CN104183581A - LED module and manufacturing process thereof - Google Patents
LED module and manufacturing process thereof Download PDFInfo
- Publication number
- CN104183581A CN104183581A CN201310193583.XA CN201310193583A CN104183581A CN 104183581 A CN104183581 A CN 104183581A CN 201310193583 A CN201310193583 A CN 201310193583A CN 104183581 A CN104183581 A CN 104183581A
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- Prior art keywords
- radiator
- led
- lenses
- led chip
- led module
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Led Device Packages (AREA)
Abstract
The invention relates to the technical filed of illuminating lamps and especially relates to an LED module and a manufacturing process thereof. The LED module comprises a lens group, an LED luminophor, a circuit board and a radiator. The LED luminophor comprises an LED chip and a heat-dissipating support, wherein the LED chip is attached to the heat-dissipating support, and the heat-dissipating support is arranged on the circuit board through a pasting process. The lens group covers on the radiator. The lens group is arranged above the LED chip. A sealed space formed by the lens group and the radiator is filled with a packaging colloid, wherein the packaging colloid is filled to the sealed space through a glue-injection process. Compared with the prior art, in the LED module of the invention, original air medium is replaced by the packaging colloid in the spreading process of the light emitted from the LED chip, and refractive index of the packaging colloid is matched with the lenses of the lens group, so that light-outputting efficiency is improved to the greatest degree; and compared with the prior art, the luminous efficiency is improved by 10-15%.
Description
Technical field
The present invention relates to the technical field of illuminating lamp, particularly a kind of LED module and manufacturing process thereof.
Background technology
Along with the development of LED chip technology and encapsulation technology, increasing LED product is applied to lighting field, especially large power white light LED.Because LED has high light efficiency, long-life, energy-conserving and environment-protective, suitable brightness adjustment control, the polluter such as not mercurous, become the lighting source of new generation after the conventional light source such as incandescent lamp, fluorescent lamp.
But there is following defect in current LED module:
1, the light that the LED chip of existing LED module sends needs through air dielectric in communication process, can cause interface loss, causes LED chip light extraction efficiency low;
2,, in existing LED module, non-filler between set of lenses and radiator, will damage LED luminous element once enter steam;
3, the bottom surface that the LED luminous element of existing LED module only passes through cooling stand is to circuit board transferring heat, and radiating effect is poor.
Summary of the invention
The object of the invention is to provide a kind of LED module, to solve the light that the LED chip of existing LED module in prior art sends, needs through air dielectric in communication process, can cause interface loss, causes the technical matters that LED chip light extraction efficiency is low.
Another object of the present invention is to provide the manufacturing process of above-mentioned LED module, to solve the light that the LED chip of existing LED module in prior art sends, in communication process, need through air dielectric, can cause interface loss, cause the technical matters that LED chip light extraction efficiency is low.
The object of the invention is achieved through the following technical solutions:
A kind of LED module, comprise set of lenses, sealing ring, LED luminous element, circuit board and radiator, described LED luminous element comprises LED chip and cooling stand, described LED chip laminating is arranged on described cooling stand, described cooling stand is arranged on described circuit board by paster technique, described set of lenses lid is located on described radiator, described set of lenses is positioned at described LED chip top, on described radiator, be provided with cable-through hole, described cable-through hole seals by sealed colloid, described set of lenses, described sealing ring, in the confined space that described sealed colloid and described radiator form, fill packing colloid, described packing colloid is filled with described confined space by the technique of injecting glue.
Preferably, described packing colloid is transparence, and its refractive index is 1.3～1.7.
Preferably, the bottom of described radiator is provided with hole for injecting glue and steam vent; Described circuit board is provided with the through hole corresponding with described hole for injecting glue and steam vent.
Preferably, described LED chip is fixed on cooling stand by die bond mode, and described LED chip is provided with fluorescent material.
Preferably, described cooling stand is made by the material of the high heat conduction of insulating.
Preferably, the material of the high heat conduction of described insulation comprises high heat-conducting ceramic materials A lN.
Preferably, described LED luminous element also comprises silicon rubber cup, and described silicon rubber cup is arranged on described cooling stand, and described silicon rubber cup is positioned at described LED chip top.
Preferably, described LED chip is fixed on cooling stand by die bond mode, is also provided with the packing colloid of mixed fluorescent powder on described LED chip.
Preferably, described cooling stand is mixed by metal material and resin material, and metal material has heat sink and effect conductive welding disk of serving as; Resin material has the effect of serving as speculum, and plays the fixedly effect of packing colloid, when packing colloid does not solidify, can stop packing colloid to leak.
Preferably, described set of lenses upper surface is provided with some reinforcements.
Preferably, on described set of lenses inner surface, be provided with some raceway grooves, for making the injection of packing colloid more smooth and easy.
A manufacturing process for LED module, comprises the following steps:
(1) LED chip laminating is arranged on cooling stand, described cooling stand is fitted and is arranged on circuit board by paster technique;
(2) described circuit board and radiator are fitted tightly, radiator surrounding, along being placed with sealing ring, is located at set of lenses lid on described radiator, and described set of lenses is positioned at described LED chip top;
(3) packing colloid is injected to the gap between radiator and set of lenses by the hole for injecting glue of radiator bottom, packing colloid fills up the gap between set of lenses and radiator, and unnecessary air is discharged from steam vent;
(4) mode screwing down and/or with mode seal pouring hole and the steam vent of glue sealing.
Preferably, described step (3) also comprises: packing colloid is injected in the raceway groove of set of lenses inner surface by the hole for injecting glue of radiator bottom.
Preferably, described packing colloid is transparence, and its refractive index is 1.3～1.7.
Compared with prior art, the present invention has following beneficial effect:
1, compared with prior art, in LED module of the present invention, the light that LED chip sends packing colloid in communication process has substituted original air dielectric, and the refractive index of packing colloid is mated with the lens in set of lenses, improved so to the full extent light emission rate, compared with prior art, light efficiency has improved 10～15%;
2, in LED module of the present invention, in the confined space of radiator and set of lenses, be filled with packing colloid, circuit board and the packed colloid of each LED luminous element are coated, therefore have good water resistance;
3, the heat that in the present invention, LED luminous element produces not only can transmit to circuit board by the bottom surface of cooling stand, and can outwards transmit by packing colloid, makes radiating effect better.
Accompanying drawing explanation
Fig. 1 is the structural representation of LED module of the present invention;
Fig. 2 is the decomposing schematic representation of LED module of the present invention;
Fig. 3 is the structural representation of circuit board of the present invention;
Fig. 4 is the structural representation of radiator of the present invention;
Fig. 5,6 is the structural representation of a kind of embodiment of LED luminous element of the present invention;
Fig. 7 is the structural representation of the another kind of embodiment of LED luminous element of the present invention;
Fig. 8 is the structural representation of another embodiment of LED luminous element of the present invention;
Fig. 9 is the structural representation in set of lenses of the present invention outside;
Figure 10 is the structural representation of set of lenses of the present invention inner side;
Figure 11 is the structural representation of the another kind of embodiment of LED module of the present invention.
Embodiment
Below in conjunction with accompanying drawing, describe the present invention in detail.
Embodiment 1
Refer to Fig. 1-10, LED module of the present invention, comprise set of lenses 1, sealing ring 4, LED luminous element 21, circuit board 2 and radiator 3, in set of lenses, be provided with buckle structure 13, sealing ring 4 comprises sealed solid circle and hydraulic seal circle, on circuit board and radiator, be provided with cable-through hole 24, 33, cable-through hole seals by sealed colloid, LED luminous element 21 comprises LED chip 211 and cooling stand 212, LED chip laminating is arranged on cooling stand, cooling stand is arranged on circuit board 2 by paster technique, set of lenses 1 is covered and is located on radiator 3 by buckle structure, set of lenses 1 is positioned at LED chip top, set of lenses 1, sealing ring 4 and radiator 3, in the confined space that cable-through hole place sealed colloid forms, fill packing colloid, the confined space that the technique of packing colloid by injecting glue is filled with.
In this example, packing colloid is transparence, and its refractive index is 1.3～1.7, and the refractive index of packing colloid and the refractive index of the lens in set of lenses approach.In LED module of the present invention, the light that LED chip sends packing colloid in communication process has substituted original air dielectric, and the refractive index of packing colloid mates with the lens in set of lenses, has improved so to the full extent light emission rate, compared with prior art, light efficiency has improved 10～15%.
Refer to Fig. 2-4, in this example, the bottom of radiator 3 is provided with hole for injecting glue 31 and steam vent 32, cable-through hole 33; Circuit board 2 is provided with the through hole 22,23 corresponding with hole for injecting glue 31 and steam vent 32, cable-through hole 24.Hole for injecting glue can be one or more; Steam vent can be also one or more; The shape of hole for injecting glue and steam vent does not limit.In this example, hole for injecting glue 31 and steam vent 32 are respectively a bottom that is arranged on radiator 3, after radiator 3 and set of lenses 1 are fastened and connected, packing colloid is injected to the gap between radiator, sealing ring, set of lenses and cable-through hole hermetically-sealed construction by the hole for injecting glue of radiator bottom, and unnecessary air is discharged from steam vent.
Refer to Fig. 5,6, in this example, LED chip is fixed on cooling stand by die bond mode, and LED chip is provided with fluorescent material.Wherein, cooling stand is made by the material of the high heat conduction of insulating, and is preferably high heat-conducting ceramic materials A lN.
Refer to Fig. 7, in this example, LED luminous element also comprises silicon rubber cup 213, and silicon rubber cup 213 is arranged on cooling stand 212, and silicon rubber cup 213 is positioned at LED chip 211 tops.
Refer to Fig. 8, in this example, LED chip 211 is fixed on cooling stand 212 by die bond mode, is also provided with the packing colloid 214 of mixed fluorescent powder on LED chip.Wherein, cooling stand 212 is mixed by metal material and resin material, and metal material has heat sink and effect conductive welding disk of serving as; Resin material has the effect of serving as speculum, and plays the fixedly effect of packing colloid, when packing colloid does not solidify, can stop packing colloid to leak.
Refer to Fig. 9,10, in this example, set of lenses 1 upper surface is provided with some reinforcements 11, and reinforcement 11 can strengthen the fastness of set of lenses.On set of lenses inner surface, be provided with some raceway grooves 12, for making the injection of packing colloid more smooth and easy.
The present invention also provides a kind of manufacturing process of LED module, comprises the following steps:
(1) LED chip laminating is arranged on cooling stand, cooling stand is fitted and is arranged on circuit board by paster technique;
(2) circuit board and radiator are fitted tightly, sealing ring is placed on edge, radiator surrounding, and set of lenses lid is located on radiator, and set of lenses is positioned at LED chip top;
(3) packing colloid is injected to the gap between radiator and set of lenses by the hole for injecting glue of radiator bottom, packing colloid fills up the gap between set of lenses and radiator, and unnecessary air is discharged from steam vent;
(4) mode screwing down and/or with mode seal pouring hole and the steam vent of glue sealing.
In order to make the injection of packing colloid more smooth and easy, step (3) also comprises: packing colloid first injects in the raceway groove of set of lenses inner surface by the hole for injecting glue of radiator bottom, then enters the gap between radiator and set of lenses.Wherein, packing colloid is transparence, and its refractive index is 1.3～1.7.
Embodiment 2
Refer to Figure 11, the difference of the present embodiment and foregoing embodiment is, no longer adopts the mode snapping of buckle in the present embodiment between set of lenses and radiator, but adopts screw tightening.
In LED module of the present invention, in the confined space of radiator and set of lenses, be filled with packing colloid, circuit board and the packed colloid of each LED luminous element are coated, therefore have good water resistance.In LED module of the present invention, the heat that LED luminous element produces not only can transmit to circuit board by the bottom surface of cooling stand, and can outwards transmit by packing colloid, makes radiating effect better.
Disclosed is above only several specific embodiments of the application, but the application is not limited thereto, and the changes that any person skilled in the art can think of, all should drop in the application's protection range.
Claims (14)
1. a LED module, it is characterized in that, comprise set of lenses, sealing ring, LED luminous element, circuit board and radiator, described LED luminous element comprises LED chip and cooling stand, described LED chip laminating is arranged on described cooling stand, described cooling stand is arranged on described circuit board by paster technique, described set of lenses lid is located on described radiator, described set of lenses is positioned at described LED chip top, on described radiator, be provided with cable-through hole, described cable-through hole seals by sealed colloid, described set of lenses, described sealing ring, in the confined space that described sealed colloid and described radiator form, fill packing colloid, described packing colloid is filled with described confined space by the technique of injecting glue.
2. LED module as claimed in claim 1, is characterized in that, described packing colloid is transparence, and its refractive index is 1.3～1.7.
3. LED module as claimed in claim 1, is characterized in that, the bottom of described radiator is provided with hole for injecting glue and steam vent; Described circuit board is provided with the through hole corresponding with described hole for injecting glue and steam vent.
4. LED module as claimed in claim 1, is characterized in that, described LED chip is fixed on cooling stand by die bond mode, and described LED chip is provided with fluorescent material.
5. LED module as claimed in claim 4, is characterized in that, described cooling stand is made by the material of the high heat conduction of insulating.
6. LED module as claimed in claim 5, is characterized in that, the material of the high heat conduction of described insulation comprises high heat-conducting ceramic materials A lN.
7. LED module as claimed in claim 1, is characterized in that, described LED luminous element also comprises silicon rubber cup, and described silicon rubber cup is arranged on described cooling stand, and described silicon rubber cup is positioned at described LED chip top.
8. LED module as claimed in claim 1, is characterized in that, described LED chip is fixed on cooling stand by die bond mode, is also provided with the packing colloid of mixed fluorescent powder on described LED chip.
9. LED module as claimed in claim 8, is characterized in that, described cooling stand is mixed by metal material and resin material.
10. LED module as claimed in claim 1, is characterized in that, described set of lenses upper surface is provided with some reinforcements.
11. LED modules as claimed in claim 1, is characterized in that, on described set of lenses inner surface, are provided with some raceway grooves, for making the injection of packing colloid more smooth and easy.
The manufacturing process of 12. 1 kinds of LED modules, is characterized in that, comprises the following steps:
(1) LED chip laminating is arranged on cooling stand, described cooling stand is fitted and is arranged on circuit board by paster technique;
(2) described circuit board and radiator are fitted tightly, radiator surrounding, along being placed with sealing ring, is located at set of lenses lid on described radiator, and described set of lenses is positioned at described LED chip top;
(3) packing colloid is injected to the gap between radiator and set of lenses by the hole for injecting glue of radiator bottom, packing colloid fills up the gap between set of lenses and radiator, and unnecessary air is discharged from steam vent;
(4) mode screwing down and/or with mode seal pouring hole and the steam vent of glue sealing.
The manufacturing process of 13. LED modules as claimed in claim 12, is characterized in that, described step (3) also comprises: packing colloid is injected in the raceway groove of set of lenses inner surface by the hole for injecting glue of radiator bottom.
The manufacturing process of 14. LED modules as claimed in claim 12, is characterized in that, described packing colloid is transparence, and its refractive index is 1.3～1.7.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310193583.XA CN104183581A (en) | 2013-05-21 | 2013-05-21 | LED module and manufacturing process thereof |
| US14/893,432 US9960323B2 (en) | 2013-05-21 | 2013-06-17 | LED module and its manufacturing process |
| DE112013006965.2T DE112013006965T5 (en) | 2013-05-21 | 2013-06-17 | LED module and its manufacturing process |
| JP2016513196A JP2016518724A (en) | 2013-05-21 | 2013-06-17 | LED module and manufacturing method thereof |
| PCT/CN2013/077333 WO2014186994A1 (en) | 2013-05-21 | 2013-06-17 | Led module and manufacturing process thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310193583.XA CN104183581A (en) | 2013-05-21 | 2013-05-21 | LED module and manufacturing process thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104183581A true CN104183581A (en) | 2014-12-03 |
Family
ID=51964513
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310193583.XA Pending CN104183581A (en) | 2013-05-21 | 2013-05-21 | LED module and manufacturing process thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104183581A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105226172A (en) * | 2015-09-08 | 2016-01-06 | 李峰 | Waterproof encapsulation structure and one-body molded treatment process thereof |
| CN108701791A (en) * | 2016-10-10 | 2018-10-23 | 株式会社Lg化学 | battery module assembly |
| CN111696927A (en) * | 2020-05-18 | 2020-09-22 | 马鞍山芯海科技有限公司 | Chip packaging frame and chip packaging method |
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| CN101097973A (en) * | 2006-06-26 | 2008-01-02 | 南京汉德森科技股份有限公司 | High power LED two-dimension light source |
| KR20100035962A (en) * | 2008-09-29 | 2010-04-07 | 서울반도체 주식회사 | Method of forming a lens of a light emitting diode package |
| CN101980387A (en) * | 2010-09-07 | 2011-02-23 | 浙江西子光电科技有限公司 | LED module and manufacturing process thereof |
| CN202308052U (en) * | 2011-11-04 | 2012-07-04 | 杭州华普永明光电股份有限公司 | LED module group |
| CN203277499U (en) * | 2013-05-21 | 2013-11-06 | 杭州华普永明光电股份有限公司 | LED module group |
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2013
- 2013-05-21 CN CN201310193583.XA patent/CN104183581A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101097973A (en) * | 2006-06-26 | 2008-01-02 | 南京汉德森科技股份有限公司 | High power LED two-dimension light source |
| KR20100035962A (en) * | 2008-09-29 | 2010-04-07 | 서울반도체 주식회사 | Method of forming a lens of a light emitting diode package |
| CN101980387A (en) * | 2010-09-07 | 2011-02-23 | 浙江西子光电科技有限公司 | LED module and manufacturing process thereof |
| CN202308052U (en) * | 2011-11-04 | 2012-07-04 | 杭州华普永明光电股份有限公司 | LED module group |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105226172A (en) * | 2015-09-08 | 2016-01-06 | 李峰 | Waterproof encapsulation structure and one-body molded treatment process thereof |
| CN105226172B (en) * | 2015-09-08 | 2017-07-14 | 李峰 | Waterproof encapsulation structure and its it is integrally formed handling process |
| CN108701791A (en) * | 2016-10-10 | 2018-10-23 | 株式会社Lg化学 | battery module assembly |
| CN108701791B (en) * | 2016-10-10 | 2021-07-16 | 株式会社Lg化学 | Battery module assembly |
| CN111696927A (en) * | 2020-05-18 | 2020-09-22 | 马鞍山芯海科技有限公司 | Chip packaging frame and chip packaging method |
| CN111696927B (en) * | 2020-05-18 | 2023-12-15 | 蔚冰 | Chip packaging frame and chip packaging method |
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Application publication date: 20141203 |