CN208753358U

CN208753358U - A kind of novel adopting surface mounted LED illuminating source packaging structure

Info

Publication number: CN208753358U
Application number: CN201821372009.5U
Authority: CN
Inventors: 张勇; 郑汉武
Original assignee: Shenzhen Suijing Optoelectronics Co Ltd
Current assignee: Shenzhen Suijing Optoelectronics Co Ltd
Priority date: 2018-08-24
Filing date: 2018-08-24
Publication date: 2019-04-16
Anticipated expiration: 2028-08-24

Abstract

The utility model discloses a kind of novel adopting surface mounted LED illuminating source packaging structures, including substrate, the upper end of the substrate is provided with light source bracket, the bottom end of the light source bracket is fixedly connected with the upper end of substrate, the inside of the light source bracket is fixedly installed with boss, the boss is trapezium structure, and groove, the upper end face of the boss are provided with LED blue light chip to shape in an angle between the inclined surface of the boss and the inside wall of cup of the light source bracket.The utility model passes through setting boss, fluorescent glue is coated to light source bracket bowl by gluing process, and through fluorescent glue after centrifugation rotating technics while uniform diffusion is coated to LED wafer, under the influence of centrifugal force, extra fluorescent glue can be thrown in the space for the angle groove that boss and light source bracket are formed, to ensure that the uniform coating of LED wafer surface fluorescence glue, ensure that SMD light source goes out light consistency and brightness, improves light source light-out effect.

Description

A kind of novel adopting surface mounted LED illuminating source packaging structure

Technical field

The utility model relates to headlamp technical field, specially a kind of novel adopting surface mounted LED illuminating source packaging structure.

Background technique

Adopting surface mounted LED, that is, common SMD light source is a kind of LED point light source that size is light and short, widely applied various Lighting area, it has also become the important component of general illumination LED light source, traditional generally existing light efficiency of SMD light source is not high, light The poor problem of color consistency；

The novel adopting surface mounted LED illuminating source packaging structure of one kind traditional at present has the disadvantage that

Conventional SMD patch-type white light source generallys use LED blue light chip and the scheme of yellow fluorescent powder is added to realize white light effect Fruit, but conventional fluorescent powder is all to be coated to SMD bracket bowl by gluing process with after silica gel mixing, is covered on LED indigo plant Light wafer surface, usual fluorescent glue is to there is the quite a while before baking-curing after dispensing, and in this period, fluorescent powder can be sent out Raw sedimentation phenomenon, ultimately causes that the photochromic consistency of SMD type light source finished product is poor, and finished product brightness reduces.

Utility model content

The purpose of this utility model is to provide a kind of novel adopting surface mounted LED illuminating source packaging structures, to solve above-mentioned back The problem of being proposed in scape technology.

To achieve the above object, the utility model provides the following technical solutions: a kind of novel adopting surface mounted LED light-source encapsulation Structure, including substrate, the upper end of the substrate are provided with light source bracket, and the bottom end of the light source bracket and the upper end of substrate are fixed Connection, the inside of the light source bracket are fixedly installed with boss, and the boss is trapezium structure, the inclined surface of the boss and institute Stating shape between the inside wall of cup of light source bracket, groove, the upper end face of the boss are provided with LED blue light chip in an angle, The two sides of the LED blue light chip are inlaid with bonding gold thread, and the interior zone of the light source bracket is filled with fluorescent glue, described Fluorescent glue is yellow and to be included LED blue light chip, boss, the top end surface height of the fluorescent glue and light source bracket Tip height is identical.

Preferably, the substrate uses conductive and heat-conductive substrate.

Preferably, the angle of the angle groove is degree.

Preferably, the boss and surrounding material are all made of metallic red copper material and are made.

Preferably, the metal surface of the boss is provided with silver coating.

Compared with prior art, the utility model has the beneficial effects that

Trapezium structure is presented by the way that boss is arranged in light source bracket bottom in boss by the utility model, and the inclination of boss Face and light source bracket inner wall form 60 degree of angle grooves, and after fluorescent glue dispensing, fluorescent powder settles under the action of the centrifugal force, has A part of fluorescent glue can be deposited to the angle groove that boss and light source bracket inner wall are formed, and light source bracket inner wall is not subjected to glimmering Optical cement, so that the fluorescent glue distribution on LED wafer surface is more uniform and thin, also, light source bracket inner wall does not have fluorescent glue Coating, greatly improve light source bracket inner wall to the reflecting effect of light, after LED blue light chip excites it to show fluorescent glue, More light can reflecting by light source bracket side inner walls, to promote LED blue light chip to the rubber powder of fluorescent glue Stimulation effect, promotion light efficiency, improvement are photochromic, and then promote properties of product, reduce packaging cost, realize splendid light-out effect.

Detailed description of the invention

Fig. 1 is a kind of novel adopting surface mounted LED illuminating source packaging structure overall structure diagram of the utility model；

Fig. 2 is a kind of novel adopting surface mounted LED illuminating source packaging structure sectional structure chart of the utility model；

Fig. 3 is a kind of novel adopting surface mounted LED illuminating source packaging structure local structural graph of the utility model.

In figure: 1- substrate；2- angle groove；3-LED blue light chip；4- boss；5- light source bracket；6- is bonded gold thread；7- Fluorescent glue；8- silver coating

Specific embodiment

The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work Every other embodiment obtained, fall within the protection scope of the utility model.

Fig. 1-3 is please referred to, the utility model provides a kind of technical solution: a kind of novel adopting surface mounted LED light-source encapsulation knot Structure, including substrate 1, the upper end of the substrate 1 are provided with light source bracket 5, the bottom end of the light source bracket 5 and the upper end of substrate 1 It is fixedly connected, the inside of the light source bracket 5 is fixedly installed with boss 4, and the boss 4 is trapezium structure, and the boss 4 inclines Groove 2, the upper end face of the boss 4 are provided with shape in an angle between inclined-plane and the inside wall of cup of the light source bracket 5 LED blue light chip 3, the two sides of the LED blue light chip 3 are inlaid with bonding gold thread 6, and the inner area of the light source bracket 5 is filled out Filled with fluorescent glue 7, the fluorescent glue 7 is yellow and is included LED blue light chip 3, boss 4, the top of the fluorescent glue 7 Apparent height is identical as the tip height of light source bracket 5.

The substrate 1 uses conductive and heat-conductive substrate 1；The angle of the angle groove 6 is 60 degree, can effectively be allowed in this way The fluorescent glue of LED blue light wafer surface coating is more uniform, and light-out effect is more preferable, and LED blue light corresponds to the excitation of fluorescent glue More sufficiently, photochromic and light efficiency will all get a promotion；The boss 4 and surrounding material are all made of metallic red copper material and are made；Institute The metal surface for stating boss 4 is provided with silver coating 8.

Working principle: by the way that boss 4 is arranged in light source bracket 5 bottom, being presented trapezium structure for boss 4, and boss 4 inclines Inclined-plane and 5 inner wall of light source bracket form 60 degree of angle grooves 2, and after 7 dispensing of fluorescent glue, fluorescent powder sinks under the action of the centrifugal force Drop, some fluorescent glue 7 can be deposited at the angle groove 2 that boss 4 and 5 inner wall of light source bracket are formed, in light source bracket 5 Wall is not subjected to fluorescent glue 7, so that the distribution of fluorescent glue 7 on 3 surface of LED wafer is more uniform and thin, also, light source bracket 5 inner walls do not have the coating of fluorescent glue, greatly improve 5 inner wall of light source bracket to the reflecting effect of light, when LED blue light chip 3 swashs Send out after it shows fluorescent glue 7, more light can reflecting by 5 side inner walls of light source bracket, so that it is brilliant to promote LED blue light Piece 3 is photochromic to the stimulation effect, promotion light efficiency, improvement of the rubber powder of fluorescent glue 7, and then promotes properties of product, reduces packaging cost, Realize splendid light-out effect.

It should be noted that, in this document, relational terms such as first and second and the like are used merely to a reality Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to Non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or equipment Intrinsic element.

While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art, It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.

Claims

1. a kind of novel adopting surface mounted LED illuminating source packaging structure, including substrate (1), it is characterised in that: the substrate (1) it is upper End is provided with light source bracket (5), and the bottom end of the light source bracket (5) is fixedly connected with the upper end of substrate (1), the light source bracket (5) inside is fixedly installed with boss (4), and the boss (4) is trapezium structure, the inclined surface of the boss (4) and the light Groove (2), the upper end face of the boss (4) are provided with LED blue light to shape in an angle between the inside wall of cup of source bracket (5) Chip (3), the two sides of the LED blue light chip (3) are inlaid with bonding gold thread (6), the interior zone of the light source bracket (5) Filled with fluorescent glue (7), the fluorescent glue (7) is yellow and is included LED blue light chip (3), boss (4), described glimmering The top end surface height of optical cement (7) is identical as the tip height of light source bracket (5).

2. the novel adopting surface mounted LED illuminating source packaging structure of one kind according to claim 1, it is characterised in that: the substrate (1) conductive and heat-conductive substrate (1) is used.

3. the novel adopting surface mounted LED illuminating source packaging structure of one kind according to claim 1, it is characterised in that: the angle The angle of groove (2) is 60 degree.

4. the novel adopting surface mounted LED illuminating source packaging structure of one kind according to claim 1, it is characterised in that: the boss (4) and surrounding material is all made of metallic red copper material and is made.

5. the novel adopting surface mounted LED illuminating source packaging structure of one kind according to claim 1, it is characterised in that: the boss (4) metal surface is provided with silver coating (8).