CN106981482A - A kind of LED dimmed light sources and preparation method thereof - Google Patents
A kind of LED dimmed light sources and preparation method thereof Download PDFInfo
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- CN106981482A CN106981482A CN201710329701.3A CN201710329701A CN106981482A CN 106981482 A CN106981482 A CN 106981482A CN 201710329701 A CN201710329701 A CN 201710329701A CN 106981482 A CN106981482 A CN 106981482A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
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Abstract
The invention discloses a kind of LED dimmed light sources and preparation method thereof, the preparation method includes step：1) it is fixed, some flip LED chips are fixed on substrate；2) subregion, the spaced arrangement of flip LED chips some flip LED chips being divided at least two light-emitting zones, and at least two light-emitting zones；3) gluing, fluorescent glue is coated according to light-emitting zone on each flip LED chips, and to form at least two illuminating parts, and wherein at least one illuminating part is different from the colour temperature for the light beam that other illuminating parts are sent；The above method uses the packaged type of upside-down mounting, without gold thread connection, reliability is high, chip in different light-emitting zones is spaced, and light mixing effect is uniform, outstanding, and spraying is substituted in fluorescent glue mode for dispensing glue in process, the waste of fluorescent material can be reduced, production cost is reduced, the photic zone being solidify to form by fluorescent glue excites another colour temperature fluorescent material when single colour temperature can be avoided to light, improve hot spot effect.
Description
Technical field
The present invention relates to technical field of lighting fixtures, more particularly to a kind of LED dimmed light sources and preparation method thereof.
Background technology
LED/light source is widely used to illumination and hand-held so that efficiency high, long lifespan, power consumption is low, high reliability
Equipment flash lamp field, the raising with people to light quality requirements, single colour temperature and brightness can not meet different fields
The lighting demand of conjunction, therefore increasing people selects Dimmable LED light source in life, to meet people under different occasions
To the demand of light.
In the prior art, typically realized by two ways, a kind of is the mould of packed LED chip combination bonding techniques
Formula, refers to Fig. 1-Fig. 3, and Fig. 1 is a kind of design structure of the adjustable radiant of packed LED chip in the prior art, and Fig. 2 is existing
Another design structure of the adjustable radiant of packed LED chip in technology, Fig. 3 is packed LED chip tunable optical in the prior art
Another design structure of light source, i.e., be divided into multigroup region, each region is used using box dam glue by the light-emitting area of LED/light source
The fluorescent glue (mixture of silica gel and fluorescent material) of gluing process filling different-colour reaches the purpose of multi color temperature tunable optical, this
The design of dimming LED (Light Emitting Diode) light-source structure exist it is clearly disadvantageous, firstly, since LED/light source uses packed LED chip, electrical equipment
Connection needs gold thread to connect, and because gold thread is very fragile, light source is if subjected to the extruding of external force, it is easy to which flexural deformation is even disconnected
Split and then cause the dead lamp of light source；Secondly, when two kinds of single colour temperatures are lighted respectively, it may appear that light source center has obvious skew；
When two kinds of colour temperature mixed lights are lighted, the photochromic of each region of hot spot of injection has obvious difference；
Another is the pattern of flip LED chips combination fluorescent powder jet printing technology, and flip LED chips first are distributed in into substrate
On, and at least two different colour temperatures are realized using the progress spraying of at least two fluorescent material, in spraying using steel mesh as tool,
Need to open a window above the flip LED chips of spraying and block other flip LED chips, although the dimming LED (Light Emitting Diode) light source of said structure
The effect of the respective uniform light extraction of different-colour can be realized, while mixed light is also more uniform, outstanding, the packing forms of upside-down mounting are also exempted from
The risk for having gone gold thread to be broken, makes LED/light source relatively reliable, it is well known that, the fluorescence of current colour rendering index more than 80
Powder scheme is all yellowish green powder and rouge and powder collocation, and the price of fluorescent material, especially rouge and powder is very expensive, and whole steel mesh is sprayed
Apply, loss is larger, substantially increases the cost of LED product, on the other hand, if LED chip arrangement is than comparatively dense, single color
Warm spot can excite the fluorescent material of another colour temperature when bright, can cause to have shadow in hot spot when the individually light of any colour temperature of hair
Picture, influences hot spot effect.
Therefore, how to improve dimming LED (Light Emitting Diode) light source manufacturing process, make dimming LED (Light Emitting Diode) light source reliability high, light mixing effect is uniform,
While outstanding, the loss of fluorescent material, reduces cost in reduction process, and improves hot spot effect, as art technology
Personnel's important technological problems urgently to be resolved hurrily.
The content of the invention
In view of this, the invention provides a kind of LED dimmed light sources and preparation method thereof, dimming LED (Light Emitting Diode) light source is made to reach
Reliability is high, light mixing effect is uniform, it is outstanding while, the loss of fluorescent material, reduces cost, and improve light in reduction process
The purpose of spot effect.
To achieve the above object, the present invention provides following technical scheme：
A kind of LED dimmed light sources preparation method, including step：
1) it is fixed, some flip LED chips are fixed on substrate；
2) some flip LED chips are divided at least two light-emitting zones, and lighted described at least two by subregion
The spaced arrangement of flip LED chips in region；
3) gluing, fluorescent glue is coated according to the light-emitting zone on each flip LED chips, to form at least two hairs
Light portion, and wherein at least one illuminating part is different from the colour temperature for the light beam that other illuminating parts are sent.
Preferably, some flip LED chips are fixed on the substrate by crystal-bonding adhesive or metal eutectic.
Preferably, different fluorescent glues is respectively coated on the flip LED core described at least two in light-emitting zone
On piece, and the illuminating part of different-colour is cured to form respectively.
Preferably, if the flip LED chips in the light-emitting zone are directly fixed on the substrate, in the light-emitting zone
Not flowable shaping fluorescent glue is coated on interior flip LED chips；
Or, the box dam around some flip LED chips is additionally provided with the substrate, then can be in the luminous zone
Flowable Flow Fluorescent Detector glue is coated on flip LED chips in domain.
Preferably, if the flip LED chips described at least two in light-emitting zone are directly fixed on the substrate, and
The box dam around some flip LED chips is provided with the substrate, then the upside-down mounting at least one described light-emitting zone
Flowable Flow Fluorescent Detector glue is coated in LED chip, is coated on the flip LED chips in remaining described light-emitting zone not flowable
Shaping fluorescent glue, and shaping fluorescent glue coating prior to Flow Fluorescent Detector glue coating carry out.
Preferably, it is luminous at this if the flip LED chips in the light-emitting zone are fixed on the substrate by bowl
Not flowable shaping fluorescent glue or flowable Flow Fluorescent Detector glue are coated on flip LED chips in region.
Preferably, the step 3) specifically include：
31) the first fluorescent glue is coated on each flip LED chips at least one described light-emitting zone；
32) the first fluorescent glue is solidify to form the first illuminating part；
33) the second fluorescent glue is coated on each flip LED chips in remaining described light-emitting zone；
34) the second fluorescent glue is solidify to form the second illuminating part.
A kind of LED dimmed light sources, including：
Some flip LED chips are provided with substrate, the substrate；
At least two illuminating parts, illuminating part flip LED chips and to be covered in the group each described as described in one group
The fluorescent adhesive layer filled in LED chip is constituted, the flip LED chips interphase distribution at least two illuminating parts, described at least one
Illuminating part is different from the colour temperature for the light beam that other illuminating parts are sent.
Preferably, some flip LED chips form multiple donuts on the substrate, and described at least two
Flip LED chips in illuminating part circumferentially interphase distribution.
Preferably, the fluorescent adhesive layer is mixed by fluorescent material with silica gel.
It can be seen from the above technical proposal that the LED dimmed light sources preparation methods that the present invention is provided, including step：1) it is solid
It is fixed, some flip LED chips are fixed on substrate；2) some flip LED chips are divided at least two luminous zones by subregion
The spaced arrangement of flip LED chips in domain, and at least two light-emitting zones；3) gluing, according to light-emitting zone it is each fall
Fluorescent glue is coated in dress LED chip, to form at least two illuminating parts, and wherein at least one illuminating part is sent out with other illuminating parts
The colour temperature of the light beam gone out is different；
Above-mentioned preparation method, using the packaged type of flip LED chips, it is not necessary to carry out electrical equipment connection using gold thread, can
High by property, external force extrudes the spaced arrangement of flip LED chips in not dead lamp, at least two light-emitting zones, can make mixed light
It is uniform in effect, outstanding, spraying is substituted in fluorescent glue mode for dispensing glue in process, the waste of fluorescent material can be greatly decreased,
The photic zone formed after reduction production cost, and fluorescence adhesive curing is contributed to play a part of reflection, refraction, it is to avoid single
The appearance of the phenomenon of the fluorescent material of another colour temperature is excited when color temperature is lighted, improves hot spot effect.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is the accompanying drawing used required in technology description to be briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, can be with
Other accompanying drawings are obtained according to these accompanying drawings.
Fig. 1 is a kind of design structure of the adjustable radiant of packed LED chip in the prior art；
Fig. 2 is another design structure of the adjustable radiant of packed LED chip in the prior art；
Fig. 3 is another design structure of the adjustable radiant of packed LED chip in the prior art；
The structural representation for the LED dimmed light sources that Fig. 4 provides for an embodiment of the present invention；
The structural representation for the LED dimmed light sources that Fig. 5 provides for another embodiment of the invention；
Fig. 6 is the structural representation of the bowl of LED dimmed light sources provided in an embodiment of the present invention.
Embodiment
The invention provides a kind of LED dimmed light sources and preparation method thereof, make dimming LED (Light Emitting Diode) light source reliability high to reach,
Light mixing effect is uniform, it is outstanding while, the loss of fluorescent material, reduces cost, and improve hot spot effect in reduction process
Purpose.
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is only a part of embodiment of the invention, rather than whole embodiments.It is based on
Embodiment in the present invention, it is every other that those of ordinary skill in the art are obtained under the premise of creative work is not made
Embodiment, belongs to the scope of protection of the invention.
A kind of LED dimmed light sources preparation method that the present invention is provided, including step：
S1：It is fixed, some flip LED chips are fixed on substrate；
S2：Subregion, some flip LED chips are divided at least two light-emitting zones, and at least two light-emitting zones
The spaced arrangement of flip LED chips；
S3：Gluing, fluorescent glue is coated according to light-emitting zone on each flip LED chips, is lighted with forming at least two
Portion, and wherein at least one illuminating part is different from the colour temperature for the light beam that other illuminating parts are sent.
Compared with prior art, the LED dimmed light sources preparation methods that the present invention is provided, using the encapsulation of flip LED chips
Mode, it is not necessary to carry out electrical equipment connection using gold thread, reliability is high, and external force is extruded in not dead lamp, at least two light-emitting zones
The spaced arrangement of flip LED chips, can make light mixing effect uniform, outstanding, in fluorescent glue mode for dispensing glue in process
Substitute spraying, the waste of fluorescent material can be greatly decreased, contribute to reduce production cost, and fluorescence adhesive curing after formed it is saturating
Photosphere can play a part of reflection, refraction, it is to avoid single colour temperature excites going out for the phenomenon of the fluorescent material of another colour temperature when lighting
It is existing, improve hot spot effect.
In the above method, some flip LED chips are fixed on substrate by crystal-bonding adhesive or metal eutectic, such as tin cream.
In embodiments of the present invention, it is respectively coated on the upside-down mounting at least two light-emitting zones using different fluorescent glues
In LED chip, and the illuminating part of different-colour is cured to form respectively.For example, using point gum machine, by two kinds of different fluorescent glues
It is respectively coated onto the flip LED chips of the first light-emitting zone and the second light-emitting zone, and is allowed to solidify to form first and lights
The colour temperature for the light beam that portion and the second illuminating part, the first illuminating part and the second illuminating part are sent is different.Further, two kinds not
In same fluorescent glue, a kind of is that, in the warm colour fluorescent glue formed after silica gel mixing, another is by just white glimmering by warm colour fluorescent material
The just white fluorescent glue that light powder is formed after being mixed with silica gel, solidification can be realized by the way of high-temperature baking.
Silica gel used in above-mentioned can be not flowable shaping silica gel, or flowable flowing silica gel is molded silicon
Glue forms shaping fluorescent glue after being mixed with fluorescent material, flowing silica gel forms Flow Fluorescent Detector glue after being mixed with fluorescent material, in LED light modulations
, it is necessary to which the mobility for fluorescent glue does appropriate adjustment in light source preparation process.
Such as, referring to Fig. 4, the structural representation for the LED dimmed light sources that Fig. 4 provides for an embodiment of the present invention, if
Flip LED chips 2 in light-emitting zone are directly fixed on substrate 1, then can be straight on the flip LED chips 2 in the light-emitting zone
Connect the not flowable shaping fluorescent glue of coating；
Or, if in another case, referring to Fig. 5, the LED light modulations that Fig. 5 provides for another embodiment of the invention
The structural representation of light source, if being additionally provided with the box dam 3 around some flip LED chips 2 on substrate 1, except it is this into
Outside type fluorescent glue, flowable Flow Fluorescent Detector glue also may be selected and is coated on the flip LED chips 2 in the light-emitting zone.
When the flip LED chips 2 at least two light-emitting zones are directly fixed on substrate 1, if all using flowing
Fluorescent glue, then may cause two kinds of Flow Fluorescent Detector glue mutually to mix, therefore, in embodiments of the present invention, to avoid above mentioned problem
Generation, if the flip LED chips 2 at least two light-emitting zones are directly fixed on substrate 1, and be provided with substrate 1
Around the box dam 3 of some flip LED chips 2, then coated on the flip LED chips 2 at least one light-emitting zone flowable
Not flowable shaping fluorescent glue, and shaping fluorescence are coated on flip LED chips 2 in Flow Fluorescent Detector glue, remaining light-emitting zone
Coating of the coating of glue prior to Flow Fluorescent Detector glue is carried out, i.e., shaping fluorescent glue is solidify to form photic zone, then in coating stream
Dynamic fluorescent glue, so as to avoid two kinds of fluorescent glues from mixing.
It is, of course, also possible to avoid fluorescent glue from mixing using other modes, such as, referring to Fig. 6, Fig. 6 is real for the present invention
The structural representation of the bowl of the LED dimmed light sources of example offer is provided, some bowls first can be set on substrate, 4, then in each bowl
Flip LED chips 2 are arranged in cup 4, in this case, then the bowl 4 of flip LED chips 2 are provided with the light-emitting zone
The not flowable shaping fluorescent glue of interior coating or flowable Flow Fluorescent Detector glue.
Flip LED chips 2 at least two light-emitting zones can be fixed on substrate 1 by bowl 4, can also wherein extremely
Flip LED chips 2 in a few light-emitting zone are fixed on substrate 1 by bowl 4, the flip LED core in remaining light-emitting zone
Piece 2 is directly fixed on substrate 1, in the latter case, and shaping fluorescence can be used in the flip LED chips 2 in remaining light-emitting zone
Glue is coated, if being provided with the upside-down mounting in the box dam 4 set around some flip LED chips 2, remaining light-emitting zone on substrate 1
Shaping fluorescent glue coating can be used in LED chip 2, it is possible to use Flow Fluorescent Detector glue is coated.
Further optimize above-mentioned technical proposal, in embodiments of the present invention, step S3 is specifically included：
S31：The first fluorescent glue is coated on each flip LED chips at least one light-emitting zone；
S32：First fluorescent glue is solidify to form the first illuminating part；
S33：The second fluorescent glue is coated on each flip LED chips in remaining light-emitting zone；
S34：Second fluorescent glue is solidify to form the second illuminating part.
As can be seen that often coating a kind of fluorescent glue from above-mentioned steps, after first being solidified, another fluorescence is coated with
Glue, so goes round and begins again and is completed until all fluorescent glues are coated.
It is of course also possible to after the completion of all fluorescent glues are coated, then the mode of integrally curing is carried out.
The embodiment of the present invention additionally provides a kind of LED dimmed light sources, and the LED dimmed light sources include substrate and at least two
Illuminating part, wherein, some flip LED chips are arranged on substrate；Illuminating part is by one group of flip LED chips and to be covered in the group every
Fluorescent adhesive layer on individual flip LED chips is constituted, the flip LED chips interphase distribution at least two illuminating parts, at least one
Illuminating part is different from the colour temperature for the light beam that other illuminating parts are sent.
Above-mentioned LED dimmed light sources use the encapsulating structure of upside-down mounting, and electrical equipment connection is carried out without gold thread, and reliability is high, resistance to
It is good with property, external force extruding will not extremely lamp, the illuminating part of different-colour is by one group of flip LED chips and corresponding fluorescence in addition
Glue-line is constituted, and directly fluorescent glue is coated on chip in preparation process, without tool and spraying, in the absence of the wave of fluorescent material
Take, can effectively control cost, and the reflected refraction ability that fluorescent adhesive layer has, excited when single colour temperature can be avoided to light another
The appearance of the phenomenon of the fluorescent material of color temperature, with preferable hot spot effect.
Further optimize above-mentioned technical proposal, some flip LED chips form multiple donuts on substrate, and at least
Flip LED chips in two illuminating parts circumferentially interphase distribution, this arrangement mode can make light mixing effect it is more uniform,
Remarkably, light source center is not in the phenomenon of skew.
Certainly above-mentioned arrangement mode is only a kind of preferred embodiment provided in an embodiment of the present invention, actual not office
It is limited to this, the arrangement of rectangular array can also be used, each row of rectangular array, each row are by between the illuminating part of different-colour
Constituted every arrangement.
In embodiments of the present invention, fluorescent adhesive layer is mixed by fluorescent material with silica gel, and above-mentioned silica gel can be to flow
Dynamic shaping silica gel, or flowable flowing silica gel.
The embodiment of each in this specification is described by the way of progressive, and what each embodiment was stressed is and other
Between the difference of embodiment, each embodiment identical similar portion mutually referring to.
The foregoing description of the disclosed embodiments, enables professional and technical personnel in the field to realize or using the present invention.
A variety of modifications to these embodiments will be apparent for those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, it is of the invention
The embodiments shown herein is not intended to be limited to, and is to fit to and principles disclosed herein and features of novelty phase one
The most wide scope caused.
Claims (10)
1. a kind of LED dimmed light sources preparation method, it is characterised in that including step：
1) it is fixed, some flip LED chips are fixed on substrate；
2) some flip LED chips are divided at least two light-emitting zones, and light-emitting zone described at least two by subregion
The spaced arrangement of interior flip LED chips；
3) gluing, fluorescent glue is coated according to the light-emitting zone on each flip LED chips, is lighted with forming at least two
Portion, and wherein at least one illuminating part is different from the colour temperature for the light beam that other illuminating parts are sent.
2. LED dimmed light sources preparation method according to claim 1, it is characterised in that some flip LED chips lead to
Cross crystal-bonding adhesive or metal eutectic is fixed on the substrate.
3. LED dimmed light sources preparation method according to claim 1, it is characterised in that apply different fluorescent glues respectively
Overlay on the flip LED chips described at least two in light-emitting zone, and be cured to form the luminous of different-colour respectively
Portion.
4. the LED dimmed light sources preparation methods according to claim any one of 1-3, it is characterised in that if the luminous zone
Flip LED chips in domain are directly fixed on the substrate, then coating can not flow on the flip LED chips in the light-emitting zone
Dynamic shaping fluorescent glue；
Or, the box dam around some flip LED chips is additionally provided with the substrate, then can be in the light-emitting zone
Flip LED chips on coat flowable Flow Fluorescent Detector glue.
5. LED dimmed light sources preparation method according to claim 4, it is characterised in that if luminous zone described at least two
Flip LED chips in domain are directly fixed on the substrate, and are provided with the substrate around some flip LEDs
The box dam of chip, then coat flowable Flow Fluorescent Detector glue on the flip LED chips at least one described light-emitting zone, remaining
Coat not flowable shaping fluorescent glue on flip LED chips in the light-emitting zone, and shaping fluorescent glue coating prior to
The coating of Flow Fluorescent Detector glue is carried out.
6. the LED dimmed light sources preparation methods according to claim any one of 1-3, it is characterised in that if the luminous zone
Flip LED chips in domain are fixed on the substrate by bowl, then are coated not on the flip LED chips in the light-emitting zone
Flowable shaping fluorescent glue or flowable Flow Fluorescent Detector glue.
7. the LED dimmed light sources preparation methods according to claim any one of 1-3, it is characterised in that the step 3) tool
Body includes：
31) the first fluorescent glue is coated on each flip LED chips at least one described light-emitting zone；
32) the first fluorescent glue is solidify to form the first illuminating part；
33) the second fluorescent glue is coated on each flip LED chips in remaining described light-emitting zone；
34) the second fluorescent glue is solidify to form the second illuminating part.
8. a kind of LED dimmed light sources, it is characterised in that including：
Some flip LED chips are provided with substrate, the substrate；
At least two illuminating parts, the illuminating part flip LED chips and is covered in each flip LED of the group as described in one group
Fluorescent adhesive layer on chip is constituted, the flip LED chips interphase distribution at least two illuminating parts, at least one described illuminating part
It is different from the colour temperature for the light beam that other illuminating parts are sent.
9. LED dimmed light sources preparation method according to claim 8, it is characterised in that some flip LED chips exist
Form multiple donuts on the substrate, and the circumferentially phase of the flip LED chips in illuminating part described at least two
Between arrange.
10. LED dimmed light sources preparation method according to claim 8, it is characterised in that the fluorescent adhesive layer is by fluorescent material
Mixed with silica gel.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109524393A (en) * | 2018-12-26 | 2019-03-26 | 福建天电光电有限公司 | A kind of double-colored COB of tunable optical Tai Ji moulding |
| CN113231283A (en) * | 2021-05-10 | 2021-08-10 | 哲恺创新科技(深圳)有限公司 | UV-LED curing device with adjustable point, line and surface light source |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102185042A (en) * | 2011-03-28 | 2011-09-14 | 北京大学深圳研究生院 | Light-emitting diode (LED) packaging method, packaging device and light adjusting method and system |
| CN104538388A (en) * | 2014-12-11 | 2015-04-22 | 佛山市国星光电股份有限公司 | Packaging method of LED light source adjustable in color temperature |
| CN105374807A (en) * | 2015-12-03 | 2016-03-02 | 易美芯光（北京）科技有限公司 | Color temperature adjustable LED integrated light source |
| CN106058017A (en) * | 2016-06-30 | 2016-10-26 | 宁波升谱光电股份有限公司 | LED assembly with continuous adjustable color temperature and preparation method thereof |
| CN106252337A (en) * | 2016-08-10 | 2016-12-21 | 华南师范大学 | A kind of LED integrated optical source of color rendering index and adjustable color |
-
2017
- 2017-05-11 CN CN201710329701.3A patent/CN106981482A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102185042A (en) * | 2011-03-28 | 2011-09-14 | 北京大学深圳研究生院 | Light-emitting diode (LED) packaging method, packaging device and light adjusting method and system |
| CN104538388A (en) * | 2014-12-11 | 2015-04-22 | 佛山市国星光电股份有限公司 | Packaging method of LED light source adjustable in color temperature |
| CN105374807A (en) * | 2015-12-03 | 2016-03-02 | 易美芯光（北京）科技有限公司 | Color temperature adjustable LED integrated light source |
| CN106058017A (en) * | 2016-06-30 | 2016-10-26 | 宁波升谱光电股份有限公司 | LED assembly with continuous adjustable color temperature and preparation method thereof |
| CN106252337A (en) * | 2016-08-10 | 2016-12-21 | 华南师范大学 | A kind of LED integrated optical source of color rendering index and adjustable color |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109524393A (en) * | 2018-12-26 | 2019-03-26 | 福建天电光电有限公司 | A kind of double-colored COB of tunable optical Tai Ji moulding |
| CN113231283A (en) * | 2021-05-10 | 2021-08-10 | 哲恺创新科技(深圳)有限公司 | UV-LED curing device with adjustable point, line and surface light source |
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