CN201589080U - LED lighting device and its heat dissipation structure - Google Patents

Abstract

The utility model provides an LED lighting device and a heat dissipation structure thereof. LED lighting device, including a protective cover, an LED light-emitting module composed of LED substrates and LED particles, and a light-transmitting plate are combined into a lamp and connected to a power supply. The light-transmitting plate and the protective cover form a box-like structure, and the middle is fixed. LED substrate; LED particles are connected in series to form a group of 3 to 10 LEDs and welded on the LED substrate; the light-emitting film is pasted on the inner side of the light-emitting wall of the light-transmitting plate, and there is a reflective layer on the inner side of the wall of the light-transmitting plate; the light emitted by the LED light-emitting module The light, after the astigmatism treatment of the transparent plate, can be evenly and softly directed to the direction that needs to be illuminated. The utility model further provides a heat dissipation structure suitable for the above-mentioned LED lighting device, which is composed of a substrate, LED particles, and copper-clad (or aluminum-clad) on both sides of the substrate. The utility model has good heat dissipation effect, low cost, energy saving and environmental protection, long LED service life, and fully satisfies popularization and application of LEDs with different powers.

Description

LED lighting device and its heat dissipation structure

technical field

The utility model relates to an LED lighting device and its heat dissipation structure, which is suitable for any place that needs lighting, and the heat dissipation structure is respectively suitable for low-power or high-power LED lighting.

Background technique

Lighting devices are basic facilities, and the light sources usually used are high-power fluorescent lamps, incandescent lamps, and halogen lamps. The disadvantages of using realistic light sources are: 1. The lamp tube is easily broken during transportation and installation, which brings many disadvantages to the construction; 2. The high breakage rate of the lamp tube increases the cost of use; 3. The life of the real light source is generally relatively Short, need to replace the lamp tube frequently, the continuous working life of the general incandescent lamp is about 1200 hours, the continuous working life of the fluorescent lamp and the halogen lamp is about 3000 hours; The rectifier of the fluorescent lamp is easily damaged, and the cost of frequent replacement of the lamp tube and maintenance is high; 5. For fluorescent lamp lighting, it also needs high voltage to start, and it takes a certain time to start to light, with low efficiency and high power consumption. And fluorescent lamps contain mercury, which has certain pollution to the environment and is also a known shortcoming. For this reason, technicians have been looking for an ideal lighting device that is environmentally friendly, energy-saving, and can adapt to frequent switching and working in a turbulent environment.

In recent years, with the continuous improvement of LED light efficiency, LED light sources have gradually entered the field of lighting. Semiconductor lighting is recognized as the third-generation light source after incandescent lamps and fluorescent lamps due to its energy saving, environmental protection, and long life. Nowadays, single LEDs ranging from a few milliwatts to several watts have been widely used in different lighting However, the problem of heat dissipation still exists, and heat dissipation is the biggest and most serious problem in a lighting device with a large power composed of multiple LEDs.

In the current application of low-power LEDs, in order to save costs, heat dissipation design is usually not adopted. Generally, low-power LEDs use PCB boards as substrates. PCB boards are generally made of organic resin and other raw materials, and are directly wired on the PCB board without heat dissipation treatment. This kind of PCB board has poor thermal conductivity. When using LEDs that generate heat , the heat is not easy to dissipate, causing the junction temperature of the LED to rise, which directly affects the light efficiency of the LED, accelerates its light decay, and reduces the service life of the LED. In recent years, some aluminum substrates have been used as LED substrates, which are conducive to the heat dissipation of LEDs. However, due to the high price of aluminum substrates, they are not suitable for low-power LEDs. Due to cost factors, they cannot be vigorously promoted and applied in the market. For high-power LEDs, it is generally used to print circuits on aluminum substrates and then dissipate heat through an external heat sink. Since there is an insulating layer on the aluminum substrates and the thermal resistance is relatively large, this method cannot achieve the best heat conduction effect.

After retrieving Chinese patents, there are some inventions related to the application of LED lighting, but their connection arrangement is different from the present invention, and there is no heat dissipation structure, and the realized work efficiency, function and service life cannot meet the requirements of LED in the market. Vigorously promote the application, and cannot solve the technical problems existing in the existing lighting devices.

Utility model content

The purpose of this utility model is to solve the problems existing in the prior art, and to provide an LED lighting device and its heat dissipation structure. The heat dissipation structure can be respectively applied to low-power or high-power LED lighting devices. The LED lighting device provided has the characteristics of low energy consumption, long life, fast start-up speed, high mechanical strength, environmental protection and no pollution. The heat dissipation structure designed by the present invention can realize a very good heat dissipation function without adding additional radiators, so that the LED lighting device has high working efficiency, good LED heat dissipation effect, low cost, and long life, and fully meets various power LEDs. promotional application.

The specific technical solution of the utility model is described as follows in conjunction with the reference numerals: an LED lighting device, including a protective cover plate 2, an LED light-emitting module composed of an LED substrate 3 or a printed circuit board and LED particles 4, and a light-transmitting plate 5 are combined into lamps 6 and connected to the power supply, and the lighting device is fixed on the connecting plate 1,

The light-transmitting plate 5 and the protective cover 2 form a box structure, and the LED substrate 3 is fixedly arranged in the middle;

The LED light-emitting module is used as a luminous body, and the working voltage of a single LED particle 4 is 2.8-4V, and the working current is 15-100mA;

The LED particles 4 are every 3-10 LEDs connected in series to form a group of LEDs, and at least one group or more are connected in parallel with each other to form an illumination light source, and are welded and fixed on the LED substrate 3,

The power supply is a constant current power supply with a working voltage of 24V, which provides power to the LEDs of each group;

The LED light-emitting module has a luminous efficiency of more than 50lm/W;

Paste a high-transmittance astigmatism film on the inner side of the light-emitting wall of the light-transmitting plate 5 to form a light-scattering layer, and the transmittance can be higher than 90%. , after the astigmatism treatment of the light-transmitting plate 5, it can evenly and softly irradiate to the direction that needs to be illuminated.

The light-transmitting plate 5 is formed into an integral lampshade shape by using transparent materials at one time, or a plurality of transparent materials are bonded into a lampshade shape, and its cross-section is concave, and the direction opposite to the light-emitting wall is a concave gap. There is a reflective layer on the inner wall surface of the surrounding wall of the light-transmitting plate 5, and the reflective layer is a mirror coating, or tinfoil, or sprays reflective paint.

The heat dissipation through holes 21 are evenly distributed on the protective cover 2 , and the shape of the heat dissipation through holes 21 is preferably a strip hole, a circular hole, or other shapes are not limited.

A through hole or groove 22 is provided at the middle and lower part of one side of the protective cover 2 for the wire to pass through and be connected to the power supply.

The distance between the LED substrate 3 and the top surface of the protective cover 2 is 5-20mm.

The shapes of the protective cover 2 , the base plate 3 , and the light-transmitting plate 5 are basically the same, which are fan-shaped, or rectangular, or square, or other geometric shapes.

The utility model further provides a heat dissipation structure, which is suitable for the above-mentioned LED lighting device. It is composed of a substrate 3, LED particles 4, and copper-clad (or aluminum-clad) 6 on both sides of the substrate 3. The copper-clad ( or aluminum clad) 6 is a large piece of copper clad (or aluminum clad), which replaces the original wire and is connected to the power supply, and the heat generated by the LED is quickly dissipated through the copper clad (or aluminum clad) 6 and the small heat dissipation through hole 7 above it. in:

The diameter of the small through hole 7 for heat dissipation is 0.6 to 1.5 mm, and the center distance between two adjacent through holes is 1 to 3.5 mm. The heat generated by the LED passes through the small through hole 7 for heat dissipation, the substrate 3 and the copper (or clad Aluminum) 6 fast conduction heat dissipation.

The substrate 3 is a resin board (PCB), or an aluminum alloy board. When the substrate 3 is a resin board, it is suitable for low-power LEDs; when the substrate 3 is an aluminum alloy board, it is suitable for high-power LEDs.

The copper clad (or aluminum clad) 6 has an insulation gap of 0.1-0.6 mm, which is used for insulation in the circuit board.

Compared with the prior art, the utility model has the following advantages: 1. The utility model solves the heat dissipation problem of low-power LED lighting integrated components for a long time, saves costs, promotes the wide application of low-power light-emitting diodes, and saves energy , and long service life. 2. For the large heat generated by high-power LEDs, the existing technology needs to add a heat sink, and the heat is conducted to the bottom surface and dissipated into the air through the heat sink; the heat dissipation structure of the utility model can achieve very good performance without additional heat sinks. Excellent heat dissipation effect, so that the LED lighting device has high working efficiency, good heat dissipation effect, and low cost, which fully meets the popularization and application of various power LEDs. 3. The utility model is suitable for any place that needs lighting. The lighting device has the characteristics of low energy consumption, long life, fast starting speed, high mechanical strength, environmental protection and no pollution.

Description of drawings

Fig. 1 is a schematic structural view of the LED lighting device of the present invention.

FIG. 2 is a three-dimensional schematic diagram of part 2 in FIG. 1 .

Fig. 3 is a schematic diagram of the heat dissipation structure of the present invention.

Marked in the figure: 1. Connection plate, 2. Protective cover plate, 3. Substrate, 4. LED particles, 5. Light-transmitting plate, 6. Copper clad (or aluminum clad), 7. Small through hole, 21. Heat dissipation Hole, 22, through hole or groove.

Detailed ways

Accompanying drawing 1 shows the structural diagram of the best embodiment of the LED lighting device of the present invention.

Below in conjunction with accompanying drawing 1 further describe the content and working principle of the present utility model in detail.

When the LED lighting device of the present invention is applied to a high-power LED, when the PCB board is used as the substrate, since the heat generated by the high-power LED is relatively large, the conductive part of the LED is welded on the substrate 3 or the top surface of the printed circuit board. Large piece of copper (or aluminum) 6, large piece of copper (or aluminum) 6 replaces the original wire, has the dual effects of conduction and heat dissipation, the area of the large piece of copper (or aluminum) 6 is determined according to the actual layout, should be Make it as big as possible, there are many small through holes 7 for heat dissipation on the large piece of copper clad (or aluminum clad) 6 and the substrate 3, the number and arrangement of the small through holes 7 are not limited, you can also refer to the accompanying drawings 3 to arrange. The heat emitted by the LED is quickly transferred to the large copper (or aluminum) 6, part of the heat is directly dissipated into the air in the lamp housing through the large copper (or aluminum) 6, and a small part of the heat is passed through the large copper (or aluminum clad) 6 is directly transmitted to the large copper clad (or aluminum clad) 6 on the back of the substrate 3, and part of the heat is conducted to the large copper clad (or aluminum clad) 6 on the back of the substrate through the small through hole 7 nearby. Large pieces of copper clad (or aluminum clad) 6 quickly dissipate heat into the air.

When the LED lighting device of the present utility model is applied to a low-power LED, when the PCB board is used as the substrate, the substrate 3 or the top surface of the printed circuit board is welded with a large copper-clad (or aluminum-clad) 6 for conduction of the LED, Also conduct heat dissipation through the bulk copper (or aluminum) 6 on the back of the substrate 3 .

In the range of 1-5mm from the edge of the whole board, copper cladding and through-hole treatment are not performed. In the case of other external insulation measures, in order to maximize the heat dissipation effect, copper cladding can also be performed within this range. In the case of other insulation measures, in order to maximize the heat dissipation effect, it is also possible to pour copper and drill through holes within this range.

Accompanying drawing 2 is a three-dimensional schematic diagram of the middle part 2 of the LED lighting device shown in FIG. Convection for good heat dissipation. A through hole 22 is opened in the middle of one side of the protective cover plate as a light source circuit board wire passing hole. The through holes are conducive to air convection on the substrate and can dissipate heat quickly.

Accompanying drawing 3 is the schematic diagram of the heat dissipation structure of the present utility model. It only represents a common and commonly used embodiment of the best heat dissipation structure, but its shape, structure of small through holes, and layout can be changed according to the actual situation, and the present invention does not make any limitation.

The utility model is only described in detail with respect to the best embodiment of the utility model, but it cannot be understood as a limitation to other ways of implementing the utility model. Any further improvement and similar or identical schemes on the basis of the utility model shall be It is regarded as the protection scope of the utility model.

Claims (10)

1. An LED lighting device, characterized in that: comprising, a protective cover (2), an LED light-emitting module made of an LED substrate (3) or a printed circuit board and LED particles (4), and a light-transmitting plate (5 ) are combined into a lamp (6) and connected to a power supply, and the lighting device is fixed on the connecting plate (1), The light-transmitting plate (5) and the protective cover (2) form a box structure, and the LED substrate (3) is fixedly arranged in the middle; The LED light-emitting module is used as a luminous body, the working voltage of a single LED particle (4) is 2.8-4V, and the working current is 15-100mA; The LED particles (4) are every 3 to 10 LEDs connected in series to form a group of LEDs, and at least one group or more are connected in parallel with each other to form an illumination light source, and are welded and fixed on the LED substrate (3), The power supply is a constant current power supply with a working voltage of 24V, which provides power to the LEDs of each group; The LED light-emitting module has a luminous efficiency of more than 50lm/W; Paste a light-scattering film on the inner side of the light-emitting wall of the light-transmitting plate (5) to form a light-scattering layer, and the inner side of the wall of the light-transmitting plate (5) has a reflective layer; the light emitted by the LED light-emitting module is treated by the light-transmitting plate (5) Finally, it can evenly and softly shoot in the direction that needs lighting. 2. The LED lighting device according to claim 1, characterized in that: the light-transmitting plate (5) is formed into an integrated lampshade shape by using transparent materials at one time, or a plurality of transparent materials are bonded into a lampshade shape, and its cross-section It is in a concave shape, and the opposite direction of the light exit wall is a concave gap. The inside of the light exit wall is pasted with a high-transmittance astigmatism film to form an astigmatism layer, and the transmission efficiency is higher than 90%. 3. The LED lighting device according to claim 1 or 2, characterized in that: there is a reflective layer on the inner wall surface of the light-transmitting plate (5), and the reflective layer is a mirror coating, or tinfoil, or spray reflective paint. 4. The LED lighting device according to claim 1, characterized in that: the protective cover (2) is evenly distributed with heat dissipation through holes (21), and the shape of the heat dissipation through holes (21) is a strip hole, or circular holes. 5. The LED lighting device according to claim 1 or 4, characterized in that: a through hole or a groove (22) is provided at the middle and lower part of one side of the protective cover (2) for wires to pass through Connect to power supply. 6. The LED lighting device according to claim 1, characterized in that: the distance between the LED substrate (3) and the top surface of the protective cover (2) is 5-20 mm. 7. The LED lighting device according to claim 1, characterized in that: the shapes of the protective cover (2), the substrate (3), and the light-transmitting plate (5) are basically the same, which are fan-shaped or rectangular, or square. 8. A heat dissipation structure suitable for the LED lighting device described in claim 1, characterized in that: the substrate (3), the LED particles (4), and the copper or aluminum clad (6) on both sides of the substrate (3) ), the described copper clad or aluminum clad (6) is a large piece of copper clad or aluminum clad, which replaces the original wire and is connected to the power supply, and the heat generated by the LED passes through the copper clad or aluminum clad (6) and its arrangement on the substrate ( 3) and the small through hole (7) on the copper clad or aluminum clad (6) emits quickly, wherein: The diameter of the small through-holes (7) is 0.6-1.5mm, and the center-to-center distance between two adjacent through-holes is 1-3.5mm. The heat generated by the LED is quickly conducted and dissipated through the small through hole (7), the substrate (3) and the copper or aluminum cladding (6). 9. A heat dissipation structure according to claim 8, characterized in that: the substrate (3) is a resin plate, or an aluminum alloy plate, and when the substrate (3) is a resin plate, it is suitable for low power LED; when the substrate (3) is an aluminum alloy plate, it is suitable for high-power LEDs. 10. A heat dissipation structure according to claim 8 or 9, characterized in that: there is an insulation gap of 0.1-0.6 mm on the copper clad or aluminum clad (6), which is used for insulation in the circuit board.

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