CN102376699A - LED (Light Emitting Diode) module based on ceramic-based PCB (Printed Circuit Board) and manufacturing process thereof - Google Patents
LED (Light Emitting Diode) module based on ceramic-based PCB (Printed Circuit Board) and manufacturing process thereof Download PDFInfo
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- CN102376699A CN102376699A CN2011101648963A CN201110164896A CN102376699A CN 102376699 A CN102376699 A CN 102376699A CN 2011101648963 A CN2011101648963 A CN 2011101648963A CN 201110164896 A CN201110164896 A CN 201110164896A CN 102376699 A CN102376699 A CN 102376699A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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Abstract
The invention relates to an LED (Light Emitting Diode) module based on a ceramic-based PCB (Printed Circuit Board) and a manufacturing process thereof. The LED module comprises a heat radiator, the ceramic-based PCB, an LED chip, a package colloid, a sealing silicon rubber and a lens module, wherein the LED chip is coated by fluorescent powder, is loaded on the ceramic-based PCB and is welded to an electrode bonding pad of an electrical layer of the ceramic-based PCB through a lead; the ceramic-based PCB is attached to the heat radiator; the lens module is arranged above the LED chip; and a lens concave pit on the lens module is filled with the package colloid. The LED chip is directly welded on a circuit board, so that the heat of the LED chip is directly diffused to the circuit board with high conductivity and the heat radiator and the heat radiating effect is improved. The package colloid is only arranged between the lens module and the LED chip; media through which the light passes are fewer; in addition, the refractive index of the filled colloid is matched with that of the lens module, so that the light emitting rate of the LED module is improved.
Description
Technical field
The present invention relates to semiconductor application and encapsulation field, more particularly, relate to a kind of LED module and manufacturing process thereof based on the ceramic base pcb board.
Background technology
Along with led chip technology and Development of Packaging Technology, increasing LED product is applied to lighting field, especially large power white light LED.Because LED has high light efficiency, long-life, energy-conserving and environment-protective, suitable brightness adjustment control, polluter such as not mercurous, becomes the lighting source of new generation after conventional light source such as incandescent lamp, fluorescent lamp.
LED is a kind of electroluminescence semiconductor device, wherein has 30 percent electric energy to convert light into approximately, and dump energy then converts heat into, and the LED temperature that thermal accumlation causes rises, and is the main cause that causes the LED light decay.Thereby the led chip heat radiation is the key issue that the LED encapsulation is devoted to solve, and manufacturer has proposed various packaged types in succession both at home and abroad.
The theory of traditional encapsulation all is to be encapsulated into led chip on the support of device; And the relevant research work of a large amount of encapsulation all center on the support expansion, comprises that hot property, the reflective function of support, the stability of material all become the emphasis of research and drops into huge manpower and materials.
At present, led chip is fixed on support heat sink, forms the LED device, and the LED device places on the Metal Substrate pcb board, and metal substrate places on the radiator.Heat through heat dissipation channels such as heat sink, aluminium bases after radiator spread out.
That is to say, adopt structure as shown in Figure 1 to carry out LED encapsulation and assembling.It is: led chip and heat sink etc. is packaged into LED device 103, and LED device 103 is welded to pcb board 102, and like aluminium base, pcb board 102 is fixed on radiator 101 through modes such as screw or silicone grease.Its passage of heat is: heat is from led chip, and, pcb board 102 inner heat sink through encapsulating and radiator 101 finally are transmitted to air.There is following defective in above-mentioned LED module: because the led chip heat radiation needs the middle interlayer of passage of heat of process many; And LED is heat sink and pcb board 102, pcb board 102 and radiator 101 between medium be air or silicone grease; Middle interlayer thermal conductivity is lower, so heat dispersion is not good.
For general LED application luminaire, light generally will pass through after sending from chip: fluorescent material, package lens, air, light-distribution lens are again to diffuser, and the medium of light process is many, and each interface all reflection loss can take place, and therefore total optical transmittance is low.Thereby, there are shortcomings such as heat dispersion is not good, optical transmittance is low, production process is complicated, cost height.
Summary of the invention
The objective of the invention is to solve problem set forth above, a kind of heat dispersion height, optical transmittance LED module and manufacturing process thereof based on the ceramic base pcb board high, with low cost are provided.
Technical scheme of the present invention is such:
A kind of LED module based on the ceramic base pcb board; Comprise radiator, ceramic base pcb board, led chip, packing colloid, sealing silica gel and lens module; Be covered with fluorescent material on the led chip; Led chip covers and is loaded on the ceramic base pcb board, and through the electrode pad of wire bonds to ceramic base pcb board electrical layer; Described ceramic base pcb board and radiator are fitted; Described lens module is installed in the led chip top, the inner packing colloid of filling of the lens pit on the lens module.
As preferably, described ceramic base pcb board inwardly is manufactured with the pit that does not penetrate covering the position of carrying led chip from the one side that has electrical layer; Led chip covers and is loaded in described pit bottom.
As preferably, covering the ceramic base plate surface that carries the led chip position is the shiny surface of brightening.
As preferably, the shiny surface of described brightening has the coating minute surface.
As preferably, described sealing silica gel comprises the solid silicon cushion rubber that is installed on the lens module, and is coated in the gel silica gel circle that the liquid silica gel of solid silicon cushion rubber side forms.
As preferably, on the position on the lens module plane that described solid silicon cushion rubber side is corresponding, have groove, be used for coating liquid silica gel.
As preferably, the lens module is designed with back-off structure, radiator tip upside down on form on the lens module close fixing.
As preferably, led chip is parallel with the LED open-circuit protector.
As preferably, the electrical layer of ceramic base pcb board is provided with electrode pad, electroplate or gold or nickel.
A kind of manufacturing process of the LED module based on the ceramic base pcb board, step is following:
(1) coat primer at the ceramic base pcb board, led chip is fixed on the ceramic base pcb board, fixing through baking;
(2) will the go between both positive and negative polarity that is welded to led chip respectively and the both positive and negative polarity pad of ceramic base pcb board;
(3) the ceramic base pcb board is installed on the radiator;
(4) the lens pit at the lens module injects packing colloid;
(5) sealing silica gel is installed on the lens module;
(6), be installed on the lens module (207) of step (5) with the radiator that pcb board is installed of step (3).
As preferably, described ceramic base pcb board inwardly is manufactured with the pit that does not penetrate covering the position of carrying led chip from the one side that has electrical layer; Led chip covers and is loaded in described pit bottom.
As preferably, have fluorescent material on the described led chip.
As preferably, described led chip does not have fluorescent material, between described step (2) (3), can also may further comprise the steps: the colloid point that will be mixed with fluorescent material on chip, perhaps adopt the technology of dusting with fluorescent powder jet printing to chip surface; Perhaps paste phosphor sheet at chip surface.
As preferably, between described step (1) (2), can also may further comprise the steps: led chip parallel connection LED open-circuit protector, and be fixed on the ceramic base pcb board.
As preferably, covering the ceramic base plate surface that carries the led chip position is the shiny surface of brightening.
As preferably, the shiny surface of described brightening is coated with minute surface coating.
As preferably, the described sealing silica gel of step (5) comprises the solid silicon cushion rubber that is installed on the lens module, and is coated in the gel silica gel circle that the liquid silica gel of solid silicon cushion rubber side forms.
As preferably, on the position on the lens module plane that described solid silicon cushion rubber side is corresponding, have groove, be used for coating liquid silica gel.
As preferably, on the described lens module back-off structure is arranged, radiator tips upside down on the lens module, fixes through described back-off structure, forms the LED module of sealing.
Beneficial effect of the present invention is following:
At first; The theory of traditional encapsulation all is to be encapsulated into led chip on the support of device, and the relevant research work of a large amount of encapsulation all center on the support expansion, and the stability that comprises hot property, reflective function, the material of support all becomes the emphasis of research and drops into huge manpower and materials and the present invention has jumped out the set of this thoughtcast; Casted off the support of LED device once and for all; Led chip directly is encapsulated on the pcb board, has omitted to include heat sink support, and the heat that makes led chip is without heat sink this intermediate layer; Directly be diffused into the pcb board and the radiator of high thermal conductivity, good heat dissipation effect.
Secondly, between lens module and the led chip, the filling colloid is only arranged; And fill the colloid refractive index between 1.4 and 1.6, and light is few through medium, and transmitance is high; And fill the refractive index match of colloid and lens module, reflection loss is few, has improved the light extraction efficiency of LED module.
Moreover the lens module pours into the filling colloid, and fills with whole lens module inner chamber, curing molding, or directly be to pour into the filling colloid earlier, back-off is fastening again, does not all have knockout course, does not damage lead.
In addition, it is few that the LED module comprises parts, and production process is simple, and is with low cost.
Description of drawings
Fig. 1 is the encapsulation exemplary plot of existing LED device;
Fig. 2 is the embodiment sketch map of LED module of the present invention;
Fig. 3 forms and the bowl configurations sketch map for pcb board of the present invention;
Fig. 4 forms and the bowl configurations profile for pcb board of the present invention;
Fig. 5 is the section of structure of lens module of the present invention;
Among the figure, the 101st, radiator, the 102nd, pcb board, the 103rd, LED device; The 201st, radiator, the 202nd, ceramic base pcb board, the 203rd, led chip, the 204th, LED open-circuit protector; The 206th, sealing silica gel, the 207th, lens module, the 301st, ceramic substrate; The 303rd, electrical layer, the 401st, lens pit, the 402nd, back-off structure.
Embodiment
Below in conjunction with accompanying drawing embodiments of the invention are further elaborated:
A kind of LED module based on the ceramic base pcb board; Comprise radiator 201, ceramic base pcb board 202, led chip 203, packing colloid, sealing silica gel 206 and lens module 207, described ceramic base pcb board 202 inwardly is manufactured with the pit that does not penetrate from the one side that has electrical layer 303; Be covered with fluorescent material on the led chip 203, led chip 203 covers and is loaded in described pit bottom, and through the electrode pad of wire bonds to ceramic base PCB plate 202 electrical layer 303; Described ceramic base pcb board 202 is fitted with radiator 201; Described lens module 207 is installed in led chip 203 tops, the lens pit 401 inner packing colloids of filling on the lens module 207.
Described ceramic base pcb board 202 comprises electrical layer 303, ceramic substrate 301, and described electrical layer 303 is positive and negative electrodes that sintering goes out on ceramic substrate 301 and is electrically connected circuit.
The angle on the wall of described pit and pit bottom plane be 90 spend to 120 the degree between.
Described pit surface is the shiny surface of brightening.
The shiny surface of described brightening has the coating minute surface.
On the ceramic substrate that contains pit 301, be furnished with electrical layer 303; Described pit is can be fired into taper seat; The hole body sidewall of this taper seat and the horizontal plane of pit bottom form the angle between 90 degree～120 degree; And the hole body sidewall of this taper seat through minute surface brightening technology be polished into can be reflective shiny surface, perhaps plate silver and carry out reflective.Pit also can be fired into other shapes except taper seat, and like platform shape, multiaspect column, cylindric, the face that is become is decided by the requirement of the angle of processing technology and hole body sidewall and bottom surface.
Described ceramic base pcb board 202 is fitted with the form that face contacts with radiator 201.
Described sealing silica gel 206 comprises the solid silicon cushion rubber that is installed on the lens module 207, and the gel silica gel circle that is coated in the liquid silica gel formation of solid silicon cushion rubber side.On the position on lens module 207 planes that described solid silicon cushion rubber side is corresponding, have groove, be used for coating liquid silica gel.Described lens module 207 has an integral planar; Obviously see it being that lens pit 401 is (if turnback is seen one by one on the plane; Be exactly protruding lens), this position, edge, plane is enclosed a solid silicon cushion rubber earlier, on lens module 207 planes of solid silicon cushion rubber side correspondence; One circle groove is arranged, be used for coating liquid silica gel.Certainly, also groove can be set, directly coat liquid silica gel.
Led chip 203 is parallel with LED open-circuit protector 204, and it act as open-circuit-protection and antistatic.
Described packing colloid refractive index is between 1.4 to 1.6.
The electrical layer 303 of ceramic base pcb board 202 is provided with electrode pad, electroplate or gold or nickel.
A kind of manufacturing process of the LED module based on the ceramic base pcb board, step is following:
(1) on ceramic base pcb board 202, is manufactured with the pit that does not penetrate;
(2) coat primer in pit bottom, led chip 203 is fixed on pit bottom, fixing through baking;
(3) will the go between both positive and negative polarity that is welded to led chip 203 respectively and the both positive and negative polarity pad of ceramic base pcb board 202;
(4) ceramic base pcb board 202 is installed on the radiator 201;
(5) inject packing colloid at lens pit 401 places of lens module 207;
(6) sealing silica gel 206 is installed on lens module 207;
(7), be installed on the lens module (207) of step (6) with the radiator that pcb board 202 is installed of step (4).
Described step (1) is a sintering electrical layer 303 on the ceramic substrate 301 of the ceramic base pcb board 202 that contains pit particularly, and described electrical layer 303 is positive and negative electrodes that sintering goes out on ceramic substrate 301 and is electrically connected circuit.
Have fluorescent material on the described led chip 203.
Another kind of technical scheme: described led chip 203 does not have fluorescent material, between described step (3) (4), can also may further comprise the steps: fluorescent material is carried on the led chip 203 that does not have fluorescent material.Specifically can with the colloid point that is mixed with fluorescent material on chip and, perhaps adopt the technology of dusting that fluorescent powder jet printing is arrived chip surface through baking-curing; Perhaps paste phosphor sheet at chip surface.
Between described step (2) (3), can also may further comprise the steps: led chip 203 parallel connection LED open-circuit protectors 204, and be fixed on the ceramic base pcb board 202.
The angle on the wall of described pit and pit bottom plane be 90 spend to 120 the degree between.
Described pit surface polishing forms the shiny surface of brightening.
The shiny surface of described brightening is coated with minute surface coating.
The described sealing silica gel 206 of step (6) comprises the solid silicon cushion rubber that is installed on the lens module 207, and the gel silica gel circle that is coated in the liquid silica gel formation of solid silicon cushion rubber side.
On the position on lens module 207 planes that described solid silicon cushion rubber side is corresponding, have groove, be used for coating liquid silica gel.
On the described lens module 207 back-off structure 402 is arranged, radiator tips upside down on the lens module 207, fixes through described back-off structure 402, forms the LED module of sealing.
Covering the ceramic base pcb board 202 that carries led chip 203 can not have above-mentioned pit yet, and directly led chip 203 is installed on the ceramic base pcb board 202, and technical scheme is following:
A kind of LED module based on the ceramic base pcb board; Comprise radiator 201, ceramic base pcb board 202, led chip 203, packing colloid, sealing silica gel 206 and lens module 207; It is characterized in that; Led chip 203 covers and is loaded on the ceramic base pcb board 202, is covered with fluorescent material on the led chip 203, and through the electrode pad of wire bonds to ceramic base pcb board 202 electrical layer 303; Described ceramic base pcb board 202 is fitted with radiator 201; Described lens module 207 is installed in led chip 203 tops, the lens pit 401 inner packing colloids of filling on the lens module 207.
Described ceramic base pcb board 202 comprises electrical layer 303, ceramic substrate 301, and covering the top, position of carrying led chip 203 does not have coating electrical layer 303.
Led chip 203 directly covers and is loaded on the ceramic base pcb board 202; And through the electrode pad of wire bonds to ceramic base pcb board 202 electrical layer 303; Said ceramic base pcb board 202 fits tightly with the form that face contacts with radiator 201; Said lens module 207 covers on led chip 203, the lens pit 401 inner filling packing colloids of lens module 207, and through sealing silica gel 206 and ceramic base pcb board 202 and radiator 201 formation hermetically-sealed constructions.
Cover ceramic substrate 301 surfaces of carrying led chip 203 positions and be the shiny surface of brightening.
The shiny surface of described brightening has the coating minute surface.
Described sealing silica gel 206 comprises the solid silicon cushion rubber that is installed on the lens module 207, and the gel silica gel circle that is coated in the liquid silica gel formation of solid silicon cushion rubber side.On the position on lens module 207 planes that described solid silicon cushion rubber side is corresponding, have groove, be used for coating liquid silica gel.Described lens module 207 has an integral planar; Obviously see it being that lens pit 401 is (if turnback is seen one by one on the plane; Be exactly protruding lens), this position, edge, plane is enclosed a solid silicon cushion rubber earlier, on lens module 207 planes of solid silicon cushion rubber side correspondence; One circle groove is arranged, be used for coating liquid silica gel.Certainly, also groove can be set, directly coat liquid silica gel.
Led chip 203 is parallel with LED open-circuit protector 204.
Described packing colloid refractive index is between 1.4 to 1.6.
The electrical layer 303 of ceramic base pcb board 202 is provided with electrode pad, electroplate or gold or nickel.
A kind of manufacturing process of the LED module based on the ceramic base pcb board, step is following:
(1) coat primer at ceramic base pcb board 202, led chip 203 is fixed on the ceramic base pcb board 202, fixing through baking;
(2) will the go between both positive and negative polarity that is welded to led chip 203 respectively and the both positive and negative polarity pad of ceramic base pcb board 202;
(3) ceramic base pcb board 202 is installed on the radiator 201;
(4) inject packing colloid at lens pit 401 places of lens module 207;
(5) sealing silica gel 206 is installed on lens module 207;
(6), be installed on the lens module (207) of step (5) with the radiator that pcb board 202 is installed of step (3).
Described ceramic base pcb board 202 is sintering electrical layer 303 on ceramic substrate 301, and covering the top, position of carrying led chip 203 does not have coating electrical layer 303.
Have fluorescent material on the described led chip 203.
Another kind of technical scheme: described led chip 203 does not have fluorescent material, between described step (3) (4), can also may further comprise the steps: fluorescent material is carried on the led chip 203 that does not have fluorescent material.Specifically can with the colloid point that is mixed with fluorescent material on chip and, perhaps adopt the technology of dusting that fluorescent powder jet printing is arrived chip surface through baking-curing; Perhaps paste phosphor sheet at chip surface.
Between described step (1) (2), can also may further comprise the steps: led chip 203 parallel connection LED open-circuit protectors 204, and be fixed on the ceramic base pcb board 202.
Cover ceramic substrate 301 surfaces of carrying led chip 203 positions and be the shiny surface of brightening.
The shiny surface of described brightening is coated with minute surface coating.
The described sealing silica gel 206 of step (5) comprises the solid silicon cushion rubber that is installed on the lens module 207, and the gel silica gel circle that is coated in the liquid silica gel formation of solid silicon cushion rubber side.
On the position on lens module 207 planes that described solid silicon cushion rubber side is corresponding, have groove, be used for coating liquid silica gel.
On the described lens module 207 back-off structure 402 is arranged, radiator tips upside down on the lens module 207, fixes through described back-off structure 402, forms the LED module of sealing.
The application's core is: existing LED module, often led chip is fixed on support heat sink, and be packaged into the LED device; The LED device is welded on different pcb boards; Be installed to again on the radiator, form Different products, to adapt to more wider application scenarios; And become industry technology prejudice, and the frame mode of this LED module exists shortcomings such as heat dispersion is not good enough, optical transmittance is low, parts complicacy.The application is directly carried led chip and is overlayed on the pcb board substrate, and adopts lens module once light-distribution, has reached the light extraction efficiency of better radiating effect and Geng Gao, and has solved led chip and carry the encapsulation problem that overlays on the pcb board.
Embodiment 1
As shown in Figure 2, a kind of LED module comprises: radiator 201, ceramic base pcb board 202, led chip 203, LED open-circuit protector 204, packing colloid, sealing silica gel 206, lens module 207.
LED open-circuit protector 204 is parallelly connected with led chip 203, and it act as open-circuit-protection and antistatic.The LED open-circuit protector 204 of present embodiment adopts zener diode.
Described ceramic base pcb board 202 also can be selected high heat-conducting ceramic base pcb board for use, then comprises ceramic substrate 301 and electrical layer 303.
Like Fig. 3, shown in Figure 4, contain the pit that does not penetrate that is fired on the ceramic base pcb board, and the electrical layer 303 of sintering.Described electrical layer 303 is positive and negative electrodes that sintering goes out on ceramic substrate 301 and is electrically connected circuit.Led chip 203 directly covers and is loaded on the said pit base that does not penetrate; And through the electrode pad of wire bonds to ceramic base pcb board 202 electrical layer 303; Said ceramic base pcb board 202 fits tightly with the form that face contacts with radiator 201; Said lens module 207 covers on led chip 203, the lens pit 401 inner filling packing colloids of lens module 207, and through sealing silica gel 206 and ceramic base pcb board 202 and radiator 201 formation hermetically-sealed constructions.
On the ceramic substrate that contains pit 301, be furnished with electrical layer 303; Described pit is taper seat; The hole body sidewall of this taper seat and the horizontal plane of pit bottom form the angle between 90 degree～120 degree; The hole body sidewall of this taper seat through minute surface brightening technology be polished into can be reflective shiny surface, perhaps the shiny surface after brightening plates silver and carries out reflective.
Pit also can be fired into other shapes except taper seat, and like platform shape, multiaspect column, cylindric, the face that is become is decided by the requirement of the angle of processing technology and hole body sidewall and bottom surface.
It act as the optics luminous intensity distribution said lens module 207, its be shaped as circle, square, oval, or with the different shape of optics light distribution requirements design.
As shown in Figure 5, a said lens module 207 comprises back-off structure 402, and eight back-off structure 402 are arranged, and is buckled on the radiator 201.
From the above; Led chip 203 can directly be encapsulated on the ceramic substrate 301 of ceramic base pcb board 202; Do not have electrical layer 303, the heat of led chip 203 is directly transferred to ceramic base pcb board 202 and radiator 201, does not pass through the LED packaging heat sink; And LED is heat sink and the air dielectric of ceramic base pcb board 202, has promoted radiating effect greatly.
In addition, the light that led chip 203 sends directly transmits through filling colloid and lens module 207, do not have secondary lens or diffuser, thereby light extraction efficiency is high.
A kind of manufacturing process of the LED module based on ceramic base pcb board 202, step is following:
(1) on ceramic base pcb board 202, fired conical pit, the hole body sidewall of this taper seat and the horizontal plane of pit bottom form the angle between 90 degree～120 degree; Described groove position top does not have coating electrical layer 303;
(2) the hole body sidewall of this taper seat through minute surface brightening technology be polished into can be reflective shiny surface, perhaps the shiny surface after brightening plates silver and carries out reflective;
(3) coat primer in the pit bottom of ceramic base pcb board 202, led chip 203 is fixed on pit bottom, fixing through baking;
(4) with the Zener diode of parallel connection, through with the consistent technology of step (3), be fixed on the ceramic base pcb board 202;
(5) will the go between both positive and negative polarity that is welded to led chip 203, Zener diode respectively and the both positive and negative polarity pad of ceramic base pcb board 202;
(6) fluorescent material is carried on the led chip 203; The used method of present embodiment is: the colloid point that will be mixed with fluorescent material is on led chip 203 and through baking-curing.Also can adopt the technology of dusting that fluorescent powder jet printing is arrived led chip 203 surfaces; Perhaps paste phosphor sheet on led chip 203 surfaces.If on the led chip 203 fluorescent material has been arranged, this step is omitted;
(7) again ceramic base pcb board 202 is fastened on the radiator 201;
(8) the lens module pours into the filling colloid, and fills with whole lens module inner chamber, curing molding;
(9) the solid silicone sealing ring of moulding is placed in the outside around lens module 207, and the inboard is coated with last layer liquid seal silica gel 206 all around;
(10) behind completing steps (9), immediately with the radiator that is fixed with ceramic base pcb board 202 201 of step (7), tip upside down on the lens module 207 of step (9), and fixing by back-off structure 402, form the LED module that seals.
Embodiment 2
Be not provided for installing the pit of led chip 203 on the ceramic base pcb board 202 of present embodiment, but led chip 203 is directly covered on the ceramic substrate 301 that is loaded in ceramic base pcb board 202.The surface that ceramic substrate 301 is used to cover the position of carrying led chip 203 is the shiny surface of brightening, and the shiny surface of described brightening further can also have the coating minute surface.The present embodiment remainder is identical with embodiment 1.
A kind of manufacturing process of the LED module based on ceramic base pcb board 202, step is following:
(1) sintering electrical layer 303 on ceramic base pcb board 202, described electrical layer 303 is positive and negative electrodes that sintering goes out on ceramic substrate 301 and is electrically connected circuit;
(2) on ceramic base pcb board 202, be used to install the position of led chip 203, through minute surface brightening technology be polished into can be reflective shiny surface, perhaps the shiny surface after brightening plates silver and carries out reflective;
(3) primer is coated in the position that on ceramic base pcb board 202, is used to install led chip 203, and led chip 203 is fixed on the position that does not have coating electrical layer 303, and is fixing through baking;
(4) fluorescent material is carried on the led chip 203; The used method of present embodiment is: the colloid point that will be mixed with fluorescent material is on led chip 203 and through baking-curing.Also can adopt the technology of dusting that fluorescent powder jet printing is arrived led chip 203 surfaces; Perhaps paste phosphor sheet on led chip 203 surfaces.Fluorescent material has been arranged on the led chip 203, and this step is omitted;
(5) with the Zener diode of parallel connection, through with the consistent technology of step (3), be fixed on the ceramic base pcb board 202;
(6) will the go between both positive and negative polarity that is welded to led chip 203, Zener diode respectively and the both positive and negative polarity pad of ceramic base pcb board 202;
(7) again ceramic base pcb board 202 is fastened on the radiator 201;
(8) the lens module pours into the filling colloid, and fills with whole lens module inner chamber, curing molding;
(9) the solid silicone sealing ring of moulding is placed in the outside around lens module 207, and the inboard is coated with last layer liquid seal silica gel 206 all around;
(10) behind completing steps (9), immediately with the radiator that is fixed with ceramic base pcb board 202 201 of step (7), tip upside down on the lens module 207 of step (9), and fixing by back-off structure 402, form the LED module that seals.
Above-described only is preferred implementation of the present invention; Should be pointed out that the those of ordinary skill in the art, under the prerequisite that does not break away from core technology characteristic of the present invention; Can also make some improvement and retouching, these improvement and retouching also should be regarded as protection scope of the present invention.
Claims (19)
1. LED module based on the ceramic base pcb board; Comprise radiator (201), ceramic base pcb board (202), led chip (203), packing colloid, sealing silica gel (206) and lens module (207); It is characterized in that; Said led chip is covered with fluorescent material on (203), and led chip (203) covers and is loaded on the ceramic base pcb board (202), and through the electrode pad of wire bonds to ceramic base pcb board (202) electrical layer (303); Described ceramic base pcb board (202) is fitted with radiator (201); Described lens module (207) is installed in led chip (203) top, the inner packing colloid of filling of the lens pit (401) on the lens module (207).
2. the LED module based on the ceramic base pcb board according to claim 1 is characterized in that, described ceramic base pcb board (202) inwardly is manufactured with the pit that does not penetrate covering the position of carrying led chip (203) from the one side that has electrical layer (303); Led chip (203) covers and is loaded in described pit bottom.
3. the LED module based on the ceramic base pcb board according to claim 1 and 2 is characterized in that, covers ceramic substrate (301) surface of carrying led chip (203) position and is the shiny surface of brightening.
4. the LED module based on the ceramic base pcb board according to claim 3 is characterized in that the shiny surface of described brightening has the coating minute surface.
5. the LED module based on the ceramic base pcb board according to claim 1 and 2; It is characterized in that; Described sealing silica gel (206) comprises the solid silicon cushion rubber that is installed on the lens module (207), and the gel silica gel circle that is coated in the liquid silica gel formation of solid silicon cushion rubber side.
6. the LED module based on the ceramic base pcb board according to claim 5 is characterized in that, on the position on lens module (207) plane that described solid silicon cushion rubber side is corresponding, has groove, is used for coating liquid silica gel.
7. the LED module based on the ceramic base pcb board according to claim 1 and 2 is characterized in that lens module (207) is designed with back-off structure (402), and radiator (201) tips upside down on the last formation of lens module (207) and closes fixing.
8. the LED module based on the ceramic base pcb board according to claim 1 and 2 is characterized in that led chip (203) is parallel with LED open-circuit protector (204).
9. the LED module based on the ceramic base pcb board according to claim 1 and 2 is characterized in that, the electrical layer (303) of ceramic base pcb board (202) is provided with electrode pad, electroplate or gold or nickel.
10. manufacturing process based on the LED module of ceramic base pcb board is characterized in that step is following:
(1) coat primer at ceramic base pcb board (202), led chip (203) is fixed on the ceramic base pcb board (202), fixing through baking;
(2) will the go between both positive and negative polarity that is welded to led chip (203) respectively and the both positive and negative polarity pad of ceramic base pcb board (202);
(3) ceramic base pcb board (202) is installed on the radiator (201);
(4) locate to inject packing colloid at the lens pit (401) of lens module (207);
(5) sealing silica gel (206) is installed on lens module (207);
(6), be installed on the lens module (207) of step (5) with the radiator that pcb board (202) are installed of step (3).
11. the manufacturing process of the LED module based on the ceramic base pcb board according to claim 10; It is characterized in that; Described ceramic base pcb board (202) inwardly is manufactured with the pit that does not penetrate covering the position of carrying led chip (203) from the one side that has electrical layer (303); Led chip (203) covers and is loaded in described pit bottom.
12. the manufacturing process according to claim 10 or 11 described LED modules based on the ceramic base pcb board is characterized in that described led chip has fluorescent material on (203).
13. manufacturing process according to claim 10 or 11 described LED modules based on the ceramic base pcb board; It is characterized in that; Described led chip (203) does not have fluorescent material; Between described step (2) (3), can also may further comprise the steps: the colloid point that will be mixed with fluorescent material perhaps adopts the technology of dusting that fluorescent powder jet printing is arrived chip surface on chip; Perhaps paste phosphor sheet at chip surface.
14. manufacturing process according to claim 10 or 11 described LED modules based on the ceramic base pcb board; It is characterized in that; Between described step (1) (2); Can also may further comprise the steps: led chip (203) parallel connection LED open-circuit protector (204), and be fixed on the ceramic base pcb board (202).
15. the manufacturing process according to claim 10 or 11 described LED modules based on the ceramic base pcb board is characterized in that, covers ceramic substrate (301) surface of carrying led chip (203) position and is the shiny surface of brightening.
16. the manufacturing process of the LED module based on the ceramic base pcb board according to claim 16 is characterized in that the shiny surface of described brightening is coated with minute surface coating.
17. the manufacturing process of the LED module of no wire bonds according to claim 10; It is characterized in that; The described sealing silica gel of step (5) (206) comprises the solid silicon cushion rubber that is installed on the lens module (207), and the gel silica gel circle that is coated in the liquid silica gel formation of solid silicon cushion rubber side.
18. the manufacturing process of the LED module of no wire bonds according to claim 17 is characterized in that, on the position on lens module (207) plane that described solid silicon cushion rubber side is corresponding, has groove, is used for coating liquid silica gel.
19. the manufacturing process of the LED module of no wire bonds according to claim 10; It is characterized in that back-off structure (402) is arranged on the described lens module (207), radiator tips upside down on the lens module (207); Fixing through described back-off structure (402), form the LED module that seals.
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| Application Number | Priority Date | Filing Date | Title |
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| CN2011101648963A CN102376699A (en) | 2011-06-17 | 2011-06-17 | LED (Light Emitting Diode) module based on ceramic-based PCB (Printed Circuit Board) and manufacturing process thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2011101648963A CN102376699A (en) | 2011-06-17 | 2011-06-17 | LED (Light Emitting Diode) module based on ceramic-based PCB (Printed Circuit Board) and manufacturing process thereof |
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Application publication date: 20120314 |