CN207883721U - A kind of LED light bar with excellent heat dispersion performance - Google Patents
A kind of LED light bar with excellent heat dispersion performance Download PDFInfo
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Abstract
本实用新型公开了一种具有良好散热性能的LED灯条。该LED灯条包括基板、金属导电层、封装胶体、若干LED芯片。基板的表面设置有若干个凹槽。LED芯片安装在凹槽内。金属导电层贴附在基板的表面上。金属导电层用于将各LED芯片电气连接。封装胶体用于填充凹槽，密封LED芯片。该灯条结构的LED芯片直接安装在基板的凹槽内，省掉了封装支架，使灯条结构更加简单，降低了材料成本；更重要的优点是，LED芯片产生的热，能够直接散到基板上，省略了诸多散热环节，从而使热阻大大降低，改善LED的散热效果。
The utility model discloses an LED lamp bar with good heat dissipation performance. The LED light bar includes a substrate, a metal conductive layer, an encapsulating colloid, and several LED chips. Several grooves are arranged on the surface of the substrate. The LED chip is installed in the groove. The metal conductive layer is attached on the surface of the substrate. The metal conductive layer is used to electrically connect each LED chip. The encapsulant is used to fill the groove and seal the LED chip. The LED chip of the light bar structure is directly installed in the groove of the substrate, which saves the packaging bracket, makes the structure of the light bar simpler, and reduces the cost of materials; the more important advantage is that the heat generated by the LED chip can be directly dissipated to On the substrate, many heat dissipation links are omitted, so that the thermal resistance is greatly reduced and the heat dissipation effect of the LED is improved.
Description
技术领域technical field
本实用新型涉及灯条技术领域，尤其涉及一种具有良好散热性能的LED灯条。The utility model relates to the technical field of light bars, in particular to an LED light bar with good heat dissipation performance.
背景技术Background technique
近年来，随着LED的性能快速提高，其应用日趋广泛，在各种照明和显示背光源方面获得了大量的应用。如图1所示，目前普遍的应用方式是LED芯片4首先封装在支架内或基板上形成LED器件，然后再采用SMT贴片方式将LED封装器件贴装在PCB表面。LED芯片4通过固晶胶10固晶在由胶体6和金属片7组成的封装支架内，采用打金线20实现电连接，封装胶体3将LED芯片4封装在支架内，从而形成了LEDSMD封装器件a；然后将SMD封装器件a用贴片回流的方式通过焊料30焊接在PCB板b表面，PCB板b由金属导电层2、绝缘导热层5和基板1组成。In recent years, with the rapid improvement of the performance of LED, its application has become more and more extensive, and it has obtained a large number of applications in various lighting and display backlight sources. As shown in FIG. 1 , the current common application method is that the LED chip 4 is first packaged in a bracket or on a substrate to form an LED device, and then the LED packaged device is mounted on the surface of the PCB by SMT. The LED chip 4 is solidified in the packaging bracket composed of the colloid 6 and the metal sheet 7 through the crystal-bonding glue 10, and the electrical connection is realized by using a gold wire 20, and the packaging colloid 3 encapsulates the LED chip 4 in the bracket, thereby forming an LEDSMD package. Device a; then solder the SMD packaged device a on the surface of the PCB board b through the solder 30 in the way of chip reflow, and the PCB board b is composed of a metal conductive layer 2 , an insulating and thermally conductive layer 5 and a substrate 1 .
目前，在照明和背光应用中，大量使用LED灯条。如图2所示，多颗LED封装器件a采用图1所示的结构，排布在窄长的PCB板b上，多颗LED器件a可以串联也可以并联来实现电连接。这种采用SMD形式的LED器件贴片结构及灯条结构，LED芯片4产生的热量是通过固晶胶10、封装支架和焊料30散到PCB的表面。这样LED散热途径，包括了LED芯片4与固晶胶10界面、固晶胶10与封装支架的界面、封装支架、封装支架与焊料30的界面、焊料 30、焊料30与PCB板b的界面和基板1，最后PCB板再散热到其固定的热沉上。从中可见， LED芯片4散热路径较长，散热界面较多。如果能够减少散热环节和界面，对LED芯片4的散热将非常有利。Currently, LED strips are heavily used in lighting and backlighting applications. As shown in Figure 2, multiple LED packaged devices a adopt the structure shown in Figure 1 and are arranged on a narrow and long PCB board b, and multiple LED devices a can be connected in series or in parallel to realize electrical connection. In the LED device patch structure and light bar structure in the form of SMD, the heat generated by the LED chip 4 is dissipated to the surface of the PCB through the die-bonding adhesive 10 , the packaging bracket and the solder 30 . The LED heat dissipation approach includes the interface between the LED chip 4 and the crystal-bonding glue 10, the interface between the crystal-bonding glue 10 and the packaging bracket, the packaging bracket, the interface between the packaging bracket and the solder 30, the solder 30, the interface between the solder 30 and the PCB board b, and Substrate 1, and finally the PCB board dissipates heat to its fixed heat sink. It can be seen that the heat dissipation path of the LED chip 4 is relatively long, and there are many heat dissipation interfaces. If heat dissipation links and interfaces can be reduced, it will be very beneficial to the heat dissipation of the LED chip 4 .
实用新型内容Utility model content
针对现有技术的不足，本实用新型提出了一种具有良好散热性能的LED灯条，该灯条的 LED芯片直接安装在基板的凹槽内，省掉了封装支架，LED芯片产生的热，能够直接散到基板上，省略了诸多散热环节，解决了现有灯条散热性差的问题。Aiming at the deficiencies of the prior art, the utility model proposes an LED light bar with good heat dissipation performance. The LED chip of the light bar is directly installed in the groove of the substrate, which saves the packaging bracket and the heat generated by the LED chip. It can be directly scattered on the substrate, omitting many heat dissipation links, and solves the problem of poor heat dissipation of the existing light bar.
为了实现上述目的，本实用新型技术方案如下：In order to achieve the above object, the technical scheme of the utility model is as follows:
一种具有良好散热性能的LED灯条，包括基板、金属导电层、封装胶体、若干LED芯片。基板的表面设置有若干个凹槽。LED芯片安装在凹槽内。金属导电层贴附在基板的表面上。金属导电层用于将各LED芯片电气连接。封装胶体用于填充凹槽，密封LED芯片。金属导电层呈条形。金属导电层跨接在两个凹槽之间。金属导电层的两端位于凹槽内。LED芯片的底面通过固晶胶固定在凹槽的底面上。LED芯片的电极通过导线与金属导电层相连接。An LED light bar with good heat dissipation performance includes a substrate, a metal conductive layer, packaging colloid, and several LED chips. The surface of the substrate is provided with several grooves. The LED chip is installed in the groove. The metal conductive layer is attached on the surface of the substrate. The metal conductive layer is used to electrically connect each LED chip. The encapsulant is used to fill the groove and seal the LED chip. The metal conductive layer is strip-shaped. The metal conductive layer bridges between the two grooves. Both ends of the metal conductive layer are located in the groove. The bottom surface of the LED chip is fixed on the bottom surface of the groove by a die-bonding glue. The electrodes of the LED chip are connected to the metal conductive layer through wires.
进一步地，LED芯片为倒装芯片。LED芯片的电极通过焊料焊接在金属导电层上。Further, the LED chip is a flip chip. The electrodes of the LED chip are welded on the metal conductive layer by solder.
进一步地，还包括若干透镜。透镜位于凹槽的上面。并且，透镜的光学中心与凹槽内LED 芯片的出光中心相重合。Further, several lenses are also included. The lens is located above the groove. Moreover, the optical center of the lens coincides with the light emitting center of the LED chip in the groove.
进一步地，基板由金属材质制成。金属导电层与基板之间通过绝缘导热层相隔离。Further, the substrate is made of metal material. The metal conductive layer is isolated from the substrate by an insulating and thermally conductive layer.
进一步地，凹槽的表面上设置有镀银层。Further, a silver-plated layer is provided on the surface of the groove.
进一步地，凹槽呈带有坡度的圆槽状。Further, the groove is in the shape of a circular groove with a slope.
进一步地，封装胶体内含有光转换材料。Further, the encapsulation colloid contains light conversion material.
一种基板，表面上设置有若干个凹槽。凹槽用于安装LED芯片。A substrate with several grooves on its surface. The grooves are used to install LED chips.
本实用新型的有益效果：The beneficial effects of the utility model:
该灯条结构的LED芯片直接安装在基板的凹槽内，省掉了封装支架，使灯条结构更加简单，降低了材料成本；更重要的优点是，LED芯片产生的热，能够直接散到基板上，省略了诸多散热环节，从而使热阻大大降低，改善LED的散热效果。特别是对于散热要求较高的大功率LED应用场合，例如大电流驱动的大功率LED直下式背光灯条，这种结构是非常有利的。The LED chip of the light bar structure is directly installed in the groove of the substrate, which saves the packaging bracket, makes the structure of the light bar simpler, and reduces the cost of materials; the more important advantage is that the heat generated by the LED chip can be directly dissipated to On the substrate, many heat dissipation links are omitted, so that the thermal resistance is greatly reduced and the heat dissipation effect of the LED is improved. This structure is especially advantageous for high-power LED applications that require high heat dissipation, such as high-power LED direct-lit backlight strips driven by high current.
附图说明Description of drawings
图1为传统SMDLED贴片结构示意图。Figure 1 is a schematic diagram of the structure of a traditional SMD LED patch.
图2为传统采用SMDLED贴片结构形成的LED灯条示意图。Fig. 2 is a schematic diagram of an LED light bar formed by a traditional SMD LED patch structure.
图3为本实用新型第一实施例剖面结构示意图。Fig. 3 is a schematic cross-sectional structure diagram of the first embodiment of the utility model.
图4为本实用新型第一实施例俯视示意图。Fig. 4 is a schematic top view of the first embodiment of the utility model.
图5为本实用新型第二实施例剖面结构示意图。Fig. 5 is a schematic cross-sectional structure diagram of the second embodiment of the present invention.
图6为本实用新型第二实施例俯视示意图。Fig. 6 is a schematic top view of the second embodiment of the present invention.
图7为本实用新型第三实施例剖面结构示意图。Fig. 7 is a schematic cross-sectional structure diagram of the third embodiment of the present invention.
图8为本实用新型第四实施例剖面结构示意图。Fig. 8 is a schematic cross-sectional structure diagram of the fourth embodiment of the present invention.
其中，图1至图8的附图标记为：基板1、金属导电层2、封装胶体3、LED芯片4、绝缘导热层5、胶体6、金属片7、透镜8；固晶胶10、导线20、焊料30；凹槽11。Wherein, reference numerals in Fig. 1 to Fig. 8 are: substrate 1, metal conductive layer 2, encapsulation colloid 3, LED chip 4, insulating and heat-conducting layer 5, colloid 6, metal sheet 7, lens 8; die-bonding glue 10, wire 20. Solder 30; Groove 11.
具体实施方式Detailed ways
下面结合附图和实施例，进一步阐述本实用新型。Below in conjunction with accompanying drawing and embodiment, further set forth the utility model.
实施例1：Example 1:
如图3-4所示，一种具有良好散热性能的LED灯条，包括基板1、金属导电层2、封装胶体3、若干LED芯片4。As shown in FIG. 3-4 , an LED light bar with good heat dissipation performance includes a substrate 1 , a metal conductive layer 2 , an encapsulant 3 , and several LED chips 4 .
基板1的表面设置有若干个凹槽11；各凹槽11呈线形排列或矩阵排列。LED芯片4安装在凹槽11内。具体地，凹槽11的底面为固晶区域；LED芯片4的底面通过固晶胶10固定在凹槽11的底面上。LED芯片4的电极通过导线20与金属导电层2相连接。金属导电层2用于将各LED芯片4电气连接。金属导电层2贴附在基板1的表面上。封装胶体3用于填充凹槽11的空间，密封LED芯片4。The surface of the substrate 1 is provided with several grooves 11; the grooves 11 are arranged in a line or in a matrix. The LED chip 4 is installed in the groove 11 . Specifically, the bottom surface of the groove 11 is a die-bonding area; the bottom surface of the LED chip 4 is fixed on the bottom surface of the groove 11 by the die-bonding glue 10 . The electrodes of the LED chip 4 are connected to the metal conductive layer 2 through wires 20 . The metal conductive layer 2 is used to electrically connect each LED chip 4 . The metal conductive layer 2 is attached on the surface of the substrate 1 . The encapsulant 3 is used to fill the space of the groove 11 and seal the LED chip 4 .
较佳地，凹槽11的表面上设置有镀银层，提高LED芯片4的出光效率。Preferably, a silver-plated layer is provided on the surface of the groove 11 to improve the light extraction efficiency of the LED chip 4 .
具体地，基板1由金属材质制成。较佳地，基板1由铝材质制成。金属导电层2与基板1 之间通过绝缘导热层5相隔离，使得金属导电层2与基板1相绝缘。Specifically, the substrate 1 is made of metal material. Preferably, the substrate 1 is made of aluminum. The conductive metal layer 2 is isolated from the substrate 1 by the insulating and thermally conductive layer 5 , so that the conductive metal layer 2 is insulated from the substrate 1 .
具体地，金属导电层2呈条形，金属导电层2跨接在两个凹槽11之间，金属导电层2的两端位于凹槽11内。Specifically, the conductive metal layer 2 is strip-shaped, the conductive metal layer 2 bridges between two grooves 11 , and both ends of the conductive metal layer 2 are located in the grooves 11 .
具体地，凹槽11呈带有坡度的圆槽状。Specifically, the groove 11 is in the shape of a circular groove with a slope.
具体地，封装胶体3由硅胶、环氧树脂等透明胶体材料制成。封装胶体3内含有荧光粉或其它光转换材料。Specifically, the packaging colloid 3 is made of transparent colloidal materials such as silica gel and epoxy resin. The packaging colloid 3 contains fluorescent powder or other light conversion materials.
LED芯片4可以是蓝光LED芯片、红光LED芯片、黄光LED芯片或者绿光LED芯片等。The LED chip 4 may be a blue LED chip, a red LED chip, a yellow LED chip or a green LED chip and the like.
LED芯片4直接封装在基板1上的凹槽11内，省掉了封装支架，使灯条结构更加简单，降低了材料成本。并且，LED芯片4直接通过固晶胶10散热到基板1上，减少了散热的环节和界面，使LED散热效果大大改善。The LED chip 4 is directly packaged in the groove 11 on the substrate 1, which saves the packaging bracket, makes the structure of the light bar simpler, and reduces the cost of materials. Moreover, the LED chip 4 dissipates heat directly to the substrate 1 through the die-bonding glue 10 , which reduces heat dissipation links and interfaces, and greatly improves the heat dissipation effect of the LED.
实施例2：Example 2:
如图5-6所示，一种具有良好散热性能的LED灯条，包括基板1、金属导电层2、封装胶体3、若干LED芯片4。As shown in FIGS. 5-6 , an LED light bar with good heat dissipation performance includes a substrate 1 , a metal conductive layer 2 , an encapsulant 3 , and several LED chips 4 .
基板1的表面设置有若干个凹槽11；各凹槽11呈线形排列或矩阵排列。LED芯片4安装在凹槽11内。LED芯片4为倒装芯片。LED芯片4的电极通过焊料30焊接在金属导电层2上。金属导电层2用于将各LED芯片4电气连接。金属导电层2贴附在基板1的表面上；且金属导电层2与基板1之间通过绝缘导热层5相隔离，使得金属导电层2与基板1相绝缘。封装胶体3用于填充凹槽11的空间，密封LED芯片4。The surface of the substrate 1 is provided with several grooves 11; the grooves 11 are arranged in a line or in a matrix. The LED chip 4 is installed in the groove 11 . The LED chip 4 is a flip chip. The electrodes of the LED chip 4 are welded on the metal conductive layer 2 through the solder 30 . The metal conductive layer 2 is used to electrically connect each LED chip 4 . The conductive metal layer 2 is attached on the surface of the substrate 1 ; The encapsulant 3 is used to fill the space of the groove 11 and seal the LED chip 4 .
较佳地，凹槽11的表面上设置有镀银层，提高LED芯片4的出光效率。Preferably, a silver-plated layer is provided on the surface of the groove 11 to improve the light extraction efficiency of the LED chip 4 .
具体地，基板1由金属材质制成。较佳地，基板1由铝材质制成。金属导电层2与基板1 之间通过绝缘导热层5相隔离，使得金属导电层2与基板1相绝缘。Specifically, the substrate 1 is made of metal material. Preferably, the substrate 1 is made of aluminum. The conductive metal layer 2 is isolated from the substrate 1 by the insulating and thermally conductive layer 5 , so that the conductive metal layer 2 is insulated from the substrate 1 .
具体地，金属导电层2呈条形，金属导电层2跨接在两个凹槽11之间，金属导电层2的两端位于凹槽11内。Specifically, the conductive metal layer 2 is strip-shaped, the conductive metal layer 2 bridges between two grooves 11 , and both ends of the conductive metal layer 2 are located in the grooves 11 .
具体地，凹槽11呈带有坡度的圆槽状。Specifically, the groove 11 is in the shape of a circular groove with a slope.
具体地，封装胶体3由硅胶、环氧树脂等透明胶体材料制成。封装胶体3内含有荧光粉或其它光转换材料。Specifically, the packaging colloid 3 is made of transparent colloidal materials such as silica gel and epoxy resin. The packaging colloid 3 contains fluorescent powder or other light conversion materials.
LED芯片4可以是蓝光LED芯片、红光LED芯片、黄光LED芯片或者绿光LED芯片等。The LED chip 4 may be a blue LED chip, a red LED chip, a yellow LED chip or a green LED chip and the like.
LED芯片4直接封装在基板1上的凹槽11内，省掉了封装支架，使灯条结构更加简单，降低了材料成本。并且，LED芯片4直接通过焊料30、金属导电层2和绝缘导热层5散热到基板1上，减少了散热的环节和界面，使LED散热效果得到改善。特别是对于散热要求较高的大功率LED应用场合，例如大电流驱动的大功率LED直下式背光灯条，这种结构是非常有利的。The LED chip 4 is directly packaged in the groove 11 on the substrate 1, which saves the packaging bracket, makes the structure of the light bar simpler, and reduces the cost of materials. Moreover, the LED chip 4 dissipates heat directly to the substrate 1 through the solder 30 , the metal conductive layer 2 and the insulating and heat-conducting layer 5 , which reduces heat dissipation links and interfaces, and improves the LED heat dissipation effect. This structure is especially advantageous for high-power LED applications that require high heat dissipation, such as high-power LED direct-lit backlight strips driven by high current.
实施例3：Example 3:
如图7所示，为一种具有良好散热性能的LED灯条的剖面示意图。本实施例在实施例1 的基础上，在LED芯片4的上方增加了透镜8，目的是将LED芯片4的出光进行重新分布，以便形成所需要的光形分布。透镜8采用胶粘合的方式贴装在凹槽11的上面，透镜8的光学中心与凹槽11内LED芯片4的出光中心对准，使得光形达到设计的光学要求。As shown in FIG. 7 , it is a schematic cross-sectional view of an LED light bar with good heat dissipation performance. In this embodiment, on the basis of Embodiment 1, a lens 8 is added above the LED chip 4 for the purpose of redistributing the light output from the LED chip 4 so as to form a required light shape distribution. The lens 8 is mounted on the groove 11 by glue, and the optical center of the lens 8 is aligned with the light output center of the LED chip 4 in the groove 11, so that the light shape meets the optical requirements of the design.
本实施例可用于直下式LED背光灯条和直下式平板灯的灯条，表面的透镜8将LED芯片4 的发光均匀分散，多颗LED芯片4形成的均匀光斑覆盖整个面板后，实现了整个面板均匀的光分布。This embodiment can be used for direct-lit LED backlight strips and direct-lit panel light strips. The lens 8 on the surface evenly disperses the light from the LED chips 4. After the uniform light spots formed by multiple LED chips 4 cover the entire panel, the entire panel is realized Homogeneous light distribution of the panel.
实施例4：Example 4:
如图8所示，为一种具有良好散热性能的LED灯条的剖面示意图。本实施例在实施例2 的基础上，在LED芯片4的上方增加了透镜8，目的是将LED芯片4的出光进行重新分布，以便形成所需要的光形分布。透镜8采用胶粘合的方式贴装在凹槽11上，透镜8的光学中心与凹槽11内LED芯片4的出光中心对准，使得光形达到设计的光学要求。As shown in FIG. 8 , it is a schematic cross-sectional view of an LED light bar with good heat dissipation performance. In this embodiment, on the basis of Embodiment 2, a lens 8 is added above the LED chip 4 for the purpose of redistributing the light emitted by the LED chip 4 so as to form a required light shape distribution. The lens 8 is mounted on the groove 11 by glue, and the optical center of the lens 8 is aligned with the light output center of the LED chip 4 in the groove 11, so that the light shape meets the optical requirements of the design.
本实施例可用于直下式LED背光灯条和直下式平板灯的灯条，表面的透镜8将LED芯片4 的发光均匀分散，多颗LED芯片4形成的均匀光斑覆盖整个面板后，实现了整个面板均匀的光分布。This embodiment can be used for direct-lit LED backlight strips and direct-lit panel light strips. The lens 8 on the surface evenly disperses the light from the LED chips 4. After the uniform light spots formed by multiple LED chips 4 cover the entire panel, the entire panel is realized Homogeneous light distribution of the panel.
以上所述的仅是本实用新型的优选实施方式，本实用新型不限于以上实施例。可以理解，本领域技术人员在不脱离本实用新型的基本构思的前提下直接导出或联想到的其它改进和变化均应认为包含在本实用新型的保护范围之内。The above are only preferred implementations of the utility model, and the utility model is not limited to the above examples. It can be understood that other improvements and changes directly derived or associated by those skilled in the art without departing from the basic concept of the present invention should be considered to be included in the protection scope of the present invention.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109343273A (en) * | 2018-11-23 | 2019-02-15 | 江苏新广联科技股份有限公司 | A Mini LED backlight module with a large light emitting angle and a manufacturing method thereof |
| CN112017550A (en) * | 2019-05-31 | 2020-12-01 | 云谷（固安）科技有限公司 | Display panel, manufacturing method thereof and display device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109343273A (en) * | 2018-11-23 | 2019-02-15 | 江苏新广联科技股份有限公司 | A Mini LED backlight module with a large light emitting angle and a manufacturing method thereof |
| CN112017550A (en) * | 2019-05-31 | 2020-12-01 | 云谷（固安）科技有限公司 | Display panel, manufacturing method thereof and display device |
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