CN102364685A - Lead-free LED (Light-Emitting Diode) module and manufacturing process thereof - Google Patents
Lead-free LED (Light-Emitting Diode) module and manufacturing process thereof Download PDFInfo
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- CN102364685A CN102364685A CN2011101648982A CN201110164898A CN102364685A CN 102364685 A CN102364685 A CN 102364685A CN 2011101648982 A CN2011101648982 A CN 2011101648982A CN 201110164898 A CN201110164898 A CN 201110164898A CN 102364685 A CN102364685 A CN 102364685A
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Abstract
The invention relates to a lead-free LED (Light-Emitting Diode) module and a manufacturing process thereof. The LED module comprises a radiator, a PCB (Printed Circuit Board), an LED chip, an encapsulating colloid, sealing silica gel and a lens module, wherein the LED chip is welded on the PCB; the anode and cathode of the LED chip are welded on corresponding electrode pads respectively; the PCB is jointed with the radiator; and the lens module is arranged above the LED chip, and is filled with the encapsulating colloid. The LED chip is directly welded on the circuit board, so that the conventional LED encapsulating process is eliminated, a bracket comprising a heat sink is eliminated, heat of the LED chip is directly diffused to the high-heat-conductivity circuit board and the radiator, and the radiating effect is enhanced. Only the sealing colloid is arranged between the lens module and the LED chip, so that light rays pass through a small quantity of media, and the transmittance is high; and the filling colloid is matched with the refractive index of the lens module, so that the reflection loss is small, and the light emitting rate of the LED module is increased.
Description
Technical field
The present invention relates to semiconductor application and encapsulation field, more particularly, relate to a kind of LED module and manufacturing process thereof of not having lead-in wire.
Background technology
Along with led chip technology and Development of Packaging Technology, increasing LED product is applied to lighting field, especially large power white light LED.Because LED has high light efficiency, long-life, energy-conserving and environment-protective, suitable brightness adjustment control, polluter such as not mercurous, becomes the lighting source of new generation after conventional light source such as incandescent lamp, fluorescent lamp.
LED is a kind of electroluminescence semiconductor device, wherein has 30 percent electric energy to convert light into approximately, and dump energy then converts heat into, and the LED temperature that thermal accumlation causes rises, and is the main cause that causes the LED light decay.Thereby the led chip heat radiation is the key issue that the LED encapsulation is devoted to solve, and manufacturer has proposed various packaged types in succession both at home and abroad.
The theory of traditional encapsulation all is to be encapsulated into led chip on the support of device; And the relevant research work of a large amount of encapsulation all center on the support expansion, comprises that hot property, the reflective function of support, the stability of material all become the emphasis of research and drops into huge manpower and materials.
At present, led chip is fixed on support heat sink, forms the LED device, and the LED device places on the Metal Substrate pcb board, and metal substrate places on the radiator.Heat through heat dissipation channels such as heat sink, aluminium bases after radiator spread out.
That is to say, adopt structure as shown in Figure 1 to carry out LED encapsulation and assembling.It is: led chip and heat sink etc. is packaged into LED device 103, and LED device 103 is welded to pcb board 102, and like aluminium base, pcb board 102 is fixed on radiator 101 through modes such as screw or silicone grease.Its passage of heat is: heat is from led chip, and, pcb board 102 inner heat sink through encapsulating and radiator 101 finally are transmitted to air.There is following defective in above-mentioned LED module: because the led chip heat radiation needs the middle interlayer of passage of heat of process many; And LED is heat sink and pcb board 102, pcb board 102 and radiator 101 between medium be air or silicone grease; Middle interlayer thermal conductivity is lower, so heat dispersion is not good.
For general LED application luminaire, light generally will pass through after sending from chip: fluorescent material, package lens, air, light-distribution lens are again to diffuser, and the medium of light process is many, and each interface all reflection loss can take place, and therefore total optical transmittance is low.Thereby, there are shortcomings such as heat dispersion is not good, optical transmittance is low, production process is complicated, cost height.
Summary of the invention
The objective of the invention is to solve problem set forth above, provide that a kind of heat dissipation is good, light extraction efficiency is high, production process is simple, the LED module and the manufacturing process thereof of nothing lead-in wire with low cost.
Technical scheme of the present invention is such:
A kind of LED module that does not have lead-in wire comprises radiator, pcb board, led chip, packing colloid, sealing silica gel and lens module, and described led chip is welded on the pcb board, and positive and negative electrode is welded in respectively on the corresponding electrode pad; Said pcb board and radiator are fitted; Said lens module is installed in the led chip top, the inner packing colloid of filling.
As preferably, the lens module is designed with back-off structure, radiator tip upside down on form on the lens module close fixing.
As preferably, two electrodes of said led chip are positioned at the same surface of chip, and the surface of distribution electrode is coated with solder coating, and there is fluorescent material on another surface.
As preferably, led chip is parallel with the LED open-circuit protector, and it act as open-circuit-protection and antistatic.
As preferably, described pcb board is the Metal Substrate pcb board, comprises metal level, insulating barrier and electrical layer; Electrical layer is provided with electrode pad, electroplate or gold or nickel.
As preferably, described pcb board is the high heat-conducting ceramic substrate, comprises ceramic layer and electrical layer, and electrical layer is provided with electrode pad, is coated with silver or nickel or gold.
As preferably, described sealing silica gel comprises the solid silicon cushion rubber that is installed on the lens module, and is coated in the gel silica gel circle that the liquid silica gel of solid silicon cushion rubber side forms.
As preferably, on the position on the lens module plane that described solid silicon cushion rubber side is corresponding, have groove, be used for coating liquid silica gel.
A kind of manufacturing process of not having the LED module of lead-in wire, step is following:
(1) on pcb board, etches positive and negative electrode and be electrically connected circuit;
(2) led chip is fixed on the pcb board.
(3) above-mentioned pcb board is installed on the radiator;
(4) the lens pit at the lens module injects packing colloid;
(5) sealing silica gel is installed on the lens module;
(6), be installed on the lens module (207) of step (5) with the radiator that pcb board is installed of step (3).
As preferably, the described sealing silica gel of step (5) comprises the solid silicon cushion rubber that is installed on the lens module, and is coated in the gel silica gel circle that the liquid silica gel of solid silicon cushion rubber side forms.
As preferably, on the position on the lens module plane that described solid silicon cushion rubber side is corresponding, have groove, be used for coating liquid silica gel.
As preferably, on the described lens module back-off structure is arranged, radiator tips upside down on the lens module, fixes through described back-off structure, forms the LED module of sealing.
As preferably, have fluorescent material on the described led chip.
As preferably, described led chip does not have fluorescent material, between described step (2) (3), can also may further comprise the steps: the colloid point that will be mixed with fluorescent material on chip, perhaps adopt the technology of dusting with fluorescent powder jet printing to chip surface; Perhaps paste phosphor sheet at chip surface.
As preferably, the described led chip of step (2) is fixed on the pcb board, and step is:
(2.1) the led chip bottom is coated with solder coating, then on the pcb board positive and negative electrode, coats scaling powder;
(2.2) led chip is placed the corresponding positive and negative electrode of pcb board place, and insert the eutectic stove and carry out solid crystalline substance; Perhaps heat pcb board and led chip, when solder coating melts led chip placed on the pcb board and fix.
As preferably, the described led chip of step (2) is fixed on the pcb board, and step is: led chip is placed the corresponding positive and negative electrode of pcb board place, through ultrasonic vibration, led chip is fixed on the pcb board.
As preferably, between described step (2) (3), can also may further comprise the steps: led chip parallel connection LED open-circuit protector, and be fixed on the pcb board.
Beneficial effect of the present invention is following:
At first; The theory of traditional encapsulation all is to be encapsulated into led chip on the support of LED device, and the relevant research work of a large amount of encapsulation all center on the support expansion, and the stability that comprises hot property, reflective function, the material of support all becomes the emphasis of research and drops into huge manpower and materials and the present invention has jumped out the set of this thoughtcast; Casted off the support of LED device once and for all; Led chip directly is encapsulated on the pcb board, has omitted to include heat sink support, and the heat that makes led chip is without heat sink this intermediate layer; Directly be diffused into the pcb board and the radiator of high thermal conductivity, good heat dissipation effect.
Secondly, between lens module and the led chip, the filling colloid is only arranged; And fill the colloid refractive index between 1.4 and 1.6, and light is few through medium, and transmitance is high; And fill the refractive index match of colloid and lens module, reflection loss is few, has improved the light extraction efficiency of LED module.
In addition, it is few that the LED module comprises parts, and production process is simple, and is with low cost.
Description of drawings
Fig. 1 is the encapsulation exemplary plot of existing LED device;
Fig. 2 is a LED module embodiment sketch map of the present invention;
Fig. 3 forms sketch map for pcb board of the present invention;
Fig. 4 is a lens module sketch map of the present invention;
Among the figure, the 101st, radiator, the 102nd, pcb board, the 103rd, LED device; The 201st, radiator, the 202nd, pcb board, the 203rd, led chip, the 204th, LED open-circuit protector; The 206th, sealing silica gel, the 207th, lens module, the 301st, metal level, the 302nd, insulating barrier; The 303rd, electrical layer, the 401st, lens pit, the 402nd, back-off structure.
Embodiment
Below in conjunction with accompanying drawing embodiments of the invention are further elaborated:
A kind of LED module that does not have lead-in wire; Comprise radiator 201, pcb board 202, led chip 203, packing colloid, sealing silica gel 206 and lens module 207; Said led chip 203 directly is welded on the pcb board 202 through covering brilliant technology, and positive and negative electrode is welded in respectively on the corresponding electrode pad; Said pcb board 202 is fitted with radiator 201; Said lens module 207 is installed in led chip 203 tops, the inner packing colloid of filling.
Said pcb board 202 is fitted with the form that face contacts with radiator 201.
Described lens module 207 bottom surfaces are designed with plural at least lens.
203 two electrodes of said led chip are positioned at the same surface of chip, and the surface of distribution electrode is coated with solder coating, and there is fluorescent material on another surface.
Led chip 203 is parallel with LED open-circuit protector 204, and it act as open-circuit-protection and antistatic.
Described pcb board 202 is a Metal Substrate pcb board 202, comprises metal level 301, insulating barrier 302 and electrical layer 303; Electrical layer 303 is provided with electrode pad, electroplate or gold or nickel.
Described pcb board 202 is the high heat-conducting ceramic substrate, comprises ceramic layer and electrical layer 303, and electrical layer 303 is provided with electrode pad, is coated with silver or nickel or gold.
Described packing colloid refractive index is between 1.4 to 1.6.
Described sealing silica gel 206 comprises the solid silicon cushion rubber that is installed on the lens module 207, and the gel silica gel circle that is coated in the liquid silica gel formation of solid silicon cushion rubber side.On the position on lens module 207 planes that described solid silicon cushion rubber side is corresponding, have groove, be used for coating liquid silica gel.Described lens module 207 has an integral planar; Obviously seeing one by one protruding on the plane is lens (seeing if falling, is exactly pit), and this position, edge, plane is enclosed a solid silicon cushion rubber earlier; Solid silicon cushion rubber lateral location; On corresponding lens module 207 planes, a circle groove is arranged, be used for coating liquid silica gel.Certainly, also groove can be set, directly coat liquid silica gel.
A kind of manufacturing process of not having the LED module of lead-in wire, step is following:
(1) on pcb board 202, etches positive and negative electrode and be electrically connected circuit;
(2) led chip 203 is fixed on the pcb board 202.
(3) above-mentioned pcb board 202 is installed on the radiator;
(4) inject packing colloid at lens pit 401 places of lens module 207;
(5) sealing silica gel 206 is installed on lens module 207;
(6), be installed on the lens module (207) of step (4) with the radiator that pcb board 202 is installed of step (3).
The described sealing silica gel 206 of step (5) comprises the solid silicon cushion rubber that is installed on the lens module 207, and the gel silica gel circle that is coated in the liquid silica gel formation of solid silicon cushion rubber side.
On the position on lens module 207 planes that described solid silicon cushion rubber side is corresponding, have groove, be used for coating liquid silica gel.
On the described lens module 207 back-off structure 402 is arranged, radiator tips upside down on the lens module 207, fixes through described back-off structure 402, forms the LED module of sealing.
Have fluorescent material on the described led chip 203.
Another kind of technical scheme, described led chip 203 does not have fluorescent material, between described step (2) (3), can also may further comprise the steps: the colloid point that will be mixed with fluorescent material perhaps adopts the technology of dusting that fluorescent powder jet printing is arrived chip surface on chip; Perhaps paste phosphor sheet at chip surface.
The described led chip 203 of step (2) is fixed on the pcb board 202, and step is:
(2.1) led chip 203 bottoms are coated with solder coating, then on pcb board 202 positive and negative electrodes, coat scaling powder;
(2.2) led chip 203 is placed pcb board 202 corresponding positive and negative electrode places, and insert the eutectic stove and carry out solid crystalline substance; Perhaps heat pcb board 202 and led chip 203, when solder coating melts led chip 203 placed on the pcb board 202 and fix.
Described solder coating can be the Au-Sn layer, and led chip 203 places pcb board 202 corresponding positive and negative electrode places, and after inserting the eutectic stove, specifically can carry out solid crystalline substance with the temperature more than 280 ℃.
Another kind of technical scheme, the described led chip 203 of step (2) is fixed on the pcb board 202, and step is: led chip 203 is placed pcb board 202 corresponding positive and negative electrode places, through ultrasonic vibration, led chip 203 is fixed on the pcb board 202.
Between described step (2) (3), can also may further comprise the steps: led chip 203 parallel connection LED open-circuit protectors 204, and be fixed on the pcb board 202.
The application's core is: existing LED module, often led chip is fixed on support heat sink, and be packaged into the LED device; The LED device is welded on different pcb boards; Be installed to again on the radiator, form Different products, to adapt to more wider application scenarios; And become industry technology prejudice, and the frame mode of this LED module exists shortcomings such as heat dispersion is not good enough, optical transmittance is low, parts complicacy.
The application is directly carried led chip 203 and is overlayed on the pcb board 202, and adopts lens module 207 once light-distributions, has reached the light extraction efficiency of better radiating effect and Geng Gao, and has solved led chip and overlayed on the encapsulation problem on the pcb board 202 in 203 years.
Embodiment
As shown in Figure 2, a kind of LED module comprises: radiator 201, pcb board 202, led chip 203, LED open-circuit protector 204, packing colloid, sealing silica gel 206, lens module 207.In the present embodiment, LED open-circuit protector 204 is selected Zener diode for use.Described sealing silica gel 206 comprises the solid silicon cushion rubber that is installed on the lens module 207, and the gel silica gel circle that is coated in the liquid silica gel formation of solid silicon cushion rubber side.On the position on lens module 207 planes that described solid silicon cushion rubber side is corresponding, have groove, be used for coating liquid silica gel.In the present embodiment, described lens module 207 has an integral planar, sees obviously on the plane that one by one protruding is that lens (are seen if falling; Be exactly the lens pits); This position, edge, plane is enclosed a solid silicon cushion rubber earlier, and the solid silicon cushion rubber outside or inner side are on corresponding lens module 207 planes; One circle groove is arranged, be used for coating liquid silica gel.Certainly, also groove can be set, directly coat liquid silica gel.
The positive and negative electrode of led chip 203 is positioned at the chip lower surface, and is coated with solder coating, and upper surface applies or be pasted with fluorescent material.LED open-circuit protector 204 is parallelly connected with led chip 203, and it act as open-circuit-protection and antistatic.In the present embodiment, described solder coating is an Au-Sn coating, according to the enforcement needs, also can select for use other to can be used as the alloy layer of scolder.
Pcb board 202 adopts metal substrate or other high thermal conductivity substrate.In the present embodiment, described pcb board 202 is metal substrate, and is as shown in Figure 3, comprises metal level 301, insulating barrier 302, electrical layer 303; Electrical layer 303, especially electrical layer 303 electrode pad places are coated with silver, nickel or gold, and it act as the raising reflectivity, strengthens light effect.According to the utilization needs, described pcb board 202 can be the high heat-conducting ceramic substrate also, comprises ceramic layer and electrical layer 303, and electrical layer 303, especially electrical layer 303 electrode pad places are coated with silver, nickel or gold.
As shown in Figure 4, lens module 207 bottom surfaces are designed with plural at least lens pit 401, the inner packing colloid of filling.Be designed with back-off structure 402 around the lens module 207, be buckled on the radiator 201, and form hermetically-sealed construction through sealing silica gel 206 and pcb board 202 and radiator 201.
Said lens module 207 its another act as the optics luminous intensity distribution, its be shaped as circle, square, oval, or with the different shape of optics light distribution requirements design.
From the above; Led chip 203 can directly be encapsulated on the pcb board 202, and the heat of led chip 203 is directly transferred to pcb board 202 and radiator 201, does not pass through the LED packaging heat sink; And LED is heat sink and the air dielectric of pcb board 202, has promoted radiating effect greatly.
In addition, the light that led chip 203 sends directly transmits through filling colloid and lens module 207, do not have secondary lens or diffuser, thereby light extraction efficiency is high.
A kind of manufacturing process of not having the LED module of lead-in wire, step is following:
(1) on pcb board 202, etches positive and negative electrode and be electrically connected circuit;
(2) led chip 203 bottoms are coated with the Au-Sn layer, on pcb board 202 positive and negative electrodes, coat scaling powder;
(3) Zener diode in led chip (203) parallel connection places pcb board 202 corresponding positive and negative electrode places with led chip 203, Zener diode, and inserts the eutectic stove, and is solid brilliant through the temperature more than 280 ℃; Perhaps heat pcb board 202 and led chip 203, Zener diode, during the Au-Sn melting layer, led chip 203, Zener diode are placed pcb board 202, led chip 203, Zener diode are fixed on the pcb board 202.
(4) above-mentioned pcb board 202 is installed on the radiator;
(5) inject packing colloid at lens pit 401 places of lens module 207;
(6) the solid silicon cushion rubber is installed on lens module 207, on the position on lens module 207 planes that described solid silicon cushion rubber side is corresponding, has groove, be used for coating liquid silica gel.On the position on lens module 207 planes that described solid silicon cushion rubber side is corresponding, have groove, be used for coating liquid silica gel.Described lens module 207 has an integral planar; Obviously seeing one by one protruding on the plane is lens (seeing if falling, is exactly pit), and this position, edge, plane is enclosed a solid silicon cushion rubber earlier; Solid silicon cushion rubber lateral location; On corresponding lens module 207 planes, a circle groove is arranged, be used for coating liquid silica gel.Certainly, also groove can be set, directly coat liquid silica gel.
(7) with the radiator that pcb board 202 is installed of step (4), tip upside down on the lens module 207 of step (6), the back-off structure 402 on the scioptics module 207 is fixing, forms the LED module of sealing.
Described led chip 203 does not have fluorescent material, between described step (2) (3), can also may further comprise the steps: the colloid point that will be mixed with fluorescent material perhaps adopts the technology of dusting that fluorescent powder jet printing is arrived chip surface on chip; Perhaps paste phosphor sheet at chip surface.
Another kind of technical scheme if having fluorescent material on the described led chip 203, then can be omitted in the step that installs fluorescent material on the led chip 203 additional.
The described led chip 203 of step (2) is fixed on the pcb board 202, and step is:
(2.1) led chip 203 bottoms are coated with solder coating, then on pcb board 202 positive and negative electrodes, coat scaling powder;
(2.2) led chip 203 is placed pcb board 202 corresponding positive and negative electrode places, and insert the eutectic stove and carry out solid crystalline substance; Perhaps heat pcb board 202 and led chip 203, when solder coating melts led chip 203 placed on the pcb board 202 and fix.
Described solder coating can be the Au-Sn layer, and led chip 203 places pcb board 202 corresponding positive and negative electrode places, and after inserting the eutectic stove, specifically can carry out solid crystalline substance with the temperature more than 280 ℃.
Another kind of technical scheme; The described led chip of step (2) 203, Zener diode are fixed on the pcb board 202; Step is: led chip 203, Zener diode are placed pcb board 202 corresponding positive and negative electrode places; Through ultrasonic vibration, led chip 203, Zener diode are fixed on the pcb board 202.
Above-described only is preferred implementation of the present invention; Should be pointed out that the those of ordinary skill in the art, under the prerequisite that does not break away from core technology characteristic of the present invention; Can also make some improvement and retouching, these improvement and retouching also should be regarded as protection scope of the present invention.
Claims (17)
1. LED module that does not have lead-in wire; Comprise radiator (201), pcb board (202), led chip (203), packing colloid, sealing silica gel (206) and lens module (207); It is characterized in that; Described led chip (203) is welded on the pcb board (202), and positive and negative electrode is welded in respectively on the corresponding electrode pad; Said pcb board (202) is fitted with radiator (201); Said lens module (207) is installed in led chip (203) top, the inner packing colloid of filling.
2. the LED module of nothing lead-in wire according to claim 1 is characterized in that lens module (207) is designed with back-off structure (402), and radiator (201) tips upside down on the last formation of lens module (207) and closes fixing.
3. the LED module of nothing lead-in wire according to claim 1 is characterized in that (203) two electrodes of said led chip are positioned at the same surface of chip, and the surface of distribution electrode is coated with solder coating, and there is fluorescent material on another surface.
4. the LED module of nothing lead-in wire according to claim 1 is characterized in that led chip (203) is parallel with LED open-circuit protector (204).
5. the LED module of nothing lead-in wire according to claim 1 is characterized in that described pcb board (202) is Metal Substrate pcb board (202), comprises metal level (301), insulating barrier (302) and electrical layer (303); Electrical layer (303) is provided with electrode pad, electroplate or gold or nickel.
6. the LED module of nothing lead-in wire according to claim 1 is characterized in that described pcb board (202) is the high heat-conducting ceramic substrate, comprises ceramic layer and electrical layer (303), and electrical layer (303) is provided with electrode pad, is coated with silver or nickel or gold.
7. the LED module of nothing lead-in wire according to claim 1 is characterized in that described sealing silica gel (206) comprises the solid silicon cushion rubber that is installed on the lens module (207), and the gel silica gel circle that is coated in the liquid silica gel formation of solid silicon cushion rubber side.
8. the LED module of nothing lead-in wire according to claim 7 is characterized in that, on the position on lens module (207) plane that described solid silicon cushion rubber side is corresponding, has groove, is used for coating liquid silica gel.
9. manufacturing process of not having the LED module of lead-in wire is characterized in that step is following:
(1) on pcb board (202), etches positive and negative electrode and be electrically connected circuit;
(2) led chip (203) is fixed on the pcb board (202).
(3) above-mentioned pcb board (202) is installed on the radiator;
(4) locate to inject packing colloid at the lens pit (401) of lens module (207);
(5) sealing silica gel (206) is installed on lens module (207);
(6), be installed on the lens module (207) of step (5) with the radiator that pcb board (202) are installed of step (3).
10. the manufacturing process of the LED module of nothing lead-in wire according to claim 9; It is characterized in that; The described sealing silica gel of step (5) (206) comprises the solid silicon cushion rubber that is installed on the lens module (207), and the gel silica gel circle that is coated in the liquid silica gel formation of solid silicon cushion rubber side.
11. the manufacturing process of the LED module of nothing lead-in wire according to claim 10 is characterized in that, on the position on lens module (207) plane that described solid silicon cushion rubber side is corresponding, has groove, is used for coating liquid silica gel.
12. the manufacturing process of the LED module of nothing lead-in wire according to claim 10; It is characterized in that back-off structure (402) is arranged on the described lens module (207), radiator tips upside down on the lens module (207); Fixing through described back-off structure (402), form the LED module that seals.
13. the manufacturing process of the LED module of nothing lead-in wire according to claim 10 is characterized in that described led chip has fluorescent material on (203).
14. the manufacturing process of the LED module of nothing lead-in wire according to claim 10; It is characterized in that; Described led chip (203) does not have fluorescent material; Between described step (2) (3), can also may further comprise the steps: the colloid point that will be mixed with fluorescent material perhaps adopts the technology of dusting that fluorescent powder jet printing is arrived chip surface on chip; Perhaps paste phosphor sheet at chip surface.
15. the manufacturing process according to the LED module of claim 13 or 14 described nothings lead-in wire is characterized in that the described led chip of step (2) (203) is fixed on the pcb board (202), step is:
(2.1) led chip (203) bottom is coated with solder coating, then on pcb board (202) positive and negative electrode, coats scaling powder;
(2.2) led chip (203) is placed the corresponding positive and negative electrode place of pcb board (202), and insert the eutectic stove and carry out solid crystalline substance; Perhaps heat pcb board (202) and led chip (203), when solder coating melts led chip (203) placed on the pcb board (202) and fix.
16. manufacturing process according to the LED module of claim 13 or 14 described nothings lead-in wire; It is characterized in that; The described led chip of step (2) (203) is fixed on the pcb board (202); Step is: led chip (203) is placed the corresponding positive and negative electrode place of pcb board (202), through ultrasonic vibration, led chip (203) is fixed on the pcb board (202).
17. the manufacturing process of the LED module of nothing lead-in wire according to claim 9; It is characterized in that; Between described step (2) (3), can also may further comprise the steps: led chip (203) parallel connection LED open-circuit protector (204), and be fixed on the pcb board (202).
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| CN103307483A (en) * | 2013-06-03 | 2013-09-18 | 杭州杭科光电股份有限公司 | LED light source module based on printed circuit board |
| CN105226172A (en) * | 2015-09-08 | 2016-01-06 | 李峰 | Waterproof encapsulation structure and one-body molded treatment process thereof |
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| WO2016146025A1 (en) * | 2015-03-13 | 2016-09-22 | 杭州华普永明光电股份有限公司 | Light emitting diode lighting device and assembly method thereof |
| WO2017152879A1 (en) * | 2016-03-11 | 2017-09-14 | 杭州华普永明光电股份有限公司 | Light emitting diode module and manufacturing method therefor, and lamp |
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