CN107331756A - A kind of radiator and chip integrative packaging light-source structure - Google Patents

Abstract

The invention discloses a heat sink and chip integrated packaging light source structure, which comprises a heat dissipation plate, an insulating fixing part, an LED chip, a PCB board, a lens, a positive conductive circuit and a negative conductive circuit. The LED chip of the present invention is directly solidified on the surface of the heat dissipation plate, and is electrically connected to an external circuit through the positive conductive circuit and the negative conductive circuit arranged on the PCB. Remove the bracket, reduce the number of thermal resistance layers, and greatly improve the heat conduction efficiency; the light source packaged by the present invention is directly equipped with a lens, which greatly improves the light output efficiency, simplifies the relevant light distribution requirements, and eliminates the need to add The process of installing the lens is conducive to greatly reducing related costs and improving production efficiency. The lens and LED chip are integrated, and the light distribution technology and light source packaging technology are perfectly combined; the light source achieves waterproof requirements above IP65 through insulating fixtures, suitable for different lamps Requirements of the place of use; due to the removal of the bracket, the present invention can be relatively thin, very practical and beautiful.

Description

A heat sink and chip integrated packaging light source structure

technical field

The invention relates to a radiator and a chip integrated packaging light source structure. It belongs to the field of LED light source packaging.

Background technique

The existing light source packaging process generally includes die bonding, wire bonding, phosphor spotting, resin sealing, long baking, punching, aging and life testing, and packaging. On the PCB board, this light source packaging process has the following defects:

1. Due to the installation steps of the bracket, the process is complicated;

2. Due to the existence of the bracket, the structure cannot be relatively thin;

3. Due to the existence of the bracket, the number of thermal resistance layers increases, and the heat conduction efficiency is low.

Contents of the invention

The object of the present invention is to overcome the above-mentioned defects, and provide a heat sink and chip integrated packaging light source structure.

In order to achieve the above object, the technical scheme adopted in the present invention is as follows:

A heat sink and chip integrated packaging light source structure, including a heat dissipation plate, an insulating fixture, an LED chip, a PCB board, a lens, a positive conductive line and a negative conductive line; the insulating fixture includes an insulating fixing plate, and the insulating fixing The bottom of the plate is fixed and sealed on the heat dissipation plate, the middle part of the insulating fixed plate is hollowed out to the heat sink plate and forms a cup cavity with the heat sink plate, and the cup cavity is directly connected to the bottom of the lens; the PCB board is fixed on the top of the insulating fixed plate and The positive conductive circuit and the negative conductive circuit are arranged on the PCB board, the LED chip is solidified in the cup cavity and the positive and negative electrodes of the LED chip are electrically connected to one end of the positive conductive circuit and the negative conductive circuit respectively, and the positive conductive circuit and the negative electrode are electrically connected to each other. The other end of the conductive line is used for electrical conduction with the external circuit; the lens is sealed and connected to the heat sink through the PCB board and the insulating fixture.

The LED chip of the present invention is directly solidified on the surface of the heat dissipation plate, and is electrically connected to the external circuit through the positive conductive circuit and the negative conductive circuit arranged on the PCB. Remove the bracket, reduce the number of thermal resistance layers, and greatly improve the heat conduction efficiency; the light source packaged by the present invention is directly equipped with a lens, which greatly improves the light output efficiency, simplifies the relevant light distribution requirements, and eliminates the need to add The process of installing the lens is beneficial to greatly reduce related costs and improve production efficiency. The lens and LED chip are integrated, and the light distribution technology and light source packaging technology are perfectly combined; since the bracket is removed, the invention can be relatively thin and very Practical and beautiful, especially suitable for large-scale promotion and use.

Specifically, the positive electrode conductive circuit includes a first electrical conductor and positive electrode pads respectively arranged at both ends of the first electrical conductor; the negative electrode conductive circuit includes a second electrical conductor and negative electrode pads respectively arranged at both ends of the second electrical conductor ; The positive electrode pad and the negative electrode pad arranged on the relatively inner side are used for electrical conduction with the LED chip, and the positive electrode pad and the negative electrode pad arranged on the relatively outer side are used for electrical conduction with the external circuit.

Further, in order to realize the electrical conduction between the positive electrode wire circuit and the negative electrode conductive circuit and the external circuit, both the positive electrode conductive circuit and the negative electrode conductive circuit also include conductive needles/conductive sheets for communicating with the external circuit, and the conductive needles/conductive sheets are connected to the external circuit respectively. The positive electrode pad and the negative electrode pad arranged on the opposite outer side are electrically connected.

As a preference, the positive electrode and the negative electrode of the LED chip are respectively welded to the opposite inner positive electrode pad and negative electrode pad by gold wires.

In order to achieve a better waterproof and installation effect, the conductive pins/conductive sheets pass from the bottom to the top of the heat sink, and then pass through the insulating fixture to be welded to the positive pad and the negative pad on the opposite outer side respectively. The cup cavity, the positive conductive circuit, the negative conductive circuit and the PCB board are all arranged on the top of the cooling plate.

Further, in order to better realize the fixing effect of the insulating fixing member, the insulating fixing member also includes pins, and the pins are multiple and arranged on the bottom of the insulating fixing plate, and correspondingly, there are provided on the cooling plate corresponding to the position of the pins and A consistent number of jacks.

At least two of the pins are provided with through holes for passing through conductive pins/conductive sheets. The corresponding socket is a through hole, which is used to pass through the conductive pin/conductive sheet.

In order to facilitate the packaging of the insulating fixture and the PCB board and make the thickness of the present invention thinner, the top of the insulating fixing disc is also provided with a groove for placing the PCB board; the PCB board is an integrated structure, in the middle of the PCB board There is a through hole corresponding to the position of the cup cavity, and the positive conductive circuit and the negative conductive circuit are respectively arranged on the PCB board on both sides of the through hole; The first PCB board and the second PCB board in the groove, the positive electrode conductive circuit and the negative electrode conductive circuit are respectively arranged on the first PCB board and the second PCB board.

Furthermore, the cup cavity is filled with sealant to form a light-emitting cavity.

Furthermore, the insulating fixing member is made of rubber, the first conductor and the second conductor are both made of copper sheets, and the heat dissipation plate is made of high thermal conductivity material.

In addition, the lens is detachably connected to the heat dissipation plate, more than one clamping groove is provided on the edge of the heat dissipation plate, and a matching clamping block is provided at a corresponding position of the lens.

Compared with the prior art, the present invention has the following beneficial effects:

(1) The present invention designs a heat sink and chip integrated packaging light source structure, the LED chip is directly solidified on the surface of the heat sink, and is electrically connected to the external circuit through the positive conductive circuit and the negative conductive circuit on the PCB. Remove the bracket, reduce the number of thermal resistance layers, and greatly improve the heat conduction efficiency.

(2) The light source packaged by the present invention is directly equipped with a lens, which greatly improves the light output efficiency, simplifies the relevant light distribution requirements, and saves the process of installing a lens above the traditional light source, which is conducive to greatly reducing related costs and improving Production efficiency, integration of lens and LED chip, perfect combination of light distribution technology and light source packaging technology.

(3) The light source of the present invention realizes the waterproof requirement above IP65 level through the insulating fixing parts, and is suitable for the requirements of different places where lamps are used.

(4) Since the bracket is removed in the present invention, the present invention can be made relatively thin, very practical and beautiful, and especially suitable for large-scale popularization and use.

Description of drawings

Fig. 1 is a schematic structural diagram of the present invention-Example 1.

Fig. 2 is a schematic structural diagram of the present invention-embodiment 2.

Among them, the names corresponding to the reference signs:

1-radiating plate, 101-card slot, 2-insulating fixing piece, 201-insulating fixing plate, 202-pin, 203-cup cavity, 3-LED chip, 4-PCB board, 5-conductive needle, 6-lens, 601-clamping block, 602-lens frame, 603-lens.

detailed description

The present invention will be further described below with reference to the accompanying drawings and examples, and the embodiments of the present invention include but not limited to the following examples.

Glossary Explanation: Solid crystal is also called DieBond or chip loading. Die bonding is to bond the chip to the designated area of the bracket through colloid (for LEDs, it is generally conductive glue or insulating glue), forming a thermal path or an electrical path, and providing conditions for subsequent wiring connections.

Example 1

As shown in Figure 1, a heat sink and chip integrated package light source structure, including a heat sink 1, an insulating fixture 2, an LED chip 3, a PCB board 4, a conductive pin 5/conductive sheet, a lens 6, a positive conductive circuit and Negative conductive line.

The interconnection relationship of the above components is as follows: the insulating fixing part includes an insulating fixing plate, the bottom of the insulating fixing plate is fixed and hermetically connected to the heat dissipation plate, the middle part of the insulating fixing plate is hollowed out to the heat dissipation plate and forms a cup cavity with the heat dissipation plate, The cup cavity is directly connected to the bottom of the lens.

The PCB board is fixed on the top of the insulating fixed plate and the positive conductive circuit and the negative conductive circuit are arranged on the PCB board, the LED chip is solidified on the surface of the cooling plate in the cup cavity and the positive and negative electrodes of the LED chip are respectively connected to the positive conductive circuit and the negative electrode. One end of the conductive circuit is electrically connected, and the other end of the positive conductive circuit and the negative conductive circuit are used to electrically conduct with the external circuit; the positive conductive circuit includes a first conductor and positive pads respectively arranged at both ends of the first conductor; the negative conductive circuit Including the second electrical conductor and the negative electrode pads respectively arranged at both ends of the second electrical conductor; the positive electrode pad and the negative electrode pad arranged on the opposite inner side are used for electrical conduction with the LED chip, and the positive electrode pad and the negative electrode pad arranged on the relatively outer side The disk is used for electrical conduction with the external circuit, and then makes the LED chip and the external circuit electrically conduct. The lens is sealed and connected with the heat dissipation plate through the PCB board and the insulating fixture.

In this embodiment, the positive electrode and the negative electrode of the LED chip are respectively welded to the positive electrode pad and the negative electrode pad on the opposite inner sides through gold wires. Specifically, the anode and cathode of the LED chip are respectively welded to one end of the gold wire, and the other end of the gold wire is respectively welded to the opposite inner positive electrode pad and negative electrode pad to achieve electrical conduction.

Further, in order to realize the electrical conduction between the positive conductive line and the negative conductive line and the external circuit, this embodiment provides a way to realize that: both the positive conductive line and the negative conductive line also include a conductive needle/conductive sheet for communicating with the external circuit, The conductive needle/conductive sheet is electrically connected to the positive electrode pad and the negative electrode pad arranged on the opposite outer sides respectively.

The relevant waterproof and installation requirements of the light source are met through insulating fixtures. In order to achieve better waterproof and installation effects, the cup cavity, positive conductive line, negative conductive line, and PCB board are all set on the top of the heat sink. The sheet passes from the bottom to the top of the heat sink, and then passes through the insulating fixture and is respectively welded to the positive electrode pad and the negative electrode pad arranged on the opposite outer side.

Further, in order to better realize the fixing effect of the insulating fixing member, the insulating fixing member also includes pins, which are multiple and arranged on the bottom of the insulating fixing plate. The pins are inserted into the jacks, and the insulating fixture is more firmly fixed on the heat sink.

Due to the presence of conductive needles/conductive sheets, in order to make the structure simpler, the position of the conductive needles/conductive sheets is integrated with the pins and sockets. In this embodiment, there are two pins for passing through the conductive needles/conductive The through hole of the sheet, the through hole corresponds to the position of the positive electrode pad and the negative electrode pad located on the opposite side, and there are two jacks corresponding to the position of the pin as a through hole, which is used to pass through the conductive pin/conductive sheet .

In order to facilitate the packaging of the insulating fixture and the PCB board and make the thickness of the present invention thinner, and in order to achieve a better waterproof effect, the top of the insulating fixing plate is also provided with a groove for placing the PCB board, and the height of the groove is higher than that of the PCB. In this embodiment, the PCB board is an integrated structure, and a through hole corresponding to the position of the cup cavity is provided in the middle of the PCB board, and the positive conductive line and the negative conductive line are respectively arranged on the PCB board on both sides of the through hole. ,As shown in Figure 1.

In this embodiment, the cup cavity is filled with sealant to form a light-emitting cavity.

In this embodiment, rubber is used for the insulating fixing member, and copper sheets are used for both the first conductor and the second conductor.

The lens is detachably connected to the cooling plate. In this embodiment, the detachable connection is preferably made by buckle, which is simple and convenient. More than one clamping slot 101 is provided on the edge of the heat sink, and a matching clamping block 601 is provided at a corresponding position of the lens. The lens includes a lens frame 602 and a lens 603. The lens is arranged in the middle of the lens frame and is a convex lens. The lower surface of the lens frame is sealed and connected to the front of the heat sink through the PCB board, and forms a cavity. The clamping block is arranged on The edge of the lens frame. The lens is made of PC, PMMA and other related high temperature resistant engineering plastic materials.

In this embodiment, the heat dissipation plate is a square plate, and more than one card slot is provided on each of the four edges. The cooling plate is made of special high thermal conductivity material. High thermal conductivity material is aluminum substrate, glass fiber board or ceramics.

Example 2

As shown in Figure 2, a heat sink and chip integrated packaging light source structure is different from Embodiment 1 in that the PCB board of this embodiment is a segmented structure, including the grooves on both sides of the cup cavity. The first PCB board and the second PCB board, the positive electrode conductive circuit and the negative electrode conductive circuit are respectively arranged on the first PCB board and the second PCB board.

According to the above-mentioned embodiments, the present invention can be well realized. It is worth noting that, based on the premise of the above-mentioned design principles, in order to solve the same technical problem, even if some insubstantial changes or modifications are made on the basis of the structure disclosed in the present invention, the essence of the adopted technical solution is still Like the present invention, it should also be within the protection scope of the present invention.

Claims (10)

1. A heat sink and chip integrated packaging light source structure, characterized in that it includes a heat sink (1), an insulating fixture (2), an LED chip (3), a PCB board (4), a lens (6), and a positive electrode Conductive lines and negative conductive lines; The insulating fixing member includes an insulating fixing plate (201), the bottom of the insulating fixing plate is fixed and sealed on the heat dissipation plate, the middle part of the insulating fixing plate is hollowed out to the heat dissipation plate and forms a cup cavity (203) with the heat dissipation plate, The cup cavity is directly connected to the bottom of the lens; The PCB board is fixed on the top of the insulating fixed disk and the positive conductive circuit and the negative conductive circuit are arranged on the PCB board, the LED chip is solidified in the cup cavity and the positive pole and the negative pole of the LED chip are respectively connected to the positive conductive circuit and the negative pole. One end of the conductive line is electrically connected, and the other end of the positive conductive line and the negative conductive line are used for electrical conduction with an external circuit; The lens is sealed and connected with the heat dissipation plate through the PCB board and the insulating fixing piece. 2. The heat sink and chip integrated packaging light source structure according to claim 1, characterized in that, the positive electrode conductive circuit comprises a first electrical conductor and positive electrode pads respectively arranged at both ends of the first electrical conductor; The negative electrode conductive circuit includes a second electrical conductor and negative electrode pads respectively arranged at both ends of the second electrical conductor; The anode pad and the cathode pad arranged on the inner side are used for electrical conduction with the LED chip, and the anode pad and the cathode pad arranged on the outer side are used for electrical connection with the external circuit. 3. A heat sink and chip integrated packaging light source structure according to claim 2, characterized in that, both the positive conductive circuit and the negative conductive circuit also include conductive pins (5)/ The conductive sheet, the conductive needle/conductive sheet is respectively electrically connected to the positive electrode pad and the negative electrode pad arranged on the opposite outer side. 4. The heat sink and chip integrated packaging light source structure according to claim 3, characterized in that, the conductive pins/conductive sheets pass from the bottom to the top of the heat sink, and then pass through the insulating fixtures to connect with the heat sink respectively. The positive electrode pad and the negative electrode pad arranged on the relative outer side are welded, and the cup chamber, the positive electrode conductive circuit, the negative electrode conductive circuit and the PCB board are all arranged on the top of the heat dissipation plate. 5. A heat sink and chip integrated packaging light source structure according to claim 4, characterized in that, the insulating fixture further includes pins (202), the pins are multiple and arranged on the bottom of the insulating fixing plate , Correspondingly, there are sockets corresponding to the positions of the pins and the same number on the heat sink. 6. A heat sink and chip integrated packaging light source structure according to claim 5, characterized in that at least two of the pins are provided with through holes for passing through conductive pins/conductive sheets, and the through holes are connected with The positions of the positive electrode pad and the negative electrode pad on the opposite outer side correspond, and at least two jacks corresponding to the positions of the pins are through holes for passing through the conductive pins/conductive sheets. 7. The heat sink and chip integrated packaging light source structure according to claim 6, characterized in that, the top of the insulating fixed plate is also provided with a groove for placing a PCB board; The PCB board is an integrated structure, and a through hole corresponding to the position of the cup cavity is provided in the middle of the PCB board, and the positive conductive circuit and the negative conductive circuit are respectively arranged on the PCB board on both sides of the through hole; The PCB board is a segmented structure, including a first PCB board and a second PCB board respectively arranged in the grooves on both sides of the cup cavity, and the positive conductive circuit and the negative conductive circuit are respectively arranged on the first PCB board and the second PCB board. board. 8 . The heat sink and chip integrated packaging light source structure according to claim 1 , wherein the cup cavity is filled with a sealant to form a light emitting cavity. 9 . 9. A heat sink and chip integrated packaging light source structure according to any one of claims 2-7, characterized in that the insulating fixing member is made of rubber, and the first conductor and the second conductor are both Copper sheet is adopted, and the heat dissipation plate is made of high thermal conductivity material. 10. A heat sink and chip integrated packaging light source structure according to any one of claims 1-7, characterized in that the lens is detachably connected to the heat dissipation plate, and more than one clip is arranged on the edge of the heat dissipation plate The groove (101) is provided with a matching clamping block (601) at the corresponding position of the lens.