CN112234134A - Fluorescent powder-free multi-primary-color LED packaging structure and packaging method thereof - Google Patents
Fluorescent powder-free multi-primary-color LED packaging structure and packaging method thereof Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- Condensed Matter Physics & Semiconductors (AREA)
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- Led Device Packages (AREA)
Abstract
The invention discloses a fluorescent powder-free multi-primary color LED packaging structure and a packaging method thereof, wherein the packaging structure comprises a packaging substrate, a plurality of LED chips arranged at intervals, a solid crystal layer, a lead and a composite packaging glue structure; the packaging substrate is provided with a plurality of LED chips which are bonded through a die bonding layer, the LED chips are connected with a substrate circuit through leads, the multi-primary LED chips are provided with a composite packaging adhesive structure, the composite packaging adhesive structure is composed of a first packaging adhesive layer of pure packaging adhesive and a second packaging adhesive layer doped with micro-nano scattering particles, and the second packaging adhesive layer is located around the first packaging adhesive layer. Therefore, most of light is directly emitted from the first packaging adhesive layer, and the light with large angle is scattered with the micron nano particles in the second packaging adhesive layer doped with the micron nano particles, so that the uniformity of light emitted by different LED chips in each direction is improved, light mixing at large visual angle is realized, and the high light extraction efficiency is ensured.
Description
Technical Field
The invention relates to the technical field of LED packaging, in particular to a fluorescent powder-free multi-primary-color LED packaging structure and a packaging method thereof.
Background
LED (light Emitting diodes) is a semiconductor light Emitting device based on P-N junction electroluminescence principle, has the advantages of high electro-optical conversion efficiency, long service life, environmental protection, energy saving, small volume, etc., and has begun to be widely applied in many fields such as backlight, street lamps, automobile headlights, head lamps and indoor lighting, etc., with the continuous improvement of LED efficiency and the popularization of application products, the demand of people for LED lighting has been gradually changed from "lighting" to "lighting comfort", so the spatial color uniformity becomes one of the important evaluation indexes of LED lighting quality.
The current white light LED synthesis method mainly comprises two methods, one is to use a blue LED chip to excite fluorescent powder to synthesize white light; another is to synthesize white light by multi-color LED chips (e.g., blue, cyan, green, yellow, and red LED chips). The blue light chip is combined with the yellow fluorescent powder to synthesize white light, and the problems of excessive blue light, lack of blue light and insufficient red light exist in the spectrum of the white light. More and more researches show that the problem of serious blue light leakage exists along with the time when the white light LED light source is synthesized by the method, and due to the fact that the blue light accounts for a large amount in the spectrum, a non-visual biological effect is generated on a user, melatonin secretion is influenced, a biological clock disorder is caused, the sleep quality is poor, and the like. In addition, the yellow fluorescent powder can age with the use time, which causes the problems of the LED such as the reduction of luminous efficiency and the color temperature drift, therefore, the method of synthesizing white light by combining the blue light chip and the yellow fluorescent powder has serious defects.
The white light synthesized by the multicolor LED chip has the advantages of long service life, continuously adjustable spectrum, high light quality and the like, and has wider prospects in the fields of intelligent illumination, health illumination, visible light communication and the like. The multi-primary-color white light LED can effectively solve the problems of color temperature drift, blue light leakage and the like caused by fluorescent powder aging of the fluorescent powder conversion LED in the using process. According to the prediction of the LED illumination plan issued by the U.S. department of energy, the limiting efficiency of the phosphor-converted white LED is about 250lm/W, and the limiting efficiency of the multi-primary color white LED is about 350lm/W, so that the multi-primary color white LED with high quality, high reliability and high light efficiency is the inevitable trend of the next generation of green healthy illumination.
In LED packaging, optical regulation and control are indispensable parts, directly influence the light emitting efficiency and the light mixing efficiency of an LED, and are key links for realizing the application requirements of multi-primary-color LED illumination. The traditional packaging structure such as the lumen-imitating package, the SMD package and the like can not meet the requirements of uniform light mixing and high extraction efficiency of the multi-primary-color LED. The white light is directly synthesized by adopting multi-primary-color LEDs, and LED chips with different colors are different in spatial distribution position. Due to the fact that the light intensities of the light emitted by the LED chips with different colors at different angles are not matched, the color temperature of the light emitted by the LED packaging module at each visual angle in space is not consistent, and color temperature deviation exists. Moreover, when the multi-primary-color LED packaging module is applied to a lamp, the secondary lens of the lamp aggravates color temperature deviation of different spatial viewing angles, and particularly, a color separation phenomenon can occur even at a large viewing angle, so that a target plane obtains regional color spots instead of white light synthesized by a multi-primary-color chip, the illumination quality is greatly reduced, and the requirement of high-quality illumination cannot be met.
Disclosure of Invention
The first purpose of the invention is to provide a phosphor-free multi-primary-color LED packaging structure, which utilizes a packaging colloid layer doped with scattering particles to solve the problem of uneven light emission of LED chips with different colors, thereby not only improving the spatial color uniformity, but also ensuring the high light extraction efficiency.
The second purpose of the invention is to provide a phosphor-free multi-primary-color LED packaging method, which avoids the use of phosphor powder, simplifies the packaging process, improves the reliability of the packaging module, and can overcome the defects of excessive light and blue light, blue light loss and insufficient red light in the traditional packaging method.
The first object of the present invention is achieved by:
a phosphor-free multi-primary color LED packaging structure is characterized in that: the LED packaging structure comprises a packaging substrate, a plurality of LED chips arranged at intervals, a solid crystal layer, a lead and a composite packaging adhesive structure; the packaging substrate is provided with a plurality of LED chips which are bonded through a die bonding layer, each LED chip is connected with a substrate circuit through a lead, the LED chips are provided with a composite packaging adhesive structure, the composite packaging adhesive structure is composed of a first packaging adhesive layer of pure packaging adhesive and a second packaging adhesive layer doped with micro-nano scattering particles, and the second packaging adhesive layer is positioned around the first packaging adhesive layer. So guarantee most light and directly follow first encapsulation glue film outgoing, and the scattering effect takes place with micro-nano scattering particle in the second encapsulation glue film that micro-nano scattering particle mixes for the light of wide angle to improve the homogeneity of each direction of different LED chip light-emitting, realize the mixed light of wide visual angle, guarantee highlight extraction efficiency simultaneously.
Further, the composite packaging adhesive structure realizes light extraction and light mixing of the multi-primary-color LED chip, wherein the first packaging adhesive layer is one of a hemispherical cap lens structure, a segment lens structure, a ball table lens structure, a circular table lens structure, a free-form surface lens structure, a trapezoidal structure lens structure, a square lens structure, a cylindrical lens structure or a polygonal lens structure.
Further, the height h of the first packaging adhesive layer in the vertical direction is 1 mm-50 mm, the characteristic length s of the first packaging adhesive layer [1] in the horizontal direction is 2 mm-100 mm, and the ratio s1/s3 of the characteristic length s1 of the first packaging adhesive layer in the top horizontal direction to the characteristic length s3 of the first packaging adhesive layer in the bottom horizontal direction is 0-1.
Further, the horizontal direction thickness s2 of second encapsulation glue film is 0mm ~50mm, horizontal direction thickness be invariable or gradual change in the vertical direction, the vertical direction height of second encapsulation glue film is the same with the vertical direction height of first encapsulation glue film, or is less than the vertical direction height of first encapsulation glue film.
Further, the material of the first packaging adhesive layer is one of silica gel, polyurethane or epoxy resin. Because the refractive index of the LED light emergent surface material is relatively large (for example, the refractive index of GaP is 3.32, and the refractive index of GaN is 2.5), light can generate total reflection at the packaging adhesive-air boundary, so that only light with partial angles can be emitted from the device, light with other larger angles is reflected back to the inside of the chip and cannot be extracted, the refractive index of the packaging adhesive is between that of the LED device material and air, and the critical total reflection angle can be increased by utilizing the difference of the refractive indexes of different materials, so that light extraction is realized.
Further, the second packaging adhesive layer is one of silica gel, polyurethane or epoxy resin doped with micro-nano scattering particles, the micro-nano scattering particles are organic micro-nano scattering particles of silicone resin, polycarbonate or polymethyl methacrylate, or the micro-nano scattering particles are inorganic micro-nano scattering particles of silicon dioxide, titanium dioxide, aluminum nitride, zirconium dioxide, barium sulfate or calcium carbonate, the particle size of the micro-nano scattering particles is 0.005-20 μm, and the doping concentration of the micro-nano scattering particles is 0.001-20%.
Furthermore, at least two LED chips with different wavelengths are arranged on the packaging substrate, the LED chips are GaN binary material chips or AlGaNP quaternary material chips, and the LED chips are distributed in a circular or polygonal arrangement. According to the colorimetry theory, the LED chips with different wavelengths can realize light with different color temperatures, for example, the LED chips with yellow light and red light with different wavelengths can synthesize golden yellow light with low color temperature; the high-color-rendering-index five-primary-color LED white light can be synthesized by using the LED chips with the five different wavelengths of blue light, cyan light, green light, yellow light and red light.
Furthermore, one of packaging glue, high-reflectivity reflective paint or high-concentration scattering particle doped packaging glue is coated around the LED chip. The purpose is to reduce the side-wall absorption of the chip and increase the light extraction.
Further, the packaging substrate is one of a copper substrate, an aluminum substrate, a silicon substrate, a ceramic substrate or a PCB, and the reflective layer on the surface of the packaging substrate is a high-reflectivity reflective paint layer or a high-reflectivity reflective glue layer. Due to the total reflection and Fresnel reflection of the packaging adhesive-air interface, part of light is reflected back to the packaging substrate, and light extraction is increased through the substrate high-reflectivity coating.
The second object of the invention is achieved by:
a packaging method of a fluorescent powder-free multi-primary-color LED realizes high spatial color uniformity through a second packaging adhesive layer doped with micro-nano scattering particles, and comprises the following specific implementation steps:
a: preparing a plurality of LED chips with more than two different wavelengths, and bonding the LED chips which are arranged at intervals through a solid crystal layer;
b: the upper electrode of the chip is connected with a circuit on the packaging substrate by a gold wire, an aluminum wire, a copper wire or a silver wire by adopting a wire bonding process to realize electric connection;
c: preparing packaging adhesive, manufacturing a first packaging adhesive layer on a packaging substrate by adopting a die top or spot coating process to realize light extraction of different LED chips, and heating the first packaging adhesive layer to realize curing of the first packaging adhesive layer;
d: and uniformly mixing the micron scattering particles or the nanometer scattering particles with the packaging adhesive, manufacturing a second packaging adhesive layer doped with the micron scattering particles around the first packaging adhesive layer by adopting a die-top or spot-coating process, realizing light mixing of different LED chips, heating the whole packaging module to realize curing of the second packaging adhesive layer, and obtaining a finished product.
Compared with the prior art, the technical scheme provided by the invention has the following advantages that:
1. according to the fluorescent powder-free multi-primary-color LED packaging structure, the problems of uneven light emission of LED chips with different colors, mixed light and light extraction of multi-primary-color LED packaging are solved by using the composite packaging colloid layer doped with scattering particles, the uniformity of space colors is improved by using the scattering effect of micro-nano scattering particles, the high light extraction efficiency is ensured, and the problem of light loss caused by backscattering of the micro-nano particles is solved;
2. the fluorescent powder-free multi-primary color LED packaging method provided by the invention avoids the use of fluorescent powder, simplifies the packaging process, improves the reliability of the packaging module, and can overcome the defects of excessive light and blue light, blue light deficiency and insufficient red light in the traditional packaging method.
Drawings
Fig. 1 is a schematic view of a package structure according to embodiment 1 of the present invention;
fig. 2 is a schematic distribution diagram of a multi-primary-color LED chip on a substrate according to embodiment 1 of the present invention;
fig. 3 is a schematic three-dimensional structure diagram of a package module according to embodiment 1 of the present invention;
FIG. 4 is a graph comparing color temperature with spatial viewing angle for a conventional ball cap package structure and a package structure of embodiment 1 of the present invention;
FIG. 5 is a graph comparing color temperature with spatial viewing angle for a conventional ball cap package structure and a package structure of embodiment 2 of the present invention;
fig. 6 is a schematic view of a package structure according to embodiment 3 of the present invention;
FIG. 7 is a schematic diagram of the distribution of multi-primary LED chips on a substrate in embodiment 3 of the present invention
Fig. 8 is a schematic view of a package structure according to embodiment 4 of the present invention;
fig. 9 is a schematic view of a package structure according to embodiment 5 of the present invention;
fig. 10 is a schematic view of a package structure according to embodiment 6 of the present invention;
fig. 11 is a schematic view of the distribution of the golden yellow LED chips on the substrate according to embodiment 6 of the present invention;
fig. 12 is a schematic view of a package structure according to embodiment 7 of the invention.
Detailed Description
The invention is further illustrated by the following examples in connection with the accompanying drawings.
Example 1:
as shown in fig. 1, a phosphor-free multi-primary-color LED package structure includes a ceramic substrate 11, four LED chips 13 arranged at intervals, a die attach layer 12, leads 14, and composite package glue layers 16 and 17; four LED chips 13 which are arranged at intervals are bonded on the ceramic substrate 11 through the solid crystal layer 12, the LED chips 13 are connected with the substrate circuit 15 through leads 14, composite packaging adhesive layers 16 and 17 are arranged on the LED chips 13, each composite packaging adhesive layer is composed of a first packaging adhesive layer 16 and a second packaging adhesive layer 17 doped with micro-nano scattering particles, and the second packaging adhesive layer 17 is positioned around the first packaging adhesive layer 16.
The first packaging adhesive layer 16 is made of silica gel, the first packaging adhesive layer 16 is in a spherical frustum shape, the height h of the first packaging adhesive layer 16 in the vertical direction is 4mm, and the characteristic lengths s1 and s3 of the top and bottom of the first packaging adhesive layer 16 in the horizontal direction are 12mm and 15mm respectively. The ratio s1/s3 of the top horizontal characteristic length s1 to the bottom horizontal characteristic length s3 of the first encapsulating glue layer is 0.8. The height h of the second packaging adhesive layer 17 in the vertical direction is 4mm, the thickness of the second packaging adhesive layer 17 in the horizontal direction is constant, the thickness s2 in the horizontal direction is 1.5mm, the material of the second packaging adhesive layer 17 is silica gel doped with scattering particles, the scattering particles are organic silicon resin particles, the doping concentration is 0.6wt%, and the average particle size of the scattering particles is 2 micrometers.
As shown in fig. 1, a method for packaging a phosphor-free multi-primary LED improves spatial color uniformity of the multi-primary LED through a second packaging layer doped with micro-nano particles, and includes the following specific steps:
1. firstly, bonding an LED chip 13 on a ceramic substrate 11 through a silver glue solid crystal layer 12 to realize the electrical connection between a lower electrode of the chip 13 and a circuit 15 on the ceramic substrate 11; the arrangement of the 4 LED chips 13 on the ceramic substrate 11 is shown in fig. 2, where the 4 LED chips 13 are composed of a blue LED chip 131 with a dominant wavelength of 460nm, a green LED chip 132 with a dominant wavelength of 520nm, a yellow LED chip 133 with a dominant wavelength of 560nm, and a red LED chip 134 with a dominant wavelength of 620nm, and are distributed on the ceramic substrate 11 at intervals in a square arrangement;
2. the upper electrode of the chip 13 is connected with a circuit 15 on the ceramic substrate 11 through a lead 14 by adopting a lead bonding process to realize electric connection;
3. manufacturing a spherical first packaging adhesive layer 16 on a ceramic substrate 11 by adopting a die-top process to realize light extraction of different LED chips, heating and curing the first packaging adhesive layer 16, and baking and heating the first packaging adhesive layer by using a baking oven at the heating temperature of 150 ℃ for 0.5 hour;
4. the micro-nano particles and the packaging adhesive are uniformly mixed, a second packaging adhesive layer 17 doped with the micro-nano particles is manufactured around the first packaging adhesive layer 16 by adopting a die-jacking process, so that light mixing of different LED chips is realized, the whole packaging module is heated and cured, the heating temperature is 150 ℃, and the heating time is 1 hour.
Fig. 3 is a schematic diagram of a three-dimensional structure of a package module with a composite package structure, which includes a ceramic substrate 11, a chip 13, a first package adhesive layer 16 and a second package adhesive layer 17. According to the method, the micro-nano particles are doped with the packaging adhesive layer to improve the light emitting distribution of different colors of the LED chip, so that the uniformity of spatial color is improved.
As shown in fig. 4, a comparison graph of color temperature variation with spatial viewing angle of the conventional ball cap package structure and the package structure of the present embodiment shows that by using the package structure of the present embodiment, high spatial color uniformity of light emitted from the multi-primary LED package structure is achieved.
Example 2:
the structure of example 2 is substantially the same as that of example 1, and differs from example 1 in that: the scattering particles used in example 2 were an inorganic material, TiO2, TiO2 doped with 0.6wt%, TiO2 having a particle size of 2 μm.
As shown in fig. 5, a comparison graph of color temperature of the conventional ball cap package structure and the package structure of embodiment 2 along with the change of the spatial viewing angle shows that the package structure of the present embodiment realizes high spatial color uniformity of light emitted from the multi-primary LED package structure.
Example 3:
as shown in fig. 6, a phosphor-free multi-primary-color LED package structure includes an aluminum substrate 61, five LED chips 63 arranged at intervals, a die attach layer 62, leads 64, and composite package glue layers 66 and 67; five LED chips 63 which are arranged at intervals are bonded on the aluminum substrate 61 through the solid crystal layer 62, the LED chips 63 are connected with the substrate circuit 65 through leads 64, composite packaging adhesive layers 66 and 67 are arranged on the LED chips 63, each composite packaging adhesive layer is composed of a first packaging adhesive layer 66 and a second packaging adhesive layer 67 doped with micro-nano scattering particles, and the second packaging adhesive layers 67 are located around the first packaging adhesive layer 66.
The first packaging adhesive layer 16 is made of epoxy resin, the first packaging adhesive layer 66 is of a cylindrical structure, the height h of the first packaging adhesive layer 66 in the vertical direction is 10mm, the characteristic length s of the first packaging adhesive layer 66 is 30mm, and the characteristic lengths s1 and s3 of the top and bottom of the first packaging adhesive layer 66 in the horizontal direction are both 30 mm. The ratio s1/s3 of the top horizontal characteristic length s1 and the bottom horizontal characteristic length s3 of the first encapsulating glue layer is 1. The height h of the second packaging adhesive layer 67 in the vertical direction is 10mm, the thickness of the second packaging adhesive layer 67 in the horizontal direction is constant, and the thickness s2 in the horizontal direction is 5 mm. The second packaging adhesive layer 67 is made of epoxy resin doped with scattering particles, the scattering particles are zirconium dioxide, the doping concentration is 5wt%, and the average particle size of the scattering particles is 5 μm.
As shown in FIG. 7, the arrangement of the 5 LED chips 63 on the aluminum substrate 61 is that the 5 LED chips 63 are composed of a blue LED chip 631 having a dominant wavelength of 460nm, a cyan LED chip 632 having a dominant wavelength of 485nm, a green LED chip 633 having a dominant wavelength of 520nm, a yellow LED chip 634 having a dominant wavelength of 560nm, and a red LED chip 635 having a dominant wavelength of 620nm, and are distributed on the aluminum substrate 61 at intervals in an annular arrangement manner.
Example 4:
as shown in fig. 8, a phosphor-free multi-primary-color LED package structure includes a copper substrate 81, a plurality of LED chips 83 disposed at intervals, a die attach layer 82, leads 84, and composite package glue layers 86 and 88; a plurality of LED chips 83 which are arranged at intervals are bonded on the copper substrate 81 through the die bonding layer 82, the LED chips 83 are connected with the substrate circuit 85 through leads 84, composite packaging adhesive layers 86 and 87 are arranged on the LED chips 83, each composite packaging adhesive layer is composed of a first packaging adhesive layer 86 and a second packaging adhesive layer 87 doped with micro-nano scattering particles, and the second packaging adhesive layers 87 are positioned around the first packaging adhesive layers 86.
The first packaging adhesive layer 16 is made of polyurethane, the first packaging adhesive layer 86 is of a ball cap structure, the height h of the first packaging adhesive layer 86 in the vertical direction is 6mm, and the characteristic lengths s1 and s3 of the top and bottom of the first packaging adhesive layer 86 in the horizontal direction are 0mm and 20mm respectively. The ratio s1/s3 of the top horizontal characteristic length s1 and the bottom horizontal characteristic length s3 of the first encapsulating glue layer is 0. The height h of the second packaging adhesive layer 87 in the vertical direction is 4mm, the thickness s2 of the second packaging adhesive layer 87 in the horizontal direction is gradually changed, and the thickness s2 in the horizontal direction is gradually changed from 0 to 2mm from top to bottom in the vertical direction. The material of the second packaging adhesive layer 87 is epoxy resin doped with scattering particles, the scattering particles are polycarbonate, the concentration is 10wt%, and the average particle size of the scattering particles is 8 μm.
Example 5:
as shown in fig. 9, a phosphor-free multi-primary color LED package structure includes a silicon substrate 91, four LED chips 93 spaced apart from each other, a die attach layer 92, leads 94, and composite package glue layers 96 and 97; four LED chips 93 which are arranged at intervals are bonded on the silicon substrate 91 through the solid crystal layer 92, the LED chips 93 are connected with the substrate circuit 95 through the leads 94, composite packaging adhesive layers 96 and 97 are arranged on the LED chips 93, each composite packaging adhesive layer is composed of a first packaging adhesive layer 96 and a second packaging adhesive layer 97 doped with micro-nano scattering particles, and the second packaging adhesive layer 97 is positioned around the first packaging adhesive layer 96.
Wherein, first encapsulation glue film 96 material is silica gel, and first encapsulation glue film 96 is the cylindrical structure of top curved surface, and first encapsulation glue film 96 vertical direction height h is 35mm, and first encapsulation glue film 96 top and bottom horizontal direction characteristic length s1 and s3 are 0mm and 50mm respectively. The ratio s1/s3 of the top horizontal characteristic length s1 and the bottom horizontal characteristic length s3 of the first encapsulating glue layer is 0. The height h of the second packaging adhesive layer 97 in the vertical direction is 25mm, the thickness s2 of the second packaging adhesive layer 97 in the horizontal direction is gradually changed, and the thickness s2 in the horizontal direction is gradually changed from 0 to 10mm from top to bottom in the vertical direction. The second packaging adhesive layer 77 is made of silica gel doped with scattering particles, the scattering particles are silicon dioxide, the concentration is 10wt%, and the average particle size of the scattering particles is 1 μm.
Example 6:
as shown in fig. 10, a phosphor-free multi-primary color LED package structure includes a ceramic substrate 101, four LED chips 103 arranged at intervals, a die attach layer 102, leads 104, and composite package glue layers 106 and 107; four LED chips 103 which are arranged at intervals are bonded on the ceramic substrate 101 through the solid crystal layer 102, the LED chips 103 are connected with the substrate circuit 105 through leads 104, composite packaging adhesive layers 106 and 107 are arranged on the LED chips 103, each composite packaging adhesive layer is composed of a first packaging adhesive layer 106 and a second packaging adhesive layer 107 which is doped with micro-nano scattering particles, and the second packaging adhesive layers 107 are located around the first packaging adhesive layers 106.
The surface of the packaging substrate 101 is provided with a white glue layer 109 with high diffuse reflectance, white glue 108 with high diffuse reflectance is coated on the periphery of the LED chip 103, and the thickness of the white glue 108 with high diffuse reflectance, which is coated on the periphery of the LED chip 103, is consistent with that of the LED chip and is 0.2 mm. The arrangement of the 4 LED chips 103 on the ceramic substrate 101 is shown in fig. 11, and the 4 LED chips 103 are composed of two yellow LED chips 1031 having a dominant wavelength of 560nm and two red LED chips 1032 having a dominant wavelength of 620nm, and are distributed at intervals on the ceramic substrate 101 in a rectangular arrangement. The first encapsulant layer 106 is made of silicon gel, the first encapsulant layer 106 is in a shape of a frustum of a sphere, the height h of the first encapsulant layer 106 in the vertical direction is 4mm, and the characteristic lengths s1 and s3 of the top and bottom of the first encapsulant layer 106 in the horizontal direction are 12mm and 15mm, respectively. The ratio s1/s3 of the top horizontal characteristic length s1 to the bottom horizontal characteristic length s3 of the first encapsulating glue layer is 0.8. The height h of the second packaging adhesive layer 107 in the vertical direction is 4mm, the thickness of the second packaging adhesive layer 107 in the horizontal direction is constant, the thickness s2 in the horizontal direction is 1.5mm, the material of the second packaging adhesive layer 107 is silica gel doped with scattering particles, the scattering particles are barium sulfate particles, the doping concentration is 1wt%, and the average particle size of the scattering particles is 2 micrometers.
Example 7:
as shown in fig. 12, a phosphor-free multi-primary color LED package structure includes a ceramic substrate 121, four LED chips 123 disposed at intervals, a die attach layer 122, leads 124, and composite package glue layers 126 and 127; four LED chips 123 which are arranged at intervals are bonded on the ceramic substrate 121 through the solid crystal layer 122, the LED chips 123 are connected with the substrate circuit 125 through leads 124, composite packaging adhesive layers 126 and 127 are arranged on the LED chips 123, each composite packaging adhesive layer is composed of a first packaging adhesive layer 126 and a second packaging adhesive layer 127 doped with micro-nano scattering particles, and the second packaging adhesive layer 127 is positioned around the first packaging adhesive layer 126.
The surface of the ceramic substrate 121 is vapor-plated with a high-reflectivity silver layer 128, the first packaging adhesive layer 126 is made of silica gel, the first packaging adhesive layer 126 is in a spherical frustum shape, the height h of the first packaging adhesive layer 126 in the vertical direction is 4mm, and the characteristic lengths s1 and s3 of the top and bottom of the first packaging adhesive layer 126 in the horizontal direction are 12mm and 15mm respectively. The ratio s1/s3 of the top horizontal characteristic length s1 to the bottom horizontal characteristic length s3 of the first encapsulating glue layer is 0.8. The height h of the second encapsulating adhesive layer 127 in the vertical direction is 4mm, the thickness of the second encapsulating adhesive layer 127 in the horizontal direction is constant, the thickness s2 in the horizontal direction is 1.5mm, the material of the second encapsulating adhesive layer 127 is silica gel doped with scattering particles, the scattering particles are barium sulfate particles, the doping concentration is 1wt%, and the average particle size of the scattering particles is 2 μm.
The above description is a preferred embodiment of the present invention, but the present invention should not be limited to the disclosure of the embodiment and the drawings. Therefore, it is intended that all equivalents and modifications which do not depart from the spirit of the invention disclosed herein are deemed to be within the scope of the invention.
Claims (10)
1. The utility model provides a do not have many primary colors LED packaging structure of phosphor powder which characterized in that: the LED packaging structure comprises a packaging substrate, a plurality of LED chips arranged at intervals, a solid crystal layer, a lead and a composite packaging adhesive structure; the packaging substrate is provided with a plurality of LED chips which are bonded through a die bonding layer, each LED chip is connected with a substrate circuit through a lead, the LED chips are provided with a composite packaging adhesive structure, the composite packaging adhesive structure is composed of a first packaging adhesive layer of pure packaging adhesive and a second packaging adhesive layer doped with micro-nano scattering particles, and the second packaging adhesive layer is positioned around the first packaging adhesive layer.
2. The phosphor-free multi-primary LED package structure according to claim 1, wherein: the composite packaging adhesive structure realizes light extraction and light mixing of the multi-primary-color LED chip, wherein the first packaging adhesive layer is one of a hemispherical cap lens structure, a segment lens structure, a ball table lens structure, a circular table lens structure, a free-form surface lens structure, a trapezoid structure lens structure, a square lens structure, a cylindrical lens structure or a polygonal lens structure.
3. The phosphor-free multi-primary LED package structure according to claim 1, wherein: the height h of the first packaging adhesive layer in the vertical direction is 1 mm-50 mm, the characteristic length s of the first packaging adhesive layer in the horizontal direction is 2 mm-100 mm, and the ratio s1/s3 of the characteristic length s1 of the first packaging adhesive layer in the top horizontal direction to the characteristic length s3 of the first packaging adhesive layer in the bottom horizontal direction is 0-1.
4. The phosphor-free multi-primary LED package structure according to claim 1, wherein: the horizontal direction thickness s2 of second encapsulation glue film is 0mm ~50mm, horizontal direction thickness be invariable or gradual change in the vertical direction, the vertical direction height of second encapsulation glue film is the same with the vertical direction height of first encapsulation glue film, or is less than the vertical direction height of first encapsulation glue film.
5. The phosphor-free multi-primary LED package structure according to claim 1, wherein: the first packaging adhesive layer is made of one of silica gel, polyurethane or epoxy resin.
6. The phosphor-free multi-primary LED package structure according to claim 1, wherein: the second packaging adhesive layer is one of silica gel, polyurethane or epoxy resin doped with micro-nano scattering particles, the doping concentration of the micro-nano scattering particles is 0.001% -20%, the micro-nano scattering particles are one of silicone resin, polycarbonate or polymethyl methacrylate, silicon dioxide, titanium dioxide, aluminum nitride, zirconium dioxide, barium sulfate or calcium carbonate, and the particle size of the micro-nano scattering particles is 0.005-20 microns.
7. The phosphor-free multi-primary LED package structure according to claim 1, wherein: the packaging substrate is at least provided with two LED chips with different wavelengths, the LED chips are GaN binary material chips or AlGaNP quaternary material chips, and the LED chips are distributed in a circular or polygonal arrangement.
8. The phosphor-free multi-primary LED package structure according to claim 1, wherein: one of packaging glue, high-reflectivity reflecting paint or high-concentration scattering particle doped packaging glue is coated around the LED chip.
9. The phosphor-free multi-primary LED package structure according to claim 1, wherein: the packaging substrate is one of a copper substrate, an aluminum substrate, a silicon substrate, a ceramic substrate or a PCB, and the reflecting layer on the surface of the packaging substrate is a high-reflectivity reflecting paint layer or a high-reflectivity reflecting glue layer.
10. A packaging method of a phosphor-free multi-primary-color LED is characterized by comprising the following steps: the second packaging adhesive layer doped with the micro-nano scattering particles realizes high spatial color uniformity, and the specific implementation steps are as follows:
a: preparing a plurality of LED chips with more than two different wavelengths, and bonding the LED chips which are arranged at intervals through a solid crystal layer;
b: the upper electrode of the chip is connected with a circuit on the packaging substrate by a gold wire, an aluminum wire, a copper wire or a silver wire by adopting a wire bonding process to realize electric connection;
c: preparing packaging adhesive, manufacturing a first packaging adhesive layer on a packaging substrate by adopting a die top or spot coating process to realize light extraction of different LED chips, and heating the first packaging adhesive layer to realize curing of the first packaging adhesive layer;
d: and uniformly mixing the micron scattering particles or the nanometer scattering particles with the packaging adhesive, manufacturing a second packaging adhesive layer doped with the micron scattering particles around the first packaging adhesive layer by adopting a die-top or spot-coating process, realizing light mixing of different LED chips, heating the whole packaging module to realize curing of the second packaging adhesive layer, and obtaining a finished product.
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113192940A (en) * | 2021-04-30 | 2021-07-30 | 南京工业大学 | Tricolor Mini LED backlight source with uniform light mixing |
| CN114335305A (en) * | 2021-11-09 | 2022-04-12 | 南昌大学 | Fluorescent powder-free multi-primary color LED side light emitting module and side light emitting device |
| CN115020393A (en) * | 2022-06-22 | 2022-09-06 | 江西煜明智慧光电股份有限公司 | Fluorescent powder-free multi-primary-color LED packaging structure |
| CN117497667A (en) * | 2023-12-29 | 2024-02-02 | 江西省兆驰光电有限公司 | Luminous LED packaging method and luminous LED packaging structure |
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- 2020-09-29 CN CN202011050672.5A patent/CN112234134A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113192940A (en) * | 2021-04-30 | 2021-07-30 | 南京工业大学 | Tricolor Mini LED backlight source with uniform light mixing |
| CN114335305A (en) * | 2021-11-09 | 2022-04-12 | 南昌大学 | Fluorescent powder-free multi-primary color LED side light emitting module and side light emitting device |
| CN114335305B (en) * | 2021-11-09 | 2024-04-16 | 南昌大学 | Fluorescent powder-free multi-primary-color LED side light-emitting module and side light-emitting device |
| CN115020393A (en) * | 2022-06-22 | 2022-09-06 | 江西煜明智慧光电股份有限公司 | Fluorescent powder-free multi-primary-color LED packaging structure |
| CN117497667A (en) * | 2023-12-29 | 2024-02-02 | 江西省兆驰光电有限公司 | Luminous LED packaging method and luminous LED packaging structure |
| CN117497667B (en) * | 2023-12-29 | 2024-03-19 | 江西省兆驰光电有限公司 | Luminous LED packaging method and luminous LED packaging structure |
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