TWI458134B - Packaged leds with phosphor films, and associated systems and methods - Google Patents

Packaged leds with phosphor films, and associated systems and methods Download PDF

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TWI458134B
TWI458134B TW100121668A TW100121668A TWI458134B TW I458134 B TWI458134 B TW I458134B TW 100121668 A TW100121668 A TW 100121668A TW 100121668 A TW100121668 A TW 100121668A TW I458134 B TWI458134 B TW I458134B
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led
phosphor
phosphor film
carrier
film
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TW100121668A
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TW201205891A (en
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Jonathon G Greenwood
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Micron Technology Inc
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Description

具有磷光膜之封裝發光二極體及相關之系統和方法Packaged light emitting diode with phosphor film and related systems and methods

本發明概言之係關於具有磷光膜之封裝發光二極體(LED)、及相關之系統及方法。SUMMARY OF THE INVENTION The present invention relates to packaged light emitting diodes (LEDs) having phosphorescent films, and related systems and methods.

由於LED有效產生高強度、高品質光，故出於許多目的對該等裝置之需要不斷增加。舉例而言，行動電話、個人數位助理、數位相機、MP3播放器及其他可攜式裝置使用LED或其他固態發光裝置產生白光用於背景照明。LED亦可用於除電子裝置外之應用中，例如用於天花板面板、桌燈、冰箱燈、臺燈、路燈、自動前照燈、及需要或期望發光之其他情形中。Since LEDs effectively produce high intensity, high quality light, the need for such devices is increasing for many purposes. For example, mobile phones, personal digital assistants, digital cameras, MP3 players, and other portable devices use LEDs or other solid state lighting devices to produce white light for background illumination. LEDs can also be used in applications other than electronic devices, such as ceiling panels, table lamps, refrigerator lights, table lamps, street lamps, automatic headlamps, and other situations where illumination is desired or desired.

與生產LED相關之一個挑戰係控制生產成本以使LED之定價與其他更習用之發光源相比具有競爭力。由於LED之成本大部分歸因於製備LED之方法，故製造商已嘗試降低處理成本。處理成本之一個態樣係關於磷光體在封裝LED系統中之使用。具體而言，典型LED發射藍光，而許多應用需要或至少受益於較柔和之有色光或白光。因此，製造商用吸收一部分所發射藍光並重新發射黃光形式之光的磷光體塗佈該等LED，從而產生白色或至少大約白色之複合光發射。One of the challenges associated with producing LEDs is to control production costs to make LED pricing competitive with other more conventional sources of illumination. Since the cost of LEDs is largely due to the method of making LEDs, manufacturers have tried to reduce processing costs. One aspect of processing cost relates to the use of phosphors in packaged LED systems. In particular, typical LEDs emit blue light, and many applications require or at least benefit from softer colored or white light. Thus, the manufacturer coats the LEDs by absorbing a portion of the emitted blue light and re-emitting the light in the form of yellow light to produce a white or at least approximately white composite light emission.

用於在LED之發射光途徑中提供磷光體區域的現有方法可顯著增加LED之成本。一種該方法包括將LED置於支撐基板之腔或凹槽中，且隨後用磷光體填充該腔。另一方法包括將LED置於平坦基板上且隨後在LED周圍構建壩並用磷光體填充內部區域。又一方法包括將磷光體層直接沈積於LED晶粒上且隨後去除磷光體之部分以暴露下伏焊墊，由此與晶粒電連接。儘管上述方法已獲得可產生適宜光發射特性之LED，但其均會增加LED之成本。因此，工業中仍需要改良之低成本處理技術。Existing methods for providing a phosphor region in the emission path of an LED can significantly increase the cost of the LED. One method includes placing an LED in a cavity or recess in a support substrate and subsequently filling the cavity with a phosphor. Another method involves placing the LED on a flat substrate and then constructing a dam around the LED and filling the interior region with a phosphor. Yet another method includes depositing a phosphor layer directly onto the LED die and subsequently removing portions of the phosphor to expose the underlying pad, thereby electrically connecting to the die. Although the above methods have obtained LEDs that produce suitable light emission characteristics, they all increase the cost of the LEDs. Therefore, there is still a need for improved low cost processing techniques in the industry.

本發明之態樣概言之係關於具有磷光膜之封裝發光二極體(LED)、及相關之系統及方法。下文參照特定LED闡述本發明之若干實施例的具體細節以便達成對該等實施例之透徹瞭解。在其他實施例中，本發明之態樣可與具有其他組態之LED結合使用。為清晰起見，以下說明中並未闡釋用以闡述眾所周知且經常與LED相關、但可不必要地淡化本發明之一些顯著態樣的若干細節。此外，儘管以下解釋內容闡釋本發明不同態樣之若干實施例，但若干其他實施例可具有與此部分中所述之彼等不同之組態、不同之組份及/或不同之方法或步驟。因此，本發明可具有其他實施例，該等實施例具有額外要素、及/或無下文參照圖1至5闡述之若干要素。Aspects of the invention relate to packaged light emitting diodes (LEDs) having phosphorescent films, and related systems and methods. Specific details of several embodiments of the invention are set forth in the <RTIgt; In other embodiments, aspects of the invention may be used in conjunction with LEDs having other configurations. For the sake of clarity, the following description does not illustrate some of the details that are well known and often associated with LEDs, but which may unnecessarily dilute some of the salient aspects of the present invention. In addition, although the following explanation sets forth several embodiments of various aspects of the invention, several other embodiments may have different configurations, different components, and/or different methods or steps than those described in this section. . Accordingly, the present invention is capable of other embodiments, and the embodiments may have additional elements and/

圖1係LED系統100之局部示意性剖視側面圖，該系統包括經組合形成本發明實施例的封裝101之組件。該等組件可包括攜載LED 130之支撐部件140、及視情況由載體120支撐之磷光膜110。磷光膜110具有等形性且在利用焊線104將LED 130後連接至支撐部件140後其附接至LED 130及支撐部件140。下文闡述此佈置及相關方法之其他細節。1 is a partial schematic cross-sectional side view of an LED system 100 including components that are assembled to form a package 101 of an embodiment of the present invention. The components may include a support member 140 carrying the LED 130, and a phosphor film 110 supported by the carrier 120 as appropriate. The phosphor film 110 has an isomorphism and is attached to the LED 130 and the support member 140 after the LED 130 is subsequently attached to the support member 140 by the bonding wire 104. Further details of this arrangement and related methods are set forth below.

在圖1中所示之特定實施例中，支撐部件140係自陶瓷或另一適宜基材材料形成且具有第一(例如，面朝上)表面143a及第二(例如，面朝下)表面143b。每一支撐部件140進一步包括為LED 130及/或自其提供電連通的第一及第二支撐部件結合位點141a、141b(例如焊墊)。因此，支撐部件結合位點141a、141b中之每一者藉由相應通孔142或另一導電結構連接至相應封裝結合位點102a、102b。第一及第二封裝結合位點102a、102b可自封裝101之外側接近以有利於在封裝101與外部裝置(圖1中未顯示)之間進行物理及電連接。In the particular embodiment illustrated in Figure 1, the support member 140 is formed from a ceramic or another suitable substrate material and has a first (e.g., face up) surface 143a and a second (e.g., face down) surface. 143b. Each support member 140 further includes first and second support member bonding sites 141a, 141b (e.g., pads) that are in electrical communication with and/or from the LEDs 130. Thus, each of the support member bonding sites 141a, 141b is coupled to the respective package bonding sites 102a, 102b by respective vias 142 or another conductive structure. The first and second package bonding sites 102a, 102b can be accessed from the outside of the package 101 to facilitate physical and electrical connection between the package 101 and an external device (not shown in Figure 1).

支撐部件140在(例如)支撐部件表面143a處攜載LED 130。LED 130可包括第一LED結合位點131a及第二LED結合位點131b。第二LED結合位點131b可面朝第二支撐部件結合位點141b且與其直接電連接。在另一實施例中，第二LED結合位點131b可背離第二支撐部件結合位點141b，且可利用焊線連接至第二支撐部件結合位點141b。在任一實施例中，第一LED結合位點131a可利用焊線104電連接至第一支撐部件結合位點141a。在圖1中所示之實施例的特定態樣中，封裝101亦可包括靜電放電(ESD)晶粒103，其為LED 130提供保護且亦利用焊線104電連接至第一支撐部件結合位點141a，並以適宜背側表面對表面連接電連接至第二支撐部件結合位點141b。在其他實施例中，可忽略ESD晶粒103。The support member 140 carries the LED 130 at, for example, the support member surface 143a. The LED 130 can include a first LED bonding site 131a and a second LED bonding site 131b. The second LED bonding site 131b can face and be directly electrically connected to the second support member bonding site 141b. In another embodiment, the second LED bonding site 131b can face away from the second support member bonding site 141b and can be connected to the second support member bonding site 141b using a bonding wire. In either embodiment, the first LED bonding site 131a can be electrically coupled to the first support member bonding site 141a using bond wires 104. In a particular aspect of the embodiment shown in FIG. 1, package 101 may also include an electrostatic discharge (ESD) die 103 that provides protection for LED 130 and is also electrically connected to the first support component bond by wire bond 104. Point 141a is electrically connected to the second support member bonding site 141b with a suitable backside surface to surface connection. In other embodiments, the ESD die 103 can be ignored.

在圖1中所示之實施例中，LED 130具有面朝上之作用表面132，透過其發射光(例如藍光)。磷光膜110定位於作用表面132上以改變方向遠離封裝101之光的特性。因此，磷光膜110可包括具有磷光體成份112之分佈的基質材料111。磷光體成份112接收LED 130之光且發射不同波長之光以(例如)產生白色而非藍色之複合發射光。In the embodiment shown in FIG. 1, LED 130 has an upwardly facing active surface 132 through which light (e.g., blue light) is emitted. The phosphor film 110 is positioned on the active surface 132 to change the characteristics of the light away from the package 101. Accordingly, the phosphor film 110 can include a matrix material 111 having a distribution of phosphor components 112. Phosphor component 112 receives the light of LED 130 and emits light of a different wavelength to, for example, produce a composite emission of white rather than blue.

在一特定實施例中，磷光膜110係由自支撐、保留形狀但仍具有韌性或可等形之材料形成。舉例而言，磷光膜110之基質材料111可包括部分固化(例如b階段)之環氧樹脂材料，其在呈膜形式時具有足夠處理強度，但其在加熱時可與LED及相關特徵等形。在處理期間，如箭頭C所示使磷光膜110與LED 130及支撐部件140接觸，且加熱以形成下文參照圖2闡述之組裝單元。基質材料111可因加熱而軟化，從而使磷光膜110與LED 130及連接LED 130與支撐部件140之焊線104等形。在一特定實施例中，基質材料111於升高溫度下足夠順從以在焊線104周圍等形、流動或以其他方式變形，而不會代替、扭曲、干擾或以其他方式改變焊線104之位置及/或形狀。因此，可在添加磷光膜110之前將LED 130用焊線連接至支撐部件140，且磷光膜110不會干擾焊線104之完整性。In a particular embodiment, the phosphor film 110 is formed from a self-supporting, retained shape material that is still tough or otherwise conformable. For example, the matrix material 111 of the phosphor film 110 may comprise a partially cured (eg, b-stage) epoxy material that has sufficient processing strength when in film form, but which can be shaped with LEDs and related features when heated . During processing, the phosphor film 110 is brought into contact with the LED 130 and the support member 140 as indicated by arrow C and heated to form an assembly unit as explained below with reference to FIG. The matrix material 111 can be softened by heating to shape the phosphor film 110 and the LEDs 130 and the bonding wires 104 connecting the LEDs 130 to the support member 140. In a particular embodiment, the matrix material 111 is sufficiently compliant at elevated temperatures to conform, flow, or otherwise deform around the bond wire 104 without replacing, distorting, interfering with, or otherwise altering the bond wire 104. Location and / or shape. Therefore, the LED 130 can be connected to the support member 140 with a bonding wire before the addition of the phosphor film 110, and the phosphor film 110 does not interfere with the integrity of the bonding wire 104.

基質材料111亦選擇為對由LED 130及膜110發射之輻射至少部分(在特定實施例中，完全)透明。舉例而言，在LED發射藍光且磷光體成份112發射黃光之情形下，基質材料111選擇為對兩種波長大體上透明。在某些實施例中，膜110可包括多個磷光體成份112，不同磷光體成份經選擇以發射相應不同波長之光。在其他實施例中，封裝101可包括多個膜層110，其各自具有磷光體元件112以發射相應不同波長之光。在該等實施例中之任一者中，基質材料111可選擇為對一或多種(例如，所有)發射波長至少部分(且在特定實施例中，完全)透明。The matrix material 111 is also selected to be at least partially (in a particular embodiment, completely) transparent to the radiation emitted by the LEDs 130 and 110. For example, where the LED emits blue light and the phosphor component 112 emits yellow light, the host material 111 is selected to be substantially transparent to both wavelengths. In some embodiments, film 110 can include a plurality of phosphor components 112 that are selected to emit light of corresponding different wavelengths. In other embodiments, the package 101 can include a plurality of film layers 110 each having a phosphor element 112 to emit light of a respective different wavelength. In any of these embodiments, the matrix material 111 can be selected to be at least partially (and in a particular embodiment, completely) transparent to one or more (eg, all) emission wavelengths.

在一特定實施例中，磷光膜110作為獨立式單元強到足以耐受常規微電子裝置處理技術。在其他實施例中，磷光膜110可附接至載體120，其可為剛性或半剛性以便在製程期間為磷光膜提供額外支撐。因此，磷光膜110可包括面朝LED 130及支撐部件140之第一表面113a、及與第一表面113a相反面對且附接至載體120之第二表面113b。載體120通常比磷光膜110更硬及/或剛性更強以提供額外支撐。在一特定實施例中，載體120可包括大體上平坦、大體上剛性且大體上透明的材料，其為磷光膜110提供支撐，而不會影響遠離LED 130之光的透射。舉例而言，載體120可包括對輻射(例如，光，且在特定實施例中，可見光)透明之玻璃的平坦層。在其他實施例中，載體120可包括不會影響由LED 130發射之光的特徵。舉例而言，載體120可包括重定向自LED 130發射之光的透鏡部分121。在另一實施例中，載體120可包括除磷光膜110中存在之彼等磷光體成份外的其他磷光體成份112。若載體120包括磷光體成份，則磷光體成份在載體120中之濃度通常小於磷光體成份112在磷光膜110中之濃度。載體120可固定附接至膜110，且可形成封裝101之永久部分。在其他實施例中，在膜110附接至LED 130及支撐部件140後，或體可自膜110釋放。In a particular embodiment, phosphor film 110 is strong enough as a stand-alone unit to withstand conventional microelectronic device processing techniques. In other embodiments, the phosphor film 110 can be attached to the carrier 120, which can be rigid or semi-rigid to provide additional support for the phosphor film during the process. Accordingly, the phosphor film 110 may include a first surface 113a facing the LED 130 and the support member 140, and a second surface 113b opposite to the first surface 113a and attached to the carrier 120. Carrier 120 is generally stiffer and/or stiffer than phosphor film 110 to provide additional support. In a particular embodiment, the carrier 120 can comprise a substantially planar, substantially rigid, and substantially transparent material that provides support for the phosphor film 110 without affecting the transmission of light away from the LEDs 130. For example, carrier 120 can include a planar layer of glass that is transparent to radiation (eg, light, and in particular embodiments, visible light). In other embodiments, the carrier 120 can include features that do not affect the light emitted by the LEDs 130. For example, carrier 120 can include a lens portion 121 that redirects light emitted from LED 130. In another embodiment, the carrier 120 can include other phosphor components 112 in addition to the phosphor components present in the phosphor film 110. If the carrier 120 comprises a phosphor component, the concentration of the phosphor component in the carrier 120 is generally less than the concentration of the phosphor component 112 in the phosphor film 110. The carrier 120 can be fixedly attached to the film 110 and can form a permanent portion of the package 101. In other embodiments, the body may be released from the film 110 after the film 110 is attached to the LED 130 and the support member 140.

圖2繪示磷光膜110與LED 130及基板140接觸後之封裝101。在製程期間，對封裝101之元件施加熱105，使得磷光膜110軟化並與焊線104、LED 130、ESD晶粒103(若存在)、及/或可自基板140之第一表面143a凸起或自其凹陷的其他特徵等形。因此，磷光膜110可在第一LED結合位點131a、第一支撐部件結合位點141a處、及/或兩個結合位點131a、141a之間之焊線104的位置處完全包圍、囊封及/或以其他方式容納焊線104。隨後可以圖2中所示形狀及位置完全固化整個封裝101以硬化磷光膜110，磷光膜110黏附至LED 130及基板140。2 illustrates the package 101 after the phosphor film 110 is in contact with the LED 130 and the substrate 140. During processing, heat 105 is applied to the components of package 101 such that phosphor film 110 softens and embosses with bond wires 104, LEDs 130, ESD die 103 (if present), and/or can be lifted from first surface 143a of substrate 140. Or other features that are recessed from it. Therefore, the phosphor film 110 can be completely surrounded and encapsulated at the position of the bonding wire 104 between the first LED bonding site 131a, the first supporting member bonding site 141a, and/or the two bonding sites 131a, 141a. And/or otherwise accommodate the bond wires 104. The entire package 101 can then be fully cured in the shape and position shown in FIG. 2 to harden the phosphor film 110, and the phosphor film 110 is adhered to the LED 130 and the substrate 140.

圖3A係繪示根據本發明實施例形成磷光膜110之方法300a的示意性方塊圖。在本實施例之一個態樣中，將基質材料111(例如，軟化、液體或可以其他方式流動或延展之環氧樹脂或其他材料)與磷光體成份112合併形成混合物114。磷光體成份112可均勻分佈於基質材料111中。其後，該混合物114可經成形或以其他方式處理，以根據多種適宜技術中之任一者產生磷光膜110。該等技術可包括旋塗方法、橡皮輥方法、或產生具有均勻厚度之磷光膜110的另一方法。隨後可在將磷光膜110施加至LED之前對其進行部分固化，如上文參照圖1及2所述。FIG. 3A is a schematic block diagram of a method 300a of forming a phosphor film 110 in accordance with an embodiment of the present invention. In one aspect of this embodiment, a matrix material 111 (e.g., softened, liquid, or otherwise epoxy or other material that flows or extends) is combined with the phosphor component 112 to form a mixture 114. The phosphor component 112 can be uniformly distributed in the matrix material 111. Thereafter, the mixture 114 can be shaped or otherwise processed to produce the phosphor film 110 in accordance with any of a variety of suitable techniques. Such techniques may include a spin coating method, a squeegee method, or another method of producing a phosphor film 110 having a uniform thickness. The phosphor film 110 can then be partially cured prior to application to the LED, as described above with reference to Figures 1 and 2.

圖3B繪示根據多個其他實施例形成磷光膜310的另一方法300b。在該等實施例中，磷光體成份不需均勻分佈於基質材料中。舉例而言，該方法可包括使用上述形成膜之方法中的任一者自基質材料111形成基質膜層115a。因此，基質材料111可具有上述黏著及柔軟特性。隨後可使用磷光體沈積方法(示於方塊116中)將磷光體成份直接佈置於基質膜層115a上。在替代實施例中，磷光體成份自身亦可使用上述先前技術中之任一者形成為個別的磷光膜層115b。在此實施例中，隨後將磷光膜層115b附接至基質膜層115a。在上述實施例之任一者中，結果係具有磷光體成份之不均勻分佈的多層磷光膜310。FIG. 3B illustrates another method 300b of forming a phosphor film 310 in accordance with various other embodiments. In such embodiments, the phosphor component need not be uniformly distributed in the matrix material. For example, the method can include forming the matrix film layer 115a from the matrix material 111 using any of the methods of forming a film described above. Therefore, the matrix material 111 can have the above-described adhesive and soft properties. Phosphor composition can then be disposed directly onto the host film layer 115a using a phosphor deposition process (shown in block 116). In an alternate embodiment, the phosphor component itself may also be formed as an individual phosphor film layer 115b using any of the prior art described above. In this embodiment, the phosphor film layer 115b is subsequently attached to the matrix film layer 115a. In any of the above embodiments, the result is a multilayer phosphor film 310 having an uneven distribution of phosphor components.

圖4係具有使用(例如)上述技術中之任一者參照圖3B形成的多層磷光膜310之封裝401的局部示意性立面分解圖。多層磷光膜310可包括自基質材料形成之第一層115a、及自磷光體成份112形成之第二層115b。如上文所論述，磷光體成份112及/或磷光體成份112之套組可經選擇以發射一個或一個以上波長之輻射。磷光體成份112係集中在與LED 130直接毗鄰之區域中。如上文參照圖1所論述，多層磷光膜310可自支撐或未自支撐，且在任一實施例中，可包括載體420以提供額外支撐。在圖4中所示之實施例中，載體420不包括透鏡部分。在其他實施例中，載體420可包括(例如)與上文參照圖1闡述之透鏡部分121類似的透鏡部分。4 is a partial schematic elevational exploded view of a package 401 having a multilayer phosphor film 310 formed using, for example, any of the above techniques with reference to FIG. 3B. The multilayer phosphor film 310 can include a first layer 115a formed from a matrix material and a second layer 115b formed from the phosphor composition 112. As discussed above, the set of phosphor component 112 and/or phosphor component 112 can be selected to emit radiation of one or more wavelengths. Phosphor composition 112 is concentrated in the area directly adjacent to LED 130. As discussed above with respect to FIG. 1, the multi-layer phosphor film 310 can be self-supporting or not self-supporting, and in any embodiment, can include carrier 420 to provide additional support. In the embodiment shown in Figure 4, the carrier 420 does not include a lens portion. In other embodiments, carrier 420 can include, for example, a lens portion similar to lens portion 121 set forth above with respect to FIG.

圖5係根據本發明之若干實施例對LED施加磷光膜之不同技術的局部示意性圖解。在一特定實施例中，磷光膜510可直接在載體晶圓520上形成且可定尺寸以為多種LED提供覆蓋。在此實施例之一個態樣中，可一起切割載體晶圓520及膜510以形成膜元件516。隨後使用習用拾取並放置方法將個別膜元件516個別地佈置於相應基板140(其中之一者示於圖5中)上。在另一實施例中，晶圓載體520及膜510可在附接至相應LED後進行切割。舉例而言，晶圓載體520及相關膜510可直接附接至LED晶圓133，其具有在LED晶圓133自身中已線結合至預圖案化或其他方式形成之電線的LED。在膜510及載體晶圓520已附接至LED晶圓133後，可切割或單切整個總成以產生(例如)組態與圖2中所示類似之個別封裝。Figure 5 is a partial schematic illustration of different techniques for applying a phosphor film to an LED in accordance with several embodiments of the present invention. In a particular embodiment, phosphor film 510 can be formed directly on carrier wafer 520 and can be sized to provide coverage for a variety of LEDs. In one aspect of this embodiment, carrier wafer 520 and film 510 can be cut together to form film element 516. Individual film elements 516 are then individually arranged on respective substrates 140 (one of which is shown in Figure 5) using conventional pick and place methods. In another embodiment, wafer carrier 520 and film 510 can be cut after attachment to respective LEDs. For example, wafer carrier 520 and associated film 510 can be directly attached to LED wafer 133 having LEDs that have been wire bonded to pre-patterned or otherwise formed wires in LED wafer 133 itself. After film 510 and carrier wafer 520 have been attached to LED wafer 133, the entire assembly can be cut or singulated to produce, for example, an individual package similar to that shown in FIG.

在另一實施例中，可對經單切LED施加不同磷光膜(例如，具有磷光體成份之不同濃度、分佈及/或類型之磷光膜)以負責由LED產生之輸出(例如，發射光之顏色)的差別。舉例而言，個別LED由於相關製程之變化而通常具有稍微不同之發射光特性且因此「分頻率倉(binned)」以使具有類似光特性之LED組合在一起。不同頻率倉之LED可接收具有不同磷光體特性之磷光膜以差異地調節所得封裝之光輸出。使用此技術可封裝不同頻率倉之LED以便產生相同或幾乎相同之光輸出，及/或可封裝頻率倉內之LED以與頻率倉內之其他LED等形。此技術之優點在於其可減少或消除用於歸類LED的頻率倉的數量、及/或改良頻率倉內之LED的均勻性。In another embodiment, different phosphorescent films (eg, phosphorescent films having different concentrations, distributions, and/or types of phosphor components) can be applied to the single-cut LEDs to account for the output produced by the LEDs (eg, emitting light) The difference in color). For example, individual LEDs typically have slightly different emission characteristics due to changes in the associated process and are therefore "binned" to combine LEDs having similar optical characteristics. LEDs of different frequency bins can receive phosphor films with different phosphor characteristics to differentially adjust the light output of the resulting package. Using this technique, LEDs of different frequency bins can be packaged to produce the same or nearly identical light output, and/or LEDs within the frequency bin can be packaged to be shaped with other LEDs within the frequency bin. An advantage of this technique is that it can reduce or eliminate the number of frequency bins used to classify LEDs, and/or improve the uniformity of LEDs within the frequency bin.

上文參照圖1至5闡述之至少一些實施例的一個特徵在於其可包括預形成之含磷光體之膜，在已將LED線結合至適宜支撐結構後，該含磷光膜置於相應LED(在晶圓位準或個別晶粒位準下)上。由於磷光體成份係由膜攜載，故其不需直接沈積於呈液態或其他形式之LED上。因此，支撐部件不需包括腔、凹槽、壩、或含有及/或限制磷光體成份之另一圍阻特徵。另外，期望在至少一些實施例中，磷光體成份在施加至LED時其分佈會比利用習用技術獲得之分佈更均勻。One feature of at least some embodiments set forth above with reference to Figures 1 through 5 is that it can include a preformed phosphor-containing film that is placed in a corresponding LED after the LED wire has been bonded to a suitable support structure ( Above the wafer level or individual grain level). Since the phosphor component is carried by the film, it does not need to be deposited directly on the liquid or other form of LED. Thus, the support member need not include a cavity, a groove, a dam, or another containment feature that contains and/or limits the composition of the phosphor. Additionally, it is contemplated that in at least some embodiments, the phosphor composition will be more evenly distributed when applied to the LED than would be obtained using conventional techniques.

上述方法之實施例的另一優點在於：由於膜具有順從性，故其可與下伏焊線之形狀等形，而無需進一步處理。具體而言，膜之等形性質可消除在膜中切割溝槽或凹槽以容納焊線的需要。因此，該方法所需之步驟可比一些習用技術中所用少。該方法之實施例亦可消除如下需要：在將磷光體成份沈積於LED上之前鋪置覆蓋焊線之單獨層，此係其他習用技術中所用之方法。此特徵使得膜110中之磷光體直接毗鄰LED 130、例如直接毗鄰作用表面132定位。此外，可在膜與LED嚙合之前向膜中添加磷光體成份。此特徵使得可與LED晶粒完全分離、例如與製造及處理晶粒平行地製造膜。此佈置可減少封裝晶粒所需之流動時間且可允許單獨形成或貯備晶粒及膜，此減小在總體製程中形成瓶頸的可能性。上述特徵可單獨或組合減少與封裝晶粒相關之時間及花費，且因此可減少所得晶粒封裝之成本。Another advantage of embodiments of the above method is that since the film is compliant, it can be shaped like the shape of the underlying wire without further processing. In particular, the isomorphic nature of the film eliminates the need to cut grooves or grooves in the film to accommodate the bond wires. Therefore, the steps required for this method can be used less than in some conventional techniques. Embodiments of the method may also eliminate the need to lay a separate layer covering the bond wire prior to depositing the phosphor component onto the LED, which is the method used in other conventional techniques. This feature allows the phosphor in film 110 to be positioned directly adjacent to LED 130, such as directly adjacent active surface 132. In addition, the phosphor component can be added to the film before it is engaged with the LED. This feature makes it possible to completely separate the LED dies, for example to fabricate films in parallel with the fabrication and processing of the dies. This arrangement can reduce the flow time required to package the die and can allow separate formation or storage of the die and film, which reduces the likelihood of bottlenecks in the overall process. The above features can reduce the time and expense associated with packaging the die, either alone or in combination, and thus can reduce the cost of the resulting die package.

依據前文所述，將瞭解，本文已出於圖解闡釋目的闡釋了本發明之具體實施例，但可在不背離本發明之情況下作出各種修改。舉例而言，基質材料可包括亦為磷光體成份提供支撐、且具有黏著特性以有利於結合至LED及/或支撐部件的其他組成(例如，除環氧樹脂外)。該等材料可包括(但不限於)固態、部分固化之熱固性黏著材料，其中一個實例係b階段環氧樹脂。LED可具有與圖中所示之彼等不同之形狀、尺寸及/或其他特性。在其他實施例中，可組合或消除在特定實施例上下文中闡述之本發明的某些特徵。舉例而言，在一些實施例中，可消除圖1中所示之載體120，且在其他實施例中可與圖4中所示之磷光膜組合。此外，儘管已在彼等實施例之上下文中闡述與某些實施例相關之優點，但其他實施例亦可呈現該等優點。在本發明範疇內，並非所有實施例均需要一定呈現該等優點。因此，本發明及相關技術可涵蓋本文中未明確展示或闡述之其他實施例。In view of the foregoing, it will be understood that the particular embodiments of the invention are described herein For example, the matrix material can include other components that also provide support for the phosphor component and have adhesive properties to facilitate bonding to the LED and/or support component (eg, in addition to epoxy). Such materials may include, but are not limited to, solid, partially cured thermoset adhesive materials, one example being a b-stage epoxy. The LEDs can have different shapes, sizes, and/or other characteristics than those shown in the figures. In other embodiments, certain features of the invention set forth in the context of particular embodiments may be combined or eliminated. For example, in some embodiments, the carrier 120 shown in FIG. 1 can be eliminated, and in other embodiments can be combined with the phosphor film shown in FIG. In addition, while the advantages associated with certain embodiments have been set forth in the context of the embodiments, other embodiments may present such advantages. Not all embodiments are required to exhibit such advantages within the scope of the invention. Accordingly, the present invention and related art may encompass other embodiments not explicitly shown or described herein.

100．．．LED系統100. . . LED system

101．．．封裝101. . . Package

102a．．．封裝結合位點102a. . . Package binding site

102b．．．封裝結合位點102b. . . Package binding site

103．．．靜電放電(ESD)晶粒103. . . Electrostatic discharge (ESD) grain

104．．．焊線104. . . Welding wire

110．．．磷光膜110. . . Phosphor film

111．．．基質材料111. . . Matrix material

112．．．磷光體成份112. . . Phosphor composition

113a．．．第一表面113a. . . First surface

113b．．．第二表面113b. . . Second surface

115a．．．基質膜層115a. . . Matrix membrane

115b．．．磷光膜層115b. . . Phosphorescent film layer

120．．．載體120. . . Carrier

121．．．透鏡部分121. . . Lens part

130．．．LED130. . . led

131a．．．第一LED結合位點131a. . . First LED binding site

131b．．．第二LED結合位點131b. . . Second LED binding site

132．．．作用表面132. . . Surface

133．．．LED晶圓133. . . LED wafer

140．．．支撐部件140. . . Support member

141a．．．第一支撐部件結合位點141a. . . First support member binding site

141b．．．第二支撐部件結合位點141b. . . Second support member binding site

142．．．通孔142. . . Through hole

143a．．．第一表面143a. . . First surface

143b．．．第二表面143b. . . Second surface

310．．．多層磷光膜310. . . Multilayer phosphor film

401．．．封裝401. . . Package

420．．．載體420. . . Carrier

510．．．磷光膜510. . . Phosphor film

516．．．膜元件516. . . Membrane element

520．．．載體晶圓520. . . Carrier wafer

圖1係根據本發明實施例而組態之LED系統中組件之局部示意性剖視側面圖。1 is a partial schematic cross-sectional side view of an assembly of an LED system configured in accordance with an embodiment of the present invention.

圖2係圖1中所示各組件的局部示意性剖視側面圖，其結合形成本發明實施例之封裝。2 is a partial schematic cross-sectional side view of the components shown in FIG. 1 in combination with a package forming an embodiment of the present invention.

圖3A係繪示根據本發明實施例形成磷光膜之方法的流程圖。3A is a flow chart showing a method of forming a phosphor film according to an embodiment of the present invention.

圖3B係繪示根據本發明之另一實施例形成多層磷光膜之方法的流程圖。3B is a flow chart showing a method of forming a multilayer phosphor film in accordance with another embodiment of the present invention.

圖4係根據本發明之一實施例具有多層磷光膜之封裝的局部示意性分解剖視側面圖。4 is a partial schematic exploded cross-sectional side view of a package having a multilayer phosphor film in accordance with an embodiment of the present invention.

圖5係根據本發明之其他實施例形成LED封裝的多種方法之局部示意性圖解。5 is a partial schematic illustration of various methods of forming an LED package in accordance with other embodiments of the present invention.

100．．．LED系統100. . . LED system

101．．．封裝101. . . Package

102a．．．封裝結合位點102a. . . Package binding site

102b．．．封裝結合位點102b. . . Package binding site

103．．．靜電放電(ESD)晶粒103. . . Electrostatic discharge (ESD) grain

104．．．焊線104. . . Welding wire

110．．．磷光膜110. . . Phosphor film

111．．．基質材料111. . . Matrix material

112．．．磷光體成份112. . . Phosphor composition

113a．．．第一表面113a. . . First surface

113b．．．第二表面113b. . . Second surface

120．．．載體120. . . Carrier

121．．．透鏡部分121. . . Lens part

130．．．LED130. . . led

131a．．．第一LED結合位點131a. . . First LED binding site

131b．．．第二LED結合位點131b. . . Second LED binding site

132．．．作用表面132. . . Surface

140．．．支撐部件140. . . Support member

141a．．．第一支撐部件結合位點141a. . . First support member binding site

141b．．．第二支撐部件結合位點141b. . . Second support member binding site

142．．．通孔142. . . Through hole

143a．．．第一表面143a. . . First surface

143b．．．第二表面143b. . . Second surface

Claims (43)

一種LED系統，其包含：支撐部件，其具有支撐部件結合位點；LED，其由該支撐部件攜載且具有LED結合位點；焊線，其具有在該支撐部件結合位點與該LED位點之間電連接的線；磷光膜，其由該LED及該支撐部件攜載，該磷光膜經定位以自該LED接收第一波長之光並發射與該第一波長不同之第二波長之光，該磷光膜經定位以在該LED結合位點處與該焊線直接接觸；及載體，其非透鏡且在該磷光膜上，其中該載體具有與該磷光膜大體上平坦的界面；該界面缺乏用以含該磷光膜的腔；及該磷光膜將該載體及該焊線的線分開。 An LED system comprising: a support member having a support member bonding site; an LED carried by the support member and having an LED bonding site; a bonding wire having a bonding site at the supporting member and the LED bit a line electrically connected between the dots; a phosphor film carried by the LED and the support member, the phosphor film being positioned to receive light of a first wavelength from the LED and emit a second wavelength different from the first wavelength Light, the phosphor film is positioned to be in direct contact with the bond wire at the LED bonding site; and a carrier that is non-lens and on the phosphor film, wherein the carrier has a substantially flat interface with the phosphor film; The interface lacks a cavity for containing the phosphor film; and the phosphor film separates the carrier and the wire of the bonding wire. 如請求項1之系統，其中該支撐部件攜載該LED之表面大體上平坦，且其中該表面不包括含有該磷光膜之特徵。 The system of claim 1, wherein the surface of the support member carrying the LED is substantially flat, and wherein the surface does not include features comprising the phosphor film. 如請求項1之系統，其中該支撐部件攜載該LED之表面大體上平坦，且其中該表面不包括定位有該LED之腔。 The system of claim 1, wherein the surface of the support member carrying the LED is substantially flat, and wherein the surface does not include a cavity in which the LED is positioned. 如請求項1之系統，其中該磷光膜係結合至該LED及該支撐部件。 The system of claim 1, wherein the phosphor film is bonded to the LED and the support member. 如請求項1之系統，其中該磷光膜包括基質材料及多個磷光體成份，且其中該等磷光體成份係大體上均勻地分佈於該基質材料中。 The system of claim 1, wherein the phosphor film comprises a matrix material and a plurality of phosphor components, and wherein the phosphor components are substantially uniformly distributed in the matrix material. 如請求項5之系統，其中該基質材料對由該LED發射之光 大體上透明。 The system of claim 5, wherein the matrix material is directed to light emitted by the LED It is generally transparent. 如請求項1之系統，其中該磷光膜具有與該LED接觸之第一表面及背對該第一表面之第二表面，且其中磷光體成份在該膜中朝向該第一表面的濃度比朝向該第二表面的濃度大。 The system of claim 1, wherein the phosphor film has a first surface in contact with the LED and a second surface opposite the first surface, and wherein a concentration ratio of the phosphor component in the film toward the first surface is The concentration of the second surface is large. 如請求項1之系統，其中該載體對該第二波長之光透明。 The system of claim 1, wherein the carrier is transparent to the light of the second wavelength. 如請求項8之系統，其進一步包含定位於該載體上的透鏡，以影響由該LED發射之輻射。 The system of claim 8 further comprising a lens positioned on the carrier to affect radiation emitted by the LED. 如請求項1之系統，其中該LED包括LED焊墊，且其中該磷光膜經定位以與該LED直接接觸且與該焊線之一部分在該LED焊墊處直接接觸。 The system of claim 1, wherein the LED comprises an LED pad, and wherein the phosphor film is positioned to be in direct contact with the LED and in direct contact with a portion of the bond wire at the LED pad. 如請求項1之系統，其中該磷光膜沿該焊線之長度在至少一個位置處完全包圍該焊線之外表面。 The system of claim 1, wherein the phosphor film completely surrounds the outer surface of the bonding wire at at least one location along the length of the bonding wire. 如請求項1之系統，其中該焊線在與該LED結合位點間隔開之位置處由該磷光膜囊封。 The system of claim 1, wherein the bonding wire is encapsulated by the phosphor film at a location spaced apart from the LED binding site. 如請求項1之系統，其中該LED具有作用表面，其經定位以使該LED發射之光可自其穿過，且其中該磷光膜係與該作用表面直接接觸。 The system of claim 1 wherein the LED has an active surface positioned to allow light emitted by the LED to pass therethrough, and wherein the phosphor film is in direct contact with the active surface. 一種LED系統，其包含：支撐部件，其具有支撐部件焊墊；LED，其由該支撐部件攜載且具有LED焊墊；焊線，其具有在該支撐部件焊墊與該LED焊墊之間電連接的線； 非透鏡的載體；及磷光膜，其定位於該LED與該載體之間以自該LED接收第一波長之光並發射與該第一波長不同之第二波長之光，其中該磷光膜與該焊線之至少一部分等形並將其囊封，該磷光膜亦將該載體自該焊線的線分開；該磷光膜及該載體具有大體上平坦的界面在其間，且該載體對該第二波長之光透明。 An LED system comprising: a support member having a support member pad; an LED carried by the support member and having an LED pad; a bonding wire having between the support member pad and the LED pad Electrically connected line; a non-lens carrier; and a phosphor film positioned between the LED and the carrier to receive light of a first wavelength from the LED and emit light of a second wavelength different from the first wavelength, wherein the phosphor film At least a portion of the wire is contoured and encapsulated, the phosphor film also separating the carrier from the wire of the wire; the phosphor film and the carrier having a substantially flat interface therebetween, and the carrier is The wavelength of light is transparent. 如請求項14之系統，其中磷光體在該磷光膜中之濃度大於磷光體在該載體中存在時之濃度。 The system of claim 14, wherein the concentration of the phosphor in the phosphor film is greater than the concentration of the phosphor in the carrier. 如請求項14之系統，其中該磷光膜具有與該LED接觸之第一表面及與該載體接觸之第二表面，且其中磷光體成份在該磷光膜中朝向該第一表面之濃度比朝向該第二表面之濃度大。 The system of claim 14, wherein the phosphor film has a first surface in contact with the LED and a second surface in contact with the carrier, and wherein a concentration ratio of the phosphor component in the phosphor film toward the first surface faces The concentration of the second surface is large. 如請求項14之系統，其進一步在包括定位在該載體上的透鏡，以收集並影響由該LED發射之光。 The system of claim 14, further comprising a lens positioned on the carrier to collect and affect light emitted by the LED. 如請求項14之系統，其中該載體具有包括玻璃之第一組成且該磷光膜具有包括環氧樹脂之第二組成。 The system of claim 14, wherein the carrier has a first composition comprising glass and the phosphor film has a second composition comprising an epoxy resin. 一種晶圓總成，其包含：發光二極體(LED)晶圓；載體晶圓；及磷光膜系統，將該LED晶圓及該載體晶圓分開，該磷光膜系統包含：形成第一層之順從性、大體上透明之基質材料膜，其 大體上覆蓋該LED晶圓；及形成第二層之磷光體成份的分佈，該第二層與該第一層及該載體晶圓表面對表面地接觸，其中該第二層具有與該載體晶圓大體上平坦的界面。 A wafer assembly comprising: a light emitting diode (LED) wafer; a carrier wafer; and a phosphor film system, the LED wafer and the carrier wafer are separated, the phosphor film system comprising: forming a first layer Compliance, substantially transparent matrix material film, Generally covering the LED wafer; and forming a distribution of phosphor components of the second layer, the second layer is in surface contact with the first layer and the surface of the carrier wafer, wherein the second layer has a crystal with the carrier A generally flat interface. 如請求項19之晶圓總成，其中磷光體在該第二層中之濃度大於磷光體在該第一層中存在時之濃度。 The wafer assembly of claim 19, wherein the concentration of the phosphor in the second layer is greater than the concentration of the phosphor when present in the first layer. 如請求項19之晶圓總成，其中該第二層係位於該第一層與該載體晶圓之間。 The wafer assembly of claim 19, wherein the second layer is between the first layer and the carrier wafer. 如請求項19之晶圓總成，其中該基質材料包括固態、部分固化之熱固性黏著材料。 The wafer assembly of claim 19, wherein the matrix material comprises a solid, partially cured thermoset adhesive material. 一種晶圓總成，其包含：發光二極體(LED)晶圓；附接至該LED晶圓的膜，該膜具有順從性、透光基質材料及磷光體成份之分佈；及附接至該膜之剛性或半剛性透光載體，該載體具有與該膜大體上平坦的界面，且該載體藉由該膜與該LED晶圓分開。 A wafer assembly comprising: a light emitting diode (LED) wafer; a film attached to the LED wafer, the film having a compliant, light transmissive matrix material and a distribution of phosphor components; and attached to A rigid or semi-rigid light transmissive carrier of the film, the carrier having a substantially flat interface with the film, and the carrier being separated from the LED wafer by the film. 如請求項23之晶圓總成，其中該基質材料具有第一組成且該載體具有與該第一組成不同之第二組成。 The wafer assembly of claim 23, wherein the matrix material has a first composition and the carrier has a second composition that is different from the first composition. 如請求項24之晶圓總成，其中該第二組成包括玻璃且該第一組成包括部分固化之環氧樹脂。 The wafer assembly of claim 24, wherein the second composition comprises glass and the first composition comprises a partially cured epoxy. 如請求項23之晶圓總成，其中磷光體在該膜中之濃度大於磷光體在該大體上剛性載體中存在時之濃度。 The wafer assembly of claim 23, wherein the concentration of the phosphor in the film is greater than the concentration of the phosphor in the substantially rigid carrier. 如請求項23之晶圓總成，其中該等磷光體成份對第一波 長之輻射主動反應並發射與該第一波長不同之第二波長之輻射，且其中該載體對該第一及第二波長二者大體上透明。 The wafer assembly of claim 23, wherein the phosphor components are for the first wave The long radiation actively reacts and emits a second wavelength of radiation different from the first wavelength, and wherein the carrier is substantially transparent to both the first and second wavelengths. 如請求項23之晶圓總成，其中該膜具有第一勁度且其中該載體具有大於該第一勁度之第二勁度。 The wafer assembly of claim 23, wherein the film has a first stiffness and wherein the carrier has a second stiffness greater than the first stiffness. 如請求項23之晶圓總成，其中該膜包括基質材料之第一層及佈置為與該基質材料之第一層表面對表面接觸之磷光體成份的第二層。 The wafer assembly of claim 23, wherein the film comprises a first layer of matrix material and a second layer of phosphor composition disposed in surface contact with the surface of the first layer of the matrix material. 如請求項24之晶圓總成，其中該基質材料及該載體對可見光透明。 The wafer assembly of claim 24, wherein the matrix material and the carrier are transparent to visible light. 一種用於製造LED系統之方法，其包含：將LED安裝至支撐部件；利用焊線將該LED電連接至該支撐部件；在該LED與該支撐部件之間在該焊線之至少一部分上使預形成磷光膜與該焊線等形，其中使該預形成磷光膜等形包括在該磷光膜附接於載體時使其等形，其中該載體形成與該磷光膜大體上平坦的界面，而無用以含該磷光膜的腔，且其中該磷光膜將該載體自該焊線的線分開；及將該磷光膜附接至該LED及該支撐部件。 A method for fabricating an LED system, the method comprising: mounting an LED to a support member; electrically connecting the LED to the support member by a wire; and causing at least a portion of the bond wire between the LED and the support member The pre-formed phosphor film is shaped like the bonding wire, wherein the pre-formed phosphor film is shaped to include an isomorphism when the phosphor film is attached to the carrier, wherein the carrier forms a substantially flat interface with the phosphor film, and There is no cavity for containing the phosphor film, and wherein the phosphor film separates the carrier from the wire of the bonding wire; and attaching the phosphor film to the LED and the support member. 如請求項31之方法，其中使預形成磷光膜等形包括加熱部分固化之磷光膜及用該磷光膜包圍該焊線之至少一部分，且其中附接該磷光膜包括進一步固化該磷光膜。 The method of claim 31, wherein the pre-forming phosphor film or the like comprises heating the partially cured phosphor film and surrounding at least a portion of the bonding wire with the phosphor film, and wherein attaching the phosphor film comprises further curing the phosphor film. 如請求項31之方法，其中該LED係形成LED晶圓之至少 一部分之多個LED晶粒中之一者，且其中將該磷光膜附接至該LED包括在自該晶圓切割多個晶粒之前將該膜附接至該晶圓之該等晶粒。 The method of claim 31, wherein the LED forms at least one of the LED wafers One of a plurality of LED dies, and wherein attaching the phosphor film to the LED comprises attaching the film to the dies of the wafer prior to dicing the plurality of dies from the wafer. 如請求項31之方法，其中該磷光膜包括基質材料之第一層及磷光體成份之第二層，該第二層在使該磷光膜與該焊線等形時經佈置為與該基質材料之第一層表面對表面接觸。 The method of claim 31, wherein the phosphor film comprises a first layer of a host material and a second layer of a phosphor component, the second layer being disposed with the matrix material when the phosphor film is shaped like the bond wire The first layer of the surface is in contact with the surface. 如請求項31之方法，其中使預形成磷光膜等形包括在自LED晶圓單切該LED後使該預形成磷光膜等形。 The method of claim 31, wherein the pre-forming phosphor film isoform comprises forming the pre-formed phosphor film after forming the LED from the LED wafer. 如請求項31之方法，其中使預形成磷光膜等形包括在自LED晶圓單切該LED之前使該預形成磷光膜等形。 The method of claim 31, wherein the pre-forming the phosphor film isoform comprises forming the pre-formed phosphor film or the like prior to singulating the LED from the LED wafer. 如請求項31之方法，其中該載體之勁度大於該磷光膜之勁度且組成與該磷光膜之組成不同。 The method of claim 31, wherein the carrier has a stiffness greater than a stiffness of the phosphor film and a composition different from a composition of the phosphor film. 如請求項37之方法，其中該載體包括透鏡部分，該透鏡部分經定位以重定向由該LED發射之光。 The method of claim 37, wherein the carrier comprises a lens portion positioned to redirect light emitted by the LED. 如請求項31之方法，其中附接該磷光膜包括在附接該磷光膜時在該LED處不使用圍阻結構來容納磷光體成份流。 The method of claim 31, wherein attaching the phosphor film comprises not using a containment structure at the LED to accommodate the phosphor composition stream when the phosphor film is attached. 如請求項31之方法，其進一步包含藉由以下方式來形成該磷光膜：混合磷光體成份與基質材料；及至少部分固化該基質材料。 The method of claim 31, further comprising forming the phosphor film by mixing the phosphor component with the matrix material; and at least partially curing the matrix material. 如請求項31之方法，其中該LED係具有第一輸出特性之第一LED，該支撐部件係第一支撐部件，該焊線係第一 焊線且該磷光膜係具有第一磷光體特性之第一磷光膜，且其中該方法進一步包含：將第二LED安裝至第二支撐部件，該第二LED具有與該第一輸出特性不同之第二輸出特性；用第二焊線將該第二LED電子連接至該第二支撐部件；在該第二LED與該第二支撐部件之間在該焊線之至少一部分上使第二預形成磷光膜與該第二焊線等形，該第二磷光膜具有與該第一磷光體特性不同之第二磷光體特性，以至少部分補償該第一輸出特性與該第二輸出特性之間的差異；及將該第二磷光膜附接至該第二LED及該第二支撐部件。 The method of claim 31, wherein the LED is a first LED having a first output characteristic, the support member being a first support member, the bonding wire being first a bonding wire and the phosphor film is a first phosphor film having a first phosphor characteristic, and wherein the method further comprises: mounting the second LED to the second support member, the second LED having a different characteristic from the first output a second output characteristic; electronically connecting the second LED to the second support member with a second bonding wire; and forming a second pre-form on at least a portion of the bonding wire between the second LED and the second support member The phosphor film is shaped like the second bonding wire, the second phosphor film having a second phosphor characteristic different from the first phosphor characteristic to at least partially compensate between the first output characteristic and the second output characteristic a difference; and attaching the second phosphor film to the second LED and the second support member. 如請求項41之方法，其中該第一輸出特性係第一顏色特性，且其中該第二輸出特性係與該第一顏色特性不同之第二顏色特性。 The method of claim 41, wherein the first output characteristic is a first color characteristic, and wherein the second output characteristic is a second color characteristic that is different from the first color characteristic. 如請求項42之方法，其中該第一顏色特性係第一波長，且該第二顏色特性係與該第一波長不同之第二波長。 The method of claim 42, wherein the first color characteristic is a first wavelength and the second color characteristic is a second wavelength different from the first wavelength.
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