CN101034231A - LED back light module - Google Patents
LED back light module Download PDFInfo
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- CN101034231A CN101034231A CN 200610057241 CN200610057241A CN101034231A CN 101034231 A CN101034231 A CN 101034231A CN 200610057241 CN200610057241 CN 200610057241 CN 200610057241 A CN200610057241 A CN 200610057241A CN 101034231 A CN101034231 A CN 101034231A
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- led
- led chip
- light
- concave structure
- guide plate
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Abstract
The invention provides a LED backlight module, comprising substrate, LED chips, light guide plate and/or light scattering plate, light scattering and refracting mechanism and casing, and characterized in that LED chips are equipped in the light guide plate or light scattering plate. And the LED chips are directly packaged in the light guide plate or light scattering plate or other optical structure, which can largely reduce the size of the backlight source. And the light emitted from the light outgoing surface of the LED in all directions can directly enter into the optical structure of the backlight source, completely beneficial to raise light utilization ratio, and multiple LED bases are welded on one or more substrates so as to increase heat radiating area and improve heat dispersing effect. And it is simple to make, applied to make direct-type and edge lighting backlight sources and completely beneficial to raise industrial competitive power.
Description
Technical field
The present invention is about a kind of LED (Light Emitting Diode) backlight module.Especially led chip directly is encapsulated in the LED-backlit module in the backlight optical texture.
Background technology
At present, LCD (LCD) has become the main flow in flat pannel display field.Because liquid crystal itself is not luminous, so LCD need realize that transmission or reflection show by external light source.Existing LCD great majority are transmission-types, and for these transmission-types LCD, backlight is indispensable ingredient.
With respect to traditional cold cathode fluorescent lamp (CCFL), with LED be that the backlight module of light source has that color reducibility is good, advantage such as power saving, good environmental adaptability, pollution are little.Adopt the LCD of LED-backlit can show chromatic colour more, its color rendition scope can reach more than 105% of NTSC, be higher than far away CCFL backlight 75%.As the light source of full curing, LED has very strong environmental suitability.What is more important, CCFL contains the mercury metal that environment is had significant damage, and then there is not the problem of this respect in LED.Though at present the price of LED-backlit is than the CCFL height, and according to rule in the industry, per 10 years prices of LED descend about 10 times and performance improves about 20 times.Can predict, about 2008, LED will replace CCFL gradually and become the backlight source of main flow.
At present in the technology, all be with led chip packaged after, as independently light source and other optical textures combination backlight.Like this, the light that sends from led chip will be through encapsulating structure, the air of itself, numerous interfaces such as other optical textures of backlight, and the spreading loss of light guiding surface makes that the light utilization ratio is lower thus.Because single encapsulated LED area of dissipation is limited, the heat that produces distributes when being unfavorable for LED work.In addition, single encapsulated LED volume is relatively large, is unfavorable for making more compact backlight module.Therefore, need the backlight technology of a kind of utilization ratio that can either improve light and good heat dissipation effect, more compact structure.
Summary of the invention
Fundamental purpose of the present invention is the defective at prior art, and a kind of utilization ratio that can significantly improve light and good heat dissipation effect, LED-backlit technology that structure is more compact are provided.
In order to realize the foregoing invention purpose, the invention provides a kind of LED-backlit module, comprise substrate, led chip, light guide plate, astigmatism plate, light scattering and refraction means and shell is characterized in that: led chip is installed in the light guide plate.
Wherein, be manufactured with concave structure on the described light guide plate, led chip is placed in these concave structures; Concave structure can be individual or a plurality of for odd number on the described light guide plate; The described led chip that is placed in the concave structure can be that odd number is individual or a plurality of; The described form of laying that is placed in led chip in the concave structure can combining for upside-down mounting, formal dress or upside-down mounting and formal dress; Be filled with in the described concave structure and be used for color and adjust material or matter of matching refractive index, as fluorescent powder and refractive index match glue etc.; Described led chip base directly is fixed on one or more substrate.
In order to realize the foregoing invention purpose, the present invention also can be a kind of LED-backlit module, comprises substrate, led chip, and astigmatism plate, light scattering and refraction means and shell is characterized in that: led chip is installed in the astigmatism plate.
Wherein, be manufactured with concave structure on the described light guide plate, led chip is placed in these concave structures; Concave structure can be individual or a plurality of for odd number on the described light guide plate; The described led chip that is placed in the concave structure can be that odd number is individual or a plurality of; The described form of laying that is placed in led chip in the concave structure can combining for upside-down mounting, formal dress or upside-down mounting and formal dress; Be filled with in the described concave structure and be used for color adjustment material or matter of matching refractive index; Described led chip base directly is fixed on one or more substrate.
Among the present invention, light scattering and refraction means are made up of optical textures such as some diffusion barriers (plate) and prism films, and the upper surface of this mechanism is exactly the exiting surface of module.Led chip directly is encapsulated in the backlight optical texture, and the light that sends from LED directly enters the back light source structure, reduces a large amount of unnecessary boundary reflection losses.The base of LED, LED comprises contact conductor and heat sink structure, is placed on a substrate or several substrates, owing to can directly be fixed on the large-area substrate with circuit structure and radiator structure, thereby increased area of dissipation greatly, the radiating effect when also effectively having improved LED work.In addition, the light that led chip sends directly enters into structures such as light guide plate or astigmatism plate, adjust the color that the material acquisition needs by color, or by the minimum reflection loss of light of matter of matching refractive index acquisition, so not only improved the utilization factor of light, and compact conformation, be specially adapted to the making of ultra-thin backlight source.In a word, the present invention LED-backlit source that can provide has very high light utilization ratio and good heat dissipation effect, structure more compact.Be very beneficial for improving the competitive power of industry.
The present invention will be described in more detail with specific embodiment below with reference to accompanying drawings.
Description of drawings
The single led chip mount of Fig. 1 synoptic diagram in the light guide plate concave structure;
The a plurality of led chips of Fig. 2 are placed in synoptic diagram in the light guide plate concave structure;
Fig. 3 led chip adopts the upside-down mounting form to be placed in synoptic diagram in the astigmatism plate concave structure;
Fig. 4 led chip is placed in the both sides synoptic diagram of light guide plate;
Fig. 5 led chip is placed in the bottom schematic view of light guide plate;
The drawing reference numeral explanation:
1, LED; 2, light guide plate; 3, astigmatism plate; 4, light scattering and refraction means; 5, shell; 11, led chip; 12, chip pad; 13, the LED electrode is derived lead-in wire; 14, solder metal salient point; 21, concave structure; 22, color is adjusted material; 23, bottom reflection film; 24, matter of matching refractive index; 25, astigmatic site; 31, substrate metal layer; 32, substrate insulating layer; 33, substrate heat dissipating layer
Embodiment
Embodiment one:
As shown in Figure 1, in the present embodiment, the structure of holding led chip 11 is a light guide plate 2.Fig. 1 is placed in synoptic diagram in the concave structure 21 of light guide plate 2 with single led chip 11.The single blue-light LED chip 11 that uses in this example is placed on the chip pad 12, and its electrode is derived lead-in wire 13 through the LED electrode and is connected on the substrate that has circuit.Chip pad 12 is made by the material of coefficient of heat conductivity height, good mechanical property, and these materials can be silicon or metal etc.Substrate adopts the Metal Substrate pcb board of good heat dissipation effect, and its structure comprises substrate metal layer 31, substrate insulating layer 32 and substrate heat dissipating layer 33.The main body of light guide plate 2 is acryl materials, has made the concave structure 21 that holds led chip on the light guide plate, and concave structure 21 can utilize methods such as injection moulding punching press, machining, laser or heated filament ablation to make.Be filled with color in the concave structure 21 and adjust material 22, this material can be the known yellow fluorescent powder of intending white light that is used to inspire.On the light guide plate 2, lay the bottom surface of led chip, remove outside the concave structure zone, other parts are bottom reflection film 23.
Fig. 4 is the edge-lit-backlights source module that utilizes structure shown in Figure 1 to constitute with other assemblies of backlight.Led chip 11 directly is encapsulated in the both sides of light guide plate 2 in this module, is printed with astigmatic site 25 in the bottom of light guide plate 2.Miscellaneous part shown in the module comprises shell 5 and by light scattering and refraction means 4 that light-diffusing film, prism film etc. is formed, is known technology.
Fig. 5 is the direct-light-type backlight module that utilizes structure shown in Figure 1 to constitute with other assemblies of backlight.Led chip 11 directly is encapsulated in the bottom of light guide plate 2 in this module.Miscellaneous part shown in the module comprises shell 5 and by light scattering and refraction means 4 that light-diffusing film, prism film etc. is formed, is known technology.
Embodiment two:
During as Fig. 2 institute, in the present embodiment, the structure 2 of holding led chip 11 is light guide plate.Fig. 2 is placed in synoptic diagram in the concave structure 21 of light guide plate 2 with a plurality of led chips 11.Be placed on the chip pad 12 by red, green and blue three kinds of monochromatic LED chips 11, its electrode is derived lead-in wire 13 through the LED electrode and is connected on the circuit board substrate.Chip pad 12 is made by the material of coefficient of heat conductivity height, good mechanical property, and these materials can be silicon or metal etc.Circuit substrate adopts the Metal Substrate pcb board of good heat dissipation effect, and its structure comprises substrate metal layer 31, substrate insulating layer 32 and substrate grid thermosphere 33.The main body of light guide plate 2 is acryl materials, has made the concave structure 21 that holds led chip on the light guide plate, and concave structure 21 can utilize methods such as injection moulding punching press, machining, laser or heated filament ablation to make.Be filled with matter of matching refractive index 24 in the concave structure 21, this material can be that refractive index is through careful ultra-violet curing glue or the silica gel of selecting, adopt such matter of matching refractive index can reduce the Fresnel reflection loss of light on the different medium interface greatly, thereby further improve the utilization ratio of light.On the light guide plate, lay the bottom surface of led chip 11, remove outside concave structure 21 zones, other parts are bottom reflection film 23.
Adopt and embodiment one similar structure, can produce similar Fig. 4 and side-light type and direct-light-type backlight module shown in Figure 5.
Embodiment three:
In the present embodiment, the structure of holding led chip 11 is an astigmatism plate 3, and led chip 11 adopts the form of upside-down mounting to be encapsulated in the astigmatism plate 3.The electrode of led chip 11 is connected with chip pad 12 by solder metal salient point 14.Solder metal salient point 14 can be by the Pb/Sn alloy of electro-plating method making and Au/Sn alloy etc., also can directly use metal A u salient point, uses the upside-down mounting form, can improve the efficient of distributing of heat greatly.By known technology as can be known, light is outwards launched from led chip 11 bottoms, has better light extraction efficiency.
Adopt and embodiment one similar structure, can produce similar Fig. 4 and side-light type and direct-light-type backlight module shown in Figure 5.
More than explanation and accompanying drawing illustrate specific implementations of the present invention, but self-evident, the present invention can carry out various distortion by those skilled in the art and implement, and is designed to different shape as the concave structure with direct packaging LED chips; Can attached various bloomings on the surface of concave structure; The led chip mounting means is designed to the combination of upside-down mounting and formal dress etc.The embodiment that has been out of shape like that etc. can not break away from technological thought of the present invention or prospect is individually understood, and must regard as in the structure that appending claims of the present invention comprises.
Claims (18)
1. a LED-backlit module comprises substrate, led chip, and light guide plate, astigmatism plate, light scattering and refraction means and shell is characterized in that: led chip is installed in the light guide plate.
2. a kind of LED-backlit module according to claim 1 is characterized in that: be manufactured with concave structure on the described light guide plate, led chip is placed in these concave structures.
3. a kind of LED-backlit module according to claim 2 is characterized in that: concave structure can be individual or a plurality of for odd number on the described light guide plate.
4. a kind of LED-backlit module according to claim 3 is characterized in that: the described led chip that is placed in the concave structure can be that odd number is individual or a plurality of.
5. a kind of LED-backlit module according to claim 4 is characterized in that: the described form of laying that is placed in led chip in the concave structure can combining for upside-down mounting, formal dress or upside-down mounting and formal dress.
6. according to claim 2 or 3 or 4 or 5 described a kind of LED-backlit modules, it is characterized in that: be filled with in the described concave structure and be used for color and adjust material.
7. according to claim 2 or 3 or 4 or 5 described a kind of LED-backlit modules, it is characterized in that: be filled with in the described concave structure and be used for matter of matching refractive index.
8. a kind of LED-backlit module according to claim 6 is characterized in that: described led chip base directly is fixed on one or more substrate.
9. a kind of LED-backlit module according to claim 7 is characterized in that: described led chip base directly is fixed on one or more substrate.
10. a LED-backlit module comprises substrate, led chip, and astigmatism plate, light scattering and refraction means and shell is characterized in that: led chip is installed in the astigmatism plate.
11. a kind of LED-backlit module according to claim 10 is characterized in that: be manufactured with concave structure on the described astigmatism plate, led chip is placed in these concave structures.
12. a kind of LED-backlit module according to claim 11 is characterized in that: concave structure can be individual or a plurality of for odd number on the described astigmatism plate.
13. a kind of LED-backlit module according to claim 12 is characterized in that: the described led chip that is placed in the concave structure can be that odd number is individual or a plurality of.
14. a kind of LED-backlit module according to claim 13 is characterized in that: the described form of laying that is placed in led chip in the concave structure can combining for upside-down mounting, formal dress or upside-down mounting and formal dress.
15., it is characterized in that: be filled with in the described concave structure and be used for color and adjust material according to claim 11 or 12 or 13 or 14 described a kind of LED-backlit modules.
16., it is characterized in that: be filled with in the described concave structure and be used for matter of matching refractive index according to claim 11 or 12 or 13 or 14 described a kind of LED-backlit modules.
17. a kind of LED-backlit module according to claim 15 is characterized in that: described led chip base directly is fixed on one or more substrate.
18. a kind of LED-backlit module according to claim 16 is characterized in that: described led chip base directly is fixed on one or more substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100572415A CN100573266C (en) | 2006-03-09 | 2006-03-09 | A kind of LED-backlit module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100572415A CN100573266C (en) | 2006-03-09 | 2006-03-09 | A kind of LED-backlit module |
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| Publication Number | Publication Date |
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| CN101034231A true CN101034231A (en) | 2007-09-12 |
| CN100573266C CN100573266C (en) | 2009-12-23 |
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| CNB2006100572415A Active CN100573266C (en) | 2006-03-09 | 2006-03-09 | A kind of LED-backlit module |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101827238A (en) * | 2009-03-04 | 2010-09-08 | 康佳集团股份有限公司 | LED side light television |
| CN102221167A (en) * | 2011-06-13 | 2011-10-19 | 南京蓝摩科技有限公司 | LED backlight plate |
| CN102364685A (en) * | 2011-06-17 | 2012-02-29 | 杭州华普永明光电股份有限公司 | Lead-free LED (Light-Emitting Diode) module and manufacturing process thereof |
| CN102738375A (en) * | 2011-04-12 | 2012-10-17 | 东莞怡和佳电子有限公司 | Led light source module |
| CN102738371A (en) * | 2011-04-12 | 2012-10-17 | 东莞怡和佳电子有限公司 | White light led and manufacturing method thereof |
| CN102738356A (en) * | 2011-04-07 | 2012-10-17 | 矽品精密工业股份有限公司 | Light emitting diode packaging structure |
| CN103032765A (en) * | 2012-12-11 | 2013-04-10 | 京东方科技集团股份有限公司 | Light source module, liquid crystal display device and neon lamp display device |
| CN105135238A (en) * | 2008-11-19 | 2015-12-09 | 罗姆股份有限公司 | Led lamp |
| CN109509401A (en) * | 2019-01-17 | 2019-03-22 | 京东方科技集团股份有限公司 | Backlight, backlight module, display device and backlight source preparation method |
| CN110260263A (en) * | 2018-03-12 | 2019-09-20 | 联嘉光电股份有限公司 | Vehicle-mounted difunctional light emitting module and vehicle-mounted difunctional lighting lamp group |
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2006
- 2006-03-09 CN CNB2006100572415A patent/CN100573266C/en active Active
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105135238A (en) * | 2008-11-19 | 2015-12-09 | 罗姆股份有限公司 | Led lamp |
| CN101827238A (en) * | 2009-03-04 | 2010-09-08 | 康佳集团股份有限公司 | LED side light television |
| CN101827238B (en) * | 2009-03-04 | 2013-04-17 | 康佳集团股份有限公司 | LED side light television |
| CN102738356A (en) * | 2011-04-07 | 2012-10-17 | 矽品精密工业股份有限公司 | Light emitting diode packaging structure |
| CN102738375A (en) * | 2011-04-12 | 2012-10-17 | 东莞怡和佳电子有限公司 | Led light source module |
| CN102738371A (en) * | 2011-04-12 | 2012-10-17 | 东莞怡和佳电子有限公司 | White light led and manufacturing method thereof |
| CN102221167A (en) * | 2011-06-13 | 2011-10-19 | 南京蓝摩科技有限公司 | LED backlight plate |
| CN102364685A (en) * | 2011-06-17 | 2012-02-29 | 杭州华普永明光电股份有限公司 | Lead-free LED (Light-Emitting Diode) module and manufacturing process thereof |
| CN103032765A (en) * | 2012-12-11 | 2013-04-10 | 京东方科技集团股份有限公司 | Light source module, liquid crystal display device and neon lamp display device |
| CN110260263A (en) * | 2018-03-12 | 2019-09-20 | 联嘉光电股份有限公司 | Vehicle-mounted difunctional light emitting module and vehicle-mounted difunctional lighting lamp group |
| CN110260263B (en) * | 2018-03-12 | 2022-01-18 | 联嘉光电股份有限公司 | Vehicle-mounted dual-function light emitting module and vehicle-mounted dual-function lighting lamp set |
| CN109509401A (en) * | 2019-01-17 | 2019-03-22 | 京东方科技集团股份有限公司 | Backlight, backlight module, display device and backlight source preparation method |
| CN109509401B (en) * | 2019-01-17 | 2022-10-04 | 京东方科技集团股份有限公司 | Backlight source, backlight module, display device and backlight source manufacturing method |
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|---|---|
| CN100573266C (en) | 2009-12-23 |
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