount of (embodiment of the fluorescent member 3 to be filled in the recess 9, as shown in FIG. 8 1-7 ) slightly reduced than in the case of the surface of the light emitting element 2 side of the fluorescent member 3, it is formed to have a curved surface recessed to the inner surface side of the recess 9. つまり、(実施形態1−7)においては、蛍光部材3の光取出し面19側の面のみを曲面に形成しているのに対し、本実施形態においては、蛍光部材3の光取出し面19側の面及び蛍光部材3の発光素子2側の面の両方を曲面に形成している。 That is, in the (Embodiment 1-7), whereas only the surface of the light extraction surface 19 side of the fluorescent member 3 is formed in a curved surface, in the present embodiment, the light extraction surface 19 side of the fluorescent member 3 and both the surface and the surface of the light emitting element 2 side of the fluorescent member 3 is formed in a curved surface. また凹所9の開口縁は円形となり、この略中心に発光素子2を配置することによって、発光素子2から凹所9の内面までの距離がいずれの方角についても略等しくなって、発光素子2 The opening edge of the recess 9 also becomes circular, by placing the light emitting element 2 in the substantially central, substantially equal also direction distance either from the light emitting element 2 to the inner surface of the recess 9, the light emitting element 2
から発せられた光が蛍光部材3中を略等しい光路長にて通過することができるものである。 Light emitted from it is capable to pass through in a substantially equal optical path lengths fluorescent member 3 medium. 【0065】このように、発光素子2から発せられた光は蛍光部材3内を通過する際、どの方向でも等距離となり、蛍光部材3を励起させる距離も同じとなる。 [0065] Thus, when light emitted from the light emitting element 2 is passing through the fluorescent member 3, also becomes equal distance in any direction, the distance to excite the fluorescent member 3 is also the same. そのため角度ごとでの色特性が緩和されることによって、光取出し面19での色むらを抑えることができるものである。 Therefore by the color characteristics at each angle it is relaxed, in which it is possible to suppress color unevenness in the light extraction surface 19. 【0066】さらに、本実施形態においては、実装基板1に凹部6を凹設することなく発光素子2を搭載しているので、発光素子2の周囲(実装基板1側の面を除く) [0066] Further, in the present embodiment, since the mounting the light emitting element 2 without recessed recesses 6 on the mounting substrate 1, (excluding the surface of the mounting substrate 1 side) around the light emitting element 2
は全て蛍光部材3で囲まれることとなり、発光素子2から発せられる横方向の光、すなわち実装基板1の表面と略平行に発せられる光も、蛍光部材3に入射させやすくなって、発光効率がさらに良好になるものである。 Becomes that all surrounded by the fluorescent member 3, the horizontal direction of the light emitted from the light emitting element 2, that is, the surface and the light emitted substantially in parallel to the mounting board 1 is also more likely to be incident on the fluorescent member 3, luminous efficiency it is intended to become even better. 【0067】(実施形態1−9)図9は本発明の請求項11に係る発光装置の実施の形態の一例を示すものであり、この発光装置は基本的には上記の(実施形態1)等と同様に形成されているが、本実施形態においては、発光素子2を略包囲するように蛍光部材3を配置している。 [0067] (Embodiment 1-9) FIG. 9 shows an example of an embodiment of a light emitting device according to claim 11 of the present invention, the light emitting device is basically of the above (Embodiment 1) Although etc. are formed in the same manner as in the present embodiment, the light emitting element 2 is disposed a fluorescent member 3 so as to be substantially surrounded. 具体的には、光学部材4に設けた凹所9の内面に蛍光部材3を塗布するなどして配置すると共に、この凹所9内に発光素子2を配置することによって、蛍光部材3 More specifically, the placing, for example, by applying a fluorescent member 3 to the inner surface of the recess 9 provided in the optical member 4, by arranging the light emitting element 2 in the recess 9, the fluorescent member 3
で発光素子2を略包囲している。 It is substantially surround the light emitting element 2 in. また本実施形態においても、(実施形態1−8)と同様に、実装基板1に凹部6を凹設することなく発光素子2を搭載している。 Also in this embodiment, is equipped with a light-emitting element 2 without recessed recesses 6 Similarly, the mounting board 1 (Embodiment 1-8). 【0068】このように、実装基板1に凹部6を凹設することなく発光素子2を搭載してあると、発光素子2を光学部材4の凹所9内に配置させやすくなり、発光素子2の周囲(実装基板1側の面を除く)は全て蛍光部材3 [0068] Thus, if there is mounted a light-emitting element 2 without recessed recesses 6 on the mounting substrate 1, it becomes easy to arrange the light emitting element 2 in the recess 9 of the optical member 4, the light emitting element 2 around (except for the surface of the mounting substrate 1 side) all fluorescent member 3
で囲まれることとなり、発光素子2から出てきた光の多くを蛍光部材3に入射させて波長を変換させることができ、発光素子2からの光の利用効率を向上させることができるものである。 It and becomes surrounded by, a number of light emerging from the light emitting element 2 is incident on the fluorescent member 3 can be converted wavelength, it is capable of improving the utilization efficiency of light from the light emitting element 2 . なお、図9において発光素子2と蛍光部材3は接していないが、発光素子2と蛍光部材3は接していてもよい。 Although not in contact with the light emitting element 2 and the fluorescent member 3 in FIG. 9, the light emitting element 2 and the fluorescent member 3 may be in contact. 【0069】(実施形態1−10)図10は本発明の請求項12に係る発光装置の実施の形態の一例を示すものであり、この発光装置は基本的には上記の(実施形態1)等と同様に形成されているが、本実施形態においては、蛍光部材3の発光素子2側の面を、実装基板1に凹設した凹部6の開口面と略等しい大きさに形成している。 [0069] (Embodiment 1-10) Fig. 10 shows an example of an embodiment of a light emitting device according to claim 12 of the present invention, the light emitting device is basically of the above (Embodiment 1) Although etc. are similarly formed, in this embodiment, it forms a surface of the light emitting element 2 side of the fluorescent member 3, a substantially equal magnitude to the opening surface of the concave portion 6 that is recessed in the mounting board 1 . 具体的には、光学部材4の凹所9の開口縁と実装基板1の凹部6の開口縁を略同じ形状にして、両者を合致させている。 More specifically, the opening edge of the recess portion 6 of the opening edge and the mounting board 1 of the recess 9 of the optical member 4 at substantially the same shape, are made to match both. そして、上記の凹所9に蛍光部材3を充填すると、蛍光部材3の発光素子2側の面を凹部6の開口面と略等しい大きさにすることができる。 When filling the fluorescent member 3 to the recesses 9 can be made substantially equal magnitude to the surface of the light-emitting element 2 side of the fluorescent member 3 opening surface of the concave portion 6 and. 【0070】このようにしてあると、発光素子2から出てきた光の波長を変換する蛍光部材3の大きさを有効に制限することができ、できるだけ小さな疑似光源を得ることができるものである。 [0070] When a in this manner, the size of the fluorescent member 3 for converting a wavelength of light emerging from the light emitting element 2 can be effectively limit, in which can be as much as possible to obtain a small pseudo light source . よって、光学部材4において光取出し面19側の光学形状によって配光制御が行いやすくなり、所望の配光を実現することが容易となるものである。 Therefore, light distribution control becomes easy to carry out by the optical shape of the light extraction surface 19 side in the optical member 4, in which it is easy to realize a desired light distribution. さらに、蛍光部材3の発光素子2側の面を凹部6の開口面と略等しい大きさにしてあるので、蛍光部材3での発光径のぼやけがなくなり、配光制御性が良好となるものである。 Further, since the surface of the light emitting element 2 side of the fluorescent member 3 are made substantially equal in magnitude to the opening surface of the concave portion 6, there is no blurring of luminous diameter of a fluorescent member 3, in which the light distribution controllability is improved is there. 【0071】(実施形態1−11)図11は本発明の請求項13に係る発光装置の実施の形態の一例を示すものであり、この発光装置は基本的には上記の(実施形態1)等と同様に形成されているが、本実施形態においては、実装基板1に凹設する凹部6の内周面を、略放物面形状に形成してある。 [0071] (Embodiment 1-11) Fig. 11 shows an example of an embodiment of a light emitting device according to claim 13 of the present invention, the light emitting device is basically of the above (Embodiment 1) Although etc. are formed in the same manner as, in the present embodiment, the inner peripheral surface of the concave portion 6 recessed in the mounting substrate 1, it is formed in a substantially parabolic shape. そうして発光素子2から放射された光を上記略放物面形状の内周面で反射させることによって蛍光部材3へ入射可能にしている。 Then thereby enabling incident light emitted from the light emitting element 2 to the fluorescent member 3 by reflecting on the inner peripheral surface of the substantially parabolic shape. そうすると、図11において2本の矢印で示すように、蛍光部材3へ入射する光を全て平行光に近い状態にすることができ、蛍光部材3へ入射する光量を多く得ることができると共に、蛍光部材3の発光輝度分布を平均化することで、光取出し面19における色むらを抑えることができるものである。 Then, as shown by two arrows in FIG. 11, the light incident to the fluorescent member 3 all can be a state close to parallel light, it is possible to obtain much the quantity of light incident on the fluorescent member 3, a fluorescent by averaging the luminous intensity distribution of the member 3, in which it is possible to suppress color unevenness in the light extraction surface 19. 【0072】(実施形態1−12)図12は本発明の請求項14に係る発光装置の実施の形態の一例を示すものであり、この発光装置は基本的には上記の(実施形態1)等と同様に形成されているが、本実施形態においては、実装基板1に凹設する凹部6の内周面を、略楕円面形状に形成してある。 [0072] (Embodiment 1-12) Fig. 12 shows an example of an embodiment of a light emitting device according to claim 14 of the present invention, the light emitting device is basically of the above (Embodiment 1) Although etc. are formed in the same manner as, in the present embodiment, the inner peripheral surface of the concave portion 6 recessed in the mounting substrate 1, it is formed into a substantially ellipsoidal shape. そうして発光素子2から放射された光を上記略楕円面形状の内周面で反射させることによって蛍光部材3へ入射可能にしている。 Then thereby enabling incident light emitted from the light emitting element 2 to the fluorescent member 3 by reflecting on the inner peripheral surface of the substantially ellipsoidal shape. そうすると、図12において2本の矢印で示すように、蛍光部材3へ入射する光量を多く得ることができると共に、蛍光部材3 Then, as shown by two arrows in FIG. 12, it is possible to obtain much the quantity of light incident on the fluorescent member 3, the fluorescent member 3
の中心部へ集光させることができ、蛍光部材3での発光も中心部が高輝度となり、狭角配光性能を実現して、より点光源化することができるものである。 Can be condensed to the central emission at the fluorescence member 3 also center becomes high brightness, it realized a narrow-angle light distribution performance, in which it is possible to more point light source of. 【0073】(実施形態1−13)図13は本発明の請求項15に係る発光装置の実施の形態の一例を示すものであり、この発光装置は基本的には上記の(実施形態1)等と同様に形成されているが、本実施形態においては、発光装置を形成するにあたって、光学部材4と実装基板1とを離間させて両者の間に放熱のための間隙部2 [0073] (Embodiment 1-13) Fig. 13 shows an example of an embodiment of a light emitting device according to claim 15 of the present invention, the light emitting device is basically of the above (Embodiment 1) Although etc. are formed in the same manner as, in the present embodiment, the light emitting device in forming the optical member 4 and the mounting substrate 1 and the by spaced gap for heat radiation between the two 2
6を設け、この間隙部26と実装基板1の凹部6とが連通されるようにしている。 6 is provided, so that passed recesses 6 are communicated in the mounting substrate 1 and the gap 26. このようにすると、図13において点線矢印で示すような気体(通常は空気)の流れを容易に発生させることができ、凹部6の底面に載置した発光素子2が上記気体に晒されることによって、発光素子2の放熱を促進することが可能となり、発光装置の寿命を長く延ばすことができるものである。 In this way, by the gas as indicated by the dotted line arrow (usually air) can generate flow easily, the light emitting element 2 placed on the bottom surface of the recess 6 is exposed to the gas in FIG. 13 , it is possible to promote the heat dissipation of the light emitting element 2, in which the life of the light emitting device can be extended long. 【0074】(実施形態1−14)図14は本発明の請求項16に係る発光装置の実施の形態の一例を示すものであり、この発光装置は基本的には上記の(実施形態1)等と同様に形成されているが、本実施形態においては、実装基板1と発光素子2とを電気的に接続した後に、シリコーン樹脂等の透光性樹脂27によって発光素子2を封止している。 [0074] (Embodiment 1-14) Fig. 14 shows an example of an embodiment of a light emitting device according to claim 16 of the present invention, the light emitting device is basically of the above (Embodiment 1) Although etc. are formed in the same manner as, in the present embodiment, after electrically connecting the mounting substrate 1 and the light emitting element 2, to seal the light emitting element 2 by the translucent resin 27 such as silicone resin there. ここで、透光性樹脂27としては、屈折率が空気より大きく、発光素子2より小さいものが好ましい。 Examples of the translucent resin 27, the refractive index is greater than air, smaller than the light emitting element 2 is preferred. さらに封止した後の透光性樹脂27の光取出し面19側の面は曲面形状となるように形成してある。 Furthermore the surface of the light extraction surface 19 side of the translucent resin 27 after sealing is are formed to have a curved shape. 曲面形状としては、特に限定されるものではないが、例えば半球状の凸曲面形状を挙げることができる。 The curved shape, but it is not particularly limited, and may be, for example, hemispherical convex curved shape. 【0075】このように透光性樹脂27で発光素子2を封止することによって、発光素子2の外部への光の取出し効率を高めることができるものであり、さらに透光性樹脂27の表面を曲面とすることによって、透光性樹脂27と空気との界面で全反射する光の成分を減少させることができ、さらに光の取出し効率を増加させることができて、発光素子2からの光の利用効率を増大させることができるものである。 [0075] By sealing the light emitting element 2 thus a translucent resin 27, which can increase the light extraction efficiency of the light emitting element 2 externally further surface of the translucent resin 27 the by a curved surface, it is possible to reduce the component of the light totally reflected at the interface between the translucent resin 27 and air, and it is possible to further increase the extraction efficiency of light, the light from the light emitting element 2 in which it is possible to increase utilization efficiency. 【0076】(実施形態1−15)図15は本発明の請求項17に係る発光装置の実施の形態の一例を示すものであり、この発光装置は基本的には(実施形態1)等と同様に形成されているが、本実施形態においては、蛍光部材3と発光素子2との間に反射防止膜28を介在させてある。 [0076] (Embodiment 1-15) Fig. 15 shows an example of an embodiment of a light emitting device according to claim 17 of the present invention, the light emitting device is basically the like (Embodiment 1) It has been similarly formed, in this embodiment, are the anti-reflection film 28 is interposed between the fluorescent member 3 and the light emitting element 2. 反射防止膜28としては、発光素子2の発光に対する蛍光部材3表面の光反射率を低下させ、かつ蛍光部材3中への入射量を増加させるものであれば、特に限定されるものではないが、例えばSiO 膜/TiO The antireflection film 28 reduces the light reflectance of the fluorescent member 3 surface for light emission of the light emitting element 2, and as long as it increases the amount of incident to the fluorescent member 3 in, but not limited , for example, SiO 2 film / TiO 2
膜の組み合わせからなる光学多層膜を交互に複数層形成したものを用いることができる。 It can be used with a plurality of layers forming an optical multilayer film comprising a combination of film alternately. そして、このような反射防止膜28を蛍光部材3の発光素子2側の面に形成することによって、蛍光部材3と発光素子2との間に反射防止膜28を介在させることができる。 Then, by forming such a reflection preventing film 28 on the surface of the light emitting element 2 side of the fluorescent member 3, it can be interposed an anti-reflection film 28 between the fluorescent member 3 and the light emitting element 2. この際、光学部材4の実装基板1側の面のうち、反射防止膜28を形成した箇所以外の面にアルミ蒸着を行うこともできる。 In this case, among the mounting substrate 1-side surface of the optical member 4, it is also possible to perform the aluminum deposited on a surface other than the portion forming the antireflection film 28. 【0077】上記のように蛍光部材3と発光素子2との間に反射防止膜28を介在させると、発光素子2から出た光のうち、蛍光部材3中へ入射する光量を増加させることができ、発光素子2の効率を増大させることができるものである。 [0077] When an intervening anti-reflective film 28 between the fluorescent member 3 as described above and the light emitting element 2, of the light emitted from the light emitting element 2, to increase the amount of light incident on the fluorescent member 3 in it can, is capable of increasing the efficiency of the light emitting element 2. また光学部材4の実装基板1側の面のうち、反射防止膜28を形成した箇所以外の面にアルミ蒸着を行うと、さらに光の取出し効率を増加させることができるものである。 Of the mounting substrate 1-side surface of the optical member 4, when the aluminum deposited on a surface other than the portion forming the antireflection film 28, in which it is possible to further increase the light extraction efficiency. 【0078】(実施形態1−16)図16は本発明の請求項18に係る発光装置の実施の形態の一例を示すものであり、この発光装置は基本的には(実施形態1)等と同様に形成されているが、本実施形態においては、蛍光部材3と光学部材4との間に光拡散材29を介在させてある。 [0078] (Embodiment 1-16) Fig. 16 shows an example of an embodiment of a light emitting device according to claim 18 of the present invention, the light emitting device is basically the like (Embodiment 1) It has been similarly formed, in this embodiment, are interposed a light diffusing material 29 between the fluorescent member 3 and the optical member 4. 光拡散材29としては、発光素子2又は蛍光部材3からの光を散乱させるものであれば、特に限定されるものではないが、例えば大きさ1〜2μm程度のSiO The light diffusing member 29, so long as it is capable of scattering light from the light emitting element 2 or the fluorescent member 3, but are not particularly limited, for example, about the size 1~2μm of SiO
微粒子を用いることができる。 It is possible to use a 2 fine particles. また、蛍光部材3と光学部材4との間に光拡散材29を介在させるにあたっては、例えば図16に示すように、光学部材4の凹所9の内面に光拡散材29を塗布するなどして配置した後、ここにさらに蛍光部材3を充填することによって行うことができる。 Furthermore, when interposing a light diffusing material 29 is provided between the fluorescent member 3 and the optical member 4, as shown in FIG. 16, for example, by applying a light diffusing material 29 to the inner surface of the recess 9 of the optical member 4 after placement Te, it can be carried out by further filling the fluorescent member 3 here. 【0079】上記のように蛍光部材3と光学部材4との間に光拡散材29を介在させると、発光素子2から発せられた光や蛍光部材3から発せられた光が拡散光となるため、角度ごとでの色特性が緩和されることとなり、光取出し面19での色むらを抑えることができるものである。 [0079] When interposing a light diffusing material 29 between the fluorescent member 3 and the optical member 4 as described above, since the light emitted from the light or fluorescent member 3 emitted from the light emitting element 2 becomes diffused light , it becomes the color characteristics at each angle is relaxed, in which it is possible to suppress color unevenness in the light extraction surface 19. 【0080】以上の(実施形態1)〜(実施形態1−1 [0080] The above (Embodiment 1) to (Embodiment 1-1
6)において、透明ガラス等の無機透明材料を用いて光学部材4を形成することができる。 In 6), it is possible to form the optical member 4 using an inorganic transparent material such as transparent glass. これによって、光学部材4の耐候性を良好にすることができ、蛍光部材3から出てきた光による光学部材4の劣化を、ガラス等の無機材料によって抑えることができるものである。 This makes it possible to improve the weather resistance of the optical member 4, in which the deterioration of the optical member 4 due to the light coming out of the fluorescent member 3 can be suppressed by an inorganic material such as glass. 発光素子2として、青色光を放射するLEDチップ(青色LE As the light emitting element 2, LED chip (blue LE that emits blue light
D)を用いる場合はもちろん、特に、紫外線を放射するLEDチップ(紫外LED)を用いる場合に有効である。 When using a D) of course, it is particularly effective in the case of using the LED chip (ultraviolet LED) that emits ultraviolet rays. また、光学部材4の熱膨張を少なくすることもできるものである。 Further, those which can also reduce the thermal expansion of the optical member 4. 【0081】(実施形態2)図17は本発明に係る発光装置の実施の形態の他例を示すものであり、この発光装置は以下のように形成されている。 [0081] (Embodiment 2) FIG. 17 shows another example of the embodiment of the light-emitting device according to the present invention, the light emitting device is formed as follows. 【0082】すなわち、実施形態1と同様に、実装基板1はプリント配線板等で形成されるものであり、この実装基板1には凹部6が凹設されると共に、この凹部6にLEDチップ等の発光素子2が搭載され、実装基板1と発光素子2とが電気的に接続されている。 [0082] That is, similarly to Embodiment 1, the mounting board 1 is intended to be formed with the printed wiring board or the like, the recess 6 is recessed in the mounting board 1, LED chips in the concave portion 6 emitting element 2 is mounted in a mounting substrate 1 and the light emitting element 2 are electrically connected. 【0083】実装基板1には、発光素子2を覆うようにして、半球状のドーム5が着脱自在に装着されている。 [0083] The mounting substrate 1 so as to cover the light emitting element 2, the dome 5 hemispherical is mounted detachably.
このとき発光素子2はドーム5の略中心にあり、またこのドーム5は、蛍光体等の蛍光部材3を含む、樹脂やガラス等の透明物質で形成されるものであり、肉厚は略一定にしている。 This time is in the approximate center of the light emitting element 2 is dome 5 and the dome 5 comprises a fluorescent member 3 such as phosphor, which is formed of a transparent material such as resin or glass, the thickness is substantially constant I have to. 【0084】このように、半球状のドーム5を実装基板1に装着することによって、発光装置を形成することができるものであるが、このドーム5を実装基板1に対して着脱自在にするにあたっては、以下のようにして行うことができる。 [0084] Thus, by mounting the dome 5 semispherical the mounting board 1, when it is capable of forming a light-emitting device, to removably this dome 5 to the mounting substrate 1 it can be performed as follows. 例えば、図17に示すように、ドーム5 For example, as shown in FIG. 17, the dome 5
の開口縁に沿って、この開口縁の幅と略同一の幅を有する凹欠部13を実装基板1の表面に凹設しておくものである。 Along the opening edge, but to keep recessed a concave portion 13 having a width substantially the same width of the opening edge on the surface of the mounting substrate 1. このようにしておくと、実装基板1の凹欠部13 If you leave this way, concave portion 13 of the mounting board 1
の底面にドーム5の開口縁を載置すると同時に、ドーム5の開口縁が凹欠部13の対向する内周面で挟持されることとなり、ドーム5と実装基板1とを嵌合によって装着することができるものである。 Bottom surface at the same time placing the opening edge of the dome 5, will be clamped at the inner peripheral surface of the opening edge of the dome 5 is opposed concave portion 13, it is mounted by fitting the dome 5 and the mounting board 1 it is what it is. しかも、このような嵌合構造であると、ドーム5を実装基板1から取り外すにあたっては、両者を離間する方向に引っ張ることによって行うことができるものであり、実装基板1に対するドーム5の着脱が自在となるものである。 Moreover, if it is such a fitting structure, when remove the dome 5 from the mounting substrate 1, which can be done by pulling in a direction away both universal attachment and detachment of the dome 5 with respect to the mounting board 1 and it serves as a. ここで、凹欠部13の内周面を、奥ほど広がるようにして若干傾斜させて形成しておくと、つまり、テーパ状に形成しておくと、ドーム5の開口縁に対して凹欠部13の内周面が弾接することによって、実装基板1からドーム5が不用意に外れるのを防止することができるものである。 Here, the inner circumferential surface of the concave portion 13, the preliminarily formed by slightly inclined so as to spread as far, that is, when the previously formed in a tapered shape, concave with respect to the opening edge of the dome 5 by the inner peripheral surface of the part 13 makes elastic contact, dome 5 from the mounting board 1 is capable of preventing the coming off inadvertently. 【0085】そして、上記のようにして形成した発光装置にあって、最も劣化の早い蛍光体等の蛍光部材3はドーム5にのみ含まれており、しかもこのドーム5は実装基板1に対して着脱自在であるため、蛍光部材3の劣化によって発光装置の性能が低下した場合には、実装基板1はそのままにして、ドーム5を新しいものに取り替えるだけでよく、これによって蛍光部材3が未劣化の新しいものに交換され、発光装置の性能が回復し商品としての寿命を延ばすことができるものである。 [0085] Then, in the light emitting device formed as described above, most fluorescent member 3 early phosphors such degradation is included only on the dome 5, yet with respect to the dome 5 is mounted board 1 because it is detachable, if the performance of the light emitting device due to deterioration of the fluorescent member 3 is lowered, the mounting substrate 1 intact, it is only replaced with a new dome 5, whereby non-deteriorated fluorescent member 3 it is replaced with a new one of the one in which the performance of the light emitting device can extend the life of the product recovered. 【0086】さらに、本実施形態においては、蛍光部材3を含むドーム5を半球状にすると共に、その肉厚を略一定にして形成しているため、このドーム5の略中心に位置する発光素子2からドーム5の内面及び外面に至るまでの距離が、いずれの方角についても略等しくなり、 [0086] Further, in the present embodiment, since as well as the dome 5 comprising a fluorescent member 3 hemispherical, is formed with its thickness substantially constant, the light emitting element located substantially at the center of the dome 5 distance from 2 up to the inner and outer surfaces of the dome 5 is substantially equal for any direction,
発光装置をいずれの角度から観察しても、色むらが生じることがなくなるものである。 Even by observing the light emitting device from any angle, in which it is eliminated the color unevenness. 【0087】(実施形態3)図18は本発明に係る発光装置の実施の形態のさらに他例を示すものであり、この発光装置は以下のように形成されている。 [0087] (Embodiment 3) FIG. 18 is shows still another example of the embodiment of the light-emitting device according to the present invention, the light emitting device is formed as follows. 【0088】すなわち、実施形態1及び2と同様に、実装基板1はプリント配線板等で形成されるものであり、 [0088] That is, as in Embodiment 1 and 2, the mounting board 1 is intended to be formed with the printed wiring board or the like,
この実装基板1には凹部6が凹設されると共に、この凹部6にLEDチップ等の発光素子2が搭載され、実装基板1と発光素子2とが電気的に接続されている。 With recesses 6 is recessed in the mounting substrate 1, the light emitting element 2 such as an LED chip in the concave portion 6 is mounted, the mounting substrate 1 and the light emitting element 2 are electrically connected. 【0089】そして、この凹部6に蛍光体等の蛍光部材3を充填すると共に、透明材料を用いて形成された蓋7 [0089] Then, the lid 7 with, formed using a transparent material filling the fluorescent member 3 such as phosphor in the recess 6
が、上記の凹部6を密閉するようにして、実装基板1に着脱自在に装着されている。 But so as to seal the recess 6 mentioned above, is detachably mounted on the mounting substrate 1. このとき発光素子2は、図18のように蛍光部材3内に埋没していればよく、凹部6の内部をすべて蛍光部材3で満たす必要はない。 Emitting element 2 at this time has only to be buried in the fluorescent member 3 as shown in FIG. 18, it is not necessary to fill in all the autofluorescence member 3 of the recess 6. 【0090】上記のようにして発光装置を形成することができるものであるが、蓋7を実装基板1に対して着脱自在にするにあたっては、以下のようにして行うことができる。 [0090] Although it is capable of forming a light-emitting device as described above, in order to detachable lid 7 with respect to the mounting substrate 1 may be performed as follows. 例えば、図18に示すように、実装基板1の凹部6を略すり鉢状に形成しておくと共に、このすり鉢状の凹部6の内周面の途中に切欠段部14を形成しておくものである。 For example, as shown in FIG. 18, the previously formed recesses 6 of the mounting board 1 in a substantially conical shape, intended to be formed a cutout step portion 14 in the middle of the inner peripheral surface of the cone-shaped recess 6 is there. ここで、この切欠段部14は、凹部6の底面と略平行な載置面16を有し、またこの載置面16に略垂直な内面部15を有するように形成されている。 Here, the cutout step portion 14 is formed to have a bottom face substantially has parallel mounting side 16, also substantially vertical inner surface 15 on the mounting surface 16 of the recess 6. このようにしておくと、切欠段部14の載置面16に蓋7 If you leave this way, the lid 7 on the mounting surface 16 of the cut-out step portion 14
の裏面の周縁を載置すると同時に、切欠段部14の内面部15と蓋7の周縁の側面とが当接することとなり、蓋7と実装基板1とを嵌合によって装着することができるものである。 Simultaneously placing the backside of the periphery, as it can be a side surface of the periphery of the inner surface portion 15 and the cover 7 of the cutout step portion 14 becomes able to abut, it is mounted by fitting a lid 7 and the mounting board 1 is there. しかも、このような嵌合構造であると、蓋7を実装基板1から取り外すにあたっては、蓋7を凹部6から引っ張り出すことによって行うことができるものであり、実装基板1に対する蓋7の着脱が自在となるものである。 Moreover, if it is such a fitting structure, when the removing the lid 7 from the mounting substrate 1, which can be done by pulling the lid 7 from the recess 6, is detachable lid 7 with respect to the mounting board 1 and it serves as a freely. ここで、切欠段部14の内面部15を、奥ほど広がるようにして若干傾斜させて形成しておくと、つまり、テーパ状に形成しておくと、切欠段部14の内面部15と蓋7の周縁の側面とが弾接することによって、 Here, the inner surface portion 15 of the cutout step portion 14, the preliminarily formed slightly tilted so as to spread as far, that is, when the previously formed in a tapered shape, the inner surface portion 15 of the cut-out step portion 14 and the lid 7 and the side surface of the periphery of the fact that the elastic contact,
実装基板1から蓋7が不用意に外れるのを防止することができるものである。 The lid 7 from the mounting board 1 is what can be prevented from unexpectedly detached. 【0091】そして、上記のようにして形成した発光装置にあって、最も劣化の早い蛍光体等の蛍光部材3は凹部6内にあり、この凹部6は着脱自在な蓋7によって密閉されているため、蛍光部材3の劣化によって発光装置の性能が低下した場合には、一旦蓋7を取り外し、劣化した蛍光部材3を凹部6内から除去した後、未劣化の新しい蛍光部材3を凹部6内に充填し、再度蓋7を装着すればよく、これによって蛍光部材3が新しいものに交換され、発光装置の性能が回復し商品としての寿命を延ばすことができるものである。 [0091] Then, in the light emitting device formed as described above, most fluorescent member 3 early phosphors such degradation is in the recess 6, the recess 6 is sealed by a removable lid 7 Therefore, if the performance of the light emitting device due to deterioration of the fluorescent member 3 is lowered, temporarily removing the lid 7, after removal of the fluorescent member 3 which is deteriorated from within the recess 6, a new fluorescent member 3 of non-deteriorated recess 6 was filled in, it may be attached to cover 7 again, thereby fluorescent member 3 is replaced with a new one, in which the performance of the light emitting device can extend the life of the product recovered. 【0092】さらに、本実施形態においては、凹部6内の発光素子2が隠れる程度に蛍光部材3を凹部6に充填すればよいので、実施形態1や実施形態2に比べて、使用する蛍光部材3の量が少なくて済むと共に、この少量の蛍光部材3のみを交換すればよいので、製造・交換コストを低減することができるものである。 [0092] Further, in the present embodiment, since the fluorescent member 3 to the extent that the light emitting element 2 in the recess 6 is hidden it may be filled into the recess 6, as compared with Embodiment 1 and Embodiment 2, a fluorescent member used with only a small amount of 3, since it is sufficient to replace only the small amount of the fluorescent member 3, in which it is possible to reduce the manufacturing and replacement costs. しかも、本実施形態においては、実施形態1の光学部材4のように実装基板1の表面に載置したり、あるいは実施形態2のドーム5のように実装基板1の表面から突出したりするような部品を必要としないので、発光装置をより薄型にすることができるものである。 Moreover, in the present embodiment, as or protrude from the surface of the mounting substrate 1 as mounted or placed on the surface of the substrate 1, or the dome 5 in the second embodiment as the optical member 4 of Embodiment 1 It does not require a component, in which the light-emitting device more can be thin. 【0093】 【実施例】以下、本発明を実施例によって具体的に説明する。 [0093] EXAMPLES Hereinafter, the present invention will be described examples specifically. 【0094】(実施例1)図19に本発明の請求項3に係る発光装置を示す。 [0094] A light emitting device according to claim 3 of the present invention (Embodiment 1) FIG. 発光素子2として、青色LEDを用い、これを実装基板1に凹設した凹部6にフェースダウン実装した。 As the light emitting element 2, a blue LED, and face-down mounted in a recess 6 which is recessed so the mounting board 1. 一方、蛍光部材3として、YAG蛍光体を混ぜたシリコーン樹脂を用いると共に、光学部材4として、透光性のアクリル樹脂で形成されたものを用い、 On the other hand, used as the fluorescent member 3, together with a silicone resin mixed with YAG phosphors, as an optical member 4, those formed with translucent acrylic resin,
上記蛍光部材3を光学部材4に設けた凹所9に充填した後、凹所9の開口を透光性樹脂で形成した蓋体30で蓋をした。 After filling the recess 9 provided with the fluorescent member 3 in the optical member 4 and then capped with a lid member 30 forming the opening of the recess 9 in the translucent resin. ここで、上記YAG蛍光体は、青色光で励起されて黄色光を放射する黄色発光蛍光体であり、また上記シリコーン樹脂としては、光学部材4を形成するアクリル樹脂と略同じ屈折率を有するものを用いた。 Here, the YAG phosphor is excited by blue light and yellow light emitting phosphor emits yellow light, and as the above-mentioned silicone resin, having substantially the same refractive index as the acrylic resin forming the optical member 4 It was used. 蛍光部材3として用いる樹脂の種類は、本実施例に限定されるものではないが、光学部材4と同一材料であるか、あるいは光学部材4と屈折率が近い材料を用いる方が、配光制御の点で望ましい。 The type of resin used as the fluorescent member 3 is not limited to this embodiment, the optical member 4 and either of the same material, or better the optical member 4 and the refractive index is used near material, light distribution control desirable in terms of. 【0095】そして、光学部材4に含ませた蛍光部材3 [0095] Then, the fluorescent member 3 was included in the optical member 4
を発光素子2に対向配置させることによって、発光装置を形成した。 By opposed to the light emitting element 2 to form a light-emitting device. この際、図19においては図示省略しているが、光学部材4及び実装基板1の一部分を加工することによって、図1に示すような嵌合構造を上記発光装置に形成した。 In this case, although not shown in FIG. 19, by processing a portion of the optical member 4 and the mounting substrate 1, a fitting structure as shown in FIG. 1 formed on the light emitting device. これによって実装基板1から光学部材4を着脱するのが可能になった。 This consisted mounting board 1 to allow to attach and detach the optical member 4. 以下の実施例においても同様である。 The same applies to the following examples. 【0096】上記のようにして形成した発光装置にあって、青色LEDを発光させると、この青色LEDから発せられた青色光が、蛍光部材3へ入射してこれを励起すると共に、蛍光部材3が黄色光を発することとなり、結局、青色光と黄色光の2色が混色することによって白色光を発光させることができた。 [0096] In the light emitting device formed as described above, when light is emitted a blue LED, together with the blue light emitted from the blue LED excites this by entering the fluorescent member 3, the fluorescent member 3 There will be emitted yellow light, eventually, it was possible to emit white light by two-color blue light and yellow light are mixed. 【0097】(実施例2)図20に本発明の請求項4に係る発光装置を示す。 [0097] (Example 2) shows a light emitting device according to claim 4 of the present invention in FIG. 20. 蛍光部材3を発光素子2の直上位置に配置することにより、蛍光部材3を発光素子2に最も近い位置に配置した以外は、実施例1と同様にして発光装置を形成した。 By disposing the fluorescent member 3 to a position immediately above the light emitting element 2, except that disposed fluorescent member 3 at a position closest to the light emitting element 2 to form a light-emitting device in the same manner as in Example 1. 【0098】実施例1と同様の効果が得られた上に、蛍光部材3への光の入射量が増加し、発光効率が良好になった。 [0098] On the obtained the same effect as in Example 1, increases the amount of light incident to the fluorescent member 3, luminous efficiency was improved. 【0099】(実施例3)図21に本発明の請求項5に係る発光装置を示す。 [0099] A light emitting device according to claim 5 of the present invention (Embodiment 3) FIG 21. 光学部材4の形状を砲弾型の凸レンズ形状にした以外は、実施例2と同様にして発光装置を形成した。 Except that the shape of the optical member 4 in a convex lens shape of the bullet type, to form a light-emitting device in the same manner as in Example 2. 【0100】実施例2と同様の効果が得られた上に、配光制御を容易に行うことができた。 [0100] On the same effects as in Example 2 were obtained, it was possible to easily light distribution control. 【0101】(実施例4)図22に本発明の請求項5に係る発光装置の他例を示す。 [0102] illustrates another example of a light-emitting device according to claim 5 of the present invention (Embodiment 4) Figure 22. 実装基板1に複数の凹部6 Implementation plurality of recesses 6 in the substrate 1
を凹設して各凹部6に発光素子2をフェースダウン実装すると共に、光学部材4として、光取出し面19に各発光素子2に対応する凸レンズ形状を形成したマルチレンズを用いた以外は、実施例2と同様にして発光装置を形成した。 The light emitting element 2 with mounted face-down in the recesses 6 and recessed to, as an optical member 4, except for using a multi-lens forming a convex lens shape corresponding to the light emitting element 2 to the light extraction surface 19 is performed to form a light-emitting device in the same manner as in example 2. 【0102】実施例3と同様の効果が得られた上に、複数の光源を用いることでより多くの光量を照射することができた。 [0102] On the effect similar to that of Example 3 was obtained, it was possible to irradiate a more amount of light by using a plurality of light sources. しかも複数の凸レンズ形状を一体成形できるので加工が容易であった。 Moreover machining was easy since a plurality of convex lens shape can be integrally molded. 【0103】(実施例5)図23に本発明の請求項6に係る発光装置を示す。 [0103] A light emitting device according to claim 6 of the present invention (Embodiment 5) Figure 23. 光学部材4として以下の形状を有するものを用いた以外は、実施例2と同様にして発光装置を形成した。 Except for using those having the shape as an optical member 4 to form a light-emitting device in the same manner as in Example 2. すなわち光学部材4の形状は、光取出し面19が平坦であり、その反対側には円錐台状の凸部2 That shape of the optical member 4, the light extraction surface 19 is flat, truncated cone-shaped convex portion 2 on the opposite side
2を設けた形状である。 2 is a shape provided with. 凸部22の先端部21は平坦であって、その略中心には凹所9を設けてある。 The distal end portion 21 of the protrusion 22 is a flat, at its substantially central is provided with a recess 9. 【0104】実施例2と同様の効果が得られた上に、蛍光部材3よりほぼ横方向へ出てくる光(図23において矢印ロ)を凸部22の外側面20で全反射させて有効に光取出し面19から取り出すことができた。 [0104] On the effect similar to that of Example 2 was obtained, the effective substantially transverse to the emerging light (the arrow B in FIG. 23) is totally reflected by the outer surface 20 of the protrusion 22 from the fluorescent member 3 It could be removed from the light extraction surface 19. 【0105】(実施例6)図24に本発明の請求項7に係る発光装置を示す。 [0105] A light emitting device according to claim 7 of the present invention (Embodiment 6) FIG. 光学部材4の実装基板1側の面において凹所9の開口以外にアルミ蒸着を行って反射部2 Reflectors 2 performs aluminum deposition other than the opening of the recess 9 in the plane of the mounting substrate 1 side of the optical member 4
3を設けた以外は、実施例5と同様にして発光装置を形成した。 3 except that was provided to form a light-emitting device in the same manner as in Example 5. アルミ蒸着によって高反射率を有する反射面を形成することができた。 It was possible to form a reflecting surface having a high reflectance by aluminum vapor deposition. 【0106】実施例5と同様の効果が得られた上に、光学部材4内から実装基板1側へ抜け出る光がなくなり、 [0106] On the effects similar to those of Example 5 were obtained, there is no light exiting from the optical member within 4 to the mounting board 1 side,
発光効率をさらに向上させることができた。 It was possible to further improve the luminous efficiency. 【0107】(実施例7)図25に本発明の請求項7に係る発光装置の他例を示す。 [0107] illustrates another example of a light-emitting device according to claim 7 of the present invention (Embodiment 7) FIG. 光学部材4として以下の形状を有するものを用いた以外は、実施例6と同様にして発光装置を形成した。 Except for using those having the shape as an optical member 4 to form a light-emitting device in the same manner as in Example 6. すなわち光学部材4の形状は、光取出し面19が平坦であり、その反対側には外側面20 That shape of the optical member 4, the light extraction surface 19 is flat, the outer surface 20 on the opposite side
の周囲に段差部(変曲点)38を有する凸部22を設けた形状である。 Of a shape having a convex portion 22 having a step portion (inflection point) 38 around. 光取出し面19に対して、段差部38から光取出し面19側の外側面20の傾斜は緩やかとなるように、また段差部38から凸部22の先端部21側の外側面20の傾斜は急となるように、凸部22を設けている。 With respect to the light extracting surface 19, so that the inclination of the outer surface 20 of the light extraction surface 19 side from the stepped portion 38 becomes gentle, and the slope of the tip portion 21 side of the outer surface 20 of the projection 22 from the stepped portion 38 as it will be sudden, and a protrusion 22 provided. 【0108】実施例6と同様の効果が得られた上に、以下のような効果を得ることもできた。 [0108] On thus obtained an effect similar to that of Example 6, it was possible to obtain the following effects. すなわち蛍光部材3より出た光のうち、光取出し面19へ向かうもの(図25において矢印イ)はそのまま直接光取出し面19から外部へ取り出され、またほぼ横方向へ向かうもの(図25において矢印ロ)は、傾斜の急な凸部22の外側面20で反射された後に光取り出し面19から外部へ取り出され、さらに一旦光取出し面19へ向かうものの、光取出し面19で全反射されて戻ってくるもの(図25において矢印ハ)は、傾斜の緩やかな凸部22の外側面2 That of the light emitted from the fluorescent member 3, which toward the light extraction surface 19 (arrow i in Fig. 25) is as directly extracted from the light extracting surface 19 to the outside, also the arrows (FIG. 25 which towards the substantially horizontal direction b) is extracted from the light extraction surface 19 to the outside after being reflected by the outer surface 20 of the sharp projections 22 of the inclined, although further once toward the light extraction surface 19, back is totally reflected by the light extracting surface 19 come those (arrow c in FIG. 25), the outer surface of the gentle projections 22 of the inclined 2
0で反射された後に光取出し面19から外部に取り出された。 0 were extracted from the light extracting surface 19 to the outside after being reflected by the. つまり、凸部22の外側面20を反射面として用いることにより、蛍光部材3より出た光のほぼ全てを向きを制御することができ、光を有効に取り出すことができた。 That is, by using the outer surface 20 of the projection 22 as a reflective surface, it is possible to control the orientation substantially all of the light emitted from the fluorescent member 3, could be taken to enable the light. 特に、光取出し面19より全反射して戻ってくる光も制御することができるため、光利用効率が向上するものと考えられる。 In particular, it is possible to light also control returning totally reflected from the light extraction surface 19, it is believed that light utilization efficiency is improved. 【0109】(実施例8)図26に本発明の請求項7に係る発光装置の他例を示す。 [0109] illustrates another example of a light-emitting device according to claim 7 of the present invention (Embodiment 8) FIG 26. 光学部材4として光取出し面19の一部として凸レンズ部31を形成した以外は、 Except for forming a convex lens portion 31 as a part of the light extraction surface 19 as the optical member 4,
実施例7と同様にして発光装置を形成した。 To form a light-emitting device in the same manner as in Example 7. 【0110】実施例7と同様の効果が得られた上に、以下のような効果を得ることもできた。 [0110] On thus obtained an effect similar to that of Example 7, it was possible to obtain the following effects. すなわち蛍光部材3より出た光のうち、特に光取出し面19へ向かう光(図26において矢印イ)を凸レンズ部31によって所定の方向に制御するのが容易となった。 That of the light emitted from the fluorescent member 3, especially made by the convex lens portion 31 light (arrow b in FIG. 26) toward the light extraction surface 19 is easy to control in a predetermined direction. つまり、光取出し面19の一部に凸レンズ部31を形成したことにより、蛍光部材3より発せられた光のほぼ全てを配光制御するのがさらに容易となり、所定の方向に光を有効に取り出すことができた。 In other words, by forming the convex lens portion 31 in a part of the light extraction surface 19, becomes even easier to light distribution control almost all of the light emitted from the fluorescent member 3, taken out effectively the light in a predetermined direction it could be. 【0111】(実施例9)図27に本発明の請求項7に係る発光装置の他例を示す。 [0111] illustrates another example of a light-emitting device according to claim 7 of the present invention (Embodiment 9) FIG 27. 光学部材4として段差部3 It stepped portion as an optical member 4 3
8の位置に切欠部32を形成した以外は、実施例8と同様にして発光装置を形成した。 Except that the notch 32 is formed in the 8 position, to form a light-emitting device in the same manner as in Example 8. 【0112】実施例8と同様の効果が得られた上に、以下のような効果を得ることもできた。 [0112] On the obtained the same effect as in Example 8, it was possible to obtain the following effects. すなわち蛍光部材3より出た光のうち、特に光取出し面19から斜め方向へ抜けていた光まで配光制御することができ、蛍光部材3より発せられた光の全てを配光制御するのがさらに容易となり、所定の方向に光を有効に取り出すことができた。 That of the light emitted from the fluorescent member 3, in particular from the light extraction surface 19 to the light missing the oblique direction can be controlled light distribution, to a light distribution control all of the light emitted from the fluorescent member 3 becomes easier, it could be taken to enable the light to a predetermined direction. 本実施例は、実施例7及び8に比べて、最も効率の良いものである。 This embodiment, as compared with Examples 7 and 8, is the most efficient. 【0113】(実施例10)図28に本発明の請求項8 [0113] Claim 8 of the present invention (Embodiment 10) FIG. 28
に係る発光装置を示す。 The light emitting device according to indicate. 低屈折部材25としてシリカエアロゲルを用い、これを光学部材4の凹所9の内面に設置した後、蛍光部材3を充填した以外は、実施例1と同様にして発光装置を形成した。 The silica airgel used as a low refractive member 25, after placing them on the inner surface of the recess 9 of the optical member 4, except filled with fluorescent member 3 to form a light-emitting device in the same manner as in Example 1. 【0114】実施例1と同様の効果が得られた上に、光学部材4の光取出し面19の凸レンズ形状をより緩やかにすることができた。 [0114] On the same effects as in Example 1 were obtained, it was possible to more gradual convex lens shape of the light extraction surface 19 of the optical member 4. 【0115】(実施例11)図29に本発明の請求項9 [0115] Claim of the present invention (Embodiment 11) FIG. 29 9
に係る発光装置を示す。 The light emitting device according to indicate. 光学部材4に半球状の凹所9を設けると共に、光学部材4の発光素子2側の面(凹所9 Provided with a hemispherical recess 9 in the optical member 4, the light emitting element 2 side surface of the optical member 4 (recess 9
を除く)と蛍光部材3の発光素子2側の面とが面一となるように、凹所9に蛍光部材3を充填した以外は、実施例1と同様にして発光装置を形成した。 The excluded) and so that the surface of the light emitting element 2 side of the fluorescent member 3 is flush, except filled with fluorescent member 3 in the recess 9, to form a light-emitting device in the same manner as in Example 1. 【0116】実施例1と同様の効果が得られた上に、角度ごとでの色特性が緩和されることにより、光取出し面19での色むらを抑えることもできた。 [0116] On the effects similar to those of Example 1 were obtained, by the color characteristics of a per angle is alleviated, it was possible to suppress color unevenness in the light extraction surface 19. 【0117】(実施例12)図30に本発明の請求項1 [0117] Claim 1 of the present invention (Embodiment 12) FIG. 30
0に係る発光装置を示す。 Showing a light emitting device according to 0. 蛍光部材3の光取出し面19 Light extraction surface 19 of the fluorescent member 3
側の面のみならず、蛍光部材3の発光素子2側の面も曲面に形成すると共に、実装基板1に凹部6を凹設することなく発光素子2をフェースダウン実装した以外は、実施例11と同様にして発光装置を形成した。 Not only the surface on the side, and forming a light-emitting element 2 side surface also the curved surface of the fluorescent member 3, except that the light-emitting element 2 without recessed recesses 6 on the mounting substrate 1 was mounted face down, Example 11 to form a light-emitting device in the same manner as. 【0118】実施例11と同様の効果が得られた上に、 [0118] On the effects similar to those of Example 11 were obtained,
発光素子2の周囲(実装基板1側の面を除く)は全て蛍光部材3で囲まれることとなり、発光素子2から発せられる横方向の光も、蛍光部材3に入射させやすくなって、発光効率がさらに良好になった。 Around the light emitting element 2 (except for the surface of the mounting substrate 1 side) becomes being surrounded on all fluorescent member 3, the horizontal direction of the light emitted from the light emitting element 2 is also more likely to be incident on the fluorescent member 3, the luminous efficiency There was even better. 【0119】(実施例13)図31に本発明の請求項1 [0119] Claim 1 of the present invention (Embodiment 13) Figure 31
1に係る発光装置を示す。 A light-emitting device according to 1. 光学部材4に設けた凹所9の内面に蛍光部材3を略均一な厚みで塗布すると共に、実装基板1に凹部6を凹設することなく発光素子2をフェースダウン実装した以外は、実施例1と同様にして発光装置を形成した。 While applying a substantially uniform thickness of the fluorescent member 3 to the inner surface of the recess 9 provided in the optical member 4, except that the light-emitting element 2 without recessed recesses 6 on the mounting substrate 1 was mounted face down, Example to form a light-emitting device in the same manner as 1. 【0120】実施例1と同様の効果が得られた上に、発光素子2から出てきた光の多くを蛍光部材3に入射させて波長を変換させることができ、発光素子2からの光の利用効率を向上させることができた。 [0120] On the same effects as in Example 1 were obtained, the number of light emerging from the light emitting element 2 is incident on the fluorescent member 3 can be converted to the wavelength, of the light from the light emitting element 2 I was able to improve the utilization efficiency. 【0121】(実施例14)図32に本発明の請求項1 [0121] Claim 1 of the present invention (Embodiment 14) FIG. 32
2に係る発光装置を示す。 A light-emitting device according to 2. 光学部材4の凹所9の開口縁と実装基板1の凹部6の開口縁を略同じ形状にして、両者を合致させた以外は、実施例1と同様にして発光装置を形成した。 In the substantially same shape opening edge of the recess portion 6 of the opening edge and the mounting board 1 of the recess 9 of the optical member 4, except that is matched both, to form a light-emitting device in the same manner as in Example 1. 【0122】実施例1と同様の効果が得られた上に、蛍光部材3での発光径のぼやけがなくなり、配光制御性が良好となった。 [0122] On the effects similar to those of Example 1 were obtained, no blurring of the emission diameter of a fluorescent member 3, the light distribution control properties were good. 【0123】(実施例15)図33に本発明の請求項1 [0123] Claim 1 of the present invention (Embodiment 15) Figure 33
3に係る発光装置を示す。 A light-emitting device according to 3. 実装基板1の凹部6の内周面を略放物面形状に形成すると共に、この内周面にアルミ蒸着を行って鏡面状の反射面(図示省略)を形成した以外は、実施例1と同様にして発光装置を形成した。 The inner peripheral surface of the concave portion 6 of the mounting substrate 1 so as to form the Ryakuho Surface Generation, except for forming a specular reflecting surface (not shown) performing aluminum evaporation on the inner peripheral surface, as in Example 1 to form a light-emitting device in a similar manner. 【0124】実施例1と同様の効果が得られた上に、蛍光部材3へ入射する光量を多く得ることができると共に、光取出し面19における色むらを抑えることができた。 [0124] On the effects similar to those of Example 1 were obtained, it is possible to obtain much the quantity of light incident on the fluorescent member 3, it was possible to suppress the color unevenness in the light extraction surface 19. 【0125】なお、発光素子2として面発光形LEDを用いると、図33に示すように、実装基板1の凹部6の内周面を略放物面形状にする必要なく、上記と同一の効果が得られることも確認した。 [0125] Note that a surface emitting type LED as the light emitting element 2, as shown in FIG. 33, without the need for the inner peripheral surface of the recessed portion 6 of the mounting board 1 on Ryakuho Surface Generation, the same effect also it confirmed that the obtained. 【0126】(実施例16)図34に本発明の請求項1 [0126] Claim 1 of the present invention (Embodiment 16) FIG. 34
3に係る発光装置の他例を示す。 It shows another example of a light-emitting device according to 3. 実装基板1として立体基板を用いると共にフリップチップ実装によって発光素子2を実装基板1に載置した以外は、実施例15と同様にして発光装置を形成した。 Except that a mounting board 1 mounting the light emitting element 2 to the mounting substrate 1 by flip-chip mounting with use of three-dimensional substrate to form a light-emitting device in the same manner as in Example 15. 本実施例においては、実装基板1の凹部6の内周面の大部分を覆うように、立体的な配線部18を形成することによって、この配線部18 In the present embodiment, so as to cover most of the inner peripheral surface of the concave portion 6 of the mounting board 1, by forming a three-dimensional wiring 18, the wiring portion 18
に反射部23としての役割も持たせている。 And then also have the role of as the reflective portion 23 in. 【0127】実施例15と同様の効果が得られた上に、 [0127] On the effects similar to those of Example 15 were obtained,
実装基板1として立体基板を用いることによって、凹部6の内周面に配線部18及び反射部23の両方を一度に形成することができて、発光装置を形成する効率を高めることができた。 By using a three-dimensional substrate as the mounting substrate 1, and it is possible to form both of the wiring portion 18 and the reflecting portion 23 on the inner peripheral surface of the concave portion 6 at a time, it was possible to increase the efficiency of forming the light-emitting device. 【0128】(実施例17)図35に本発明の請求項1 [0128] Claim 1 of the present invention (Example 17) Figure 35
4に係る発光装置を示す。 A light-emitting device according to 4. 実装基板1の凹部6の内周面を略楕円形状に形成した以外は、実施例15と同様にして発光装置を形成した。 The inner peripheral surface of the concave portion 6 of the mounting substrate 1 except for forming a substantially elliptical shape, to form a light-emitting device in the same manner as in Example 15. 【0129】実施例1と同様の効果が得られた上に、蛍光部材3へ入射する光量を多く得ることができると共に、より点光源化することができた。 [0129] On the effects similar to those of Example 1 were obtained, it is possible to obtain much the quantity of light incident on the fluorescent member 3, it was possible to more point light source of. 【0130】(実施例18)図36に本発明の請求項1 [0130] Claim 1 of the present invention (Embodiment 18) Figure 36
5に係る発光装置を示す。 A light-emitting device according to 5. 実装基板1の光学部材4側の面と光学部材4の実装基板1側の面とを密着させずに、 The optical member 4-side surface of the mounting substrate 1 and the mounting substrate 1-side surface of the optical member 4 without contact,
実装基板1と光学部材4と離間して間隙部26を形成した以外は、実施例1と同様にして発光装置を形成した。 Except that apart from the mounting substrate 1 and the optical member 4 to form a gap 26 to form a light-emitting device in the same manner as in Example 1.
さらに本実施例においては、上記のようにして形成した発光装置をアルミニウム製の筐体33内の底面に設置して収容した。 Furthermore, in the present embodiment was accommodated a light emitting device formed as described above was placed on the bottom of the aluminum housing 33. 発光装置の光取出し面19は筐体33の開口窓39を通して筐体33外から見えるようにしてある。 Light extraction surface 19 of the light emitting device are to look like from the housing 33 out through the opening window 39 of the housing 33. また筐体33の側壁には吸気口34及び排気口35 Also in the side wall of the housing 33 inlet 34 and the outlet 35
を設けておいた。 The it had provided. 【0131】実施例1と同様の効果が得られた上に、図36の点線矢印で示すように、吸気口34、間隙部2 [0131] On the effects similar to those of Example 1 were obtained, as shown by the dotted line arrow in FIG. 36, intake port 34, the gap 2
6、排気口35を通じて、空気の流れが自然に発生し、 6, through the exhaust port 35, the flow of air occurs naturally,
発光素子2の放熱を促進することができた。 It was possible to promote the heat dissipation of the light emitting element 2. 【0132】(実施例19)図37に本発明の請求項1 [0132] Claim 1 of the present invention (Embodiment 19) FIG. 37
5に係る発光装置の他例を示す。 It shows another example of a light-emitting device according to 5. 吸気口34にファン3 Fan 3 to the intake port 34
6を設置するようにした以外は、実施例18と同様にして発光装置を形成した。 Except that so as to install the 6, to form a light-emitting device in the same manner as in Example 18. なお、上記ファン36は、図3 Incidentally, the fan 36, FIG. 3
7の実線矢印で示すように回転させると、筐体33外から筐体33内へ空気を送り込めるように設置してある。 Rotation, as shown in 7 of the solid arrows, are installed such Okurikomeru air from outside the housing 33 into the housing 33. 【0133】実施例18と同様の効果が得られた上に、 [0133] On the effects similar to those of Example 18 were obtained,
ファン36を回転させることによって、図37の点線矢印で示すように、吸気口34、間隙部26、排気口35 By rotating the fan 36, as indicated by the dotted line arrow in FIG. 37, intake port 34, the gap 26, the exhaust port 35
を通じて、空気の流れを強制的に発生させることで、発光素子2の放熱をさらに促進することができた。 Through, by forcibly generating a flow of air, it was possible to further promote heat radiation of the light emitting element 2. 【0134】(実施例20)図38に本発明の請求項1 [0134] Claim 1 of the present invention (Embodiment 20) Figure 38
6に係る発光装置を示す。 A light-emitting device according to 6. フェースダウン実装によって実装基板1の凹部6の底面に発光素子2を載置した後、 After placing the light emitting element 2 to the bottom surface of the concave portion 6 of the mounting substrate 1 by face-down mounting,
これを透光性樹脂27であるシリコーン樹脂で封止した以外は、実施例14と同様にして発光装置を形成した。 Except that it was sealed with a silicone resin which is a light-transmitting resin 27 to form a light-emitting device in the same manner as in Example 14.
なお、封止後の透光性樹脂27の光取出し面19側の面は半球状の凸曲面形状に形成してある。 The surface of the light extraction surface 19 side of the translucent resin 27 after sealing is formed on the semispherical convex curved shape. 【0135】実施例14と同様の効果が得られた上に、 [0135] On the effects similar to those of Example 14 were obtained,
発光素子2からの光の利用効率を増大させることができた。 It was possible to increase the utilization efficiency of light from the light emitting element 2. 【0136】(実施例21)図39に本発明の請求項1 [0136] Claim 1 of the present invention (Embodiment 21) FIG. 39
7に係る発光装置を示す。 A light-emitting device according to 7. 蛍光部材3の発光素子2側の面に反射防止膜28を形成すると共に、光学部材の実装基板1側の面のうち反射防止膜28を形成していない箇所の面に光反射膜37を形成した以外は、実施例1と同様にして発光装置を形成した。 And forming a reflection preventing film 28 on the surface of the light emitting element 2 side of the fluorescent member 3, forming a light reflection film 37 on the surface of the portion formed with no anti-reflection film 28 of the mounting substrate 1-side surface of the optical member except that the, to form a light-emitting device in the same manner as in example 1. ここで、反射防止膜28 Here, the antireflection film 28
としては、発光素子2が放射する光の波長に対して、発光素子2側への反射が最小になるように、各々膜厚を制御したSiO 膜/TiO 膜の組み合わせからなる光学多層膜を交互に10層形成したものを用いた。 The, for the wavelength of the light emitting element 2 emits, as reflected to the light emitting element 2 side is minimized, the optical multilayer film consisting of a combination of SiO 2 film / TiO 2 film were each controlled thickness It was used after forming 10 layers alternately. また、 Also,
光反射膜37はアルミ蒸着を行うことによって形成した。 Light reflection film 37 was formed by performing aluminum deposition. 【0137】実施例1と同様の効果が得られた上に、光反射膜37による光取出し効率が増加する。 [0137] On the obtained the same effect as in Example 1, the light extraction efficiency due to the light reflection film 37 is increased. 【0138】(実施例22)図40に本発明の請求項1 [0138] Claim 1 of the present invention (Embodiment 22) Figure 40
8に係る発光装置を示す。 A light-emitting device according to 8. 光学部材4の凹所9の内面に光拡散材29を塗布して配置した後、蛍光部材3を充填した以外は、実施例1と同様にして発光装置を形成した。 After placing in the light diffusing material 29 is applied to the inner surface of the recess 9 of the optical member 4, except filled with fluorescent member 3 to form a light-emitting device in the same manner as in Example 1. 蛍光部材3の発光素子2側の面を除いて、蛍光部材3の周囲に光拡散材29が配置されている。 Except for the surface of the light emitting element 2 side of the fluorescent member 3, the light diffusing material 29 is arranged around the fluorescent member 3. ここで、光拡散材29としては、大きさ1〜2μm程度のSiO Here, as the light diffusing material 29, the order of magnitude of 1 to 2 [mu] m SiO 2
微粒子を用いた。 Using fine particles. 【0139】実施例1と同様の効果が得られた上に、角度ごとでの色特性が緩和されることとなり、光取出し面19での色むらを抑えることができた。 [0139] On the effects similar to those of Example 1 were obtained, it becomes possible to color characteristics at each angle is alleviated, it was possible to suppress the color unevenness in the light extraction surface 19. 【0140】なお、蛍光部材3及び光拡散材29の形状としては、図40に示すものに限定されるものではない。 [0140] Incidentally, the shape of the fluorescent member 3 and the light diffusing material 29, but the invention is not limited to that shown in Figure 40. すなわち円柱状や直方体状以外に、例えば図41に示すように、光学部材4の実装基板1側の面に半球状の凹所9を設け、この凹所9に光拡散材29及び蛍光部材3をこの順で充填することによって、蛍光部材3及び光拡散材29の形状を半球状とすることもできる。 That in addition to a cylindrical shape or a rectangular parallelepiped shape, for example, as shown in FIG. 41, a hemispherical recess 9 provided on the surface of the mounting substrate 1 side of the optical member 4, a light diffusing member 29 and the fluorescent member 3 in the recess 9 the by filling in this order, it may be the shape of the fluorescent member 3 and the light diffusing member 29 and hemispherical. このようにしても上記と同様の効果が得られることを確認した。 Also in this manner it was confirmed that the same effects can be obtained. 【0141】(実施例23)図42に本発明の請求項1 [0141] Claim 1 of the present invention (Embodiment 23) Figure 42
9に係る発光装置を示す。 Showing a light emitting device according to 9. 発光素子2として紫外LED Ultraviolet LED as a light-emitting element 2
2aを用い、また蛍光部材3として紫外線で励起されるRGB発光蛍光体3aを用い、さらに光学部材4として透明ガラスを用いた以外は、実施例1と同様にして発光装置を形成した。 Using 2a, also the RGB emitting phosphor 3a is excited by ultraviolet rays used as the fluorescent member 3, except that further using a transparent glass as an optical member 4 to form a light-emitting device in the same manner as in Example 1. 【0142】実施例1と同様の効果が得られた上に、発光素子2として紫外LED2aを用いた場合であっても、光学部材4の劣化を防止できることを確認した。 [0142] On the same effects as in Example 1 were obtained, even when using ultraviolet LED2a as a light-emitting element 2, it was confirmed that can prevent deterioration of the optical member 4. 【0143】 【発明の効果】上記のように本発明の請求項1に係る発光装置は、実装基板に発光素子を載置し、この発光素子の発光によって励起されると共に励起波長と異なる波長の光を放射する蛍光部材を備えて形成される発光装置において、蛍光部材を交換可能にしているので、蛍光部材の劣化によって発光装置の性能が低下した場合には、実装基板はそのままにして、蛍光部材を未劣化の新しいものに交換することによって、発光装置の性能が回復し商品としての寿命を延ばすことができるものである。 [0143] The light emitting device according to claim 1 of the present invention as described above according to the present invention is to mount the light emitting element mounting substrate, the wavelength different from the excitation wavelength while being excited by light emission of the light emitting element in the light-emitting device is formed with a fluorescent member for emitting light, since the replaceable fluorescent member, when the performance of the light emitting device is decreased by deterioration of the fluorescent member, the mounting substrate is intact, the fluorescence by exchanging member with a new one of the non-deteriorated, but the performance of the light emitting device can extend the life of the product recovered. 【0144】また請求項2の発明は、発光素子を載置した実装基板に、表面又は内部に蛍光部材を含んで形成される光学部材を着脱自在に装着しているので、蛍光部材の劣化によって発光装置の性能が低下した場合には、光学部材を新しいものに取り替えるだけでよく、これによって商品としての寿命を延ばすことができるものである。 [0144] The invention of claim 2 is the mounting substrate mounting the light emitting element, since wearing the optical member is formed to include a surface or inside the fluorescent member detachably, by deterioration of the fluorescent member If the performance of the light emitting device is decreased, you need only replace the optical member with a new one, whereby those which can prolong the life of the product. 【0145】また請求項3の発明は、フェースダウン実装によって実装基板に発光素子を載置すると共に、発光素子に光学部材を対向配置させているので、フェースアップ実装に比べて、導電性ワイヤーが不必要となり、発光素子に接しない範囲で、蛍光体や蛍光体を含む樹脂等の蛍光部材を、より発光素子に近付けることが可能となる。 [0145] The invention of claim 3 is configured to mount the light emitting element mounting substrate by face-down mounting, since the optical member is disposed opposite to the light emitting element, as compared with the face-up mounting, conductive wires It becomes unnecessary, in a range not in contact with the light emitting element, the fluorescent member such as a resin containing a phosphor or phosphor, it is possible to approach the more light-emitting elements. 従って、より正確で効果的な配光制御が可能となるものである。 Therefore, it is made possible to more accurate and efficient light distribution control. しかも、導電性ワイヤーにより発光の一部が遮られることによる光量ロスも起こらなくなり、蛍光部材への光の入射量が増加し、発光効率が良好になるものである。 Moreover, the light quantity loss is also no longer occur due to part of the light by the conductive wires is shielded, the amount of incident light to the fluorescent member is increased, but the emission efficiency is improved. 【0146】また請求項4の発明は、光学部材内において蛍光部材を発光素子に最も近い位置に配置しているので、蛍光部材への光の入射量が増加し、発光効率が良好になるものである。 [0146] The invention of claim 4, since the arrangement fluorescent member closest to the light emitting element in the optical member, the amount of incident light to the fluorescent member is increased, that the luminous efficiency is improved it is. 【0147】また請求項5の発明は、光学部材の形状が凸レンズ形状であるので、蛍光部材から出てくる光を所望の方向へ配光制御することができるものである。 [0147] The invention of claim 5, since the shape of the optical member is a convex lens shape, in which it is possible to light distribution control of light emerging from the fluorescent member in the desired direction. 【0148】また請求項6の発明は、蛍光部材によって波長が変換された光のうち、光学部材の光取出し面に向かう方向と異なる方向に放射された光を、光取出し面に向かう方向に全反射させる形状となるように光学部材を形成しているので、蛍光部材より横方向へ出てくる光を有効に外部に取り出すことができ、発光効率が良好になるものである。 [0148] The invention of claim 6, of the light wavelength has been converted by the fluorescent member, all the light emitted in a direction different from a direction toward the light extraction surface of the optical member, in a direction toward the light extraction surface since forming the optical member so that the shape for reflecting, can be extracted effectively outside the light emerging laterally from the fluorescent member, in which the luminous efficiency is improved. 【0149】また請求項7の発明は、光学部材の発光素子側の面に反射部を設けると共に、発光素子からの光を取り入れるための開口部を反射部に設けているので、発光素子からの光を全て反射部で全反射させることができ、それによって所定の方向へ配光制御することができるものである。 [0149] The invention of claim 7, provided with a reflection portion on a surface of the light emitting element side of the optical member, since the opening for introducing the light from the light emitting element is provided in the reflection portion, from the light emitting element can be totally reflected by all the light reflecting portion, thereby it is capable of light distribution control in a predetermined direction. また、反射部で全反射されることにより、実装基板側へ抜け出る光がなくなり、発光効率がさらに向上するものである。 Further, by being totally reflected by the reflection portion, there is no light exiting toward the mounting substrate, in which the luminous efficiency is further improved. また反射部は、光学部材と実装基板との間に設けてあるので、容易に触れられず、劣化や汚れを少なくすることができるものである。 The reflecting portion, so is provided between the mounting substrate and the optical member, not be easily touched, but it is possible to reduce the deterioration or contamination. さらに光学部材であれば容易に反射部を設けることができるものである。 In which it may further easily reflecting unit if the optical member. 【0150】また請求項8の発明は、光学部材が光学部材よりも低い屈折率を有する低屈折部材を備えると共に、蛍光部材を通過した光又は蛍光部材により波長が変換された光が低屈折部材を介して光学部材へ入射されるように低屈折部材を配置しているので、蛍光部材と光学部材との間に低屈折部材による界面ができ、光学部材の光取出し面のレンズ形状をより緩やかにすることができるものである。 [0150] The invention of claim 8 is provided with a low refractive member the optical member has a lower refractive index than the optical member, light wavelength by light or fluorescent member passing through the fluorescent member is converted low refractive member since placing a low refractive member as incident on the optical member through the can surface by low refractive member between the fluorescent member and the optical member, and more gently the lens shape of the light extraction surface of the optical member it is capable to. 【0151】また請求項9の発明は、発光素子からの光が蛍光部材中を略等しい光路長にて通過するように蛍光部材を形成しているので、色の角度特性を抑えることができ、光取出し面における色むらを低減することができるものである。 [0151] The invention of claim 9, the light from the light emitting element form a fluorescent member so as to pass in a substantially equal optical path lengths through the fluorescent member, it is possible to suppress the color angle characteristics, it is capable of reducing the color unevenness in the light extraction surface. 【0152】また請求項10の発明は、蛍光部材の光取出し面と蛍光部材の発光素子側の面のうち少なくとも一方を曲面に形成しているので、色の角度特性を抑えることができ、光取出し面における色むらを低減することができるものである。 [0152] The invention of claim 10, since at least one of a surface of the light emitting element side of the light extraction surface and the fluorescent member of the fluorescent member is formed into a curved surface, it is possible to suppress the color angle characteristics, light it is capable of reducing the color unevenness in the extraction surface. 【0153】また請求項11の発明は、発光素子を略包囲するように蛍光部材を配置しているので、発光素子からの光利用効率を向上させることができるものである。 [0153] The invention of claim 11, since the light-emitting elements are arranged a fluorescent member so as to be substantially surrounds and is able to improve the light utilization efficiency from the light emitting element. 【0154】また請求項12の発明は、実装基板に凹設された凹部の底面に発光素子を載置すると共に、蛍光部材の発光素子側の面を凹部の開口面と略等しい大きさに形成しているので、蛍光部材での発光径のぼやけがなくなり、配光制御性が良好となるものである。 [0154] The invention of claim 12 is formed with mounting the light emitting element on the bottom surface of the concave portion which is recessed in the mounting substrate, the surface of the light emitting element side of the fluorescent member to substantially the same size as the opening surface of the concave portion since it is, and there is no blurring of luminous diameter of a fluorescent member, in which the light distribution controllability is improved. 【0155】また請求項13の発明は、凹部の内周面を略放物面形状に形成すると共に、発光素子から放射された光を上記内周面で反射させることによって蛍光部材へ入射可能にしているので、蛍光部材の発光輝度分布を平均化することができ、光取出し面における色むらを抑えることができるものである。 [0155] The invention of claim 13, together forming the inner peripheral surface of the recess Ryakuho Surface Generation, the light emitted from the light emitting element to allow incident on the fluorescent member by reflecting at the inner peripheral surface since it is, it is possible to average the light emission brightness distribution of the fluorescent member, in which it is possible to suppress the color unevenness in the light extraction surface. 【0156】また請求項14の発明は、凹部の内周面を略楕円面形状に形成すると共に、発光素子から放射された光を上記内周面で反射させることによって蛍光部材へ入射可能にしているので、蛍光部材の発光輝度分布の中心輝度が高くなり、狭角配光性能を実現することができるものである。 [0156] The invention of claim 14, together forming the inner peripheral surface of the concave portion in a substantially ellipsoid shape, a light emitted from the light emitting element and enables enters the fluorescent member by reflecting at the inner peripheral surface because there, the center luminance of the light emitting luminance distribution of the fluorescent member is increased, in which it is possible to realize a narrow-angle light distribution performance. 【0157】また請求項15の発明は、光学部材と実装基板との間に放熱のための間隙部を設けているので、発光素子の放熱を促進することができ、発光装置の寿命を長く延ばすことができるものである。 [0157] The invention of claim 15, since the provided gap for heat radiation between the mounting substrate and the optical member, it is possible to promote the heat dissipation of the light emitting element, lengthen the life of the light emitting device it is what it is. 【0158】また請求項16の発明は、透光性樹脂によって発光素子を封止すると共に、封止した透光性樹脂の光取出し面側の面を曲面形状に形成しているので、発光素子からの光の利用効率を向上させることができるものである。 [0158] The invention of claim 16 is configured to seal the light emitting element by the light-transmitting resin, since the surface of the light extraction surface side of the sealed light-transmissive resin is formed in a curved shape, the light emitting element it is capable of improving the use efficiency of light from. 【0159】また請求項17の発明は、発光素子の発光に対する蛍光部材表面の光反射率を低下させ、かつ蛍光部材中への入射量を増加させる反射防止膜を、蛍光部材と発光素子との間に介在させているので、蛍光部材への光の入射量が増加して効率が良くなるものである。 [0159] The invention of claim 17, the fluorescent member surface for light emission of the light emitting element to reduce the light reflectance, and an antireflection film to increase the incident amount to the fluorescent member in, the fluorescent member and the light emitting element since interposed between, in which efficiency is improved amount of incident light to the fluorescent member is increased. 【0160】また請求項18の発明は、発光素子又は蛍光部材からの光を散乱させる光拡散材を、蛍光部材と光学部材との間に介在させているので、色の角度特性が抑えられ、光取出し面の色むらを低減することができるものである。 [0160] The invention of claim 18, a light diffusing material that scatters light from the light emitting element or a fluorescent member, since is interposed between the fluorescent member and the optical member, the color of the angular characteristic can be suppressed, it is capable of reducing the color unevenness of the light extraction surface. 【0161】また請求項19の発明は、無機透明材料を用いて光学部材を形成しているので、光学部材の耐候性を良好にすることができると共に、熱膨張を少なくすることができるものである。 [0161] The invention of claim 19, since the form of the optical member by using the transparent inorganic material, as it can be reduced with the thermal expansion can be made favorable weather resistance of the optical member is there. 【0162】また請求項20の発明は、実装基板に載置された発光素子を覆うように、蛍光部材を含む透明物質を用いて形成された半球状のドームを実装基板に着脱自在に装着しているので、蛍光部材の劣化によって発光装置の性能が低下した場合には、ドームを新しいものに取り替えるだけでよく、これによって商品としての寿命を延ばすことができるものである。 [0162] The invention of claim 20, so as to cover the light emitting element mounted on the mounting substrate, detachably mounted on the hemispherical mounting substrate dome formed using a transparent material containing a fluorescent member since it is, if the performance of the light emitting device is decreased by deterioration of the fluorescent member need only replace with a new dome, whereby those which can prolong the life of the product. その上、本発明においては、蛍光部材を含むドームを半球状に形成しているため、発光素子からドームに至るまでの距離が、いずれの方角についても略等しくなり、色むらが生じることがなくなるものである。 After this, in the present invention, because it forms a dome containing the fluorescent member hemispherical, the distance from the light emitting element to reach the dome, approximately equal for any direction, thereby preventing the color unevenness it is intended. 【0163】また請求項21の発明は、実装基板に形成した凹部に発光素子を載置すると共に、この凹部に蛍光部材を充填し、透明材料を用いて形成された着脱自在な蓋でこの凹部を密閉しているので、蛍光部材の劣化によって発光装置の性能が低下した場合には、一旦蓋を取り外し、劣化した蛍光部材を未劣化のものに交換した後、 [0163] The invention of claim 21, the recess while placing the light-emitting element in the recess formed in the mounting substrate, a fluorescent member was filled into the recess, with removable lid formed of a transparent material since the sealed, if the performance of the light emitting device is decreased by deterioration of the fluorescent member, temporarily remove the lid, after it replaced with a degraded fluorescent member undeteriorated,
再度蓋を装着すればよく、これによって商品としての寿命を延ばすことができるものである。 It may be attached to the lid again, whereby those which can prolong the life of the product. その上、本発明においては、発光素子が隠れる程度に蛍光部材を凹部に充填すればよいので、使用する蛍光部材の量が少なくて済むと共に、この少量の蛍光部材のみを交換すればよいので、製造・交換コストを低減することができるものであり、また、実装基板の表面に載置する部品や、実装基板の表面から突出する部品を必要としないので、発光装置をより薄型にすることができるものである。 Moreover, in the present invention, since the fluorescent member to the extent that the light-emitting element is hidden may be filled in the recess, with only a small amount of the fluorescent member to be used, it is sufficient to replace only the small amount of the fluorescent member, it is those capable of reducing the manufacturing and replacement costs, also, parts and for placing on the surface of the mounting board does not require a component protruding from the surface of the mounting board, to be a light-emitting device thinner it is those that can be.

【図面の簡単な説明】 【図1】本発明の実施の形態の一例を示す断面図である。 Is a sectional view showing an example of an embodiment of BRIEF DESCRIPTION OF THE DRAWINGS [Figure 1] present invention. 【図2】本発明の実施の形態の他例を示す断面図である。 It is a sectional view showing another example of the embodiment of the present invention; FIG. 【図3】本発明の実施の形態のさらに他例を示す断面図である。 3 is a sectional view showing still another example of the embodiment of the present invention. 【図4】本発明の実施の形態のさらに他例を示す断面図である。 Is a sectional view showing still another example of the embodiment of the present invention; FIG. 【図5】本発明の実施の形態のさらに他例を示す断面図である。 5 is a sectional view showing still another example of the embodiment of the present invention. 【図6】本発明の実施の形態のさらに他例を示す断面図である。 6 is a sectional view showing still another example of the embodiment of the present invention. 【図7】本発明の実施の形態のさらに他例を示すものであり、(a)は断面図、(b)は(a)において点線で囲んだ箇所を拡大した断面図である。 FIG. 7 is shows still another example of the embodiment of the present invention, (a) is a sectional view, (b) is a sectional view enlarging a portion surrounded by a dotted line in (a). 【図8】本発明の実施の形態のさらに他例を示すものであり、(a)は断面図、(b)は(a)において点線で囲んだ箇所を拡大した断面図である。 FIG. 8 is shows still another example of the embodiment of the present invention, (a) is a sectional view, (b) is a sectional view enlarging a portion surrounded by a dotted line in (a). 【図9】本発明の実施の形態のさらに他例を示すものであり、(a)は断面図、(b)は(a)において点線で囲んだ箇所を拡大した断面図である。 [9] and shows still another example of the embodiment of the present invention, (a) is a sectional view, (b) is a sectional view enlarging a portion surrounded by a dotted line in (a). 【図10】本発明の実施の形態のさらに他例を示すものであり、(a)は断面図、(b)は(a)において点線で囲んだ箇所を拡大した断面図である。 [Figure 10] and shows still another example of the embodiment of the present invention, (a) is a sectional view, (b) is a sectional view enlarging a portion surrounded by a dotted line in (a). 【図11】本発明の実施の形態のさらに他例を示す拡大断面図である。 11 is an enlarged sectional view showing still another example of the embodiment of the present invention. 【図12】本発明の実施の形態のさらに他例を示す拡大断面図である。 12 is an enlarged sectional view showing still another example of the embodiment of the present invention. 【図13】本発明の実施の形態のさらに他例を示す断面図である。 13 is a sectional view showing still another example of the embodiment of the present invention. 【図14】本発明の実施の形態のさらに他例を示す断面図である。 14 is a sectional view showing still another example of the embodiment of the present invention. 【図15】本発明の実施の形態のさらに他例を示す断面図である。 15 is a cross-sectional view showing still another example of the embodiment of the present invention. 【図16】本発明の実施の形態のさらに他例を示す断面図である。 16 is a sectional view showing still another example of the embodiment of the present invention. 【図17】本発明の実施の形態のさらに他例を示すものであり、(a)及び(b)は断面図である。 [Figure 17] and shows still another example of the embodiment of the invention, (a) and (b) is a cross-sectional view. 【図18】本発明の実施の形態のさらに他例を示す断面図である。 18 is a sectional view showing still another example of the embodiment of the present invention. 【図19】本発明の実施例1を示す断面図である。 19 is a cross-sectional view showing a first embodiment of the present invention. 【図20】本発明の実施例2を示す断面図である。 20 is a cross-sectional view showing a second embodiment of the present invention. 【図21】本発明の実施例3を示す断面図である。 21 is a cross-sectional view showing a third embodiment of the present invention. 【図22】本発明の実施例4を示す断面図である。 22 is a cross-sectional view showing a fourth embodiment of the present invention. 【図23】本発明の実施例5を示す断面図である。 23 is a cross-sectional view showing a fifth embodiment of the present invention. 【図24】本発明の実施例6を示す断面図である。 Is a sectional view showing a sixth embodiment of FIG. 24 the present invention. 【図25】本発明の実施例7を示す断面図である。 Is a sectional view showing a seventh embodiment of FIG. 25 the present invention. 【図26】本発明の実施例8を示す断面図である。 26 is a cross-sectional view showing an eighth embodiment of the present invention. 【図27】本発明の実施例9を示す断面図である。 27 is a cross-sectional view showing a ninth embodiment of the present invention. 【図28】本発明の実施例10を示す断面図である。 28 is a sectional view showing an embodiment 10 of the present invention. 【図29】本発明の実施例11を示すものであり、 [Figure 29] is indicative of Example 11 of the present invention,
(a)は断面図、(b)は(a)において点線で囲んだ箇所を拡大した断面図である。 (A) is a cross-sectional view and a cross-sectional view enlarging a portion surrounded by a dotted line in (b) is (a). 【図30】本発明の実施例12を示すものであり、 [Figure 30] is indicative of Example 12 of the present invention,
(a)は断面図、(b)は(a)において点線で囲んだ箇所を拡大した断面図である。 (A) is a cross-sectional view and a cross-sectional view enlarging a portion surrounded by a dotted line in (b) is (a). 【図31】本発明の実施例13を示すものであり、 [Figure 31] is indicative of Example 13 of the present invention,
(a)は断面図、(b)は(a)において点線で囲んだ箇所を拡大した断面図である。 (A) is a cross-sectional view and a cross-sectional view enlarging a portion surrounded by a dotted line in (b) is (a). 【図32】本発明の実施例14を示すものであり、 [Figure 32] is indicative of Example 14 of the present invention,
(a)は断面図、(b)は(a)において点線で囲んだ箇所を拡大した断面図である。 (A) is a cross-sectional view and a cross-sectional view enlarging a portion surrounded by a dotted line in (b) is (a). 【図33】本発明の実施例15を示す断面図である。 33 is a cross-sectional view showing an embodiment 15 of the present invention. 【図34】本発明の実施例16を示すものであり、 [Figure 34] is indicative of Example 16 of the present invention,
(a)は実装基板の断面図、(b)は実装基板の平面図である。 (A) is a cross-sectional view of a mounting board, (b) is a plan view of the mounting substrate. 【図35】本発明の実施例17を示す断面図である。 Is a sectional view showing an embodiment 17 of FIG. 35 the present invention. 【図36】本発明の実施例18を示す断面図である。 36 is a cross-sectional view showing an embodiment 18 of the present invention. 【図37】本発明の実施例19を示す断面図である。 Is a sectional view showing an embodiment 19 of FIG. 37 the present invention. 【図38】本発明の実施例20を示す断面図である。 38 is a cross-sectional view showing an embodiment 20 of the present invention. 【図39】本発明の実施例21を示す断面図である。 39 is a cross-sectional view showing an embodiment 21 of the present invention. 【図40】本発明の実施例22を示す断面図である。 Is a sectional view showing an embodiment 22 of FIG. 40 the present invention. 【図41】本発明の実施例22の他例を示す断面図である。 41 is a cross-sectional view showing another example of embodiment 22 of the present invention. 【図42】本発明の実施例23を示す断面図である。 FIG. 42 is a sectional view showing an embodiment 23 of the present invention. 【図43】従来例を示すものであり、(a)はキャップ被着後の発光ダイオードの断面図、(b)はキャップ被着前の発光ダイオードの断面図である。 [Figure 43] is indicative of the prior art, is a cross-sectional view of (a) is a sectional view of a light emitting diode after the cap deposition, (b) the cap deposition before the light emitting diode. 【符号の説明】 1 実装基板2 発光素子3 蛍光部材4 光学部材5 ドーム6 凹部7 蓋19 光取出し面23 反射部24 開口部25 低屈折部材26 間隙部27 透光性樹脂28 反射防止膜29 光拡散材 [EXPLANATION OF SYMBOLS] 1 mounting substrate 2 light-emitting element 3 fluorescent member 4 the optical member 5 dome 6 recess 7 the lid 19 the light extraction surface 23 reflecting portion 24 opening 25 low refractive member 26 the gap portion 27 translucent resin 28 antireflection film 29 light diffusing material

───────────────────────────────────────────────────── フロントページの続き (72)発明者 村上 忠史 大阪府門真市大字門真1048番地松下電工株 式会社内(72)発明者 杉本 勝 大阪府門真市大字門真1048番地松下電工株 式会社内(72)発明者 塩濱 英二 大阪府門真市大字門真1048番地松下電工株 式会社内(72)発明者 木村 秀吉 大阪府門真市大字門真1048番地松下電工株 式会社内(72)発明者 橋本 拓磨 大阪府門真市大字門真1048番地松下電工株 式会社内(72)発明者 西岡 浩二 大阪府門真市大字門真1048番地松下電工株 式会社内Fターム(参考) 5F041 AA11 AA44 DA03 DA04 DA12 DA13 DA19 DA20 DA34 DA35 DA36 DA74 DA75 DA77 DA78 EE21 FF01 FF11 ────────────────────────────────────────────────── ─── of the front page continued (72) inventor Tadashi Murakami Osaka Prefecture Kadoma Oaza Kadoma 1048 address Matsushita Electric Works Co., within the company (72) inventor Masaru Sugimoto Osaka Prefecture Kadoma Oaza Kadoma 1048 address Matsushita Electric Works Co., the company ( 72) inventor Shiohama Eiji Osaka Prefecture Kadoma Oaza Kadoma 1048 address Matsushita Electric Works Co., within the company (72) inventor Hideyoshi Kimura, Osaka Prefecture Kadoma Oaza Kadoma 1048 address Matsushita Electric Works Co., within the company (72) inventor Hashimoto Takuma Osaka Cabinet Office Kadoma Oaza Kadoma 1048 address Matsushita Electric Works Co., within the company (72) inventor Koji Nishioka Osaka Prefecture Kadoma Oaza Kadoma 1048 address Matsushita Electric Works Co., Ltd. in the F-term (reference) 5F041 AA11 AA44 DA03 DA04 DA12 DA13 DA19 DA20 DA34 DA35 DA36 DA74 DA75 DA77 DA78 EE21 FF01 FF11

Claims (1)

  1. 【特許請求の範囲】 【請求項1】 実装基板に発光素子を載置し、この発光素子の発光によって励起されると共に励起波長と異なる波長の光を放射する蛍光部材を備えて形成される発光装置において、蛍光部材を交換可能にして成ることを特徴とする発光装置。 Placing a light emitting element to the Claims 1] mounting substrate, light emission is formed with a fluorescent member which emits light of a wavelength different from the excitation wavelength while being excited by light emission of the light emitting element in the device, the light emitting device characterized by comprising in the replaceable fluorescent member. 【請求項2】 発光素子を載置した実装基板に、表面又は内部に蛍光部材を含んで形成される光学部材を着脱自在に装着して成ることを特徴とする請求項1に記載の発光装置。 To 2. A mounting substrate mounting the light emitting element, a light-emitting device according to claim 1, characterized in that formed by mounting an optical member detachably formed include on or in the fluorescent member . 【請求項3】 フェースダウン実装によって実装基板に発光素子を載置すると共に、発光素子に光学部材を対向配置させて成ることを特徴とする請求項1又は2に記載の発光装置。 Wherein while placing the light-emitting element mounting substrate by face-down mounting, the light emitting device according to claim 1 or 2, characterized by comprising by opposed optical members to the light emitting element. 【請求項4】 光学部材内において蛍光部材を発光素子に最も近い位置に配置して成ることを特徴とする請求項2又は3に記載の発光装置。 4. A light emitting device according to claim 2 or 3, characterized in that formed by placing a fluorescent member closest to the light emitting element in the optical member. 【請求項5】 光学部材の形状が凸レンズ形状であることを特徴とする請求項2乃至4のいずれかに記載の発光装置。 5. The light emitting device according to any one of claims 2 to 4, characterized in that the shape of the optical member is a convex lens shape. 【請求項6】 蛍光部材によって波長が変換されて放射された光のうち、光学部材の光取出し面に向かう方向と異なる方向に放射された光を、光取出し面に向かう方向に全反射させる形状となるように光学部材を形成して成ることを特徴とする請求項2乃至5のいずれかに記載の発光装置。 6. Of the light wavelength emitted are converted by the fluorescent member, the light emitted in a direction different from the direction toward the light extraction surface of the optical member, is totally reflected toward the light extraction surface shape be made by forming an optical member such that the light-emitting device according to any one of claims 2 to 5, wherein. 【請求項7】 光学部材の発光素子側の面に反射部を設けると共に、発光素子からの光を取り入れるための開口部を反射部に設けて成ることを特徴とする請求項2乃至6のいずれかに記載の発光装置。 With 7. providing the reflecting portion on the surface of the light emitting element side of the optical member, either an opening for introducing the light from the light emitting device according to claim 2 to 6, characterized by comprising providing the reflective portion the light emitting device of crab according. 【請求項8】 光学部材が光学部材よりも低い屈折率を有する低屈折部材を備えると共に、蛍光部材を通過した光又は蛍光部材により波長が変換された光が低屈折部材を介して光学部材へ入射されるように低屈折部材を配置して成ることを特徴とする請求項2乃至7のいずれかに記載の発光装置。 8. The optical member is provided with a low refractive member having a lower refractive index than the optical member, light wavelength by light or fluorescent member passing through the fluorescent member is conversion to the optical member via a low refractive member the light emitting device according to any one of claims 2 to 7, characterized by comprising placing a low refractive member as incident. 【請求項9】 発光素子からの光が蛍光部材中を略等しい光路長にて通過するように蛍光部材を形成して成ることを特徴とする請求項1乃至8のいずれかに記載の発光装置。 9. The light emitting device according to any one of claims 1 to 8 light from the light emitting element is characterized in that by forming a fluorescent member so as to pass in a substantially equal optical path lengths through the fluorescent member . 【請求項10】 蛍光部材の光取出し面側の面と蛍光部材の発光素子側の面のうち少なくとも一方を曲面に形成して成ることを特徴とする請求項9に記載の発光装置。 10. A light emitting device according to claim 9, characterized by comprising forming at least one curved surface of the surfaces of the light emitting element side of the light extraction surface side surface and the fluorescent member of the fluorescent member. 【請求項11】 発光素子を略包囲するように蛍光部材を配置して成ることを特徴とする請求項1乃至10のいずれかに記載の発光装置。 11. The light emitting device according to any one of claims 1 to 10, characterized in that formed by arranging the fluorescent member so as to substantially surround the light emitting element. 【請求項12】 実装基板に凹設された凹部の底面に発光素子を載置すると共に、蛍光部材の発光素子側の面を凹部の開口面と略等しい大きさに形成して成ることを特徴とする請求項1乃至11のいずれかに記載の発光装置。 With 12. mounting the light emitting element on the bottom surface of the concave portion which is recessed in the mounting board, characterized by comprising the surface of the light emitting element side of the fluorescent member is formed in substantially the same size as the opening surface of the concave portion the light emitting device according to any one of claims 1 to 11,. 【請求項13】 凹部の内周面を略放物面形状に形成すると共に、発光素子から放射された光を上記内周面で反射させることによって蛍光部材へ入射可能にして成ることを特徴とする請求項12に記載の発光装置。 With 13. forming the inner peripheral surface of the recess Ryakuho Surface Generation, and characterized in that the light emitted from the light emitting element formed by allowing incident on the fluorescent member by reflecting at the inner peripheral surface the light emitting device according to claim 12,. 【請求項14】 凹部の内周面を略楕円面形状に形成すると共に、発光素子から放射された光を上記内周面で反射させることによって蛍光部材へ入射可能にして成ることを特徴とする請求項12に記載の発光装置。 14. with forming the inner peripheral surface of the concave portion in a substantially ellipsoidal shape, characterized by comprising enabling enters the fluorescent member light emitted from the light emitting element by reflecting at the inner peripheral surface the light emitting device according to claim 12. 【請求項15】 光学部材と実装基板との間に放熱のための間隙部を設けて成ることを特徴とする請求項2乃至14のいずれかに記載の発光装置。 15. The light emitting device according to any one of claims 2 to 14, characterized in by comprising providing gap for heat radiation between the optical member and the mounting substrate. 【請求項16】 透光性樹脂によって発光素子を封止すると共に、封止した透光性樹脂の光取出し面側の面を曲面形状に形成して成ることを特徴とする請求項1乃至1 Together to seal the light emitting element by 16. translucent resin, according to claim 1 1, characterized by comprising the surface of the light extraction surface side of the sealed light-transmissive resin is formed in a curved shape
    5のいずれかに記載の発光装置。 The light emitting device according to any one of 5. 【請求項17】 発光素子の発光に対する蛍光部材表面の光反射率を低下させ、かつ蛍光部材中への入射量を増加させる反射防止膜を、蛍光部材と発光素子との間に介在させて成ることを特徴とする請求項1乃至16のいずれかに記載の発光装置。 17. reduces the light reflectance of the fluorescent member surface to the light emission of the light emitting element, and an antireflection film to increase the incident amount to the fluorescent member in, and be interposed between the fluorescent member and the light emitting element the light emitting device according to any one of claims 1 to 16, wherein the. 【請求項18】 発光素子又は蛍光部材からの光を散乱させる光拡散材を、蛍光部材と光学部材との間に介在させて成ることを特徴とする請求項2乃至17のいずれかに記載の発光装置。 The method according to claim 18 light diffusing material that scatters light from the light emitting element or a fluorescent member, according to any one of claims 2 to 17, characterized by comprising interposed between the fluorescent member and the optical member the light-emitting device. 【請求項19】 無機透明材料を用いて光学部材を形成して成ることを特徴とする請求項2乃至18のいずれかに記載の発光装置。 The light emitting device according to any one of claims 19] claims 2 to 18, characterized by comprising forming an optical member by using the transparent inorganic material. 【請求項20】 実装基板に載置された発光素子を覆うように、蛍光部材を含む透明物質を用いて形成された半球状のドームを実装基板に着脱自在に装着して成ることを特徴とする請求項1に記載の発光装置。 As 20. cover the light-emitting element mounted on the mounting substrate, and characterized in that formed by detachably mounted to the hemispherical mounting substrate dome formed using a transparent material containing a fluorescent member the light emitting device according to claim 1. 【請求項21】 実装基板に形成した凹部に発光素子を載置すると共に、この凹部に蛍光部材を充填し、透明材料を用いて形成された着脱自在な蓋でこの凹部を密閉して成ることを特徴とする請求項1に記載の発光装置。 With 21. mounting the light emitting element in the recess formed in the mounting substrate, a fluorescent member was filled into the recess, that is formed by sealing the recess with removable lid formed of a transparent material the light emitting device according to claim 1, wherein the.
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