CN102148319A - High-power white light emitting diode (LED) light source packaging structure - Google Patents
High-power white light emitting diode (LED) light source packaging structure Download PDFInfo
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- CN102148319A CN102148319A CN2011100366156A CN201110036615A CN102148319A CN 102148319 A CN102148319 A CN 102148319A CN 2011100366156 A CN2011100366156 A CN 2011100366156A CN 201110036615 A CN201110036615 A CN 201110036615A CN 102148319 A CN102148319 A CN 102148319A
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- led
- packaging structure
- cap
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- Non-Portable Lighting Devices Or Systems Thereof (AREA)
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Abstract
The invention discloses a high-power white LED light source packaging structure. Fluorescent powder is away from an LED chip, and the packaging structure and a process are simple and practicable. The packaging structure can improve the luminous efficiency of the high-power LED, reduce the thermal resistance and improve the heat dispersion. In the packaging structure, an LED blue chip is fixed on a substrate through a welding layer, outlet welding spots are formed on two sides of the welding layer, positive and negative poles of the LED blue chip are fixedly connected with neighboring outlet welding spots through an electrode lead respectively, the LED blue chip and two electrode leads are covered and fixed on the substrate through an LED fluorescent cap, and a sealing ring is sleeved at the periphery of the LED fluorescent cap in a matching mode and fixedly presses and seals partial outlet welding spots of the cap edge.
Description
Technical field
The present invention relates to light emitting semiconductor device encapsulation technology field, particularly a kind of large power white light LED illuminating source packaging structure.
Background technology
In recent years, be used to for a long time show that the semiconductor light sources in field just progressively enters lighting field with the role of novel solid light source.Compare energy-conservation, efficient, advantages such as volume is little, the life-span is long, response speed is fast, driving voltage is low, anti-vibration that semiconductor light sources has with conventional light source.Along with Development of Packaging Technology, the continuous reduction of its manufacturing cost, the improving constantly of luminosity, semiconductor light sources has represented application prospects at lighting field.
The core of semiconductor lighting is to utilize the semiconductor light emitting technology to realize white light.Present blue-light LED chip+yellow fluorescent powder converts the white light LEDs technology to and occupies leading position.And realize that the method for white light, great majority are fluorescent material and epoxy resin to be mixed directly be coated on the chip.The shortcoming of this method is that heat dispersion is relatively poor, the rising of temperature when working along with LED, and the fluorescent material quantum efficiency reduces, and bright dipping reduces, and radiation wavelength also can change, thereby causes the variation of white light LEDs colour temperature, colourity; And because fluorescent powder and chip be close to, make the light of led chip emission and light that the chip excitated fluorescent powder sends turn back to chip and absorbed by chip and lose, cause the taking-up efficient of light to reduce through scattering.In addition, the human factor that traditional fluorescent powder coated technique exists when the fluorescent material allocation process point of neutralization is coated on the chip has certain influence to the consistency of product quality, the applied thickness and the shape of fluorescent material can not accurately be controlled, also cause the emergent light color inconsistent, inclined to one side blue light or inclined to one side gold-tinted occur.At present, fluorescent material and the contactless method for packing of led chip have been adopted in the encapsulation of more existing white light LEDs, and fill with protective atmosphere between fluorescent material and led chip or inject transparent colloid to make it isolation.This method has overcome fluorescent material and has closely contacted the problem that causes with led chip, but the technological requirement height is unfavorable for batch process, and the space of further improvement is still arranged at aspects such as heat dispersion and luminous efficiencies.
Secondly, in conventional package structure commonly used at present, substantially all be to adopt four-layer structures such as chip, aluminium base, heat conduction copper sheet, main radiator to constitute a high-power LED light source.And all need heat-conducting glue as intermediate medium between each layer.Therefore, the conductive coefficient of heat-conducting glue will directly have influence on the heat dispersion of product, makes thermal-conduction resistance very big.In addition, also the material owing to sandwich construction has nothing in common with each other, the especially influence of adverse circumstances in normal use, and the coefficient of thermal expansion and contraction of each layer medium is also different, and each assembly itself badly influences the effect of heat radiation because of the distortion of cold and hot variation.
Led light source is owing to be the one-way light source, and the led light source of existing encapsulating structure can't be applied on traditional lighting, becomes the difficult problem that the LED illumination is used.
Summary of the invention
The objective of the invention is to propose a kind of fluorescent material away from led chip, structure and large power white light LED illuminating source packaging structure simple for process, this encapsulating structure can improve the luminous efficiency of great power LED, reduces its thermal resistance, improves its heat dispersion.
Technical solution proposed by the invention is such:
A kind of large power white light LED illuminating source packaging structure, comprise the LED blue chip, substrate, sealing ring, the LED blue chip is fixed on the substrate by weld layer, weld layer both sides on the substrate are laid with respectively draws solder joint, the LED blue chip just, negative electrode firmly is connected with the adjacent solder joint spot welding of drawing respectively by contact conductor, be provided with LED fluorescence cap, this LED fluorescence cap covers described LED blue chip and two contact conductors and be fixedly mounted on the described substrate, and the sealing ring coupling is linked in LED fluorescence cap periphery and the part on LED fluorescence cap shade and adjacent cap edge is drawn solder joint and compresses, fixing seal.
Described LED fluorescence cap is coated in after synthetic by fluorescent material and silica gel by methacrylate sheet is prefabricated again and is pressed into calyptrate inner surface, becomes LED fluorescence cap, is provided with shade in the cap bottom.
The preferred high refractive index nano fluorescent material of described fluorescent material; Described polymethyl methacrylate preferred light classes and grades in school polymethyl methacrylate.
Described LED fluorescence cap be shaped as truncated or flat-top square column type or hemisphere or candle lamp cell-shell shape.Described substrate is an aluminium sheet.Described weld layer is to be formed by the direct attachment process of LED blue chip by aluminium sheet.
Compared with prior art, the present invention has following remarkable result:
(1) owing to adopts LED fluorescence cap to replace the fluorescent material encapsulation, the large power white light LED chip is separated with fluorescent material, solved fluorescent material owing to thereby the caused fluorescent material quantum efficiency reduction of temperature rise, bright dipping minimizing, radiation wavelength change and cause the variation of white light LEDs colour temperature, colourity, and under higher temperature problem such as fluorescent material accelerated ageing, the life-span of having improved luminous efficiency and device.
(2) owing to adopt aluminium sheet COB packaging technology structure, reduced the thermal resistance of device.
(3) LED fluorescence cap is bigger than the fluorescent powder coated layer of the sphere of conventional package rising angle.Because the light-source structure of LED fluorescence cap and the light distributing method that luminous intensity distribution provides high performance-price ratio.LED white light fluorescence cap is the design of shade at the bottom of adopting inwall to scribble nano-phosphor film, cap, make it bigger than the rising angle of the fluorescent powder coated layer of the sphere of existing encapsulation, can be near 180 ° of angles, can be applicable on the light fixture of illuminating industry traditional reflective Lamp cup, thereby, solved industry and used the difficult problem that led light source occurred.
(4) replace the method for filling protective gas between the direct coating of fluorescent material or fluorescent material and the chip or injecting glue in the assembled mode of LED fluorescence cap; can accomplish simple in structure; work simplification; reduce the influence of manual operation factor; guarantee process repeatability and homogeneity of product, improved product quality and production efficiency.
The present invention is applicable to the white light LEDs encapsulation of all kinds, specification.LED fluorescence cap can cover a plurality of chips, changes the LED fluorescence cap of different-colour, can encapsulate out the LED white light source of various colour temperatures.
Description of drawings
Fig. 1 is the large power white light LED illuminating source packaging structure schematic diagram of one embodiment of the invention.
Embodiment
By following embodiment the present invention is further elaborated.
Referring to shown in Figure 1, a kind of large power white light LED illuminating source packaging structure, this large power white light LED light source is by substrate 6, LED blue chip 1, LED fluorescence cap 7 and sealing ring 4 are formed, substrate 6 adopts aluminium sheet, LED blue chip 1 is fixed on the substrate 6 by weld layer 3, weld layer 3 left and right sides on the substrate 6 are laid with respectively draws solder joint 5, LED blue chip 1 just, negative electrode firmly is connected with the adjacent solder joint spot welding of drawing respectively by contact conductor 2, described contact conductor 2 adopts gold thread, LED fluorescence cap covers LED blue chip 1 and two contact conductors 2 and be fixed on the substrate 6, sealing ring 4 couplings are linked in LED fluorescence cap 7 peripheries and the shade of LED fluorescence cap 7 and the part on adjacent cap edge are drawn solder joint 5 compressions, fixing seal becomes the large power white light LED illuminating source packaging structure.
Described LED fluorescence cap 7 is the calyptras that are pressed into multiple shape earlier with the optical grade methacrylate sheet by mould, the cap bottom is provided with shade, be mixed into fluorescent colloid with high refractive index nano fluorescent material and silica gel then, and become LED fluorescence cap 7 after these fluorescent colloids are coated in described calyptrate inner surface dry solidification.The shape of LED fluorescence cap 7 can adopt truncated or flat-top square column type or hemisphere or candle lamp cell-shell shape etc.LED blue chip 1 adopts direct attachment process (aluminium sheet COB packaging technology) to be installed on the aluminium base 6 by weld layer 3.
Claims (6)
1. large power white light LED illuminating source packaging structure, comprise the LED blue chip, substrate, sealing ring, the LED blue chip is fixed on the substrate by weld layer, weld layer both sides on the substrate are laid with respectively draws solder joint, the LED blue chip just, negative electrode firmly is connected with the adjacent solder joint spot welding of drawing respectively by contact conductor, it is characterized in that: be provided with LED fluorescence cap, this LED fluorescence cap covers described LED blue chip and two contact conductors and be fixedly mounted on the described substrate, and the sealing ring coupling is linked in LED fluorescence cap periphery and the part on LED fluorescence cap shade and adjacent cap edge is drawn solder joint and compresses, fixing seal.
2. large power white light LED illuminating source packaging structure according to claim 1, it is characterized in that: described LED fluorescence cap is coated in after synthetic by fluorescent material and silica gel by methacrylate sheet is prefabricated again and is pressed into calyptrate inner surface, become LED fluorescence cap, be provided with shade in the cap bottom.
3. large power white light LED illuminating source packaging structure according to claim 2 is characterized in that: described fluorescent material adopts high refractive index nano fluorescent material; Described polymethyl methacrylate adopts the optical grade polymethyl methacrylate.
4. according to the described large power white light LED illuminating source packaging structure of claim 2, it is characterized in that: described LED fluorescence cap be shaped as truncated or flat-top square column type or hemisphere or candle lamp cell-shell shape.
5. large power white light LED illuminating source packaging structure according to claim 1 is characterized in that: described substrate is an aluminium sheet.
6. large power white light LED illuminating source packaging structure according to claim 1 is characterized in that: described weld layer is to be formed by the direct attachment process of LED blue chip by aluminium sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100366156A CN102148319A (en) | 2011-01-24 | 2011-01-24 | High-power white light emitting diode (LED) light source packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100366156A CN102148319A (en) | 2011-01-24 | 2011-01-24 | High-power white light emitting diode (LED) light source packaging structure |
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| CN102148319A true CN102148319A (en) | 2011-08-10 |
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| CN2011100366156A Pending CN102148319A (en) | 2011-01-24 | 2011-01-24 | High-power white light emitting diode (LED) light source packaging structure |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103346152A (en) * | 2013-06-24 | 2013-10-09 | 江西量一光电科技有限公司 | Adjustable 380-780nm wavelength COB packing technique |
| CN103855278A (en) * | 2014-01-26 | 2014-06-11 | 上海瑞丰光电子有限公司 | LED packaging structure and illumination equipment |
| CN106525103A (en) * | 2016-10-27 | 2017-03-22 | 深圳市康通科技有限公司 | Electrode installation structure and method of ultrasonic sensor |
| JP2022184689A (en) * | 2021-05-31 | 2022-12-13 | 日亜化学工業株式会社 | light emitting device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2001320091A (en) * | 2001-03-29 | 2001-11-16 | Clarion Co Ltd | Cap member for led and led illuminator provided with the same |
| US6812503B2 (en) * | 2001-11-29 | 2004-11-02 | Highlink Technology Corporation | Light-emitting device with improved reliability |
| CN2729907Y (en) * | 2004-10-08 | 2005-09-28 | 陈天宇 | Improved structure of white light LED |
| CN201146197Y (en) * | 2007-12-21 | 2008-11-05 | 亿光电子工业股份有限公司 | Led device and fluorescence casing thereof |
| CN101369614A (en) * | 2007-08-17 | 2009-02-18 | 刘胜 | Packaging structure and method for high power white light LED |
| CN202018990U (en) * | 2011-01-24 | 2011-10-26 | 佛山电器照明股份有限公司 | High-power white-light LED light source encapsulating structure |
-
2011
- 2011-01-24 CN CN2011100366156A patent/CN102148319A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001320091A (en) * | 2001-03-29 | 2001-11-16 | Clarion Co Ltd | Cap member for led and led illuminator provided with the same |
| US6812503B2 (en) * | 2001-11-29 | 2004-11-02 | Highlink Technology Corporation | Light-emitting device with improved reliability |
| CN2729907Y (en) * | 2004-10-08 | 2005-09-28 | 陈天宇 | Improved structure of white light LED |
| CN101369614A (en) * | 2007-08-17 | 2009-02-18 | 刘胜 | Packaging structure and method for high power white light LED |
| CN201146197Y (en) * | 2007-12-21 | 2008-11-05 | 亿光电子工业股份有限公司 | Led device and fluorescence casing thereof |
| CN202018990U (en) * | 2011-01-24 | 2011-10-26 | 佛山电器照明股份有限公司 | High-power white-light LED light source encapsulating structure |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103346152A (en) * | 2013-06-24 | 2013-10-09 | 江西量一光电科技有限公司 | Adjustable 380-780nm wavelength COB packing technique |
| CN103855278A (en) * | 2014-01-26 | 2014-06-11 | 上海瑞丰光电子有限公司 | LED packaging structure and illumination equipment |
| CN106525103A (en) * | 2016-10-27 | 2017-03-22 | 深圳市康通科技有限公司 | Electrode installation structure and method of ultrasonic sensor |
| JP2022184689A (en) * | 2021-05-31 | 2022-12-13 | 日亜化学工業株式会社 | light emitting device |
| JP7303453B2 (en) | 2021-05-31 | 2023-07-05 | 日亜化学工業株式会社 | light emitting device |
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Application publication date: 20110810 |