WO2014196498A1

WO2014196498A1 - Lighting device and optical member

Info

Publication number: WO2014196498A1
Application number: PCT/JP2014/064608
Authority: WO
Inventors: 修治大中
Original assignee: 三菱化学株式会社
Priority date: 2013-06-04
Filing date: 2014-06-02
Publication date: 2014-12-11
Also published as: JP2015195156A

Abstract

This lighting device comprises: a substrate; at least one semiconductor light emitting device which is affixed on the substrate; a light-transmitting light guide part which is arranged so that one end thereof is on the light emitting surface side of the semiconductor light emitting device, and which guides the light of the semiconductor light emitting device entered from the one end to the other end and emits therefrom; a light distribution part which is arranged so as to surround the periphery of the other end of the light guide part, and which diffuses and emits the light emitted from the light guide part in all directions; and a cover body which covers the semiconductor light emitting device, the light guide part and the light distribution part such that the semiconductor light emitting device, the light guide part and the light distribution part are separated from each other.

Description

Lighting apparatus and optical member

The present invention relates to a lighting fixture including a semiconductor light emitting device such as an LED (Light Emitting Diode), and an optical member used therefor.

Conventionally, halogen light bulbs with filaments and lighting equipment using the halogen light bulbs have been widely used as general lighting fixtures. However, in light of the recent needs for power saving, downsizing, and long life, light emitting elements such as LEDs. Development and manufacture of LED bulbs or LED lamps using LED as a light source, or lighting equipment using LEDs, and the spread of the LED bulbs are progressing. For example, Patent Literature 1 and Patent Literature 2 disclose LED lamps including LEDs that are a plurality of light emitting elements.

The LED lamp disclosed in Patent Document 1 includes a plurality of LEDs, a support on which the LED is mounted at a tip portion, a base for supporting the support, and a reflector that reflects light emitted from the LED. ing. The LED lamp disclosed in Patent Document 2 includes a plurality of LEDs, a prism portion in which the LED is disposed at a tip portion, an exterior portion that supports the prism portion, a reflective surface that reflects light emitted from the LED, A cover is provided that covers the rectangular column part in a spaced manner. In any of the LED lamps, a structure is adopted in which light is emitted from the central portion of the LED lamp by disposing the LED at a position shifted in the optical axis direction of the LED lamp from the reflection surface.

Further, in the LED bulb disclosed in Patent Document 3, the light guide is provided on the end surface on the other end side, and has a substantially conical shape with a diameter substantially the same as the center of the shaft portion and reduced in diameter toward the one end side. It has a 1st curved surface provided so that a recessed part and the end surface and side surface of the other end side may become substantially continuous. The light source guide disclosed in Patent Document 4 has a light guide part, a refracting part, and a top part, and a fine structure is formed in the light guiding part and the refracting part, and light from the light emitting diode unit is guided to the light guide part. And it is the structure radiate | emitted from the top part.

The light emitting device disclosed in Patent Document 5 includes a semiconductor laser diode that emits laser light, and a light emitting body that is provided apart from the semiconductor laser diode and absorbs the laser light and emits visible light. The body has an optical path for allowing laser light to enter the center of the light emitter. The light-emitting diode illuminating device disclosed in Patent Document 6 guides light from a surface-emitting first light source emitted from a light-emitting diode to a spherical phosphor by a light guide means such as an optical fiber, and the light-emitting diode emits light. A structure is adopted in which a point light source is formed by light from a second light source that is excited by light and generates light having a long wavelength.

JP 2004-111355 A JP 2011-54577 A JP 2012-155895 A Utility Model Registration No. 3172957 JP 2011-187291 A JP 2012-4090 A

However, in an LED lamp having a structure as disclosed in Patent Document 1 and Patent Document 2, a support such as a column or a prism is provided at a position where the LED is separated from a housing or a heat radiator excellent in heat dissipation. Therefore, the heat generated with the light emission of the LED cannot be efficiently radiated. Moreover, in the LED lamp having the structure as disclosed in Patent Document 1 and Patent Document 2, it is necessary to form the wiring for the LED also on the support, and the wiring becomes complicated, and the cost of forming the wiring is increased. To increase.

Moreover, in the structure of the light guide in the LED bulb disclosed in Patent Document 3, the amount of light in the upper oblique direction of the expanded diameter portion is smaller than that in the upper and side directions, and uniform light may be emitted in all directions. could not. In addition, the light source guide disclosed in Patent Document 4 has a structure that emits light in the lateral or upward oblique direction from the light guide and emits light in the upward direction from the top, and therefore also emits uniform light in all directions. I couldn't.

Moreover, in the method of installing fluorescent substance (light-emitting body) in the light emission center of an illuminating device (light bulb) in the position spaced apart from the semiconductor laser diode or the light-emitting diode as disclosed in

Patent Documents

5 and 6, There were the following problems. That is, a part of the light of the semiconductor laser diode or the light emitting diode is emitted from the phosphor (light emitter) as non-converted light that is not wavelength-converted in the phosphor (light emitter). Color mixing of such non-converted light and wavelength-converted light that has been wavelength-converted by a phosphor (light-emitting body) is difficult. For this reason, it has been very difficult to make the illumination light of the illuminating device (bulb) beautiful and uniform white illumination as a whole.

Further, in the technologies disclosed in

Patent Documents

5 and 6, the phosphor or the light emitter generates heat by the incidence of light from the semiconductor laser diode or the light emitting diode. However, both the phosphor and the light emitter are in contact with the light guide or the light guide means and float in the air, and are separated from the heat radiating part such as a heat sink. As described above, since it is difficult to dissipate heat from the phosphor or the light emitter, the illumination light becomes unstable due to a temperature rise due to continuous use (light emission) of the lighting device (light bulb) (lightness (brightness) decreases). Or the chromaticity may change).

This invention is made | formed in view of such a subject, The place made into the objective is a simple structure, is equipped with the outstanding heat dissipation, and is excellent in light distribution, and the said lighting fixture. It is to provide an optical member to be used.

To achieve the above object, according to a first aspect of the present invention, there is provided a substrate, at least one semiconductor light emitting device fixed on the substrate, and one end disposed on a light emitting surface side of the semiconductor light emitting device. A light guide portion having translucency to guide and emit the light of the semiconductor light emitting device incident from the one end to the other end, and disposed so as to surround the periphery of the other end of the light guide portion, A lighting apparatus comprising: a light distribution unit that diffuses light emitted from the light guide unit and emits the light in all directions; and a covering that covers the semiconductor light emitting device, the light guide unit, and the light distribution unit in a spaced manner. It is.

By providing the light guide part and the light distribution part having the structure as described above, the light emitted from the substrate is diffused from the light distribution part and emitted in all directions through the light guide part and the light distribution part. Can do. In addition, since the semiconductor light emitting device is fixed on the substrate, not on the central portion of the light distribution portion, which is a position where light is emitted in all directions, wiring can be easily formed on the substrate, and the cost of the lighting fixture can be reduced. Reduction can be achieved. Furthermore, since the semiconductor light emitting device is fixed on the substrate, heat generated from the semiconductor light emitting device can be radiated well through the substrate.

A second aspect of the present invention is that, in the first aspect described above, the light distribution section is connected to the other end of the light guide section. By connecting the light distribution units in this way, the light emitted from the substrate can be diffused from the light distribution unit through the light guide unit and the light distribution unit, and can be emitted well in all directions. .

A third aspect of the present invention is that, in the first aspect or the second aspect described above, the light distribution section is made of a resin containing a light diffusing element. With such a structure of the light distribution part, light can be diffused satisfactorily from the light distribution part in all directions.

A fourth aspect of the present invention is that, in the first aspect or the second aspect described above, the light distribution section has a two-layer structure including an inner layer and an outer layer having a refractive index larger than that of the inner layer. With such a structure of the light distribution part, when the light incident on the light distribution part is radiated to the outside, it can be diffused while being refracted well. In this aspect, by making the central part of the light distribution part a fluid layer having higher thermal conductivity than air, the heat dissipation of the light distribution part can be improved. For example, helium can be suitably used as the fluid layer having high thermal conductivity.

A fifth aspect of the present invention is that, in the fourth aspect described above, the inner layer of the light distribution section is an air layer. With such a structure of the light distribution unit, the cost of the light distribution unit can be reduced.

A sixth aspect of the present invention is that, in the above-described fourth aspect or fifth aspect, the surface of the other end of the light guide is subjected to a rough surface treatment or a coating treatment. With such a configuration of the light guide unit, the light extraction efficiency in the light guide unit can be improved. Further, light can be diffused on the surface of the other end of the light guide unit, and unevenness is less likely to occur on the irradiation surface of the light emitted from the light distribution unit.

A seventh aspect of the present invention is that in any one of the first to sixth aspects described above, the surface of the light distribution section is subjected to a rough surface treatment or a coating treatment. With such a configuration of the light distribution unit, the light emitted from the light distribution unit is diffused well, and unevenness is less likely to occur on the light irradiation surface. Moreover, the light extraction efficiency in the light distribution section is also improved.

According to an eighth aspect of the present invention, in any one of the first to seventh aspects described above, the light guide portion extends so that the light distribution portion is located at a central portion of the inner region of the covering body. Is. By extending the light guide portion in this way, light can be emitted from all directions in the luminaire, and a luminaire having excellent optical characteristics can be provided.

9th aspect of this invention is that the shape of the said light distribution part is a spherical form in any one of the 1st thru | or 8th aspect mentioned above. With such a shape of the light distribution unit, light incident from the light guide unit is radiated in all directions from the center of the luminaire, and the luminaire can be seen as a general halogen light bulb.

A tenth aspect of the present invention is that, in any one of the first to ninth aspects described above, the light guide section and the light distribution section are integrally formed by two-color molding. As a result, a process for accurately positioning and fixing the light guide unit and the light distribution unit becomes unnecessary, and the light guide unit and the light distribution unit can be formed easily and at low cost.

An eleventh aspect of the present invention is that in any one of the first to tenth aspects described above, a heat sink is disposed on the surface of the substrate opposite to the fixed surface of the semiconductor light emitting device. . Thereby, the heat generated from the semiconductor light emitting device can be radiated better.

According to a twelfth aspect of the present invention, in any one of the first to eleventh aspects described above, the light emitted from the semiconductor light emitting device is emitted in all directions via the light guide unit and the light distribution unit. The light to be used is the same chromaticity. Thereby, the light radiate | emitted from a semiconductor light-emitting device can be used as the light radiate | emitted from a lighting fixture, and the light of a semiconductor light-emitting device can be utilized efficiently.

A thirteenth aspect of the present invention is that in any one of the first to twelfth aspects described above, the light emitted from the semiconductor light emitting device is white light. Thereby, the illuminating device which concerns on this aspect can be used as a general halogen light bulb which radiates | emits white light.

According to a fourteenth aspect of the present invention, in any one of the first to thirteenth aspects described above, a plurality of the semiconductor light emitting devices are fixed to the substrate, and at least one set selected from the plurality of semiconductor light emitting devices is It emits light of different color temperatures. With such a configuration, the color temperature of the synthesized light emitted from the lighting fixture can be changed as appropriate, and optimal light can be provided according to the demand of the user of the lighting fixture. For example, the behavior of the lighting fixture can be approximated to that of a general halogen bulb.

A fifteenth aspect of the present invention is an optical member attached to a semiconductor light emitting device, wherein one end is disposed on the light emitting surface side of the semiconductor light emitting device, and the light of the semiconductor light emitting device incident from the one end is connected to the other end. A light guide part having translucency to guide and radiate the light, and to surround the other end of the light guide part, diffusing light emitted from the light guide part in all directions And an optical member having a light distribution part that radiates to the light source.

A sixteenth aspect of the present invention is that, in the fifteenth aspect described above, the light distribution section is connected to the other end of the light guide section. By connecting the light distribution units in this way, the light emitted from the substrate can be diffused from the light distribution unit through the light guide unit and the light distribution unit, and can be emitted well in all directions. .

A seventeenth aspect of the present invention is that, in the fifteenth aspect or the sixteenth aspect described above, the light distribution section is made of a resin containing a light diffusing element. With such a structure of the light distribution part, light can be diffused satisfactorily from the light distribution part in all directions.

An eighteenth aspect of the present invention is that, in the fifteenth aspect described above, the surface of the other end of the light guide is subjected to a rough surface treatment or a coating treatment. With such a configuration of the light guide unit, the light extraction efficiency in the light guide unit can be improved. Further, light can be diffused on the surface of the other end of the light guide unit, and unevenness is less likely to occur on the irradiation surface of the light emitted from the light distribution unit.

A nineteenth aspect of the present invention is that in any one of the fifteenth to eighteenth aspects described above, the surface of the light distribution section is subjected to a rough surface treatment or a coating treatment. With such a configuration of the light distribution unit, the light emitted from the light distribution unit is diffused well, and unevenness is less likely to occur on the light irradiation surface. Moreover, the light extraction efficiency in the light distribution section is also improved.

Alternatively, the present invention may include the following aspects.
(1) a substrate;
At least one semiconductor light emitting device fixed on the substrate;
A light distribution unit that diffuses and emits light from the incident semiconductor light emitting device in all directions;
Provided between the semiconductor light emitting device and the light distribution unit, the light traveling from the semiconductor light emitting device that travels in a direction not directly incident on the light distribution unit is incident on the light distribution unit. A light guide portion to be changed,
A covering that covers the semiconductor light emitting device, the light distribution unit, and the light guide unit separately;
The lighting fixture characterized by including.

(2) a substrate;
At least one semiconductor light emitting device fixed on the substrate;
One end is disposed on the light emitting surface side of the semiconductor light emitting device, and a light guide unit having translucency for guiding and emitting the light of the semiconductor light emitting device incident from the one end to the other end;
A light distribution unit that is disposed at the other end of the light guide unit and diffuses light emitted from the light guide unit and emits the light in all directions;
A covering that covers the semiconductor light emitting device, the light distribution unit, and the light guide unit separately;
The lighting fixture characterized by including.

In each aspect of the present invention, the semiconductor light emitting device may be configured to emit light that has been wavelength-converted by the wavelength conversion member. With this configuration, the wavelength-converted light emitted from the semiconductor light emitting device is guided to the light distribution unit by the light guide unit, diffused by the light distribution unit, and radiated in all directions. As a result, it is possible to easily achieve illumination light that is clean and uniform as a whole. The illumination light includes white light. Alternatively, the semiconductor light emitting device may be configured to emit diffused light (surface emitting light).

From the above, according to the present invention, it is possible to provide a lighting apparatus having a simple configuration, excellent heat dissipation, and wide light distribution, and an optical member used in the lighting apparatus. According to the present invention, it is possible to provide a lighting fixture having a function similar to a general light bulb using a semiconductor light emitting device.

It is a partially notched front view which shows the whole lighting fixture which concerns on an Example in a partial longitudinal cross section. It is a perspective view of the light emitting module which comprises the lighting fixture which concerns on an Example. It is a top view of the light emitting module which comprises the lighting fixture which concerns on an Example. FIG. 4 is a cross-sectional view of the light emitting module taken along line IV-IV in FIG. 3. It is a principal part enlarged view of sectional drawing shown by FIG. It is a perspective view of the optical member which comprises the lighting fixture which concerns on an Example. It is a top view of the optical member which comprises the lighting fixture which concerns on an Example. It is sectional drawing of the optical member along line VIII-VIII of FIG. It is a partially notched front view which shows the whole lighting fixture which concerns on the modification 1 in a part longitudinal cross section. It is sectional drawing of the LED package apparatus which comprises the lighting fixture which concerns on the modification 1. FIG. It is an electric circuit diagram which shows the outline of the electric circuit structure of the lighting fixture which concerns on the modification 1. FIG. 12 is a time chart showing an example of an operating state of each transistor and a current value of a driving current of each LED in the circuit configuration of FIG. 11. 12 is a time chart showing an example of an operating state of each transistor and a current value of a driving current of each LED in the circuit configuration of FIG. 11. 10 is a perspective view of an optical member according to Modification 2. FIG. 10 is a top view of an optical member according to Modification 2. FIG. FIG. 16 is a cross-sectional view of the optical member taken along line XVI-XVI in FIG. 15. It is a schematic diagram which shows the modification of a light guide part. It is a schematic diagram which shows the modification of a light guide part. It is a schematic diagram which shows the modification of a light guide part. It is a schematic diagram which shows the modification of a light guide part.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings based on examples and modifications. In addition, this invention is not limited to the content demonstrated below, In the range which does not change the summary, it can change arbitrarily and can implement. In addition, the drawings used for explaining the embodiments and the respective modifications schematically show the lighting apparatus according to the present invention and the optical members that are structural members thereof, and are partially emphasized to deepen understanding. Enlargement, reduction, omission, and the like are performed, and the scale, shape, and the like of the lighting fixture and the optical member that is a structural member thereof may not be accurately represented. Furthermore, the various numerical values and quantities used in the embodiments and the modifications are only examples, and can be variously changed as necessary.

<< Example >>
Hereinafter, with reference to FIGS. 1 to 8, a configuration of a lighting fixture and its constituent members according to this embodiment of the present invention will be described. FIG. 1 is a partially cutaway front view showing the whole lighting apparatus according to the present embodiment in a partially longitudinal section. FIG. 2 is a perspective view of a light emitting module constituting the lighting fixture according to the present embodiment. FIG. 3 is a top view of the light emitting module constituting the lighting fixture according to the present embodiment. 4 is a cross-sectional view of the light emitting module taken along line IV-IV in FIG. 3, and FIG. 5 is an enlarged view of a main part of the cross-sectional view shown in FIG. 6 is a perspective view of an optical member constituting the lighting fixture according to the present embodiment, FIG. 7 is a top view of the optical member constituting the lighting fixture according to the present embodiment, and FIG. 8 is a line VIII in FIG. It is sectional drawing of the optical member in alignment with -VIII.

<Configuration of lighting fixture>
As shown in FIG. 1, the luminaire 1 includes a housing 2, a light source unit 3 provided in the housing 2, a light source cover 4 that functions as a cover that separates and covers the light source unit 3, and the interior of the housing 2. The heat sink 5 is provided on the opposite side of the light source 3 and the base 6 is disposed on the opposite side of the light source 3. In the luminaire 1 according to the present embodiment, electric power supplied from the outside is supplied to the light source unit 3 via the base unit 6, and light emitted by driving the light source unit 3 passes through the light source cover 4. Is emitted to the outside. That is, the lighting fixture 1 according to the present embodiment has the same outer shape as a general light bulb.

(Casing)
The housing 2 of the luminaire 1 is formed in a substantially truncated cone shape, and a cavity 2a for incorporating various components is formed therein. Further, an opening 2b for fitting the heat sink 5 is formed at one end of the housing 2, and the heat sink 5 is disposed from the opening 2b toward the inside of the housing 2 (that is, the cavity 2a). Yes. Furthermore, the housing 2 is made of a metal material having excellent heat dissipation properties such as aluminum in order to efficiently dissipate heat generated with light emission from the light source unit 3 to the outside.

(Light source cover)
As shown in FIG. 1, both ends of the light source cover 4 are bent, and the bent portions enter the cavity 2 a of the housing 2. The both end portions are fixed to the housing 2 via an adhesive 7. The light source cover 4 is formed using a material having translucency, for example, a material such as glass, polycarbonate resin, or acrylic resin, in order to radiate light emitted from the light source unit 3 to the outside. In this embodiment, the light source cover 4 has a substantially spherical shape, and a cavity 4a for accommodating the light source unit 3 is formed in the inside thereof. Furthermore, in the light source cover 4, the distance (that is, radius) from the cover surface to the center of the cavity 4a is about 30 mm. In addition, the shape, dimension, etc. of the light source cover 4 can be changed according to the environment where the lighting fixture 1 is used, the application, and the like. For example, the shape of the light source cover 4 may be hemispherical.

(Light source)
As shown in FIG. 1, the light source unit 3 is disposed on the side of the housing 2 where the opening 2b is formed. That is, the light source unit 3 is disposed so as to be located above the opening 2 b of the housing 2. The light source unit 3 includes a light emitting module 11 that is a semiconductor light emitting device, a fixed substrate 12 that supports the light emitting module 11, an optical member 13 that emits light emitted from the light emitting module 11 in a desired direction, and an optical member 13. The fixing member 14 for fixing the to the fixed substrate 12 and the housing 2 is provided.

Moreover, in the light source part 3, the light radiated | emitted from the light emitting module 11 is diffused by the optical member 13, and is radiated | emitted in all directions with the chromaticity as it is (substantially without wavelength conversion). . That is, in the lighting fixture 1 which concerns on a present Example, the white light radiated | emitted from the light emitting module 11 is not changed substantially, but the said light is radiated | emitted in all directions with the said white light. Thereby, there is no light emission unevenness and white light can be radiated uniformly in all directions. The substantially unchanged chromaticity is not limited to the fact that the light emitted from the light emitting module 11 and the light emitted from the optical member 13 and the lighting fixture 1 are completely the same chromaticity, This means that it includes a change (a slight change in chromaticity and wavelength) that is not noticed by the user who visually recognizes the light of the lighting fixture 1.

[Light emitting module]
The light emitting module 11 used for the lighting fixture 1 according to the present embodiment includes a module main body 11a and a wavelength conversion member 11b stored in the module main body 11a. The module main body 11a is provided to protect the wavelength conversion member 11b from an impact applied from the outside. The material of the module main body 11a is a material such as a relatively hard metal (for example, iron, aluminum, copper, ceramic). Is used. The module main body 11a is provided with a screw hole 16 for screwing a screw 15 used for fixing the light emitting module 11, and the module main body 11a is fixed to the fixed substrate 12 and the heat sink 5 via the screw 15. Will be. Further, the module main body 11a is provided with a circular opening for emitting light, and for example, light that has been whitened inside can be taken out from the opening. On the other hand, in another case, a glass plate or the like may be installed in the opening, and a phosphor may be applied to the inside of the module on the glass surface, and light may be extracted by whitening at this portion. In addition, the said opening is not restricted to circular, Polygons, such as a rectangle, or other shapes may be sufficient. That is, the shape of the opening can be appropriately changed according to the required shape of the light emitting surface of the light emitting module 11.

As can be seen from FIGS. 2 to 4, the module main body 11 a has a rectangular outer shape and functions as a wiring board, and is located on the chip mounting surface 21 a of the flat plate portion 21, and the outer shape is cylindrical. And a side wall portion 22. As can be seen from FIGS. 2 and 3, twelve LED chips 23 as semiconductor light emitting elements are regularly arranged on the chip mounting surface 21 a of the flat plate portion 21 and inside the side wall portion 22. Yes. Specifically, four LED chips 23 are arranged at equal intervals in the central portion of the flat plate portion 21, and eight LED chips 23 are arranged so as to surround four sides of the four LED chips 23. Each of the four LED chips 23 arranged in the central portion is arranged at a position separated by an equal distance from the center of the flat plate portion 21, and similarly, eight LED chips arranged so as to surround the four sides. Each of 23 is arrange | positioned in the position spaced apart from the center of the flat plate part 21 by equal distance. That is, each of the four LED chips 23 and the eight LED chips are concentrically arranged to form a substantially circular LED chip mounting region (not shown) as the entire twelve LED chips 23. Yes. Although not shown in FIG. 5, a wiring pattern for supplying power to each of these LED chips 23 is formed on the flat plate portion 21.

In this embodiment, the LED chip 23 is an LED chip that emits blue light having a peak wavelength of 450 nm. Specifically, as such an LED chip, for example, there is a GaN-based LED chip in which an InGaN semiconductor is used for a light emitting layer. Note that the type and emission wavelength characteristics of the LED chip 23 are not limited thereto, and various semiconductor light emitting elements such as LED chips can be used without departing from the gist of the present invention. In this embodiment, the peak wavelength of light emitted from the LED chip 23 is preferably in the wavelength range of 360 nm to 480 nm, and more preferably in the wavelength range of 440 nm to 470 nm.

In addition, the material of the module main body 11a is not limited to the above-described material, and is selected from, for example, a resin, glass epoxy, a composite resin containing a filler in the resin, and the like as a material having excellent electrical insulation. Materials may be used. Alternatively, in order to improve the light reflectivity on the chip mounting surface 21a of the flat plate portion 21 and improve the light emission efficiency of the wavelength conversion member 11b, silicone containing white pigment such as alumina powder, silica powder, magnesium oxide, titanium oxide or the like is used. It is preferable to use a resin. In order to obtain better heat dissipation, the module body 11a may be made of a metal such as aluminum, an interlayer insulating film such as a resin is formed on the metal such as aluminum, and the wiring pattern of the flat plate portion 21 is formed. It may be electrically insulated from the metal body.

As shown in FIG. 5, a p-electrode 26 and an n-electrode 27 are provided on the surface of the LED chip 23 facing the flat plate portion 21 side. In the LED chip 23, the p electrode 26 is bonded to the wiring pattern 28 formed on the chip mounting surface 21a of the flat plate portion 21, and the n electrode 27 is bonded to the wiring pattern 29 also formed on the chip mounting surface 21a. Has been. The p electrode 26 and the n electrode 27 are connected to the wiring pattern 28 and the wiring pattern 29 through a metal bump (not shown) or by soldering. Other LED chips 23 (not shown) have the same p electrodes 26 and n electrodes 27 as the

wiring patterns

28 and 29 formed on the chip mounting surface 21a of the flat plate portion 21 corresponding to the respective LED chips 23. Are joined together.

Note that the method of mounting the LED chip 23 on the flat plate portion 21 is not limited to this, and an appropriate method can be selected according to the type and structure of the LED chip 23. For example, after the LED chip 23 is bonded and fixed to a predetermined position of the flat plate portion 21, two electrodes of each LED chip 23 may be connected to a corresponding wiring pattern by wire bonding, or one electrode may be connected as described above. While joining to a corresponding wiring pattern, you may make it connect the other electrode to a corresponding wiring pattern by wire bonding.

As can be seen from FIGS. 2 to 4, a wavelength conversion member 11 b that converts the wavelength of the blue light emitted from the LED chip 23 is provided in the inner region surrounded by the side wall portion 22. In the light emitting module 11 according to the present embodiment, the blue light emitted from the LED chip 23 and the light emitted by wavelength conversion of the blue light by the wavelength conversion member 11b are combined, and the combined light is combined with the module main body. The light is emitted from the opening 11a. Alternatively, the wavelength conversion member 11b can be configured such that a glass plate or the like is installed in the opening of the module storage case and applied to the inside of the module on the glass surface, and whitening is performed at this portion to extract light. .

Further, as shown in FIG. 5, the wavelength conversion member 11b absorbs at least a part of the blue light incident from the LED chip 23 and emits emission light having a wavelength different from that of the blue light, and the fluorescent light. It is comprised from the base material 25 which hold | maintains the body 24. FIG. In the wavelength conversion member 11b according to the present embodiment, since the LED chip 23 that emits blue light is used as a semiconductor light emitting element, it is possible to synthesize white light by converting a part of the blue light into yellow light. It is. Accordingly, the phosphor 24 in this embodiment is a yellow phosphor that absorbs blue light and is excited to emit light having a wavelength different from that of the blue light when returning to the ground state.

The emission peak wavelength of a specific yellow phosphor is usually 530 nm or more, preferably 540 nm or more, more preferably 550 nm or more, and usually 620 nm or less, preferably 600 nm or less, more preferably 580 nm or less. Is preferred. Among them, as the yellow phosphor, for example, Y ₃ Al ₅ O ₁₂ : Ce [YAG phosphor], (Y, Gd) ₃ Al ₅ O ₁₂ : Ce, (Sr, Ca, Ba, Mg) ₂ SiO ₄ : Eu, (Ca, Sr) Si ₂ N ₂ O ₂ : Eu, α-sialon, La ₃ Si ₆ N ₁₁ : Ce (however, a part thereof may be substituted with Ca or O) is preferable.

As the base material 25, a material having translucency such as resin or glass can be used. In this embodiment, resin is used. In the present embodiment, the wavelength conversion member 11b is formed by kneading the phosphor 24 into a base material 25 that is a resin.

Specific resins include polycarbonate resin, polyester resin (for example, polyethylene terephthalate resin, polybutylene terephthalate resin), acrylic resin (for example, polymethyl methacrylate resin), polyurethane resin, epoxy resin, and silicone resin. It is preferable to use it. The resin preferably does not absorb light emitted from the LED chip (for example, ultraviolet light, near ultraviolet light, or blue light) or visible light emitted from the wavelength conversion member. Furthermore, it is preferable to have sufficient transparency and durability against blue light emitted from the LED chip 23.

These resins may be used alone or in combination of two or more. Moreover, the copolymer of these resin may be sufficient and it may use it, laminating | stacking 2 or more types.

As the resin, polycarbonate resin is most preferably used because it is excellent in transparency, heat resistance, mechanical properties, and flame retardancy.

Further, the light emitted from the light emitting module 11 is not limited to white light, and may emit colored light such as blue light, red light, and yellow light.

[Fixed substrate]
As shown in FIG. 1, the fixed substrate 12 is disposed on the surface of the housing 2 where the opening 2b is formed. The fixed substrate 12 has a disk shape and is fixed to the housing 2 by a bonding member such as an adhesive or a screw. In the fixed substrate 12, the light emitting module 11 is fixed (mounted) on the first surface 12a, and the heat sink 5 is fixed (mounted) on the second surface 12b located on the opposite side of the first surface 12a. The The fixed substrate 12 is formed with screw holes so as to penetrate the fixed substrate 12 in the thickness direction, and the light emitting module 11 is fixed to the fixed substrate 12 by screwing screws 15 into the screw holes. ing. Further, although not shown in FIG. 1, a resistor, a capacitor, and the like are mounted on the first surface 12 a of the fixed substrate 12, and a circuit pattern for controlling the driving of the light emitting module 11 is formed. Yes.

The material of the fixed substrate 12 can be an alumina-based ceramic having excellent electrical insulation and good heat dissipation. The fixed substrate 12 may be made of a material selected from a resin, glass epoxy, a composite resin containing a filler in the resin, or other general substrate materials, as in the module body 11a described above. Good.

(Optical member)
As can be seen from FIG. 1 and FIGS. 6 to 8, the optical member 13 constituting the light source unit 3 includes a light guide unit 31 disposed so as to cover the light emitting surface of the light emitting module 11, and the light guide unit 31. The light distribution section 32 is fixed (connected) to the end portion of the light guide section 31 so as to surround the periphery of the end section. That is, the optical member 13 guides the light emitted from the light emitting module 11 from one end of the light guide unit 31 toward the other end, and all the light emitted from the light guide unit 31 through the light distribution unit 32. Radiates almost evenly in the direction. In the present embodiment, the light guide unit 31 and the light distribution unit 32 are fixed by an adhesive from resin or the like. Here, the omnidirectional means that the light distribution angle is not limited to 360 °, but substantially means the omnidirectional (wider light distribution angle). That is, the omnidirectional in the present invention means that the light distribution angle is usually 180 ° or more, preferably 240 ° or more, more preferably 300 ° or more.

The light guide unit 31 is made of a transparent material having translucency such as glass, polycarbonate, or resin (for example, poly (methyl methacrylate) (PMMA)). Further, as can be seen from FIGS. 1, 6 and 8, the shape of the light guide 31 is substantially a truncated cone. More specifically, as shown in FIG. 8, a concave portion 31b is formed on the first surface 31a side on which the light emitting module 11 is disposed, and the second surface located on the opposite side to the first surface 31a. The surface 31c is generally flat, and the side surface 31d is inclined so that the diameter of the light guide portion 31 decreases from the first surface 31a side to the second surface 31c side. In the present embodiment, the diameter of the light guide 31 on the first surface 31a side is about 16 mm, and the diameter on the second surface 31c side is about 12 mm.

Here, from the viewpoint of guiding more light emitted from the light emitting module 11 to the light guide unit 31, the light guide unit 31 preferably covers the entire light emitting module 11. The diameter on the surface 31 a side of the light emitting module 11 is appropriately changed according to the dimensions of the light emitting module 11. The shape of the light guide unit 31 is not limited to a truncated cone, and may be another three-dimensional shape such as a cylinder or a prism.

The light guide 31 extends from the light emitting module 11 toward the center of the cavity 4a in order to arrange the light distribution unit 32 in the center of the cavity 4a, which is the inner region of the light source cover 4. In the present embodiment, the height of the light guide portion 31 is about 20 mm.

The second surface 31c of the light guide unit 31 is subjected to a rough surface treatment to form minute irregularities. The reason why the second surface 31c is a rough surface is to improve the light extraction efficiency and diffuse the light on the second surface 31c. In addition, you may perform the coating process which can improve the extraction efficiency of light, without making the 2nd surface 31c rough.

The side surface 31d of the light guide 31 functions so as to reflect the light incident from the first surface 31a and not leak from the side 31d of the light guide 31. Here, when the height of the light guide portion 31 is increased, there is a case where light cannot be favorably reflected on the side surface 31d, and light may leak from the side surface 31d. For this reason, the height of the light guide unit 31 is such that light incident from the first surface 31a leaks while the light distribution unit 32 is disposed at the center of the cavity 4a, which is the inner region of the light source cover 4. There is no need to adjust within the range. That is, the height of the light guide unit 31 is appropriately adjusted according to the dimensions of the lighting fixture 1, the light source cover 4, and the light distribution unit 32.

The light distribution part 32 is made of a transparent material having translucency such as glass or resin (for example, polycarbonate, poly (methyl methacrylate): PMMA), like the light guide part 31. . In addition, the light distribution part 32 may be comprised from the transparent material same as the light guide part 31, and may be comprised from a different transparent material.

As can be seen from FIG. 1 and FIGS. 6 to 8, the light distribution portion 32 has a substantially spherical shape, and a substantially spherical cavity 32 a is formed inside the light distribution portion 32. In other words, the light distribution unit 32 has a two-layer structure including an outer layer made of the transparent material and an inner layer located inside the outer layer (that is, an air layer in the cavity 32a). In this embodiment, the transparent material has a higher refractive index than air. Here, in view of the shape of the light distribution part 32, among the materials described above, glass is a material that can easily form a sphere. With such a structure of the light distribution unit 32, when the light incident on the light distribution unit 32 is radiated to the outside, it can be diffused while being refracted well. Moreover, the cost of the light distribution part 32 can be reduced by making the center part of the light distribution part 32 into a cavity (that is, an air layer).

In addition, you may fill the cavity 32a of the light distribution part 32 with the other member whose refractive index is smaller than a transparent material. For example, the cavity 32a can be filled with helium, and the central portion of the light distribution part can be a fluid layer having higher thermal conductivity than air. Thereby, the heat dissipation of the light distribution part 32 can be improved. Moreover, the shape of the light distribution part 32 is not limited to a substantially spherical shape, and may be another three-dimensional shape such as a polygonal body.

In the light distribution part 32, the distance (namely, radius) from the outer surface 32b of the light distribution part 32 to the center of the cavity 32a is about 7.5 mm. In addition, the said dimension is suitably changed according to the dimension of the lighting fixture 1, the light source cover 4, the light emitting module 11, etc., and the light radiate | emitted from the light distribution part 32 radiate | emits favorable (substantially equal) with respect to all directions, and is distributed. It is preferable not to cause unevenness on the irradiation surface irradiated with the light emitted from the light unit 32.

The outer surface 32b of the light distribution part 32 is roughened, and minute irregularities are formed. The reason why the outer surface 32b is rough is to improve the light extraction efficiency and not to cause unevenness on the irradiation surface irradiated with the light emitted from the light distribution section 32. In addition, you may perform the coating process which can improve the extraction efficiency of light, without making the outer surface 32b rough. Further, the rough surface treatment and the coating treatment are not limited to being performed only on the outer surface 32b, but are performed only on the inner surface of the light distribution unit 32, or the outer surface 32b and the inner surface of the light distribution unit 32 (that is, the distribution surface). You may implement on the whole surface of the optical part 32).

As the positional relationship between the light guide unit 31 and the light distribution unit 32, it is preferable that the light guide unit 31 bites into the cavity 32a of the light distribution unit 32 as shallowly as possible. That is, it is preferable that the second surface 31 c of the light guide unit 31 is arranged as far as possible from the center of the cavity 32 a of the light distribution unit 32. Therefore, it is preferable that the light distribution unit 32 is fixed to a predetermined position of the side surface 31d closer to the second surface 31c of the light guide unit 31 or the second surface 31c. Thereby, the light distribution of the light radiated from the light guide unit 31 to the light distribution unit 32 can be further expanded.

Due to the structure of the light distribution section 32 as described above, the light guided from the light guide section 31 into the cavity 32a of the light distribution section 32 is radiated well in all directions of the light distribution section 32. . That is, the light distribution part 32 can be visually recognized as a light source, and can be visually recognized as light is emitted from the center of the cavity 4a of the light source cover 4 to the outside like a general halogen light bulb.

In this embodiment, the light guide unit 31 and the light distribution unit 32 are separately formed and the optical member 13 is formed by fixing the two members with an adhesive. The light part 32 may be integrally formed by two-color molding. Thereby, a process for accurately positioning and fixing the light guide unit 31 and the light distribution unit 32 becomes unnecessary, and the light guide unit 31 and the light distribution unit 32 can be formed easily and at low cost. In addition, the optical member 13 is fixed to the housing 2 and the fixed substrate 12 by the fixing member 14, but an adhesive is further applied to the first surface 31 a side of the light guide unit 31 to fix the optical member 13. The substrate 12 may be firmly fixed.

[Fixing member]
The fixing member 14 is provided to fix the optical member 13 to the fixed substrate 12 and the housing 2. The fixing member 14 covers the fixed substrate 12, the first surface 31 a side of the light guide unit 31, and the light emitting surface side of the light emitting module, and supports the side surface 31 d of the light guide unit 31. As shown in FIG. 1, the fixing member 14 has an opening for fitting a disk-shaped fixing substrate 12 on one end side, and has a through-hole for penetrating the optical member 13 on the other end side. ing. Further, the portion of the fixing member 14 that comes into contact with the fixed substrate 12 and the housing 2 is joined to the fixed substrate 12 and the housing 2 via a joining member such as an adhesive or a screw. For example, a flange made of a material such as plastic, resin, or metal may be used as the fixing member 14. By using such a fixing member 14, the light guide part 31 and the light distribution part 32 can be fixed firmly, and the lighting fixture 1 provided with the outstanding reliability can be provided.

The surface 14a of the fixing member 14 is roughened. Thereby, circuit components such as resistors and capacitors mounted on the first surface 12a of the fixed substrate 12 cannot be visually recognized from the outside, and the aesthetic appearance of the lighting fixture 1 is not impaired.

(heatsink)
As shown in FIG. 1, the heat sink 5 is disposed in the cavity 2 a of the housing 2 and is in contact with the light source unit 3. Specifically, the heat sink 5 is disposed on the opposite side of the fixed surface (mounting surface) of the light emitting module 11 of the fixed substrate 12 constituting the light source unit 3. The heat sink 5 is fixed to the fixed substrate 12 with screws 15 and further fixed to the opening 2b of the housing 2 with an adhesive or the like.

Note that a fan may be provided in place of the heat sink 5. In this case, the air discharge port may be provided on the side surface of the housing 2 or the like so that warm air in the cavity 2a of the housing 2 can be exhausted and air having a relatively low temperature can be sucked.

(Base part)
The base part 6 includes a base body 6 a that is a part that is attached to and detached from a power supply socket provided in a power supply source of the lighting fixture 1, and a connection part 6 b that connects the base body 6 a and the housing 2. . In order to make the base body 6a detachable from the power supply socket, the surface of the base body 6a is threaded and can be attached and detached by screwing the base body 6a into the power supply socket. The connecting portion 6b is made of an insulating material in order to electrically insulate the base body 6a and the housing 2 from each other.

<Operation of lighting equipment>
Next, operation | movement of the lighting fixture 1 which concerns on a present Example is demonstrated.

First, the base part 6 is screwed into a power supply socket (not shown) of an illumination system provided indoors or outdoors, and the luminaire 1 is attached to the illumination system. In such a state, the power supply switch of the lighting system is shifted to the on state, and power is supplied to the lighting fixture 1. The electric power is supplied to the light emitting module 11 via the base 6 and a driving circuit formed on the fixed substrate 12, and the LED chip 23 of the light emitting module 11 emits light, and desired light is emitted from the light emitting module 11. Is done.

The light emitted from the light emitting module 11 enters the light guide 31 from the first surface 31 a of the light guide 31. At this time, since the light guide unit 31 is disposed so as to surround the light emitting surface of the light emitting module 11, all the light emitted from the light emitting module 11 enters the light guide unit 31.

The light incident on the light guide 31 is reflected directly or on the side surface 31d of the light guide 31 and reaches the second surface 31c of the light guide 31. In the present embodiment, the height of the light guide unit 31 is such that the light distribution unit 32 is disposed at the center of the cavity 4a, which is the inner region of the light source cover 4, and light incident from the first surface 31a leaks out. Since the adjustment is made within a range that does not occur, most of the light entering the light guide portion 31 reaches the second surface 31 c of the light guide portion 31.

The light that has reached the second surface 31 c of the light guide part 31 is emitted toward the cavity 32 a of the light distribution part 32. In the present embodiment, since the rough surface treatment is performed on the second surface 31 c of the light guide unit 31, light is diffused on the second surface 31 c of the light guide unit 31, and the second surface 31 c of the light guide unit 31 is processed. The light reaching the second surface 31c is emitted in a wide range.

The light guided into the cavity 32 a of the light distribution unit 32 is emitted from the outer surface 32 b of the light distribution unit 32 toward the light source cover 4, and is further transmitted through the light source cover 4 and emitted to the outside. In the present embodiment, since the outer surface 32b is roughened, light is diffused on the outer surface 32b, and the light reaching the outer surface 32b is emitted in a wide range. Furthermore, since the shape of the light distribution part 32 is substantially spherical, light is radiated substantially uniformly from the center of the light distribution part 32 in all directions, thereby realizing a wide light distribution of the lighting fixture 1. Has been. Moreover, since light is diffused in the outer surface 32b by roughening the outer surface 32b, unevenness is hardly formed on the irradiation surface of the lighting fixture 1.

Moreover, in the lighting fixture 1 according to the present embodiment, the light emitting module 11 is not disposed in the center in the cavity 4a of the light source cover 4, but is fixed to the fixed substrate 12 and close to the heat sink 5, and thus the light emitting module 11 The heat generated during the light emission of 11 is radiated well through the fixed substrate 12 and the heat sink. Thereby, it becomes difficult to produce the problem by the heat_generation | fever of the lighting fixture 1, and it leads to the improvement of the electrical property and reliability of the lighting fixture 1 itself.

<Effect of this embodiment>
By providing the light guide unit 31 and the light distribution unit 32 according to the present embodiment, the light emitted from the light emitting module 11 on the fixed substrate 12 is caused to pass through the light guide unit 31 and the light distribution unit 32, thereby distributing the light distribution unit 32. Can diffuse and radiate in all directions. In addition, since the light emitting module 11 is fixed on the fixed substrate 12 instead of the central portion of the light distribution unit 32 that is a position for emitting light in all directions, wiring can be easily formed on the fixed substrate 12. Cost reduction of the lighting fixture 1 can be aimed at. Furthermore, since the light emitting module 11 is fixed on the fixed substrate 12, heat generated from the light emitting module 11 can be radiated well through the fixed substrate 12.

As described above, the lighting fixture 1 according to the present embodiment has a simple configuration and has excellent heat dissipation and light distribution. The optical member 13 according to the present embodiment is used for the lighting fixture 1 and is an important member for realizing a simple configuration and excellent heat dissipation of the lighting fixture 1.

Moreover, since the light guide part 31 which concerns on a present Example is extended so that the light distribution part 32 may be located in the center part of the cavity 4a of the light source cover 4, light is omnidirectional from the center of the lighting fixture 1 The luminaire 1 that can be radiated and has excellent optical characteristics can be provided.

Furthermore, since the shape of the light distribution unit 32 according to the present embodiment is a sphere, light incident from the light guide unit 31 is radiated in all directions from the center of the lighting device 1. It can look like a typical halogen bulb.

<< Modification 1 >>
In the above-described embodiment, the chip-on-board (COB) type light emitting module 11 including the plurality of LED chips 23 is fixed to the fixed substrate 12 as a semiconductor light emitting device. It is not limited to COB as described above. For example, a package type LED package device in which an LED chip is embedded in a wavelength conversion member may be used as the semiconductor light emitting device. Hereinafter, with reference to FIGS. 9 and 10, a lighting apparatus 1 ′ including the light source unit 3 ′ using such an LED package device will be described as a first modification. FIG. 9 is a partially cutaway front view showing the entire lighting fixture 1 ′ according to the modified example 1 in a partly longitudinal section. FIG. 10 is a cross-sectional view of the LED package device constituting the lighting fixture according to the first modification. In addition, about the structure similar to the Example mentioned above, the same code | symbol is attached | subjected and the description is abbreviate | omitted.

<Configuration of lighting fixture>
The difference between the configuration of the lighting fixture 1 ′ according to this modification and the configuration of the lighting fixture 1 according to the above-described embodiment is that the first LED package device 41 (hereinafter also referred to as the first LED 41) instead of the light emitting module 11. The second LED package device 42 (hereinafter also referred to as a second LED 42) is fixed to the fixed substrate 12 only. Therefore, in the lighting fixture 1 ′ according to the present modification, the light emitted from the first LED 41 and the second LED 42 is guided to the light distribution unit 32 through the light guide unit 31, and all of the light distribution unit 32 diffuses the light. It will radiate substantially uniformly toward the direction.

(LED package device)
Next, the configuration of the first LED 41 according to the first modification of the present invention will be described with reference to FIG. In the present modification, the first LED 41 is a light source that emits white light. As shown in FIG. 10, the first LED 41 according to this modification includes a package 43, an LED chip 44 that is a semiconductor light emitting element mounted in the package 43, and at least a part of light emitted from the LED chip 44. It is comprised from the wavelength conversion member 45 which has the function to convert.

Therefore, in the first LED 41 according to this modification, white light that is a combined light of light emitted from the LED chip 44 and light having different wavelengths that have been wavelength-converted by the function of the wavelength conversion member 45, or wavelength conversion. The white light, which is the combined light of only the light having different wavelengths that has been wavelength-converted by the function of the member 45, is emitted from the wavelength conversion member 45 to the outside. Below, each member which comprises 1st LED41 is demonstrated in detail.

〔package〕
The package 43 is made of an alumina-based ceramic having excellent electrical insulation, good heat dissipation, and high reflectivity (preferably a reflectivity of 80% or more). The package 43 has an opening 43a for accommodating the LED chip 44, and the LED chip 44 is mounted on the bottom surface of the opening 43a. Furthermore, a wiring pattern (not shown) for mounting the LED chip 44 and supplying current to the LED chip 44 is formed on the mounting surface of the package 43 (that is, on the bottom surface of the opening 43a).

The material of the package 43 is not limited to alumina-based ceramics. For example, a material selected from resin, glass epoxy resin, composite resin containing a filler in the resin, etc. as a material having excellent electrical insulation. The body of the package 43 may be formed using Alternatively, in order to improve the light emission efficiency of the first LED 41 by improving the light reflectivity on the chip mounting surface of the package 43, a silicone resin containing a white pigment such as alumina powder, silica powder, magnesium oxide, or titanium oxide is used. Is preferred. On the other hand, in order to obtain better heat dissipation and reflectivity, the package 43 may be made of a metal such as aluminum whose body is covered with an insulator. In such a case, it is necessary to electrically insulate the wiring pattern of the package 43 from the metal main body.

[LED chip]
In the present modification, one LED chip 44 functions as a semiconductor light source that is a light source of the first LED 41. In this modification, the LED chip 44 has a blue light emitting diode that emits blue light having a peak wavelength in the range of 430 nm to 480 nm, or a purple that emits ultraviolet to purple light having a peak wavelength in the range of 360 nm to 430 nm. Light emitting diodes can be used. In the case of a blue light emitting diode, the peak wavelength is preferably in the wavelength range of 430 nm to 480 nm, and particularly preferably 450 nm. In the case of a violet light emitting diode, the peak wavelength is preferably in the wavelength range of 360 nm to 430 nm, particularly preferably 400 to 415 nm.

The number of LED chips 44 is not limited to one, and a plurality of LED chips 44 that emit light having the same peak wavelength may be used as the semiconductor light emitting source. Further, the type and emission wavelength characteristics of the LED chip 44 are not limited thereto, and various semiconductor light emitting elements such as LED chips can be used without departing from the gist of the present invention.

The LED chip 44 has an electrode (not shown) on the surface side facing the bottom surface (that is, the chip mounting surface) of the opening 43a of the package 43. The electrodes are electrically connected to the wiring pattern on the package 43 described above. The electrical connection between the electrode and the wiring pattern is performed by soldering, for example, via a metal bump. The method for mounting the LED chip 44 on the package 43 is not limited to this, and an appropriate method can be selected according to the type and structure of the LED chip 44. For example, after the LED chip 44 is bonded and fixed to a predetermined position of the package 43, the electrodes of the LED chip 44 may be connected to a corresponding wiring pattern by wire bonding.

(Wavelength conversion member)
The wavelength conversion member 45 absorbs at least a part of incident light incident from the LED chip 44 and emits emitted light having a wavelength different from the incident light, and a base material that holds the plurality of phosphors. It consists of and. That is, the wavelength conversion member 45 is a member containing a plurality of phosphors.

In the first LED 41 of this modification, when a blue light emitting diode that emits blue light is used as the LED chip 44, in order to obtain white light from the first LED 41, at least a part of the blue light is converted into green light and red light. It is necessary to synthesize white light by wavelength conversion and mixing blue light that has not been wavelength-converted by either the green light or red light (that is, transmitted through the wavelength conversion member 45) with the green light and red light. is there. In such a case, the phosphor in the present modification includes a green phosphor that can absorb and excite blue light and emit green light having a wavelength different from that of the blue light when returning to the ground state, and A red phosphor is used that is excited by absorbing blue light and can emit red light having a wavelength different from that of the blue light when returning to the ground state.

On the other hand, when a violet light emitting diode that emits ultraviolet to violet light is used as the LED chip 44, in order to obtain white light from the first LED 41, at least part of the ultraviolet to violet light is blue light, green light, and red light. It is necessary to synthesize the white light by mixing the blue light, the green light and the red light. In such a case, the phosphor in this modification is excited by absorbing ultraviolet to violet light, and can emit blue light having a wavelength different from that of ultraviolet to violet light when returning to the ground state. Phosphor, absorbs ultraviolet to violet light, excites and emits green light having a wavelength different from ultraviolet to violet light when returning to the ground state, and absorbs ultraviolet to violet light In this case, a red phosphor that can emit red light having a wavelength different from ultraviolet to violet light when excited and returned to the ground state is used.

In the following, specific examples of each phosphor will be shown.

The green phosphor in the first LED 41 according to this modification has an emission peak wavelength of usually 510 nm or more, preferably 530 nm or more, more preferably 535 nm or more, usually less than 570 nm, preferably 550 nm or less, more preferably 545 nm or less. Those in the wavelength range are preferred. As specific green phosphors, for example, (Y, Lu) ₃ Al, Ga) ₅ O ₁₂ : Ce, CaSc ₂ O ₄ : Ce, Ca ₃ (Sc, Mg) ₂ Si ₃ O ₁₂ : Ce, (Sr , Ba) ₂ SiO ₄ : Eu (BSS), (Si, Al) ₆ (O, N) ₈ : Eu (β-sialon), (Ba, Sr) ₃ Si ₆ O ₁₂ N ₂ : Eu (BSON), SrGa ₂ S ₄ : Eu, BaMgAl ₁₀ O ₁₇ : Eu, Mn, (Ba, Sr, Ca, Mg) Si ₂ O ₂ N ₂ : Eu are preferably used. Among these, BSS, β-sialon, BSON, SrGa ₂ S ₄ : Eu, BaMgAl ₁₀ O ₁₇ : Eu, Mn are more preferably used, BSS, β-sialon, and BSON are more preferably used, and β- Sialon and BSON are particularly preferably used, and β-sialon is most preferably used. In this modification, β-sialon is used as the green phosphor.

The red phosphor in the first LED 41 according to this modification has an emission peak wavelength of usually 570 nm or more, preferably 580 nm or more, more preferably 600 nm or more, further preferably 630 nm or more, particularly preferably 645 nm or more, and usually 780 nm. Hereinafter, those having a wavelength range of preferably 700 nm or less, more preferably 680 nm or less are suitable. As a specific red phosphor, for example, CaAlSi (N, O) ₃ : Eu, (Ca, Sr, Ba) ₂ Si ₅ (N, O) ₈ : Eu, (Ca, Sr, Ba) Si (N, O) ₂ : Eu, (Ca, Sr, Ba) AlSi (N, O) ₃ : Eu, (Sr, Ba) ₃ SiO ₅ : Eu, (Ca, Sr) S: Eu, SrAlSi ₄ N ₇ : Eu (Ca, Sr, Ba) ₂ Si ₅ (N, O) ₈ : Eu, (Sr, Ca) AlSi (N, O) ₃ : Eu, and SrAlSi ₄ N ₇ : Eu are preferable. Among these, (Sr, Ca) AlSi (N, O) ₃ : Eu and SrAlSi ₄ N ₇ : Eu are more preferable, and (Sr, Ca) AlSi (N, O) ₃ : Eu is more preferable. In this modification, CaAlSi (N, O) ₃ : Eu (hereinafter also referred to as CASN) is used as the red phosphor.

As the red phosphor, for example, CaAlSi (N, O) ₃ : Eu, (Ca, Sr, Ba) ₂ Si ₅ (N, O) ₈ : Eu, (Ca, Sr, Ba) Si (N, O) ₂ : Eu, (Ca, Sr, Ba) AlSi (N, O) ₃ : Eu, (Sr, Ba) ₃ SiO ₅ : Eu, (Ca, Sr) S: Eu, SrAlSi ₄ N ₇ : Eu, Eu (di) Β-diketone Eu complexes such as benzoylmethane) ₃ · 1,10-phenanthroline complex and carboxylic acid Eu complexes are preferred, and (Ca, Sr, Ba) ₂ Si ₅ (N, O) ₈ : Eu, (Sr, Ca) AlSi (N, O) ₃ : Eu and SrAlSi ₄ N ₇ : Eu are preferably used. Among these, (Sr, Ca) AlSi (N, O) ₃ : Eu and SrAlSi ₄ N ₇ : Eu are more preferable, and (Sr, Ca) AlSi (N, O) ₃ : Eu is more preferable.

The emission peak wavelength of the blue phosphor in the first LED 41 according to this modification is usually 420 nm or more, preferably 430 nm or more, more preferably 440 nm or more, usually less than 500 nm, preferably 490 nm or less, more preferably 480 nm or less, More preferred are those in the wavelength range of 470 nm or less, particularly preferably 460 nm or less. As specific blue phosphors, (Ca, Sr, Ba) MgAl ₁₀ O ₁₇ : Eu, (Sr, Ca, Ba, Mg) ₁₀ (PO ₄ ) ₆ (Cl, F) ₂ : Eu, (Ba, Ca , Mg, Sr) ₂ SiO ₄ : Eu, (Ba, Ca, Sr) ₃ MgSi ₂ O ₈ : Eu are preferred, and (Ba, Sr) MgAl ₁₀ O ₁₇ : Eu, (Ca, Sr, Ba) ₁₀ (PO ₄ ) ₆ (Cl, F) ₂ : Eu, Ba ₃ MgSi ₂ O ₈ : Eu is more preferable, Sr ₁₀ (PO ₄ ) ₆ C ₁₂ : Eu, BaMgAl ₁₀ O ₁₇ : Eu is more preferable, and (Sr, Ba , Ca) ₅ (PO ₄ ) ₃ Cl: Eu (more specifically, Sr ₅ (PO ₄ ) ₃ Cl: Eu (hereinafter also referred to as SCA)) or (Sr _1-x Ba _x ) ₅ (PO _{_{4) 3 Cl: Eu (x}} > 0, preferably 0.4>x> 0.12) (hereinafter, SBCA both To.)) Is particularly preferred. In this modification, SBCA is used as the blue phosphor.

The base material used for the wavelength conversion member 45 of the present modification can be the same material as the base material 25 of the wavelength conversion member 11b according to the above-described embodiment. Here, the description of the base material is omitted.

In the first LED 41 according to this modification, the color temperature of the emitted white light is adjusted to about 1900K by changing the mixing ratio of the phosphors described above.

The second LED 42 according to this modification has substantially the same structure as the first LED 41 described above, but a plurality of phosphors are mixed at a mixing ratio different from the mixing ratio of the phosphors in the first LED 41, and the color of the emitted white light The temperature is adjusted to about 2700K.

<Electric circuit configuration of lighting equipment>
Next, the electrical circuit configuration of the lighting fixture 1 ′ and the light emission control of the lighting fixture 1 ′ according to this modification will be described. FIG. 11 is an electric circuit diagram showing an outline of an electric circuit configuration of the lighting fixture 1 ′ according to the present modification. 12 and 13 are time charts showing an example of the operating state of each transistor and the current value of the drive current of each LED in the circuit configuration of FIG.

As can be seen from FIG. 11, the light emitting module 11 of the luminaire 1 ′ includes one first LED 41, two second LEDs 42, a current limiting resistor R 1 and a resistor R 2, and a driving current for driving the LED. Transistor Q1 and transistor Q2 are provided. Here, the resistor R1 is provided to adjust the current flowing through the corresponding first LED 41 to an appropriate magnitude, and the resistor R2 is provided to adjust the current flowing through the corresponding two second LEDs 42 to an appropriate magnitude. It has been.

Specifically, the first LED 41 is connected in series with the resistor R1, and the anode of the first LED 41 is connected to the positive electrode of the power source 51a via the resistor R1. The cathode of the first LED 41 is connected to the collector of the transistor Q1, and the emitter of the transistor Q1 is connected to the negative electrode of the power source 51a. On the other hand, the two second LEDs 42 have the same polarity and are connected in parallel to each other. Like the first LED 41, the anode is connected to the positive electrode of the power source 51b via the resistor R2, and the cathode is connected via the transistor Q2. And connected to the negative electrode of the power source 51b.

Here, the power source 51a is a DC power source composed of a conversion circuit that converts an AC voltage supplied from the outside of the lighting fixture 1 'through the base 6 into a DC voltage, and the inside of the lighting fixture 1' (for example, a housing) It is provided in the cavity 2a of the body 2 or the fixed substrate 12). Similarly, the power source 51b is a DC power source including a conversion circuit that converts an AC voltage supplied from the outside of the lighting fixture 1 'through the base unit 6 into a DC voltage. It is provided in the cavity 2a of the body 2 or the fixed substrate 12). Moreover, although not shown in FIG. 11, the power supplies 51a and 51b are connected to the external power supply of the lighting fixture 1 ′.

In addition, the transistors Q1 and Q2 can both be switched on / off according to the respective base signals, and the base signals are individually sent from the current control unit 52 to the respective bases. Yes. More specifically, the constant current control circuit 52a constituting the current control unit 52 is connected to the base of the transistor Q1, and the duty ratio control circuit constituting the current control unit 52 is connected to the base of the transistor Q2. 52b is connected.

Furthermore, the luminaire 1 'is connected to an operation unit 53 for adjusting the light emission characteristics such as the luminance of light emitted from the luminaire 1' from the outside. Specifically, the operation unit 53 is connected to the current control unit 52 and outputs a drive signal corresponding to the set luminance in accordance with an operation for setting a light emission characteristic such as the luminance of light emitted from the lighting fixture 1 ′. This is transmitted to the current control unit 52. Then, the current control unit 52 controls the operation of the transistor Q1 and the transistor Q2 according to the drive signal, and controls the drive current supplied to the first LED 41 and the drive current supplied to the second LED 42.

Next, specific control in the current control unit 52 will be described. As described above, the current control unit 52 includes the constant current control circuit 52a and the duty ratio control circuit 52b. The constant current control circuit 52a supplies a base signal to the transistor Q1, and the duty ratio control circuit 52b includes the transistor Q2. To supply the base signal.

That is, the first LED 41 is controlled by the constant current control circuit 52a. More specifically, when the transistor Q1 is turned ON, a constant driving current is always supplied to the first LED 41, and the first LED 41 is supplied to the first LED 41. The actual driving current that flows (that is, the amount of power supplied to the second LED 42) is constant.

On the other hand, the second LED 42 is controlled by the duty ratio control circuit 52b. More specifically, although the magnitude of the base signal supplied to the transistor Q2 does not change, the ratio between the supply time and non-supply time of the base signal is controlled. ing. That is, by intermittently driving the transistor Q2 on and off at a predetermined cycle, the ratio of the supply time and non-supply time of the drive current supplied to the second LED 42 is controlled, and the actual drive current flowing through the second LED 42 (i.e., The amount of power supplied to the second LED 42) is controlled by the duty ratio control circuit 52b. In other words, the drive current supplied to the second LED 42 is controlled by the variable current according to the drive signal described above by the duty ratio control circuit 52b.

Note that the current control unit 52 may include a storage unit (for example, a memory) that stores control content corresponding to the electrical signal supplied from the operation unit 53. In such a case, the current control unit 52 reads the control content corresponding to the electrical signal supplied from the operation unit 53 from the storage unit, and controls the operation of the transistor Q1 and the transistor Q2 according to the read control content. become.

Next, the control of the drive current by the constant current control circuit 52a and the duty ratio control circuit 52b will be specifically described with reference to FIGS.

First, FIG. 12 shows a case where synthetic white light that is relatively dark and reddish is emitted from the lighting apparatus 1 ′. In the state shown in FIG. 12, when the transistor Q1 is turned on, a driving current having a current value A0 flows through the first LED 41, and 1900K white light is emitted from the first LED 41. On the other hand, the transistor Q2 is turned on only during the on period t1 (for example, 3 ms) during the period t0 (for example, 20 ms), and the driving current of the current value A0 flows through the first LED 41 during the on period t1, and the second LED 42 2700K white light is emitted.

As described above, when the ON period t1 of the transistor Q2 is shorter than the period t0, the current value of the drive current that flows instantaneously (that is, the period of t1) through the second LED 42 when the transistor Q2 is ON is A0. However, the current value of the drive current actually supplied to the second LED 42 is A0 in the state where the luminaire 1 ′ is actually used (ie, the period of t0 is repeated a plurality of times). Less than half. Accordingly, in the state shown in FIG. 12, the 1900K light emitted from the first LED 41 is brighter than the 2700K light emitted from the second LED 42, and the color temperature of the synthetic white light emitted from the lighting fixture 1 ′ is 1900K. As a result, the composite white light having a reddish color as a whole is emitted.

In order to brighten the light emitted from the luminaire 1 ′ from the above-described state (that is, dimming), for example, as shown in FIG. 13, the on period of the transistor Q2 is longer than the on period t1 (for example, 18 ms), and the drive time of the transistor Q2 is lengthened.

Thus, when the ON period of the transistor Q2 is brought close to the cycle t0, the second LED 42 is actually used in the state where the lighting fixture 1 ′ is actually used (that is, the cycle of t0 is repeated a plurality of times). The current value of the supplied drive current approaches the current value (A0) of the drive current that flows instantaneously (that is, during the period t2) in the second LED 42, as compared with the state of FIG. Therefore, in the state shown in FIG. 13, the brightness of the 2700K light emitted from the second LED 42 and the light of 1900K emitted from the first LED 41 are substantially the same, and the combined white light emitted from the lighting fixture 1 ′ The color temperature approaches 2700K, and light of a color closer to daylight is emitted.

In this way, by adjusting the supply time and non-supply time of the drive current supplied to the second LED 42 by the duty ratio control circuit 52b while making the actual drive current flowing to the first LED 41 constant by the constant current control circuit 52a, It is possible to freely adjust the intensity of 2700K light while emitting 1900K light at a constant intensity, and to change the color temperature according to the change in the intensity of the synthetic white light emitted from the lighting fixture 1 ′. It becomes possible. That is, when the intensity of the synthetic white light emitted from the luminaire 1 ′ is small (that is, the synthetic white light is relatively dark), the color temperature of the synthetic white light can be brought close to 1900K, and the luminaire 1 ′ When the intensity of the emitted synthetic white light is large (that is, the synthetic white light is relatively bright), the color temperature of the synthetic white light can be brought close to 2700K.

In the first modification described above, the timing at which the transistor Q2 is turned on and the drive current is supplied to the second LED 42 may be a case where the drive current supplied to the transistor Q1 becomes a predetermined value (for example, 200 mA) or more. By adjusting in this way, in a state where the value of the drive current is small, light can be emitted only from the first LED 41 and white light of 1900K can be emitted, and when the value of the drive current becomes large, The 2LED 42 can also emit white light of 2700 K, and the color temperature of the synthetic white light can be adjusted according to the intensity of the synthetic white light (that is, the value of the drive current).

The first LED 41 is controlled by the constant current control circuit 52a, and the second LED 42 has a structure controlled by the duty ratio control circuit 52b. However, the first LED 41 also has a structure controlled by the duty ratio control circuit, When the drive current supplied to the first LED 41 is stopped, the drive current supplied to the first LED 41 may be controlled with a variable current according to the drive signal. Thereby, the behavior until the lighting fixture 1 ′ is extinguished can be made closer to the halogen bulb. Note that the drive current supplied to the first LED 41 being stopped means that the supply of the drive current is completely stopped, not a period in which the drive current periodically becomes zero.

The first LED 41 is controlled by the constant current control circuit 52a, and the second LED 42 has a structure controlled by the duty ratio control circuit 52b. However, when the driving current supplied to the second LED 42 is stopped, the first LED 41 is controlled. The drive current supplied to one LED 41 may be stopped. Thereby, when the drive current supplied to 1st LED41 is stopped, lighting fixture 1 'can be light-extinguished and the behavior of lighting fixture 1' can be brought closer to a halogen bulb more.

In addition, the color temperature of the white light radiated | emitted from 1st LED41 and 2nd LED42 is not limited to the numerical value mentioned above, It can change suitably according to the use environment, use application, etc. of lighting fixture 1 '. In the above-described modification, one first LED 41 and two second LEDs 42 are fixed to the fixed substrate 12. However, the first LEDs 41 and the second LEDs 42 are arranged in a matrix and fixed to the fixed substrate 12. May be. Furthermore, when a plurality of LED package devices are fixed to the fixed substrate 12, it is not necessary that the color temperatures of all the LED package devices be different, and at least one set selected from the plurality of LED package devices has light of different color temperatures. May be emitted.

For the light emitted from at least one of the first LED 41 and the second LED 42, the parameters of the first LED 41 and the second LED 42 are adjusted by adjusting parameters such as the wavelength, the distance from the black body radiation locus, the spectral distribution, and the normalized spectral distribution. White light having a natural color from at least one and having excellent saturation in green, yellow, and red may be emitted. By using the semiconductor light emitting device adjusted in this way, even when the color of the irradiated object to be irradiated is different, it is possible to irradiate the irradiated object with various colors with the optimum white light. It is possible to illuminate the irradiated object more vividly and clearly.

In the lighting fixture 1 'according to the above-described embodiment, the transistors Q1 and Q2 which are bipolar transistors are used as switching elements. However, a MOS field effect transistor (Metal-Oxide-Semiconductor-Field-Effect-Transistor) is used. A bipolar transistor may be used instead.

<< Modification 2 >>
In the embodiment described above, the optical member 13 constituting the light source unit 3 has a structure in which a light distribution unit 32 having a cavity and having a substantially spherical shape is connected to the end of the light guide unit 31 having a truncated cone shape. However, the structure of the optical member 13 is not limited to this. Hereinafter, the optical member 13 having another structure will be described as a second modification with reference to FIGS. 14 to 16. 14 is a perspective view of an optical member according to Modification 2, FIG. 15 is a top view of the optical member according to Modification 2, and FIG. 16 is a cross-sectional view of the optical member along line XVI-XVI in FIG. It is.

(Optical member)
As can be seen from FIGS. 14 to 16, the optical member 113 is connected to the light guide part 131 having substantially the same configuration and function as the light guide part 31 of the above-described embodiment, and to the end of the light guide part 131. The light distribution part 132 and a substantially annular (ring-shaped) connection part 133 for connecting the light guide part 131 to the fixing member 14 of the above-described embodiment are configured. That is, similarly to the optical member 13 of the above-described embodiment, the optical member 113 guides light emitted from the light emitting module 11 from one end of the light guide unit 131 to the other end, and radiates from the light guide unit 131. The emitted light is radiated substantially uniformly in all directions through the light distribution unit 132. Note that the omnidirectional means that the light distribution angle is not limited to 360 °, as in the above-described embodiments, but substantially means the omnidirectional (wider light distribution angle). That is, the omnidirectional in the present invention means that the light distribution angle is usually 180 ° or more, preferably 240 ° or more, more preferably 300 ° or more.

The light guide 131 is made of a transparent material having translucency such as resin (for example, polycarbonate, poly (methyl methacrylate): PMMA). As can be seen from FIGS. 14 and 16, the light guide 131 has a truncated cone shape. The light guide part 131 of the optical member 113 according to the modified example 2 is different from the light guide part 31 in the above-described embodiment, and is in contact with the light distribution part 132 (a second surface of the light guide part 31 in the above embodiment). The surface corresponding to the surface 31c) is not subjected to rough surface treatment or coating treatment. Moreover, the light guide part 131 is not formed with the concave part 31b like the light guide part 31 of the above-described embodiment. In addition, since the other structure and function of the light guide part 131 are the same as the light guide part 31 of the Example mentioned above, the specific description is abbreviate | omitted.

As shown in FIG. 16, the light distribution unit 132 is made of a transparent material having translucency such as a resin (for example, polycarbonate, polymethyl methacrylate resin (PMMA)), and its The light diffusing element 132a is mixed inside. In other words, the light distribution part 132 is comprised from transparent materials, such as resin containing the light-diffusion element 132a. Here, the light distribution unit 132 may be formed of a transparent material different from that of the light guide unit 131, but it is preferable to form the light guide unit 131 and the light distribution unit 132 by two-color formation using the same transparent material. . This is because it is not necessary to bond the light guide part 131 and the light distribution part 132 with an adhesive or the like, so that the cost can be reduced, and further problems such as a decrease in adhesive strength are less likely to occur. is there.

(Light diffusion element)
In this modification, it is preferable to use an inorganic light diffusing material, an organic light diffusing material, or air bubbles as the light diffusing element 132a.

As the inorganic light diffusing material, for example, inorganic light diffusing materials such as silicon, aluminum, titanium, zirconium, calcium, and barium can be used, and the group consisting of silicon, aluminum, titanium, and zirconium can be used. It is preferable to use an inorganic light diffusing material containing at least one element. As the organic light diffusing material, it is possible to use an acrylic light diffusing material, or an organic light diffusing material containing silicon as an element, or an organic material containing silicon as an element. It is preferable to use a system light diffusing material.

Specific examples of inorganic light diffusing materials include silicon dioxide (silica), white carbon, talc, magnesium oxide, zinc oxide, titanium oxide, aluminum oxide, zirconium oxide, boron oxide, calcium carbonate, barium carbonate, magnesium carbonate, water Examples thereof include aluminum oxide, calcium hydroxide, magnesium hydroxide, barium sulfate, calcium silicate, magnesium silicate, aluminum silicate, sodium aluminosilicate, zinc silicate, glass, mica and the like.

Examples of the organic light diffusing material include styrene (co) polymers, acrylic (co) polymers, siloxane (co) polymers, polyamide (co) polymers, and the like. Some or all of these molecules of the organic diffusing material may or may not be cross-linked. Here, “(co) polymer” means both “polymer” and “copolymer”.

Among the light diffusion elements described above, in order to increase the light diffusion effect with a small amount, a light diffusion element having a large difference between the refractive index of the transparent material such as the resin and the refractive index of the selected light diffusion element is selected. Is preferred. Further, in order not to greatly reduce the luminous efficiency, it is preferable to select a light diffusing element having high transparency.

For example, when the resin is a polycarbonate resin, as the light diffusing element 132a, a crosslinked acrylic (co) polymer particle, a crosslinked particle of a copolymer of an acrylic compound and a styrene compound, a siloxane (co) polymer particle, It is preferable to use hybrid crosslinked particles of an acrylic compound and a compound containing a silicon atom, and it is more preferable to use crosslinked acrylic (co) polymer particles and siloxane (co) polymer particles.

As the crosslinked acrylic (co) polymer particles, polymer particles composed of a non-crosslinkable acrylic monomer and a crosslinkable monomer are more preferable, and polymer particles obtained by crosslinking methyl methacrylate and trimethylolpropane tri (meth) acrylate are more preferable. . As the siloxane-based (co) polymer, polyorganosilsesquioxane particles are more preferable, and polymethylsilsesquioxane particles are more preferable.

The dispersion shape of the light diffusing element 132a in the resin may be any of a substantially spherical shape, a plate shape, a needle shape, and an indefinite shape, but is preferably a substantially spherical shape from the viewpoint that there is no anisotropy in the light scattering effect. . The average dimension of the light diffusing element 132a is usually 100 μm or less, preferably 30 μm or less, more preferably 10 μm or less, and usually 0.01 μm or more, preferably 0.1 μm or more. More preferably, it is 0.5 μm or more. When the average dimension of the light diffusing element 132a is out of the above range, the light diffusibility is likely to fluctuate greatly due to a subtle difference in the content of the light diffusing element 132a or a difference in the particle diameter, thereby stabilizing the light diffusibility. It may be difficult to control the light diffusibility required in the present invention. As a result, it may become difficult to stably control the wavelength conversion efficiency within a preferable range. Here, the average dimension of the light diffusing element 132a is a 50% average dimension based on the volume, and is a value of the median diameter (D50) of the volume standard particle size distribution measured by a laser or diffraction scattering method.

Further, the particle size distribution of the light diffusing element 132a may be a monodispersed system or a polydispersed system having several peak tops, and is a single peak top having a narrow particle size distribution. However, it is preferable that the particle size distribution is narrow and the particle size is almost a single particle size (monodispersion or near monodispersion particle size distribution).

As an index indicating the degree of particle size distribution of the light diffusing element 132a, there is a ratio (Dv / Dn) between the volume-based average particle diameter Dv and the number-based average particle diameter Dn of the light diffusing element 132a. In the present invention, Dv / Dn is preferably 1.0 or more. On the other hand, Dv / Dn is preferably 5 or less. If Dv / Dn is too large, there will be light diffusing elements 132a with significantly different weights, and the dispersion of the light diffusing elements 132a in the light distribution section 132 tends to be non-uniform.

The inorganic light diffusing material, the organic light diffusing material, and the bubbles used as the light diffusing element 132a described above may be used alone or in combination of two or more kinds having different materials and dimensions. Good. When two or more types are used in combination, the refractive index of the light diffusing element 132a is calculated by the volume average of a plurality of light diffusing elements.

The refractive index of the light diffusing element 132a is usually 1.0 or more and usually 1.9 or less. The light diffusing element 132a is preferably highly transparent and excellent in light transmittance. For example, the extinction coefficient may be 10 ⁻² or less, preferably 10 ⁻³ or less, more preferably 10 ⁻⁴ or less, particularly preferably 10 ⁻⁶ or less. The refractive index of the light diffusing element 132a can be measured by a liquid immersion method (Aerosol Research Vol. 9, No. 1 Spring pp. 44-50 (1994)) by YOSHIYAMA et al. The measurement temperature is 20 ° C., and the measurement wavelength is 450 nm.

The content of the light diffusing element 132a in the light distribution part 132 depends on the type of the resin. For example, when the resin is a polycarbonate resin and the light diffusing element 132a is polymethylsilsesquioxane particles, polycarbonate is used. The amount is usually 0.1 parts by weight or more, preferably 0.3 parts by weight or more, more preferably 0.5 parts by weight or more, and usually 10.0 parts by weight or less, preferably 7 parts by weight with respect to 100 parts by weight of the resin. 0.0 parts by weight or less, more preferably 3.0 parts by weight or less. If the content of the light diffusing element 132a is too small, the diffusion effect is insufficient, and if it is too large, the mechanical identification may be lowered, which is not preferable.

Also, as can be seen from FIG. 16, the shape of the light distribution section 132 is different from the light distribution section 32 of the above-described embodiment, and the outer shape is substantially spherical, but no cavity is formed inside. That is, the light distribution unit 132 according to this modification is not formed with a two-layer structure like the light distribution unit 32 of the above-described embodiment. Even if the two-layer structure is not formed, the light diffusing element 132a described above is contained in the transparent material such as a resin constituting the light distribution unit 132. When radiating, it can diffuse well. In addition, the shape of the light distribution part 132 is not limited to a substantially spherical shape, and may be another three-dimensional shape such as a polygonal body.

The outer surface 132b of the light distribution part 32 is roughened, and minute irregularities are formed. The reason for making the outer surface 132b rough is to improve the light extraction efficiency and not to cause unevenness on the irradiation surface irradiated with the light emitted from the light distribution section 132. In addition, you may perform the coating process which can improve the extraction efficiency of light, without making the outer surface 132b rough.

Due to the structure of the light distribution unit 132 as described above, the light guided from the light guide unit 131 to the light distribution unit 132 is radiated well (substantially equal) with respect to all directions of the light distribution unit 132. . That is, the light distribution part 132 can be visually recognized as a light source, and can be visually recognized as being emitted outward from the center of the cavity 4a of the light source cover 4 in FIG.

As can be seen from FIGS. 14 to 16, the connection portion 133 is provided at one end portion of the light guide portion 131 (the end portion on the opposite side to the end portion in contact with the light distribution portion 132). The connection portion 133 has an annular shape and is connected so as to surround the side surface of the light guide portion 131. Further, the connection portion 133 is provided with two notches 133a. Then, a joining member such as a screw is fitted into the notch 133a, and the connecting portion 133 is joined to the surface 14a of the fixing member 14 in FIG. Thereby, the optical member 113 can be arranged away from the light emitting module 11.

In this modification, the connection portion 133 is made of a transparent material having translucency such as a resin (for example, polycarbonate, poly (methyl methacrylate): PMMA) like the light guide portion 131. Has been. Accordingly, when the optical member 113 is formed, the connection portion 133 is simultaneously formed as a part of the light guide portion 131. Note that the connection portion 133 is not an essential structure. For example, if the light guide portion 131 is formed with the recess 31b like the light guide portion 31 of the above-described embodiment, the connection portion 133 is not necessary.

<Modification of light guide>
The structure of the light guide part 31 and the light guide part 131 demonstrated in the said Example is an example. Instead of the light guide unit 31 and the light guide unit 131, the following light guide unit can be applied. The light guide unit 31, the light guide unit 131, and a modification of the light guide unit described below function as a light travel direction control unit (light travel direction control unit) that changes the travel direction of light from the light emitting module 11. .

<< First Modification of Light Guide Section >>
FIG. 17 is a diagram schematically illustrating a first modification of the light guide unit 31. In the first modification, a reflection cylinder is applied as the light guide unit 231. The light guide part (reflective cylinder) 231 shown in FIG. 17 is formed in a hollow (hollow) cylindrical shape having one end part 231a on the light emitting module 11 side and the other end part 231b connected to the light distribution part 132. ing. In this respect, the inside is different from the solid light guide 31. The light distribution unit 132 has the same configuration as that described in the second modification. Instead of the light distribution unit 132, the light distribution unit 32 (FIG. 8 and the like) may be applied.

The inner diameter of the light guide portion 231 is formed in a tapered shape that decreases from the one end portion 231a toward the other end portion 231b. As described above, the inner surface 231c of the light guide portion 231 is formed by the peripheral surface of the truncated cone, and is mirror-finished. By the mirror finishing, the light impinging on the inner surface 231c is almost totally reflected. Mirror surface processing can be performed by producing the light guide part 231 with a reflecting material, or attaching or coating the reflecting material on the inner surface of the cylindrical member.

The light emitting module 11 is arranged at a substantially central portion below the one end portion 231a so that light emitted from the light emitting module 11 enters the cavity of the light guide portion 231. In addition, you may make it the light emitting module 11 arrange | position in the one end part 231a.

Among the light emitted from the light emitting module 11, for example, a part of the light from the light emitting module 11, such as light traveling in the axial direction of the light guide unit 231 from the light emitting module 11 toward the light distribution unit 132, The light directly enters the light distribution unit 132. On the other hand, the light that travels in the direction not directly incident on the light distribution unit 132 out of the light from the light emitting module 11 is reflected by the inner surface 231c of the light guide unit 231 and changes the traveling direction to the direction that enters the light distribution unit 132. (See arrow in FIG. 17). Accordingly, the light guide unit 231 can cause almost all of the light from the light emitting module 11 to enter the light distribution unit 132.

<< Second Modification of Light Guide Section >>
FIG. 18 is a diagram schematically illustrating a second modification of the light guide unit. In the second modification, a reflecting mirror is applied as the light guide unit 331. The light guide unit 331 shown in FIG. 18 includes a plurality of reflecting mirrors 332 arranged so as to surround the light emitting module 11. Each reflecting mirror 332 has one end 332a disposed on the light emitting module 11 side and the other end 332b connected to the light distribution unit 132A.

The inner surface 332c of each reflecting mirror 332 is formed as a continuous curved surface having a curvature that increases from the other end 332b toward the one end 332a, and is a mirror surface. The mirror surface can be formed by mirror processing as described in the first modification. Thereby, the light colliding with the inner surface 332c is formed to be totally reflected.

Unlike the light distribution unit 132 described in the second modification, the light distribution unit 132A is formed in a perfect spherical shape. Except for this point, the light distribution unit 132 </ b> A is the same as the light distribution unit 132. However, the light distribution part 132A may be cut along the virtual line V shown in FIG. Further, instead of the light distribution unit 132A, the light distribution unit 32 (FIG. 8 or the like) can be applied.

A plurality (a predetermined number) of the reflecting mirrors 332 are arranged in a cylindrical state (so as to form an intermittent cylindrical shape) so that the light from the light emitting module 11 does not escape sideways. However, the reflecting mirror 332 may be formed in one cylindrical shape. The light guide unit 331 and the light distribution unit 132A may be fixed by a support member (not shown) so as not to change their relative positions.

Among the light emitted from the light emitting module 11, for example, a part of the light from the light emitting module 11 such as light traveling upward from the light emitting module 11 toward the light distributing unit 132 </ b> A is directly incident on the light distributing unit 132 </ b> A. To do. On the other hand, of the light from the light emitting module 11, the light traveling in the direction not directly incident on the light distribution unit 132A is reflected by the inner surface 332c of the light guide unit 331 (reflecting mirror 332) and enters the light distribution unit 132A. The direction of travel is changed (see arrow in FIG. 18). Accordingly, the light guide unit 331 can cause almost all of the light from the light emitting module 11 to enter the light distribution unit 132A.

<< Third Modification of Light Guide Section >>
FIG. 19 is a diagram schematically illustrating a third modification of the light guide unit. In the third modification, a condensing lens is applied as the light guide unit 431. The light guide part (condensing lens) 431 has one end part 431a on the light emitting module 11 side and the other end part 431b on the light distribution part 132A side. The light guide 431 as a whole has a truncated cone-shaped outer shape whose diameter decreases from the other end 431b toward the one end 431a. The one end 431a is formed with a cylindrical recess 431c, and the other end 431b is formed with a recess 431d recessed in a spherical shape in accordance with the shape of the light distribution portion 132A. Part 132A (preferably a spherical light distribution part made of a resin containing a light diffusing element) is connected. The light guide unit 431 and the light distribution unit 132A may be fixed by a support member (not shown) so as not to change their relative positions.

The light emitted from the light emitting module 11 enters the light guide 431 from the recess 431 c of the light guide 431. The incident light is refracted and reflected in the light guide unit 431 and enters the light distribution unit 132A. Accordingly, the light traveling from the light emitting module 11 in the direction not directly incident on the light distribution unit 132A is changed in the traveling direction to the direction incident on the light distribution unit 132A by the light guide unit (condensing lens) 431. (See arrow in FIG. 19). Accordingly, the light guide unit 431 can cause almost all of the light from the light emitting module 11 to enter the light distribution unit 132A.

In the example shown in FIG. 19, the light distribution unit 132A is applied. However, the light distribution unit 132 may be applied instead of the light distribution unit 132A, or the light distribution unit 32 may be applied. In this case, the recess 431d is not provided.

By using the light guide unit of the third modification, it is possible to further improve the light extraction efficiency and to further increase the height of the cylindrical light guide unit, so that the light distribution unit in the covering body The effect of improving the freedom of placement is expected.

<< 4th modification of a light guide part >>
FIG. 20 is a diagram schematically illustrating a fourth modification of the light guide unit. In FIG. 20, in the fourth modification, a side exit lens is applied as the light guide unit 531. The light guide portion 531 has a cylindrical shaft portion 531a having one end portion disposed on the light emitting module 11 side, and a cylindrical large-diameter portion 531b provided coaxially with the shaft portion 531a on the other end side of the shaft portion 531a. have. A conical recess 531c is formed on the upper surface of the large-diameter portion 531b. A part of the large diameter portion 531b and the shaft portion 531a are covered with the light distribution portion 32. The large diameter portion 531 b is disposed at the center in the light distribution portion 32. The light guide 531 is formed of a material such as a resin such as an acrylic resin, glass, or other material.

The outgoing light from the light emitting module 11 enters the light guide part 531 from one end face of the shaft part 531a. Of the light from the light emitting module 11, the light traveling in the axial direction of the shaft portion 531 a passes through the recess 531 c and is emitted from above, diffused by the light distribution portion 32, and emitted from the light distribution portion 32. The light traveling to the side of the shaft portion 531a is reflected by the inner surface of the shaft portion 531a and reaches the large diameter portion 531b, is reflected by the concave portion 531c, and is emitted from the side surface of the large diameter portion 531b. The emitted light is diffused by the light distribution unit 32 and emitted from the light distribution unit 32.

In this way, the light traveling from the light emitting module 11 in the direction not directly incident on the light distribution unit 32 is changed in the traveling direction to the direction incident on the light distribution unit 32 by the light guide unit 531 (FIG. 20). See arrow). Accordingly, the light guide unit 531 can cause almost all of the light from the light emitting module 11 to enter the light distribution unit 32. Then, the light from the light emitting module 11 emitted from the light guide unit 531 is diffused by the light distribution unit 32 and is emitted in all directions.

In addition, it replaces with the light distribution part 32, the light distribution part 132 may be applied, and the large diameter part 531b and a part of shaft part 531a may be embedded in the light distribution part 132. FIG. In this case, the light emitted from the light guide unit 531 is diffused by the light diffusion element 132a of the light distribution unit 132 and is emitted in all directions.

DESCRIPTION OF SYMBOLS 1, 1 'Lighting fixture 2 Case 2a Cavity 2b Opening 3, 3' Light source part 4 Light source cover 4a Cavity 5 Heat sink 6 Cap part 11 Light emitting module (semiconductor light emitting device)
11a Module body 11b Wavelength conversion member 12 Fixed substrate

12a First surface

12b Second surface 13 Optical member 14 Fixed member 15 Screw 16 Screw hole 21 Flat plate portion 22 Side wall portion 23 LED chip 24 Phosphor 25 Base material 26 P electrode 27

N electrode

28, 29 Wiring pattern 31 Light guide part 31a First surface 31b Recessed part

31c Second surface

31d Side surface 32 Light distribution part 32a Cavity 32b Outer surface 41 First LED package device (first LED)
42 Second LED package device (second LED)
43 package 44 LED chip 45 wavelength conversion member 51a, 51b power supply 52 current control unit 52a constant current control circuit 52b duty ratio control circuit 53 operation unit 113 optical member 131 light guide unit 131a contact surface 132 light distribution unit 132a light diffusion element 133 connection Part 133a Notch R1, R2 Resistor Q1,

Q2 Transistors

231, 331, 431, 531 Light guiding part

Claims

A substrate,
At least one semiconductor light emitting device fixed on the substrate;
One end is disposed on the light emitting surface side of the semiconductor light emitting device, and a light guide unit having translucency for guiding and emitting the light of the semiconductor light emitting device incident from the one end to the other end;
A light distribution unit disposed so as to surround the periphery of the other end of the light guide unit, diffusing light emitted from the light guide unit and radiating in all directions;
A covering that covers the semiconductor light emitting device, the light guide unit, and the light distribution unit separately;
The lighting fixture characterized by having.
A substrate,
At least one semiconductor light emitting device fixed on the substrate;
A light distribution unit that diffuses and emits light from the incident semiconductor light emitting device in all directions;
Provided between the semiconductor light emitting device and the light distribution unit, the light traveling from the semiconductor light emitting device that travels in a direction not directly incident on the light distribution unit is incident on the light distribution unit. A light guide portion to be changed,
A covering that covers the semiconductor light emitting device, the light distribution unit, and the light guide unit separately;
The lighting fixture characterized by including.
A substrate,
At least one semiconductor light emitting device that emits light fixed on the substrate and wavelength-converted by a wavelength conversion member;
A light distribution unit that diffuses and emits light from the incident semiconductor light emitting device in all directions;
Provided between the semiconductor light emitting device and the light distribution unit, the light traveling from the semiconductor light emitting device that travels in a direction not directly incident on the light distribution unit is incident on the light distribution unit. A light guide portion to be changed,
A covering that covers the semiconductor light emitting device, the light distribution unit, and the light guide unit separately;
The lighting fixture characterized by including.
The lighting device according to claim 1, wherein the light distribution unit is connected to the other end of the light guide unit.
The lighting device according to any one of claims 1 to 3, wherein the light distribution part is made of a resin containing a light diffusing element.
The lighting device according to any one of claims 1 to 3, wherein the light distribution section includes a two-layer structure including an inner layer and an outer layer having a refractive index larger than that of the inner layer.
The lighting apparatus according to claim 6, wherein the inner layer of the light distribution unit is an air layer.
The lighting fixture according to claim 6 or 7, wherein a surface of the other end of the light guide unit is subjected to a roughening process or a coating process.
The lighting device according to any one of claims 1 to 8, wherein the surface of the light distribution section is subjected to a rough surface treatment or a coating treatment.
The lighting device according to claim 1, wherein the light guide portion extends so that the light distribution portion is located at a central portion of an inner region of the covering body. .
The lighting device according to any one of claims 1 to 10, wherein the light distribution portion is disposed so as to be positioned at a center portion of an inner region of the covering body.
The lighting fixture according to any one of claims 1 to 11, wherein the light distribution portion has a spherical shape.
The lighting apparatus according to claim 1, wherein the light guide unit and the light distribution unit are integrally formed by two-color molding.
The lighting apparatus according to claim 1, wherein a heat sink is disposed on a surface of the substrate opposite to a fixing surface of the semiconductor light emitting device.
15. The light emitted from the semiconductor light emitting device and the light emitted in all directions through the light guide unit and the light distribution unit have the same chromaticity. The lighting fixture according to item 1.
The light fixture according to claim 1, wherein the light emitted from the semiconductor light emitting device is white light.
A plurality of the semiconductor light emitting devices are fixed to the substrate,
The lighting fixture according to claim 1, wherein at least one set selected from the plurality of semiconductor light emitting devices emits light having different color temperatures.
An optical member attached to a semiconductor light emitting device,
One end is disposed on the light emitting surface side of the semiconductor light emitting device, and a light guide unit having translucency for guiding and emitting the light of the semiconductor light emitting device incident from the one end to the other end;
An optical member comprising: a light distribution unit disposed so as to surround the periphery of the other end of the light guide unit, and diffusing light emitted from the light guide unit and radiating the light in all directions. .
The optical member according to claim 18, wherein the light distribution unit is connected to the other end of the light guide unit.
The optical member according to claim 18, wherein the light distribution part is made of a resin containing a light diffusing element.
The optical member according to claim 18, wherein the surface of the other end of the light guide is subjected to a rough surface treatment or a coating treatment.
The optical member according to any one of claims 18 to 21, wherein the surface of the light distribution section is subjected to a rough surface treatment or a coating treatment.