CN201062757Y - Illuminating device of white light surface light source - Google Patents

Illuminating device of white light surface light source Download PDF

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Publication number
CN201062757Y
CN201062757Y CNU2007200072895U CN200720007289U CN201062757Y CN 201062757 Y CN201062757 Y CN 201062757Y CN U2007200072895 U CNU2007200072895 U CN U2007200072895U CN 200720007289 U CN200720007289 U CN 200720007289U CN 201062757 Y CN201062757 Y CN 201062757Y
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light
light source
semiconductor chip
lens
white
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CNU2007200072895U
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诸建平
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诸建平
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Abstract

The utility model relates to a light-emitting device for a white light source, which comprises a semiconductor chip and a base, a cavity is formed in a lens and is filled with light-converting material, and the lens is fixed above the semiconductor chip and is separated from the semiconductor chip. Because the lens with light-converting material is adopted, the utility model can effectively solve excitation wavelength shift, quantum efficiency reduction, ageing and other adverse effects caused by the heating of the semiconductor chip to the light-converting material; the light-emitting rate, color temperature, chroma and consistency of the fabricated light-emitting device of the white light source can also be improved effectively; the luminous surface and uniformity of the light source is enlarged and the emitted light is a white light source and can effectively avoid glaring phenomenon.

Description

白光面光源发光装置 The surface light source device emitting white

技术领域 FIELD

本实用新型涉及一种发光器件,尤其是涉及一种以半导体为发光元件的白光面光源发光装置。 The present invention relates to a light emitting device, particularly to a white surface light source device emitting semiconductor light emitting element.

背景技术 Background technique

从上世纪90年代末,白光LED (lightemittingdiode,简称为LED)得到了迅猛发展。 From the late 1990s, the white LED (lightemittingdiode, referred to as LED) has been developing rapidly. LED作为第4代照明光源,具有节能、环保、寿命长、光效高、无辐射、抗冲击等优点,这都是传统光源无法比拟的。 LED as a fourth-generation light source, energy saving, environmental protection, long life, high luminous efficiency, no radiation, impact resistance, etc., which are the traditional sources unmatched.

虽然LED具有众多独特的优点,但由于LED芯片的发光面积小,亮度高, 因此LED产生的光源集中,为一点光源,极容易产生眩光和光污染。 Although the LED has many unique advantages, but because of the small light-emitting area of ​​the LED chip, high brightness, and therefore light generated by the LED focus, to a point light source, very prone to glare and light pollution. 如果直接将荧光粉等光转换材料覆盖在芯片表面,荧光粉极容易受到LED芯片高温的影响,加速荧光粉的老化,引起LED的出光率和使用寿命的縮短。 If light such as direct conversion phosphor material covering the surface of the chip, the phosphor of the LED chip are extremely vulnerable to high temperature, accelerated aging phosphors, causing light of the LED and shorten the service life. 这些都影响着LED的使用性能和应用范围。 Which all affect the LED performance and application range.

在专利公开号为"CN03824703.8"的"具有改良效率的镀膜LED"专利中, 其主要是将透明透镜覆盖在半导体上并与半导体隔开,其中磷光体层涂布在透镜的内表面或外表面。 In Patent Publication No. "CN03824703.8" a "film with improved efficiency LED" patent, which is mainly a transparent lens covering and spaced apart from the semiconductor on the semiconductor, wherein the phosphor layer coated on the inner surface of the lens or The outer surface. 半导体产生的光源,通过透镜表面的磷光体层激发和原来的光线混合产生白光,扩大光源的发光面积。 The semiconductor light generated by the phosphor layer and the lens surface of the excitation light to generate white light mixed original, expanded light emission area of ​​the light source. 虽然这样也能够解决LED的点光源问题,但是由于磷光体是一胶状的混合物,具有一定的流动性,因此涂布在透镜上时,厚度和均匀性比较难控制,对加工工艺的要求非常高,而且对LED 激发产生白光的均匀性和色温一致性也都难以控制。 Although this can solve the problem of the LED point light source, but because the phosphor is a mixture of a gum having a certain fluidity, and therefore when the coating on the lens thickness and uniformity more difficult to control, very requirements of the process high and uniform excitation of the LED to produce white light and color temperature consistency are also difficult to control.

发明内容 SUMMARY

本实用新型的目的是克服上述现有技术的缺点,提供一种以半导体芯片为发光元件,并通过含有光转换材料的透镜吸收、激发和转化,以产生白光面光源的发光装置。 The object of the present invention overcome the above disadvantages of the prior art, to provide a semiconductor chip is a light emitting element, and absorbed by the lens material containing a light conversion, and conversion of the excitation, to generate white light emitting device is a surface light source.

为实现上述目的,本实用新型采用的技术方案是: 一种白光面光源发光装置,包括有半导体芯片、基座,其中透镜内部形成有空腔,空腔内填充有光转 To achieve the above object, the present invention uses the technical solution is: A white light emitting surface light source device, comprising a semiconductor chip, the base, wherein the inner lens is formed with a cavity, the cavity filled with light switch

换材料,透镜固定于半导体芯片上方,并与半导体芯片隔开。 In other materials, the lens is fixed to the top of the semiconductor chip, the semiconductor chip and spaced apart.

所述的半导体芯片固定在基座上。 The semiconductor chip is fixed on the base.

所述半导体芯片的发光波长范围为200 nm ~ 1000nm。 The emission wavelength range of the semiconductor chip is 200 nm ~ 1000nm.

所述的半导体芯片为LED芯片。 The semiconductor chip is an LED chip.

所述的半导体芯片至少为一个。 Said at least one semiconductor chip.

所述的光转换材料为荧光粉或含有荧光粉的混合物。 The light conversion material is a phosphor or a phosphor containing mixture.

所述的透镜为塑料材料或玻璃材料制作。 The lens is a plastic material or a glass material.

所述的光转换材料在透镜的空腔中为面状分布。 The light conversion material is distributed in the cavity is a planar lens.

所述的空腔截面为方形、圆环形或不规则形状。 The cavity cross-section is square, circular or irregular shape.

所述的空腔内表面可以为粗糙或高低不平的非光滑面或凹凸面。 The cavity surface may be rough or non-smooth uneven surfaces or uneven surfaces.

所述的透镜由若干部分组成,各部分之间采用超声波焊接、粘合剂粘结、 卡口、螺纹结构中的一种或多种方式结合成一整体,并在其内部形成有空腔和开孔,光转换材料通过开孔填充在空腔内。 The lens composed of several parts, each part between the ultrasonic welding, adhesive bonding, bayonet, threaded structures incorporated into one or more integral and formed with a cavity in its interior and open hole, light converting material is filled in the cavity through the opening.

所述的粘合剂为硅胶、环氧树脂或UV胶中的一种。 Said binder is a silicone, epoxy or UV gum.

所述的透镜与半导体芯片之间填充有环氧树脂、硅树脂、丙烯酸树脂、热塑性材料或聚氨酯材料中的一种。 Filled epoxy, a silicone resin, an acrylic resin, a thermoplastic material or a polyurethane material between the lens and the semiconductor chip.

本实用新型由于采用了含有光转换材料层的透镜,因此在白光器件的制备过程中,就可以省略在芯片表面覆盖光转换材料的这一工序,使白光面光源的加工工艺更加简单,进一步缩短生产流程,提高生产效率,降低生产成本;并且可以有效的解决由于半导体芯片发热对光转换材料所造成的激发波长偏移、 量子效率下降、老化等不良影响,大大提高白光器件的使用寿命。 As a result of the present invention, a lens containing a light conversion material layer, thus the white light emitting device manufacturing process, this step may be omitted light conversion material covering the chip surface, so that the white surface light source process more simple, further reducing production process, increase productivity, reduce production costs; and can effectively solve the heat generation of the semiconductor chip due to the excitation light wavelength converting material caused by offset, the quantum efficiency is lowered, adverse effects such as aging, greatly improve the life of the white light emitting device. 此外,由于 In addition, due to the

光转换材料包含在透镜的空腔中,光转换材料的状态、体积以及透镜空腔的形状、层数都可以控制,因此所制作的白光面光源发光装置的出光率、色温、色度和一致性等也能够得到有效的改善,有效的提高成品率。 Light converting material contained in the cavity of the lens, the state of the light conversion material, and a lens shape of the cavity volume, the number of layers can be controlled, and therefore the light source of the white light emitting device fabricated surface, color temperature, color and consistency and the like can be effectively improved, effectively improve the yield.

发光二极管LED作为第四代光源,虽具有环保、节能、使用寿命长等优点, 但是其所产生的是刺眼的点光源,极易造成人眼的不适。 A light emitting diode LED as the fourth generation light source, although with environmental protection, energy saving, and long life, but it produces dazzling point light source, can easily cause eye discomfort. 本实用新型将光转换材料填充到透镜空腔中,形成光转换材料层,经光转换材料层激发后产生的光源为一面光源,扩大了光源的发光面积和均匀性,发出的光为白光面光源,能够有效的防止眩光现象。 The present invention converts light into the lens material is filled into the cavity, a light conversion material layer, a light source conversion material layer after excitation by a light source side is to expand the area of ​​the light source and the light emitting uniformity of the light emitted from the white surface a light source can effectively prevent glare. 附图说明 BRIEF DESCRIPTION

图1为本实用新型实施例1的剖面示意图; 图2为本实用新型实施例2的剖面示意图; 图3为本实用新型实施例3的剖面示意图; 图4为本实用新型实施例4的剖面示意图; 图5为本实用新型实施例5的剖面示意图; FIG 1 a schematic cross-sectional view of an embodiment of the present novel practical embodiment; FIG. 2 a schematic cross-sectional novel Example 2 of the present utility; new sectional view of Example 3 of the present utility FIG. 3; FIG. 4 is a sectional invention Example 4 schematic; FIG. 5 is a cross-sectional schematic view of the new embodiment of the present practical embodiment 5;

具体实施方式 Detailed ways

下面结合具体实施方式对本实用新型作进一步的描述: The following further description of the present invention in conjunction with specific embodiments for:

如图1所示,为本实用新型实施例1的剖面图,透镜1为一制作好的整体结构。 1, a sectional view of a new embodiment of the present practical embodiment, the lens 1 for the production of a good overall structure. 其中,透镜1由若干部分组成,各部分之间采用超声波焊接、粘合剂粘结、卡口、螺纹结构中的一种或多种方式结合成一整体结构,并在其内部形成有空腔13和开孔12,光转换材料11通过开孔12填充在空腔13内。 Wherein the lens 1 is composed of several components, ultrasonic welding between the parts, in conjunction with adhesive bonding, bayonet A thread structure or into a unitary structure in various ways, and has a cavity 13 formed therein and openings 12, the light conversion material 1113 is filled in the cavity through the openings 12. 其中空腔13的截面可以为方形、圆环形或其他不规则形状;空腔13的内表面可以为光滑平整的表面,也可以为粗糙或高低不平的非光滑面或凹凸面。 Wherein the section of the cavity 13 may be rectangular, circular, or other irregular shapes; the inner surface of the cavity 13 may be a smooth surface may be rough or non-smooth uneven surfaces or uneven surfaces. 其中,如果透镜l 各部分之间采用粘合剂粘合,则粘合剂可以采用环氧树脂、硅树脂、丙烯酸树脂、UV胶、热塑性材料或聚氨酯材料等材料中的任意一种。 Wherein, if the adhesive bond between the lens l portions, the adhesive material may be employed any epoxy resin, silicone resin, acrylic resin, UV adhesive, thermoplastic material or polyurethane material, and the like. 透镜1的制作材料则可以采用PC、 PMMA、 PS等塑料材料或玻璃材料。 The lens forming material may be employed a PC, PMMA, PS and other plastic material or glass material.

在本实施例中,光转换材料ll为黄色荧光粉和硅胶的混合物,可以根据不同的色温要求,来选用不同的荧光粉比例,例如黄色荧光粉和硅胶采用1: 10 的质量比混合。 In the present embodiment, the light conversion material ll is a mixture of silica and a yellow phosphor, color temperature according to different requirements, selection of different proportions of the phosphor, a yellow phosphor, and for example, silica gel using 1: 10 by mass ratio. 光转换材料11通过透镜1的开孔12,填充到空腔13中后,再将透镜放l入烘箱中,采用11(TC〜150'C温度,最佳温度为120°C,连续烘烤l 小时左右,将光转换材料2固化在空腔13内。本实施例中,透镜l中的光转换 After 1,112 light converting material is filled into the cavity 13 through the aperture of the lens 1, the lens then placed into an oven l, using 11 (TC~150'C temperature, the optimum temperature of 120 ° C, continuous baking about l hour, the light conversion material 2 is cured within a cavity 13 in the embodiment, the light converting lens l in the present embodiment

材料11为平面状分布,透镜1的外观和造型则可以根据实际的光学要求来进行设计和制作。 11 is a planar profile material, shape and appearance of the lens 1 may be designed and produced in accordance with the actual optical requirements.

半导体芯片2为波长在460nm左右的发蓝色光的LED芯片,其固定在基座5的凹槽51内,其中凹槽51为圆台型结构,表面涂布有反光材料,比如进行镀银,能够有效增加半导体芯片2的出光率。 The semiconductor chip 2 at a wavelength of about 460nm blue LED chip, which is fixed in the recess 51 of the base 5, wherein the groove 51 is a truncated cone-shaped structure, the surface is coated with a reflective material, such as silver plating, can be effective to increase the light extraction efficiency of the semiconductor chip 2. 透镜1固定于半导体芯片2的上方, 并和半导体芯片2隔开,使透镜1中的光转换材料11不受半导体芯片2的高温 The lens 1 is fixed above the semiconductor chip 2, and 2 and spaced apart from the semiconductor chip, the light conversion material 111 of the lens from the temperature of the semiconductor chip 2

影响。 influences. 半导体芯片固定在透镜的上方, 一般是指照明装置的出射光源朝上的情 The semiconductor chip is fixed at the top of the lens, generally it refers to the illumination device light emitted upwardly situation

况。 condition. 如果照明装置的出射光源朝下,则相反。 If the illumination device light emitted downward, and vice versa. 在透镜1和LED芯片2之间填充有胶体4,如硅胶、环氧树脂、丙烯酸树脂、热塑性材料或聚氨酯材料,其中胶体4的折射率在1.4〜2.0之间。 1 lens and the LED chip 4 is filled with a colloid, such as silicone, epoxy, acrylic, polyurethane, or a thermoplastic material between the two materials, where the refractive index between the body 4 of 1.4~2.0. 半导体芯片2的电极则通过导线3引出。 2 is an electrode of the semiconductor chip through the wire 3 drawn out. 当引出的电极施加电压时,半导体芯片2被驱动,并照射到透镜1中光转换材料ll,使之激发并混合原来的蓝色光,产生类似日光的白光。 When a voltage is applied to the electrode leads, the semiconductor chip 2 is driven, and irradiated to the light conversion material ll lens 1, so that the original excitation and mixing blue light to produce white light similar to sunlight.

本实用新型由于采用了含有光转换材料11的透镜1,因此在制备过程中, 就可以减少在半导体芯片2表面覆盖光转换材料的这一工序,使白光面光源的加工工艺更加简单,进一步縮短生产流程,提高生产效率,降低生产成本。 As a result of the present invention comprises a lens 11 of a light conversion material, and therefore in the manufacturing process, this process can reduce the light conversion material covering the surface of the semiconductor chip 2, the surface light source of white light simpler process, further reducing production processes, improve production efficiency, reduce production costs.

图2为本实用新型的另一实施例,其透镜1中的光转换材料11为曲面的圆环状分布。 Another novel embodiment 2 of the present practical embodiment, the light conversion material 111 of the lens which is curved annular distribution. 半导体芯片2为发紫外光的LED芯片,光转换材料11为RGB荧光粉和UV胶的混合物,其中UV胶也可以采用硅胶或环氧树脂等来替换。 The semiconductor chip 2 is made of UV LED chip, the light conversion material 11 is a mixture of RGB phosphor and the UV adhesive, UV adhesive which can be replaced using silica gel or an epoxy resin and the like. 光转换材料ll也可以为荧光粉一种,不需要其它的混合物。 Ll light conversion material may be a phosphor one of the other mixtures required. 荧光粉和UV胶混合时, 荧光粉和UV胶根据色温要求,按一定的比例进行混合后,如采用1: 10的质量比。 When the mixed phosphor and the UV adhesive, UV adhesive and the phosphor color temperature according to the requirements, after a certain mixing ratio, such as 1: 10 by mass ratio. 荧光粉和UV胶的混合物在光强大约30mW / cm2,波长为365nm左右的UV光源照射下,通过数分钟后,使填充到空腔中的光转换材料11固化。 The mixture of phosphor and the light intensity UV glue about 30mW / cm2, a wavelength of UV light source around 365nm, after a few minutes by the light converting material is filled into the cavity 11 is cured. 此种快速固化荧光粉的方法,能够大幅度的提高固化过程中的生产效率;而且UV 胶相对于硅树脂,其成本上也有很大的优势,因此能够有效的降低生产成本。 Such a method of fast curing phosphor, can greatly improve the production efficiency during curing; and UV glue with respect to the silicone resin, is also a great cost advantage, it is possible to effectively reduce the production cost.

半导体芯片2固定在基座5的凹槽51内,使半导体芯片2产生的光源能够经反射后,将反射光线都投射到光转换材料11的面上,通过光转换材料11激发后产生面状的白光。 The semiconductor chip 2 is fixed to the base 5 of the groove 51, the semiconductor chip 2 can be generated by the light source after reflection, the reflected light rays are projected onto the surface 11 of the light converting material, produced by the planar excitation light converting material 11 white. 在透镜1和半导体芯片2之间填充有胶体4,如环氧树脂、 硅树脂、丙烯酸树脂、热塑性材料、聚氨酯材料中的一种。 In the lens 1 and the semiconductor chip is filled with, such as epoxy resin, silicone resin, acrylic resin, thermoplastic material, a polyurethane material in the body 4 between the two. 由于半导体芯片2 光源的波长能够很好的控制,再加上光转换材料11在透镜1的空腔13内有很好的均匀性和统一的形状。 Since the wavelength of the light source of the semiconductor chip 2 can be well controlled, together with conversion material 11 coating has good uniformity in shape and uniform inner cavity 13 of the lens 1. 因此其产生的光源也具有良好的一致性,能大幅提高LED成品的良品率。 Thus it produces light source also has good consistency, a substantial increase in yield of LED products.

如图3所示,为本实用新型另一实施例的剖面示意图。 3, a schematic cross-sectional view of an another embodiment of the present practical embodiment. 光转换材料ll通过透镜1的开孔12,填充到透镜1的空腔13中,其中开孔12、空腔13数量和位置可以根据实际的需要进行变换和调节。 Ll light converting material through the opening 12 of the lens 1, the lens 1 is filled into the cavity 13, wherein the openings 12, the number and location of the cavity 13 may be transformed and adjusted according to actual needs. 在基座5的凹槽51内,共晶或粘合有多颗半导体芯片2,采用并联和/或串联的结构连接。 In the recess 51 of the base 5, eutectic bonding, or multiple pieces of the semiconductor chips 2, the use of parallel and / or series connection structure. 其中所用的半导体芯片2 为波长范围在830nm〜980mn的红外LED芯片,光转换材料11为红外荧光粉和UV胶的混合物,通过红外LED芯片发出的红外光照射光转换材料ll,激发并和原来的光线混合,产生类似日光的白光。 Wherein the semiconductor chip 2 in the wavelength range used in 830nm~980mn infrared LED chip, the light conversion material is a mixture of 11 infrared phosphor and the UV adhesive, irradiation of the infrared light emitted by the LED chip infrared light conversion material ll, and the original excitation and mixing light, a similar daylight white light.

其中,在透镜1和半导体芯片2之间填充有胶体4,如环氧树脂、硅树脂、 丙烯酸树脂、热塑性材料、聚氨酯材料中的一种。 Wherein, in the lens 1 and the semiconductor chip is filled with, such as epoxy resin, silicone resin, acrylic resin, thermoplastic material, a polyurethane material in the body 4 between the two. 透镜l采用两侧凸起的结构, 能够使多芯片照射光转换材料ll后,激发产生柔和、均匀的面光源。 L using both sides of the rear lens convex configuration, the irradiation light conversion material multichip ll, stimulate the production of soft, uniform surface light source.

如图4所示,为本实用新型实施例4的剖面图。 4, the new cross-sectional view of an embodiment 4 of the present invention. 在透镜1内形成有一个空腔13和开孔12,其中空腔13和开孔12的数量可以根据实际的需求进行调节。 Formed with a cavity 13 and an opening 12 in the lens 1, wherein the number of the cavities 13 and openings 12 can be adjusted according to actual needs. 光转换材料11通过开孔12填充到空腔13内,形成光转换材料层。 Light converting material 11 is filled into the cavity 13 through the opening 12, forming a light conversion material layer. 半导体芯片2固定在基座5的凹槽51内,透镜1与半导体芯片2之间隔离有一定的距离, 其间填充胶体4。 The semiconductor chip 2 is fixed to the base 51 within the recess 5, the lens 1 and the spacer 2 have a certain distance between the semiconductor chip body 4 filled therebetween. 由于半导体芯片2与透镜1的空腔13中的光转换材料11之间间隔较大距离,有效的解决了由于半导体芯片2发热对光转换材料11所造成的激发波长偏移、量子效率下降、老化等不良影响,大大提高白光器件的使用寿命。 Because large spacing distance between the light converting material in the cavity of the semiconductor chip 1 and the lens 2 is 13 11, effective solution since the semiconductor chip 2 of the heat generating material 11 is an excitation wavelength conversion of light caused by the offset, the quantum efficiency is lowered, aging and other adverse effects, greatly improve the life of white light emitting device.

如图5所示,为本实用新型实施例5的剖面图。 5, a sectional view of Example 5 of the present novel practical. 透镜1内含有光转换材料11,透镜1的外观和造型则可以根据实际的光学要求来进行设计和制作,其材料则可以PC、 PMMA、 PS等塑料材料或玻璃材料制作,光转换材料ll在透镜1的空腔13内形成由曲面和平面组成的不规则面。 A light conversion material containing the lens 11, the lens 1 and the appearance shape may be designed and produced in accordance with the actual optical requirements, the material may be PC, PMMA, PS and other plastic material or glass forming material, the light conversion material ll the inner cavity 13 of the lens 1 is formed by the irregular surface of curved and flat surfaces thereof. 发光波长范围为200~380nm 的紫外半导体芯片2固定在基座5的凹槽51内,透镜1固定在半导体芯片2上方,其间填充胶体4,如环氧树脂、硅树脂、丙烯酸树脂、热塑性材料、聚氨酯材料等材料。 Emission wavelength range of 200 ~ 380nm of the ultraviolet semiconductor chip 2 is fixed to the base 51 within the recess 5, the lens 1 is fixed above the semiconductor chip 2, during the filling body 4, such as epoxy resin, silicone resin, acrylic resin, thermoplastic material material like polyurethane material. 半导体芯片2产生的光线照射到光转换材料11,通过光转换材料ll激发后产生一面状柔和、均匀的白光面光源。 Light generated by the semiconductor chip 2 is irradiated to the light conversion material 11, to produce side-shaped soft, uniform white surface light source ll after excitation by a light conversion material.

以上的实施例只是本实用新型的几个优选方案,但本实用新型不局限于以上方案,任何表面形式和结构的简单改动都在本实用新型专利的保护范围内。 Embodiment of the present invention only several preferred embodiments of the above embodiment, but are within the scope of the present invention of the present patent disclosure is not limited to the above embodiment, a simple alteration of any form and structure of the surface.

Claims (12)

1、一种白光面光源发光装置,包括有半导体芯片、基座,其特征在于透镜内部形成有空腔,空腔内填充有光转换材料,透镜固定于半导体芯片上方,并与半导体芯片隔开。 A white light emitting surface light source device, comprising a semiconductor chip, the base, wherein the inner lens is formed with a cavity, the cavity filled with light conversion material, is fixed to the lens over the semiconductor chip, the semiconductor chip and spaced .
2、 根据权利要求l所述的一种白光面光源发光装置,其特征在于所述的半导体芯片固定在基座上。 2, a light source device emitting white light of the surface according to claim l, wherein said semiconductor chip is fixed on the base.
3、 根据权利要求l所述的一种白光面光源发光装置,其特征在于所述的半导体芯片为LED芯片。 3, a white light emitting device of the surface according to claim l, wherein said semiconductor chip is an LED chip.
4、 根据权利要求l, 2,或3所述的一种白光面光源发光装置,其特征在于所述的半导体芯片至少为一个。 4, according to claim l, 2, or one white light emitting surface light source device of claim 3, wherein said at least one semiconductor chip.
5、 根据权利要求l所述的一种白光面光源发光装置,其特征在于所述的光转换材料为荧光粉或含有荧光粉的混合物。 5, the light emitting device according to claim white surface light source according to claim l, wherein said light-converting phosphor material or a mixture containing phosphor.
6、 根据权利要求l所述的一种白光面光源发光装置,其特征在于所述的透镜为塑料材料或玻璃材料制作。 6. The white light emitting device according to claim l plane, wherein said lens is a plastic material or a glass material.
7、 根据权利要求l所述的一种白光面光源发光装置,其特征在于所述的光转换材料在透镜的空腔中为面状分布。 7. The surface light source emitting white light device according to claim l, wherein said planar light converting material is distributed in the cavity of the lens.
8、 根据权利要求1或7所述的一种白光面光源发光装置,其特征在于所述的空腔截面为方形、圆环形或不规则形状。 8 in accordance with claim emitting white surface light source device according to claim 17, wherein said cavity cross-section is square, circular or irregular shape.
9、 根据权利要求1或7所述的一种白光面光源发光装置,其特征在于所述的空腔内表面可以为粗糙或高低不平的非光滑面或凹凸面。 9, in accordance with claim emitting white surface light source device according to claim 17, wherein said cavity surface may be rough or non-smooth uneven surfaces or uneven surfaces.
10、 根据权利要求1所述的一种白光面光源发光装置,其特征在于所述的透镜由若干部分组成,各部分之间采用超声波焊接、粘合剂粘结、卡口、螺纹结构中的一种或多种方式结合成一整体,并在其内部形成有空腔和开孔,光转换材料通过开孔填充在空腔内。 10, according to one white light emitting surface light source device according to claim 1, wherein said lens is composed of several parts, each part between the ultrasonic welding, adhesive bonding, bayonet, threaded structure incorporated into one or more integral and formed with an opening and a cavity in its interior, the light conversion material is filled in the cavity through the opening.
11、 根据权利要求10所述的一种白光面光源发光装置,其特征在于所述的粘合剂为硅胶、环氧树脂或UV胶中的一种。 11, in accordance with claim emitting white surface light source device of claim 10, wherein said adhesive as a silicone, epoxy or UV gum.
12、 根据权利要求1所述的一种白光面光源发光装置,其特征在于所述的透镜与半导体芯片之间填充有环氧树脂、硅树脂、丙烯酸树脂、热塑性材料或聚氨酯材料中的一种。 12, according to one white light emitting surface light source device according to claim 1, characterized in that between said lens is filled with the semiconductor chip with an epoxy resin, a silicone resin, an acrylic resin, a thermoplastic material or a polyurethane material .
CNU2007200072895U 2007-06-05 2007-06-05 Illuminating device of white light surface light source CN201062757Y (en)

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WO2008148342A1 (en) * 2007-06-05 2008-12-11 Jianping Zhu An illuminator with white light planar light source
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