CN209691752U - A kind of double-colored temperature COB light source - Google Patents
A kind of double-colored temperature COB light source Download PDFInfo
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- CN209691752U CN209691752U CN201920903857.2U CN201920903857U CN209691752U CN 209691752 U CN209691752 U CN 209691752U CN 201920903857 U CN201920903857 U CN 201920903857U CN 209691752 U CN209691752 U CN 209691752U
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Abstract
The utility model relates to LED technology fields, in particular a kind of double-colored temperature COB light source, including substrate, several LED chips being distributed on substrate and the fluorescent glue for dimming color, LED chip is solid on the pad of substrate, LED chip forms corresponding multiple height color temperature regions, low color temperature dispensing region is that low color temperature fluorescent glue point is applied in LED chip, high color temperature dispensing region be by high color temperature fluorescent glue in light-emitting surface integral-filled covering LED chip, during fabrication, it is first that flip LED blue chip is solid on the substrate pads, then again by low color temperature fluorescence glue point on the chip of corresponding position, last one layer of fluorescent glue integral-filled again, the utility model, it can be realized with upside-down mounting COB packing forms, realize that high low color temperature uniform crossover formula on optical colour-mixing is distributed, even light mixing, light Chromaticity matter is good, while high low color temperature need not be separated with the form of box dam, chip can High Density Integration, product cost is low, good reliability, and manufacturing process is simple.
Description
Technical field
The utility model relates to LED technology field, specially a kind of double-colored temperature COB light source.
Background technique
COB light source be it is a kind of that LED chip is directly solid on substrate, using COB encapsulation technology by bonding wire or its
The high photosynthetic efficiency that his mode is bonded with circuit board integrates area source, and with resin or silica gel covering to ensure reliability, relative to
The LED light source of other structures has electrical stabilization, Gao Xianse, the uniform, rapid heat dissipation that shines, is convenient for light distribution, exempts from reflow soldering, drop
The advantages that low Design of Luminaires difficulty, therefore had been more and more widely used in LED encapsulation technology field.
Currently, COB light source majority is only able to display a kind of colour temperature, turning for two kinds of colour temperatures can not be carried out inside the same COB
It changes, is unable to satisfy the demand of certain scene applications, and the COB light source of monochromatic temperature is also brought to the application of COB light source lamps and lanterns
Certain limitation.And some color temperature-tunable COB light sources on the market, mainly half-and-half filling, annular filling, strip filling
The fluorescent glue of high low color temperature is controlled, and arranges the CSP or low color temperature CSP and blue chip of high low color temperature on substrate, so
One layer of fluorescent adhesive layer is being covered afterwards to achieve the purpose that change colour temperature.First three form filling area is big, and light-emitting surface is big, can not
Uniformly go out light, there is halation, light type can generate variation when adjusting, and color quality is poor, and internal the form of box dam must be used height color
Temperature area separates, and complex process, packaging technology is mostly formal dress COB, and dead lamp rate is high.Latter two form is since CSP cost is too high, body
Product is big, so the interval between LED chip is larger, this kind of COB light source cannot achieve High Density Integration.
Utility model content
It is mentioned above in the background art to solve the purpose of this utility model is to provide a kind of double-colored temperature COB light source
Problem.The double-colored temperature COB light source can be realized with upside-down mounting COB packing forms, realize that high low color temperature is uniformly handed on optical colour-mixing
V shape distribution, even light mixing, color quality is good, while high low color temperature need not be separated with the form of box dam, and chip can high density collection
At product cost is low, good reliability, and manufacturing process is simple.
To achieve the above object, the utility model provides the following technical solutions:
A kind of double-colored temperature COB light source, including substrate, several LED chips being distributed on substrate and for dimming the glimmering of color
Optical cement, the LED chip is solid on the pad of substrate, and the LED chip forms corresponding multiple height color temperature regions, the height
Low color temperature region includes high color temperature region, low color temperature region, is distributed for uniform crossover formula, the low color temperature region is by low color temperature
Fluorescent glue point is applied to LED chip and is realized, the high color temperature region is covered high color temperature fluorescent glue is integral-filled in light-emitting surface
Lid LED chip is realized.
Further, the substrate is upside-down mounting COB substrate, and the LED chip is flip LED blue light core.
Further, the LED chip quantity in the height color temperature regions is one or more, the height color temperature regions
Between need not be separated with the form of box dam.
Further, the low color temperature region includes the low color temperature dispensing region of several small areas of corresponding position, high
Color temperature regions include the high color temperature dispensing region of its remaining as entirety in addition to low color temperature region.
Further, the fluorescent glue includes high color temperature fluorescent glue and low color temperature fluorescent glue.
Further, the fluorescent glue is the fluorescent powder of different type and ratio and the mixture of silica gel, the fluorescent glue
Low color temperature part of properties is that viscosity is high, mobility is small.
The utility model also provides a kind of manufacturing method of double-colored temperature COB light source, includes the following steps:
Step 1: first consolidating LED chip on the pad of substrate；
Step 2: and then by low color temperature fluorescence glue point in the LED chip of corresponding position；
Step 3: last one layer of high color temperature fluorescent glue integral-filled again.
Further, in step 2-3: in low color temperature dispensing region, the small low color temperature fluorescent glue of point sticky degree high fluidity is real
Existing low color temperature shines, then again in high color temperature dispensing area filling high color temperature fluorescent glue.
Further, in step 2-3: on low color temperature dispensing region mold mould top, the form of low color temperature fluorescent glue is realized low
Colour temperature shines, then again in high color temperature dispensing area filling high color temperature fluorescent glue.
Further, in step 2-3: in low color temperature dispensing region, spraying low color temperature fluorescent glue realizes that low color temperature shines,
Then again in high color temperature dispensing area filling high color temperature fluorescent glue.
Compared with prior art, the utility model has the beneficial effects that
The utility model separates without having to by the height color temperature regions on substrate, it is only necessary on corresponding low color temperature position
The small fluorescent glue of one layer of viscosity high fluidity of LED chip spot printing, then integral-filled one layer of fluorescent glue in filling region
Realize the COB light source of multi color temperature, this kind of light-source structure is simple, and manufacturing process is simple；When manufacture, first by flip LED blue chip
Gu on substrate, then again by low color temperature fluorescence glue point on the chip of corresponding position, last integral-filled one layer of fluorescent glue again
.It is possible thereby to realize that high low color temperature uniform crossover formula on optical colour-mixing is distributed, even light mixing, color quality is good, height
Colour temperature need not be separated with the form of box dam, chip can High Density Integration, product cost is low, good reliability, and manufacturing process is simple.
Detailed description of the invention
Fig. 1 is in upside-down mounting COB substrate.
Fig. 2 is the schematic diagram that box dam, die bond are put on Fig. 1 substrate.
Fig. 3 is in low color temperature dispensing region point fluorescent glue schematic diagram.
Fig. 4 is the schematic diagram in high color temperature dispensing region point fluorescent glue.
In figure: 1- substrate, 2- pad, 3-LED chip, 4- box dam, 5- low color temperature dispensing region, 6- high color temperature glue application region
Domain.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
In the description of the present invention, it should be noted that term " up/down end ", "inner", "outside" " front end ", " after
The orientation or positional relationship of the instructions such as end ", " both ends ", " one end ", " other end " is that orientation based on the figure or position are closed
System, is merely for convenience of describing the present invention and simplifying the description, rather than the device or element of indication or suggestion meaning are necessary
It with specific orientation, is constructed and operated in a specific orientation, therefore should not be understood as limiting the present invention.In addition,
Term " first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " is pacified
Dress ", " be arranged/be arranged with ", " socket ", " connection " etc., shall be understood in a broad sense, such as " connection ", may be a fixed connection, can also
To be to be detachably connected, or be integrally connected；It can be mechanical connection, be also possible to be electrically connected；It can be directly connected, it can also
Indirectly connected through an intermediary, can be the connection inside two elements.For the ordinary skill in the art,
The concrete meaning of above-mentioned term in the present invention can be understood with concrete condition.
Fig. 1-4 is please referred to, the utility model provides a kind of technical solution:
A kind of double-colored COB light source, including substrate 1, several LED chips 3 being distributed on substrate 1 and for dimming the glimmering of color
Optical cement, the substrate 1 are upside-down mounting COB substrate, and the LED chip 3 is solid on the pad 2 of substrate 1, and the LED chip 3 is upside-down mounting
LED blue chip, the LED chip 3 form corresponding multiple height color temperature regions, the height color temperature regions uniform crossover formula
It is distributed, 3 quantity of LED chip in the height color temperature regions is one or more, and the height color temperature regions need not use box dam 4
Form separate, the low color temperature region formed several small areas low color temperature dispensing region 5 and its it is remaining be one
Whole high color temperature dispensing region 6, low color temperature dispensing region 5 is that low color temperature fluorescent glue point is applied on chip, and area is small,
High color temperature dispensing region 6 be by high color temperature fluorescent glue in light-emitting surface integral-filled covering LED chip 3, the fluorescent glue
For the mixture of the fluorescent powder and silica gel of different type and ratio, the fluorescent glue low color temperature part of properties is viscosity high fluidity
It is small.The fluorescent glue of the present embodiment includes high color temperature fluorescent glue and low color temperature fluorescent glue, high low color temperature light emitting region uniform crossover formula
Distribution, flip LED blue chip generate the white light of different-colour by exciting different fluorescent glues.
There are many preparation methods of the COB of the utility model:
1, as shown in Figure 1, 2, after the completion of 1 box dam 4 of substrate, die bond, as shown in Figure 3 in 5, low color temperature dispensing region viscosity
The small low color temperature fluorescent glue of high fluidity realizes that low color temperature shines, and then fills height in high color temperature dispensing region 6 again as shown in Figure 4
Colour temperature fluorescent glue.
2, as shown in Figure 1, 2, after the completion of 1 box dam 4 of substrate, die bond, as shown in Figure 3 in 5 mold mould of low color temperature dispensing region
It pushes up low color temperature fluorescent glue and realizes that low color temperature shines, then fill high color temperature fluorescent glue in high color temperature dispensing region 6 again as shown in Figure 4
.
3, it as shown in Figure 1, 2, after the completion of 1 box dam 4 of substrate, die bond, is sprayed as shown in Figure 3 in low color temperature dispensing region 5 low
Colour temperature fluorescent glue realizes that low color temperature shines, and then fills high color temperature fluorescent glue in high color temperature dispensing region 6 again as shown in Figure 4 and is
It can.
As an improvement, the height color temperature regions pass through a fluorescent glue, then fill above again one layer of fluorescent glue or
There is no the silica gel form of fluorescent powder to realize.
As an improvement, the height color temperature regions pass through mold mould top, then fill above again one layer of fluorescent glue or
There is no the silica gel form of fluorescent powder to realize.
It dusts, then fill one layer of fluorescent glue above again or does not have as an improvement, the height color temperature regions pass through
The silica gel form of fluorescent powder is realized.
The utility model separates without having to by the height color temperature regions on substrate 1, it is only necessary on corresponding low color temperature position
The small fluorescent glue of LED chip 3 spot printing, one layer of high viscosity flow, then integral-filled one layer of fluorescent glue in filling region
Realize the COB light source of multi color temperature, this kind of light-source structure is simple, and manufacturing process is simple；When manufacture, first by flip LED blue chip
Gu on the pad 2 of substrate 1, then again by low color temperature fluorescence glue point on the chip of corresponding position, finally again integral-filled one
Layer fluorescent glue.It is possible thereby to realize that high low color temperature uniform crossover formula on optical colour-mixing is distributed, and even light mixing, color quality
Good, high low color temperature need not be separated with the form of box dam, chip can High Density Integration, product cost is low, good reliability, manufacturing process
Simply.
The utility model is separated the LED chip 3 on substrate 1 using the small low color temperature fluorescent glue of viscosity high fluidity,
Point is on corresponding chip, then fills high color temperature fluorescent glue in high color temperature dispensing region 6 and the COB light of multi color temperature can be realized
Source, this kind of light-source structure is simple, and manufacturing process is simple；High low color temperature uniform crossover formula point on optical colour-mixing is realized simultaneously
Cloth, even light mixing, color quality are good；In addition, LED chip 3 is blue chip, and it is at low cost, it is small in size, therefore may be implemented
The High Density Integration of LED chip 3；And LED packaging technology is reverse installation process, the dead lamp risk of product is small, good reliability.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired
Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.
Claims (5)
1. a kind of double-colored temperature COB light source, it is characterised in that: including substrate (1), several LED chips being distributed on substrate (1)
(3) and the fluorescent glue for dimming color, the LED chip (3) consolidate LED chip (3) shape on the pad (2) of substrate (1)
At corresponding multiple height color temperature regions, it is uniform crossover that the height color temperature regions, which include high color temperature region, low color temperature region,
Formula distribution, the low color temperature region is that low color temperature fluorescent glue point is applied on LED chip (3) to be realized, the high color temperature region
It is that integral-filled covering LED chip (3) is realized in light-emitting surface by high color temperature fluorescent glue.
2. the double-colored temperature COB light source of one kind according to claim 1, it is characterised in that: the substrate (1) is upside-down mounting COB base
Plate, the LED chip (3) are flip LED blue light core.
3. the double-colored temperature COB light source of one kind according to claim 1, it is characterised in that: the LED in the height color temperature regions
Chip (3) quantity is one or more, need not be separated with the form of box dam (4) between the height color temperature regions.
4. the double-colored temperature COB light source of one kind according to claim 1, it is characterised in that: the low color temperature region includes corresponding
The low color temperature dispensing region (5) of several small areas of position, high color temperature region include that its is remaining i.e. in addition to low color temperature region
For the high color temperature dispensing region (6) of an entirety.
5. the double-colored temperature COB light source of one kind according to claim 1, it is characterised in that: the fluorescent glue includes that high color temperature is glimmering
Optical cement and low color temperature fluorescent glue, low color temperature fluorescence adhesiveness is high, mobility is small.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920903857.2U CN209691752U (en) | 2019-06-17 | 2019-06-17 | A kind of double-colored temperature COB light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920903857.2U CN209691752U (en) | 2019-06-17 | 2019-06-17 | A kind of double-colored temperature COB light source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209691752U true CN209691752U (en) | 2019-11-26 |
Family
ID=68609546
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920903857.2U Active CN209691752U (en) | 2019-06-17 | 2019-06-17 | A kind of double-colored temperature COB light source |
Country Status (1)
| Country | Link |
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| CN (1) | CN209691752U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111554787A (en) * | 2020-05-15 | 2020-08-18 | 珠海市宏科光电子有限公司 | COB structure packaging process convenient for dimming and color mixing |
| CN112151519A (en) * | 2020-10-23 | 2020-12-29 | 开发晶照明（厦门）有限公司 | Chip-on-board type photoelectric device |
-
2019
- 2019-06-17 CN CN201920903857.2U patent/CN209691752U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111554787A (en) * | 2020-05-15 | 2020-08-18 | 珠海市宏科光电子有限公司 | COB structure packaging process convenient for dimming and color mixing |
| CN112151519A (en) * | 2020-10-23 | 2020-12-29 | 开发晶照明（厦门）有限公司 | Chip-on-board type photoelectric device |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220510 Address after: 523000 Room 301, No. 16, West Sixth lane, Shanmei Xinzhuang, Houjie Town, Dongguan City, Guangdong Province Patentee after: Huachen Intelligent Technology (Dongguan) Co.,Ltd. Address before: 516000 3rd floor, No.5 factory building, Daxin group, Shuguang Avenue, Chenjiang sub district office, Zhongkai high tech Zone, Huizhou City, Guangdong Province Patentee before: Zhongkai photoelectric technology (Huizhou) Co.,Ltd. |
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| TR01 | Transfer of patent right |