CN102412246A - LED (Light-emitting diode) module based on metal matrix PCB (Printed Circuit Board) board and manufacture method thereof - Google Patents
LED (Light-emitting diode) module based on metal matrix PCB (Printed Circuit Board) board and manufacture method thereof Download PDFInfo
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- CN102412246A CN102412246A CN2011101648639A CN201110164863A CN102412246A CN 102412246 A CN102412246 A CN 102412246A CN 2011101648639 A CN2011101648639 A CN 2011101648639A CN 201110164863 A CN201110164863 A CN 201110164863A CN 102412246 A CN102412246 A CN 102412246A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H01L2224/4809—Loop shape
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Abstract
The invention relates to an LED (Light-emitting diode) module based on a metal matrix PCB (Printed Circuit Board) board and a manufacture method thereof. The LED module comprises a heat radiator, a metal matrix PCB board, an LED chip, encapsulation gel, sealing silica gel and a lens module, wherein a pit which is not penetrated is formed inward from an electric layer on the PCB board; the LED chip covers and is loaded at the bottom of the pit and is welded with an electrode welding pad of the electric layer of the metal matrix PCB board by a lead; the LED chip is covered with fluorescent powder; the metal matrix PCB board is adhered with the heat radiator; and the lens module is mounted above the LED chip and the interior of a lens pit on the lens module is filled with the encapsulation gel. The LED chip is welded on a circuit board directly, so that the conventional LED encapsulation process is omitted and a bracket with heat sink is omitted, then the heat radiation effect is improved because the heat of the LED chip is diffused to the circuit board of high heat guide efficiency and the heat radiator directly. Only the encapsulation gel is filled between the lens module and the LED chip, and the filling gel is matched with the index of reflection of the lens module, so that the light extracting rate of the LED module is improved.
Description
Technical field
The present invention relates to semiconductor application and encapsulation field, more particularly, relate to a kind of LED module and manufacturing process thereof based on the Metal Substrate pcb board.
Background technology
Along with led chip technology and Development of Packaging Technology, increasing LED product is applied to lighting field, especially large power white light LED.Because LED has high light efficiency, long-life, energy-conserving and environment-protective, suitable brightness adjustment control, polluter such as not mercurous, becomes the lighting source of new generation after conventional light source such as incandescent lamp, fluorescent lamp.
LED is a kind of electroluminescence semiconductor device, wherein has 30 percent electric energy to convert light into approximately, and dump energy then converts heat into, and the LED temperature that thermal accumlation causes rises, and is the main cause that causes the LED light decay.Thereby the led chip heat radiation is the key issue that the LED encapsulation is devoted to solve, and manufacturer has proposed various packaged types in succession both at home and abroad.
The theory of traditional encapsulation all is to be encapsulated into led chip on the support of device; And the relevant research work of a large amount of encapsulation all center on the support expansion, comprises that hot property, the reflective function of support, the stability of material all become the emphasis of research and drops into huge manpower and materials.
At present, led chip is fixed on support heat sink, forms the LED device, and the LED device places on the Metal Substrate pcb board, and metal substrate places on the radiator.Heat through heat dissipation channels such as heat sink, aluminium bases after radiator spread out.
That is to say, adopt structure as shown in Figure 1 to carry out LED encapsulation and assembling.It is: led chip and heat sink etc. is packaged into LED device 103, and LED device 103 is welded to pcb board 102, and like aluminium base, pcb board 102 is fixed on radiator 101 through modes such as screw or silicone grease.Its passage of heat is: heat is from led chip, and, pcb board 102 inner heat sink through encapsulating and radiator 101 finally are transmitted to air.There is following defective in above-mentioned LED module: because the led chip heat radiation needs the middle interlayer of passage of heat of process many; And LED is heat sink and pcb board 102, pcb board 102 and radiator 101 between medium be air or silicone grease; Middle interlayer thermal conductivity is lower, so heat dispersion is not good.
For general LED application luminaire, light generally will pass through after sending from chip: fluorescent material, package lens, air, light-distribution lens are again to diffuser, and the medium of light process is many, and each interface all reflection loss can take place, and therefore total optical transmittance is low.Thereby, there are shortcomings such as heat dispersion is not good, optical transmittance is low, production process is complicated, cost height.
Summary of the invention
The objective of the invention is to solve problem set forth above, a kind of heat dispersion height, optical transmittance LED module and manufacturing process thereof based on the Metal Substrate pcb board high, with low cost are provided.
Technical scheme of the present invention is such:
A kind of LED module based on the Metal Substrate pcb board comprises radiator, Metal Substrate pcb board, led chip, packing colloid, sealing silica gel and lens module, and described pcb board inwardly has the pit that does not penetrate from electrical layer; Led chip covers and is loaded in described pit bottom, and through the electrode pad of wire bonds to Metal Substrate pcb board electrical layer; Be covered with fluorescent material on the said led chip; Described Metal Substrate pcb board and radiator are fitted; Described lens module is installed in the led chip top, the inner packing colloid of filling of the lens pit on the lens module.
As preferably, described Metal Substrate pcb board comprises electrical layer, insulating barrier, metal level, and in described pit, electrical layer and insulating barrier penetrate, and metal level does not penetrate.
As preferably, described pit surface is the shiny surface of brightening.
As preferably, the shiny surface of described brightening has the coating minute surface.
As preferably, described sealing silica gel comprises the solid silicon cushion rubber that is installed on the lens module, and is coated in the gel silica gel circle that the liquid silica gel in the solid silicon cushion rubber outside forms.
As preferably, on the position on the lens module plane that described solid silicon cushion rubber side is corresponding, have groove, be used for coating liquid silica gel.
As preferably, the lens module is designed with back-off structure, radiator tip upside down on form on the lens module close fixing.
As preferably, led chip is parallel with the LED open-circuit protector.
As preferably, described packing colloid refractive index is between 1.4 to 1.6.
As preferably, the electrical layer of Metal Substrate pcb board is provided with electrode pad, electroplate or gold or nickel.
A kind of manufacturing process of the LED module based on the Metal Substrate pcb board, step is following:
(1) on the Metal Substrate pcb board, leaves the pit that does not penetrate;
(2) coat primer in pit bottom, led chip is fixed on pit bottom, fixing through baking;
(3) will the go between both positive and negative polarity that is welded to led chip respectively and the both positive and negative polarity pad of Metal Substrate pcb board;
(4) the Metal Substrate pcb board is installed on the radiator;
(5) the lens pit at the lens module injects packing colloid;
(6) sealing silica gel is installed on the lens module;
(7), be installed on the lens module (207) of step (6) with the radiator that pcb board is installed of step (4).
As preferably, have fluorescent material on the described led chip.
As preferably; Described led chip does not have fluorescent material; Between described step (3) (4), can also may further comprise the steps: the colloid point that will be mixed with fluorescent material perhaps adopts the technology of dusting that fluorescent powder jet printing is arrived chip surface on chip and through baking-curing; Perhaps paste phosphor sheet at chip surface.
As preferably, between described step (2) (3), can also may further comprise the steps: led chip parallel connection LED open-circuit protector, and be fixed on the Metal Substrate pcb board.
As preferably, described Metal Substrate pcb board is left pit through boring cup technology, and electrical layer and insulating barrier penetrate, and metal level does not penetrate.
As preferably, described pit surface polishing forms the shiny surface of brightening.
As preferably, the shiny surface of described brightening is coated with minute surface coating.
As preferably, the described sealing silica gel of step (6) comprises the solid silicon cushion rubber that is installed on the lens module, and is coated in the gel silica gel circle that the liquid silica gel of solid silicon cushion rubber side forms.
As preferably, on the position on the lens module plane that described solid silicon cushion rubber side is corresponding, have groove, be used for coating liquid silica gel.
As preferably, on the described lens module back-off structure is arranged, radiator tips upside down on the lens module, fixes through described back-off structure, forms the LED module of sealing.
Beneficial effect of the present invention is following:
At first; The theory of traditional encapsulation all is to be encapsulated into led chip on the support of device, and the relevant research work of a large amount of encapsulation all center on the support expansion, and the stability that comprises hot property, reflective function, the material of support all becomes the emphasis of research and drops into huge manpower and materials and the present invention has jumped out the set of this thoughtcast; Casted off the support of LED device once and for all; Led chip directly is encapsulated on the pcb board, has omitted to include heat sink support, and the heat that makes led chip is without heat sink this intermediate layer; Directly be diffused into the pcb board and the radiator of high thermal conductivity, good heat dissipation effect.
Secondly, between lens module and the led chip, the filling colloid is only arranged; And fill the colloid refractive index between 1.4 and 1.6, and light is few through medium, and transmitance is high; And fill the refractive index match of colloid and lens module, reflection loss is few, has improved the light extraction efficiency of LED module.
Moreover the lens module pours into the filling colloid, and fills with whole lens module inner chamber, curing molding, or directly be to pour into the filling colloid earlier, back-off is fastening again, does not all have knockout course, does not damage lead.
In addition, it is few that the LED module comprises parts, and production process is simple, and is with low cost.
Description of drawings
Fig. 1 is the encapsulation exemplary plot of existing LED device;
Fig. 2 is the embodiment sketch map of LED module of the present invention;
Fig. 3 forms and the bowl configurations sketch map for pcb board of the present invention;
Fig. 4 forms and the bowl configurations profile for pcb board of the present invention;
Fig. 5 is the section of structure of lens module of the present invention;
Among the figure, the 101st, radiator, the 102nd, pcb board, the 103rd, LED device; The 201st, radiator, the 202nd, Metal Substrate pcb board, the 203rd, led chip, the 204th, LED open-circuit protector; The 206th, sealing silica gel, the 207th, lens module, the 301st, metal level, the 302nd, insulating barrier; The 303rd, electrical layer, the 401st, lens pit, the 402nd, back-off structure.
Embodiment
Below in conjunction with accompanying drawing embodiments of the invention are further elaborated:
A kind of LED module based on the Metal Substrate pcb board; Comprise radiator 201, Metal Substrate pcb board 202, led chip 203, packing colloid, sealing silica gel 206 and lens module 207, described Metal Substrate pcb board 202 inwardly has the pit that does not penetrate from electrical layer 303; Led chip 203 covers and is loaded in described pit bottom, and through the electrode pad of wire bonds to Metal Substrate pcb board 202 electrical layer 303; Be covered with fluorescent material on the said led chip 203; Described Metal Substrate pcb board 202 is fitted with radiator 201; Described lens module 207 is installed in led chip 203 tops, the lens pit 401 inner packing colloids of filling on the lens module 207.
Described Metal Substrate pcb board 202 comprises electrical layer 303, insulating barrier 302, metal level 301, and in described pit, electrical layer 303 penetrates with insulating barrier 302, and metal level 301 does not penetrate.
Form perforation in the electrical layer 303 of Metal Substrate pcb board with insulating barrier 302 through boring cup technology; And the pit that does not penetrate is set at the metal level of said Metal Substrate pcb board 301; Led chip 203 directly covers and is loaded on the said pit base that does not penetrate; And through the electrode pad of wire bonds to Metal Substrate pcb board 202 electrical layer 303, said Metal Substrate pcb board 202 fits tightly with the form that face contacts with radiator 201, and said lens module 207 covers on led chip 203; The lens pit 401 inner filling packing colloids of lens module 207, and through sealing silica gel 206 and Metal Substrate pcb board 202 and radiator 201 formation hermetically-sealed constructions.
The angle on the wall of described pit and pit bottom plane be 90 spend to 120 the degree between.
Described pit surface is the shiny surface of brightening.
The shiny surface of described brightening has the coating minute surface.
For Metal Substrate pcb board 202; Through boring cup technology at the electrical layer 303 of Metal Substrate pcb board 202 and the wall of cup of the perforation formation of insulating barrier 302 formation; Form taper seat with the wall of cup of metal level 301 pits; The wall of cup of this taper seat and the horizontal plane of pit bottom form the angle between 90 degree～120 degree, and the wall of cup of this taper seat through bore cup technology be polished into can be reflective shiny surface, perhaps plate silver and carry out reflective.The face that described perforation wall of cup and pit wall of cup form can be other shapes except taper seat, and like platform shape, multiaspect column, cylindric, the face that is become is by processing technology and the requirement of the angle of bore a hole wall of cup and pit bottom surface decided.
Described Metal Substrate pcb board 202 is fitted with the form that face contacts with radiator 201.
Described sealing silica gel 206 comprises the solid silicon cushion rubber that is installed on the lens module 207, and the gel silica gel circle that is coated in the liquid silica gel formation of solid silicon cushion rubber side.On the position on lens module 207 planes that described solid silicon cushion rubber side is corresponding, have groove, be used for coating liquid silica gel.Described lens module 207 has an integral planar; Obviously see it being that lens pit 401 is (if turnback is seen one by one on the plane; Be exactly protruding lens), this position, edge, plane is enclosed a solid silicon cushion rubber earlier, on lens module 207 planes of solid silicon cushion rubber side correspondence; One circle groove is arranged, be used for coating liquid silica gel.Certainly, also groove can be set, directly coat liquid silica gel.
Led chip 203 is parallel with LED open-circuit protector 204, and it act as open-circuit-protection and antistatic.
Described packing colloid refractive index is between 1.4 to 1.6.
The electrical layer 303 of Metal Substrate pcb board 202 is provided with electrode pad, electroplate or gold or nickel.
A kind of manufacturing process of the LED module based on the Metal Substrate pcb board, step is following:
(1) on Metal Substrate pcb board 202, leaves the pit that does not penetrate;
(2) coat primer in pit bottom, led chip 203 is fixed on pit bottom, fixing through baking;
(3) will the go between both positive and negative polarity that is welded to led chip 203 respectively and the both positive and negative polarity pad of Metal Substrate pcb board 202;
(4) Metal Substrate pcb board 202 is installed on the radiator 201;
(5) inject packing colloid at lens pit 401 places of lens module 207;
(6) sealing silica gel 206 is installed on lens module 207;
(7), be installed on the lens module (207) of step (6) with the radiator that pcb board 202 is installed of step (4).
Have fluorescent material on the described led chip.
Another kind of technical scheme: described led chip 203 does not have fluorescent material, between described step (3) (4), can also may further comprise the steps: fluorescent material is carried on the led chip 203 that does not have fluorescent material.Specifically can with the colloid point that is mixed with fluorescent material on chip and, perhaps adopt the technology of dusting that fluorescent powder jet printing is arrived chip surface through baking-curing; Perhaps paste phosphor sheet at chip surface.
Between described step (2) (3), can also may further comprise the steps: led chip 203 parallel connection LED open-circuit protectors 204, and be fixed on the Metal Substrate pcb board 202.
Described Metal Substrate pcb board 202 is left pit through boring cup technology, and electrical layer 303 penetrates with insulating barrier 302, and metal level 301 does not penetrate.
The angle on the wall of described pit and pit bottom plane be 90 spend to 120 the degree between.
Described pit surface polishing forms the shiny surface of brightening.
The shiny surface of described brightening is coated with minute surface coating.
The described sealing silica gel 206 of step (6) comprises the solid silicon cushion rubber that is installed on the lens module 207, and the gel silica gel circle that is coated in the liquid silica gel formation of solid silicon cushion rubber side.
On the position on lens module 207 planes that described solid silicon cushion rubber side is corresponding, have groove, be used for coating liquid silica gel.
On the described lens module 207 back-off structure 402 is arranged, radiator tips upside down on the lens module 207, fixes through described back-off structure 402, forms the LED module of sealing.
The application's core is: existing LED module, often led chip is fixed on support heat sink, and be packaged into the LED device; The LED device is welded on different pcb boards; Be installed to again on the radiator, form Different products, to adapt to more wider application scenarios; And become industry technology prejudice, and the frame mode of this LED module exists shortcomings such as heat dispersion is not good enough, optical transmittance is low, parts complicacy.The application is directly carried led chip and is overlayed on the pcb board substrate, and adopts lens module once light-distribution, has reached the light extraction efficiency of better radiating effect and Geng Gao, and has solved led chip and carry the encapsulation problem that overlays on the pcb board.
Embodiment
As shown in Figure 2, a kind of LED module comprises: radiator 201, Metal Substrate pcb board 202, led chip 203, LED open-circuit protector 204, packing colloid, sealing silica gel 206, lens module 207.
LED open-circuit protector 204 is parallelly connected with led chip 203, and it act as open-circuit-protection and antistatic.The LED open-circuit protector 204 of present embodiment adopts zener diode.
Metal Substrate pcb board 202 comprises metal level 301, insulating barrier 302, electrical layer 303; Electrical layer 303, especially electrode pad place are coated with silver, nickel or gold, and it act as the raising reflectivity, strengthens light effect.
Like Fig. 3, shown in Figure 4, Metal Substrate pcb board 202 covers and carries led chip 203 places, and pit is set; Pit bottom does not comprise insulating barrier 302 and electrical layer 303 on metal level 301.Form perforation in the electrical layer 303 of Metal Substrate pcb board with insulating barrier 302 through boring cup technology; And at the metal level 301 of said Metal Substrate pcb board; Led chip 203 directly covers and is loaded on the said pit base that does not penetrate; And through the electrode pad of wire bonds to Metal Substrate pcb board 202 electrical layer 303, said Metal Substrate pcb board 202 fits tightly with the form that face contacts with radiator 201, and said lens module 207 covers on led chip 203; The lens pit 401 inner filling packing colloids of lens module 207, and through sealing silica gel 206 and Metal Substrate pcb board 202 and radiator 201 formation hermetically-sealed constructions.
The wall of cup that forms in the perforation of electrical layer of Metal Substrate pcb board 303 and insulating barrier 302 forms taper seat with the wall of cup of metal level 301 pits, and the wall of cup of this taper seat and the horizontal plane of pit bottom form the angle of 90 degree～120 between spending; The wall of cup of this taper seat through minute surface brightening technology be polished into can be reflective shiny surface, perhaps the shiny surface after brightening plates silver, or other have the metal of reflecting effect to carry out reflective.
The face that described perforation wall of cup and pit wall of cup form can be other shapes except taper seat, and like platform shape, multiaspect column, cylindric, the face that is become is by processing technology and the requirement of the angle of bore a hole wall of cup and pit bottom surface decided.
It act as the optics luminous intensity distribution said lens module 207, its be shaped as circle, square, oval, or with the different shape of optics light distribution requirements design.
As shown in Figure 5, a said lens module 207 comprises back-off structure 402, and present embodiment can have eight back-off structure 402, is buckled on the radiator 201.
From the above; Led chip 203 can directly be encapsulated on the metal level 301 of Metal Substrate pcb board 202; Do not have electrical layer 303 and insulating barrier 302, the heat of led chip 203 is directly transferred to Metal Substrate pcb board 202 and radiator 201, does not pass through the LED packaging heat sink; And LED is heat sink and the air dielectric of Metal Substrate pcb board 202, has promoted radiating effect greatly.
In addition, the light that led chip 203 sends directly transmits through filling colloid and lens module 207, do not have secondary lens or diffuser, thereby light extraction efficiency is high.
A kind of manufacturing process of the LED module based on Metal Substrate pcb board 202, step is following:
(1) forms perforation and the pit that does not penetrate is set at the electrical layer 303 of Metal Substrate pcb board and insulating barrier 302 through boring cup technology at the metal level 301 of said Metal Substrate pcb board; The wall of cup that forms in the perforation of electrical layer of Metal Substrate pcb board 303 and insulating barrier 302; Form taper seat with the wall of cup of metal level 301 pits, the wall of cup of this taper seat and the horizontal plane of pit bottom form the angle between 90 degree～120 degree;
(2) wall of cup of this taper seat through minute surface brightening technology be polished into can be reflective shiny surface, perhaps the shiny surface after brightening plates silver and carries out reflective;
(3) coat primer in the pit bottom of Metal Substrate pcb board 202, led chip 203 is fixed on pit bottom, fixing through baking;
(4) will the go between both positive and negative polarity that is welded to led chip 203 respectively and the both positive and negative polarity pad of Metal Substrate pcb board 202;
(5) with the Zener diode of parallel connection, through with step (3), (4) consistent technology, be fixed on the Metal Substrate pcb board 202;
(6) fluorescent material is carried on the led chip 203; The used method of present embodiment is: the colloid point that will be mixed with fluorescent material is on led chip 203 and through baking-curing.Also can adopt the technology of dusting that fluorescent powder jet printing is arrived led chip 203 surfaces; Perhaps paste phosphor sheet on led chip 203 surfaces.Fluorescent material has been arranged on the led chip 203, and this step is omitted;
(7) again Metal Substrate pcb board 202 is fastened on the radiator 201;
(8) on lens module 207, click and enter the filling colloid, colloid and lens module 207 horizontal planes maintain an equal level or a little more than lens module 207 horizontal planes;
(9) the solid silicone sealing ring of moulding is placed in the inboard around lens module 207 planes, has in the outside all around on lens module 207 planes to be coated with last layer liquid seal silica gel 206 in the corresponding groove, and makes liquid seal silica gel 206 natural air dryings;
(10) behind completing steps (9), immediately with the radiator that is fixed with Metal Substrate pcb board 202 201 of step (7), tip upside down on the lens module 207 of step (9), and fixing by back-off structure 402, form the LED module that seals.
The back-off structure 402 here plays the corresponding correction relationship in position that makes LED device and lens.
Above-described only is preferred implementation of the present invention; Should be pointed out that the those of ordinary skill in the art, under the prerequisite that does not break away from core technology characteristic of the present invention; Can also make some improvement and retouching, these improvement and retouching also should be regarded as protection scope of the present invention.
Claims (19)
1. LED module based on the Metal Substrate pcb board; Comprise radiator (201), Metal Substrate pcb board (202), led chip (203), packing colloid, sealing silica gel (206) and lens module (207); It is characterized in that described Metal Substrate pcb board (202) inwardly has the pit that does not penetrate from electrical layer (303); Led chip (203) covers and is loaded in described pit bottom, and through the electrode pad of wire bonds to Metal Substrate pcb board (202) electrical layer (303); Said led chip is covered with fluorescent material on (203); Described Metal Substrate pcb board (202) is fitted with radiator (201); Described lens module (207) is installed in led chip (203) top, the inner packing colloid of filling of the lens pit (401) on the lens module (207).
2. the LED module based on the Metal Substrate pcb board according to claim 1; It is characterized in that; Described Metal Substrate pcb board (202) comprises electrical layer (303), insulating barrier (302), metal level (301); In described pit, electrical layer (303) and insulating barrier (302) penetrate, and metal level (301) does not penetrate.
3. the LED module based on the Metal Substrate pcb board according to claim 2 is characterized in that described pit surface is the shiny surface of brightening.
4. the LED module based on the Metal Substrate pcb board according to claim 3 is characterized in that the shiny surface of described brightening has the coating minute surface.
5. the LED module based on the Metal Substrate pcb board according to claim 1; It is characterized in that; Described sealing silica gel (206) comprises the solid silicon cushion rubber that is installed on the lens module (207), and the gel silica gel circle that is coated in the liquid silica gel formation of solid silicon cushion rubber side.
6. the LED module based on the Metal Substrate pcb board according to claim 5 is characterized in that, on the position on lens module (207) plane that described solid silicon cushion rubber side is corresponding, has groove, is used for coating liquid silica gel.
7. according to claim 1 or 5 or 6 described LED modules based on the Metal Substrate pcb board, it is characterized in that lens module (207) is designed with back-off structure (402), radiator (201) tips upside down on the last formation of lens module (207) and closes fixing.
8. the LED module based on the Metal Substrate pcb board according to claim 1 is characterized in that led chip (203) is parallel with LED open-circuit protector (204).
9. the LED module based on the Metal Substrate pcb board according to claim 1 is characterized in that, the electrical layer (303) of Metal Substrate pcb board (202) is provided with electrode pad, electroplate or gold or nickel.
10. manufacturing process based on the LED module of Metal Substrate pcb board is characterized in that step is following:
(1) on Metal Substrate pcb board (202), leaves the pit that does not penetrate;
(2) coat primer in pit bottom, led chip (203) is fixed on pit bottom, fixing through baking;
(3) will the go between both positive and negative polarity that is welded to led chip (203) respectively and the both positive and negative polarity pad of Metal Substrate pcb board (202);
(4) Metal Substrate pcb board (202) is installed on the radiator (201);
(5) locate to inject packing colloid at the lens pit (401) of lens module (207);
(6) sealing silica gel (206) is installed on lens module (207);
(7), be installed on the lens module (207) of step (6) with the radiator that pcb board (202) are installed of step (4).
11. the manufacturing process of the LED module based on the Metal Substrate pcb board according to claim 10 is characterized in that described led chip has fluorescent material on (203).
12. the manufacturing process of the LED module based on the Metal Substrate pcb board according to claim 10; It is characterized in that; Described led chip (203) does not have fluorescent material; Between described step (3) (4), can also may further comprise the steps: the colloid point that will be mixed with fluorescent material perhaps adopts the technology of dusting that fluorescent powder jet printing is arrived chip surface on chip and through baking-curing; Perhaps paste phosphor sheet at chip surface.
13. the manufacturing process of the LED module based on the Metal Substrate pcb board according to claim 10; It is characterized in that; Between described step (2) (3), can also may further comprise the steps: led chip (203) parallel connection LED open-circuit protector (204), and be fixed on the Metal Substrate pcb board (202).
14. the manufacturing process of the LED module based on the Metal Substrate pcb board according to claim 10; It is characterized in that; Described Metal Substrate pcb board (202) is left pit through boring cup technology, and electrical layer (303) and insulating barrier (302) penetrate, and metal level (301) does not penetrate.
15. the manufacturing process of the LED module based on the Metal Substrate pcb board according to claim 10 is characterized in that, described pit surface polishing forms the shiny surface of brightening.
16. the manufacturing process of the LED module based on the Metal Substrate pcb board according to claim 15 is characterized in that the shiny surface of described brightening is coated with minute surface coating.
17. the manufacturing process of the LED module based on the Metal Substrate pcb board according to claim 10; It is characterized in that; The described sealing silica gel of step (6) (206) comprises the solid silicon cushion rubber that is installed on the lens module (207), and the gel silica gel circle that is coated in the liquid silica gel formation of solid silicon cushion rubber side.
18. the manufacturing process of the LED module based on the Metal Substrate pcb board according to claim 17 is characterized in that, on the position on lens module (207) plane that described solid silicon cushion rubber side is corresponding, has groove, is used for coating liquid silica gel.
19. the manufacturing process of the LED module based on the Metal Substrate pcb board according to claim 10; It is characterized in that; Back-off structure (402) is arranged on the described lens module (207); Radiator tips upside down on the lens module (207), and is fixing through described back-off structure (402), forms the LED module of sealing.
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| Application Number | Priority Date | Filing Date | Title |
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| CN2011101648639A CN102412246A (en) | 2011-06-17 | 2011-06-17 | LED (Light-emitting diode) module based on metal matrix PCB (Printed Circuit Board) board and manufacture method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2011101648639A CN102412246A (en) | 2011-06-17 | 2011-06-17 | LED (Light-emitting diode) module based on metal matrix PCB (Printed Circuit Board) board and manufacture method thereof |
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| CN102412246A true CN102412246A (en) | 2012-04-11 |
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| CN102916111A (en) * | 2012-10-19 | 2013-02-06 | 杨勇平 | LED (light-emitting diode) integrated light source substrate and producing method thereof |
| CN103943038A (en) * | 2014-04-03 | 2014-07-23 | 吴光 | Outdoor display unit module based on integrated series unit board |
| CN108617091A (en) * | 2018-05-30 | 2018-10-02 | 太龙（福建）商业照明股份有限公司 | A kind of on-plane surface pcb board |
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