CN102738371A - White light led and manufacturing method thereof - Google Patents
White light led and manufacturing method thereof Download PDFInfo
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- CN102738371A CN102738371A CN2011100916673A CN201110091667A CN102738371A CN 102738371 A CN102738371 A CN 102738371A CN 2011100916673 A CN2011100916673 A CN 2011100916673A CN 201110091667 A CN201110091667 A CN 201110091667A CN 102738371 A CN102738371 A CN 102738371A
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Abstract
The invention discloses a white light LED which comprises a base body, a blue light LED chip arranged on the base body, and a plastic layer which seals the blue light LED chip. The plastic layer includes a first transparent layer, a YAG fluorescent layer and a second transparent layer. The first transparent layer directly seals the blue light LED chip, the fluorescent layer is formed between the first transparent layer and the second transparent layer, and the second transparent layer directly seals the fluorescent layer. The invention also discloses a manufacturing method of the white light LED.
Description
Technical field
The present invention relates to the light-emitting diode packaging technology field, relate in particular to a kind of white light LEDs and manufacturing approach thereof.
Background technology
Advantages such as that light-emitting diode (LED) has is energy-efficient, environmental protection, it is used more and more widely, is generally believed it is main lighting source of 21 century by industry.At present, white light LEDs realization approach mainly contains and utilizes a plurality of chips of RGB (red, green, blue) three primary colors or the luminous white that is mixed into of a plurality of device; On the ultraviolet light chip, coat RGB (red, green, blue) fluorescent material, utilize purple light excited fluorescent material to produce three primary colors and mix the formation white light; Perhaps on basket light led chip, coating can be by blue-light excited fluorescent material; Like YAG (yttrium-aluminium-garnet) fluorescent material; The blue-light excited fluorescent material that utilizes chip to send sends green-yellow light and blue light synthesize white light, perhaps utilizes the formation that cooperates of fluorescent material with the chip of other colors.Owing to there is the difference of optical parametric (like wavelength, light intensity) and electrical parameter (voltage) between the RBG chip; And at present ultraviolet light chip and RGB fluorescent material produce reasons such as the efficient of white light is lower, and blue chip coating YAG fluorescent material is still the widest LED white light implementation of present application.
The manufacturing approach that conventional blue chip LED chip applies YAG fluorescent material white light LEDs is: but earlier with the viscose glue of led chip through heat conduction; Like elargol; Be fixedly arranged on the substrate; Utilize gold thread that led chip is connected with circuit node on the substrate then, then fluorescent glue is applied and the plastic packaging led chip, and make the fluorescent glue typing through baking.It is right because the fluorescent glue coating is difficult to accomplish the thickness uniformity; And in its solidification process; Fluorescent powder grain possibly deposit, and changes thereby can cause LED significant correlated colour temperature to occur, i.e. variations in temperature and change color that human eye is experienced is remarkable in the LED.Apply the general manual work point glue that passes through in addition in this kind manufacturing approach and apply, be unfavorable for that so the production capacity of white light LEDs promotes.In addition, because fluorescent glue directly is coated on led chip, the caloric value of led chip is directly conducted to fluorescent glue, cause the influence of fluorescent glue particle, and LED is easy to light decay, and reduces useful life.
Summary of the invention
In view of foregoing, be necessary to provide a kind of light decay that is difficult for, and improve the white light LEDs in useful life.
In addition, be necessary to provide a kind of fluorescent glue that helps to apply evenly, and can improve the white light LEDs manufacturing approach of production capacity.
A kind of white light LEDs; Comprise a matrix, be arranged on blue-light LED chip on the matrix, and with a plastic packaging layer of blue-light LED chip plastic packaging; Said plastic packaging layer comprises one first hyaline layer, a fluorescence coating, and one second hyaline layer, the direct plastic packaging blue-light LED chip of this first hyaline layer; Fluorescence coating is formed between first hyaline layer and second hyaline layer, the direct plastic packaging fluorescence coating of second hyaline layer.
A kind of manufacturing approach of white light LEDs, it may further comprise the steps:
At least one blue-light LED chip is arranged on the matrix;
On each blue-light LED chip, form one first hyaline layer through one first mould;
On each first hyaline layer, form a fluorescence coating through one second mould;
On each fluorescence coating, form one second hyaline layer through one the 3rd mould;
Said matrix is cut and form single white light LEDs.
This white light LEDs is through being provided with the direct plastic packaging blue-light LED chip of one first hyaline layer, and plastic packaging one fluorescence coating on first hyaline layer then can prevent that so fluorescence coating and led chip from crossing near and prevent the white light LEDs light decay, prolongs the useful life of white light LEDs; Through adopting mould molding plastic packaging layer, the uneven problem of coating thickness that so can avoid artificial some glue to produce simultaneously, can be enhanced productivity and production capacity through adopting mould molding.
Description of drawings
Fig. 1 is the cutaway view of preferred embodiment one white light LEDs of the present invention;
Fig. 2 is the vertical view that is laid in a plurality of led chips on the matrix when making white light LEDs;
Fig. 3 is the structural section sketch map of first mould when making white light LEDs;
Fig. 4 is a schematic flow sheet of making white light LEDs.
Embodiment
By specifying technology contents of the present invention, structural feature, realized purpose and effect, give explanation below in conjunction with execution mode and conjunction with figs. are detailed.
See also Fig. 1, white light LEDs 100 of the present invention comprises a matrix 10, be arranged at least one blue-light LED chip 20 on the matrix 10, and with a plastic-sealed body 30 of blue-light LED chip plastic packaging.
Said matrix 10 comprises a heat-radiating substrate 11, is formed on the insulating barrier 12 on the heat-radiating substrate 11 and is formed on the layer printed circuit board 13 on the insulating barrier 12.Said heat-radiating substrate 10 is processed for can be materials such as the good aluminium of thermal conductivity, silver, and in the present embodiment, this heat-radiating substrate 10 is an aluminium base.Said insulating barrier 12 electrically conducts with heat-radiating substrate 11 in order to isolated layer printed circuit board 13, and this insulating bottom layer 12 can be the preferable insulating varnish of heat conductivility and forms.Said layer printed circuit board 13 forms for the electrically conductive ink printing, and this layer printed circuit board 13 comprises a plurality of circuit units that equidistance is provided with, and each circuit unit is in order to electrically connect a led chip 20.
Said led chip 20 is laid on the said layer printed circuit board 13; And each led chip 20 is corresponding with each circuit unit position; This led chip 20 is bonding with layer printed circuit board 13 through a solid crystal layer 23, and these solid crystal layer 23 materials can be organic metal welding compound or soldering paste, and solid crystal layer material employing organic metal welding compound in the present embodiment is arranged; Can be the preferable elargol of thermal conductivity, elargol mainly is made up of silver powder, glass sand and resin.Lead to two gold threads 22 on each led chip 20; This two gold thread 22 is connected with the node of layer printed circuit board 13 corresponding electrical circuits unit; Thereby each led chip 20 forms a current circuit, can whether control the luminous of led chip 20 through the control integrated circuit cell conduction.
Said plastic-sealed body 30 is the hemisphere shape, with said led chip 20 plastic packagings.This plastic-sealed body 30 comprises one first hyaline layer, 31, one fluorescence glue-lines 32 and one second hyaline layer 32.Said first hyaline layer 31 is plastic packaging led chip 20 and said gold thread 22 directly; Said fluorescence coating 32 is formed between first hyaline layer 31 and second hyaline layer 33; This fluorescence coating 32 equably plastic packaging on said first hyaline layer 31; Second hyaline layer, 33 direct plastic packaging fluorescence coatings 32, it is as the outermost adhesive layer of this plastic-sealed body 30.This first hyaline layer 31 and second hyaline layer 33 can be resin or silica gel is processed.This fluorescence coating 32 is for being processed by blue-light excited fluorescent material, like YAG (yttrium-aluminium-garnet) fluorescent material.
Consult Fig. 2,3 and 4, the manufacturing approach of said white light LEDs 100 may further comprise the steps:
An at least one blue led chip 20 and a said matrix 10 are provided, should be fixedly arranged on this layer printed circuit board 13 by at least one led chip 20, each led chip 20 is corresponding with each circuit unit (figure does not show) position;
A plurality of gold threads 22 are provided, with each led chip 20 through two gold threads 22 respectively with layer printed circuit board 13 on the circuit node of corresponding electrical circuits unit be connected;
One first mould 40 is provided; This first mould bag 40 is drawn together one first male model plate 41 and one first caster 42; Offer one first die cavity 411 of corresponding ccontaining said matrix 10 on this first male model plate 41; Offering correspondence on said first caster 42, to accommodate at least one first die cavity, 421, the first die cavitys 421 of said at least one led chip 20 big than led chip 20, and be formed with one first glue road 422 on this first caster 42 and be communicated with these some first die cavitys 421; Matrix 10 is placed in first die cavity 411; With first mould, 40 matched moulds, each led chip 20 receives in the first corresponding die cavity 421 and with first die cavity 421 and forms one first die cavity (figure is mark not); Then inject first transparent plastic of fusion; First transparent plastic like this will flow in each first die cavity; This first transparent plastic is one-body molded with said led chip 20 and corresponding gold thread 22 parcels; After the cooling, plastic packaging one first hyaline layer 31 on each led chip 20, and this matrix 10 taken out from first mould 40;
One second mould (not shown) is provided, and its structure and first mould structure are similar.This second mould comprises one second male model plate and one second caster; Offer one second die cavity of corresponding ccontaining said matrix on this second male model plate; Offer correspondence on said second caster and accommodate at least one second die cavity of said at least one led chip 20; Second die cavity has the led chip 20 of first hyaline layer 31 big than plastic packaging, and is formed with one second Jiao Dao on this second caster and is communicated with these some second die cavitys; Place in second die cavity matrix and with the second mould matched moulds; Each plastic packaging has the led chip 20 of first hyaline layer 31 to receive in the second corresponding die cavity and with second die cavity to form one second die cavity; Inject the fluorescent glue of fusion, the fluorescent powder grain that fluorescent glue is inner can be through stirring, so fluorescent glue will flow in each second die cavity; This fluorescent glue will wrap up first hyaline layer 31; After the cooling, plastic packaging one first hyaline layer 31 and a fluorescence glue-line 32 on each led chip 20, and this matrix 10 taken out from second mould;
One the 3rd mould (not shown) is provided, and its structure and first mould structure are similar.The 3rd mould comprises one the 3rd male model plate and one the 3rd caster; Offer one the 3rd die cavity of corresponding ccontaining said matrix on the 3rd male model plate; Offer correspondence on said the 3rd caster and accommodate at least one the 3rd die cavity of said at least one led chip 20; The 3rd die cavity has the led chip 20 of first hyaline layer 31 and fluorescence glue-line 32 big than plastic packaging, and is formed with one the 3rd Jiao Dao on the 3rd caster and is communicated with these some the 3rd die cavitys; Matrix 10 is placed in the 3rd die cavity; With the 3rd mould matched moulds; Each plastic packaging has the led chip 20 of first hyaline layer 31 and fluorescence glue-line 32 to receive in the 3rd corresponding die cavity and with the 3rd die cavity to form one the 3rd die cavity, inject second transparent plastic of fusion, and second transparent plastic like this will flow in each the 3rd die cavity; This second transparent plastic will wrap up fluorescence glue-line 32; After the cooling, plastic packaging one first hyaline layer 31,32 layers of fluorescent glues and second hyaline layer 33 on each led chip 20, and this matrix 10 taken out from the 3rd mould;
Position cutting matrix 10 with on the led chip 20 place matrixes 10 makes each led chip 20 become independently unit, so, obtains single white light LEDs 100.
Plastic-sealed body 30 among this white light LED100 is through difference injection mo(u)lding first hyaline layer 31; The fluorescence glue-line 32 and second hyaline layer 33 and form, each layer shape and thickness can control be set through mould, so; Can make the hyaline layer 31 of winning; Fluorescence glue-line 32 and second hyaline layer, 33 thickness are even, the uniformity of the inner fluorescent powder grain of combined with fluorescent glue simultaneously, thus can realize the colour temperature consistency of led chip 20 preferably.Method through adopting injection mo(u)lding is processed plastic-sealed body 30, also can improve the production capacity of white light LEDs 100.
The above is merely embodiments of the invention; Be not so limit claim of the present invention; Every equivalent structure or equivalent flow process conversion that utilizes specification of the present invention and accompanying drawing content to be done; Or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present invention.
Claims (10)
1. white light LEDs; Comprise a matrix, be arranged on blue-light LED chip on the matrix, and with a plastic packaging layer of blue-light LED chip plastic packaging; It is characterized in that: said plastic packaging layer comprises one first hyaline layer, a fluorescence coating, and one second hyaline layer, the direct plastic packaging led chip of this first hyaline layer; Fluorescence coating is formed between first hyaline layer and second hyaline layer, the direct plastic packaging fluorescence coating of second hyaline layer.
2. white light LEDs as claimed in claim 1 is characterized in that: said matrix comprises a heat-radiating substrate, is formed on the insulating barrier on the heat-radiating substrate and is formed on the layer printed circuit board on the insulating barrier.
3. white light LEDs as claimed in claim 1 is characterized in that: said heat-radiating substrate is an aluminium base.
4. white light LEDs as claimed in claim 2 is characterized in that: said white light LEDs also comprises solid crystal layer, and said led chip is consolidated on the layer printed circuit board through solid crystal layer.
5. white light LEDs as claimed in claim 1 is characterized in that: said fluorescence coating is processed for YAG fluorescent material.
6. white light LEDs as claimed in claim 1 is characterized in that: said first hyaline layer and second hyaline layer are that resin or silica gel are processed.
7. the manufacturing approach of a white light LEDs, it may further comprise the steps:
At least one blue-light LED chip is arranged on the matrix;
On each blue-light LED chip, form one first hyaline layer through one first mould;
On each first hyaline layer, form a fluorescence coating through one second mould;
On each fluorescence coating, form one second hyaline layer through one the 3rd mould.
8. the manufacturing approach of white light LEDs as claimed in claim 7, it is characterized in that: said matrix comprises a heat-radiating substrate, is formed on the insulating barrier on the heat-radiating substrate and is formed on the layer printed circuit board on the insulating barrier.
9. the manufacturing approach of white light LEDs as claimed in claim 8 is characterized in that: said manufacturing approach also be included in form on the led chip before first hyaline layer with two pins on each led chip through gold thread respectively with layer printed circuit board on the circuit node connection that is connected of corresponding electrical circuits unit.
10. the manufacturing approach of white light LEDs as claimed in claim 8 is characterized in that: said manufacturing approach also is included in to form on the led chip behind second hyaline layer said matrix cut and forms single white light LEDs.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100916673A CN102738371A (en) | 2011-04-12 | 2011-04-12 | White light led and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100916673A CN102738371A (en) | 2011-04-12 | 2011-04-12 | White light led and manufacturing method thereof |
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| CN102738371A true CN102738371A (en) | 2012-10-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2011100916673A Pending CN102738371A (en) | 2011-04-12 | 2011-04-12 | White light led and manufacturing method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105161600A (en) * | 2015-09-06 | 2015-12-16 | 江苏稳润光电有限公司 | Manufacturing method of light-emitting diode (LED) candle lamp applied to illumination |
| CN109855038A (en) * | 2019-04-04 | 2019-06-07 | 华域视觉科技(上海)有限公司 | A kind of car headlight device and car light |
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| CN1702141A (en) * | 2004-05-25 | 2005-11-30 | 安捷伦科技有限公司 | Mold compound with fluorescent material and a light-emitting device made therefrom |
| CN101022144A (en) * | 2006-02-15 | 2007-08-22 | 深圳市量子光电子有限公司 | Large power light-emitting diode |
| CN101034231A (en) * | 2006-03-09 | 2007-09-12 | 京东方科技集团股份有限公司 | LED back light module |
| CN101452986A (en) * | 2008-12-31 | 2009-06-10 | 广东昭信光电科技有限公司 | Encapsulation structure and method for white light emitting diode device |
| CN101582477A (en) * | 2009-06-23 | 2009-11-18 | 中山大学 | Method for actively encapsulating LED chip and encapsulation structure thereof |
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2011
- 2011-04-12 CN CN2011100916673A patent/CN102738371A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1702141A (en) * | 2004-05-25 | 2005-11-30 | 安捷伦科技有限公司 | Mold compound with fluorescent material and a light-emitting device made therefrom |
| CN101022144A (en) * | 2006-02-15 | 2007-08-22 | 深圳市量子光电子有限公司 | Large power light-emitting diode |
| CN101034231A (en) * | 2006-03-09 | 2007-09-12 | 京东方科技集团股份有限公司 | LED back light module |
| CN101452986A (en) * | 2008-12-31 | 2009-06-10 | 广东昭信光电科技有限公司 | Encapsulation structure and method for white light emitting diode device |
| CN101582477A (en) * | 2009-06-23 | 2009-11-18 | 中山大学 | Method for actively encapsulating LED chip and encapsulation structure thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105161600A (en) * | 2015-09-06 | 2015-12-16 | 江苏稳润光电有限公司 | Manufacturing method of light-emitting diode (LED) candle lamp applied to illumination |
| CN109855038A (en) * | 2019-04-04 | 2019-06-07 | 华域视觉科技(上海)有限公司 | A kind of car headlight device and car light |
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Application publication date: 20121017 |