CN207883721U - A kind of LED light bar with excellent heat dispersion performance - Google Patents

A kind of LED light bar with excellent heat dispersion performance Download PDF

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Publication number
CN207883721U
CN207883721U CN201721532573.4U CN201721532573U CN207883721U CN 207883721 U CN207883721 U CN 207883721U CN 201721532573 U CN201721532573 U CN 201721532573U CN 207883721 U CN207883721 U CN 207883721U
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CN
China
Prior art keywords
led chip
groove
substrate
conducting layer
metal conducting
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Expired - Fee Related
Application number
CN201721532573.4U
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Chinese (zh)
Inventor
王红英
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Shenzhen Polytechnic
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Shenzhen Polytechnic
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Priority to CN201721532573.4U priority Critical patent/CN207883721U/en
Application granted granted Critical
Publication of CN207883721U publication Critical patent/CN207883721U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a kind of LED light bars with excellent heat dispersion performance.The LED light bar includes substrate, metal conducting layer, packing colloid, several LED chips.The surface of substrate is provided with several grooves.LED chip is mounted in groove.Metal conducting layer attaches on a surface of a substrate.Metal conducting layer is for each LED chip to be electrically connected.Packing colloid is for filling groove, sealed LED chip.The LED chip of the lamp bar structure is directly installed in the groove of substrate, eliminates package support, is kept lamp bar structure simpler, is reduced material cost;More important advantage is that the heat that LED chip generates can directly be scattered on substrate, many heat dissipation links are omitted, to make thermal resistance substantially reduce, improve the heat dissipation effect of LED.

Description

A kind of LED light bar with excellent heat dispersion performance
Technical field
The utility model is related to lamp bar technical field more particularly to a kind of LED light bars with excellent heat dispersion performance.
Background technology
In recent years, as the performance of LED quickly improves, application is increasingly extensive, in various illuminations and display backlight side Face obtains a large amount of application.As shown in Figure 1, universal application mode is that LED chip 4 is encapsulated in holder or base first at present LED component is formed on plate, and LED packagings are then mounted on by PCB surface using SMT patches mode again.LED chip 4 passes through 10 die bond of crystal-bonding adhesive realizes electrical connection, packaging plastic in the package support being made of colloid 6 and sheet metal 7, using gold thread 20 is beaten LED chip 4 is encapsulated in holder by body 3, so as to form LEDSMD packagings a;Then by SMD packaging a patches The mode of reflux is welded on the surfaces pcb board b by solder 30, and pcb board b is by 1 group of metal conducting layer 2, thermal insulation layer 5 and substrate At.
Currently, illuminating in backlight application, LED light bar is largely used.As shown in Fig. 2, plurality of LEDs packaging a is adopted With structure shown in FIG. 1, be arranged on long narrow pcb board b, plurality of LEDs device a can connect can also parallel connection be electrically connected to realize It connects.This LED component paster structure and lamp bar structure using SMD forms, the heat that LED chip 4 generates is to pass through crystal-bonding adhesive 10, package support and solder 30 are scattered to the surface of PCB.LED sinking paths in this way include LED chip 4 and 10 boundary of crystal-bonding adhesive Face, the interface of crystal-bonding adhesive 10 and package support, package support, the interface of package support and solder 30, solder 30, solder 30 with The interface of pcb board b and substrate 1, last pcb board reject heat to again its it is fixed it is heat sink on.The therefrom road as it can be seen that LED chip 4 radiates Diameter is longer, and heat dissipation interface is more.It, will be highly beneficial to the heat dissipation of LED chip 4 if heat dissipation link and interface can be reduced.
Utility model content
In view of the deficiencies of the prior art, the utility model proposes a kind of LED light bar with excellent heat dispersion performance, the lamps The LED chip of item is directly installed in the groove of substrate, eliminates package support, and the heat that LED chip generates can directly dissipate Onto substrate, many heat dissipation links are omitted, solve the problems, such as existing lamp bar poor radiation.
To achieve the goals above, technical solutions of the utility model are as follows:
A kind of LED light bar with excellent heat dispersion performance, including substrate, metal conducting layer, packing colloid, several LED cores Piece.The surface of substrate is provided with several grooves.LED chip is mounted in groove.Metal conducting layer attaches on the surface of the substrate On.Metal conducting layer is for each LED chip to be electrically connected.Packing colloid is for filling groove, sealed LED chip.Metal is led Electric layer is in bar shaped.Metal conducting layer is connected across between two grooves.The both ends of metal conducting layer are located in groove.LED chip Underrun crystal-bonding adhesive is fixed on the bottom surface of groove.The electrode of LED chip is connected by conducting wire with metal conducting layer.
Further, LED chip is flip-chip.The electrode of LED chip is welded on by solder on metal conducting layer.
Further, if further including dry lens.Lens are located at the upper surface of groove.Also, the optical centre and groove of lens The light center that goes out of interior LED chips coincides.
Further, substrate is made of metal material.It is isolated by thermal insulation layer between metal conducting layer and substrate.
Further, it is provided with silver coating on the surface of groove.
Further, groove is in acclive circular groove shape.
Further, contain light conversion material in packing colloid.
A kind of substrate is provided with several grooves on surface.Groove is for installing LED chip.
The beneficial effects of the utility model:
The LED chip of the lamp bar structure is directly installed in the groove of substrate, eliminates package support, makes lamp bar structure more Add simply, reduces material cost;More important advantage is that the heat that LED chip generates can be directly scattered on substrate, be omitted Many heat dissipation links to make thermal resistance substantially reduce improve the heat dissipation effect of LED.It is higher especially for cooling requirements Great power LED application scenario, for example, large driven current density great power LED direct-type backlight lamp bar, this structure is highly beneficial 's.
Description of the drawings
Fig. 1 is tradition SMDLED paster structure schematic diagrames.
Fig. 2 is the LED light bar schematic diagram that conventionally employed SMDLED paster structures are formed.
Fig. 3 is the utility model first embodiment cross-sectional view.
Fig. 4 is the utility model first embodiment schematic top plan view.
Fig. 5 is the utility model second embodiment cross-sectional view.
Fig. 6 is the utility model second embodiment schematic top plan view.
Fig. 7 is the utility model 3rd embodiment cross-sectional view.
Fig. 8 is the utility model fourth embodiment cross-sectional view.
Wherein, the reference numeral of Fig. 1 to Fig. 8 is:Substrate 1, metal conducting layer 2, packing colloid 3, LED chip 4, insulation are led Thermosphere 5, colloid 6, sheet metal 7, lens 8;Crystal-bonding adhesive 10, conducting wire 20, solder 30;Groove 11.
Specific implementation mode
With reference to the accompanying drawings and examples, the utility model is expanded on further.
Embodiment 1:
As shown in Figure 3-4, a kind of LED light bar with excellent heat dispersion performance, including substrate 1, metal conducting layer 2, encapsulation Colloid 3, several LED chips 4.
The surface of substrate 1 is provided with several grooves 11;Each groove 11 is in linear array or matrix arrangement.LED chip 4 is pacified In groove 11.Specifically, the bottom surface of groove 11 is die bond region;The underrun crystal-bonding adhesive 10 of LED chip 4 is fixed on recessed On the bottom surface of slot 11.The electrode of LED chip 4 is connected by conducting wire 20 with metal conducting layer 2.Metal conducting layer 2 is used for will be each LED chip 4 is electrically connected.Metal conducting layer 2 is attached on the surface of substrate 1.Packing colloid 3 is used to fill the sky of groove 11 Between, sealed LED chip 4.
Preferably, being provided with silver coating on the surface of groove 11, the light extraction efficiency of LED chip 4 is improved.
Specifically, substrate 1 is made of metal material.Preferably, substrate 1 is made of aluminium material.Metal conducting layer 2 and substrate It is isolated by thermal insulation layer 5 between 1 so that metal conducting layer 2 insulate with 1 phase of substrate.
Specifically, metal conducting layer 2 is in bar shaped, and metal conducting layer 2 is connected across between two grooves 11, metal conducting layer 2 Both ends be located in groove 11.
Specifically, groove 11 is in acclive circular groove shape.
Specifically, packing colloid 3 is made of the transparent colloids material such as silica gel, epoxy resin.Contain fluorescence in packing colloid 3 Powder or other light conversion materials.
LED chip 4 can be blue-light LED chip, red LED chip, yellow light LED chip or green LED chip etc..
LED chip 4 is directly encapsulated into the groove 11 on substrate 1, eliminates package support, keeps lamp bar structure simpler It is single, reduce material cost.Also, LED chip 4 is directly rejected heat to by crystal-bonding adhesive 10 on substrate 1, and the link of heat dissipation is reduced And interface, so that LED heat dissipation effects is substantially improved.
Embodiment 2:
As seen in figs. 5-6, a kind of LED light bar with excellent heat dispersion performance, including substrate 1, metal conducting layer 2, encapsulation Colloid 3, several LED chips 4.
The surface of substrate 1 is provided with several grooves 11;Each groove 11 is in linear array or matrix arrangement.LED chip 4 is pacified In groove 11.LED chip 4 is flip-chip.The electrode of LED chip 4 is welded on by solder 30 on metal conducting layer 2. Metal conducting layer 2 is for each LED chip 4 to be electrically connected.Metal conducting layer 2 is attached on the surface of substrate 1;And metallic conduction It is isolated by thermal insulation layer 5 between layer 2 and substrate 1 so that metal conducting layer 2 insulate with 1 phase of substrate.Packing colloid 3 is used In the space of filling groove 11, sealed LED chip 4.
Preferably, being provided with silver coating on the surface of groove 11, the light extraction efficiency of LED chip 4 is improved.
Specifically, substrate 1 is made of metal material.Preferably, substrate 1 is made of aluminium material.Metal conducting layer 2 and substrate It is isolated by thermal insulation layer 5 between 1 so that metal conducting layer 2 insulate with 1 phase of substrate.
Specifically, metal conducting layer 2 is in bar shaped, and metal conducting layer 2 is connected across between two grooves 11, metal conducting layer 2 Both ends be located in groove 11.
Specifically, groove 11 is in acclive circular groove shape.
Specifically, packing colloid 3 is made of the transparent colloids material such as silica gel, epoxy resin.Contain fluorescence in packing colloid 3 Powder or other light conversion materials.
LED chip 4 can be blue-light LED chip, red LED chip, yellow light LED chip or green LED chip etc..
LED chip 4 is directly encapsulated into the groove 11 on substrate 1, eliminates package support, keeps lamp bar structure simpler It is single, reduce material cost.Also, LED chip 4 is directly rejected heat to by solder 30, metal conducting layer 2 and thermal insulation layer 5 On substrate 1, reduces link and the interface of heat dissipation, LED heat dissipation effects is made to be improved.It is higher especially for cooling requirements Great power LED application scenario, for example, large driven current density great power LED direct-type backlight lamp bar, this structure is highly beneficial 's.
Embodiment 3:
As shown in fig. 7, being a kind of diagrammatic cross-section of the LED light bar with excellent heat dispersion performance.The present embodiment is being implemented On the basis of example 1, lens 8 are increased in the top of LED chip 4, it is therefore an objective to the light extraction of LED chip 4 is redistributed, To form required smooth shape distribution.Lens 8 are mounted on the upper surface of groove 11, the optics of lens 8 by the way of glue bond Center is aligned with the light center that goes out of LED chip 4 in groove 11 so that light shape reaches the optical requirement of design.
The present embodiment can be used for the lamp bar of direct-light type LED backlight lamp bar and direct type flat plate light, and the lens 8 on surface are by LED Shining for chip 4 is evenly dispersed, after the uniform light spots that plurality of LEDs chip 4 is formed cover entire panel, realizes entire panel Uniform light distribution.
Embodiment 4:
As shown in figure 8, being a kind of diagrammatic cross-section of the LED light bar with excellent heat dispersion performance.The present embodiment is being implemented On the basis of example 2, lens 8 are increased in the top of LED chip 4, it is therefore an objective to the light extraction of LED chip 4 is redistributed, To form required smooth shape distribution.Lens 8 are mounted on by the way of glue bond on groove 11, the optical centre of lens 8 It is aligned with the light center that goes out of LED chip 4 in groove 11 so that light shape reaches the optical requirement of design.
The present embodiment can be used for the lamp bar of direct-light type LED backlight lamp bar and direct type flat plate light, and the lens 8 on surface are by LED Shining for chip 4 is evenly dispersed, after the uniform light spots that plurality of LEDs chip 4 is formed cover entire panel, realizes entire panel Uniform light distribution.
Above-described is only preferred embodiments of the present invention, and the utility model is not limited to above example.It can With understand, those skilled in the art directly export or associate under the premise of not departing from the basic conception of the utility model its It is improved and variation is considered as being included within the scope of protection of this utility model.

Claims (1)

1. a kind of LED light bar with excellent heat dispersion performance, it is characterised in that:
Including substrate (1), metal conducting layer (2), packing colloid (3), several LED chips (4);
The surface of the substrate (1) is provided with several grooves (11);
The LED chip (4) is mounted in groove (11);
The metal conducting layer (2) is attached on the surface of substrate (1);
The metal conducting layer (2) is used to each LED chip (4) being electrically connected;
The packing colloid (3) is for filling groove (11), sealed LED chip (4);
The LED chip (4) is flip-chip;
The electrode of the LED chip (4) is welded on by solder (30) on metal conducting layer (2);
If further including dry lens (8);
The lens (8) are located at the upper surface of groove (11);Also,
The optical centre and the light center that goes out of groove (11) interior LED chip (4) of the lens (8) coincide;
The substrate (1) is made of metal material;
It is isolated by thermal insulation layer (5) between the metal conducting layer (2) and substrate (1);
The metal conducting layer (2) is in bar shaped;
The metal conducting layer (2) is connected across between two grooves (11);
The both ends of the metal conducting layer (2) are located in groove (11);
It is provided with silver coating on the surface of the groove (11);
The groove (11) is in acclive circular groove shape;
Contain light conversion material in the packing colloid (3);
The underrun crystal-bonding adhesive (10) of the LED chip (4) is fixed on the bottom surface of groove (11);
The electrode of the LED chip (4) is connected by conducting wire (20) with metal conducting layer (2).
CN201721532573.4U 2017-11-16 2017-11-16 A kind of LED light bar with excellent heat dispersion performance Expired - Fee Related CN207883721U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201721532573.4U CN207883721U (en) 2017-11-16 2017-11-16 A kind of LED light bar with excellent heat dispersion performance

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201721532573.4U CN207883721U (en) 2017-11-16 2017-11-16 A kind of LED light bar with excellent heat dispersion performance

Publications (1)

Publication Number Publication Date
CN207883721U true CN207883721U (en) 2018-09-18

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201721532573.4U Expired - Fee Related CN207883721U (en) 2017-11-16 2017-11-16 A kind of LED light bar with excellent heat dispersion performance

Country Status (1)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112017550A (en) * 2019-05-31 2020-12-01 云谷(固安)科技有限公司 Display panel, manufacturing method thereof and display device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112017550A (en) * 2019-05-31 2020-12-01 云谷(固安)科技有限公司 Display panel, manufacturing method thereof and display device

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20180918

Termination date: 20191116

CF01 Termination of patent right due to non-payment of annual fee