CN203800079U - LED module - Google Patents
LED module Download PDFInfo
- Publication number
- CN203800079U CN203800079U CN201420193983.0U CN201420193983U CN203800079U CN 203800079 U CN203800079 U CN 203800079U CN 201420193983 U CN201420193983 U CN 201420193983U CN 203800079 U CN203800079 U CN 203800079U
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- China
- Prior art keywords
- radiator
- substrate
- led module
- lens
- wafer level
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- 239000000758 substrate Substances 0.000 claims abstract description 52
- 238000007789 sealing Methods 0.000 claims description 39
- 239000010980 sapphire Substances 0.000 claims description 11
- 229910052594 sapphire Inorganic materials 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 9
- 239000012530 fluid Substances 0.000 claims description 8
- 239000003292 glue Substances 0.000 claims description 7
- 238000004078 waterproofing Methods 0.000 claims description 6
- 229920001296 polysiloxane Polymers 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 3
- 229910002804 graphite Inorganic materials 0.000 claims description 3
- 239000010439 graphite Substances 0.000 claims description 3
- 239000004519 grease Substances 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 230000002787 reinforcement Effects 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 abstract description 5
- 238000009877 rendering Methods 0.000 abstract 1
- 239000000084 colloidal system Substances 0.000 description 15
- 238000012856 packing Methods 0.000 description 13
- 230000000694 effects Effects 0.000 description 8
- 241000218202 Coptis Species 0.000 description 6
- 235000002991 Coptis groenlandica Nutrition 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 4
- 230000006854 communication Effects 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000011049 pearl Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 235000009967 Erodium cicutarium Nutrition 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000001795 light effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
Abstract
The utility model relates to an LED module which comprises a lens, wafer level package LED light sources, a substrate and a radiator. The substrate is arranged on the radiator. The substrate and the radiator are directly connected or are connected through a medium. The lens is provided with a protruding cavity. A seal waterproof space in which the wafer level package LED light sources are placed is formed between the protruding cavity of the lens and the radiator. The substrate is fixed on the radiator. Compared with the prior art, the LED module provided by the utility model has the advantages that only one lens is arranged; the lens is provided with only one protruding cavity; a number of wafer level package LED light sources are arranged in the protruding cavity; optical matching such as color temperature, color rendering index and the like can be carried out on the entire LED module; the optical performance of the whole LED module is improved; the application can be expanded; the demand on the light sources is reduced; and the cost is reduced.
Description
Technical field
The utility model relates to the technical field of illuminating lamp, particularly a kind of LED module.
Background technology
Along with the development of LED chip technology and encapsulation technology, increasing LED product is applied to lighting field, especially large power white light LED.Because LED has high light efficiency, long-life, energy-conserving and environment-protective, suitable brightness adjustment control, the polluter such as not mercurous, become the lighting source of new generation after the conventional light source such as incandescent lamp, fluorescent lamp.
But there is following defect in current LED module:
First, the making step of existing LED module is various, and luminescent layer need first be arranged on substrate and be soldered to substrate again, causes complex manufacturing technology.And the shape of present LED module is rectangle normally, and application scenario is limited.
Then, the light that the LED chip of existing LED module sends needs through air dielectric in communication process, can cause interface loss, causes LED chip light extraction efficiency low; In existing LED module, non-filler between set of lenses and radiator, will damage LED luminous element once enter steam;
Secondly, existing LED module, only for indoor and outdoor lighting such as street lamps, can not carry out the optics proportionings such as colour temperature, aobvious finger, and very high to LED light source parameter request, application scenario is extremely limited.
Finally, when existing LED module is applied in street lighting, because the reasons such as existing tail gas cause the easy dust suction of kick structure outside LED module, the utmost point affects the light effect that of LED module.
Utility model content
The utility model object is to provide a kind of LED module, to solve LED module in prior art, can not carry out the optics proportionings such as colour temperature, aobvious finger, and the lower technical matters of light efficiency.
The utility model object is achieved through the following technical solutions:
A kind of LED module, comprise: lens, wafer level encapsulated LED light source, substrate and radiator, described substrate is set on described radiator, described substrate can directly be connected or connect by medium with described radiator, described lens are provided with protruding cavity, between the protruding cavity of described lens and described radiator, form the water-tight space of placing described wafer level encapsulated LED light source, described substrate is fixed on radiator.
Preferably, in described lens, in the intermediate cavity between wafer level encapsulated LED light source and described lens, fill the index-matching fluid that is provided with to improve light efficiency.Preferably, between the protruding cavity of the full whole described lens of index-matching fluid filling and described radiator, form the water-tight space of placing described wafer level encapsulated LED light source.
Preferably, on described water-tight space, be provided with the wire hole for water-proof wire outlet, and for hole for injecting glue and the steam vent of injecting glue.
Preferably, radiator is directly connected with substrate and further comprises directly laminating, the clamping of described radiator, is spirally connected or welds described substrate, or radiator is connected and is further comprised that described radiator is connected with described substrate by heat-conducting silicone grease, heat-conducting pad or graphite flake by medium with substrate.
Preferably, described LED module also comprises that in order to by fixing sealing clamping ring and the black box of described lens, described sealing clamping ring makes described lens and described radiator form described seal cavity by black box.
Preferably, described black box comprises sealing ring and/or conical surface fit sealing assembly, and described conical surface fit sealing assembly is arranged on sealing clamping ring and radiator.
Preferably, described sealing clamping ring surrounding is set to grid, and is convexly equipped with reinforcement in surrounding, and the bottom of described sealing ring and inner ring setting have some annular projections of better water proofing property.
Preferably, described sealing ring is interior " U " type structure, and upper and lower two rings are packaged in the periphery of lens, and bottom arranges some annular projections with inner ring setting with better water proofing property, guarantees to greatest extent sealing grade between sealing ring and trim ring, lens.
Preferably, described wafer level encapsulated LED light source comprises fluorescent material, sapphire, luminescent layer, pad, and described pad is arranged at luminescent layer bottom, and described sapphire is arranged on luminescent layer, and described fluorescent material is arranged on sapphire.Fluorescent material and luminescent layer separate by sapphire, realize heat isolation; Described wafer level encapsulated LED light source is to connect without gold thread, without disconnected gold thread risk, can greatly extend the chip life-span, thereby extend the life-span of whole module.
Preferably, described wafer level encapsulated LED light source is welded on described substrate, and substrate comprises one of them of metal substrate, ceramic substrate.
It should be noted that, lens and radiator fixed form be buckle not necessarily, also plays screw; Sealing clamping ring shape is lattice-shaped not necessarily, and lattice-shaped is just as preferred.
Compared with prior art, the utility model has following beneficial effect:
1, between the protruding cavity of the full whole described lens of index-matching fluid filling and described radiator, form the water-tight space of placing described wafer level encapsulated LED light source.Fill index-matching fluid and realize high sealing classification of waterproof auxiliary heat dissipation, thus the high reliability of realization.
2, LED module of the present utility model only arranges lens, is only provided with a protruding cavity on these lens.In this projection cavity, place many wafer level encapsulated LED light sources.Like this, to whole LED module, the optics proportionings such as colour temperature, aobvious finger are carried out in unification, improve the optical property of whole LED module.
3, compared with prior art, in LED module of the present utility model, the light that LED chip sends packing colloid in communication process has substituted original air dielectric, and the refractive index of packing colloid is mated with the lens in set of lenses, improved so to the full extent light emission rate, compared with prior art, light efficiency has improved 10 ~ 15%; Also have, in LED module of the present utility model, in the confined space of radiator and set of lenses, be filled with packing colloid, substrate and the packed colloid of each LED luminous element are coated, therefore have good water resistance; And the heat that in the utility model, LED luminous element produces not only can transmit to substrate by the bottom surface of cooling stand of self, and can outwards transmit by packing colloid, makes radiating effect better.
4, wafer level encapsulated LED light source can carry out the optics proportionings such as colour temperature, aobvious finger.The LED light source of different-colour can be soldered in same LED module, allot needed colour temperature, especially many inclined to one side color temperature lamp pearls can be neutralized into the bright dipping of positive colour temperature.Can, by adding red-light source, realize aobvious finger and adjust.Wafer level encapsulated LED light source is to connect without gold thread, without disconnected gold thread risk, can greatly extend the chip life-span, thereby extend the life-span of whole module.
5, LED module only arranges lens, is only provided with a protruding cavity on these lens.These lens are adopted and are difficult for falling dust, and the material that is particularly difficult for sticky tail gas is made, and can improve light efficiency.And module is shaped as prototype, application scenario is more extensive, as car light, street lamp etc.
Accompanying drawing explanation
Figure 1A, Figure 1B are respectively exploded view and the assembly drawing of the embodiment 1 of LED module;
Fig. 2 A, Fig. 2 B are respectively exploded view and the assembly drawing of the embodiment 2 of LED module;
Fig. 3 is a kind of generalized section of conical surface fastening seal structure.
Embodiment
Below in conjunction with accompanying drawing, describe the utility model in detail.
Embodiment 1
A kind of LED module, comprise: lens 12, wafer level encapsulated LED light source and substrate 14(wafer level encapsulated LED light source are arranged on substrate 14, wafer level encapsulated LED light source is smaller, in figure, do not identify label) and radiator 15, substrate 14 is set on radiator 15, substrate 14 can directly be connected or connect by medium with radiator 15, and lens 12 are provided with protruding cavity 121.Between the protruding cavity 121 of lens 12 and radiator 15, form the water-tight space of placing wafer level encapsulated LED light source, and substrate 14 is fixed on radiator 15.One waterproof grommet 13 is set between lens 12 and radiator 15, contributes to improve waterproof effect.
Wafer level encapsulated LED light source can be welded on substrate 14, and substrate 14 comprises one of them of metal substrate, ceramic substrate.
Wafer level encapsulated LED light source comprises fluorescent material, sapphire, luminescent layer, pad, and pad is arranged at luminescent layer bottom, and sapphire is arranged on luminescent layer, and fluorescent material is arranged on sapphire.Fluorescent material and luminescent layer separate by sapphire, realize heat isolation.Wafer level encapsulated LED light source is to connect without gold thread, without disconnected gold thread risk, can greatly extend the chip life-span, thereby extend the life-span of whole module.
In addition, wafer level encapsulated LED light source can carry out the optics proportionings such as colour temperature, aobvious finger.The LED light source of different-colour can be soldered in same LED module, allot needed colour temperature, especially many inclined to one side color temperature lamp pearls can be neutralized into the bright dipping of positive colour temperature.Can, by adding red-light source, realize aobvious finger and adjust.In this example, a LED module only arranges lens 12, is only provided with a protruding cavity 121 on these lens 12.The wafer level encapsulated LED light source of placing in this projection cavity can be comprised of plurality of LEDs particle.Like this, to whole LED module, the optics proportionings such as colour temperature, aobvious finger are carried out in unification, improve the optical property of whole LED module.
On water-tight space, be provided with the wire hole for water-proof wire outlet, and for hole for injecting glue and the steam vent of injecting glue.In lens 12, the interior filling of protruding cavity 121 between wafer level encapsulated LED light source and lens 12 is provided with to improve the index-matching fluid of light efficiency.In airtight waterproof space, fill packing colloid, the confined space that the technique of packing colloid by injecting glue is filled with.In this example, packing colloid is transparence, and its refractive index is 1.3 ~ 1.7, and the refractive index of packing colloid and the refractive index of the lens in set of lenses 12 approach.In LED module of the present utility model, the light that LED chip sends packing colloid in communication process has substituted original air dielectric, and the refractive index of packing colloid is mated with the lens 12 in set of lenses, improved so to the full extent light emission rate, compared with prior art, light efficiency has improved 10 ~ 15%.In LED module of the present utility model, in the confined space of radiator 15 and lens 12, can all fill full packing colloid, substrate and the packed colloid of each LED luminous element are coated, therefore have good water resistance.In LED module of the present utility model, the heat that LED luminous element produces not only can transmit to substrate by the bottom surface of cooling stand of self, and can outwards transmit by packing colloid, makes radiating effect better.Certainly, also can be as required, in the confined space of radiator 15 and lens 12, can be partially filled full packing colloid.
In addition, radiator 15 is directly connected with substrate 14 and further comprises directly laminating, clamping of radiator 15, is spirally connected or welding substrate 14, or radiator 15 is connected and is further comprised that radiator 15 is connected with substrate 14 by heat-conducting silicone grease, heat-conducting pad or graphite flake by medium with substrate 15.Radiator 15 is not limit with the type of attachment of substrate 14, as long as can reach the effect of abundant heat radiation.Also it should be noted that, radiator 15 is mainly the radiating fin that the other one side that contacts with substrate 14 is arranged to have high-cooling property, and existing radiating fin is design side by side mainly.The radiating effect that the applicant finds parallel radiating fin is not necessarily best, for this reason, the applicant's utility model there is the arrangement mode of the radiating fin of better radiating effect, such as, a kind of arrangement mode is: from intercepting face, radiating fin be divided into central part and centered by central part surrounding heronsbill mode disperse the fin unit of arranging, this set has better radiating effect to the heat at center.Also have, although the radiating fin of radiator 15 is interval designs side by side, each radiating fin is not continuously protruding, and each radiating fin can arrange some vacancies, the vacancy of adjacent radiating fin staggers, or the vacancy of adjacent radiating fin staggers between two.The radiating effect of the radiating fin of this radiator 15 is also extraordinary.
LED module also comprises in order to by fixing sealing clamping ring 11 and the black box of lens 12, and sealing clamping ring 11 makes lens 12 and radiator 15 form described seal cavity by black box.In this example, black box comprises sealing ring 17 and/or conical surface fit sealing assembly, and conical surface fit sealing assembly is arranged on sealing clamping ring 11 and radiator 15.Refer to Fig. 3.
Sealing clamping ring 11 surroundings are set to grid, and are convexly equipped with reinforcement in surrounding, and the bottom of sealing ring 17 and inner ring setting have some annular projections of better water proofing property.Sealing ring 17 can be interior " U " type structure, and upper and lower two rings are packaged in the periphery of lens 12, and bottom arranges some annular projections with inner ring setting with better water proofing property, guarantees to greatest extent sealing grade between sealing ring 17 and trim ring 11, lens 12.It should be noted that, lens and radiator fixed form be buckle not necessarily, also plays screw; Sealing clamping ring shape is lattice-shaped not necessarily, and lattice-shaped is just as preferred.In this example, the waterproof screwed pipe arranging on water-proof wire 18 wore radiator 15 by T-shaped sealing ring 19 and was connected with substrate 14.Screw is realized being spirally connected of radiator 15 and substrate 14 by silicone gasket 16.Certainly, arranging of water-proof wire 18 is not limited thereto, has a variety of implementations, and above is only for example, it should be noted that, in any case connect the sealing grade that must protect water-proof wire 18 to connect after getting on.Equally, radiator 15 is only also one with being spirally connected of substrate 14 and gives an example.
Embodiment 2
Unique different from embodiment 1, water-proof wire 21 is realized and being connected and sealing by back seal circle 22.
LED module of the present utility model only arranges lens, is only provided with a protruding cavity on these lens.In this projection cavity, place many wafer level encapsulated LED light sources.Like this, to whole LED module, the optics proportionings such as colour temperature, aobvious finger are carried out in unification, improve the optical property of whole LED module.This LED module is owing to can plurality of LEDs particle being installed at a protruding cavity, and fill in order to improve the index-matching fluid of light efficiency in cavity, greatly improve the light efficiency of single led module, can, as the application places such as car light of automobile, greatly improve the application scenarios of LED module.
Disclosed is above only several specific embodiments of the application, but the application is not limited thereto, and the changes that any person skilled in the art can think of, all should drop in the application's protection range.
Claims (12)
1. a LED module, it is characterized in that, comprise: lens, wafer level encapsulated LED light source, substrate and radiator, described substrate is set on described radiator, described substrate can directly be connected or connect by medium with described radiator, described lens are provided with protruding cavity, form the water-tight space of placing described wafer level encapsulated LED light source between the protruding cavity of described lens and described radiator, and described substrate is fixed on radiator.
2. LED module as claimed in claim 1, is characterized in that, in described lens, fills the index-matching fluid that is provided with to improve light efficiency in the protruding cavity between wafer level encapsulated LED light source and described lens.
3. LED module as claimed in claim 2, is characterized in that, index-matching fluid is filled the water-tight space of the described wafer level of the placement encapsulated LED light source forming between the full whole protruding cavity by described lens and described radiator.
4. LED module as claimed in claim 1, is characterized in that, on described water-tight space, is provided with the wire hole for water-proof wire outlet, and for hole for injecting glue and the steam vent of injecting glue.
5. the LED module as described in claim 1 or 4, is characterized in that,
Radiator is directly connected and further comprises directly laminating, the clamping of described radiator, is spirally connected or welds described substrate with substrate, or
Radiator is connected and is further comprised that described radiator is connected with described substrate by heat-conducting silicone grease, heat-conducting pad or graphite flake by medium with substrate.
6. LED module as claimed in claim 1, is characterized in that, described LED module also comprises that in order to by fixing sealing clamping ring and the black box of described lens, described sealing clamping ring makes described lens and described radiator form described seal cavity by black box.
7. LED module as claimed in claim 6, is characterized in that, described black box comprises sealing ring and/or conical surface fit sealing assembly, and described conical surface fit sealing assembly is arranged on sealing clamping ring and radiator.
8. LED module as claimed in claim 6, is characterized in that, described sealing clamping ring surrounding is set to grid, and is convexly equipped with reinforcement in surrounding, and the bottom of described sealing ring and inner ring setting have some annular projections of better water proofing property.
9. LED module as claimed in claim 6, it is characterized in that, described sealing ring is interior " U " type structure, upper and lower two rings are packaged in the periphery of lens, bottom arranges some annular projections with inner ring setting with better water proofing property, guarantees to greatest extent sealing grade between sealing ring and trim ring, lens.
10. LED module as claimed in claim 1, it is characterized in that, described wafer level encapsulated LED light source comprises fluorescent material, sapphire, luminescent layer, pad, and described pad is arranged at luminescent layer bottom, described sapphire is arranged on luminescent layer, and described fluorescent material is arranged on sapphire.
11. LED modules as claimed in claim 1, is characterized in that, described wafer level encapsulated LED light source is welded on described substrate, and substrate comprises one of them of metal substrate, ceramic substrate.
12. 1 kinds at least comprise that claim 1 is to the lighting device of any one LED module in claim 11.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420193983.0U CN203800079U (en) | 2014-04-21 | 2014-04-21 | LED module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420193983.0U CN203800079U (en) | 2014-04-21 | 2014-04-21 | LED module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203800079U true CN203800079U (en) | 2014-08-27 |
Family
ID=51382272
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420193983.0U Expired - Lifetime CN203800079U (en) | 2014-04-21 | 2014-04-21 | LED module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203800079U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103928602A (en) * | 2014-04-21 | 2014-07-16 | 杭州华普永明光电股份有限公司 | LED module |
| CN108154852A (en) * | 2017-12-29 | 2018-06-12 | 深圳Tcl新技术有限公司 | Backlight assembly, backlight module, display device and its control method |
-
2014
- 2014-04-21 CN CN201420193983.0U patent/CN203800079U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103928602A (en) * | 2014-04-21 | 2014-07-16 | 杭州华普永明光电股份有限公司 | LED module |
| CN108154852A (en) * | 2017-12-29 | 2018-06-12 | 深圳Tcl新技术有限公司 | Backlight assembly, backlight module, display device and its control method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140827 |