CN110242881A - The preparation method and COB light bar of COB light bar - Google Patents
The preparation method and COB light bar of COB light bar Download PDFInfo
- Publication number
- CN110242881A CN110242881A CN201910656176.5A CN201910656176A CN110242881A CN 110242881 A CN110242881 A CN 110242881A CN 201910656176 A CN201910656176 A CN 201910656176A CN 110242881 A CN110242881 A CN 110242881A
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- Prior art keywords
- light bar
- substrate
- light
- preparation
- cob
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- 238000002360 preparation method Methods 0.000 title claims abstract description 25
- 239000000758 substrate Substances 0.000 claims abstract description 52
- 238000004806 packaging method and process Methods 0.000 claims abstract description 32
- 238000001125 extrusion Methods 0.000 claims abstract description 26
- 239000011265 semifinished product Substances 0.000 claims abstract description 22
- 238000007711 solidification Methods 0.000 claims abstract description 10
- 230000008023 solidification Effects 0.000 claims abstract description 10
- 239000000853 adhesive Substances 0.000 claims abstract description 9
- 230000001070 adhesive effect Effects 0.000 claims abstract description 9
- 239000000084 colloidal system Substances 0.000 claims description 30
- 238000012856 packing Methods 0.000 claims description 23
- 239000003292 glue Substances 0.000 claims description 15
- 238000005538 encapsulation Methods 0.000 claims description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 7
- 239000000741 silica gel Substances 0.000 claims description 7
- 229910002027 silica gel Inorganic materials 0.000 claims description 7
- 230000001681 protective effect Effects 0.000 abstract description 4
- 239000000047 product Substances 0.000 description 20
- 238000000034 method Methods 0.000 description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 8
- 239000000843 powder Substances 0.000 description 7
- 238000005452 bending Methods 0.000 description 6
- 229920000297 Rayon Polymers 0.000 description 3
- 239000003086 colorant Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 238000012536 packaging technology Methods 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 230000003760 hair shine Effects 0.000 description 2
- 238000004020 luminiscence type Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000001192 hot extrusion Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000009738 saturating Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S4/00—Lighting devices or systems using a string or strip of light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
- F21V19/002—Fastening arrangements intended to retain light sources the fastening means engaging the encapsulation or the packaging of the semiconductor device
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a kind of preparation methods of COB light bar, include the following steps: S1 to produce high luminous mass, high IP protective performance and the long COB light bar of continuous luminous of the appearance without obvious interface, the preparation method, light-emitting component is mounted on substrate；Multiple substrate connections for being pasted with light-emitting component are become band by connecting plate, form light bar semi-finished product by S2；Light bar semi-finished product are introduced into extruder by traction device, packaging plastic are passed through in extruder by S3, and pass through extruder for packaging plastic extrusion molding together with light bar semi-finished product；The light bar semi-finished product that extruder squeezes out are introduced in solidification equipment and are packaged adhesive curing by S4.
Description
Technical field
The present invention relates to the technical field of COB light bar, in particular to the preparation method and COB light bar of a kind of COB light bar.
Background technique
Light-emitting component in existing COB light bar substantially realizes the encapsulation to light-emitting component using drop adhesive process, right
One piece is then used to drip gum forming in a plurality of light-emitting elements, however, fluorescent powder is easy heavy using the complex process of whole drop glue
Product easily leads to non-uniform light and color drift problem；Secondly, paste packing colloid is not easy to be formed, drip need to do before glue box dam or
The design of person's PCB particular channel just can guarantee the linear of colloid, colloid shape and the bad control of thickness, and complex process is at high cost, easily
Lead to luminance nonuniformity and color difference；Again, the light bar product that existing whole drop gum forming technique can only be shorter for length, for
The very long light bar of length, the then mode for needing to release bonding bond billet finished product in desired length, and interface not only influences lamp
With whole appearance, and interface has dark space, even if interface glue, not only poor appearance is also easy to reduce light bar entirety IP protection
Performance.Guarantee luminous mass and IP protective performance in conclusion lacking a kind of can produce at present and can guarantee product appearance
The preparation method of long COB light bar
Summary of the invention
In view of the problems of the existing technology, the main object of the present invention is to provide a kind of preparation method of COB light bar, should
Method is able to produce the COB light bar of high luminous mass, high IP protective performance and appearance without obvious interface.
To achieve the above object, the preparation method of COB light bar proposed by the present invention comprising following steps:
Light-emitting component is mounted on substrate by S1；
Multiple substrate connections for being pasted with light-emitting component are become band by connecting plate, form light bar semi-finished product by S2；
Light bar semi-finished product are introduced into extruder by traction device, packaging plastic are passed through in extruder, and is passed through by S3
Extruder is by packaging plastic extrusion molding together with light bar semi-finished product；
The light bar semi-finished product that extruder squeezes out are introduced in solidification equipment and are packaged adhesive curing by S4.
In the step S1, after light-emitting component being mounted on substrate, transparent cured glue and quiet is dripped on light emitting elements
It sets.
In the step S3 added with encapsulation preparation in used packaging plastic.
In the step S3, the extrusion width of the packaging plastic on light bar semi-finished product squeezes out thickness and exists between 1mm~20mm
Between 0.1mm~5mm.
In certain embodiments of the present invention, packaging plastic employed in the step S3 is transparent silica gel or transparent
PVC glue.
The present invention also proposes a kind of COB light bar comprising: if stem substrate, several light-emitting components are pasted on each substrate,
Different substrate connects to form light bar by connecting plate, and light bar is equipped with the packing colloid of covering luminous element, the packing colloid
It is arranged in light bar by extrusion forming mode.
Preferably, drop has transparent fixed glue on the light-emitting component.
Preferably, added with encapsulation preparation in the packaging plastic.
Preferably, the packing colloid is made of transparent silica gel or Transparent PVC window.
Preferably, the width of the packing colloid is between 1mm~20mm, and thickness is between 0.1mm~5mm.
Technical solution of the present invention is become band by first connecting substrate, then packaging plastic is arranged by extrusion molding process
In substrate, packaging plastic is solidificated on substrate finally by solidification equipment, avoids after drop adhesive process is made into billet product and connects again
At dark space and ugly product more appearance caused by a whole generated interface, improve the appearance of product and the continuity of light shape,
Reach higher degree of protection simultaneously；Also, the width and thickness of packaging plastic can pass through the big of the extrusion of control extruder
Small shape is adjusted, convenient and simple.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
The structure shown according to these attached drawings obtains other attached drawings.
Fig. 1 is the flow diagram of one embodiment of preparation method of COB light bar of the present invention；
Fig. 2 is the structural schematic diagram figure of COB light bar；
Fig. 3 is the structural schematic diagram of the not set packing colloid of COB light bar；
Fig. 4 is the decomposition diagram of COB light bar；
The object of the invention is realized, the embodiments will be further described with reference to the accompanying drawings for functional characteristics and advantage.
Specific embodiment
The present invention proposes a kind of preparation method of COB light bar.
Referring to Fig.1, Fig. 1 is the flow diagram of one embodiment of preparation method of COB light bar of the present invention.
As shown in Figure 1, in embodiments of the present invention, the preparation method of the COB light bar includes the following steps:
Light-emitting component is mounted on substrate by S1.
Specifically, in step sl, light-emitting component is LED chip, when attachment, by LED chip by substrate length direction etc.
Away from attachment, the spacing between adjacent LED chip is maintained within 1mm~10mm, it is more uniform to can effectively ensure that light bar shines, i.e.,
It there will not be obvious luminous point when making low bright to occur.When the distance between LED chip is less than 1mm, the chip on substrate can be overstocked, patch
Dressing up this and difficulty will increase dramatically；When the distance between LED chip is greater than 10mm, it will lead to light bar there are Luminescence Uniformities not
Problem enough, bright spot is obvious.
Preferably, in step sl, after light-emitting component being mounted on substrate simultaneously test passes, drop is saturating on light emitting elements
Bright solidification glue simultaneously stands solidification.It will can be mounted on LED chip on substrate in advance by transparent cured glue to fix, product is avoided to turn
Cause to pollute when fortune or molding and damage.
Multiple substrate connections for being pasted with light-emitting component are become band by connecting plate, form light bar semi-finished product by S2.
Specifically, in the present embodiment, light bar is using double-faced flexible FPC as substrate, the layers of copper of substrate tow sides
Thickness is between 20-75 μm, and when copper layer thickness is less than 20 μm, the circuit etching conductive capability formed in layers of copper is poor, and works as copper
When layer is greater than -75 μm, the flexibility of substrate will be greatly reduced, light bar be easy to cause damage in bending.
In the present embodiment, also reinforcing rib can be set to reinforce the protection to LED chip in the side of LED chip, thus
Increase the performance of the warp resistance resistant to bending of product.
It should be noted that substrate is not limited to using double-faced flexible FPC, manufacturer can be selected according to actual needs not
Substrate of the same substrate as light bar, for example, glass also can be used in the case where not considering light bar warp resistance bending performance
Other hard plate materials such as plate, aluminum substrate are as substrate.
Light bar semi-finished product are introduced into extruder by traction device, packaging plastic are passed through in extruder, and is passed through by S3
Extruder is by packaging plastic extrusion molding together with light bar semi-finished product；
Specifically, in the present embodiment, after light bar semi-finished product being introduced extruder, packaging plastic is expressed into light bar semi-finished product
Light-emitting surface (being pasted with the one side of LED chip) on so that packaging plastic completely covers LED chip, then by packaging plastic and lamp
Band semi-finished product extrusion molding together.
In the present embodiment, the extrusion width of the packaging plastic on light bar semi-finished product squeezes out thickness and exists between 1mm~20mm
Between 0.1mm~5mm.When LED chip cannot be completely covered when the extrusion width of packaging plastic is less than 1mm, and being greater than 20mm, not only
It is required that PCB is wider, and the big cost of light-emitting surface colloid amount is excessively high.The extrusion thickness of packaging plastic is less than 0.1mm, and packing colloid cannot be complete
It is covered in LED chip well, when the thickness of packaging plastic is higher than 5mm, it will cause light extraction efficiency to reduce, product overall brightness is relatively low,
Light efficiency is poor.
Specifically, in the present embodiment, the extrusion width of packaging plastic and extrusion thickness are by replacing various sizes of extrusion
It mouthful is adjusted, and the shape of packing colloid that packaging plastic is formed can also select the extrusion of different shapes to adjust.
The light bar semi-finished product that extruder squeezes out are introduced in solidification equipment and are packaged adhesive curing, form light bar finished product by S4.
Technical solution of the present invention is become band by first connecting substrate, then packaging plastic is arranged by extrusion molding process
In substrate, packaging plastic is solidificated on substrate finally by solidification equipment, avoids after drop adhesive process is made into billet product and connects again
At dark space and ugly product more appearance caused by a whole generated interface, improve the appearance of product and the continuity of light shape,
Reach higher degree of protection simultaneously；Also, the width and thickness of packaging plastic can pass through the big of the extrusion of control extruder
Small shape is adjusted, convenient and simple.
Preferably, in the present embodiment, it needs for different production, in step s3, can also add in packaging plastic
Add different encapsulation preparations, such as fluorescent powder, colorant.
In the first embodiment of the embodiment of the present invention, packaging plastic in step S3 is using added with fluorescent powder
Transparent silica gel, for silica gel characteristic, extruder is corresponding to use cold-extruded die mould extruder, and solidification equipment uses thermal-curable system, such as
Tunnel heating.
In the second embodiment of the embodiment of the present invention, packaging plastic in step S3 is using added with fluorescent powder
Transparent PVC window, for the characteristic of Transparent PVC window, extruder is corresponding to use hot extrusion die mould extruder, and solidification equipment is used and freezed off
Makeup is set, such as water cooling plant.
Extrusion forming packaging technology provided by the invention, which is compared, encapsulates work with traditional led drop glue packaging technology, extrusion forming
Skill may make colloid uniform fold in the light-emitting surface of light bar, form entirely lighting effect.And avoid drop adhesive process colloid molding
Box dam or PCB is needed to do groove processing complicated technology, and the colloid generated is not easy to be formed, fluorescent powder deposition, color drift, luminance nonuniformity
Even problem, can effectively improve the stability, reliability, yield rate of light bar product, and reduce production cost.
Extrusion forming packaging technology another advantage is that, may be implemented to carry out the LED chip of overlength light bar primary
Complete package avoids drop adhesive process and is made into after billet product dark space and appearance caused by being connected into a whole generated interface again
Defect improves the appearance of light bar product and the continuity of light shape, while reaching higher IP degree of protection.
The present invention also proposes a kind of COB light bar.
It is the structural schematic diagram figure of COB light bar referring to Fig. 2-4, Fig. 2, Fig. 3 is the structure of the not set packing colloid of COB light bar
Schematic diagram, Fig. 4 are the decomposition diagram of COB light bar.
As in Figure 2-4, in the present embodiment, it if the COB light bar includes stem substrate 100, is pasted on each substrate 100
Several light-emitting components 200, different substrate 100 form light bar by the connection of connecting plate 210.The upper surface of each substrate 100 is along it
Length direction is equipped with the viscose area 100a that width is a, the attachment area 100b for being b equipped with width in viscose area 100a, light-emitting component
200 are mounted in attachment area 100b, and interconnected viscose area 100a is arranged in by extrusion forming mode for packing colloid 300
It is interior.
The present invention is by connecting into pencil-shape lamp band for substrate 100, and by packing colloid 300 by way of extrusion forming
It is arranged on the light-emitting surface of light bar, can effectively realizes to overall package of light-emitting component in long light bar, the COB lamp of formation
Band is without interface defect, and the appearance integraty of light bar is good, and no dark space, and IP protective performance is high.
In the present embodiment, light-emitting component 200 is LED chip, and LED chip is equidistantly mounted on by 100 length direction of substrate
It mounts in area 100b, the spacing between adjacent LED chip is maintained within 1mm~10mm, can effectively ensure that light bar shines more
Uniformly, it there will not be obvious luminous point when even if low bright to occur.Core when the distance between LED chip is less than 1mm, on substrate 100
Sector-meeting is overstocked, and mounting cost and difficulty will increase dramatically；When the distance between LED chip is greater than 10mm, light bar presence will lead to
The problem that Luminescence Uniformity is inadequate, bright spot is obvious.
Preferably, light-emitting component 200 is fixed on the substrate 100 by transparent cured glue 400.Specifically, by packing colloid
300 are arranged before substrate 100, first pass through transparent cured glue 400 by light-emitting component 200 it is pre- it is solid on the substrate 100, avoid product from turning
Cause to pollute when fortune or molding and damage.
In the present embodiment, in the present embodiment, substrate 100 is using double-faced flexible FPC, 100 tow sides of substrate
Copper layer thickness between 20-75 μm.When copper layer thickness is less than 20 μm, the circuit etching conductive capability formed in layers of copper is poor,
And when layers of copper is greater than -75 μm, it will be greatly reduced the flexibility of substrate, light bar be easy to cause damage in bending.Further,
Also reinforcing rib can be set in the side of LED chip to reinforce the protection to LED chip, to increase the warp resistance resistant to bending of product
Performance.
It should be noted that in the present embodiment, substrate 100 is not limited to using double-faced flexible FPC, and manufacturer can root
Substrate 100 of the different substrates as light bar is selected according to actual needs, for example, in the feelings for not considering light bar warp resistance bending performance
Under condition, other hard plate materials such as glass-fiber-plate, aluminum substrate also can be used as substrate 100.
In the present embodiment, preparation is encapsulated added with fluorescent powder, colorant etc. in packing colloid 300, for improving light bar
Luminous efficiency or change light bar luminescent color, it should be noted that the encapsulation preparation specifically used be according to production need
To carry out selection, however it is not limited to two kinds of encapsulation preparations of fluorescent powder and colorant.
In the present embodiment, packing colloid 300 is made of transparent silica gel or Transparent PVC window.The width of packing colloid 300
Between 1mm~20mm, thickness is between 0.1mm~5mm.It cannot be completely covered when the width of packing colloid 300 is less than 1mm
LED chip, and be greater than 20mm when, it is wider not require nothing more than PCB, and the big cost of light-emitting surface colloid amount is excessively high.The thickness of packing colloid 300
Degree is less than 0.1mm, and packing colloid 300 intact cannot be covered in LED chip, when the thickness of packing colloid 300 is higher than 5mm, it will
Light extraction efficiency is caused to reduce, product overall brightness is relatively low, and light efficiency is poor.
The above description is only a preferred embodiment of the present invention, is not intended to limit the scope of the invention, all at this
Under the inventive concept of invention, using equivalent structure transformation made by description of the invention and accompanying drawing content, or directly/use indirectly
It is included in other related technical areas in scope of patent protection of the invention.
Claims (10)
1. a kind of preparation method of COB light bar, which comprises the steps of:
Light-emitting component is mounted on substrate by S1；
Multiple substrate connections for being pasted with light-emitting component are become band by connecting plate, form light bar semi-finished product by S2；
Light bar semi-finished product are introduced into extruder by traction device, packaging plastic are passed through in extruder, and pass through extrusion by S3
Machine is by packaging plastic extrusion molding together with light bar semi-finished product；
The light bar semi-finished product that extruder squeezes out are introduced in solidification equipment and are packaged adhesive curing by S4.
2. the preparation method of COB light bar as described in claim 1, which is characterized in that in the step S1, light-emitting component is pasted
After on substrate, transparent cured glue is dripped on light emitting elements and is stood.
3. the preparation method of COB light bar as described in claim 1, which is characterized in that encapsulation employed in the step S3
Added with encapsulation preparation in glue.
4. the preparation method of COB light bar as claimed in claim 3, which is characterized in that encapsulation employed in the step S3
Glue is transparent silica gel or Transparent PVC window.
5. the preparation method of COB light bar as described in claim 1, which is characterized in that in the step S3, on light bar semi-finished product
Packaging plastic extrusion width between 1mm~20mm, squeeze out thickness between 0.1mm~5mm.
6. a kind of COB light bar characterized by comprising if stem substrate, several light-emitting components are pasted on each substrate, it is different
Substrate connects to form light bar by connecting plate, and light bar is equipped with the packing colloid of covering luminous element, and the packing colloid passes through
Extrusion forming mode is arranged in light bar.
7. COB light bar as claimed in claim 6, which is characterized in that drop has transparent fixed glue on the light-emitting component.
8. COB light bar as claimed in claim 6, which is characterized in that added with encapsulation preparation in the packaging plastic.
9. COB light bar as claimed in claim 8, which is characterized in that the packing colloid is transparent silica gel or Transparent PVC window
It is made.
10. COB light bar as claimed in claim 6, which is characterized in that the width of the packing colloid between 1mm~20mm,
Its thickness is between 0.1mm~5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910656176.5A CN110242881A (en) | 2019-07-19 | 2019-07-19 | The preparation method and COB light bar of COB light bar |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910656176.5A CN110242881A (en) | 2019-07-19 | 2019-07-19 | The preparation method and COB light bar of COB light bar |
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| Publication Number | Publication Date |
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| CN110242881A true CN110242881A (en) | 2019-09-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910656176.5A Pending CN110242881A (en) | 2019-07-19 | 2019-07-19 | The preparation method and COB light bar of COB light bar |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111237655A (en) * | 2020-01-23 | 2020-06-05 | 重庆慧库科技有限公司 | COB lamp panel manufacturing method and COB lamp panel |
| CN117894904A (en) * | 2024-03-14 | 2024-04-16 | 攀枝花镁森科技有限公司 | FPC-COB lamp strip and manufacturing method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109812721A (en) * | 2017-11-21 | 2019-05-28 | 王定锋 | A kind of LED light strip and preparation method thereof |
| CN209944046U (en) * | 2019-07-19 | 2020-01-14 | 惠州市慧昊光电有限公司 | COB lamp area |
-
2019
- 2019-07-19 CN CN201910656176.5A patent/CN110242881A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109812721A (en) * | 2017-11-21 | 2019-05-28 | 王定锋 | A kind of LED light strip and preparation method thereof |
| CN209944046U (en) * | 2019-07-19 | 2020-01-14 | 惠州市慧昊光电有限公司 | COB lamp area |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111237655A (en) * | 2020-01-23 | 2020-06-05 | 重庆慧库科技有限公司 | COB lamp panel manufacturing method and COB lamp panel |
| CN117894904A (en) * | 2024-03-14 | 2024-04-16 | 攀枝花镁森科技有限公司 | FPC-COB lamp strip and manufacturing method thereof |
| CN117894904B (en) * | 2024-03-14 | 2024-05-17 | 攀枝花镁森科技有限公司 | FPC-COB lamp strip and manufacturing method thereof |
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