CN207883721U - A kind of LED light bar with excellent heat dispersion performance - Google Patents
A kind of LED light bar with excellent heat dispersion performance Download PDFInfo
- Publication number
- CN207883721U CN207883721U CN201721532573.4U CN201721532573U CN207883721U CN 207883721 U CN207883721 U CN 207883721U CN 201721532573 U CN201721532573 U CN 201721532573U CN 207883721 U CN207883721 U CN 207883721U
- Authority
- CN
- China
- Prior art keywords
- led chip
- groove
- substrate
- conducting layer
- metal conducting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000006185 dispersion Substances 0.000 title claims abstract description 11
- 229910052751 metal Inorganic materials 0.000 claims abstract description 45
- 239000002184 metal Substances 0.000 claims abstract description 45
- 239000000758 substrate Substances 0.000 claims abstract description 43
- 239000000084 colloidal system Substances 0.000 claims abstract description 21
- 239000000463 material Substances 0.000 claims abstract description 12
- 229910000679 solder Inorganic materials 0.000 claims description 10
- 239000000853 adhesive Substances 0.000 claims description 9
- 230000001070 adhesive Effects 0.000 claims description 9
- 238000009413 insulation Methods 0.000 claims description 8
- 230000003287 optical Effects 0.000 claims description 5
- 238000006243 chemical reaction Methods 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 239000007769 metal material Substances 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N silver Chemical compound 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[Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 abstract description 12
- 230000000694 effects Effects 0.000 abstract description 5
- 238000000605 extraction Methods 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminum Chemical compound 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- 238000001816 cooling Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
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- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicium dioxide Chemical compound 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- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 239000005439 thermosphere Substances 0.000 description 1
Abstract
The utility model discloses a kind of LED light bars with excellent heat dispersion performance.The LED light bar includes substrate, metal conducting layer, packing colloid, several LED chips.The surface of substrate is provided with several grooves.LED chip is mounted in groove.Metal conducting layer attaches on a surface of a substrate.Metal conducting layer is for each LED chip to be electrically connected.Packing colloid is for filling groove, sealed LED chip.The LED chip of the lamp bar structure is directly installed in the groove of substrate, eliminates package support, is kept lamp bar structure simpler, is reduced material cost；More important advantage is that the heat that LED chip generates can directly be scattered on substrate, many heat dissipation links are omitted, to make thermal resistance substantially reduce, improve the heat dissipation effect of LED.
Description
Technical field
The utility model is related to lamp bar technical field more particularly to a kind of LED light bars with excellent heat dispersion performance.
Background technology
In recent years, as the performance of LED quickly improves, application is increasingly extensive, in various illuminations and display backlight side
Face obtains a large amount of application.As shown in Figure 1, universal application mode is that LED chip 4 is encapsulated in holder or base first at present
LED component is formed on plate, and LED packagings are then mounted on by PCB surface using SMT patches mode again.LED chip 4 passes through
10 die bond of crystal-bonding adhesive realizes electrical connection, packaging plastic in the package support being made of colloid 6 and sheet metal 7, using gold thread 20 is beaten
LED chip 4 is encapsulated in holder by body 3, so as to form LEDSMD packagings a；Then by SMD packaging a patches
The mode of reflux is welded on the surfaces pcb board b by solder 30, and pcb board b is by 1 group of metal conducting layer 2, thermal insulation layer 5 and substrate
At.
Currently, illuminating in backlight application, LED light bar is largely used.As shown in Fig. 2, plurality of LEDs packaging a is adopted
With structure shown in FIG. 1, be arranged on long narrow pcb board b, plurality of LEDs device a can connect can also parallel connection be electrically connected to realize
It connects.This LED component paster structure and lamp bar structure using SMD forms, the heat that LED chip 4 generates is to pass through crystal-bonding adhesive
10, package support and solder 30 are scattered to the surface of PCB.LED sinking paths in this way include LED chip 4 and 10 boundary of crystal-bonding adhesive
Face, the interface of crystal-bonding adhesive 10 and package support, package support, the interface of package support and solder 30, solder 30, solder 30 with
The interface of pcb board b and substrate 1, last pcb board reject heat to again its it is fixed it is heat sink on.The therefrom road as it can be seen that LED chip 4 radiates
Diameter is longer, and heat dissipation interface is more.It, will be highly beneficial to the heat dissipation of LED chip 4 if heat dissipation link and interface can be reduced.
Utility model content
In view of the deficiencies of the prior art, the utility model proposes a kind of LED light bar with excellent heat dispersion performance, the lamps
The LED chip of item is directly installed in the groove of substrate, eliminates package support, and the heat that LED chip generates can directly dissipate
Onto substrate, many heat dissipation links are omitted, solve the problems, such as existing lamp bar poor radiation.
To achieve the goals above, technical solutions of the utility model are as follows：
A kind of LED light bar with excellent heat dispersion performance, including substrate, metal conducting layer, packing colloid, several LED cores
Piece.The surface of substrate is provided with several grooves.LED chip is mounted in groove.Metal conducting layer attaches on the surface of the substrate
On.Metal conducting layer is for each LED chip to be electrically connected.Packing colloid is for filling groove, sealed LED chip.Metal is led
Electric layer is in bar shaped.Metal conducting layer is connected across between two grooves.The both ends of metal conducting layer are located in groove.LED chip
Underrun crystal-bonding adhesive is fixed on the bottom surface of groove.The electrode of LED chip is connected by conducting wire with metal conducting layer.
Further, LED chip is flip-chip.The electrode of LED chip is welded on by solder on metal conducting layer.
Further, if further including dry lens.Lens are located at the upper surface of groove.Also, the optical centre and groove of lens
The light center that goes out of interior LED chips coincides.
Further, substrate is made of metal material.It is isolated by thermal insulation layer between metal conducting layer and substrate.
Further, it is provided with silver coating on the surface of groove.
Further, groove is in acclive circular groove shape.
Further, contain light conversion material in packing colloid.
A kind of substrate is provided with several grooves on surface.Groove is for installing LED chip.
The beneficial effects of the utility model：
The LED chip of the lamp bar structure is directly installed in the groove of substrate, eliminates package support, makes lamp bar structure more
Add simply, reduces material cost；More important advantage is that the heat that LED chip generates can be directly scattered on substrate, be omitted
Many heat dissipation links to make thermal resistance substantially reduce improve the heat dissipation effect of LED.It is higher especially for cooling requirements
Great power LED application scenario, for example, large driven current density great power LED direct-type backlight lamp bar, this structure is highly beneficial
's.
Description of the drawings
Fig. 1 is tradition SMDLED paster structure schematic diagrames.
Fig. 2 is the LED light bar schematic diagram that conventionally employed SMDLED paster structures are formed.
Fig. 3 is the utility model first embodiment cross-sectional view.
Fig. 4 is the utility model first embodiment schematic top plan view.
Fig. 5 is the utility model second embodiment cross-sectional view.
Fig. 6 is the utility model second embodiment schematic top plan view.
Fig. 7 is the utility model 3rd embodiment cross-sectional view.
Fig. 8 is the utility model fourth embodiment cross-sectional view.
Wherein, the reference numeral of Fig. 1 to Fig. 8 is：Substrate 1, metal conducting layer 2, packing colloid 3, LED chip 4, insulation are led
Thermosphere 5, colloid 6, sheet metal 7, lens 8；Crystal-bonding adhesive 10, conducting wire 20, solder 30；Groove 11.
Specific implementation mode
With reference to the accompanying drawings and examples, the utility model is expanded on further.
Embodiment 1：
As shown in Figure 3-4, a kind of LED light bar with excellent heat dispersion performance, including substrate 1, metal conducting layer 2, encapsulation
Colloid 3, several LED chips 4.
The surface of substrate 1 is provided with several grooves 11；Each groove 11 is in linear array or matrix arrangement.LED chip 4 is pacified
In groove 11.Specifically, the bottom surface of groove 11 is die bond region；The underrun crystal-bonding adhesive 10 of LED chip 4 is fixed on recessed
On the bottom surface of slot 11.The electrode of LED chip 4 is connected by conducting wire 20 with metal conducting layer 2.Metal conducting layer 2 is used for will be each
LED chip 4 is electrically connected.Metal conducting layer 2 is attached on the surface of substrate 1.Packing colloid 3 is used to fill the sky of groove 11
Between, sealed LED chip 4.
Preferably, being provided with silver coating on the surface of groove 11, the light extraction efficiency of LED chip 4 is improved.
Specifically, substrate 1 is made of metal material.Preferably, substrate 1 is made of aluminium material.Metal conducting layer 2 and substrate
It is isolated by thermal insulation layer 5 between 1 so that metal conducting layer 2 insulate with 1 phase of substrate.
Specifically, metal conducting layer 2 is in bar shaped, and metal conducting layer 2 is connected across between two grooves 11, metal conducting layer 2
Both ends be located in groove 11.
Specifically, groove 11 is in acclive circular groove shape.
Specifically, packing colloid 3 is made of the transparent colloids material such as silica gel, epoxy resin.Contain fluorescence in packing colloid 3
Powder or other light conversion materials.
LED chip 4 can be blue-light LED chip, red LED chip, yellow light LED chip or green LED chip etc..
LED chip 4 is directly encapsulated into the groove 11 on substrate 1, eliminates package support, keeps lamp bar structure simpler
It is single, reduce material cost.Also, LED chip 4 is directly rejected heat to by crystal-bonding adhesive 10 on substrate 1, and the link of heat dissipation is reduced
And interface, so that LED heat dissipation effects is substantially improved.
Embodiment 2：
As seen in figs. 5-6, a kind of LED light bar with excellent heat dispersion performance, including substrate 1, metal conducting layer 2, encapsulation
Colloid 3, several LED chips 4.
The surface of substrate 1 is provided with several grooves 11；Each groove 11 is in linear array or matrix arrangement.LED chip 4 is pacified
In groove 11.LED chip 4 is flip-chip.The electrode of LED chip 4 is welded on by solder 30 on metal conducting layer 2.
Metal conducting layer 2 is for each LED chip 4 to be electrically connected.Metal conducting layer 2 is attached on the surface of substrate 1；And metallic conduction
It is isolated by thermal insulation layer 5 between layer 2 and substrate 1 so that metal conducting layer 2 insulate with 1 phase of substrate.Packing colloid 3 is used
In the space of filling groove 11, sealed LED chip 4.
Preferably, being provided with silver coating on the surface of groove 11, the light extraction efficiency of LED chip 4 is improved.
Specifically, substrate 1 is made of metal material.Preferably, substrate 1 is made of aluminium material.Metal conducting layer 2 and substrate
It is isolated by thermal insulation layer 5 between 1 so that metal conducting layer 2 insulate with 1 phase of substrate.
Specifically, metal conducting layer 2 is in bar shaped, and metal conducting layer 2 is connected across between two grooves 11, metal conducting layer 2
Both ends be located in groove 11.
Specifically, groove 11 is in acclive circular groove shape.
Specifically, packing colloid 3 is made of the transparent colloids material such as silica gel, epoxy resin.Contain fluorescence in packing colloid 3
Powder or other light conversion materials.
LED chip 4 can be blue-light LED chip, red LED chip, yellow light LED chip or green LED chip etc..
LED chip 4 is directly encapsulated into the groove 11 on substrate 1, eliminates package support, keeps lamp bar structure simpler
It is single, reduce material cost.Also, LED chip 4 is directly rejected heat to by solder 30, metal conducting layer 2 and thermal insulation layer 5
On substrate 1, reduces link and the interface of heat dissipation, LED heat dissipation effects is made to be improved.It is higher especially for cooling requirements
Great power LED application scenario, for example, large driven current density great power LED direct-type backlight lamp bar, this structure is highly beneficial
's.
Embodiment 3：
As shown in fig. 7, being a kind of diagrammatic cross-section of the LED light bar with excellent heat dispersion performance.The present embodiment is being implemented
On the basis of example 1, lens 8 are increased in the top of LED chip 4, it is therefore an objective to the light extraction of LED chip 4 is redistributed,
To form required smooth shape distribution.Lens 8 are mounted on the upper surface of groove 11, the optics of lens 8 by the way of glue bond
Center is aligned with the light center that goes out of LED chip 4 in groove 11 so that light shape reaches the optical requirement of design.
The present embodiment can be used for the lamp bar of direct-light type LED backlight lamp bar and direct type flat plate light, and the lens 8 on surface are by LED
Shining for chip 4 is evenly dispersed, after the uniform light spots that plurality of LEDs chip 4 is formed cover entire panel, realizes entire panel
Uniform light distribution.
Embodiment 4：
As shown in figure 8, being a kind of diagrammatic cross-section of the LED light bar with excellent heat dispersion performance.The present embodiment is being implemented
On the basis of example 2, lens 8 are increased in the top of LED chip 4, it is therefore an objective to the light extraction of LED chip 4 is redistributed,
To form required smooth shape distribution.Lens 8 are mounted on by the way of glue bond on groove 11, the optical centre of lens 8
It is aligned with the light center that goes out of LED chip 4 in groove 11 so that light shape reaches the optical requirement of design.
The present embodiment can be used for the lamp bar of direct-light type LED backlight lamp bar and direct type flat plate light, and the lens 8 on surface are by LED
Shining for chip 4 is evenly dispersed, after the uniform light spots that plurality of LEDs chip 4 is formed cover entire panel, realizes entire panel
Uniform light distribution.
Above-described is only preferred embodiments of the present invention, and the utility model is not limited to above example.It can
With understand, those skilled in the art directly export or associate under the premise of not departing from the basic conception of the utility model its
It is improved and variation is considered as being included within the scope of protection of this utility model.
Claims (1)
1. a kind of LED light bar with excellent heat dispersion performance, it is characterised in that：
Including substrate (1), metal conducting layer (2), packing colloid (3), several LED chips (4)；
The surface of the substrate (1) is provided with several grooves (11)；
The LED chip (4) is mounted in groove (11)；
The metal conducting layer (2) is attached on the surface of substrate (1)；
The metal conducting layer (2) is used to each LED chip (4) being electrically connected；
The packing colloid (3) is for filling groove (11), sealed LED chip (4)；
The LED chip (4) is flip-chip；
The electrode of the LED chip (4) is welded on by solder (30) on metal conducting layer (2)；
If further including dry lens (8)；
The lens (8) are located at the upper surface of groove (11)；Also,
The optical centre and the light center that goes out of groove (11) interior LED chip (4) of the lens (8) coincide；
The substrate (1) is made of metal material；
It is isolated by thermal insulation layer (5) between the metal conducting layer (2) and substrate (1)；
The metal conducting layer (2) is in bar shaped；
The metal conducting layer (2) is connected across between two grooves (11)；
The both ends of the metal conducting layer (2) are located in groove (11)；
It is provided with silver coating on the surface of the groove (11)；
The groove (11) is in acclive circular groove shape；
Contain light conversion material in the packing colloid (3)；
The underrun crystal-bonding adhesive (10) of the LED chip (4) is fixed on the bottom surface of groove (11)；
The electrode of the LED chip (4) is connected by conducting wire (20) with metal conducting layer (2).
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721532573.4U CN207883721U (en) | 2017-11-16 | 2017-11-16 | A kind of LED light bar with excellent heat dispersion performance |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721532573.4U CN207883721U (en) | 2017-11-16 | 2017-11-16 | A kind of LED light bar with excellent heat dispersion performance |
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| CN207883721U true CN207883721U (en) | 2018-09-18 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112017550A (en) * | 2019-05-31 | 2020-12-01 | 云谷（固安）科技有限公司 | Display panel, manufacturing method thereof and display device |
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2017
- 2017-11-16 CN CN201721532573.4U patent/CN207883721U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112017550A (en) * | 2019-05-31 | 2020-12-01 | 云谷（固安）科技有限公司 | Display panel, manufacturing method thereof and display device |
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