CN107146838B - A kind of packaging technology and LED component of LED component - Google Patents
A kind of packaging technology and LED component of LED component Download PDFInfo
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- CN107146838B CN107146838B CN201710541356.XA CN201710541356A CN107146838B CN 107146838 B CN107146838 B CN 107146838B CN 201710541356 A CN201710541356 A CN 201710541356A CN 107146838 B CN107146838 B CN 107146838B
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- led lamp
- lamp bead
- light led
- polychromatic light
- heat exchange
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
Abstract
The present invention relates to a kind of packaging technologies of LED component, comprising: multiple polychromatic light LED lamp beads are carried out one-step mould using the technique of molding in the form of cell array by A., are molded the glue used as the mixture of fluorescent powder and colloid；B. multiple polychromatic light LED lamp beads after one-step mould are divided into single polychromatic light LED lamp bead；C. polychromatic light LED lamp bead and monochromatic light LED lamp bead are subjected to secondary mould pressing according on more color design requirement patches to pcb board.By one-step mould rather than the technical solution of dot fluorescent powder and colloid admixture can obtain the consistent white light LEDs lamp bead of white light color height, by secondary mould pressing, flexibility, the patch type, extensive and efficiently production LED component packaging technology of polychromatic light scheme may be implemented.The present invention also provides the LED components using the production of above-mentioned technique.
Description
Technical field
The present invention relates to LED encapsulation technology fields, and in particular to a kind of packaging technology and LED component of LED component.
Background technique
LED Packaging Industry towards can be mass-produced, low cost, flexible design, smaller trend development, symbol
Close lightening, highly integrated, small size the application trend of LED product.Especially in instruction backlight application field, in very little size
The chip of more different colours is integrated on backlight substrate.
Fig. 7 is the schematic diagram of the section structure of a LED component of the prior art.The more color LED of pcb board plane mainly by
The composition such as pcb board, 2-4 chips, gold thread, packaging plastic, crystal-bonding adhesive；Wherein white light is excited by blue-ray LED in more color combinations
Obtained from fluorescent powder.
It is a greatly challenge for PCB encapsulation when having white light in the combination of more colors.Wherein, more color combinations
Middle white light is as obtained from blue-ray LED excitated fluorescent powder.When putting fluorescent glue on the backlight substrate of planar structure, shape is formed
Shape is not easily controlled, and causes white light color consistency poor, and yields is not high, therefore is not easy to realize large-scale production.
Summary of the invention
The technical problem to be solved by the present invention is proposing that white light color height is consistent when the combination of more colors can be achieved in one kind
, can flexibility patch type, extensive, efficiently production LED component packaging technology.
A kind of packaging technology of LED component, comprising:
A. multiple polychromatic light LED lamp beads are subjected to one-step mould, molding using the technique of molding in the form of cell array
The glue used is the mixture of fluorescent powder and colloid；
B. multiple polychromatic light LED lamp beads after one-step mould are divided into single polychromatic light LED lamp bead；
C. polychromatic light LED lamp bead and monochromatic light LED lamp bead are carried out according on more color design requirement patches to pcb board
Secondary mould pressing.
Preferably, step A includes:
A1. the printing solder in LED substrate, by the monochromatic light chip of polychromatic light LED lamp bead according to polychromatic light design requirement
Paste corresponding position；
A2. monochromatic light chip is welded to by corresponding position by Reflow Soldering；
A3. the LED substrate after Reflow Soldering is placed in moulding press and carries out one-step mould.
Preferably, before step A1, further includes:
A0. LED substrate is designed according to polychromatic light design requirement, the patch position of monochromatic light chip is designed in LED substrate
It sets.
Preferably, after step B, before step C further include:
Polychromatic light LED lamp bead after segmentation is sorted；
In step C: polychromatic light LED lamp bead is the polychromatic light LED lamp bead after sorting.
Preferably, step C includes:
C1. the print solder paste on pcb board pastes polychromatic light LED lamp bead and monochromatic light LED lamp bead pair by tin cream
The position answered；
C2. polychromatic light LED lamp bead and monochromatic light LED lamp bead are welded to by corresponding position by Reflow Soldering；
C3. the pcb board after Reflow Soldering is placed in moulding press and carries out secondary mould pressing.
Preferably, before C1, further includes:
C0. according to more Color scheme design requirement Design PCB plate plates, polychromatic light LED lamp bead and list are designed on pcb board
The patch location of coloured light LED lamp bead；
Monochromatic light LED lamp bead also passes through one-step mould.
Preferably, after C3, further includes:
C4. the pcb board after secondary mould pressing is placed in cutting machine and carries out scribing, remove defective material, obtain LED unit group；
C5. sanding burr operation is carried out to the LED unit group of acquisition.
Preferably, in step A:
It is embedded with first micro- heat exchange pipeline in the mixture of one-step mould, second is embedded in the colloid of secondary mould pressing and micro- is changed
Heat pipeline, first micro- heat exchange pipeline and second micro- heat exchange pipeline form annular heat exchange tube road；
The high direction in annular heat exchange tube road is arranged along the thickness direction of the mixture of one-step mould and the colloid of secondary mould pressing,
The bottom in annular heat exchange tube road is provided with heat exchanging liquid, and the two sides at the middle part in annular heat exchange tube road are respectively arranged with one
A check valve；Wherein, a check valve can be opened unidirectionally upwards, another check valve can be opened unidirectionally downwards.
A kind of LED packaging, including pcb board and the monochromatic light LED lamp bead and polychromatic light LED light that are mounted on pcb board
Pearl, it is preferred that polychromatic light LED lamp bead is the polychromatic light LED lamp bead formed after one-step mould by monochromatic light chip；
After monochromatic light LED lamp bead and polychromatic light LED lamp bead are mounted on pcb board, formed by secondary mould pressing.
Preferably, the polychromatic light LED lamp bead being mounted on pcb board is multiple polychromatic light LED lamp beads warp after one-step mould
The relatively high polychromatic light LED lamp bead of photochromic purity is obtained after crossing sorting.
Preferably, it is embedded with first micro- heat exchange pipeline in the mixture of one-step mould, is embedded in the colloid of secondary mould pressing
Second micro- heat exchange pipeline, first micro- heat exchange pipeline and second micro- heat exchange pipeline form annular heat exchange tube road；
The high direction in annular heat exchange tube road is arranged along the thickness direction of the mixture of one-step mould and the colloid of secondary mould pressing,
The bottom in annular heat exchange tube road is provided with heat exchanging liquid, and the two sides at the middle part in annular heat exchange tube road are respectively arranged with one
A check valve；Wherein, a check valve can be opened unidirectionally upwards, another check valve can be opened unidirectionally downwards.
The beneficial effects of the present invention are: a kind of packaging technology of LED component, comprising: A. will be more in the form of cell array
A polychromatic light LED lamp bead carries out one-step mould using the technique of molding, is molded the glue used as the mixture of fluorescent powder and colloid；
B. multiple polychromatic light LED lamp beads after one-step mould are divided into single polychromatic light LED lamp bead；C. by polychromatic light LED light
Pearl and monochromatic light LED lamp bead carry out secondary mould pressing according on more color design requirement patches to pcb board.Pass through one-step mould
The technical solution of non-dot fluorescent powder and colloid admixture can obtain the consistent white light LEDs lamp bead of white light color height, pass through two
Flexibility, the patch type, extensive and efficiently production LED component packaging technology of polychromatic light scheme may be implemented in secondary molding.
Detailed description of the invention
The packaging technology and LED component of LED component of the invention are described further with reference to the accompanying drawing.
Fig. 1 is a kind of flow chart of the embodiment one of the packaging technology of LED component of the present invention.
The schematic diagram of product structure of the step of Fig. 2 is a kind of packaging technology embodiment two of LED component of the present invention one.
The schematic diagram of product structure of the step of Fig. 3 is a kind of packaging technology embodiment two of LED component of the present invention two.
The schematic diagram of product structure of the step of Fig. 4 is a kind of packaging technology embodiment two of LED component of the present invention three.
The schematic diagram of product structure of the step of Fig. 5 is a kind of packaging technology embodiment two of LED component of the present invention four.
Fig. 6 is a kind of structural schematic diagram of the product unit group of the packaging technology embodiment two of LED component of the present invention.
Fig. 7 is the structural schematic diagram of the LED packaging of the prior art of the present invention.
In figure:
1-PCB plate；2- monochromatic light LED component；3- resin；4- polychromatic light LED component；The micro- heat exchange pipeline of 5- first；6-
Two micro- heat exchange pipelines；7- check valve.
Specific embodiment
A kind of packaging technology of 1 ~ 7 pair of LED component of the present invention and LED component are described further with reference to the accompanying drawing.
A kind of packaging technology of LED component, comprising:
A. multiple polychromatic light LED lamp beads are subjected to one-step mould, molding using the technique of molding in the form of cell array
The glue used is the mixture of fluorescent powder and colloid；
B. multiple polychromatic light LED lamp beads after one-step mould are divided into single polychromatic light LED lamp bead；
C. polychromatic light LED lamp bead and monochromatic light LED lamp bead are carried out according on more color design requirement patches to pcb board
Secondary mould pressing.
In the present embodiment, step A includes:
A1. the printing solder in LED substrate, by the monochromatic light chip of polychromatic light LED lamp bead according to polychromatic light design requirement
Paste corresponding position；
A2. monochromatic light chip is welded to by corresponding position by Reflow Soldering；
A3. the LED substrate after Reflow Soldering is placed in moulding press and carries out one-step mould.
In the present embodiment, before step A1, further includes:
A0. LED substrate is designed according to polychromatic light design requirement, the patch position of monochromatic light chip is designed in LED substrate
It sets.
In the present embodiment, after step B, before step C further include:
Polychromatic light LED lamp bead after segmentation is sorted；
In step C: polychromatic light LED lamp bead is the polychromatic light LED lamp bead after sorting.
In the present embodiment, step C includes:
C1. the print solder paste on pcb board pastes polychromatic light LED lamp bead and monochromatic light LED lamp bead pair by tin cream
The position answered；
C2. polychromatic light LED lamp bead and monochromatic light LED lamp bead are welded to by corresponding position by Reflow Soldering；
C3. the pcb board after Reflow Soldering is placed in moulding press and carries out secondary mould pressing.
In the present embodiment, before C1, further includes:
C0. according to more Color scheme design requirement Design PCB plate plates, polychromatic light LED lamp bead and list are designed on pcb board
The patch location of coloured light LED lamp bead；
Monochromatic light LED lamp bead also passes through one-step mould.
In the present embodiment, after C3, further includes:
C4. the pcb board after secondary mould pressing is placed in cutting machine and carries out scribing, remove defective material, obtain LED unit group；
C5. sanding burr operation is carried out to the LED unit group of acquisition.
In the present embodiment, in step A:
It is embedded with first micro- heat exchange pipeline in the mixture of one-step mould, second is embedded in the colloid of secondary mould pressing and micro- is changed
Heat pipeline, first micro- heat exchange pipeline and second micro- heat exchange pipeline form annular heat exchange tube road；
The high direction in annular heat exchange tube road is arranged along the thickness direction of the mixture of one-step mould and the colloid of secondary mould pressing,
The bottom in annular heat exchange tube road is provided with heat exchanging liquid, and the two sides at the middle part in annular heat exchange tube road are respectively arranged with one
A check valve；Wherein, a check valve can be opened unidirectionally upwards, another check valve can be opened unidirectionally downwards.
The present invention provides a kind of packaging technology of LED component, is realized by way of the patch on pcb board different photochromic
LED's electrically conducts, and can realize the encapsulation of how photochromic small-power planar LED by secondary mould pressing later.
Embodiment two
A kind of packaging technology of LED component includes:
Step 1: as shown in Figure 2.It is combined according to more Color schemes and requires production pcb board 1, according to the pad of patch lamp bead
Size designs copper foil circuit 8 on the pcb board 1 of BT substrate, and with the patch location of 9 identification LEDs device of green oil and polarity (only with
The double-colored example combinations of Lan Bai).
Step 2: as shown in Figure 3.The print solder paste 10 on pcb board 1, by SMT by each blue led lamp bead 11 and white
Light LED lamp bead 12 is attached on pcb board 1, crosses Reflow Soldering and lamp bead is welded on pcb board 1.
Step 3: as shown in Figure 4.Pcb board 1 after patch is placed in moulding press and carries out resin-molded, resin 3 is solid after molding
Chemical conversion type protects interior patches structure.
Step 4: as shown in Figure 5.After the completion of resin 3 solidifies, pcb board 1 is placed in cutting machine and carries out scribing, removes defective material
Afterwards, sanding burr operation is carried out after isolating unit LEDs, obtains product unit group 13.
The perspective view of product unit group 13 is as shown in Figure 6.LED packaging includes pcb board 1 and is mounted on pcb board 1
Monochromatic light LED lamp bead 2(is red, orange, yellow, yellowish green, green, blue, purple) and the various white lights of polychromatic light LED component 4(, pink, ice is blue, purple
Rowland), polychromatic light LED component 4 is the polychromatic light LED lamp bead formed after one-step mould by monochromatic light chip；Monochromatic light LED
After lamp bead 2 and polychromatic light LED component 4 are mounted on pcb board 1, formed by secondary mould pressing.
On pcb board 1, packaged various photochromic paster LEDs, including monochromatic light LED component 2 are mounted by SMT
With polychromatic light LED component 4, the lamp bead after patch is protected with resin 3 by secondary mould pressing technique after crossing Reflow Soldering.
In the present embodiment, the polychromatic light LED component 4 being mounted on pcb board 1 is multiple polychromatic light LED after one-step mould
Lamp bead obtains the relatively high polychromatic light LED lamp bead of photochromic purity after sorting.
In the present embodiment, it is embedded with first micro- heat exchange pipeline 5 in the mixture of one-step mould, is buried in the colloid of secondary mould pressing
Equipped with second micro- heat exchange pipeline 6, first micro- heat exchange pipeline 5 and second micro- heat exchange pipeline 6 form annular heat exchange tube road；Annular heat exchange
The high direction of pipeline is arranged along the thickness direction of the mixture of one-step mould and the colloid of secondary mould pressing, the bottom in annular heat exchange tube road
Portion is provided with heat exchanging liquid, and the two sides at the middle part in annular heat exchange tube road are respectively arranged with a check valve 7；Wherein, one it is unidirectional
Valve 7 can be opened unidirectionally upwards, another check valve 7 can be opened unidirectionally downwards.
Beneficial effects of the present invention: it in pcb board low-power LED packaging technology, needs to use white light LEDs in polychromatic combination
When, the colour consistency of height can be realized using this programme；In PCB plane packaging technology, avoid because dispensing it is uneven or
Form it is inconsistent caused by white light uniformity difference problem；The flexibility and flexibility of pcb board design can be achieved；The packaging
SMT technique and resin-molded technique can be used, greatly improve production efficiency.
The present invention also provides a kind of LED packagings.
A kind of LED packaging, red, orange, yellow including pcb board 1 and the monochromatic light LED lamp bead 2(being mounted on pcb board 1,
It is yellowish green, green, blue, purple) and the various white lights of polychromatic light LED component 4(, pink, ice is blue, violet), polychromatic light LED component 4 be by
The polychromatic light LED lamp bead that monochromatic light chip is formed after one-step mould；Monochromatic light LED lamp bead 2 and polychromatic light LED component 4 are pasted
After pcb board 1, formed by secondary mould pressing.
As shown in fig. 6, mounting packaged various photochromic paster LEDs, including monochrome by SMT on pcb board 1
Light LED component 2 and polychromatic light LED component 4 are crossed after Reflow Soldering and are protected the lamp bead after patch with resin 3 by secondary mould pressing technique
Shield is got up.
In the present embodiment, the polychromatic light LED component 4 being mounted on pcb board 1 is multiple polychromatic light LED after one-step mould
Lamp bead obtains the relatively high polychromatic light LED lamp bead of photochromic purity after sorting.
In the present embodiment, it is embedded with first micro- heat exchange pipeline 5 in the mixture of one-step mould, is buried in the colloid of secondary mould pressing
Equipped with second micro- heat exchange pipeline 6, first micro- heat exchange pipeline 5 and second micro- heat exchange pipeline 6 form annular heat exchange tube road；Annular heat exchange
The high direction of pipeline is arranged along the thickness direction of the mixture of one-step mould and the colloid of secondary mould pressing, the bottom in annular heat exchange tube road
Portion is provided with heat exchanging liquid, and the two sides at the middle part in annular heat exchange tube road are respectively arranged with a check valve 7；Wherein, one it is unidirectional
Valve 7 can be opened unidirectionally upwards, another check valve 7 can be opened unidirectionally downwards.
The present invention is not limited to the above embodiment, and the technical solution of above-mentioned each embodiment of the invention can intersect each other
Combination form new technical solution, in addition it is all using equivalent replacement formed technical solution, all fall within the present invention claims protection
In range.
Claims (8)
1. a kind of packaging technology of LED component characterized by comprising
A. multiple polychromatic light LED lamp beads are subjected to one-step mould using the technique of molding in the form of cell array, molding uses
Glue be fluorescent powder and colloid mixture；
B. multiple polychromatic light LED lamp beads after the one-step mould are divided into single polychromatic light LED lamp bead；
C. the polychromatic light LED lamp bead and monochromatic light LED lamp bead are carried out according on more color design requirement patches to pcb board
Secondary mould pressing.
2. the packaging technology of LED component as described in claim 1, which is characterized in that the step A includes:
A1. the printing solder in LED substrate pastes the monochromatic light chip of polychromatic light LED lamp bead according to polychromatic light design requirement
To corresponding position；
A2. the monochromatic light chip is welded to by the corresponding position by Reflow Soldering；
A3. the LED substrate after the Reflow Soldering is placed in moulding press and carries out one-step mould.
3. the packaging technology of LED component as claimed in claim 2, which is characterized in that before the step A1, further includes:
A0. LED substrate is designed according to polychromatic light design requirement, the patch location of monochromatic light chip is designed in the LED substrate.
4. the packaging technology of LED component as described in claim 1, which is characterized in that after the step B, before step C, also
Include:
Polychromatic light LED lamp bead after the segmentation is sorted；
In the step C: polychromatic light LED lamp bead is the polychromatic light LED lamp bead after sorting.
5. the packaging technology of LED component as described in claim 1, which is characterized in that the step C includes:
C1. the print solder paste on pcb board pastes the polychromatic light LED lamp bead and monochromatic light LED lamp bead by the tin cream
Corresponding position；
C2. the polychromatic light LED lamp bead and monochromatic light LED lamp bead are welded to by the corresponding position by Reflow Soldering；
C3. the pcb board after Reflow Soldering is placed in moulding press and carries out secondary mould pressing.
6. the packaging technology of LED component as claimed in claim 5, which is characterized in that before the C1, further includes:
C0. according to more Color scheme design requirement Design PCB plate plates, polychromatic light LED lamp bead and monochrome are designed on the pcb board
The patch location of light LED lamp bead；
The monochromatic light LED lamp bead also passes through one-step mould.
7. the packaging technology of LED component as claimed in claim 5, which is characterized in that after the C3, further includes:
C4. the pcb board after the secondary mould pressing is placed in cutting machine and carries out scribing, remove defective material, obtain LED unit group；
C5. sanding burr operation is carried out to the LED unit group of the acquisition.
8. the packaging technology of LED component as described in claim 1, which is characterized in that in the step A:
It is embedded with first micro- heat exchange pipeline in the mixture of the one-step mould, second is embedded in the colloid of secondary mould pressing and micro- is changed
Heat pipeline, first micro- heat exchange pipeline and second micro- heat exchange pipeline form annular heat exchange tube road；
Thickness direction of the high direction in the annular heat exchange tube road along the mixture of the one-step mould and the colloid of secondary mould pressing
Setting,
The bottom in the annular heat exchange tube road is provided with heat exchanging liquid, and the two sides at the middle part in the annular heat exchange tube road are respectively set
There is a check valve；Wherein, a check valve can be opened unidirectionally upwards, another described check valve can unidirectionally be beaten downwards
It opens.
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| CN201710541356.XA CN107146838B (en) | 2017-07-05 | 2017-07-05 | A kind of packaging technology and LED component of LED component |
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| CN201710541356.XA CN107146838B (en) | 2017-07-05 | 2017-07-05 | A kind of packaging technology and LED component of LED component |
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| CN107919068A (en) * | 2017-11-09 | 2018-04-17 | 江苏稳润光电科技有限公司 | A kind of LED Surface Mounts, can cross Reflow Soldering method for packing and structure |
| CN113764546A (en) * | 2021-08-30 | 2021-12-07 | 东莞市中麒光电技术有限公司 | Mini-LED device, LED display module and manufacturing method thereof |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101562174A (en) * | 2008-04-16 | 2009-10-21 | 宏齐科技股份有限公司 | LED chip encapsulating structure for backlight module and preparing method thereof |
| CN101881420A (en) * | 2009-06-08 | 2010-11-10 | 李欣洋 | LED light source using fluorescence conversion device with transparent base material |
| CN102203965A (en) * | 2008-11-05 | 2011-09-28 | 飞利浦拉米尔德斯照明设备有限责任公司 | Overmolded phosphor lens for an LED |
| CN102347418A (en) * | 2010-08-02 | 2012-02-08 | 展晶科技(深圳)有限公司 | Light-emitting diode packaging structure and manufacturing method thereof |
| CN102473811A (en) * | 2009-07-23 | 2012-05-23 | 飞利浦拉米尔德斯照明设备有限责任公司 | LED with molded reflective sidewall coating |
| US8785953B2 (en) * | 2011-03-25 | 2014-07-22 | Samsung Electronics Co., Ltd. | Light emitting diode, manufacturing method thereof, light emitting diode module, and manufacturing method thereof |
| CN103939810A (en) * | 2014-05-12 | 2014-07-23 | 苏州东山精密制造股份有限公司 | Backlight module and manufacturing technology thereof |
| CN103972369A (en) * | 2014-05-26 | 2014-08-06 | 苏州东山精密制造股份有限公司 | LED (Light Emitting Diode) lamp bar and manufacturing method thereof |
| CN104282819A (en) * | 2013-07-08 | 2015-01-14 | 光宝电子(广州)有限公司 | Flip-over type light-emitting diode packaging module and manufacturing method thereof |
| CN104380464A (en) * | 2012-01-24 | 2015-02-25 | 柯立芝照明有限公司 | Light-emitting dies incorporating wavelength-conversion materials and related methods |
| CN106571419A (en) * | 2016-11-07 | 2017-04-19 | 深圳市源磊科技有限公司 | Method for manufacturing flashlight |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5110229B1 (en) * | 2011-06-07 | 2012-12-26 | 東レ株式会社 | Resin sheet laminate, method for producing the same, and method for producing LED chip with phosphor-containing resin sheet using the same |
-
2017
- 2017-07-05 CN CN201710541356.XA patent/CN107146838B/en active Active
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101562174A (en) * | 2008-04-16 | 2009-10-21 | 宏齐科技股份有限公司 | LED chip encapsulating structure for backlight module and preparing method thereof |
| CN102203965A (en) * | 2008-11-05 | 2011-09-28 | 飞利浦拉米尔德斯照明设备有限责任公司 | Overmolded phosphor lens for an LED |
| CN101881420A (en) * | 2009-06-08 | 2010-11-10 | 李欣洋 | LED light source using fluorescence conversion device with transparent base material |
| CN102473811A (en) * | 2009-07-23 | 2012-05-23 | 飞利浦拉米尔德斯照明设备有限责任公司 | LED with molded reflective sidewall coating |
| CN102347418A (en) * | 2010-08-02 | 2012-02-08 | 展晶科技(深圳)有限公司 | Light-emitting diode packaging structure and manufacturing method thereof |
| US8785953B2 (en) * | 2011-03-25 | 2014-07-22 | Samsung Electronics Co., Ltd. | Light emitting diode, manufacturing method thereof, light emitting diode module, and manufacturing method thereof |
| CN104380464A (en) * | 2012-01-24 | 2015-02-25 | 柯立芝照明有限公司 | Light-emitting dies incorporating wavelength-conversion materials and related methods |
| CN104282819A (en) * | 2013-07-08 | 2015-01-14 | 光宝电子(广州)有限公司 | Flip-over type light-emitting diode packaging module and manufacturing method thereof |
| CN103939810A (en) * | 2014-05-12 | 2014-07-23 | 苏州东山精密制造股份有限公司 | Backlight module and manufacturing technology thereof |
| CN103972369A (en) * | 2014-05-26 | 2014-08-06 | 苏州东山精密制造股份有限公司 | LED (Light Emitting Diode) lamp bar and manufacturing method thereof |
| CN106571419A (en) * | 2016-11-07 | 2017-04-19 | 深圳市源磊科技有限公司 | Method for manufacturing flashlight |
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