CN103337580A - LED light with ceramic heat dissipation baseplate - Google Patents
LED light with ceramic heat dissipation baseplate Download PDFInfo
- Publication number
- CN103337580A CN103337580A CN2013102422253A CN201310242225A CN103337580A CN 103337580 A CN103337580 A CN 103337580A CN 2013102422253 A CN2013102422253 A CN 2013102422253A CN 201310242225 A CN201310242225 A CN 201310242225A CN 103337580 A CN103337580 A CN 103337580A
- Authority
- CN
- China
- Prior art keywords
- substrate
- ceramic
- heat
- led lamp
- ceramic heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Led Device Packages (AREA)
Abstract
The invention provides an LED (Light Emitting Diode) light with a ceramic heat dissipation baseplate. The LED light comprises LED chips and light cups for holding the LED chips, and further comprises the heat dissipation baseplate, wherein the LED chips are in electric connection and attached to the heat dissipation baseplate. The light is characterized in that the heat dissipation baseplate is the ceramic heat dissipation baseplate. The LED light with the ceramic heat dissipation baseplate, provided by the invention, replaces the traditional metal baseplate with the ceramic heat dissipation baseplate, and has better thermal conductivity and insulativity as compared with the traditional metal baseplate on the basis of conductibility; so that the lighting effect and the service life of the LED light are improved.
Description
Technical field
The present invention relates to a kind of LED lamp, relate in particular to a kind of LED lamp with ceramic heat-dissipating substrate.
Background technology
The LED lamp mainly comprises led chip and Lamp cup, usually led chip is to be connected on the heat-radiating substrate in the mode of beating gold thread, eutectic or covering crystalline substance with the LED luminescent wafer to form, again led chip is fixed on the circuit board of system, heat-radiating substrate is being played the part of heat radiation, conduction, insulation triple role, existing heat-radiating substrate mainly is metal substrate, modal is copper substrate and aluminum substrate, the common feature of these two kinds of substrates is that conductivity is fine, but the technology of this metalloid substrate connection LED luminescent wafer exists the drawback of poor radiation, poor insulativity.The quality of heat dispersion directly influences the useful life of LED lamp, be because LED luminescent wafer when work the light that produces do not contain ultraviolet ray and infrared ray, therefore its light can not be taken away heat, just mean that also most electric energy distributes around wafer with heat, and the junction temperature of LED luminescent wafer is generally between 60-75 ℃, the heat of accumulating of failing in time to dissipate that works long hours makes the temperature in the Lamp cup continue to raise, and then it is luminous to influence the LED luminescent wafer, and the serious wafer that directly causes is died.
Summary of the invention
In order to solve the deficiency in the background technology, the objective of the invention is to overcome the defective of background technology, a kind of LED lamp with ceramic heat-dissipating substrate is provided, reached that rapid heat dissipation, light efficiency are good, the purpose of long service life.
For achieving the above object, the technical solution used in the present invention is: a kind of LED lamp with ceramic heat-dissipating substrate, described LED lamp comprises the Lamp cup of led chip and ccontaining described led chip, it also comprises heat-radiating substrate, what described led chip was electrically connected is attached on the described heat-radiating substrate, it is characterized in that: described heat-radiating substrate is ceramic heat-dissipating substrate.
In a preferred embodiment of the present invention, comprise that further described ceramic heat-dissipating substrate comprises that ceramic substrate and coating sintering are arranged on the conductor rete of described ceramic base plate surface, what described led chip was electrically connected is attached on the described conductor rete.
In a preferred embodiment of the present invention, further comprise the groove that offers on the described ceramic substrate based on described ceramic substrate plane indent, described led chip is located in the described groove.
In a preferred embodiment of the present invention, comprise that further described ceramic substrate is provided with counterbore, the described conductor rete on described ceramic substrate two sides connects by described counterbore conducting.
In a preferred embodiment of the present invention, comprise that further described ceramic substrate is a kind of in aluminium oxide ceramic substrate or the aluminium nitride ceramics substrate.
In a preferred embodiment of the present invention, comprise that further described conductor rete is provided with the solderability oxidation film layer.
In a preferred embodiment of the present invention, the material that further comprises described conductor rete is a kind of in silver-plated of copper, silver, glass silver, aluminium.
Usefulness of the present invention is: a kind of LED lamp with ceramic heat-dissipating substrate of the present invention, replace traditional metal substrate with ceramic heat-dissipating substrate, ceramic substrate has very high thermal conductivity and good insulation performance, the coating sintering one conductor rete again on its surface again, by special process with being attached on the conductor rete that led chip is electrically connected, just directly be encapsulated in led chip on the ceramic heat-dissipating substrate, the conventional metals substrate has better thermal conductivity and insulating properties having concurrently on the basis of conductivity relatively, and then has improved light efficiency and the useful life of LED lamp.
Figure of description
The present invention is further detailed explanation below in conjunction with the drawings and specific embodiments.
Fig. 1 is the structure structural representation of a kind of LED lamp with ceramic heat-dissipating substrate of the present invention.
Among the figure: 2, led chip, 4, Lamp cup, 6, heat-radiating substrate, 8, ceramic substrate, 10, the conductor rete, 12, groove, 14, the solderability oxidation film layer.
Embodiment
In order to make those skilled in the art person understand the present invention program better, and above-mentioned purpose of the present invention, feature and advantage can be become apparent more, the present invention is further detailed explanation below in conjunction with embodiment and embodiment accompanying drawing.
As shown in Figure 1, a kind of LED lamp with ceramic heat-dissipating substrate, described LED lamp comprises the Lamp cup 4 of led chip 2 and ccontaining led chip 2, it also comprises heat-radiating substrate 6, what led chip 2 was electrically connected is attached on the heat-radiating substrate 6, special feature of the present invention is that heat-radiating substrate 6 is ceramic heat-dissipating substrate, wherein ceramic heat-dissipating substrate comprises ceramic substrate 8 and printing, sintering is arranged on the conductor rete 10 on ceramic substrate 8 surfaces after applying, the material of conductor rete 10 can be copper or silver, certainly also be not limited to copper and silver, also can be glass silver, the material that the silver-plated grade of aluminium conducts electricity very well is attached on the conductor rete 10 and led chip 2 is electrically connected.Ceramic substrate 8 itself has very high thermal conductivity and thermal insulation, good insulation performance, the coating sintering one conductor rete 10 again on its surface, by special process with being attached on the conductor rete 10 that led chip 2 is electrically connected, just directly be encapsulated in led chip 2 on the ceramic heat-dissipating substrate, the conventional metals substrate has better heat conduction, thermal insulation and insulating properties having concurrently on the basis of conductivity relatively, and then has improved light efficiency and the useful life of LED lamp.
In order better led chip 2 to be attached on the ceramic substrate 8, led chip 2 is built in the groove 12 that offers on the ceramic substrate 8, attach closelyr, thermal conductivity is better.
Conductor rete 10 can be that the single face circuit connects on ceramic substrate 8, also can connect by two-sided hole conducting veneer, offers counterbore (not shown) at ceramic substrate 8, and the conductor rete 10 on two sides is communicated with by counterbore (not shown).
For led chip 2 and conductor rete 10 better weld, on conductor rete 10, also be provided with a solderability oxidation film layer 14.
Above-described embodiment is preferred implementation of the present invention; but embodiments of the present invention are not limited by the examples; other any do not deviate from change, the modification done under spiritual essence of the present invention and the principle, substitutes, combination, simplify the substitute mode that all should be equivalence, is included within protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection range that claim was defined.
Claims (7)
1. LED lamp with ceramic heat-dissipating substrate, described LED lamp comprises the Lamp cup of led chip and ccontaining described led chip, it also comprises heat-radiating substrate, and what described led chip was electrically connected is attached on the described heat-radiating substrate, it is characterized in that: described heat-radiating substrate is ceramic heat-dissipating substrate.
2. a kind of LED lamp with ceramic heat-dissipating substrate according to claim 1, it is characterized in that: described ceramic heat-dissipating substrate comprises that ceramic substrate and coating sintering are arranged on the conductor rete of described ceramic base plate surface, and what described led chip was electrically connected is attached on the described conductor rete.
3. a kind of LED lamp with ceramic heat-dissipating substrate according to claim 1 and 2, it is characterized in that: offer the groove based on described ceramic substrate plane indent on the described ceramic substrate, described led chip is located in the described groove.
4. a kind of LED lamp with ceramic heat-dissipating substrate according to claim 2, it is characterized in that: described ceramic substrate is provided with counterbore, and the described conductor rete on described ceramic substrate two sides connects by described counterbore conducting.
5. a kind of LED lamp with ceramic heat-dissipating substrate according to claim 4 is characterized in that: described ceramic substrate is a kind of in aluminium oxide ceramic substrate, aluminium nitride ceramics substrate, the low-temperature co-fired ceramic substrate.
6. a kind of LED lamp with ceramic heat-dissipating substrate according to claim 5, it is characterized in that: described conductor rete is provided with the solderability oxidation film layer.
7. a kind of LED lamp with ceramic heat-dissipating substrate according to claim 2 is characterized in that: the material of described conductor rete is a kind of in silver-plated of copper, silver, glass silver, aluminium.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013102422253A CN103337580A (en) | 2013-06-19 | 2013-06-19 | LED light with ceramic heat dissipation baseplate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013102422253A CN103337580A (en) | 2013-06-19 | 2013-06-19 | LED light with ceramic heat dissipation baseplate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103337580A true CN103337580A (en) | 2013-10-02 |
Family
ID=49245710
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013102422253A Pending CN103337580A (en) | 2013-06-19 | 2013-06-19 | LED light with ceramic heat dissipation baseplate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103337580A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040016570A1 (en) * | 2001-10-10 | 2004-01-29 | Reo Yamamoto | Substrate and method of manufacturing the same |
| CN101483217A (en) * | 2009-02-04 | 2009-07-15 | 宋立峰 | LED high heat conduction ceramic copper coating heat radiation circuit board |
| CN102376699A (en) * | 2011-06-17 | 2012-03-14 | 杭州华普永明光电股份有限公司 | LED (Light Emitting Diode) module based on ceramic-based PCB (Printed Circuit Board) and manufacturing process thereof |
| CN202423382U (en) * | 2012-01-13 | 2012-09-05 | 张家港市金港镇东南电子厂 | LED (Light Emitting Diode) ceramic substrate |
| CN203503690U (en) * | 2013-06-19 | 2014-03-26 | 苏州信亚科技有限公司 | LED lamp with ceramic heat radiation substrate |
-
2013
- 2013-06-19 CN CN2013102422253A patent/CN103337580A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040016570A1 (en) * | 2001-10-10 | 2004-01-29 | Reo Yamamoto | Substrate and method of manufacturing the same |
| CN101483217A (en) * | 2009-02-04 | 2009-07-15 | 宋立峰 | LED high heat conduction ceramic copper coating heat radiation circuit board |
| CN102376699A (en) * | 2011-06-17 | 2012-03-14 | 杭州华普永明光电股份有限公司 | LED (Light Emitting Diode) module based on ceramic-based PCB (Printed Circuit Board) and manufacturing process thereof |
| CN202423382U (en) * | 2012-01-13 | 2012-09-05 | 张家港市金港镇东南电子厂 | LED (Light Emitting Diode) ceramic substrate |
| CN203503690U (en) * | 2013-06-19 | 2014-03-26 | 苏州信亚科技有限公司 | LED lamp with ceramic heat radiation substrate |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9091421B2 (en) | LED array module and manufacturing method thereof | |
| TW201103381A (en) | High heat dissipation circuit board and fabrication method thereof | |
| WO2011124019A1 (en) | Led lampwick, led chip, and method for manufacturing led chip | |
| CN103022332B (en) | Flip-chip substrate and manufacture method thereof and the LED encapsulation structure based on this flip-chip substrate | |
| TW201349577A (en) | Lighting device | |
| TW201330337A (en) | Structure of light-emitting diode chip, structure of light-emitting diode package substrate, light-emitting diode package structure and preparation method thereof | |
| CN102969438A (en) | Sapphire bracket for LED (Light-Emitting Diode) | |
| CN104205381A (en) | LED light-emitting device and method for manufacturing same, and led lighting device | |
| CN203503690U (en) | LED lamp with ceramic heat radiation substrate | |
| CN203521463U (en) | High-thermal conductivity LED-COB packaging substrate | |
| CN103247742B (en) | A kind of LED heat radiation substrate and manufacture method thereof | |
| US20120113630A1 (en) | Led energy-saving lamp | |
| TW201205882A (en) | Manufacturing method for LED light emitting device | |
| CN102013452B (en) | LED lamp and LED chip and manufacture method | |
| TW201429009A (en) | Light-emitting diode device and method for manufacturing heat-dissipating substrate | |
| CN103337580A (en) | LED light with ceramic heat dissipation baseplate | |
| CN104501013A (en) | Led lamp | |
| CN207199666U (en) | A kind of flip-chip COB substrates and light source product | |
| KR20140122389A (en) | Structure and Method for Radiant Heat Treatment of LED Package | |
| CN202134575U (en) | LED cooling substrate | |
| CN207938645U (en) | Ceramic white light sticking type LED light source | |
| CN201859892U (en) | High-power LED light emitting component | |
| TWM502251U (en) | LED heat dissipation substrate | |
| CN103035819B (en) | Base plate for packaging and manufacture method thereof and the LED encapsulation structure based on this base plate for packaging | |
| CN105826452A (en) | LED chip and manufacturing method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20131002 |