CN202018990U - High-power white-light LED light source encapsulating structure - Google Patents

High-power white-light LED light source encapsulating structure Download PDF

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Publication number
CN202018990U
CN202018990U CN2011200355316U CN201120035531U CN202018990U CN 202018990 U CN202018990 U CN 202018990U CN 2011200355316 U CN2011200355316 U CN 2011200355316U CN 201120035531 U CN201120035531 U CN 201120035531U CN 202018990 U CN202018990 U CN 202018990U
Authority
CN
China
Prior art keywords
led
cap
white light
substrate
power white
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2011200355316U
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Chinese (zh)
Inventor
钟信才
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Foshan Electrical and Lighting Co Ltd
Original Assignee
Foshan Electrical and Lighting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foshan Electrical and Lighting Co Ltd filed Critical Foshan Electrical and Lighting Co Ltd
Priority to CN2011200355316U priority Critical patent/CN202018990U/en
Application granted granted Critical
Publication of CN202018990U publication Critical patent/CN202018990U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

Abstract

The utility model discloses a high-power white-light LED light source encapsulating structure, which enables fluorescent powder to keep far away from an LED chip, has simple and feasible structure and techniques, and can improve the light efficiency, reduce the thermal resistance, and improve the heat radiation performance of a high-power LED. In the encapsulating structure, an LED blue-light chip is fixed on a substrate through a welding layer, lead-out welding points are arranged on two sides of the welding layer, the positive and negative poles of the LED blue-light chip are fixedly connected with adjacent lead-out welding points through electrode lead wires respectively, an LED fluorescent cap covers the LED blue-light chip and the two electrode lead wires and fix the LED blue-light chip and the two electrode lead wires on the substrate, and a sealing ring is sleeved at the circumference of the LED fluorescent cap in a matched manner and compresses, fixes, and seals the lead-out welding points at the brim of the cap.

Description

A kind of large power white light LED illuminating source packaging structure
Technical field
The utility model relates to light emitting semiconductor device encapsulation technology field, particularly a kind of large power white light LED illuminating source packaging structure.
Background technology
In recent years, be used to for a long time show that the semiconductor light sources in field just progressively enters lighting field with the role of novel solid light source.Compare energy-conservation, efficient, advantages such as volume is little, the life-span is long, response speed is fast, driving voltage is low, anti-vibration that semiconductor light sources has with conventional light source.Along with Development of Packaging Technology, the continuous reduction of its manufacturing cost, the improving constantly of luminosity, semiconductor light sources has represented application prospects at lighting field.
The core of semiconductor lighting is to utilize the semiconductor light emitting technology to realize white light.Present blue-light LED chip+yellow fluorescent powder converts the white light LEDs technology to and occupies leading position.And realize that the method for white light, great majority are fluorescent material and epoxy resin to be mixed directly be coated on the chip.The shortcoming of this method is that heat dispersion is relatively poor, the rising of temperature when working along with LED, and the fluorescent material quantum efficiency reduces, and bright dipping reduces, and radiation wavelength also can change, thereby causes the variation of white light LEDs colour temperature, colourity; And because fluorescent powder and chip be close to, make the light of led chip emission and light that the chip excitated fluorescent powder sends turn back to chip and absorbed by chip and lose, cause the taking-up efficient of light to reduce through scattering.In addition, the human factor that traditional fluorescent powder coated technique exists when the fluorescent material allocation process point of neutralization is coated on the chip has certain influence to the consistency of product quality, the applied thickness and the shape of fluorescent material can not accurately be controlled, also cause the emergent light color inconsistent, inclined to one side blue light or inclined to one side gold-tinted occur.At present, fluorescent material and the contactless method for packing of led chip have been adopted in the encapsulation of more existing white light LEDs, and fill with protective atmosphere between fluorescent material and led chip or inject transparent colloid to make it isolation.This method has overcome fluorescent material and has closely contacted the problem that causes with led chip, but the technological requirement height is unfavorable for batch process, and the space of further improvement is still arranged at aspects such as heat dispersion and luminous efficiencies.
Secondly, in conventional package structure commonly used at present, substantially all be to adopt four-layer structures such as chip, aluminium base, heat conduction copper sheet, main radiator to constitute a high-power LED light source.And all need heat-conducting glue as intermediate medium between each layer.Therefore, the conductive coefficient of heat-conducting glue will directly have influence on the heat dispersion of product, makes thermal-conduction resistance very big.In addition, also the material owing to sandwich construction has nothing in common with each other, the especially influence of adverse circumstances in normal use, and the coefficient of thermal expansion and contraction of each layer medium is also different, and each assembly itself badly influences the effect of heat radiation because of the distortion of cold and hot variation.
Led light source is owing to be the one-way light source, and the led light source of existing encapsulating structure can't be applied on traditional lighting, becomes the difficult problem that the LED illumination is used.
Summary of the invention
The purpose of this utility model be to propose a kind of fluorescent material away from led chip, structure and large power white light LED illuminating source packaging structure simple for process, this encapsulating structure can improve the luminous efficiency of great power LED, reduce its thermal resistance, improve its heat dispersion.
The technical solution that the utility model proposed is such:
A kind of large power white light LED illuminating source packaging structure, comprise the LED blue chip, substrate, sealing ring, the LED blue chip is fixed on the substrate by weld layer, weld layer both sides on the substrate are laid with respectively draws solder joint, the LED blue chip just, negative electrode firmly is connected with the adjacent solder joint spot welding of drawing respectively by contact conductor, be provided with LED fluorescence cap, this LED fluorescence cap covers described LED blue chip and two contact conductors and be fixedly mounted on the described substrate, and the sealing ring coupling is linked in LED fluorescence cap periphery and the part on LED fluorescence cap shade and adjacent cap edge is drawn solder joint and compresses, fixing seal.
Described LED fluorescence cap is coated in after synthetic by fluorescent material and silica gel by methacrylate sheet is prefabricated again and is pressed into calyptrate inner surface, becomes LED fluorescence cap, is provided with shade in the cap bottom.
The preferred high refractive index nano fluorescent material of described fluorescent material; Described polymethyl methacrylate preferred light classes and grades in school polymethyl methacrylate.
Described LED fluorescence cap be shaped as truncated or flat-top square column type or hemisphere or candle lamp cell-shell shape.Described substrate is an aluminium sheet.Described weld layer is to be formed by the direct attachment process of LED blue chip by aluminium sheet.
Compared with prior art, the utlity model has following beneficial effect:
(1) owing to adopts LED fluorescence cap to replace the fluorescent material encapsulation, the large power white light LED chip is separated with fluorescent material, solved fluorescent material owing to thereby the caused fluorescent material quantum efficiency reduction of temperature rise, bright dipping minimizing, radiation wavelength change and cause the variation of white light LEDs colour temperature, colourity, and under higher temperature problem such as fluorescent material accelerated ageing, the life-span of having improved luminous efficiency and device.
(2) owing to adopt aluminium sheet COB packaging technology structure, reduced the thermal resistance of device.
(3) LED fluorescence cap is bigger than the fluorescent powder coated layer of the sphere of conventional package rising angle.Because the light-source structure of LED fluorescence cap and the light distributing method that luminous intensity distribution provides high performance-price ratio.LED white light fluorescence cap is the design of shade at the bottom of adopting inwall to scribble nano-phosphor film, cap, make it bigger than the rising angle of the fluorescent powder coated layer of the sphere of existing encapsulation, can be near 180 ° of angles, can be applicable on the light fixture of illuminating industry traditional reflective Lamp cup, thereby, solved industry and used the difficult problem that led light source occurred.
(4) replace the method for filling protective gas between the direct coating of fluorescent material or fluorescent material and the chip or injecting glue in the assembled mode of LED fluorescence cap; can accomplish simple in structure; work simplification; reduce the influence of manual operation factor; guarantee process repeatability and homogeneity of product, improved product quality and production efficiency.
The utility model is applicable to the white light LEDs encapsulation of all kinds, specification.LED fluorescence cap can cover a plurality of chips, changes the LED fluorescence cap of different-colour, can encapsulate out the LED white light source of various colour temperatures.
Description of drawings
Fig. 1 is the large power white light LED illuminating source packaging structure schematic diagram of an embodiment of the utility model.
Embodiment
By following embodiment the utility model is further elaborated.
Referring to shown in Figure 1, a kind of large power white light LED illuminating source packaging structure, this large power white light LED light source is by substrate 6, LED blue chip 1, LED fluorescence cap 7 and sealing ring 4 are formed, substrate 6 adopts aluminium sheet, LED blue chip 1 is fixed on the substrate 6 by weld layer 3, weld layer 3 left and right sides on the substrate 6 are laid with respectively draws solder joint 5, LED blue chip 1 just, negative electrode firmly is connected with the adjacent solder joint spot welding of drawing respectively by contact conductor 2, described contact conductor 2 adopts gold thread, LED fluorescence cap covers LED blue chip 1 and two contact conductors 2 and be fixed on the substrate 6, sealing ring 4 couplings are linked in LED fluorescence cap 7 peripheries and the shade of LED fluorescence cap 7 and the part on adjacent cap edge are drawn solder joint 5 compressions, fixing seal becomes the large power white light LED illuminating source packaging structure.
Described LED fluorescence cap 7 is the calyptras that are pressed into multiple shape earlier with the optical grade methacrylate sheet by mould, the cap bottom is provided with shade, be mixed into fluorescent colloid with high refractive index nano fluorescent material and silica gel then, and become LED fluorescence cap 7 after these fluorescent colloids are coated in described calyptrate inner surface dry solidification.The shape of LED fluorescence cap 7 can adopt truncated or flat-top square column type or hemisphere or candle lamp cell-shell shape etc.LED blue chip 1 adopts direct attachment process (aluminium sheet COB packaging technology) to be installed on the aluminium base 6 by weld layer 3.

Claims (6)

1. large power white light LED illuminating source packaging structure, comprise the LED blue chip, substrate, sealing ring, the LED blue chip is fixed on the substrate by weld layer, weld layer both sides on the substrate are laid with respectively draws solder joint, the LED blue chip just, negative electrode firmly is connected with the adjacent solder joint spot welding of drawing respectively by contact conductor, it is characterized in that: be provided with LED fluorescence cap, this LED fluorescence cap covers described LED blue chip and two contact conductors and be fixedly mounted on the described substrate, and the sealing ring coupling is linked in LED fluorescence cap periphery and the part on LED fluorescence cap shade and adjacent cap edge is drawn solder joint and compresses, fixing seal.
2. large power white light LED illuminating source packaging structure according to claim 1 is characterized in that: described LED fluorescence cap is provided with shade by the prefabricated calyptra that is pressed into of methacrylate sheet in the cap bottom.
3. large power white light LED illuminating source packaging structure according to claim 2 is characterized in that: described polymethyl methacrylate adopts the optical grade polymethyl methacrylate.
4. according to the described large power white light LED illuminating source packaging structure of claim 2, it is characterized in that: described LED fluorescence cap be shaped as truncated or flat-top square column type or hemisphere or candle lamp cell-shell shape.
5. large power white light LED illuminating source packaging structure according to claim 1 is characterized in that: described substrate is an aluminium sheet.
6. large power white light LED illuminating source packaging structure according to claim 1 is characterized in that: described weld layer is to be formed by the direct attachment process of LED blue chip by aluminium sheet.
CN2011200355316U 2011-01-24 2011-01-24 High-power white-light LED light source encapsulating structure Expired - Fee Related CN202018990U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2011200355316U CN202018990U (en) 2011-01-24 2011-01-24 High-power white-light LED light source encapsulating structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2011200355316U CN202018990U (en) 2011-01-24 2011-01-24 High-power white-light LED light source encapsulating structure

Publications (1)

Publication Number Publication Date
CN202018990U true CN202018990U (en) 2011-10-26

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011200355316U Expired - Fee Related CN202018990U (en) 2011-01-24 2011-01-24 High-power white-light LED light source encapsulating structure

Country Status (1)

Country Link
CN (1) CN202018990U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102148319A (en) * 2011-01-24 2011-08-10 佛山电器照明股份有限公司 High-power white light emitting diode (LED) light source packaging structure
CN102410483A (en) * 2011-11-14 2012-04-11 黎昌兴 LED light source suitable for lighting lamp of vehicles and boats
CN108758379A (en) * 2018-05-17 2018-11-06 浙江安吉成新照明电器有限公司 A kind of production technology of LED desk lamp

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102148319A (en) * 2011-01-24 2011-08-10 佛山电器照明股份有限公司 High-power white light emitting diode (LED) light source packaging structure
CN102410483A (en) * 2011-11-14 2012-04-11 黎昌兴 LED light source suitable for lighting lamp of vehicles and boats
CN108758379A (en) * 2018-05-17 2018-11-06 浙江安吉成新照明电器有限公司 A kind of production technology of LED desk lamp

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20111026

Termination date: 20170124

CF01 Termination of patent right due to non-payment of annual fee