CN110600600A - LED waterproof packaging structure and packaging process - Google Patents
LED waterproof packaging structure and packaging process Download PDFInfo
- Publication number
- CN110600600A CN110600600A CN201910810152.0A CN201910810152A CN110600600A CN 110600600 A CN110600600 A CN 110600600A CN 201910810152 A CN201910810152 A CN 201910810152A CN 110600600 A CN110600600 A CN 110600600A
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- led
- packaging
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- heat dissipation
- plate
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Abstract
The invention discloses a waterproof LED packaging structure and a packaging process, and particularly relates to the field of LED packaging, which comprises a packaging shell, wherein an external lens is arranged at the top of the packaging shell, a metal heat dissipation plate is arranged in an inner cavity of the packaging shell, a plurality of screws are arranged on the outer side and the bottom of the packaging shell, and a circuit bottom plate is arranged at the bottom of the metal heat dissipation plate; the LED heat dissipation plate is characterized in that a plurality of LED inner packaging bodies are arranged at the top of the metal heat dissipation plate, each LED inner packaging body comprises a base, a heat sink is fixedly embedded in the middle of each base, a connecting cushion block is fixedly arranged at the bottom of each heat sink, connecting pins are fixedly arranged inside the connecting cushion block, and an insulating cushion layer is sleeved outside the connecting pins. According to the invention, the air pressure rising inside the air cavity is utilized to prevent external water vapor from entering the air cavity, so that the LED chip and the electrode are corroded, the service life of the LED lamp is prolonged, and the waterproof performance of the LED packaging structure is improved.
Description
Technical Field
The invention relates to the field of LED packaging, in particular to a waterproof LED packaging structure and a waterproof LED packaging process.
Background
Light emitting diodes are referred to as LEDs for short. Is made of a compound containing gallium (Ga), arsenic (As), phosphorus (P), nitrogen (N), etc. An LED (Light-emitting diode) is widely used in the fields of indication, display, and the like due to its advantages of long life, low power consumption, and the like. Reliability, stability and high light extraction are factors that must be considered in replacing existing illumination sources with LEDs.
Most comparatively simple of current LED packaging structure mostly utilizes the structure of simple solid crystal glue cooperation lens to encapsulate, leads to LED chip's sealing performance not enough, and at the in-process that uses, outside steam invades LED chip easily, leads to LED chip's life to reduce, damages easily.
Disclosure of Invention
In order to overcome the above-mentioned drawbacks of the prior art, embodiments of the present invention provide a waterproof LED package structure, the expansion glue expands by utilizing the heat generated by the LED chip in the working process, the gas in the gas cavity is extruded, the gas pressure in the gas cavity is increased, a sealing seat and a sealing cover are arranged at the joint of the plastic lens and the insulating layer, the inner parts of the sealing seat and the sealing cover are connected with the outer part of the plastic lens, then the connecting lead is connected with the connecting pin through the expansion glue, the metal trough plate and the heat sink, the integrity of the plastic lens and the insulating layer is ensured, the sealing performance of the plastic lens and the air cavity is improved, the outside water vapor is prevented from entering the air cavity by utilizing the raised air pressure in the air cavity, therefore, the LED chip and the electrode are corroded, the service life of the LED lamp is prolonged, and the waterproof performance of the LED packaging structure is improved.
In order to achieve the purpose, the invention provides the following technical scheme: a waterproof LED packaging structure and a packaging process comprise a packaging shell, wherein an external lens is arranged at the top of the packaging shell, a metal heat dissipation plate is arranged in an inner cavity of the packaging shell, a plurality of screws are arranged on the outer side and the bottom of the packaging shell, and a circuit bottom plate is arranged at the bottom of the metal heat dissipation plate;
the LED heat dissipation plate comprises a metal heat dissipation plate body, and is characterized in that a plurality of LED inner packaging bodies are arranged at the top of the metal heat dissipation plate body, each LED inner packaging body comprises a base, a heat sink is fixedly embedded in the middle of each base, a connecting cushion block is fixedly arranged at the bottom of each heat sink, connecting pins are fixedly arranged in the connecting cushion blocks, insulating cushion layers are sleeved outside the connecting pins, and insulating layers are fixedly sleeved at the edges of the tops of the heat sinks;
the LED lamp comprises a metal trough plate, a fixing base, LED chips and electrodes, wherein the metal trough plate is provided with a heat dissipation groove, the middle part of the metal trough plate is fixedly embedded with the fixing base, the top end of the fixing base is sunken, the sunken part at the top end of the fixing base is welded with the LED chips and the electrodes, and the number of the electrodes is two and is symmetrically arranged through the LED chips;
the LED chip comprises an electrode, a fluorescent powder layer, an expansion glue, a plastic lens and a power supply, wherein the electrode is fixedly connected with a connecting wire, the top of the LED chip is provided with the fluorescent powder layer, the top of the fluorescent powder layer is fixedly provided with the expansion glue, the outside of the expansion glue is provided with an air cavity, the outside of the air cavity is provided with the plastic lens, and the top of the plastic lens is attached to;
the metal heat dissipation plate is provided with a first connecting groove, and the bottom of the first connecting groove is provided with a second connecting groove;
the circuit bottom plate is provided with a spring telescopic rod, and the top of the spring telescopic rod is provided with an electrode gasket.
In a preferred embodiment, a sealing seat is fixedly arranged at the top of the base, a sealing cover is fixedly arranged at the top of the sealing seat, the sealing seat is sleeved outside the insulating layer and the plastic lens, the sealing cover is sleeved outside the plastic lens, and the sealing cover is clamped with the sealing seat.
In a preferred embodiment, the screw on the outer side of the package shell penetrates through the package shell and extends to the inside of the side wall of the metal heat dissipation plate, the screw on the bottom of the package shell penetrates through the color of the package shell and extends to the bottom of the circuit bottom plate, and the metal heat dissipation plate and the circuit bottom plate are detachably connected with the package shell through the screw.
In a preferred embodiment, a heat conducting adhesive is arranged between the LED inner package and the metal heat dissipation plate, the heat sink and the base are both connected with the metal heat dissipation plate through the heat conducting adhesive, and the sum of the thickness of the heat conducting adhesive and the thickness of the first connecting groove is the same as the thickness of the connecting cushion block.
In a preferred embodiment, the number of the connection cushion block, the first connection groove, the second connection groove, the connection pins, the spring telescopic rod and the electrode gasket are the same, the first connection groove and the second connection groove are integrally arranged, the bottom of the connection cushion block is attached to the inner wall of the first connection groove, the connection pins penetrate through the connection cushion block, and the bottom ends of the connection pins are inserted into the top of the inner cavity of the second connection groove.
In a preferred embodiment, the top end of the spring telescopic rod extends to the bottom of the inner cavity of the second connecting groove, the electrode pad is arranged right below the connecting pin, the top of the electrode pad is attached to the bottom of the connecting pin, and the connecting wire sequentially penetrates through the fluorescent powder layer, the expansion glue, the metal groove plate, the heat sink and the insulating cushion layer to be connected with the top end of the connecting pin.
In a preferred embodiment, the bottom of the expansion glue is fixedly connected with the phosphor layer and the metal groove plate, the air cavity is arranged among the plastic lens, the metal groove plate and the phosphor layer, nitrogen is filled in the air cavity, and the bottom of the plastic lens is fixedly connected with the insulating layer and the top of the metal groove plate.
A packaging process of an LED waterproof structure specifically comprises the following steps:
fixing a circuit bottom plate at the bottom of an encapsulation shell by using screws, forming a first connecting groove in a position, corresponding to a spring telescopic rod on the circuit bottom plate, on a metal heat dissipation plate, forming a second connecting groove in the top of the first connecting groove, then sleeving the metal heat dissipation plate on the top of the circuit bottom plate, inserting the spring telescopic rod into the first connecting groove, and fixing the metal heat dissipation plate by using the screws;
welding a fixed base provided with an LED chip on a heat sink, sleeving a metal groove plate outside the fixed base and welding, sleeving a plastic lens outside the metal groove plate, forming an air cavity between the plastic lens and expansion glue, filling nitrogen into the air cavity by using an inflating device, bonding a sealing seat on the top of a base after the LED inner packaging body is packaged by using an LED packaging production line, and clamping a sealing cover on the top of the sealing seat to complete the assembly of the LED inner packaging body;
thirdly, at the joint of the LED inner packaging body and the metal heat dissipation plate, sequentially dispensing heat-conducting glue on the surface of the metal heat dissipation plate by using a glue dispenser to form heat-conducting glue, aligning a connecting pin at the bottom of the LED inner packaging body to a second connecting groove on the metal heat dissipation plate, inserting the connecting pin into the second connecting groove, placing a connecting cushion block in the first connecting groove, pressing the LED inner packaging body to enable the base and the heat sink to be bonded with the heat-conducting glue on the metal heat dissipation plate, so that the LED packaging body is fixed in the packaging shell, and at the moment, the bottom end of the connecting pin is connected with the electrode gasket;
and step four, fixing the external lens on the top of the packaging shell, and pressing the bottom of the external lens outside the plastic lens to complete packaging.
The invention has the technical effects and advantages that:
1. the heat generated by the LED chip in the working process is utilized to expand the expansion glue and extrude the gas in the gas cavity, so that the gas pressure in the gas cavity is increased, the sealing seat and the sealing cover are arranged at the joint of the plastic lens and the insulating layer, the interiors of the sealing seat and the sealing cover are both connected with the exterior of the plastic lens, and then the connecting lead is connected with the connecting pin through the expansion glue, the metal trough plate and the heat sink, so that the integrity of the plastic lens and the insulating layer is ensured, the sealing performance of the plastic lens and the gas cavity is improved, and the increased gas pressure in the gas cavity is utilized to prevent external water vapor from entering the gas cavity, so that the LED chip and the electrode are corroded, the service life of the LED lamp is prolonged, and the waterproof performance of the LED packaging structure is improved;
2. when the LED inner packaging body is packaged, the heat-conducting adhesive between the LED inner packaging body and the metal heat dissipation plate can be extruded, the connection strength between the LED inner packaging body and the packaging shell is enhanced, a gap between the bottom of the heat sink and the metal heat dissipation plate is isolated from the space inside the packaging shell, an insulating layer is welded between the base and the heat sink, and a sealing seat is fixedly arranged outside the insulating layer, so that the heat sink, the gap between the base and the metal heat dissipation plate can be sealed, and external water vapor is reduced from entering the heat sink part;
3. the external lens is pressed on the top of the plastic lens, so that the plastic lens is fixed on the top of the LED inner packaging body, and the sealing performance of the LED inner packaging body can be greatly enhanced by utilizing the double-layer packaging structure of the packaging shell and the LED inner packaging body, and the service life of the LED lamp is further prolonged.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention.
FIG. 2 is a schematic cross-sectional view taken along line A-A of FIG. 1 according to the present invention.
Fig. 3 is a schematic view of the structure of the LED inner package according to the present invention.
Fig. 4 is a schematic diagram of a detailed structure at B in fig. 2 according to the present invention.
Fig. 5 is a schematic diagram of a detailed structure at C in fig. 2 according to the present invention.
Fig. 6 is a schematic view of a partial structure of an LED inner package according to the present invention.
Fig. 7 is a schematic diagram of the internal structure of the package housing according to the present invention.
The reference signs are: the LED packaging structure comprises a packaging shell 1, an external lens 2, a metal heat dissipation plate 3, a circuit bottom plate 4, an LED internal packaging body 5, a base 6, a heat sink 7, a connecting cushion block 8, a connecting pin 9, an insulating cushion layer 10, an insulating layer 11, a heat dissipation groove 12, a fixing base 13, an LED chip 14, electrodes 15, connecting wires 16, a fluorescent powder layer 17, expansion glue 18, an air cavity 19, a plastic lens 20, a first connecting groove 21, a second connecting groove 22, a spring telescopic rod 23, an electrode gasket 24, a sealing seat 25, a sealing cover 26, a heat conduction adhesive 27 and a metal groove plate 28.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The LED waterproof packaging structure shown in fig. 1-5 comprises a packaging shell 1, wherein an external lens 2 is arranged at the top of the packaging shell 1, a metal heat dissipation plate 3 is arranged in an inner cavity of the packaging shell 1, a plurality of screws are arranged at the outer side and the bottom of the packaging shell 1, and a circuit bottom plate 4 is arranged at the bottom of the metal heat dissipation plate 3;
the LED heat dissipation structure is characterized in that a plurality of LED inner packaging bodies 5 are arranged at the top of the metal heat dissipation plate 3, each LED inner packaging body 5 comprises a base 6, a heat sink 7 is fixedly embedded in the middle of each base 6, a connecting cushion block 8 is fixedly arranged at the bottom of each heat sink 7, a connecting pin 9 is fixedly arranged in each connecting cushion block 8, an insulating cushion layer 10 is sleeved outside each connecting pin 9, and an insulating layer 11 is fixedly sleeved at the edge of the top of each heat sink 7;
the metal groove plate 28 is provided with a heat dissipation groove 12, the middle part of the metal groove plate 28 is fixedly embedded with a fixed base 13, the top end of the fixed base 13 is arranged in a concave manner, the concave part at the top end of the fixed base 13 is welded with an LED chip 14 and electrodes 15, and the number of the electrodes 15 is two and is symmetrically arranged through the LED chip 14;
the electrode 15 is fixedly connected with a connecting wire 16, the top of the LED chip 14 is provided with a fluorescent powder layer 17, the top of the fluorescent powder layer 17 is fixedly provided with an expansion glue 18, the outside of the expansion glue 18 is provided with an air cavity 19, the outside of the air cavity 19 is provided with a plastic lens 20, and the top of the plastic lens 20 is attached to the bottom of the external lens 2;
a first connecting groove 21 is formed in the metal heat dissipation plate 3, and a second connecting groove 22 is formed in the bottom of the first connecting groove 21;
the circuit board 4 is provided with the spring telescopic rod 23, the top of the spring telescopic rod 23 is provided with the electrode pad 24, the connecting pin 9 is inserted into the second connecting groove 22, the electrode pad 24 is fixedly installed on the circuit board 4 by using the spring telescopic rod 23, connection of the electrode pad 24 left by the connecting pin 9 is facilitated, certain size error and installation error of the circuit board 4 and the metal heat dissipation plate 3 are allowed, and difficulty of a packaging process is reduced.
The implementation mode is specifically as follows: in the working process, the circuit bottom plate 4 is externally connected with a power supply to supply power to the LED inner packaging body 5 in the packaging shell 1, when the LED inner packaging body 5 is packaged in the packaging shell 1, the bottom ends of the connecting pins 9 are inserted in the second connecting grooves 22, the bottom ends of the connecting pins 9 are abutted against the electrode pads 24, the electrode pads 24 are extruded by the connecting pins 9 to push the spring telescopic rods 23 to contract for self-adaptation, the connecting wires 16 at the top ends of the connecting pins 9 are connected with the electrodes 15 at two sides of the LED chip 14 to complete the power supply to the LED chip 14, so that the LED chip 14 emits light, the LED inner packaging body 5 extrudes the heat-conducting adhesive 27 between the LED inner packaging body 5 and the metal heat-radiating plate 3 in the packaging process, the connecting strength between the LED inner packaging body 5 and the packaging shell 1 is enhanced, and the gap between the bottom of the heat sink 7 and the metal heat-radiating plate 3 is isolated from the space, meanwhile, an insulating layer 11 is welded between the base 6 and the heat sink 7, and a sealing seat 25 is fixedly arranged outside the insulating layer 11, so that gaps among the heat sink 7, the base 6 and the metal heat dissipation plate 3 are sealed, and external water vapor is reduced from entering the heat sink 7.
As shown in fig. 1-7, a sealing seat 25 is fixedly arranged at the top of the base 6, a sealing cover 26 is fixedly arranged at the top of the sealing seat 25, the sealing seat 25 is sleeved outside the insulating layer 11 and the plastic lens 20, the sealing cover 26 is sleeved outside the plastic lens 20, the sealing cover 26 is clamped with the sealing seat 25, a screw on the outer side of the package housing 1 penetrates through the package housing 1 and extends to the inside of the side wall of the metal heat dissipation plate 3, a screw on the bottom of the package housing 1 penetrates through the color of the package housing 1 and the bottom of the circuit board 4, and the metal heat dissipation plate 3 and the circuit board 4 are detachably connected with the package housing 1 through screws;
a heat conducting adhesive 27 is arranged between the LED inner packaging body 5 and the metal heat dissipation plate 3, the heat sink 7 and the base 6 are connected with the metal heat dissipation plate 3 through the heat conducting adhesive 27, the sum of the thickness of the heat conducting adhesive 27 and the thickness of the first connecting groove 21 is the same as that of the connecting cushion block 8, the first connecting groove 21, the second connecting groove 22, the connecting pins 9, the spring telescopic rod 23 and the electrode gasket 24 are the same in number, the first connecting groove 21 and the second connecting groove 22 are integrally arranged, the bottom of the connecting cushion block 8 is attached to the inner wall of the first connecting groove 21, the connecting pins 9 penetrate through the connecting cushion block 8, and the bottom ends of the connecting pins 9 are inserted into the top of the inner cavity of the second connecting groove 22;
the top end of the spring telescopic rod extends to the bottom of an inner cavity of the second connecting groove 22, the electrode gasket 24 is arranged right below the connecting pin 9, the top of the electrode gasket 24 is attached to the bottom of the connecting pin 9, the connecting wire 16 sequentially penetrates through the fluorescent powder layer 17, the expansion glue 18, the metal groove plate 28, the heat sink 7 and the insulating cushion layer 10 to be connected with the top end of the connecting pin 9, the bottom of the expansion glue 18 is fixedly connected with the fluorescent powder layer 17 and the metal groove plate 28, the air cavity 19 is arranged among the plastic lens 20, the metal groove plate 28 and the fluorescent powder layer 17, nitrogen is filled in the air cavity 19, and the bottom of the plastic lens 20 is fixedly connected with the insulating layer 11 and the top of the metal groove plate 28.
The implementation mode is specifically as follows: in the process of electrifying and lighting the LED chip 14, the LED chip 14 generates heat which is radiated to the outside through the fixed base 13, the metal groove plate 28 and the fluorescent powder layer 17, in the process, the expansion glue 18 is heated to expand to extrude the gas in the air cavity 19, so that the air pressure in the air cavity 19 is raised, the sealing seat 25 and the sealing cover 26 are also arranged at the joint of the plastic lens 20 and the insulating layer 11, the interiors of the sealing seat 25 and the sealing cover 26 are both connected with the outside of the plastic lens 20, and the connecting lead is connected with the connecting pin 9 through the expansion glue 18, the metal groove plate 28 and the heat sink 7, so that the integrity of the plastic lens 20 and the insulating layer 11 is ensured, the sealing performance of the plastic lens 20 and the air cavity 19 is improved, and the outside water vapor is prevented from entering the air cavity 19 by utilizing the raised air pressure in the air cavity 19, so as to erode the LED chip 14 and the electrode 15, the service life of the LED lamp is prolonged, in the working process of the LED chip 14, part of heat can be directly radiated to the space inside the packaging shell 1 through the plastic lens 20, the other part of heat can be radiated to the metal heat dissipation plate 3 through the heat sink 7, the metal heat dissipation plate 3 and the heat conduction adhesive 27 are utilized, the heat is conducted to the bottom of the metal heat dissipation plate 3, the external lens 2 can be pressed on the top of the plastic lens 20, the plastic lens 20 is fixed on the top of the packaging body 5 in the LED, and the sealing performance of the packaging body 5 in the LED is enhanced.
Further, the packaging process of the LED waterproof structure comprises the following steps:
firstly, fixing a circuit bottom plate 4 at the bottom of a packaging shell 1 by using screws, arranging a first connecting groove 21 on a metal heat dissipation plate 3 at a position corresponding to a spring expansion link 23 on the circuit bottom plate 4, arranging a second connecting groove 22 at the top of the first connecting groove 21, then sleeving the metal heat dissipation plate 3 at the top of the circuit bottom plate 4, inserting the spring expansion link 23 into the first connecting groove 21, and fixing the metal heat dissipation plate 3 by using screws;
welding a fixed base 13 provided with an LED chip 14 on a heat sink 7, sleeving a metal groove plate 28 outside the fixed base 13 and welding, sleeving a plastic lens 20 outside the metal groove plate 28, forming an air cavity 19 between the plastic lens 20 and an expansion adhesive 18, filling nitrogen into the air cavity 19 by using an air filling device, bonding a sealing seat 25 on the top of a base 6 after the LED inner packaging body 5 is packaged by using an LED packaging production line, and clamping the sealing seat 26 on the top of the sealing seat 25 to complete the assembly of the LED inner packaging body 5;
thirdly, at the joint of the LED inner packaging body 5 and the metal heat dissipation plate 3, sequentially dispensing heat-conducting glue on the surface of the metal heat dissipation plate 3 by using a glue dispenser to form a heat-conducting glue 27, aligning a connecting pin 9 at the bottom of the LED inner packaging body 5 with a second connecting groove 22 on the metal heat dissipation plate 3, inserting the connecting pin 9 into the second connecting groove 22, placing a connecting cushion block 8 in the first connecting groove 21, pressing the LED inner packaging body 5 to bond the base 6 and the heat sink 7 with the heat-conducting glue on the metal heat dissipation plate 3, so that the LED packaging body is fixed in the packaging shell 1, and at the moment, connecting the bottom end of the connecting pin 9 is connected with an electrode gasket 24;
and step four, fixing the external lens 2 on the top of the packaging shell 1, and pressing the bottom of the external lens 2 outside the plastic lens 20 to complete packaging.
The working principle of the invention is as follows:
referring to the accompanying drawings of the specification and fig. 2-5, the heat generated by the LED chip 14 in the working process is utilized to expand the expansion glue 18, extrude the gas in the air cavity 19, raise the air pressure inside the air cavity 19, and the joint between the plastic lens 20 and the insulating layer 11 is provided with the sealing seat 25 and the sealing cover 26, the interiors of the sealing seat 25 and the sealing cover 26 are both connected with the outside of the plastic lens 20, and then the connecting lead is connected with the connecting pin 9 through the expansion glue 18, the metal trough plate 28 and the heat sink 7, so that the integrity of the plastic lens 20 and the insulating layer 11 is ensured, and the sealing performance of the plastic lens 20 and the air cavity 19 is improved;
referring to the attached drawing 1 of the specification, the external lens 2 is pressed on the top of the plastic lens 20, so that the plastic lens 20 is fixed on the top of the LED inner package 5, and the sealing performance of the LED inner package 5 can be greatly enhanced by the double-layer package structure of the package housing 1 and the LED inner package 5.
Referring to the attached drawings 1-7 of the specification, in the process of packaging the LED inner packaging body 5, the heat conducting adhesive 27 between the LED inner packaging body 5 and the metal heat dissipation plate 3 is extruded, the connection strength between the LED inner packaging body 5 and the package housing 1 is enhanced, so that a gap between the bottom of the heat sink 7 and the metal heat dissipation plate 3 is isolated from the space inside the package housing 1, meanwhile, an insulating layer 11 is welded between the base 6 and the heat sink 7, and a sealing seat 25 is fixedly arranged outside the insulating layer 11, so that the gaps among the heat sink 7, the base 6 and the metal heat dissipation plate 3 are sealed.
The points to be finally explained are: first, in the description of the present application, it should be noted that, unless otherwise specified and limited, the terms "mounted," "connected," and "connected" should be understood broadly, and may be a mechanical connection or an electrical connection, or a communication between two elements, and may be a direct connection, and "upper," "lower," "left," and "right" are only used to indicate a relative positional relationship, and when the absolute position of the object to be described is changed, the relative positional relationship may be changed;
secondly, the method comprises the following steps: in the drawings of the disclosed embodiments of the invention, only the structures related to the disclosed embodiments are referred to, other structures can refer to common designs, and the same embodiment and different embodiments of the invention can be combined with each other without conflict;
and finally: the above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that are within the spirit and principle of the present invention are intended to be included in the scope of the present invention.
Claims (8)
1. The LED waterproof packaging structure is characterized by comprising a packaging shell (1), wherein an external lens (2) is arranged at the top of the packaging shell (1), a metal heat dissipation plate (3) is arranged in an inner cavity of the packaging shell (1), a plurality of screws are arranged on the outer side and the bottom of the packaging shell (1), and a circuit bottom plate (4) is arranged at the bottom of the metal heat dissipation plate (3);
the LED heat dissipation structure is characterized in that a plurality of LED inner packaging bodies (5) are arranged at the top of the metal heat dissipation plate (3), each LED inner packaging body (5) comprises a base (6), a heat sink (7) is fixedly embedded in the middle of each base (6), a connecting cushion block (8) is fixedly arranged at the bottom of each heat sink (7), a connecting pin (9) is fixedly arranged inside each connecting cushion block (8), an insulating cushion layer (10) is sleeved outside each connecting pin (9), and an insulating layer (11) is fixedly sleeved at the edge of the top of each heat sink (7);
the LED lamp is characterized in that the metal groove plate (28) is provided with a heat dissipation groove (12), the middle of the metal groove plate (28) is fixedly embedded with a fixed base (13), the top end of the fixed base (13) is sunken, the sunken part at the top end of the fixed base (13) is welded with LED chips (14) and electrodes (15), and the number of the electrodes (15) is two and is symmetrically arranged through the LED chips (14);
the electrode (15) is fixedly connected with a connecting wire (16), the top of the LED chip (14) is provided with a fluorescent powder layer (17), the top of the fluorescent powder layer (17) is fixedly provided with an expansion glue (18), an air cavity (19) is arranged outside the expansion glue (18), a plastic lens (20) is arranged outside the air cavity (19), and the top of the plastic lens (20) is attached to the bottom of the external lens (2);
a first connecting groove (21) is formed in the metal heat dissipation plate (3), and a second connecting groove (22) is formed in the bottom of the first connecting groove (21);
the circuit board (4) is provided with a spring telescopic rod (23), and the top of the spring telescopic rod (23) is provided with an electrode gasket (24).
2. The waterproof packaging structure of LED of claim 1, characterized in that: the fixed seal receptacle (25) that is equipped with in base (6) top, fixed sealed lid (26) that is equipped with in seal receptacle (25) top, the outside of insulating layer (11) and plastic lens (20) is located in seal receptacle (25) cover, the outside of plastic lens (20) is located in sealed lid (26) cover, sealed lid (26) and seal receptacle (25) joint.
3. The waterproof packaging structure of LED of claim 1, characterized in that: the screw in encapsulation shell (1) outside runs through inside encapsulation shell (1) extends to the lateral wall of metal heating panel (3), encapsulation shell (1) bottom screw runs through encapsulation shell (1) colour to the bottom of circuit bottom plate (4), metal heating panel (3) and circuit bottom plate (4) all can dismantle with encapsulation shell (1) through the screw and are connected.
4. The waterproof packaging structure of LED of claim 1, characterized in that: be equipped with heat conduction viscose (27) between encapsulation body (5) and metal heating panel (3) in the LED, heat sink (7) and base (6) all are connected with metal heating panel (3) through heat conduction viscose (27), and heat conduction viscose (27) thickness and first connecting groove (21) thickness sum are the same with connection cushion (8) thickness.
5. The waterproof packaging structure of LED of claim 1, characterized in that: the electrode gasket connecting structure is characterized in that the number of the connecting cushion blocks (8), the first connecting grooves (21), the second connecting grooves (22), the connecting pins (9), the spring telescopic rods (23) and the electrode gaskets (24) is the same, the first connecting grooves (21) and the second connecting grooves (22) are integrally arranged, the bottoms of the connecting cushion blocks (8) are attached to the inner wall of the first connecting grooves (21), the connecting pins (9) penetrate through the connecting cushion blocks (8), and the bottoms of the connecting pins (9) are inserted into the top of the inner cavity of the second connecting grooves (22).
6. The waterproof LED packaging structure of claim 5, wherein: the spring telescopic rod top extends to the bottom of an inner cavity of the second connecting groove (22), the electrode gasket (24) is arranged under the connecting pin (9), the top of the electrode gasket (24) is attached to the bottom of the connecting pin (9), and the connecting wire (16) sequentially penetrates through the fluorescent powder layer (17), the expansion glue (18), the metal groove plate (28), the heat sink (7) and the insulating cushion layer (10) and is connected with the top of the connecting pin (9).
7. The waterproof packaging structure of LED of claim 1, characterized in that: the bottom of the expansion glue (18) is fixedly connected with the fluorescent powder layer (17) and the metal groove plate (28), the air cavity (19) is arranged among the plastic lens (20), the metal groove plate (28) and the fluorescent powder layer (17), nitrogen is filled in the air cavity (19), and the bottom of the plastic lens (20) is fixedly connected with the top of the insulating layer (11) and the top of the metal groove plate (28).
8. A packaging process of an LED waterproof structure specifically comprises the following steps:
firstly, fixing a circuit bottom plate (4) at the bottom of a packaging shell (1) by using screws, arranging a first connecting groove (21) on a metal heat dissipation plate (3) at a position corresponding to a spring telescopic rod (23) on the circuit bottom plate (4), arranging a second connecting groove (22) at the top of the first connecting groove (21), then sleeving the metal heat dissipation plate (3) at the top of the circuit bottom plate (4), inserting the spring telescopic rod (23) into the first connecting groove (21), and fixing the metal heat dissipation plate (3) by using screws;
welding a fixed base (13) provided with an LED chip (14) on a heat sink (7), sleeving a metal groove plate (28) outside the fixed base (13) and welding, sleeving a plastic lens (20) outside the metal groove plate (28), forming an air cavity (19) between the plastic lens (20) and expansion glue (18), filling nitrogen gas into the air cavity (19) by using air filling equipment, bonding a sealing seat (25) on the top of a base (6) after the LED inner packaging body (5) is packaged by using an LED packaging production line, and clamping a sealing cover (26) on the top of the sealing seat (25) to complete the assembly of the LED inner packaging body (5);
thirdly, utilizing a dispenser to sequentially dispense heat-conducting glue on the surface of the metal heat dissipation plate (3) at the joint of the LED inner packaging body (5) and the metal heat dissipation plate (3) to form heat-conducting glue (27), aligning a connecting pin (9) at the bottom of the LED inner packaging body (5) with a second connecting groove (22) on the metal heat dissipation plate (3), inserting the connecting pin (9) into the second connecting groove (22), placing a connecting cushion block (8) in the first connecting groove (21), pressing the LED inner packaging body (5), bonding the base (6) and the heat sink (7) with the heat-conducting glue on the metal heat dissipation plate (3), fixing the LED packaging body in the packaging shell (1), and connecting the bottom ends of the connecting pins (9) with the electrode pad (24);
and step four, fixing the external lens (2) on the top of the packaging shell (1), and pressing the bottom of the external lens (2) outside the plastic lens (20) to complete packaging.
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| CN110600600B (en) | 2020-09-01 |
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