CN202118634U

CN202118634U - Light-emitting diode (LED) module light source with low thermal resistance and high lighting effect

Info

Publication number: CN202118634U
Application number: CN2011202351305U
Authority: CN
Inventors: 汪绍芬
Original assignee: Individual
Current assignee: Individual
Priority date: 2011-07-05
Filing date: 2011-07-05
Publication date: 2012-01-18
Anticipated expiration: 2021-07-05

Abstract

The utility model relates to a light-emitting diode (LED) module light source, which is characterized by comprising a heat conduction base board, a concentration board, a wafer, heat conduction liquid, concentration glass and a casing. The wafer is arranged in a taper hole formed by integrally splicing the heat conduction base board and the concentration board. The concentration glass is arranged at the top of the casing, fluorescent powder is coated on the bottom face of the casing, the heat conduction liquid is filled in the casing and sealed by a silica gel gasket, and the wafer is soaked in the heat conduction liquid. The heat conduction liquid increases heated dissolution quantity, thereby removing radiating obstruction of a chip caused by wrapping of colloid, effectively reducing light source thermal resistance, and improving steady-state lighting effect to a great extent. Fluorescent powder is coated on the bottom face of grading glass so that the problem that fluorescent powder glue damages the chip caused by stress is solved, and simultaneously defects that color temperature change and quality loss of the fluorescent powder caused by high temperature and contact of the fluorescent powder and the chip are overcome. The LED module light source is provided with an airtight structure, and waterproof grade can reach IP67, thereby greatly facilitating waterproof and dustproof design of lamps.

Description

A kind of low thermal resistance high light efficiency LED die set light source

Technical field:

The utility model relates to a kind of light source, especially relates to a kind of LED die set light source, more specifically is meant the integrated die set light source of a kind of low thermal resistance high light efficiency LED.

Background technology:

According to the principle that led light source thermal resistance and light efficiency are inversely proportional to, reducing thermal resistance is the effective ways that improve light efficiency, and it is related to improves LED brightness, life-saving and reduce cost, and is the key subjects that the whole LED of being industry is longed for, pursued jointly.Tradition LED encapsulation is that chip is solid brilliant through elargol, conducts the heat to radiator through base plate for packaging, and the light source internal thermal resistance is very big; Analysis and practice show that led chip heat radiation bottleneck is between chip and substrate; This is because the led chip volume is very little, and six interfaces all tightly are wrapped in by fluorescent material and embedding gel, have produced very big thermal resistance; 10W/mK is arranged usually approximately; Therefore having the people to propose chip is immersed the heat dissipating method of cooling fluid, let around the LED and five interfaces at top are immersed among the liquid of printing opacity heat conduction, is a kind of extraordinary heat radiation thinking; But in fact inject liquid at a small space (like single small size encapsulation); Seal and cooling fluid is not rushed down leakage and structurally be difficult to be realized, like application (patent) number: 200810061713.3 " a kind of high-power LED light sources of liquid immersion type encapsulation " have proposed the liquid immersion type method for packing, but this patent shortcoming is: one of which does not provide the hermetically-sealed construction of practical; Its two said negative pressure condensation evaporation EGR that in confined chamber, adopts, this installs at limited small space, and complication system is the fantasy that at all can't realize such as heat pipe.

The great power LED die set light source has been widely used in high-power illumination in recent years, and it has high brightness, advantage such as easy to maintenance, becomes the designer trends of LED lamp module seriation; Integrated encapsulation (COB encapsulation) is the LED developing direction; More and morely admitted by people, because that integrated package area has than single highland barley is bigger, this provides the hermetically-sealed construction space for the liquid immersion type encapsulation scheme; The die set light source of concentrating yet this caloric value is big is except will solving the light source leakage-proof structure; Simultaneously fluorescent material is put and liquid heat conductive material and technology have to be optimizedly, reduced great power LED die set light source thermal resistance and improve light efficiency and need system's design and management.

Summary of the invention:

The utility model is exactly in order to solve the deficiency of prior art, has designed a kind of low thermal resistance high light efficiency LED die set light source, can heat energy be transmitted and dissipation fast, realizes reducing the purpose that thermal resistance improves light efficiency.

For realizing that the technical scheme that above-mentioned purpose the utility model is adopted is:

A kind of low thermal resistance high light efficiency LED die set light source; It is characterized in that comprising: heat-conducting substrate 9, solar panel 7, wafer 8, conductive fluid 4, condensing glass 2, housing 1; Among the heat-conducting substrate 9 that wafer 8 is installed in and the taper hole of solar panel 7 amalgamation one, condensing glass 2 is equipped with at housing 1 top, and its bottom surface scribbles fluorescent material 3; Be filled with conductive fluid 4 in the housing 1 through silicagel pad 5 sealings, wafer 8 is immersed in the conductive fluid 4.

The beneficial effect that adopts above-mentioned technical solution to reach is:

1, wafer is immersed in the conductive fluid, is filled with conductive fluid all around, has removed the colloid parcel to chip thermal resistance obstacle, and conductive fluid has increased the thermosol amount in addition, effectively reduces the light source internal thermal resistance, has significantly improved the stable state light efficiency of light source.

2, the condensing glass bottom surface scribbles fluorescent material, has not only solved the phosphor gel stress is damaged chip, has also overcome fluorescent material and has descended because of colour temperature change and the quality that contact chip Yin Gaowen causes.

3, increased the solar panel that has plated film, not only simplified the once light-distribution structure, effectively reduce the light output loss, because falling heat-transfer liquid has increased chip heatsink transverse area all around, further reduce thermal resistance, improved light efficiency.

4, light source is provided with closed structure, and classification of waterproof can reach IP67, for the design of light fixture water proof and dust proof provides very big convenience.

Description of drawings:

Below in conjunction with the accompanying drawing and the specific embodiment the utility model is done further explain:

Fig. 1 is a kind of low thermal resistance high light efficiency LED of the utility model die set light source shaft type exploded view.

Fig. 2 is Fig. 1 partial enlarged drawing.

Wherein: heat-conducting substrate 9, solar panel 7, wafer 8, conductive fluid 4, condensing glass 2, fluorescent material 3, housing 1, silicagel pad 5, holding screw 6, positive electrode pad 10, negative electrode pad 11.

The specific embodiment:

Below in conjunction with accompanying drawing the utility model is done further explain:

Embodiment: see accompanying drawing 1 and Fig. 2: a kind of low thermal resistance high light efficiency LED die set light source; It is characterized in that comprising: heat-conducting substrate 9, solar panel 7, wafer 8, conductive fluid 4, condensing glass 2, housing 1; Among the heat-conducting substrate 9 that wafer 8 is installed in and the taper hole of solar panel 7 amalgamation one, condensing glass 2 is equipped with at housing 1 top, and its bottom surface scribbles fluorescent material 3; Be filled with conductive fluid 4 in the housing 1 through silicagel pad 5 sealings, wafer 8 is immersed in the conductive fluid 4.

Said heat-conducting substrate is that copper or aluminium base have the connection line required with wafer, becomes through heat pressing process with the array solar panel to be integrated, and becomes to have cup-shaped and the heat conduction composite base plate of optically focused effect.

Described a kind of low thermal resistance high light efficiency LED die set light source, it is characterized in that: said solar panel is provided with some conical through-holes and lines up array, and hole depth is at 0.2-2.2mm, and firing angle is at the 30-120 degree, and material is copper, aluminium or steel plate, its end face and hole wall are coated with reflective membrane.

Through some glue or welding, baking, solid brilliant technology, wafer is through string and be connected to the positive and negative electrode pad 10,11 of heat-conducting substrate at the bottom of the cup end of said synthetic substrate.

Said array solar panel 7 can be copper, aluminium or alloy with shell 1 body, also can be engineering plastics.

Luminous intensity distribution glass 2 is equipped with at said housing 1 top; Luminous intensity distribution glass 2 can also can be made secondary light-distribution by the plane printing opacity as required; Its bottom surface scribbles fluorescent material 3 and composes thing, becomes through baking and penetrates light window, and fluorescent material also can mix the function that realizes the output white light in the cooling fluid; Contrast with the conventional package method; Luminous intensity distribution glass bottom surface scribbles fluorescent material, not only efficiently solves phosphor gel stress chip is damaged, and has also overcome fluorescent material and has descended because of colour temperature change and the quality that contact chip Yin Gaowen causes.

Said housing 1 forms an annular seal space with the middle silicagel pad 5 that is provided with of the synthetic substrate of heat conduction, and after wafer was sealed test, filling heat-conductive liquid 4 in the chamber, compressed and sealed through holding screw 6, and all wafers 8 are immersed in the conductive fluid 4.

Said conductive fluid 4 is conductive fluid of the methyl or phenyl silicone oil of a kind of transparent, insulation, high index of refraction, and refractive index is between 1.4-1.8.

With conventional package method contrast, each wafer all is immersed in the conductive fluid, is filled with conductive fluid all around, has removed colloid chip is wrapped up, and conductive fluid has the effect of the thermosol of increase amount simultaneously, effectively reduces the light source internal thermal resistance, big panel height the stable state light efficiency of light source.

Because, be provided with silicagel pad 5 below the luminous intensity distribution glass 2, be sealed through screw 6 fastening whole light source; After the light source electrode is drawn dish 10 and 11 welding leads, inject marine glue or compress the tight and waterproof of recycle silicon padding with shell fragment, classification of waterproof can reach IP67, for simplifying the design of light fixture water proof and dust proof very big convenience is provided.

Based on above-mentioned characteristics of principle; The utility model embodiment is merely preferred embodiment; Actual enforcement also can extend to other application, and all any modifications within the utility model claim scope are equal to or replace within the claim scope that all should fall within the utility model.

Claims

1. low thermal resistance high light efficiency LED die set light source; It is characterized in that comprising: heat-conducting substrate (9), solar panel (7), wafer (8), conductive fluid (4), condensing glass (2), housing (1); Among the taper hole of heat-conducting substrate (9) that wafer (8) is installed in and solar panel (7) amalgamation one, condensing glass (2) is equipped with at housing (1) top, and its bottom surface scribbles fluorescent material (3); Be filled with conductive fluid (4) in the housing (1) through silicagel pad (5) sealing, wafer (8) is immersed in the conductive fluid (4).

2. a kind of low thermal resistance high light efficiency LED die set light source according to claim 1; It is characterized in that: said heat-conducting substrate (9) is copper (or aluminium) substrate; Have the required connection line of wafer; Piece together for being integrated through welding procedure of hot pressing with solar panel (7), becoming has cup-shaped and the heat conduction composite base plate of optically focused effect, and some wafers (8) are through the circuit string and be connected to positive and negative electrode pad (10) and (11) of heat-conducting substrate.

3. a kind of low thermal resistance high light efficiency LED die set light source according to claim 1; It is characterized in that: said solar panel (7) is provided with some conical through-holes and lines up array, and hole depth is at 0.2-2.2mm, and firing angle is at the 30-120 degree; Material is copper, aluminium or steel plate, and its end face and hole wall are coated with reflective membrane.

4. a kind of low thermal resistance high light efficiency LED die set light source according to claim 1 is characterized in that: said conductive fluid (4) is the conductive fluid of the methyl or phenyl silicone oil of a kind of insulation, transparent, high index of refraction, and refractive index is between 1.4-1.8.

5. a kind of low thermal resistance high light efficiency LED die set light source according to claim 1; It is characterized in that: said heat-conducting substrate (9); Its material is high metallic copper substrate or an aluminium base of thermal conductivity, and its shape can be square, circular, polygon or any one shape wherein.

6. a kind of low thermal resistance high light efficiency LED die set light source according to claim 1 is characterized in that: said solar panel (7) and housing (1) can be copper, aluminium or alloy, also can be engineering plastics.