CN103633235A - LED module and manufacturing process thereof - Google Patents
LED module and manufacturing process thereof Download PDFInfo
- Publication number
- CN103633235A CN103633235A CN201210303679.2A CN201210303679A CN103633235A CN 103633235 A CN103633235 A CN 103633235A CN 201210303679 A CN201210303679 A CN 201210303679A CN 103633235 A CN103633235 A CN 103633235A
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- led
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 230000017525 heat dissipation Effects 0.000 claims abstract description 15
- 238000001816 cooling Methods 0.000 claims description 44
- 238000007789 sealing Methods 0.000 claims description 19
- 239000000084 colloidal system Substances 0.000 claims description 17
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 9
- 239000000741 silica gel Substances 0.000 claims description 9
- 229910002027 silica gel Inorganic materials 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 239000007788 liquid Substances 0.000 claims description 5
- 239000003292 glue Substances 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 11
- 230000004907 flux Effects 0.000 abstract description 3
- 238000004806 packaging method and process Methods 0.000 abstract 1
- 230000002035 prolonged effect Effects 0.000 abstract 1
- 241000218202 Coptis Species 0.000 description 9
- 235000002991 Coptis groenlandica Nutrition 0.000 description 9
- 229910052782 aluminium Inorganic materials 0.000 description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 9
- 239000004411 aluminium Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 208000010392 Bone Fractures Diseases 0.000 description 3
- 206010017076 Fracture Diseases 0.000 description 3
- 238000000605 extraction Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000004078 waterproofing Methods 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 230000003044 adaptive effect Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/13—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L33/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
The invention provides an LED module comprising LED chips, chip heat-dissipation bases, a circuit board and a radiator, wherein the circuit board is provided with through holes; the chip heat-dissipation bases are embedded in the through holes; each LED chip is arranged on the top surface of each chip heat-dissipation base; the circuit board is in close fit with the radiator; and the bottom surfaces of the chip heat-dissipation bases are in close fit with the radiator in a surface contact manner. Compared with the prior art, instead of a support utilized in the traditional packaging, the LED module utilizes the class chip heat-dissipation bases which are directly embedded in the through holes in the circuit board; and since the copper-made or aluminium-made chip heat-dissipation bases have good heat-conducting property, heat emitted from the LED chips can be directly transmitted to the radiator, and a smooth heat-dissipation channel can be formed, heat-dissipation performance is improved, luminous decay is reduced and luminous flux is improved, the service life of an LED is prolonged, production cost is reduced, and the process is simple.
Description
Technical field
The present invention relates to semiconductor application and encapsulation field, particularly a kind of LED module and manufacturing process thereof.
Background technology
LED is with its energy-conserving and environment-protective, long service life, the feature such as start-up time is short, safety and stability is good, obtain applying more and more widely, LED illumination is considered to the follow-on environmental protection lighting technology of the mankind, but current LED illuminating product cost is high, hamper its application popularization, and the heat dissipation problem of LED is the high basic reason of LED illuminating product cost.LED produces light by electronics in energy band-to-band transition, does not contain infrared part, so the heat of LED can not distribute by radiation in its spectrum.If the heat of LED chip can not distribute in time, can accelerate the aging of device, therefore, effectively solve the heat dissipation problem of LED chip, significant for the reliability and the life-saving that improve LED light fixture.The method that the most directly solves heat radiation is no more than providing a good passage of heat to shed outward from interior by heat.
Current LED module package structure roughly comprises following two kinds.A kind of is that LED chip is encapsulated on the support of device, add a cover sphere lens, form LED device, LED device is fixed on aluminium base, and aluminium base contacts with radiator formation face, and heat spreads out by radiator by heat dissipation channels such as LED support, aluminium bases, although this LED method for packing radiating effect promotes, but need LED support, its cost is higher, and complex process; And, on the LED device with sphere lens, add a cover set of lenses, certainly exist air between the two, and the sphere lens of LED device and the material of set of lenses are respectively silica gel and PC plastic cement, its refractive index, much larger than air, can cause refractive index not mated, so that light extraction efficiency is low.Another kind is that chip is fixed on aluminium base, the electrode of chip is welded on the corresponding electrode of aluminium base with gold thread, fluorescent material is blended in silicones or silica gel again, the fluorescent glue that is mixed with fluorescent material is arranged on the chip of LED, then by heating, make resin solidification, then with a transparent plastic lens case, cover on chip, and in housing, fill up transparent resin or silica gel, heating is solidified resin or silica gel again, forms finished product.In the method, be welded on longer for connecting the length of gold thread of aluminium base top electrode on LED chip, therefore, have the easily risk of fracture.
Summary of the invention
The object of the invention is to provide a kind of LED module, to solve the LED chip of LED module of the prior art, is generally encapsulated on the support of device, causes production cost higher, and the technical matters of complex process.
Another object of the present invention is to provide a kind of manufacturing process of LED module, to solve the LED chip of LED module of the prior art, be generally encapsulated on the support of device, cause production cost higher, and the technical matters of complex process.
The object of the invention is achieved through the following technical solutions:
A kind of LED module, comprise LED chip, chip cooling base, wiring board and radiator, described wiring board is provided with through hole, described chip cooling base is embedded in described through hole, described LED chip is arranged on the end face of described chip cooling base, described wiring board and described radiator fit tightly, the bottom surface of described chip cooling base fits tightly with the mode that described radiator contacts with face, the heat that LED chip sends is transmitted to radiator through chip cooling base, by radiator, be transmitted in air again, form a unobstructed heat dissipation channel.
Preferably, described chip cooling base comprises bottom and the convex body that is arranged on described bottom end face, and described bottom is embedded in described through hole, and the bottom surface of described bottom fits tightly with the mode that described radiator contacts with face.
Preferably, described convex body comprises column.
Preferably, described LED chip is welded on the end face of described convex body.
Preferably, the material of described chip cooling base is copper.
Preferably, also comprise set of lenses, described set of lenses is arranged on described LED chip top, between described set of lenses and described LED chip, is filled with colloid.
Preferably, be provided with some grooves in described set of lenses, described groove is corresponding with described LED chip, is filled with described colloid in described groove, and described colloid is molding colloid.
Preferably, described set of lenses is provided with the some annular grooves for accommodating sealing ring, in described annular groove, is provided with sealing ring.
Preferably, described LED chip is connected with the electrode pad of described wiring board by lead-in wire, on described LED chip, is provided with fluorescent glue.
A manufacturing process for LED module, comprises the following steps:
(1), stamp out in the circuit board several for laying the through hole of chip cooling base;
(2), chip cooling base is embedded in described through hole;
(3), LED chip is welded on to the end face of chip cooling base;
(4), wiring board is connected with radiator and fits tightly, the mode that the bottom surface of chip cooling base contacts with face with radiator is fitted tightly.
Preferably, the chip cooling base of described step (2) comprises bottom and the convex body that is arranged on described bottom end face.
Preferably, described step (2) further comprises: adopt pressing mounting tool that chip cooling base is pressed into through hole, make the end face of chip cooling base protrude from the end face of described wiring board.
Preferably, between described step (3) and described step (4), also comprise: lead-in wire is welded to respectively to the both positive and negative polarity of LED chip and the both positive and negative polarity pad of wiring board.
Preferably, also comprise step (5), in step (4) afterwards, step (5) is step (5): in set of lenses groove in fill colloid, sealing ring is placed in the annular groove of set of lenses to applying liquid silica gel on sealing ring.
Preferably, also comprise step (6), in step (5) afterwards, step (6) is step (6): the wiring board that radiator is installed of step (4) is tipped upside down in the set of lenses of step (5).
Compared with prior art, LED module of the present invention has following advantage:
1, LED module of the present invention adopts stratum's chip cooling base to replace the support that conventional package is used, directly stratum's chip cooling base is embedded in the through hole of wiring board, because the chip cooling base of copper or aluminum has good heat conductivility, the heat that can directly LED chip be sent conducts to radiator, form a unobstructed heat dissipation channel, thereby raising heat dispersion, and then reduce light decay and increase luminous flux, extend the useful life of LED, also reduced production cost, and technique is simple;
2, between set of lenses and LED chip, only fill colloid, the medium of light process is few, and transmitance is high; And the index matching of colloid and set of lenses, reflection loss is few, has improved the light extraction efficiency of LED module;
3, the present invention is in set of lenses be provided with between the wiring board of radiator and adopt two sealing rings to seal, and scribbles liquid silica gel at sealing ring side, plays double protection effect, has good sealing and water proofing property;
4, the close together between LED chip and the electrode pad of wiring board, can shorten the length of gold thread, thereby has reduced the risk of gold thread fracture.
Accompanying drawing explanation
Fig. 1 is the decomposing schematic representation of LED module of the present invention;
Fig. 2 is the structural representation of chip cooling base of the present invention;
Fig. 3 is the structural representation of wiring board of the present invention;
Fig. 4 is the partial sectional view of LED module of the present invention.
Embodiment
Below in conjunction with accompanying drawing, describe the present invention in detail.
Refer to Fig. 1-4, LED module of the present invention, comprises radiator 1, wiring board 2, chip cooling base 3, LED chip 6 and set of lenses 5.Wherein, wiring board 2 is provided with several through holes 21, and chip cooling base 3 is embedded in the through hole 21 of wiring board 2; LED chip 6 is arranged on the top of chip cooling base 3, and LED chip 6 is connected with the electrode pad 22 of wiring board 2 by gold thread, and on LED chip 6, point scribbles fluorescent glue; Wiring board 2 fits tightly with radiator 1, and the bottom surface of chip cooling base 3 fits tightly with the mode that radiator 1 contacts with face; Set of lenses 5 is arranged on LED chip 6 tops, between set of lenses 5 and LED chip 6, is filled with colloid.
In this example, chip cooling base 3 comprises bottom 31 and the convex body 32 that is arranged on bottom 31 end faces, and bottom 31 is embedded in through hole 21, and the bottom surface of bottom 31 fits tightly with the mode that radiator 1 contacts with face.In this example, bottom 31 is strip shape body, and convex body 32 is cylinder.LED chip 6 is welded on the end face of convex body 32.By gold thread, the both positive and negative polarity pad of the both positive and negative polarity on LED chip 6 and wiring board is connected, with respect to existing LED module, the Distance Shortened between convex body 32 and both positive and negative polarity pad, therefore, the length of gold thread also shortens, thereby can reduce the risk of gold thread fracture.
The material of chip cooling base is copper, also can adopt other thermal conductivities to be greater than other metals or the nonmetallic materials of 300W/ (mK).Copper has good heat conductivility, therefore can improve radiating effect.
The material of wiring board basic unit is selected from the wherein a kind of of pottery, copper alloy or aluminium alloy.In this example, wiring board material adopts the good aluminium alloy of radiating effect.
In set of lenses 5, be provided with several grooves, several grooves are corresponding with several LED chips 6, are filled with molding colloid in groove.In set of lenses 5, be also provided with two annular grooves for accommodating sealing ring 4, in annular groove, be provided with sealing ring 4.The present invention is in set of lenses and be provided with between the wiring board of radiator and adopt two sealing rings to seal, and scribbles liquid silica gel at sealing ring side, can play double protection effect, has good sealing and water proofing property.
LED module of the present invention adopts stratum's chip cooling base to replace the support that conventional package is used, directly stratum's chip cooling base is embedded in the through hole of wiring board, because the chip cooling base of copper or aluminum has good heat conductivility, the heat that can directly LED chip be sent conducts to radiator, by radiator, be transmitted in air again, can form a unobstructed heat dissipation channel, thereby raising heat dispersion, and then reduce light decay and increase luminous flux, extend the useful life of LED, also reduced production cost, and technique is simple.Meanwhile, between set of lenses and LED chip, only fill colloid, the medium of light process is few, and transmitance is high; And the index matching of colloid and set of lenses, reflection loss is few, has improved the light extraction efficiency of LED module.
The manufacturing process of LED module of the present invention, comprises the following steps:
(1), on the wiring board of aluminum, stamp out several for laying the through hole of chip cooling base.
(2), adopt copper to make chip cooling base, chip cooling base comprises bottom and is arranged on the convex body at bottom top, bottom 31 is strip shape body, convex body 32 is cylinder.The side view of bottom 31 and through hole are adaptive.
(3), adopt pressing mounting tool that bottom 31 is pressed into through hole from the bottom of wiring board, make the end face of convex body 32 protrude from wiring board end face, make the bottom surface of bottom 31 and the bottom surface of wiring board in same plane.
(4), LED chip is welded on to the end face of convex body 32;
(5), gold thread is welded to respectively to the both positive and negative polarity of LED chip and the both positive and negative polarity pad of wiring board;
(6), wiring board is arranged on radiator by screw;
(7), in set of lenses groove in fill molding colloid, two sealing rings are placed in two annular grooves of set of lenses to applying liquid silica gel on sealing ring;
(8), the wiring board that radiator is installed of step (6) is tipped upside down in the set of lenses of step (7) to the LED module of formation sealing.
Disclosed is above only several specific embodiments of the application, but the application is not limited thereto, and the changes that any person skilled in the art can think of, all should drop in the application's protection range.
Claims (15)
1. a LED module, it is characterized in that, comprise LED chip, chip cooling base, wiring board and radiator, described wiring board is provided with through hole, described chip cooling base is embedded in described through hole, described LED chip is arranged on the end face of described chip cooling base, described wiring board and described radiator fit tightly, the bottom surface of described chip cooling base fits tightly with the mode that described radiator contacts with face, the heat that LED chip sends is transmitted to radiator through chip cooling base, by radiator, be transmitted in air again, form a unobstructed heat dissipation channel.
2. a kind of LED module as claimed in claim 1, it is characterized in that, described chip cooling base comprises bottom and the convex body that is arranged on described bottom end face, and described bottom is embedded in described through hole, and the bottom surface of described bottom fits tightly with the mode that described radiator contacts with face.
3. a kind of LED module as claimed in claim 2, is characterized in that, described convex body comprises column.
4. a kind of LED module as claimed in claim 2, is characterized in that, described LED chip is welded on the end face of described convex body.
5. a kind of LED module as claimed in claim 2, is characterized in that, the material of described chip cooling base is copper.
6. a kind of LED module as claimed in claim 1, is characterized in that, also comprises set of lenses, and described set of lenses is arranged on described LED chip top, between described set of lenses and described LED chip, is filled with colloid.
7. a kind of LED module as claimed in claim 6, is characterized in that, is provided with some grooves in described set of lenses, and described groove is corresponding with described LED chip, is filled with described colloid in described groove, and described colloid is molding colloid.
8. a kind of LED module as claimed in claim 6, is characterized in that, described set of lenses is provided with the some annular grooves for accommodating sealing ring, in described annular groove, is provided with sealing ring.
9. a kind of LED module as claimed in claim 1, is characterized in that, described LED chip is connected with the electrode pad of described wiring board by lead-in wire, on described LED chip, is provided with fluorescent glue.
10. a manufacturing process for LED module, is characterized in that, comprises the following steps:
(1), stamp out in the circuit board several for laying the through hole of chip cooling base;
(2), chip cooling base is embedded in described through hole;
(3), LED chip is welded on to the end face of chip cooling base;
(4), wiring board is connected with radiator and fits tightly, the mode that the bottom surface of chip cooling base contacts with face with radiator is fitted tightly.
The manufacturing process of 11. a kind of LED modules as claimed in claim 10, is characterized in that, the chip cooling base of described step (2) comprises bottom and is arranged on the convex body of described bottom end face.
The manufacturing process of 12. a kind of LED modules as claimed in claim 10, is characterized in that, described step (2) further comprises: adopt pressing mounting tool that chip cooling base is pressed into through hole, make the end face of chip cooling base protrude from the end face of described wiring board.
The manufacturing process of 13. a kind of LED modules as claimed in claim 10, is characterized in that, between described step (3) and described step (4), also comprises: lead-in wire is welded to respectively to the both positive and negative polarity of LED chip and the both positive and negative polarity pad of wiring board.
The manufacturing process of 14. a kind of LED modules as claimed in claim 10, it is characterized in that, also comprise step (5), step (5) in step (4) afterwards, step (5) is: in set of lenses groove in fill colloid, sealing ring is placed in the annular groove of set of lenses to applying liquid silica gel on sealing ring.
The manufacturing process of 15. a kind of LED modules as claimed in claim 14, it is characterized in that, also comprise step (6), in step (5) afterwards, step (6) is step (6): the wiring board that radiator is installed of step (4) is tipped upside down in the set of lenses of step (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210303679.2A CN103633235A (en) | 2012-08-23 | 2012-08-23 | LED module and manufacturing process thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210303679.2A CN103633235A (en) | 2012-08-23 | 2012-08-23 | LED module and manufacturing process thereof |
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| Publication Number | Publication Date |
|---|---|
| CN103633235A true CN103633235A (en) | 2014-03-12 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210303679.2A Pending CN103633235A (en) | 2012-08-23 | 2012-08-23 | LED module and manufacturing process thereof |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103985318A (en) * | 2014-04-16 | 2014-08-13 | 长春希达电子技术有限公司 | Manufacturing method for integrated LED (light-emitting diode) three-dimensional display module and display screen |
| CN104296025A (en) * | 2014-09-05 | 2015-01-21 | 成都赛昂电子科技有限公司 | Light-emitting diode lamp with protective packaging |
| CN108347502A (en) * | 2017-01-24 | 2018-07-31 | Lg电子株式会社 | Lighting device and mobile terminal including it |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101707235A (en) * | 2009-11-26 | 2010-05-12 | 河北立德电子有限公司 | High temperature co-firing ceramic package high power integrated LED light source |
| CN102332527A (en) * | 2011-07-22 | 2012-01-25 | 东莞市万丰纳米材料有限公司 | Light source module |
| CN202736976U (en) * | 2012-08-23 | 2013-02-13 | 杭州华普永明光电股份有限公司 | LED module |
-
2012
- 2012-08-23 CN CN201210303679.2A patent/CN103633235A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101707235A (en) * | 2009-11-26 | 2010-05-12 | 河北立德电子有限公司 | High temperature co-firing ceramic package high power integrated LED light source |
| CN102332527A (en) * | 2011-07-22 | 2012-01-25 | 东莞市万丰纳米材料有限公司 | Light source module |
| CN202736976U (en) * | 2012-08-23 | 2013-02-13 | 杭州华普永明光电股份有限公司 | LED module |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103985318A (en) * | 2014-04-16 | 2014-08-13 | 长春希达电子技术有限公司 | Manufacturing method for integrated LED (light-emitting diode) three-dimensional display module and display screen |
| CN104296025A (en) * | 2014-09-05 | 2015-01-21 | 成都赛昂电子科技有限公司 | Light-emitting diode lamp with protective packaging |
| CN108347502A (en) * | 2017-01-24 | 2018-07-31 | Lg电子株式会社 | Lighting device and mobile terminal including it |
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Address after: 310015, 3 north, 2 North, 18 Kang Road, Hangzhou, Zhejiang, Gongshu District Applicant after: Hangzhou Huapu Yongming Photoelectric Co., Ltd. Address before: 311305, Hangzhou, Zhejiang province Ling'an City Qingshan Lake Street Chuen mouth Village No. 15 Applicant before: Hangzhou Huapu Yongming Photoelectric Co., Ltd. |
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Application publication date: 20140312 |