CN110021586A - A kind of LED lamp bead of wiring board and preparation method thereof - Google Patents
A kind of LED lamp bead of wiring board and preparation method thereof Download PDFInfo
- Publication number
- CN110021586A CN110021586A CN201810034259.6A CN201810034259A CN110021586A CN 110021586 A CN110021586 A CN 110021586A CN 201810034259 A CN201810034259 A CN 201810034259A CN 110021586 A CN110021586 A CN 110021586A
- Authority
- CN
- China
- Prior art keywords
- lamp bead
- cup
- wiring board
- chip
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000011324 bead Substances 0.000 title claims abstract description 66
- 238000002360 preparation method Methods 0.000 title abstract description 5
- 239000003292 glue Substances 0.000 claims abstract description 14
- 238000005520 cutting process Methods 0.000 claims abstract description 8
- 238000005538 encapsulation Methods 0.000 claims abstract description 8
- 238000007711 solidification Methods 0.000 claims abstract description 6
- 230000008023 solidification Effects 0.000 claims abstract description 6
- 230000005540 biological transmission Effects 0.000 claims description 15
- 239000000853 adhesive Substances 0.000 claims description 10
- 230000001070 adhesive effect Effects 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 9
- 238000004806 packaging method and process Methods 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 239000007769 metal material Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 238000004026 adhesive bonding Methods 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 235000003392 Curcuma domestica Nutrition 0.000 description 4
- 244000008991 Curcuma longa Species 0.000 description 4
- 235000003373 curcuma longa Nutrition 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 235000013976 turmeric Nutrition 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 238000005553 drilling Methods 0.000 description 2
- 241000872198 Serjania polyphylla Species 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
The present invention relates to LED lamp beads of a kind of wiring board and preparation method thereof, specifically, multiple LED chips are subjected to die bond bonding wire in the circuit board, or in the circuit board by the weldering of multiple flip LED chips, upper glue is applied in back with holes, the chip gap location being attached on wiring board, hole cup is formed after solidification, the chip that bottom of a cup has had in hole and wiring board is connected, then encapsulation glue, baking-curing is added dropwise in cup again, then cuts into multiple one cup lamp beads with cutting machine, either multiple more glasss of lamp beads, are fabricated to the LED lamp bead of wiring board.
Description
Technical field
The present invention relates to wiring board and LED application fields, and in particular to a kind of LED lamp bead of wiring board and its production side
Method.
Background technique
The luminous patch lamp bead of wide-angle is produced for making Christmas lamp, copper wire lamp and LED display, liquid crystal panel backlight etc.
Product are all to make of mould top method, equipment investment is big, and packaging plastic is expensive, in addition makes when the prior art makes wide-angle lamp bead
It is all the single group one cup RGB lamp bead of production, only lamp bead is smaller, could make high density display screen, still when display screen lamp bead
Lamp bead is too small, and SMT patch difficulty is big, and patch yield is low, and is difficult to make since solder joint is small very easy to fall off after the too small patch of lamp bead
Make high density display screen, and existing high density display screen lamp bead is all the transparent lamp bead without cup, light emitting angle is too big, lamp
Colour contamination colour mixture between pearl causes display screen clarity bad.
For the defect and deficiency more than overcoming, the present invention, which takes, produces both light-permeable cups with the method for adhesive patch cup
Lamp bead, and can be the lamp bead of opaque cup, either one cup lamp bead can be more glasss of lamp beads again, avoid the height on mould top
The lamp bead invested high cost, while can make that display screen is apparent with lighttight band cup lamp bead again, while being made again of more glasss,
The more stress of lamp bead leg are big, and not easily to fall off after SMT welding, yield is high, high-efficient, can do more high density display screen, while adopting envelope
The mode for pasting cup after dress die bond bonding wire again, solves and has pasted cup before die bond bonding wire, in cup very little, die bond mouth and bonding wire porcelain mouth
Under the problem of not going.
Summary of the invention
The present invention relates to LED lamp beads of a kind of wiring board and preparation method thereof, specifically, in the circuit board will be multiple
LED chip carries out die bond bonding wire, or in the circuit board by the weldering of multiple flip LED chips, applies upper glue in back with holes,
The chip gap location being attached on wiring board forms hole cup after solidification, in hole, bottom of a cup has had the chip with wiring board conducting, so
Encapsulation glue, baking-curing is added dropwise in cup again afterwards, then cuts into multiple one cup lamp beads or multiple more glasss of lamps with cutting machine
Pearl is fabricated to the LED lamp bead of wiring board.
A kind of production method of the LED lamp bead of wiring board is provided according to the present invention, specifically, in two-sided or multilayer
On wiring board, multiple LED chips are subjected to die bond bonding wire, or in the circuit board by the weldering of multiple flip LED chips, with multiple
The back in hole is applied with glue, the chip gap location being attached on wiring board, multiple hole cups is formed after solidification, in the cup of hole
There is the chip with wiring board conducting, then apply encapsulation glue in cup again, solidification cuts into multiple one cup lamps with cutting machine
Pearl or be the multiple more glasss of lamp beads of cutting, wherein the plate with multiple holes is the plate of light transmission or is lighttight plate, if it is
When the plate of light transmission, the light emitting angle of the lamp bead encapsulated out is more than or equal to 180 degree, if not light transmission plate when, encapsulate out
Lamp bead light emitting angle be less than 180 degree.
Bright a kind of LED lamp bead of wiring board is provided according to originally returning, comprising: two-sided or multilayer circuit board；Adhesive band
The cured adhesive of orifice plate；The hole cup that perforated plate is formed；It is encapsulated in the LED chip of bottom of a cup；Cured packaging plastic；The back side
There are multiple metal solder joints for being soldered on wiring board by scolding tin；It is characterized in that, described paste the cured of perforated plate
Adhesive is the resin adhesive or lighttight resin adhesive of light transmission, and the perforated plate is the resin system with light transmission
At or be made of lighttight resin material or be made of metal material or be to use inorganic non-metallic
Made of material, if perforated plate is light transmission, the light emitting angle of lamp bead is more than or equal to 180 degree, if perforated plate is not
Light transmission, the light emitting angle of lamp bead is less than 180 degree, the side of lamp bead, which is to cut out, to be come, and forms side and the cup of wiring board
Side is in a plane or curved surface, and one cup of a lamp bead or be the multiple cups of lamp bead has a core in one cup
Piece either has multiple chips in a cup, and chip is positive cartridge chip or is flip-chip or is CSP chip.
According to a preferred embodiment of the invention, the LED lamp bead of a kind of wiring board, which is characterized in that described
When LED lamp bead is multiple glasss of a lamp bead, for making LED display.
According to a preferred embodiment of the invention, the LED lamp bead of a kind of wiring board, which is characterized in that described
When LED lamp bead is one cup of a lamp bead, for making display screen, Christmas lamp, copper wire lamp, light bar, panel light and ceiling lamp.
In the description below to the drawings and specific embodiments, the thin of one or more embodiments of the invention will be illustrated
Section.
Detailed description of the invention
By reading this specification in conjunction with the following drawings, features, objects and advantages of the invention will become more to show and easy
See, it is as follows to the brief description of accompanying drawing.
Fig. 1 is the floor map of the double-faced packaging wiring board of turmeric.
Fig. 2 is the floor map on the double-faced packaging wiring board of turmeric after die bond bonding wire.
Fig. 3 is the floor map of more glasss of cup plates of production.
Fig. 4 is that the wiring board 1 after more glasss of cup plates and die bond bonding wire aligns the floor map being pasted together.
Fig. 5 is the floor map of the RGB line road plate LED lamp bead of more glasss of multiple groups.
Fig. 6 is the schematic cross-section of the RGB line road plate LED lamp bead of more glasss of multiple groups.
Fig. 7 is the floor map of the RGB line road plate LED lamp bead of single group one cup.
Fig. 8 is the schematic cross-section of the RGB line road plate LED lamp bead of single group one cup.
Specific embodiment
The present invention will be described in detail by taking preferred embodiment as an example below.
It should be appreciated to those skilled in the art that as described below be merely illustrative and describe some preferred implementation sides
Formula to claim of the invention and does not have any restrictions.
It by the double-faced packaging wiring board 1 of turmeric as shown in Figure 1, is placed on and helps in light DB382 bonder, by multiple groups R, G, B
2 die bond of LED chip on the double-faced packaging wiring board 1 of turmeric, baking-curing is then golden by ASM-AB350 bonding equipment
Belong to bonding wire 3 for the LED chip 2 of multiple groups R, G, B, bonding wire connects in the correspondence pad in assist side 1 (as shown in Figure 2).
Release agent is coated on the surface of die cavity pelvic surface of sacrum, then epoxy transparent resistant to high temperature encapsulation glue is infused in die cavity basin
Levelling, baking-curing form transparent epoxy plate 4, then take out in die cavity basin, according to the position of design on epoxy plate 4
Drilling bore hole forms hole cup 4.1, and more glasss of cup plates (as shown in Figure 3) of light transmission or black with the FR4 of 0.4~0.6mm thickness have been made
The glass-fiber-plate 4 of chromoresin, according to the position of design on the glass-fiber-plate 4 of black resin drilling bore hole, formed hole cup 4.1, thus
Lighttight more glasss of cup plates (as shown in Figure 3) have been made.
By lighttight more glasss of cups plate one side with dispenser point encapsulation glue on cup plate, then with the line after die bond bonding wire
Road plate 1 contraposition be pasted together, more glasss of cup plates have been attached on the gap of every group of chip, be formed in a cup 4.1 have one group of R,
G, the LED chip 2 of B, then the baking-curing in oven, cements glue (such as Fig. 4 institute cup plate and the firm connection of wiring board 1
Show), encapsulation glue 6 is uniformly put in each cup 4.1 with dispenser, baking-curing cuts into more glasss of multiple groups with cutting machine
RGB line road plate LED lamp bead (as shown in Figure 5, Figure 6).
Or more glasss of cup plate one side dispenser points of light transmission are encapsulated into glue on cup plate, then and after die bond bonding wire
The contraposition of wiring board 1 is pasted together, and more glasss of cup plates have been attached on the gap of every group of chip, and being formed in a cup 4.1 has one group
R, the LED chip 2 of G, B, then the baking-curing in oven, makes glue that cup plate and the firm connection of wiring board 1 are cemented (such as Fig. 4
It is shown), encapsulation glue 6 is uniformly put in each cup 4.1 with dispenser, baking-curing cuts into single group list with cutting machine
The RGB line road plate LED lamp bead (as shown in Figure 7, Figure 8) of cup.
A kind of specific embodiment of the LED lamp bead of wiring board and preparation method thereof carries out the present invention in conjunction with attached drawing above
Detailed description.It will be understood by those skilled in the art, however, that the above be merely illustrative and describe it is some specific
Embodiment to this with novel range, especially the scope of the claims, and does not have any restrictions.
Claims (4)
1. a kind of production method of the LED lamp bead of wiring board, specifically, on two-sided or multilayer circuit board, by multiple LED
Chip carries out die bond bonding wire, or in the circuit board by the weldering of multiple flip LED chips, applies gluing in the back with multiple holes
Water, the chip gap location being attached on wiring board form multiple hole cups after solidification, had in the cup of hole and wiring board conducting
Chip, then again in cup apply encapsulation glue, solidification, with cutting machine cut into multiple one cup lamp beads or be cutting it is multiple
More glasss of lamp beads, wherein the plate with multiple holes is the plate of light transmission or is lighttight plate, if it is light transmission plate when, encapsulate out
Lamp bead light emitting angle be more than or equal to 180 degree, if not light transmission plate when, the lamp bead light emitting angle encapsulated out is less than
180 degree.
2. a kind of LED lamp bead of wiring board, comprising:
Two-sided or multilayer circuit board；
Paste the cured adhesive of perforated plate；
The hole cup that perforated plate is formed；
It is encapsulated in the LED chip of bottom of a cup；
Cured packaging plastic；
There are multiple metal solder joints for being soldered on wiring board by scolding tin at the back side；
It is characterized in that, the cured adhesive for pasting perforated plate is the resin adhesive of light transmission or opaque
Resin adhesive, the perforated plate be made of the resin of light transmission or be made of lighttight resin material or
Person is made of metal material or is made of inorganic non-metallic material, if perforated plate is light transmission, the hair of lamp bead
Angular is more than or equal to 180 degree, if perforated plate be it is lighttight, the light emitting angle of lamp bead is less than 180 degree, the side of lamp bead
While be to cut out, the side of wiring board and the side of cup are formed in a plane or curved surface, one cup of a lamp bead,
The either multiple cups of lamp bead, having in a cup in a chip either cup has multiple chips, and chip is positive cored
Piece or it is flip-chip or is CSP chip.
3. a kind of LED lamp bead of wiring board according to claim 1 or 2, which is characterized in that the LED lamp bead is one
At multiple glasss of a lamp bead, for making LED display.
4. a kind of LED lamp bead of wiring board according to claim 1 or 2, which is characterized in that the LED lamp bead is one
When a one cup of lamp bead, for making display screen, Christmas lamp, copper wire lamp, light bar, panel light and ceiling lamp.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810034259.6A CN110021586A (en) | 2018-01-09 | 2018-01-09 | A kind of LED lamp bead of wiring board and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810034259.6A CN110021586A (en) | 2018-01-09 | 2018-01-09 | A kind of LED lamp bead of wiring board and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110021586A true CN110021586A (en) | 2019-07-16 |
Family
ID=67188267
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810034259.6A Withdrawn CN110021586A (en) | 2018-01-09 | 2018-01-09 | A kind of LED lamp bead of wiring board and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110021586A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111525015A (en) * | 2020-04-10 | 2020-08-11 | 浙江英特来光电科技有限公司 | LED full-color display panel and packaging method thereof |
| CN112483922A (en) * | 2019-08-24 | 2021-03-12 | 王定锋 | Closed LED lamp strip manufactured by light-transmitting adhesive film and manufacturing method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100780182B1 (en) * | 2006-11-16 | 2007-11-27 | 삼성전기주식회사 | Chip coating type light emitting diode package and fabrication method thereof |
| JP2011238802A (en) * | 2010-05-11 | 2011-11-24 | Panasonic Corp | Light-emitting module and illuminating device using the same |
| CN203300159U (en) * | 2013-07-09 | 2013-11-20 | 深圳市华海诚信电子显示技术有限公司 | Chip-on-board packaging technology based light-emitting diode (LED) display screen |
| CN105810115A (en) * | 2016-05-30 | 2016-07-27 | 深圳市奥蕾达科技有限公司 | Novel chip on board (COB) full color light-emitting diode (LED) light-emitting panel and manufacturing method thereof |
| CN207868197U (en) * | 2018-01-09 | 2018-09-14 | 王定锋 | A kind of LED lamp bead of wiring board |
-
2018
- 2018-01-09 CN CN201810034259.6A patent/CN110021586A/en not_active Withdrawn
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100780182B1 (en) * | 2006-11-16 | 2007-11-27 | 삼성전기주식회사 | Chip coating type light emitting diode package and fabrication method thereof |
| JP2011238802A (en) * | 2010-05-11 | 2011-11-24 | Panasonic Corp | Light-emitting module and illuminating device using the same |
| CN203300159U (en) * | 2013-07-09 | 2013-11-20 | 深圳市华海诚信电子显示技术有限公司 | Chip-on-board packaging technology based light-emitting diode (LED) display screen |
| CN105810115A (en) * | 2016-05-30 | 2016-07-27 | 深圳市奥蕾达科技有限公司 | Novel chip on board (COB) full color light-emitting diode (LED) light-emitting panel and manufacturing method thereof |
| CN207868197U (en) * | 2018-01-09 | 2018-09-14 | 王定锋 | A kind of LED lamp bead of wiring board |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112483922A (en) * | 2019-08-24 | 2021-03-12 | 王定锋 | Closed LED lamp strip manufactured by light-transmitting adhesive film and manufacturing method thereof |
| CN111525015A (en) * | 2020-04-10 | 2020-08-11 | 浙江英特来光电科技有限公司 | LED full-color display panel and packaging method thereof |
| CN111525015B (en) * | 2020-04-10 | 2021-09-17 | 浙江英特来光电科技有限公司 | LED full-color display panel and packaging method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20190716 |