CN102956626A

CN102956626A - LED structure

Info

Publication number: CN102956626A
Application number: CN2011102387049A
Authority: CN
Inventors: 王大强; 李上宾; 徐正飞; 邹军
Original assignee: Individual
Current assignee: Individual
Priority date: 2011-08-19
Filing date: 2011-08-19
Publication date: 2013-03-06

Abstract

The invention relates to an LED structure which comprises a substrate, a plurality of LED chips, first colloid and second colloid. The substrate is provided with at least one fixing part, and the LED chip and the first colloid are disposed on the fixing parts. The second colloid is disposed at the position of the first colloid, corresponding to the other side of the substrate. A lens is provided with at least one fixed part abutted to the fixing parts, so that the lens covers the LED chips, the first colloid and the second colloid and is integrally combined with the substrate. Therefore, luminous efficiency of the LED structure is improved, and effect in quick change in color temperature or beam angle is improved.

Description

Light emitting diode construction

Technical field

The invention relates to a kind of light emitting diode construction, espespecially a kind of substrate that will have a LED wafer and colloid layer and lens connect by fixing fast, can improve thus light extraction efficiency and can change fast the light emitting diode construction of colour temperature or light distribution angle.

Background technology

In recent years, along with light-emitting diode (Light-emitting diode, hereinafter to be referred as LED) emerging Lighting Industry development is rapidly, LED has been surpassed or near the energy-conserving light source of conventional bulb at aspects such as brightness, power, life-span, power consumption, reaction rates, so that LED begins to replace conventional bulb at present gradually, wherein with great power LED already a large amount of extensive uses in fields such as street lamp, view, Xi Qiang, room lightings.

And along with the development of LED industry, the led module of polycrystalline integrated form also is widely used as light source, wherein, the advantage that has more many uniquenesses than single the packaged LED of 1W is used in gathering of the LED packing forms of polycrystalline integrated form, and along with the further lifting of the naked brilliant light efficiency of LED, polycrystalline integrated LED package module also can present the advantage on many costs.

In recent research and development technology, industry develops a kind of integrated led module of powerful polycrystalline unit that has, and makes single LED light emitting module can provide power between the 10W-100W, and has solved heat radiation and the luminous intensity distribution problem of power greater than the led module of 5W.

It is directly the fluorescent bisque to be coated on the naked crystalline substance of LED directly to penetrate with mixed light that a kind of technology is arranged before this, but the thermal power density of high-power multi-wafer module is far longer than the LED of single wafer encapsulation, the temperature of central hot spot then can affect luminous efficiency and the life-span of the phosphor powder that wafer covers above, therefore, the fluorescent bisque should be away from the naked crystalline substance of LED when coating arranges, therefore, another kind of technology is to utilize light guide plate to derive the naked brilliant light that produces of LED and reflex on the exiting surface of fluorescent bisque, though these technology can reduce the temperature of fluorescent bisque, but the whole light efficiency that produces of relative its led module also relative reduction and manufacturing cost improves, and affects the light extraction efficiency of LED light fixture.

The above, have following shortcoming in the prior art:

1. light extraction efficiency is not good;

2. manufacturing cost is high.

Therefore, because every shortcoming that above-mentioned prior art derived, the inventor of this case exhausts its intelligence then, to be engaged in the sector experience for many years, concentrate on studies and innovated improvement, successfully this part " light emitting diode construction " case is finished in research and development finally, is the invention that a tool effect is promoted in fact.

Summary of the invention

For effectively solving the above problems, main purpose of the present invention provides a kind of light emitting diode construction of promoting light extraction efficiency that has.

Secondary objective of the present invention provides a kind of light emitting diode construction that can change fast colour temperature or light distribution angle.

Secondary objective of the present invention provides and a kind ofly avoids phosphor powder Yin Gaowen and produce the problem of light decay.

For reaching above-mentioned purpose, the present invention proposes a kind of light emitting diode construction, and be to comprise: a substrate, this substrate have a groove and side has at least one fixed part; A plurality of LED wafers, these a plurality of LED wafers are to be arranged in this groove; One first colloid, this first colloid are to be arranged on this groove and this LED wafer; One second colloid, this second colloid are to be arranged at this first gel phase for substrate opposite side position; One lens, these lens have at least one section that is fixed of this fixed part of docking in the lateral location place, and this fixed part is in conjunction with this section that is fixed, and to make these lens be these a plurality of LED wafers of cover cap and this first colloid and this second colloid and integrally combine with this substrate.

Be arranged between this first colloid and lens by its second colloid of the present invention, with the design that utilizes fixed part with the section's of being fixed combination, and then reach the effect that promotes its light extraction efficiency and can change fast colour temperature or light distribution angle.

Description of drawings

Fig. 1 is the decomposing schematic representation of the first preferred embodiment of the present invention;

Fig. 2 is the schematic perspective view of the first preferred embodiment of the present invention;

Fig. 3 is the cross-sectional schematic of the first preferred embodiment of the present invention;

Fig. 4 is the decomposing schematic representation of the second preferred embodiment of the present invention;

Fig. 5 is the schematic perspective view of the second preferred embodiment of the present invention;

Fig. 6 is the cross-sectional schematic of the 3rd preferred embodiment of the present invention;

Fig. 7 is the generalized section of the 4th preferred embodiment of the present invention;

Fig. 8 is the generalized section of the 5th preferred embodiment of the present invention;

Fig. 9 is the generalized section of the 6th preferred embodiment of the present invention;

Figure 10 is the generalized section of the 7th preferred embodiment of the present invention.

Description of reference numerals: 1-light emitting diode construction; The 10-substrate; The 101-groove; The 102-fixed part; The 11-LED wafer; 12-the first colloid; 13-the second colloid; The 14-lens; The 141-section that is fixed; The 142-exiting surface; The 143-recess.

Embodiment

Characteristic on above-mentioned purpose of the present invention and structure thereof and the function will be explained according to appended graphic preferred embodiment.

See also shown in Fig. 1,2,3, it is a kind of light emitting diode construction 1 of the present invention, in the first preferred embodiment of the present invention, this light emitting diode construction 1 comprises a substrate 10, more than one LED (Light-emitting diode is called for short LED) wafer 11, one first colloid 12, one second colloid 13 and lens 14;

Its substrate 10 has a groove 101 at place, a plan position approach, and has at least one fixed part 102 in side, in the present embodiment, its fixed part 102 is the sides that are surrounded on this substrate 10, be equipped with described LED wafer 11 in the described groove 101, and this first colloid 12 is to be arranged in this groove 101 and to be coated on this LED wafer 11, and be provided with described the second colloid 13 in this first colloid 12 with respect to substrate 10 opposite side positions, and these lens 14 have at least one section 141 that is fixed of this fixed part 102 of docking in the lateral location place, and this fixed part 102 is in conjunction with this section 141 that is fixed, and to make these lens 14 be these a plurality of LED wafers 11 of cover cap and this first colloid 12 and this second colloid 13 and integrally combine with this substrate 10;

Wherein this substrate 10 is made with copper material, aluminium material, ceramic material, graphite material, a silicon material or printed circuit board (PCB) material wherein, and its substrate 10 is provided with described LED wafer 11 in groove 101 contents, these a plurality of LED wafers 11 are the naked crystalline substances of LED that use different wave length, it can include many InGaN or the naked crystalline substance of GaN Light-Emitting Diode and many naked crystalline substances of AlGaInP Light-Emitting Diode, and has the spectrum of 450-460nm and two peak wavelengths of 620-660nm when applying bias voltage (Bias) at least;

In the present embodiment, its LED wafer 11 is to use the naked crystalline substance of ruddiness and the naked crystalline substance of blue light, but be not limited to this, the naked crystalline substance of its ruddiness is the center position that this substrate 10 is set, and the naked crystalline substance of blue light is the outer ring that is distributed in the naked brilliant relative position of ruddiness, and these a plurality of LED wafers 11 are with surface mount (or adhesion) technology (Surfaced Mounting Technolegy, be called for short SMT) and these substrate 10 close contacts, make these a plurality of LED wafers 11 be combined into one with this substrate 10, and its each LED wafer 11 again these substrate 10 sides has described fixed part 102, and this fixed part 102 is that the section that is fixed 141 with described lens 14 is connected with group;

Wherein the material of these lens 14 is to be chosen as silica gel, silicones, optics PC, glass and acrylic are wherein arbitrary, and its lens 14 have an exiting surface 142 with respect to substrate 10 opposite sides, and these lens 14 of body of complying with its exiting surface 142 are to may be selected to be planar lens, convex lens, concave lens, the male and fomale(M﹠F) lens, wavy lens and array lens are wherein arbitrary, but be not limited to this, and in the present embodiment, these lens 14 are as execution mode take planar lens, these lens 14 side of being connected to described substrate 10 has a recess 143 again, this recess 143 is to be embedded fixing for the second colloid 13, wherein this second colloid 13 is to utilize a mould molding, and be to body moulding that should recess 143 when moulding, can closely fix when making this second colloid 13 be connected to recess 143;

Wherein this second colloid 13 is for being mixed with the silica gel of phosphor powder, and in the present embodiment, the thickness range of its second colloid 13 is between 0.5mm～1mm, and can be aluminate or silicate or all the other, the chemical analysis of its phosphor powder can produce the chemical raw material of fluorescent effect, can be 450nm～460nm and 620nm～660nm with the employed spectral region value of the present embodiment, and the beeline of 11 of its second colloid 13 and LED wafers is greater than the beeline of 11 of the LED wafers of different wave length;

When wherein these lens 14 interior fixings have described the second colloid 13 and are mounted on the fixed part 102 of substrate 10 with the section of being fixed 141, to be provided with described the first colloid 12 and described LED wafer 11 of coating at its

second colloid

13 and 10 of substrates, the refractive index of its first colloid 12 is less than 1.43, and this first colloid 12 be chosen as transparent silica gel and cooling fluid wherein arbitrary, if this first colloid 12 is to be the described LED wafer 11 of complete coating when using silica gel, can utilize himself characteristic of silica gel can effectively keep original high transmission rate and the transparency to visible spectrum, and reduced the variations in refractive index in the light path, and then help to promote the whole light extraction efficiency of LED wafer 11 as light-emitting diodes tube efficiency 10%～20% as described in improving; If this first colloid 12 is to be the described LED wafer 11 of complete coating when using cooling fluid, can utilize cooling fluid to increase the radiating effect of described light-emitting diode integral body, with the temperature of effective reduction LED wafer 11;

Thus, the light emitting diode construction 1 of this case can be that the second colloid 13 relative these LED wafers 11 of fluorescent bisque are away from setting with it, and the design that can mutually be fixed by its fixed part 102 and the section 141 that is fixed, make this light emitting diode construction 1 change according to colour temperature demand or light distribution angle demand these lens 14 or the second colloid 13 are set, and then reach and promote its light extraction efficiency and the effect that can change fast colour temperature or light distribution angle.

Please consult again Fig. 4, shown in 5, it is the second preferred embodiment of the present invention, this preferred embodiment is roughly identical with front the first preferred embodiment, do not give unnecessary details mutually in addition at this and to exist together, it is dual-side or the four sides that are arranged at respectively this substrate 10 and lens 14 with the section 141 that is fixed that the difference of the second preferred embodiment is in described fixed part 102, as execution mode in the present embodiment take four side, its fixed part 102 is to collude zoarium, and zoarium one is colluded in its section 141 that is fixed, but so that these a plurality of LED wafers 11 of these lens 14 cover caps and this first colloid 12 and this second colloid 13 and integrally combine with this substrate 10.

Please consult again shown in Figure 6, it is the 3rd preferred embodiment of the present invention, this preferred embodiment is roughly identical with front the first preferred embodiment, do not give unnecessary details mutually in addition at this and to exist together, it is to be arranged at this first colloid 12 with respect to substrate 10 opposite side positions that the difference of the 3rd preferred embodiment is in described the second colloid 13, and it is can coat on these lens 14 for the second colloid 13 of fluorescent bisque, can reach equally this light emitting diode construction 1 and can change according to colour temperature demand or light distribution angle demand these lens 14 or the second colloid 13 are set, and then reach and promote its light extraction efficiency and the effect that can change fast colour temperature or light distribution angle.

Please consult again shown in Fig. 7,8,9, fourth, fifth, six preferred embodiments of the present invention, this preferred embodiment is roughly identical with front the first preferred embodiment, do not give unnecessary details mutually in addition at this and to exist together, its difference is in can be on demand and moulding in described exiting surface 142, as shown in Figure 7, its lens 14 are convex lens, this convex lens can increase taking-up and its light efficiency of Effective Raise of light, and can make its lighting angle comprise 140 degree to the scope between 30 degree by curvature or the design aspheric surface exiting surface 142 of adjusting its lens 14; And for example shown in Figure 8, its lens 14 are array lens, and its array lens is taking-up and its light efficiency of Effective Raise that can increase equally light with a plurality of packaged lens 14 moulding and arrayed on this exiting surface 142, and its lighting angle scope also can comprise 140 degree to the scope between 10 degree; And for example shown in Figure 9, its lens 14 are array lens, and its array lens is mutually to be arrayed on this exiting surface 142 with a plurality of packaged lens and a plurality of curve packaged lens, and then reach the light distribution curved surface with two or more.

Please consult again shown in Figure 10, it is the 7th preferred embodiment of the present invention, this preferred embodiment is roughly identical with front the first preferred embodiment, do not give unnecessary details mutually in addition at this and to exist together, if its difference is in and has the space in described

lens

14 and 13 in the second colloid and more can be provided with described the first colloid 12, so that 13 in its lens 14 and the second colloid can be filled the effects that reach sealing by described the first colloid 12.

The above, the present invention is a kind of light emitting diode construction, it has following advantages:

1. has lifting bright dipping (or luminous) efficient;

2. can change fast colour temperature or light distribution angle;

3. avoid light decay;

4. reduction manufacturing cost.

Above explanation is just illustrative for the purpose of the present invention, and nonrestrictive, and those of ordinary skills understand; in the situation that does not break away from the spirit and scope that following claims limit, can make many modifications, change; or equivalence, but all will fall within the scope of protection of the present invention.

Claims

1. a light emitting diode construction is characterized in that, comprising:

One substrate has a groove and side and has at least one fixed part;

More than one LED wafer is arranged in this groove;

One first colloid is arranged on this groove and this LED wafer;

One second colloid is arranged at this first gel phase for this substrate opposite side position; And

One lens have at least one section that is fixed of docking this fixed part in the lateral location place.

2. light emitting diode construction according to claim 1 is characterized in that, more is provided with described the first colloid between described lens and the second colloid.

3. light emitting diode construction according to claim 2 is characterized in that, described the first colloid is that selection transparent silica gel and cooling fluid are wherein arbitrary.

4. light emitting diode construction according to claim 1 is characterized in that, described the second colloid is fluorescent silica gel.

5. light emitting diode construction according to claim 1 is characterized in that, described lens have an exiting surface with respect to the substrate opposite side.

6. light emitting diode construction according to claim 5 is characterized in that, described lens are to select planar lens, convex lens, concave lens, male and fomale(M﹠F) lens, wavy lens and array lens wherein arbitrary.

7. light emitting diode construction according to claim 6 is characterized in that, described array lens be with a plurality of packaged lens moulding and arrayed on this exiting surface.

8. light emitting diode construction according to claim 6 is characterized in that, described array lens is mutually to be arrayed on this exiting surface with a plurality of packaged lens and a plurality of curve packaged lens.

9. light emitting diode construction according to claim 1 is characterized in that, the material of described lens is to select silica gel, silicones, optics PC, glass and acrylic wherein arbitrary.

10. light emitting diode construction according to claim 1 is characterized in that, the relative substrate position of described lens place has a recess, and this recess is to fix for the second colloid.