CN111081691A - Module structure for realizing light mixing and light extraction of multi-primary-color LED light source - Google Patents
Module structure for realizing light mixing and light extraction of multi-primary-color LED light source Download PDFInfo
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- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
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- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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Abstract
The invention discloses a module structure for realizing the purposes of light mixing and light extraction of a multi-primary-color LED light source, which comprises a plurality of LED lamp beads, a second thermal interface layer, a secondary optical lens, a second substrate layer and a sealing ring, wherein each LED lamp bead comprises a plurality of LED chips with different main wavelengths, leads, a primary optical lens, a first thermal interface layer and a first substrate layer, the different main wavelength chips are arranged in a staggered manner, and the primary optical lens seals the LED chips on the first substrate layer; the LED lamp beads are fixed on a second substrate layer through a second thermal interface material layer respectively, and the secondary optical lens is installed on the second substrate layer; the mounting angles of the LED lamp beads on the second substrate layer are not completely the same; and a third packaging colloid layer is contained between the primary optical lens and the secondary optical lens. The module structure solves the problem of poor color uniformity of the light-emitting space of the multi-primary-color LED light source, and improves the light extraction efficiency.
Description
Technical Field
The invention relates to a semiconductor lighting technology, in particular to a module structure for realizing the purposes of light mixing and light extraction of a multi-primary-color LED light source.
Background
An led (light Emitting diode) is a semiconductor light Emitting device manufactured based on the P-N junction electroluminescence principle, has the advantages of high electro-optical conversion efficiency, long service life, environmental protection, energy saving, small volume and the like, is known as a 21 st century green illumination light source, and has a very significant energy saving effect if being applied to the field of traditional illumination, which is of great significance at present when global energy is increasingly tense. The LED manufacturing industry chain mainly comprises four links of epitaxial growth, chip manufacturing, packaging and application. The packaging and application links are key links from the upstream chip to the application, and have key functions of mechanical protection, electrical signal connection, optical parameter regulation and control, heat dissipation and the like. The quality of the packaging and application links directly determines the final optical performance and reliability of the LED product.
At present, the traditional white light LED is formed by combining a blue light chip with yellow light fluorescent powder, and the problems of excessive blue light, lack of blue light and insufficient red light exist in light emitting. More and more researches show that the white light LED light source adopting the method has serious blue light harm, and the large proportion of the blue light power can generate adverse effects on the biological rhythm of a user, specifically, melatonin secretion is inhibited, so that the biological clock is disordered, and the sleep disorder is caused. In addition, due to the photon energy loss in the conversion from the short wavelength band to the long wavelength band, the conversion efficiency of the yellow phosphor is difficult to reach 100% (usually about 70%), which tends to reduce the luminous efficiency of the LED. And the yellow fluorescent powder can also age along with the use time, so that the problems of the LED such as luminous efficiency reduction, color temperature drift, service life reduction and the like are caused, and part of the yellow fluorescent powder can also cause pollution to the environment. Therefore, the method of synthesizing white light by combining a blue light chip and yellow fluorescent powder has serious disadvantages.
The adoption of multi-primary color high-efficiency LED chips (such as red, yellow, green, cyan and blue light) is another approach for synthesizing white light. The white light synthesized by adopting the multi-primary-color LED chip can effectively slow down the aging of the device and avoid environmental pollution. According to the prediction of semiconductor lighting research program of the United states energy agency, the limit value of the efficiency of converting fluorescent powder into white light is 250lm/W, the limit value of the efficiency of combining multi-primary-color LEDs into white light is 350lm/W, and the multi-primary-color LED white light lighting has greater potential than the fluorescent powder converting white light lighting. Therefore, the advantage of white light synthesis based on multi-primary LED in light efficiency is a trend of the next generation of semiconductor lighting technology.
In an LED packaging and application module, optical regulation and control are indispensable parts, directly influence the light emitting efficiency and the light mixing efficiency of an LED, and are key links for realizing the application requirements of multi-primary-color LED illumination. The traditional packaging structure such as the lumen-simulating packaging, the surface mount packaging and the like can not meet the requirements of uniform light mixing and high extraction efficiency of the multi-primary-color LED. As shown in fig. 1, white light is directly synthesized by using multi-primary-color LEDs, and the spatial distribution positions of LED chips with different colors are different. Because the light type of the light emitted by the LED chips with different colors is not matched, the colors of the light emitted by the LED packaging module at all visual angles in space are inconsistent, and color deviation exists, as shown in the attached drawing 2. And when the multi-primary-color LED packaging module is applied to a lamp, the secondary lens of the lamp can intensify color deviation of different spatial visual angles. The main reason is that the secondary lens controls the light propagation direction by refraction, the refraction can generate dispersion on the light emitted by the LEDs with different colors, the dispersion is more serious when the difference of refractive indexes among media is larger, the dispersion is more serious when the incident angle is larger, and the schematic diagram of the principle is shown in figure 3. For example, in order to realize road illumination, large-viewing-angle light emission needs to be realized in the road length direction, that is, light needs to be deflected toward a large viewing angle, and chromatic dispersion is particularly serious, so that a target plane obtains white light which is not synthesized by a multi-primary-color chip but is reddish and yellowish green in an area, thereby greatly reducing illumination quality and even causing traffic safety accidents. And, the larger the difference of the refractive index of the interface is, the more serious the fresnel reflection of the light passing through the interface is, and thus the lower the light extraction efficiency is. The principle schematic diagram is shown in the attached drawing 4, the refractive index of the packaging adhesive is 1.5, the refractive index of air is 1, when light enters air from the packaging adhesive or enters the packaging adhesive from the air, the reflection loss of a Fresnel is about 4%, therefore, the light emitted by a chip of the traditional packaging structure passes through the primary lens and the air gap layer and then exits through the secondary lens, the number of Fresnel loss interfaces is three, and the light emitting efficiency is greatly reduced. Therefore, the current packaging form is not suitable for multi-primary LED light sources.
Disclosure of Invention
The invention aims to provide a module structure for realizing the purposes of light mixing and light extraction of a multi-primary-color LED light source.
The purpose of the invention is realized as follows:
the utility model provides a realize mixed light of many primary colors LED light source and module structure of light extraction purpose, includes a plurality of LED lamp pearls, the thermal interface layer of second, secondary optical lens, second base plate layer and sealing washer, and the characteristic is: each LED lamp bead comprises a plurality of LED chips with different dominant wavelengths, a lead, a primary optical lens, a first thermal interface layer and a first substrate layer, the LED chips with different dominant wavelengths are arranged in a staggered mode, and the primary optical lens seals the LED chips on the first substrate layer; the LED lamp beads are fixed on a second substrate layer through a material layer of a second thermal interface layer respectively, the secondary optical lens is installed on the second substrate layer and covers the LED lamp beads, sealing is achieved through a sealing ring, and the mounting angles of the LED lamp beads on the second substrate layer are not identical; [1] and a third packaging colloid layer is arranged between the primary optical lens and the secondary optical lens, so that no air gap is formed between the LED chip and the light-emitting surface.
Furthermore, each LED lamp bead comprises 2-99 LED chips with high luminous efficiency vertical structures, the main wavelength range of the LED chips is 380 nm-780 nm, the LED chips comprise at least two or more main wavelengths, and each LED lamp bead directly synthesizes white light through the LED chips with different main wavelengths.
Further, the plurality of LED chips are distributed on the first substrate layer in a circumferential arrangement or a polygonal arrangement mode.
Further, the second packaging substrate layer comprises 3-99 LED lamp beads.
Further, the secondary optical lens is a spherical cap lens or a free-form surface lens.
Further, the secondary optical lenses are of an integral structure or an independent structure, and for the integral structure, the adjacent secondary optical lenses are interconnected; for the independent structure, the adjacent secondary optical lenses are completely independent.
Furthermore, the material of the primary optical lens is silica gel or epoxy resin, the material of the secondary optical lens is one of polycarbonate, polymethyl methacrylate, glass, silica gel or epoxy resin, the material of the third layer of encapsulation colloid layer is silica gel, the refractive indexes of the three layers of materials are matched, and the elastic modulus of the material of the third layer of encapsulation colloid layer is smaller than the elastic modulus of the material of the primary optical lens and the elastic modulus of the material of the secondary optical lens.
Further, the first substrate layer is one of a ceramic substrate, an aluminum substrate, a copper substrate or a silicon substrate, and the package structure adopted by the corresponding LED lamp bead is one of ceramic package, chip-on-board package or silicon-based package.
Further, the second substrate layer is one of an aluminum substrate or a copper substrate.
Compared with the prior art, the technical scheme provided by the invention has the advantages that:
1. by filling the third layer of encapsulation colloid layer between the primary optical lens and the secondary optical lens, no air gap is formed between the LED chip and the light-emitting surface of the secondary optical lens, and the dispersion caused by different deflection angles of the light-emitting with different colors due to the existence of the air gap is weakened, as shown in figure 5;
2. the LED chips in the LED lamp beads are combined to be arranged in a staggered mode to achieve internal light mixing of the LED lamp beads, the LED lamp beads are arranged on the second base plate layer at different patch angles, light mixing between the LED lamp beads is achieved, the effect of effective light mixing of the multi-primary-color LED light source module structure is achieved finally, meanwhile, Fresnel reflection loss between interfaces is effectively reduced due to the fact that the third-layer packaging colloid layer is introduced, and therefore light emitting efficiency is improved.
Drawings
FIG. 1 is a schematic distribution diagram of multi-primary LED light source chips;
FIG. 2 is a schematic diagram of the distribution of the light emitted from the LED chips with different colors and the color of a target plane;
FIG. 3 is a schematic diagram of a conventional package structure and light transmission of chips with different colors;
FIG. 4 is a schematic diagram of light transmission and reflection when light passes through interfaces with different refractive indexes;
FIG. 5 is a schematic diagram of the package structure and the light transmission of chips with different colors according to the present invention;
fig. 6 is a schematic cross-sectional view of a light mixing and extracting module of an LED light source with two primary colors according to embodiment 1 of the present invention;
fig. 7 is a schematic top view of a light mixing and extracting module of an LED light source with two primary colors according to embodiment 1 of the present invention;
FIG. 8 is a schematic cross-sectional view of a two-primary-color LED lamp bead in embodiment 1 of the present invention;
fig. 9 is a schematic top view of a two-primary-color LED lamp bead in embodiment 1 of the present invention;
fig. 10 is a schematic cross-sectional partially enlarged view of a light mixing and extracting module of an LED light source with two primary colors according to embodiment 1 of the present invention;
fig. 11 is a schematic top view partially enlarged view of a light mixing and extracting module of an LED light source with two primary colors according to embodiment 1 of the present invention;
fig. 12 is a schematic cross-sectional view of a light mixing and extracting module of an LED light source with two primary colors according to embodiment 2 of the present invention;
FIG. 13 is a schematic top view of a four-primary-color LED lamp bead in embodiment 3 of the present invention
Fig. 14 is a schematic cross-sectional view of a light mixing and extracting module of a five-primary-color LED light source according to embodiment 4 of the present invention;
fig. 15 is a schematic top view of a light mixing and extracting module of a five-primary-color LED light source according to embodiment 4 of the present invention;
fig. 16 is a schematic structural cross-sectional view of a five-primary-color LED lamp bead in embodiment 4 of the present invention;
fig. 17 is a schematic top view of a five-primary-color LED lamp bead according to embodiment 4 of the present invention;
fig. 18 is a schematic cross-sectional partially enlarged view of a light mixing and extracting module of a five-primary-color LED light source according to embodiment 4 of the present invention;
fig. 19 is a schematic top view partially enlarged view of a light mixing and extracting module of a five-primary-color LED light source according to embodiment 4 of the present invention;
fig. 20 is a schematic cross-sectional view of a light mixing and extracting module of a five-primary-color LED light source according to embodiment 5 of the present invention;
fig. 21 is a schematic top view partially enlarged view of the light mixing and extracting module of the two-primary-color LED light source according to embodiment 6 of the present invention.
Detailed Description
The invention is further illustrated by the following examples in connection with the accompanying drawings.
Example 1:
as shown in fig. 6, a module structure for realizing the light mixing and light extraction of a multi-primary-color LED light source includes LED beads 11, a thermal interface material layer (i.e., a second thermal interface layer) 12, a free-form surface lens 13, an aluminum substrate 14, and a sealing ring 15. The LED lamp beads 11 are respectively fixed on the aluminum substrate 14 through the thermal interface layer material layer 12, the free-form surface lens 13 is installed on the aluminum substrate 14 and covers the LED lamp beads 11, and sealing is achieved through the sealing ring 15. The free-form surface lenses 13 are made of polycarbonate and are structurally integrated, i.e., the free-form surface lenses 13 are interconnected. As shown in fig. 7, 22 LED beads 11 are dispersedly disposed on the module structure, and the LED beads 11 are distributed on the aluminum substrate 14 in a rectangular arrangement.
As shown in fig. 8, the LED lamp bead adopts a ceramic package structure, and includes four LED chips 111, gold wires 112, a silica gel ball cap lens 113, a die bonding layer (i.e., a first thermal interface layer) 114, and a ceramic substrate 115, where the four LED chips 111 are mechanically and fixedly connected to the ceramic substrate 115 through the die bonding layer 114, and the four LED chips 111 are electrically interconnected to the ceramic substrate 115 through the gold wires 112. The four LED chips 111 are sealed on the ceramic substrate 115 by the silicone ball cap lens 113. As shown in fig. 9, the four LED chips in each LED lamp bead include two red LED chips 1111 with a dominant wavelength of 650nm and two yellow LED chips 1112 with a dominant wavelength of 555, and the different dominant wavelength chips are arranged in a square shape.
As shown in fig. 10, a silica gel layer 16 is included between the silica gel ball cap lens 113 and the free-form surface lens 13 to ensure that there is no air gap between the LED chip 111 and the light-emitting surface of the free-form surface lens 13.
As shown in fig. 11, a plurality of LED lamp pearl are not identical on the second base plate layer paster angle, for the convenience of explanation, establish rectangular coordinate system, use the self upper left corner of LED lamp pearl 17 as the initial point, clockwise reads LED chip information, the LED chip that LED lamp pearl 17 adopted is red yellow, the LED chip that LED lamp pearl 18 adopted is yellow red, namely LED lamp pearl 18 differs 90 degrees on the second base plate layer paster angle and LED lamp pearl 17, analogize with this, guarantee that a plurality of LED lamp pearl are not identical on the second base plate layer paster angle.
Example 2:
as shown in fig. 12, the light mixing and extracting module of two primary color LED light sources, the structure of embodiment 2 is substantially the same as that of embodiment 1, and is different from that of embodiment 1 in that: the free-form surface lens 21 employed in example 2 was free-standing, that is: each LED lamp bead 22 corresponds to one free-form surface lens 21, and is sealed by a sealing ring 23.
Example 3:
as shown in fig. 13, which is a schematic top view of a four-primary-color LED lamp bead in a light mixing and extracting module of a four-primary-color LED light source, the structure of embodiment 3 is substantially the same as that of embodiment 1, and is different from embodiment 1 in that: embodiment 3 includes four chips of different dominant wavelengths in the lamp pearl that adopts, promptly: the LED light source comprises a red LED chip 3111 with a dominant wavelength of 630nm, a yellow LED chip 3112 with a dominant wavelength of 560nm, a green LED chip 3113 with a dominant wavelength of 530nm, and a blue LED chip 3114 with a dominant wavelength of 460nm, wherein the LED chips with different dominant wavelengths are arranged in a square staggered manner.
Example 4:
as shown in fig. 14, a module structure for realizing the light mixing and light extraction of a five-primary-color LED light source includes LED beads 41, a thermal interface material layer (i.e., a second thermal interface layer) 42, a free-form surface lens 43, a copper substrate 44, and a sealing ring 45. The LED lamp beads 41 are respectively fixed on the copper substrate 44 through the thermal interface material layer 42, the free-form surface lens 43 is installed on the copper substrate 44 and covers the LED lamp beads 41, and sealing is achieved through the sealing ring 45. The free-form surface lens 43 is made of polymethyl methacrylate, and the structure of the free-form surface lens is independent, namely each LED lamp bead 41 corresponds to one free-form surface lens 43. As shown in fig. 15, 36 LED beads 41 are distributed on the module structure in a co-dispersed manner, and the LED beads are distributed on the copper substrate 42 in a circular arrangement.
As shown in fig. 16, the LED lamp bead is packaged by a chip-on-board package structure, and includes five LED chips 411, gold wires 412, an epoxy resin ball cap lens 413, a die attach layer (i.e., a first thermal interface layer) 414, and a copper substrate 415, where the five LED chips 411 are mechanically and fixedly connected to the copper substrate 415 through the die attach layer 414, and the five LED chips 411 are electrically connected to the copper substrate 415 through the gold wires 412. An epoxy ball cap lens 413 seals the five LED chips 411 on the copper substrate 415. As shown in fig. 17, the five LED chips in the lamp bead include a red LED chip 4111 with a dominant wavelength of 625nm, a yellow LED chip 4112 with a dominant wavelength of 555nm, a green LED chip 4113 with a dominant wavelength of 520nm, a cyan LED chip 4114 with a dominant wavelength of 500nm, and a blue LED chip 4115 with a dominant wavelength of 455nm, and the different dominant wavelength chips are arranged in a square staggered manner. As shown in fig. 18, a silicon layer 46 is included between the ball cap lens 413 and the free-form surface lens 43 to ensure that there is no air gap between the LED chip 411 and the light-emitting surface of the free-form surface lens 43.
As shown in fig. 19, the chip angles of a plurality of LED lamp beads on the second substrate layer are not completely the same, for convenience of description, a rectangular coordinate system is established, the upper left corner of the LED lamp bead 47 itself is used as an original point, chip information is read clockwise, and finally, the chip is a central position chip, the LED lamp bead 47 adopts red, yellow, green, blue, green, red, yellow, green, blue, the LED lamp bead 48 adopts cyan, red, yellow, blue, the LED lamp bead 49 adopts green, cyan, red, yellow, blue, the LED lamp bead 50 adopts cyan, red, blue, green, blue, the LED lamp bead 52 adopts yellow, green, cyan, red, blue, that is, the chip angles of adjacent LED lamp beads on the second substrate layer differ by 90 degrees, and so on, it is ensured that the chip angles of the plurality of LED lamp beads on the.
Example 5:
as shown in fig. 20, the light mixing and extracting module of a five-primary-color LED light source is substantially the same as that of embodiment 4 in structure of embodiment 5, and is different from embodiment 4 in that: the free-form surface lens 53 used in example 5 is an integral type, that is: the free-form lenses 53 are interconnected.
Example 6:
as shown in fig. 21, which is a schematic view of locally enlarging a top view of a light mixing and extracting module of two primary color LED light sources, the structure of embodiment 6 is basically the same as that of embodiment 4, and the difference from embodiment 4 is that the LED lamp bead 61 adopted in embodiment 6 is a bicolor lamp bead, that is, the lamp bead includes two red LED chips 6111 having a dominant wavelength of 620nm and two yellow LED chips 6112 having a dominant wavelength of 555, and the different dominant wavelength chips are arranged in a staggered manner.
Claims (9)
1. The utility model provides a realize mixed light of many primary colors LED light source and module structure of light extraction purpose, includes a plurality of LED lamp pearls, the hot interfacial layer of second, secondary optical lens, second base plate layer and sealing washer, its characterized in that: each LED lamp bead comprises a plurality of LED chips with different dominant wavelengths, a lead, a primary optical lens, a first thermal interface layer and a first substrate layer, the LED chips with different dominant wavelengths are arranged in a staggered mode, and the primary optical lens seals the LED chips on the first substrate layer; the LED lamp beads are fixed on a second substrate layer through a material layer of a second thermal interface layer respectively, the secondary optical lens is installed on the second substrate layer and covers the LED lamp beads, sealing is achieved through a sealing ring, and the mounting angles of the LED lamp beads on the second substrate layer are not identical; and a third packaging colloid layer is arranged between the primary optical lens and the secondary optical lens, so that no air gap is formed between the LED chip and the light-emitting surface.
2. The module structure for realizing the purpose of light mixing and light extraction of a multi-primary LED light source as claimed in claim 1, wherein: each LED lamp bead comprises 2-99 LED chips with high luminous efficiency vertical structures, the main wavelength range of the LED chips is 380 nm-780 nm, the LED lamp beads comprise at least two or more main wavelengths, and each LED lamp bead directly synthesizes white light through the LED chips with different main wavelengths.
3. The module structure for realizing the purpose of light mixing and light extraction of a multi-primary LED light source as claimed in claim 1, wherein: the LED chips are distributed on the first substrate layer in a circumferential arrangement or polygonal arrangement mode.
4. The module structure for realizing the purpose of light mixing and light extraction of a multi-primary LED light source as claimed in claim 1, wherein: the second packaging substrate layer comprises 3-99 lamp beads.
5. The module structure for realizing the purpose of light mixing and light extraction of a multi-primary LED light source as claimed in claim 1, wherein: the secondary optical lens is a spherical cap lens or a free-form surface lens.
6. The module structure for realizing the purpose of light mixing and light extraction of a multi-primary LED light source as claimed in claim 1, wherein: the secondary lenses are of an integral structure or an independent structure, and for the integral structure, the adjacent secondary optical lenses are interconnected; for the independent structure, the adjacent secondary optical lenses are completely independent.
7. The module structure for realizing the purpose of light mixing and light extraction of a multi-primary LED light source as claimed in claim 1, wherein: the material of the primary optical lens is silica gel or epoxy resin, the material of the secondary optical lens is one of polycarbonate, polymethyl methacrylate, glass, silica gel or epoxy resin, the material of the third layer of packaging colloid layer is silica gel, the refractive indexes of the three layers of materials are matched, and the elastic modulus of the material of the third layer of packaging colloid layer is smaller than that of the material of the primary optical lens and that of the material of the secondary optical lens.
8. The module structure for realizing the purpose of light mixing and light extraction of a multi-primary LED light source as claimed in claim 1, wherein: the first substrate layer is one of a ceramic substrate, an aluminum substrate, a copper substrate or a silicon substrate, and the packaging structure adopted by the corresponding LED lamp bead is one of ceramic packaging, chip-on-board packaging or silicon-based packaging.
9. The module structure for realizing the purpose of light mixing and light extraction of a multi-primary LED light source as claimed in claim 1, wherein: the second substrate layer is one of an aluminum substrate or a copper substrate.
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| CN201911336674.8A CN111081691A (en) | 2019-12-23 | 2019-12-23 | Module structure for realizing light mixing and light extraction of multi-primary-color LED light source |
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Cited By (4)
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| CN112863317A (en) * | 2021-01-26 | 2021-05-28 | 南昌大学 | Optical experiment box with adjustable LED light source |
| CN114335305A (en) * | 2021-11-09 | 2022-04-12 | 南昌大学 | Fluorescent powder-free multi-primary color LED side light emitting module and side light emitting device |
| CN114937647A (en) * | 2022-05-30 | 2022-08-23 | 广东省旭晟半导体股份有限公司 | Semiconductor packaging structure and packaging method |
| CN114963054A (en) * | 2021-02-25 | 2022-08-30 | 杭州赛美蓝光电科技有限公司 | Biological lighting source |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112863317A (en) * | 2021-01-26 | 2021-05-28 | 南昌大学 | Optical experiment box with adjustable LED light source |
| CN114963054A (en) * | 2021-02-25 | 2022-08-30 | 杭州赛美蓝光电科技有限公司 | Biological lighting source |
| CN114335305A (en) * | 2021-11-09 | 2022-04-12 | 南昌大学 | Fluorescent powder-free multi-primary color LED side light emitting module and side light emitting device |
| CN114335305B (en) * | 2021-11-09 | 2024-04-16 | 南昌大学 | Fluorescent powder-free multi-primary-color LED side light-emitting module and side light-emitting device |
| CN114937647A (en) * | 2022-05-30 | 2022-08-23 | 广东省旭晟半导体股份有限公司 | Semiconductor packaging structure and packaging method |
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